Device for measuring temperature in vacuum and microwave environments

Abstract

An apparatus for determining the temperature of a substrate in a microwave and / or vacuum environment. A substrate holder having a plurality of support pins includes a temperature sensor assembly, at least a portion of the surface of which has a phosphor coating, and the temperature sensor assembly is configured to be inserted into at least one pin support position from an internal region of the substrate holder and into at least one pin support position from an external region of the substrate holder. The temperature sensor assembly includes a temperature sensor pin having a spring that is transparent to microwaves. The temperature sensor pin is made of a material having a thermal conductivity greater than about 200 W / mK and a low thermal mass that is transparent to microwaves. An optical transmission assembly is embedded in at least a portion of the substrate holder to receive light emissions from the surface of the temperature sensor pin.

Description

Technical Field

[0001] Embodiments of the present principle generally relate to substrate temperature measurement in a microwave and vacuum environment in semiconductor manufacturing processes. Background Art

[0002] Temperature plays an important role in semiconductor manufacturing both for converting materials and for removing moisture from materials. The processing chambers, substrates, and gases used in semiconductor formation are all strictly controlled during processing. Different types of pyrometers can be used to read the temperature, and in particular, when measuring the substrate temperature, different types of pyrometers are needed to provide high precision. However, when encountering harsh environments such as heating chambers using microwaves, the ability of general pyrometers to correctly measure the temperature in harsh environments is insufficient. When using a microwave or vacuum environment, the harsh environment usually hinders accurate temperature measurement of the substrate.

[0003] Therefore, the inventors provide improved methods and devices for measuring the substrate temperature in a microwave and / or vacuum cavity. Summary of the Invention

[0004] Devices for measuring the temperature of a substrate in a microwave and / or vacuum environment are provided herein.

[0005] In some embodiments, a device for determining the temperature of a substrate may include: a substrate holder having a plurality of support pins, the substrate holder being configured to be placed in a microwave or vacuum environment; a temperature sensor assembly, at least a portion of the surface of which has a phosphorus coating, and the temperature sensor assembly being configured to be inserted into at least one pin support position; and an optical transmission assembly embedded in at least a portion of the substrate holder and configured to receive light emissions from at least a portion of the surface of the temperature sensor assembly and relay the light emissions to a temperature detection assembly.

[0006] In some embodiments, the substrate holder is configured to be static during temperature measurement, wherein the substrate holder is configured to rotate during temperature measurement, wherein the temperature sensor assembly includes a temperature sensor pin having a spring, the spring providing upward movement of the temperature sensor pin, and configured to enhance thermal contact with a warped substrate by providing an upward force to the substrate when a warped substrate is present, wherein the spring is a material that is transparent to microwaves, wherein the spring is made of a material that is transparent to microwaves and may include a ceramic material, wherein the temperature sensor pin has a slot passing through a lower portion of the temperature sensor pin and is configured to be held in the substrate holder by a locking pin inserted through the slot of the temperature sensor pin, wherein the locking pin is a material that is transparent to microwaves, wherein the locking pin is made of a material that is transparent to microwaves and may include a ceramic material, wherein the temperature sensor pin is made of a material having a thermal conductivity greater than about 200 W / mK and a low thermal mass that is transparent to microwaves, wherein at least a portion of the surface of the temperature sensor assembly includes a side surface of the temperature sensor assembly, wherein at least a portion of the surface of the temperature sensor assembly includes a bottom surface of the temperature sensor assembly, wherein the optical transmission assembly is configured to intermittently obtain light emissions from the temperature sensor assembly, and / or wherein the substrate holder and the temperature sensor assembly are configured to be mounted on a rotating platform, and the light transmission assembly is configured to be mounted on a static platform, wherein the temperature sensor assembly is configured to pass by the optical transmission assembly when the substrate holder rotates.

[0007] In some embodiments, a device for determining the temperature of a substrate may include: a substrate holder having a plurality of support pins, the substrate holder being configured to be placed in a microwave environment or a vacuum environment; a temperature sensor assembly, at least a portion of the surface of which has a phosphor coating, and the temperature sensor assembly being configured to be inserted into at least one pin support position from an internal region of the substrate holder and into at least one pin support position from an external region of the substrate holder, wherein the temperature sensor assembly includes a temperature sensor pin having a spring, the spring being transparent to microwaves and providing upward movement of the temperature sensor pin, and being configured to enhance thermal contact with a warped substrate by providing an upward force to the substrate when a warped substrate is present, and wherein the temperature sensor pin is made of a material having a thermal conductivity greater than about 200 W / mK and a low thermal mass that is transparent to microwaves; and an optical transmission assembly embedded in at least a portion of the substrate holder and configured to receive light emissions from at least a portion of the surface of the temperature sensor assembly and relay the light emissions to a temperature detection assembly.

[0008] In some embodiments, the substrate holder and the temperature sensor assembly are configured to be mounted on a rotating platform, and the optical transmission assembly is configured to be mounted on a static platform, wherein the temperature sensor assembly is configured to pass by the optical transmission assembly when the substrate holder rotates, wherein the temperature sensor pin has a slot passing through a lower portion of the temperature sensor pin and is configured to be held in the substrate holder by a locking pin inserted through the slot of the temperature sensor pin, wherein the locking pin is made of a material transparent to microwaves, and / or wherein at least a portion of the surface of the temperature sensor assembly includes a side surface or a bottom surface of the temperature sensor assembly.

[0009] In some embodiments, an apparatus for heating a substrate with microwaves may include: a processing chamber having a microwave power source and a microwave cavity, the processing chamber being capable of providing a vacuum environment for heating the substrate; a plurality of substrate holders having a plurality of support pins, the plurality of substrate holders being configured to be placed in the microwave cavity and configured to support a plurality of substrates; at least one temperature sensor assembly, at least a portion of the surface of the at least one temperature sensor assembly having a phosphor coating, and the at least one temperature sensor assembly being configured to be inserted into at least one pin support position in at least one of the plurality of substrate holders; at least one optical transmission assembly embedded in at least a portion of at least one of the plurality of substrate holders and configured to receive a light emission from at least a portion of the surface of the temperature sensor assembly and relay the light emission to a temperature detection assembly; and a controller configured to receive temperature information from the temperature detection assembly and provide regulation of the microwave power source based on the temperature information and process information.

[0010] In some embodiments, the processing chamber is configured to process and determine the temperatures of the plurality of substrates when at least one of the plurality of substrates is made of a different material than another of the plurality of substrates.

[0011] Other and further embodiments are disclosed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Embodiments of the principles outlined above may be understood by reference to the illustrative embodiments of the principles shown in the accompanying drawings and discussed in more detail below. However, the drawings only show typical embodiments of the principles and are therefore not considered to be a limitation of the scope, as the principles may allow other equivalent embodiments.

[0013] Figure 1 A cross-sectional view of a substrate heating system in accordance with some embodiments of the present principles is shown.

[0014] Figure 2 Shows an isometric view of a substrate holder according to some embodiments of the present principle.

[0015] Figure 3 Shows a sectional isometric view of a temperature sensor assembly according to some embodiments of the present principle.

[0016] Figure 4 Shows an isometric view of a temperature sensor pin according to some embodiments of the present principle.

[0017] Figure 5 Shows a sectional view of a temperature sensor assembly and an optical transmission assembly according to some embodiments of the present principle.

[0018] Figure 6 Shows an isometric view of a temperature sensor pin according to some embodiments of the present principle.

[0019] Figure 7 Shows a sectional view of a temperature sensor assembly and an optical transmission assembly according to some embodiments of the present principle.

[0020] Figure 8 Shows an isometric view of a rotating substrate holder according to some embodiments of the present principle.

[0021] Figure 9 Shows an isometric view of a rotating temperature sensor assembly and a fixed optical transmission assembly according to some embodiments of the present principle.

[0022] For ease of understanding, the same reference numerals are used, where possible, to denote the same components common to the figures. The figures are not drawn to scale and may be simplified for clarity. The components and features of one embodiment may be beneficially incorporated into other embodiments without further recitation. Detailed Description

[0023] The device provides temperature measurement of substrates that is independent of the substrate material and in harsh environments, such as in a microwave and / or vacuum chamber, for substrate-independent proportional-integral-derivative (PID) temperature control. The device is transparent to microwaves and can be used in environments ranging from ultra-high vacuum to atmospheric conditions. Temperature measurement can advantageously be performed in a vacuum environment where fiber optic devices cannot be used and is not limited by the substrate material such as infrared (IR) sensors. The device can also be advantageously used to determine the temperature based on multiple points in a substrate and / or multiple wafers in a stack to provide an overall heating pattern of the substrate stack. The temperature of a substrate stack having a mixture of substrate materials can also be determined in one setting. The device can also be used with static substrates as well as with rotating (non-static) substrates. Since the device is material-independent, it can be used to measure substrates formed of silicon, glass, epoxy resin, etc.

[0024] In some embodiments, the temperature sensor assembly for measuring temperature is also used to support the substrate and has a temperature sensor pin made of a material having a low thermal mass and a high thermal conductivity, such as but not limited to polyetheretherketone (PEEK), aluminum nitride, or silicon nitride, etc., which also helps for proper heat transfer in a vacuum and / or microwave environment. The height of the temperature sensor pin can be the same as or different from the height of the support pin that supports the substrate. The temperature sensor assembly can have a spring mechanism that allows vertical movement and can cause the temperature sensor pin to protrude beyond the support pin to ensure good thermal contact with the substrate, especially when the substrate is warped. In some embodiments, the temperature sensor assembly can be used in a substrate drying chamber and has a temperature sensor pin formed of a material that does not absorb moisture, such as but not limited to the PEEK material that is also transparent to microwaves.

[0025] The device of this principle can be used in a vacuum environment as well as a microwave environment. The device is not limited to one type of processing chamber. For the sake of brevity, the device will be described in an example using a substrate heating or drying chamber. Figure 1A cross-sectional view of a substrate heating system 100 according to some embodiments is shown. The substrate heating system 100 includes a processing chamber 102, a microwave source 104, and a controller 106. The processing chamber 102 further includes a slit valve 108 for moving substrates into and out of the processing chamber 102. In some embodiments, the processing chamber 102 houses one or more substrates 110 for heating or drying. The one or more substrates 110 are held on one or more substrate holders 112, and the one or more substrate holders 112 hold the one or more substrates 110 on a plurality of support pins 114. The one or more substrate holders 112 are supported by one or more support members 116. The one or more support members 116 can statically support the one or more substrate holders 112 and / or can provide vertical movement to the one or more substrate holders 112 to assist in loading or unloading the one or more substrates 110.

[0026] The controller 106 controls the operation of the substrate heating system 100 using direct control or, alternatively, by controlling a computer (or controller) associated with the substrate heating system 100. In operation, the controller 106 enables data collection and feedback to optimize the performance of the substrate heating system 100. The controller 106 generally includes a central processing unit (CPU) 118, a memory 120, and support circuitry 122. The CPU 118 can be any form of general-purpose computer processor that can be used in an industrial setting. The support circuitry 122 is conventionally coupled to the CPU 118 and can include a cache, a clock circuit, an input / output subsystem, a power supply, and the like. Software routines such as the methods described above can be stored in the memory 120 and, when executed by the CPU 118, convert the CPU 118 into a dedicated computer (controller 106). The software routines can also be stored and / or executed by a second controller (not shown) located remotely from the substrate heating system 100.

[0027] The memory 120 is in the form of a computer-readable storage medium that contains instructions that, when executed by the CPU 118, facilitate the operation of semiconductor processes and devices. The instructions in the memory 120 are in the form of a program product, such as a program for a device that implements the present principles. The program code can conform to any of a variety of different programming languages. In one example, the present disclosure can be implemented as a program product stored on a computer-readable storage medium for use with a computer system. The program of the program product defines various functions. Illustrative computer-readable storage media include, but are not limited to: non-writable storage media on which information is permanently stored (e.g., read-only memory devices within a computer, such as a CD-ROM disk readable by a CD-ROM drive, flash memory, ROM chips, or any type of solid-state non-volatile semiconductor memory); and writable storage media on which changeable information is stored (e.g., a floppy disk in a floppy disk drive, or a hard disk drive, or any type of solid-state random access semiconductor memory). Such a computer-readable storage medium when carrying computer-readable instructions related to the functions of the substrate heating system described herein is an aspect of the present principles.

[0028] Figure 2 An isometric view 200 of a substrate holder 112 according to some embodiments is shown. The substrate holder 112 has support pins 114 that keep the substrate away from the upper surface 206 of the substrate holder 112. In some embodiments, one or more of the support pins 114 are replaced by one or more temperature sensor assemblies 202. To ensure temperature uniformity across the substrate, one or more internal support pins 114A and one or more external support pins 114B can be replaced by temperature sensor assemblies 202, as Figure 2 shown. One or more temperature sensor assemblies 202 interface with one or more optical transmission assemblies 208 that are embedded in channels in the substrate holder 112 ( Figure 2 not shown in the figure, see Figures 3 to 5 , Figure 7 , Figure 8) Among them. One or more optical transmission components 208 may be exposed in the channel or may be hidden in the channel. One or more temperature sensor components 202 are docked with one or more temperature detection components 204, and the temperature detection components 204 convert optical information into digital and / or analog signal information for use by the controller 106. In some embodiments, one or more temperature detection components 204 may be remote from one or more optical transmission components 208 and / or be a part of the controller 106. In some embodiments, one or more optical transmission components 208 reach one or more temperature detection components 204 via one or more support members 116. In some embodiments, one or more temperature detection components 204 may be positioned on the substrate holder 112 to convert optical transmission into digital and / or analog signals and then transmit the converted signals to the controller 106.

[0029] Figure 3 A sectional isometric view 300 of a temperature sensor component 202 according to some embodiments is shown. The temperature sensor component 202 includes a temperature sensor pin 302 having a spring 304. The temperature sensor pin 302 is held by a locking pin 306 that is inserted through a locking channel 308 in the substrate holder 112. The temperature sensor pin 302 has a slot 310 that accommodates the locking pin 306 and prevents the temperature sensor pin 302 from coming out of the substrate holder 112 in response to the upward pressure of the spring 304. The spring 304 is configured to provide sufficient upward pressure to allow sufficient thermal contact with the substrate and sufficient heat transfer from the substrate to the temperature sensor pin 302 to generate light emission from a phosphor coating on the temperature sensor pin 302. The slot 310 is large enough to allow the temperature sensor pin 302 to move vertically 316 when the substrate is lowered onto the temperature sensor pin 302 to ensure proper thermal contact. The spring 304 also helps to compensate for warping of the substrate, etc. The optical transmission component 208 is shown embedded in a channel 312 of the substrate holder 112 that leads to a side portion of the temperature sensor pin 302, and the side portion is located below the upper surface 206 of the substrate holder 112. In some embodiments, the temperature sensor pin 302 is formed of a material that is transparent to microwaves, and the material that is transparent to microwaves has a low thermal mass and a thermal conductivity greater than about 200 W / mK. In some embodiments, the spring 304 and / or the locking pin 306 may be formed of a material that is transparent to microwaves, such as but not limited to ceramics, PEEK, etc.

[0030] Figure 4An isometric view 400 of a temperature sensor pin 302 according to some embodiments is shown. The temperature sensor pin 302 includes a first end 412 having a cap 404 and an upper surface 402 that is flat to thermally contact a substrate when a substrate is present. The temperature sensor pin 302 has a second end 414 remote from the first end 412, and the second end 414 includes a bottom surface 410. Below the cap 404 of the temperature sensor pin 302 is a body 406, and a second diameter 420 of the body 406 is less than a first diameter 418 of the cap 404 when measured from a central axis 416. A portion of the outer surface of the body 406 has a phosphor coating 408 that facilitates measuring the temperature of the substrate by an optical transmission assembly 208. The phosphor coating 408 may be formed of a fluorescent material. Figure 5 A cross-sectional view 500 of a temperature sensor assembly 202 and an optical transmission assembly 208 according to some embodiments is shown. The optical transmission assembly 208 is configured to receive a light emission 516 from a phosphor coating 408 on a portion of a side surface of the body of the temperature sensor pin 302. The phosphor coating 408 is configured to cover a sufficient side surface of the body to allow the optical transmission assembly 208 to receive the light emission when the temperature sensor pin is vertically displaced when a substrate is loaded onto the upper surface 402 of the temperature sensor pin 302.

[0031] Figure 6 An isometric view 600 of a temperature sensor pin 602 according to some embodiments is shown. The temperature sensor pin 602 has a phosphor coating 604 on the bottom surface 410 of the temperature sensor pin 602. The phosphor coating 604 may be formed of a fluorescent material. In some embodiments, the temperature sensor pin 602 is formed of a material that is microwave transparent and has a low thermal mass and a thermal conductivity greater than about 200 W / mK. Figure 7 A cross-sectional view 700 of a temperature sensor assembly 702 and an optical transmission assembly 708 according to some embodiments is shown. The optical transmission assembly 708 extends below the temperature sensor pin 602 and is configured to receive a light emission 706 from a phosphor coating 604 on the bottom surface 410 of the temperature sensor pin 602. In some embodiments, the spring 304 may be formed of a material that is microwave transparent such as, but not limited to, ceramic, PEEK, etc.

[0032] Figure 8An isometric view 800 of a rotating substrate holder 812 in accordance with some embodiments is shown. The rotating substrate holder 812 is supported by one or more fixed supports 802 that provide rotational movement to the rotating substrate holder 812. The fixed supports 802 may be held in place by one or more support members 116. A first optical transmission assembly 818A is embedded in a first fixed support 802A having a first extension 816A configured to position the first optical transmission assembly 818A below a first temperature sensor assembly 702A in an interior region of the rotating substrate holder 812. The first extension 816A is configured such that when the rotating substrate holder 812 rotates, the first temperature sensor assembly 702A passes over an end of the first optical transmission assembly 818A. A second optical transmission assembly 818B is embedded in a second fixed support 802B having a second extension 816B configured to position the second optical transmission assembly 818B below a second temperature sensor assembly 702B in an exterior region of the rotating substrate holder 812. The second extension 816B is configured such that when the rotating substrate holder 812 rotates, the second temperature sensor assembly 702B passes over an end of the second optical transmission assembly 818B. In some embodiments, the first extension 816A and the second extension 816B may be part of a single fixed support.

[0033] Figure 9 An isometric view 900 of a second temperature sensor assembly 702B that rotates with the rotating substrate holder 812 and a second optical transmission assembly 818B that remains fixed with the second fixed support 802B in accordance with some embodiments is shown. The second optical transmission assembly 818B is embedded in a channel 902 in the second fixed support 802B. The second optical transmission assembly 820 may be exposed in the channel 902 (as shown) or fully hidden in the channel 902. For each rotation of the rotating substrate holder 812, the second temperature sensor assembly 702B passes over an end of the second optical transmission assembly 818B once. When more than one temperature sensor assembly is used in an exterior and / or interior region of the rotating substrate holder 812, for each rotation of the rotating substrate holder 812, the optical transmission assembly may receive multiple light emissions from multiple temperature sensor assemblies in that region. In some embodiments, the rotating substrate holder 812 may rotate at about 5, 10, 30, or up to 60 revolutions per minute.

[0034] Embodiments in accordance with the present principles may be implemented in hardware, firmware, software, or any combination thereof. Embodiments may also be implemented as instructions stored on one or more computer-readable media, which may be read and executed by one or more processors. A computer-readable medium may include any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computing platform or “virtual machine” running on one or more computing platforms). For example, a computer-readable medium may include any suitable form of volatile or non-volatile memory. In some embodiments, a computer-readable medium may include a non-transitory computer-readable medium.

[0035] Although the foregoing is directed to embodiments of the present principles, other and further embodiments of the present principles may be devised without departing from the basic scope thereof.

Claims

1. An apparatus for determining the temperature of a substrate, comprising: a substrate holder having a plurality of support pins, the substrate holder being configured to be placed in a microwave or vacuum environment; a temperature sensor assembly, at least a portion of the surface of which has a phosphorus coating, and the temperature sensor assembly being configured to be inserted into at least one pin support position on the substrate holder, wherein the temperature sensor assembly includes a temperature sensor pin having a spring that provides upward movement of the temperature sensor pin and is configured to enhance thermal contact with a warped substrate by providing an upward force to the substrate when there is a warped substrate; and an optical transmission assembly embedded in at least a portion of the substrate holder or a static platform and configured to receive light emission from at least a portion of the surface of the temperature sensor assembly and relay the light emission to a temperature detection assembly.

2. The apparatus according to claim 1, wherein the substrate holder is configured to be static during temperature detection.

3. The apparatus according to claim 1, wherein the substrate holder is configured to rotate during temperature detection.

4. The apparatus according to claim 1, wherein the static platform has an extension configured to position the optical transmission assembly below the temperature sensor assembly in an internal region of the substrate holder.

5. The apparatus according to claim 1, wherein the spring is a material that is transparent to microwaves.

6. The apparatus according to claim 5, wherein the spring is made of a ceramic material.

7. The apparatus according to claim 1, wherein the temperature sensor pin has a slot passing through a lower portion of the temperature sensor pin and is configured to be held in the substrate holder by a locking pin inserted through the slot of the temperature sensor pin.

8. The apparatus according to claim 7, wherein the locking pin is a material that is transparent to microwaves.

9. The apparatus according to claim 8, wherein the locking pin is made of a ceramic material.

10. The apparatus according to claim 1, wherein the temperature sensor pin is made of a material having a thermal conductivity greater than 200 W / mK and a low thermal mass that is transparent to microwaves.

11. The apparatus according to claim 1, wherein at least a portion of the surface of the temperature sensor assembly includes a side surface of the temperature sensor assembly.

12. The apparatus according to claim 1, wherein at least a portion of the surface of the temperature sensor assembly includes a bottom surface of the temperature sensor assembly.

13. The apparatus according to claim 1, wherein the optical transmission assembly is configured to intermittently obtain light emission from the temperature sensor assembly.

14. The apparatus according to claim 1, wherein the substrate holder and the temperature sensor assembly are configured to be mounted on a rotating platform, and the optical transmission assembly is configured to be mounted on the static platform, wherein the temperature sensor assembly is configured to pass by the optical transmission assembly when the substrate holder rotates.

15. An apparatus for determining the temperature of a substrate, comprising: a substrate holder having a plurality of support pins, the substrate holder being configured to be placed in a microwave environment or a vacuum environment; a temperature sensor assembly, at least a portion of a surface of the temperature sensor assembly having a phosphorus coating, and the temperature sensor assembly being configured to be inserted into at least one pin support position in an inner region of the substrate holder and at least one pin support position in an outer region of the substrate holder, wherein the temperature sensor assembly includes a temperature sensor pin having a spring, the spring being transparent to microwaves and providing upward movement of the temperature sensor pin, and being configured to enhance thermal contact with a warped substrate by providing an upward force to the substrate when there is a warped substrate, and wherein the temperature sensor pin is made of a material having a thermal conductivity greater than 200 W / mK and having a low thermal mass that is transparent to microwaves; and an optical transmission assembly embedded in at least a portion of the substrate holder or a static platform, and being configured to receive an optical emission from at least a portion of the surface of the temperature sensor assembly and relay the optical emission to a temperature detection assembly.

16. The apparatus of claim 15, wherein the substrate holder and the temperature sensor assembly are configured to be mounted on a rotating platform, and the optical transmission assembly is configured to be mounted on the static platform, wherein the temperature sensor assembly is configured to pass by the optical transmission assembly when the substrate holder rotates.

17. The apparatus of claim 15, wherein the temperature sensor pin has a slot passing through a lower portion of the temperature sensor pin and is configured to be held in the substrate holder by a locking pin inserted through the slot of the temperature sensor pin, wherein the locking pin is made of a material transparent to microwaves.

18. The apparatus of claim 15, wherein at least a portion of the surface of the temperature sensor assembly includes a side surface of the temperature sensor assembly or a bottom surface of the temperature sensor assembly.

19. An apparatus for heating a substrate with microwaves, comprising: a processing chamber having a microwave power source and a microwave cavity, the processing chamber being capable of providing a vacuum environment for heating the substrate; a plurality of substrate holders having a plurality of support pins, the plurality of substrate holders being configured to be placed in the microwave cavity, the plurality of substrate holders being configured to support a plurality of substrates; at least one temperature sensor assembly, at least a portion of a surface of the at least one temperature sensor assembly having a phosphorus coating, and the at least one temperature sensor assembly being configured to be inserted into at least one pin support position in at least one of the plurality of substrate holders, wherein the temperature sensor assembly includes a temperature sensor pin having a spring, the spring providing upward movement of the temperature sensor pin and being configured to enhance thermal contact with a warped substrate by providing an upward force to the substrate when there is a warped substrate; At least one optical transmission component, embedded in at least a part of at least one of the plurality of substrate holders or in a static platform, and configured to receive the light emission from the at least a part of the surface of the temperature sensor component and relay the light emission to a temperature detection component; And A controller, configured to receive temperature information from the temperature detection component and provide regulation to the microwave power source based on the temperature information and processing information.

20. The apparatus of claim 19, wherein the processing chamber is configured to process and detect the temperatures of the plurality of substrates when at least one of the plurality of substrates is made of a different material than another one of the plurality of substrates.

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