Electronic control device

Abstract

【Problem】To provide an electronic control device that can improve the vibration resistance of a heat degradation component that needs to cope with vibration and causes heat degradation, and suppress the heat degradation of the heat degradation component. 【Solution】The electronic control device (1) includes: a circuit board (4) on which heat generating components (21, 22, 23) and heat degradation components (31, 32) are mounted on a first surface (4A); a first metal housing (2) that covers the first surface (4A); a second housing (3) that covers a second surface (4B) of the circuit board (4) opposite to the first surface (4A); support members (51, 52) that are provided between the heat degradation components (31, 32) and the first housing (2) and support the heat degradation components (31, 32); and heat dissipation members (41, 42, 43) that are provided on at least one of the heat generating components (21, 22, 23) and the first housing (2) and transfer the heat generated by the heat generating components (21, 22, 23) to the first housing (2). The thermal conductivity of the heat dissipation members (41, 42, 43) is higher than the thermal conductivity of the support members (51, 52).

Description

Technical Field

[0001] The present invention relates to an electronic control device having a circuit board on which a heat-generating component and a thermally deteriorated component are mounted. Background Art

[0002] For example, an in-vehicle electronic control device has a circuit board. In order to cope with various mounting conditions, such a circuit board is required to have high heat resistance and vibration resistance. In the circuit board, a heat-generating component that generates heat during operation and a component that needs to cope with vibration in consideration of vehicle vibration are mixed and mounted.

[0003] As one of the means for improving the heat resistance of the heat-generating component, for example, it is known to fix the circuit board to a metal frame, and the heat generated by the heat-generating component is efficiently transferred to the metal frame via a heat dissipation member and diffused. In addition, the size of the component that needs to cope with vibration is mainly large in the height direction. Therefore, as one of the means for improving the vibration resistance of the component that needs to cope with vibration, for example, it is known to support the component that needs to cope with vibration on a metal frame at a position as far as possible from the position where the component that needs to cope with vibration is connected to the circuit board by welding.

[0004] A circuit board of an electronic device is disclosed in Patent Document 1. A heat dissipation resin for heat dissipation is filled in the housing of the electronic device described in Patent Document 1. The top end portion of the heat-generating component on the circuit board is buried in the heat dissipation resin in the housing. Therefore, the heat generated by the heat-generating component is transferred to the housing through the heat dissipation resin and diffused. In addition, the top end portion of the low-heat-generating component described in Patent Document 1 is buried in the heat dissipation resin in the housing via a protective cover made of an elastic member. Therefore, the protective cover suppresses the heat generated by the heat-generating component from being transferred to the low-heat-generating component through the heat dissipation resin.

[0005] Prior Art Documents

[0006] Patent Documents

[0007] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2014-99550 Summary of the Invention

[0008] Problems to be Solved by the Invention

[0009] However, among the components that need to cope with vibration, there are components that cause thermal deterioration, such as electrolytic capacitors. Therefore, as described above, as a means for improving the vibration resistance of the component that needs to cope with vibration, if the component that needs to cope with vibration is supported on a metal frame, it is possible that the heat generated by the heat-generating component is transferred to the component that causes thermal deterioration (such as an electrolytic capacitor) in the component that needs to cope with vibration via the metal frame. Then, it is possible to promote the thermal deterioration of the component that causes thermal deterioration in the component that needs to cope with vibration.

[0010] The present invention is completed to solve the above problems, and an object thereof is to provide an electronic control device capable of improving the vibration resistance of a heat degradation component that needs to cope with vibration and causes heat degradation, and capable of suppressing the heat degradation of the heat degradation component.

[0011] Means for Solving the Problem

[0012] The above problems are solved by the electronic control device of the present invention. The electronic control device includes: a circuit board on which a heat generating component that generates heat during operation and a heat degradation component that needs to cope with vibration and causes heat degradation are mounted on a first surface; a first metal housing that covers the first surface; a second housing that covers a second surface of the circuit board opposite to the first surface; a support member that is disposed between the heat degradation component and the first housing and supports the heat degradation component; and a heat dissipation member that is disposed on at least one of the heat generating component and the first housing and transfers the heat generated by the heat generating component to the first housing, and the thermal conductivity of the heat dissipation member is higher than that of the support member.

[0013] According to the electronic control device of the present invention, a heat degradation component that needs to cope with vibration and causes heat degradation is supported by a support member disposed between the heat degradation component and the first housing. The heat generated by the heat generating component is transferred to the first metal housing through the heat dissipation member disposed on at least one of the heat generating component and the first housing and diffused. Among them, the thermal conductivity of the heat dissipation member is higher than that of the support member. Therefore, even if the heat generated by the heat generating component is transferred to the first metal housing through the heat dissipation member and diffused, the support member can suppress the heat transferred to the first housing from being transferred to the heat degradation component and can support the heat degradation component. Thus, the electronic control device of the present invention can improve the vibration resistance of a heat degradation component that needs to cope with vibration and causes heat degradation, and can suppress the heat degradation of the heat degradation component.

[0014] In the electronic control device of the present invention, it is preferable that the support member is disposed between the heat degradation component and the first housing.

[0015] According to the electronic control device of the present invention, since the support member is disposed between the heat degradation component and the first housing, the heat degradation component that needs to cope with vibration and causes heat degradation can be reliably supported by the first housing, and the heat diffused to the first housing can be further suppressed from being transferred to the heat degradation component, and the heat degradation of the heat degradation component can be further suppressed.

[0016] In the electronic control device of the present invention, it is preferable that the heat dissipation member is sandwiched between the heat generating component and the first housing.

[0017] In the electronic control device according to the present invention, since the heat dissipation member is sandwiched between the heat generating component and the first housing, the heat generated by the heat generating component during operation can be reliably transferred through the first housing and diffused, and the heat dissipation of the heat generating component can be performed more reliably.

[0018] The electronic control device of the present invention preferably further includes a sealant disposed between the first housing and the second housing to bond the first housing and the second housing to each other, and hermetically seal the circuit board between the first housing and the second housing. The material of the sealant is the same as the material of the support member.

[0019] In the electronic control device according to the present invention, the material of the sealant that hermetically seals the circuit board between the first housing and the second housing is the same as the material of the support member. Therefore, the types of components can be reduced to achieve the unification of the types of components, and the production process of the electronic control device can be simplified.

[0020] In the electronic control device of the present invention, preferably, the heat generating component is a first heat generating component, the heat dissipation member is a first heat dissipation member, and the electronic control device further includes: a second heat generating component mounted on the second surface and generating heat during operation; and a second heat dissipation member attached to the second heat generating component to release the heat generated by the second heat generating component.

[0021] In the electronic control device according to the present invention, the heat generated by the second heat generating component mounted on the second surface of the circuit board is transferred to the circuit board and the first housing through the second heat dissipation member attached to the second heat generating component and diffused, or diffused by radiation through the second heat dissipation member. Thus, even when the heat generating components are mounted on both the first surface and the second surface of the circuit board, the heat generated by the heat generating components can be efficiently released.

[0022] In the electronic control device of the present invention, preferably, the circuit board is used for controlling the operation of the engine of a vehicle, and the first housing is mounted on at least one of the engine and the vehicle body on which the engine is mounted.

[0023] In the electronic control device according to the present invention, when the electronic control device is mounted on at least one of the engine of a vehicle and the vehicle body on which the engine is mounted, the vibration resistance of the heat deterioration components that need to cope with vibration and generate heat deterioration can be improved, and the heat deterioration of the heat deterioration components can be suppressed. Thus, the durability and reliability of the in-vehicle electronic control device can be improved.

[0024] In the electronic control device of the present invention, preferably, the first housing is mounted on at least one of the engine and the vehicle body through fastening members and is in surface contact with the surface of at least one of the engine and the vehicle body.

[0025] According to the electronic control device of the present invention, the first housing is mounted on at least one of the engine and the vehicle body by fastening members and is in surface contact with the surface of at least one of the engine and the vehicle body. Therefore, the heat transferred from the heat-generating component to the first housing via the heat dissipation component can be efficiently transferred from the first housing to at least one of the engine and the vehicle body and released. In addition, the electronic control device is stably mounted on at least one of the engine and the vehicle body in a surface contact manner in the first housing, so that the vibration of the electronic control device can be suppressed.

[0026] Advantages of the Invention

[0027] According to the present invention, an electronic control device can be provided that can improve the vibration resistance of heat deterioration components that need to cope with vibration and generate heat deterioration, and suppress the heat deterioration of the heat deterioration components. Description of the Drawings

[0028] Figure 1 It is a perspective view showing an electronic control device according to an embodiment of the present invention.

[0029] Figure 2 It is a perspective view showing the upper housing of the electronic control device according to the present embodiment.

[0030] Figure 3 It is an exploded perspective view showing a structural example of the electronic control device according to the present embodiment.

[0031] Figure 4 is Figure 1 A cross-sectional view taken along line G-G shown. Detailed Embodiment

[0032] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

[0033] In addition, the embodiments described below are preferred specific examples of the present invention, and thus various technically preferred limitations are added. However, as long as there is no description specifically limiting the gist of the present invention in the following description, the scope of the present invention is not limited to these embodiments. In addition, in each drawing, the same reference numerals are assigned to the same components and their detailed descriptions are appropriately omitted.

[0034] (Overview and Mounting Object of Electronic Control Device 1)

[0035] Figure 1 It is a perspective view showing an electronic control device according to an embodiment of the present invention.

[0036] Figure 2 It is a perspective view showing the upper housing of the electronic control device according to the present embodiment.

[0037] In addition, Figure 2 shows the inner surface (back surface) side of the upper housing.

[0038] Figure 1 The electronic control device 1 shown is used, for example, as an in-vehicle electronic control device. The in-vehicle electronic control device 1 is an engine control unit (ECU: Engine Control Unit) that comprehensively controls electrical auxiliary devices used, for example, when performing engine operation control, safety control, etc.

[0039] The engine to which the electronic control device 1 is applied is, for example, an internal combustion engine. Such an engine is mounted, for example, on vehicles such as construction machinery, agricultural machinery, lawn mowers, and automobiles. The engine is, for example, a supercharged diesel engine with a turbocharger. However, the engine is not limited thereto, and may also be a naturally aspirated diesel engine, a supercharged gasoline engine with a turbocharger, a naturally aspirated gasoline engine, and a hybrid diesel engine or hybrid gasoline engine that uses an electric motor in combination. Figure 1 The electronic control device 1 shown is mounted, for example, on the vehicle body or the engine. The electronic control device 1 is detachably mounted on a mounting object 200 such as the vehicle body or the engine using a plurality of bolts 201. As the mounting object 200, for example, components in the engine compartment of the vehicle body, components in the driver's cab of the driver's seat, the engine itself, etc. can be cited.

[0040] As Figure 1 and Figure 2 shown, for example, bolt through-holes 151 are provided at a plurality of positions on the upper housing 2. Since Figure 1 the bolts 201 shown are fitted to the mounting object 200 through the respective bolt through-holes 151, the electronic control device 1 can be detachably mounted on the mounting object 200. The bolt 201 of the present embodiment is an example of the "fastening member" of the present invention.

[0041] (Structural example of the electronic control device 1)

[0042] Figure 3 is an exploded perspective view showing a structural example of the electronic control device of the present embodiment.

[0043] Figure 4 is Figure 1 a cross-sectional view taken along the sectional line G-G shown.

[0044] In addition, in Figure 4 order to easily understand the structural example of the electronic control device 1, the components and the like included in the electronic control device 1 are schematically shown in a partially emphasized manner.

[0045] As Figure 3As shown in the figure, the electronic control device 1 includes: an upper housing 2, a lower housing 3, an electronic control board 4, and a sealant 5. The electronic control board 4 in the present embodiment is an example of the "circuit board" of the present invention. The upper housing 2 in the present embodiment is an example of the "first housing" of the present invention. The lower housing 3 in the present embodiment is an example of the "second housing" of the present invention. The upper housing 2 and the lower housing 3 use the sealant 5 to accommodate the electronic control board 4 in a liquid-tightly sealed or enclosed state inside, and use Figure 3 the plurality of bolts 221 shown in the figure to be fastened to each other. The upper housing 2 and the lower housing 3 constitute a metal frame 10. Thus, the upper housing 2 and the lower housing 3 of the frame 10 ensure various functions such as heat dissipation, dust prevention, waterproofing, vibration resistance, and heat resistance required for the in-vehicle electronic control device 1.

[0046] Next, the upper housing 2 and the lower housing 3 will be described.

[0047] <Upper housing 2>

[0048] Figure 2 And Figure 3 As shown in the figure, since the upper housing 2 needs to release the heat generated inside the electronic control device 1, it is a metal frame with heat dissipation properties, and is formed by, for example, die-casting of aluminum. The upper housing 2 has a three-dimensional shape with unevenness corresponding to the shapes of various electronic components mounted on the electronic control board 4.

[0049] As Figure 2 shown, the upper housing 2 has an internal thread portion 224. An internal thread for fitting the bolt 202 (refer to Figure 3 ) is formed on the internal thread portion 224. In addition, as Figure 3 shown, bolt through-holes 48 through which the bolt 202 can pass are formed at the four corners of the electronic control board 4. By passing the bolt 202 through the bolt through-hole 48 of the electronic control board 4 and fitting it with the internal thread portion 224 of the upper housing 2, the electronic control board 4 is fixed to the upper housing 2. In this way, the upper housing 2 fixes the electronic control board 4 and covers the first surface 4A of the electronic control board 4 on which various electronic components are mounted. In addition, the holding method of the electronic control board 4 is not limited to this. For example, the electronic control board 4 can also be clamped between the upper housing 2 and the lower housing 3 without relying on fastening members such as bolts 202.

[0050] As Figures 1 to 3 shown, the upper housing 2 has an internal thread portion 223. An internal thread for fitting the bolt 221 (refer to Figure 3 ) is formed on the internal thread portion 223. In addition, as Figure 3As shown, bolt through-holes 222 through which bolts 221 can pass are formed at the four corners of the lower housing 3. The lower housing 3 is fixed to the upper housing 2 by fitting the bolts 221 through the bolt through-holes 222 of the lower housing 3 with the internal threaded portions 223 of the upper housing 2. In this way, the lower housing 3 is fixed to the upper housing 2, thereby covering the second surface 4B of the electronic control board 4 on the side opposite to the first surface 4A of the electronic control board 4.

[0051] The upper housing 2 has mounting portions 15 at both ends in the Y direction. The mounting portions 15 are parts that are mounted on the mounting object 200 by bolts 201. Bolt through-holes 151 penetrate the mounting portions 15 in the Z direction (height direction). As described above, since the bolts 201 pass through the bolt through-holes 151 and are fitted with the mounting object 200, the electronic control device 1 is mounted on the mounting object 200. As Figure 4 shown, when the electronic control device 1 is fastened to the mounting object 200 by the bolts 201, the surface 152 of the mounting portion 15 contacts the surface 205 of the mounting object 200 with a relatively large area. Thus, the electronic control device 1 is stably mounted on the mounting object 200. Therefore, vibration of the electronic control device 1 can be suppressed. In addition, the shape etc. of the upper housing 2 will be described in detail later.

[0052] <Lower housing 3>

[0053] Figure 3 The shown lower housing 3 is made of a metal plate such as iron or aluminum, for example. Alternatively, the lower housing 3 can also be formed of resin. The lower housing 3 does not necessarily need to be formed of a material with heat dissipation, and can also be formed of a non-heat-dissipating material. Thus, the lower housing 3 can be formed by stamping a cheap metal plate. Therefore, there is no need to use aluminum die-casting in the manufacture of the lower housing 3, and accordingly, cost reduction of the lower housing 3 can be achieved. The lower housing 3 is a substantially flat plate-shaped member with fewer concavities and convexities compared to the upper housing 2. Thus, the structure of the lower housing 3 is relatively simple. In addition, as described above, the lower housing 3 is fixed to the upper housing 2 by bolts 221, thereby covering the second surface 4B of the electronic control board 4. Thus, the upper housing 2 and the lower housing 3 use a sealant 5 to accommodate the electronic control board 4 in a liquid-tightly sealed or enclosed state inside. The dimension of the lower housing 3 in the longitudinal direction, i.e., the X direction, is substantially the same as the dimension of the upper housing 2 in the X direction. The dimension of the lower housing 3 in the transverse direction, i.e., the Y direction, is substantially the same as the dimension of the upper housing 2 in the Y direction.

[0054] <Electronic control board 4>

[0055] Refer to Figure 3 and Figure 4 to describe a structural example of the electronic control board 4. To cope with various mounting conditions and usage environment conditions, for Figure 3 and Figure 4The illustrated electronic control substrate 4 requires, for example, high heat resistance and vibration resistance. As Figure 1 and Figure 3 shown, the electronic control substrate 4 has, for example, two connectors 4C and 4D. The connectors 4C and 4D are electrically connected to the harness connectors on the vehicle body side, receive power supply, or transmit and receive control signals.

[0056] On Figure 3 and Figure 4 the illustrated electronic control substrate 4, heat-generating components that generate heat during operation and components that need to cope with vibration in consideration of the vibration of the vehicle body are hybrid-mounted. The "heat-generating components" refer to electronic components that generate heat when operating by being energized, and are components that may cause a decrease in function if heat dissipation is not performed. As heat-generating components, for example, semiconductor components such as coils, LSIs (large-scale integrated circuits), and microcomputers can be cited.

[0057] Therefore, in order to efficiently diffuse and release the heat generated by the Figure 4 shown heat-generating components 21, 22, and 23 to the external gas during operation by using the upper housing 2 of the housing 10, the electronic control device 1 of the present embodiment has the following heat dissipation structure. That is, as Figure 4 shown, a heat dissipation region portion 2A and a heat dissipation region portion 2B are provided on the upper housing 2. On the inner surface 2R of the upper housing 2, heat dissipation members 41 and 42 are coated or pasted at the position of the heat dissipation region portion 2A. In addition, on the inner surface 2R of the upper housing 2, a heat dissipation member 43 is coated or pasted at the position of the heat dissipation region portion 2B. In addition, the heat dissipation members 41, 42, and 43 can be coated or pasted on the respective heat-generating components 21, 22, and 23, or can be coated or pasted on both the respective heat-generating components 21, 22, and 23 and the inner surface 2R of the upper housing 2. The heat-generating components 21, 22, and 23 of the present embodiment are examples of the "first heat-generating components" of the present invention. The heat dissipation members 41, 42, and 43 of the present embodiment are examples of the "first heat dissipation members" of the present invention.

[0058] The heat dissipation members 41 and 42 are respectively in close contact with the upper surfaces of the heat-generating components 21 and 22, and are sandwiched between the respective upper surfaces of the heat-generating components 21 and 22 and the inner surface 2R in the heat dissipation region portion 2A of the upper housing 2. Similarly, the heat dissipation member 43 is in close contact with the upper surface of the heat-generating component 23, and is sandwiched between the upper surface of the heat-generating component 23 and the inner surface 2R in the heat dissipation region portion 2B of the upper housing 2. Thereby, the heat generated by the heat-generating components 21, 22, and 23 during operation is efficiently transferred to the metal upper housing 2 through the heat dissipation members 41, 42, and 43 and diffused, and thus released to the outside.

[0059] The heat dissipation members 41, 42, and 43 are formed of a material having a relatively high thermal conductivity of about 2.2 W / m·K or more and about 2.8 W / m·K or less, for example. The form of the heat dissipation members 41, 42, and 43 is not particularly limited, and it may be any one of a sheet type, a tape type, a gel type, a rubber type, a paste type, a composite type, and the like. In addition, the thermal conductivity of the heat dissipation members 41, 42, and 43 is not limited to 2.2 W / m·K or more and 2.8 W / m·K or less.

[0060] As components that need to cope with vibration, for example, components such as electrolytic capacitors whose component dimensions are mainly higher in the Z direction (height direction) can be cited. That is, the components that need to cope with vibration are components with a relatively high height. Therefore, when the components that need to cope with vibration are vibrated due to interference, the posture of the components that need to cope with vibration inside the housing 10 may change, or the welded parts of the components that need to cope with vibration and the electronic control substrate 4 may come off. In addition, among the components that need to cope with vibration, there are, for example, electronic components (thermal degradation components) that generate thermal degradation such as electrolytic capacitors.

[0061] More specifically, as Figure 4 shown, the thermal degradation components 31 and 32 in the components that need to cope with vibration have thin electrical connection terminals 33. The electrical connection terminals 33 are electrically connected to the conduction pattern portion of the electronic circuit of the electronic control substrate 4 by welding. The thermal degradation components 31 and 32 are independently held on the first surface 4A of the electronic control substrate 4 using the electrical connection terminals 33. Therefore, in the independent state of the thermal degradation components 31 and 32, for example, when the electronic control device is vibrated due to the vibration of the vehicle body, inside the housing 10, the postures of the thermal degradation components 31 and 32 may change, or the welded parts of the electrical connection terminals 33 may come off, resulting in poor electrical contact. In addition, the X direction, Y direction, and Z direction shown in the figure are orthogonal to each other.

[0062] Therefore, as Figure 4 shown, in the electronic control device 1 of the present embodiment, the upper housing 2 has support region portions 2C and 2D formed to accommodate the thermal degradation components 31 and 32. The support region portions 2C and 2D have: support region tops 2CT and 2DT opposite to the tops 31T and 32T of the thermal degradation components 31 and 32; and support region sides 2CS and 2DS opposite to the sides 31S and 32S of the thermal degradation components 31 and 32. The support region tops 2CT and 2TD correspond to the height dimensions H1 and H2 of the thermal degradation components 31 and 32 of the electronic control substrate 4, and are formed in a convex shape in the Z direction. The heights of the support region tops 2CT and 2DT are higher than the heights of the above-mentioned heat dissipation region portions 2A and 2B. In addition, the support region portions 2C and 2D are not limited to having a rectangular space (refer to Figure 2 ), and may also have a cylindrical space, for example.

[0063] The support members 51 and 52 are formed on the inner surface 2R of the upper housing 2 by coating or pasting at positions opposite to the tops 31T and 32T of the heat degradation components 31 and 32, namely, the top portions 2CT and 2DT of the support areas. The support members 51 and 52 are in close contact with the tops 31T and 32T of the heat degradation components 31 and 32 respectively. In addition, the support members 51 and 52 can be coated or pasted on the respective tops 31T and 32T of the heat degradation components 31 and 32, or can be coated or pasted on both the respective tops 31T and 32T of the heat degradation components 31 and 32 and the top portions 2CT and 2DT of the support areas of the upper housing 2. That is to say, the support members 51 and 52 are clamped between the respective tops 31T and 32T of the heat degradation components 31 and 32 and the top portions 2CT and 2DT of the support areas of the upper housing 2.

[0064] Thus, the tops 31T and 32T of the heat degradation components 31 and 32 in the components that need to cope with vibration are supported on the top portions 2CT and 2DT of the support areas of the upper housing 2 via the support members 51 and 52. That is, the tops 31T and 32T, which are located at positions far from the position where the electrical connection terminals 33 are connected to the electronic control board 4 by welding, are supported on the inner surface 2R of the upper housing 2 via the support members 51 and 52. Therefore, even if there is vibration of, for example, the vehicle body, the heat degradation components 31 and 32 are supported between the upper housing 2 and the electronic control board 4 to suppress movement. Thereby, the vibration resistance of the heat degradation components 31 and 32 can be improved, and the change in the posture of the heat degradation components 31 and 32 or the disconnection of the welded portion of the electrical connection terminals 33 resulting in poor electrical contact can be suppressed.

[0065] In addition, as long as the heat degradation components 31 and 32 can be supported and the breakage of the electrical connection terminals 33 can be suppressed when the mounting object 200 such as the vehicle body or the engine vibrates, the support members 51 and 52 do not necessarily have to be in close contact with the heat degradation components 31 and 32. That is to say, the support members 51 and 52 do not have to be clamped between the heat degradation components 31 and 32 and the upper housing 2, as long as they can be arranged between the heat degradation components 31 and 32, support the heat degradation components 31 and 32 when the mounting object 200 vibrates, and suppress the breakage of the electrical connection terminals 33, etc.

[0066] In addition, the support members 51 and 52 may also be formed by coating or pasting at positions opposite to the side portions 31S and 32S of the heat deterioration components 31 and 32, that is, the support area side portions 2CS and 2DS. Alternatively, the support members 51 and 52 may be coated or pasted on the respective side portions 31S and 32S of the heat deterioration components 31 and 32, or may be coated or pasted on both the respective side portions 31S and 32S of the heat deterioration components 31 and 32 and the respective support area side portions 2CS and 2DS of the upper housing 2. In this case, the support members 51 and 52 do not necessarily have to be sandwiched between the heat deterioration components 31 and 32 and the upper housing 2, as long as they can be arranged between the heat deterioration components 31 and 32 and support the heat deterioration components 31 and 32 and suppress breakage of the electrical connection terminals 33 when the mounting object 200 vibrates.

[0067] Thus, the movement of the support members 51 and 52 in the X direction and the Y direction is restricted by the support area side portions 2CS and 2DS of the upper housing 2 via the support members 51 and 52, so that the vibration of the heat deterioration components 31 and 32 in the X direction and the Y direction can also be reliably suppressed. Moreover, by the support area side portions 2CS and 2DS and the support area top portions 2CT and 2DT of the upper housing 2, the space for arranging the support members 51 and 52 can be suppressed to be small, so that the usage amount of the support members 51 and 52 can be reduced.

[0068] However, in electronic components (heat deterioration components) that generate heat deterioration such as electrolytic capacitors in components that need to cope with vibration, the following problems occur. That is, as described above, the heat generated by the heat generating components 21, 22, and 23 during operation is transferred to the upper housing 2 through the heat dissipation members 41, 42, and 43 and diffused. Therefore, the heat diffused to the upper housing 2 may be transferred to the heat deterioration components 31 and 32 via the upper housing 2 and the support members 51 and 52. When the heat generated by the heat generating components 21, 22, and 23 is transferred to the heat deterioration components 31 and 32, the heat deterioration components 31 and 32 may cause heat deterioration.

[0069] Therefore, in the electronic control device 1 of the present embodiment, in order to suppress the heat deterioration of the heat deterioration components 31 and 32, the following conditional expression (1) related to the thermal conductivity is satisfied. That is, the thermal conductivity of the heat dissipation members 41, 42, and 43 is higher than the thermal conductivity of the support members 51 and 52. That is to say, the heat dissipation members 41, 42, and 43 transfer heat more easily than the support members 51 and 52. Conversely, the support members 51 and 52 transfer heat more difficultly than the heat dissipation members 41, 42, and 43.

[0070] Thermal conductivity of heat dissipation members 41, 42, and 43 > Thermal conductivity of support members 51 and 52 ··· Expression (1)

[0071] According to conditional expression (1) related to thermal conductivity, the heat generated by the heat-generating components 21, 22, and 23 during operation is transferred to the upper housing 2 through the heat-dissipating components 41, 42, and 43 and diffused. In another invention, it is possible to suppress the heat diffused to the upper housing 2 from being transferred to the heat-deteriorating components 31, 32 via the support components 51, 52. Therefore, it is possible to suppress the heat deterioration of the heat-deteriorating components 31, 32.

[0072] Examples of the material of the support components 51, 52 include silicone. The thermal conductivity of the support components 51, 52 is, for example, about 0.2 W / m·K or more and about 0.6 W / m·K or less. In addition, the thermal conductivity of the support components 51, 52 is not limited to 0.2 W / m·K or more and 0.6 W / m·K or less.

[0073] In addition, as Figure 4 As illustrated, the heat-generating component 24 may also be mounted on the second surface 4B side of the electronic control substrate 4. The heat-generating component 24 of the present embodiment is an example of the "second heat-generating component" of the present invention. For example, when the heat-generating component 24 is mounted on the second surface 4B side of the electronic control substrate 4, the heat-dissipating component 60 is provided by coating or pasting on the heat-generating component 24. The heat-dissipating component 60 of the present embodiment is an example of the "second heat-dissipating component" of the present invention. Since the heat-dissipating component 60 is attached to the heat-generating component 24, the heat generated by the heat-generating component 24 is transferred to the electronic control substrate 4 and the upper housing 2 via the heat-dissipating component 60 and diffused, or diffused by radiation via the heat-dissipating component 60. Thus, even if the heat-generating components 21, 22, 23, 24 are mounted on both the first surface 4A and the second surface 4B of the electronic control substrate 4, the heat generated by the heat-generating components 21, 22, 23, 24 can be effectively released.

[0074] For example, the material of the heat-dissipating component 60 is the same as that of the heat-dissipating components 41, 42, 43. In this case, it is possible to reduce the types of heat-dissipating components and achieve the unification of the types of heat-dissipating components, thereby simplifying the production process of the electronic control device 1.

[0075] <Sealant 5>

[0076] Figure 3 The sealant 5 shown can be elastically deformed and is disposed between the upper housing 2 and the lower housing 3. As Figure 4As shown, in order to protect the electronic control substrate 4, the sealant 5 bonds the upper housing 2 and the lower housing 3 to each other to provide dustproof, waterproof, and vibration-proof properties, etc., and hermetically seals or encloses the electronic control substrate 4. The sealant 5 is made of, for example, silicone. The sealant 5 can be formed by coating silicone or the like on at least one of the upper housing 2 and the lower housing 3, or can also be a member pre-formed in a substantially quadrilateral frame shape. "Sealant" is also called "sealing material". For example, when the electronic control device 1 is installed in the engine room of a vehicle, the sealant 5 protects the electronic control substrate 4 and various electronic components of the electronic control device 1 from the effects of moisture, dust, exhaust gas, combustion gas (SO2), etc. in the engine room. Thereby, failures of the electronic control device 1 can be avoided.

[0077] As Figure 2 and Figure 4 shown, the upper housing 2 has a groove portion 28. The groove portion 28 of the upper housing 2 holds the sealant 5. For example, when the sealant 5 is formed by coating silicone or the like, the groove portion 28 of the upper housing 2 functions as a storage portion for the sealant 5, and can suppress the sealant 5 from flying out or overflowing between the upper housing 2 and the lower housing 3. In addition, for example, when the sealant 5 is a member pre-formed in a substantially quadrilateral frame shape, the groove portion 28 of the upper housing 2 functions as a fitting portion for the sealant 5, and can hold the sealant 5.

[0078] For example, the material of the sealant 5 is the same as that of the support members 51, 52. In this case, the number of component types can be reduced to achieve unification of component types, and thus the production process of the electronic control device 1 can be simplified.

[0079] As described above, in the electronic control device 1 according to the present embodiment, the heat deterioration components 31, 32 that need to cope with vibration and generate heat deterioration are supported by the support members 51, 52 provided between the heat deterioration components 31, 32 and the upper housing 2. The heat generated by the heat generating components 21, 22, 23 is transferred to the metal upper housing 2 and diffused through the heat dissipation members 41, 42, 43 provided in at least one of the heat generating components 21, 22, 23 and the upper housing 2. Among them, the thermal conductivity of the heat dissipation members 41, 42, 43 is higher than that of the support members 51, 52. Therefore, even if the heat generated by the heat generating components 21, 22, 23 is transferred to the metal upper housing 2 and diffused through the heat dissipation members 41, 42, 43, the support members 51, 52 can suppress the heat transferred to the upper housing 2 from being transferred to the heat deterioration components 31, 32 and support the heat deterioration components 31, 32. Thereby, the electronic control device 1 can improve the vibration resistance of the heat deterioration components 31, 32 that need to cope with vibration and generate heat deterioration, and can suppress the heat deterioration of the heat deterioration components 31, 32.

[0080] In addition, the upper housing 2 of the present embodiment can dissipate and release the heat generated by the heat-generating components 21, 22, and 23, and can support the heat degradation components 31, 32 that need to cope with vibration via the support members 51, 52. Therefore, the lower housing 3 can function as a cover for covering the electronic control board 4. As a result, the structure of the lower housing 3 can be relatively simplified, and the external shape of the electronic control device 1 can be simplified.

[0081] The heat dissipation members 41, 42, and 43 are sandwiched between the heat-generating components 21, 22, and 23 and the upper housing 2. Therefore, the heat generated by the heat-generating components 21, 22, and 23 during operation can be reliably transferred and dissipated through the upper housing 2, so that the heat dissipation of the heat-generating components 21, 22, and 23 can be performed more reliably. Since the support members 51, 52 are sandwiched between the heat degradation components 31, 32 and the upper housing 2, the heat degradation components 31, 32 that need to cope with vibration and generate heat degradation can be reliably supported by the upper housing 2, and the heat diffused to the upper housing 2 can be further inhibited from being transferred to the heat degradation components 31, 32, and the heat degradation of the heat degradation components 31, 32 can be further inhibited.

[0082] In addition, as described above, the electronic control device 1 of the present embodiment is mounted on a mounting object 200 such as a vehicle body or an engine of a vehicle. According to the electronic control device 1 of the present embodiment, when the electronic control device 1 is mounted on at least one of an engine of a vehicle and a vehicle body on which the engine is mounted, the vibration resistance of the heat degradation components 31, 32 that need to cope with vibration and generate heat degradation can be improved, and the heat degradation of the heat degradation components 31, 32 can be inhibited. As a result, the durability and reliability of the in-vehicle electronic control device 1 can be improved. In addition, as described above, if the electronic control device 1 is fastened to the mounting object 200 by bolts 201, the surface 152 of the mounting portion 15 of the upper housing 2 contacts the surface 205 of the mounting object 200 with a large area. As a result, the heat transferred from the heat-generating components 21, 22, and 23 to the upper housing 2 via the heat dissipation members 41, 42, and 43 can be effectively transferred from the mounting portion 15 of the upper housing 2 to the mounting object 200. In addition. Since the electronic control device 1 is stably mounted on the mounting object 200 with a large area on the surface 152 of the mounting portion 15 of the upper housing 2, the vibration of the electronic control device 1 can be inhibited.

[0083] The embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the claims. A part of the structure of the above-described embodiments can be omitted, or can be arbitrarily combined in a manner different from the above.

[0084] For example, the electronic control device 1 can also be used for applications other than vehicle-mounted use. The shapes of the illustrated upper housing 2 and lower housing 3, the shape of the electronic control substrate 4, the types and quantities of the mounted electronic components, etc. are just examples and can be arbitrarily changed.

[0085] Description of reference numerals:

[0086] 1: Electronic control device, 2: Upper housing, 2A, 2B: Heat dissipation area parts, 2C, 2D: Support area parts, 2CS, 2DS: Support area side parts, 2CT, 2DT: Support area top parts, 2R: Inner surface, 3: Lower housing, 4: Electronic control substrate, 4A: First surface, 4B: Second surface, 4C, 4D: Connectors, 5: Sealant, 10: Frame, 15: Mounting part, 21, 22, 23, 24: Heat generating components, 28: Groove part, 31: Heat deterioration component, 31S: Side part, 31T: Top part, 32: Heat deterioration component, 32S: Side part, 32T: Top part, 33: Electrical connection terminal, 41, 42, 43: Heat dissipation members, 48: Bolt through hole, 51, 52: Support members, 60: Heat dissipation member, 151: Bolt through hole, 152: Surface, 200: Mounting object, 201, 202: Bolts, 205: Surface, 221: Bolt, 222: Bolt through hole, 223, 224: Internal thread parts, H1, H2: Height dimensions.

Claims

1. An electronic control device, wherein, The electronic control device has: a circuit board on which a heat generating component that generates heat during operation and a plurality of heat degradation components that need to cope with vibration, generate heat degradation, and have different heights are mounted on a first surface; a first metal housing that covers the first surface; a second housing that covers a second surface of the circuit board opposite to the first surface; a support member that is provided between the heat degradation component and the first housing and supports the heat degradation component; and a heat dissipation member that is provided on at least one of the heat generating component and the first housing and transfers the heat generated by the heat generating component to the first housing, the first housing has a plurality of support region portions formed in a manner to integrally accommodate the plurality of heat degradation components, the support region portion has a support region top portion opposite to the top of the heat degradation component, the support region top portion is formed in a convex shape in the height direction corresponding to the height of each of the plurality of heat degradation components, the support member is only disposed between the top of each of the plurality of heat degradation components and the support region top portion, and is disposed separated by a space from the heat dissipation member, the heat dissipation member has a higher thermal conductivity than the support member.

2. The electronic control device according to claim 1, wherein the heat dissipation member is sandwiched between the heat generating component and the first housing.

3. The electronic control device according to claim 1, wherein the electronic control device further has a sealant that is disposed between the first housing and the second housing and adhesively bonds the first housing and the second housing to hermetically seal the circuit board between the first housing and the second housing, the material of the sealant is the same as the material of the support member.

4. The electronic control device according to claim 1, wherein the heat generating component is a first heat generating component, the heat dissipation member is a first heat dissipation member, the electronic control device further has: a second heat generating component that is mounted on the second surface and generates heat during operation; and a second heat dissipation member that is attached to the second heat generating component and releases the heat generated by the second heat generating component.

5. The electronic control device according to claim 1, wherein the circuit board is for controlling the operation of an engine of a vehicle, the first housing is mounted on at least one of the engine and the vehicle body on which the engine is mounted.

6. The electronic control device according to claim 5, wherein the first housing is mounted on at least one of the engine and the vehicle body by a fastening member and is in surface contact with the surface of at least one of the engine and the vehicle body.

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