A wafer supercritical drying device and a drying method

Abstract

The present invention provides a wafer supercritical drying device and a drying method. The device includes: a drying barrel; a wafer carrying mechanism for carrying wafers; a first protective cover having a plurality of pores, and the wafer carrying mechanism is within the first protective cover; wherein, an air inlet is provided on the drying barrel. During the drying process of the drying device of the present invention, since the supercritical fluid does not directly impact the wafer, but first passes through the first protective cover, and by utilizing the pores of the first protective cover, the supercritical fluid uniformly penetrates through the porous first protective cover and then dries the wafer. In this way, it can avoid the direct impact of the rapidly entering supercritical fluid on the wafer and causing damage to the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit processing, and particularly to a wafer supercritical drying device and a drying method. Background Art

[0002] Currently, in the process of integrated circuit manufacturing, after wafer etching, wet cleaning is required, using various acids and bases for treatment, and the residues after treatment need to be cleaned wet. In some processes, for the prepared high aspect ratio structures, the surface tension generated during the evaporation and drying of organic solvents is likely to push down the columnar structures, causing damage to the wafer devices.

[0003] Supercritical refers to the state where the pressure and temperature of a substance simultaneously exceed its critical pressure and critical temperature. In the supercritical state, there is no distinction between the liquid phase and the gas phase, and the supercritical fluid has no surface tension and has extremely high solubility for organic solvents such as IPA. The critical temperature of supercritical carbon dioxide is 31 °C, and the critical pressure is 73 atm. Therefore, using supercritical carbon dioxide for drying, there is no surface tension during the drying process, which can improve the chip yield.

[0004] However, the applicant has found that when currently using supercritical fluid to dry wafers, the high-pressure gas introduced forms uneven airflows such as vortices in the cavity, resulting in a pressure difference at different positions of the wafer, thus causing wafer breakage. Based on this, it is necessary to make improvements. Summary of the Invention

[0005] In view of this, the present invention provides a wafer supercritical drying device and a drying method to solve or at least partially solve the technical problems existing in the prior art.

[0006] In a first aspect, the present invention provides a wafer supercritical drying device, including:

[0007] A drying barrel;

[0008] A wafer carrying mechanism, which is located inside the drying barrel and is used to carry wafers;

[0009] A first protective cover, which is provided with a plurality of pores, and the wafer carrying mechanism is inside the first protective cover;

[0010] Wherein, an air inlet is provided on the drying barrel, and the supercritical fluid introduced from the air inlet enters the inside of the first protective cover through the pores on the first protective cover.

[0011] Preferably, for the wafer supercritical drying device, the wafer carrying mechanism includes:

[0012] A base;

[0013] A plurality of support rods, and a plurality of the support rods are detachably fixed to the base along the circumferential direction, and a plurality of grooves adapted to the wafers are provided on the support rods from top to bottom.

[0014] Preferably, in the wafer supercritical drying equipment, the drying barrel includes a barrel body and a barrel cover covering the barrel body, and the air inlet is opened on the barrel cover;

[0015] It further includes a baffle located in the barrel body, the upper end of the baffle is connected to the barrel cover, and the lower end is connected to the upper ends of a plurality of the support rods, and the first protective cover is wrapped around the outer periphery of a plurality of the support rods.

[0016] Preferably, in the wafer supercritical drying equipment, the drying barrel includes a barrel body and a barrel cover covering the barrel body, and the air inlet is opened on the barrel cover;

[0017] It further includes a baffle located in the barrel body, the upper end of the baffle is connected to the barrel cover, and the lower end is connected to the upper ends of a plurality of the support rods;

[0018] A protective cover support is provided in the barrel body, the first protective cover is wrapped around the outer periphery of the protective cover support, the base is located inside the protective cover support, and the outer periphery of the baffle is fitted with the protective cover support.

[0019] Preferably, in the wafer supercritical drying equipment, it further includes an installation groove located in the drying barrel, protrusions are provided on both sides of the base, and clamping grooves corresponding to the protrusions are provided on the inner wall of the installation groove, and the protrusions can be clamped in the clamping grooves to fix the base in the installation groove.

[0020] Preferably, in the wafer supercritical drying equipment, the clamping groove includes a horizontally arranged first part, a second part extending upward along one end of the first part, and a third part extending downward along the other end of the first part, and the protrusion is clamped in the third part through the second part and the first part.

[0021] Preferably, in the wafer supercritical drying equipment, a plurality of blocking strips are arranged along the circumferential direction on the upper end surface of the installation groove, and a second protective cover with a plurality of pores is wrapped around the outer periphery of the plurality of blocking strips.

[0022] Preferably, the wafer supercritical drying equipment further includes:

[0023] A temperature sensor, which is arranged on the drying barrel to monitor the temperature inside the drying barrel;

[0024] A pressure gauge, which is arranged on the drying barrel to monitor the pressure inside the drying barrel;

[0025] A heater, which is used to heat the drying barrel to make the temperature inside the drying barrel reach a predetermined temperature.

[0026] Preferably, in the wafer supercritical drying equipment, an air outlet is provided on one side of the air inlet on the barrel cover, and the distance between the base and the inner wall of the barrel is not greater than 10 cm.

[0027] In a second aspect, the present invention also provides a wafer supercritical drying method, including the following steps:

[0028] Provide the wafer supercritical drying equipment as described above;

[0029] Fix the wafer on the wafer carrying mechanism;

[0030] Introduce supercritical fluid into the drying barrel through the air inlet, so that the supercritical fluid dries the wafer;

[0031] Wherein, the flow rate of the introduced supercritical fluid is 1 - 8000 L / h, and the temperature in the drying barrel is controlled to be higher than the critical temperature of the supercritical fluid, and the pressure is higher than the critical pressure of the supercritical fluid.

[0032] The wafer supercritical drying equipment of the present invention has the following beneficial effects compared with the prior art:

[0033] 1. In the wafer supercritical drying equipment of the present invention, by covering the first protective cover outside the wafer carrying mechanism, when in use, supercritical fluid is introduced into the drying barrel through the air inlet. The supercritical fluid first enters the gap between the first protective cover and the inner wall of the drying barrel, and then passes through the pores on the first protective cover to enter the inside of the first protective cover, and dries the wafer on the wafer carrying mechanism inside the first protective cover. Drying with supercritical fluid has no surface tension during the drying process, improving the chip yield. Since in the drying process of the drying equipment of the present invention, the supercritical fluid does not directly impact the wafer, but first passes through the first protective cover, and uses the pores of the first protective cover, so that the supercritical fluid uniformly passes through the porous first protective cover and then dries the wafer, which can avoid the direct impact of the rapidly entering supercritical fluid on the wafer and causing damage to the wafer;

[0034] 2. In the wafer supercritical drying equipment of the present invention, the wafer carrying mechanism includes a base and a plurality of support rods. A plurality of grooves are provided on the support rods from top to bottom, and the ends of the wafers can be clamped in the grooves. When in use, a plurality of wafers can be fixed on the support rods at the same time, so that a plurality of wafers can be dried simultaneously, and the drying efficiency is high;

[0035] 3. In the wafer supercritical drying equipment of the present invention, a baffle is further provided at the upper end of the first protective cover. By providing the baffle, the supercritical fluid introduced through the air inlet first enters the baffle, is diverted by the baffle, and then passes through the first protective cover to dry the wafer. This can further prevent the supercritical fluid from directly impacting the wafer and causing wafer fragmentation damage.

[0036] 4. The wafer supercritical drying equipment of the present invention has a slot comprising a first portion, a second portion, and a third portion. When in use, the protrusion first enters the second portion, then the base is rotated to cause the protrusion to rotate along the first portion, and finally enters the third portion. This slot structure allows the protrusion to be more stably installed in the slot, thereby allowing the base to be firmly fixed in the drying barrel.

[0037] 5. In the wafer supercritical drying equipment of the present invention, a plurality of bars are provided at intervals on the upper end surface of the mounting groove, and a second protective cover is wrapped around the periphery of the plurality of bars. By providing the second protective cover, the first protective cover, the second protective cover and the drying barrel form a multi-cavity body. In this way, the supercritical fluid introduced from the air inlet enters the drying barrel and first passes through the second protective cover, and then passes through the first protective cover to dry the wafer. By providing two layers of protective covers, the supercritical fluid can be further prevented from directly impacting the wafer, thereby preventing damage to the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0039] Figure 1 Schematic diagram of the structure of a wafer supercritical drying device in one embodiment of the present invention;

[0040] Figure 2 A schematic structural diagram of a wafer supercritical drying device in one embodiment of the present invention;

[0041] Figure 3 A schematic structural diagram of a wafer carrying mechanism in one embodiment of the present invention;

[0042] Figure 4 This is a front view of a wafer carrying mechanism in one embodiment of the present invention;

[0043] Figure 5 A schematic structural diagram of a wafer supercritical drying device in one embodiment of the present invention;

[0044] Figure 6Schematic structural diagram of a wafer supercritical drying device in one embodiment of the present invention;

[0045] Figure 7 Schematic structural diagram of a mounting groove in one embodiment of the present invention;

[0046] Figure 8 Schematic structural diagram of a wafer carrying mechanism mounted in a mounting groove in one embodiment of the present invention;

[0047] Figure 9 Schematic structural diagram of a barrel cover connected to a critical fluid generating device and an exhaust system in one embodiment of the present invention. Detailed implementation manners

[0048] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some but not all of the embodiments of the present invention. Usually, the components of the embodiments of the present invention described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0049] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0050] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0051] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "upper" etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship when the product of the present invention is normally placed, or the orientation or positional relationship commonly understood by those skilled in the art. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0052] In addition, terms such as "first", "second", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.

[0053] Next, in combination with the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0054] An embodiment of the present application provides a wafer supercritical drying device, as Figures 1 - 9 shown, including:

[0055] A drying barrel 1;

[0056] A wafer carrying mechanism, which is located inside the drying barrel 1 and is used to carry the wafer 10;

[0057] A first protective cover 2, on which a plurality of pores are provided, and the wafer carrying mechanism is arranged inside the first protective cover 2;

[0058] Among them, an air inlet 11 is provided on the drying barrel 1, and the supercritical fluid introduced through the air inlet 11 enters the inside of the first protective cover 2 through the pores on the first protective cover 2.

[0059] It should be noted that the wafer supercritical drying equipment provided by the embodiments of the present application includes a drying barrel 1, a wafer carrying mechanism, and a first protective cover 1; the drying barrel 1 has a hollow structure inside, and its specific shape is not specifically limited. The drying barrel 1 can be horizontal or vertical. It can be understood that any structure that can provide a drying place for the wafer is feasible. The wafer carrying mechanism is used to carry the wafer, that is, the wafer can be fixed on the wafer carrying mechanism to facilitate drying of the wafer. Specifically, the structure of the wafer carrying mechanism is not limited, and any mechanism that can carry the wafer is acceptable. The first protective cover 2 is located inside the drying barrel 1 and covers the outside of the wafer carrying mechanism. An air inlet 11 is provided on the drying barrel 1, and the supercritical fluid introduced through the air inlet 11 enters the first protective cover 2 through the pores on the first protective cover 2. For example, the upper end of the first protective cover 2 is closed, so the setting position of the air inlet 11 is arbitrary; if the upper end of the first protective cover 2 is open, the projection of the air inlet 11 on the horizontal plane does not fall within the projection range of the first protective cover 2 on the horizontal plane. During use, supercritical fluid is introduced into the drying barrel 1 through the air inlet 11. The supercritical fluid first enters the gap between the first protective cover 2 and the inner wall of the drying barrel 1, and then passes through the pores on the first protective cover 2 to enter the inside of the first protective cover 2, and dries the wafer 10 on the wafer carrying mechanism inside the first protective cover 2. Using supercritical fluid for drying, there is no surface tension during the drying process, which improves the chip yield. Since in the drying process of the drying equipment of the present invention, the supercritical fluid does not directly impact the wafer, but first passes through the first protective cover 1, and uses the pores of the first protective cover 1 to make the supercritical fluid uniformly pass through the porous first protective cover 1 and then dry the wafer, this can avoid the damage to the wafer caused by the supercritical fluid that enters quickly and directly impacts the wafer.

[0060] In the above embodiment, the first protective cover 2 directly wraps around the outer periphery of the wafer carrying mechanism, or the first protective cover 2 covers the wafer carrying mechanism and there is a certain gap between the first protective cover 2 and the wafer carrying mechanism.

[0061] In some embodiments, the first protective cover 2 can be made of breathable porous materials such as yarn, cloth, non-woven fabric, nylon, metal mesh, etc.

[0062] In some embodiments, the air inlet 11 can be provided at the upper end of the drying barrel 1, or on the side wall and the lower end of the drying barrel, as long as the supercritical fluid entering from the air inlet 11 does not directly impact the wafer.

[0063] In some embodiments, the wafer carrying mechanism includes:

[0064] a base 3;

[0065] A plurality of support rods 4 are detachably fixed to the base 3 in the circumferential direction. A plurality of grooves 41 adapted to the wafers are provided on the support rods 4 from top to bottom.

[0066] In the above embodiment, the wafer carrying mechanism includes a base 3 and a plurality of support rods 4. A plurality of grooves 41 are formed on the support rods 4 from top to bottom. The end of the wafer can be clamped in the grooves 41. When in use, first clamp one end of the wafer 10 in the groove 41 on one of the support rods 4, then clamp the grooves 41 on the other support rods 4 on the end of the wafer 10, and then fix the support rods 4, and the wafer 10 can be stably fixed on the support rods 4. The number of support rods 4 can be determined according to the actual use situation. For example, it can be four, and the four support rods 4 are evenly distributed in the circumferential direction on the outer periphery of the base 3. The support rods 4 and the base 3 can be fixed by bolts, which is convenient for the installation and disassembly between the support rods 4 and the base 3. Obviously, multiple wafers 10 can be fixed on the support rods 4 at the same time, so that multiple wafers 10 can be dried at the same time.

[0067] In some embodiments, a baffle 5 is further included. The baffle 5 is arranged at the upper end of the first protective cover 2, and the air inlet 11 is arranged at the upper end of the drying barrel 1.

[0068] In the above embodiment, a baffle 5 is further provided at the upper end of the first protective cover 2, and the air inlet 11 is arranged at the upper end of the drying barrel 1. By providing the baffle 5, the supercritical fluid introduced through the air inlet 11 first enters the baffle 5, and the supercritical fluid is shunted through the baffle 5, and then the wafer 10 is dried through the first protective cover 2, which can further prevent the supercritical fluid from directly impacting the wafer 10 and causing damage to the wafer 10.

[0069] In some embodiments, the first protective cover 2 wraps around the outer periphery of the plurality of support rods 4, the baffle 5 is located above the plurality of support rods 4, and the plurality of support rods 4 and the baffle 5 are detachably fixed.

[0070] In the above embodiment, the baffle 5 is located above the support rod 4, and both the upper and lower ends of the support rod 4 are detachably fixed to the baffle 5 and the base 3 respectively, while the first protective cover 2 wraps around the outer periphery of the support rod 4. Specifically, the first protective cover 2 can be wrapped around the outer periphery of the support rod 4 through a buckle.

[0071] In some embodiments, the drying barrel 1 includes a barrel body 12 and a barrel cover 13. The barrel cover 13 is disposed on the barrel body 12. Specifically, the barrel cover 13 is fixed to the barrel body 12 by means such as screw connection or rubber ring sealing. The air inlet 11 is opened on the barrel cover 13, and the air inlet 11 communicates with the supercritical fluid generating device 8. The supercritical fluid generating device 8 supplies supercritical fluid to the drying barrel 1. Specifically, a first valve 81 is further provided between the supercritical fluid generating device 8 and the air inlet 11. Specifically, an exhaust port 14 is further provided on the barrel cover 13. The exhaust port 14 communicates with the exhaust system 9 through a second valve 91, and the supercritical fluid after drying in the drying barrel 1 can be discharged through the exhaust system 9. Please refer to again Figure 9 as shown Figure 7 The arrows in the figure show the schematic diagrams of introducing and discharging the supercritical fluid.

[0072] In some embodiments, as Figure 5 shown, the baffle 5 is located inside the barrel body 12. The upper end of the baffle 5 is connected to the barrel cover 13, and the lower end is connected to the upper end of the support rod 4. Specifically, the upper and lower ends of the baffle 5 can be fixedly connected or detachably fixed to the barrel cover 13 and the support rod 4, and the first protective cover 2 is wrapped around the outer periphery of a plurality of support rods 4. In this way, when the barrel cover 13 is removed, the wafer carrying mechanism and the first protective cover 2 can be removed integrally, which is convenient for installation and disassembly.

[0073] In some embodiments, as Figure 6 shown, a protective cover support 15 is provided inside the barrel body 12. The first protective cover 2 is wrapped around the outer periphery of the protective cover support 15. The base 3 is located inside the protective cover support 15, and the outer periphery of the baffle 5 is in contact with the protective cover support 15. Obviously, when the upper end of the support rod 4 is provided with the baffle 5, the air inlet 11 can be set at any position.

[0074] In the above embodiments, the first protective cover 2 is wrapped around the outer periphery of the protective cover support 15. It can be understood that at this time, the upper end of the first protective cover 2 can be open. When the first protective cover 2 is wrapped around the outer periphery of the protective cover support 15 and the base 3 is located inside the protective cover support 15, the outer periphery of the baffle 5 is in contact with the inner wall of the protective cover support 15. In this way, when the barrel cover 13 is removed, the wafer carrying mechanism can be removed integrally, which is convenient for installation and disassembly.

[0075] In some embodiments, the distance between the base 3 and the inner wall of the barrel body 12 is not greater than 10 cm. The specific distance can be 1 cm, 2 cm, 3 cm, 4 cm, 5 cm, 6 cm, 7 cm, 8 cm, 9 cm, etc.

[0076] In some embodiments, it further includes an installation groove 6 located inside the drying barrel 1. Protrusions 31 are provided on both sides of the base 3, and clamping grooves 7 are provided on the inner wall of the installation groove 6 corresponding to the protrusions 31. The protrusions 31 can be clamped in the clamping grooves 7 to fix the base 3 in the installation groove 6.

[0077] In the above embodiment, an installation groove 6 is provided at the bottom of the drying barrel 1, and a clamping groove 7 is provided on the side wall of the installation groove 6. Correspondingly, a protrusion 31 is provided on the base 3. By clamping the protrusion 31 in the clamping groove 7, the base 3 can be stably installed in the drying barrel 1.

[0078] In some embodiments, the clamping groove 7 includes a first portion 71 arranged horizontally, a second portion 72 extending upward along one end of the first portion 71, and a third portion 73 extending downward along the other end of the first portion 71. The protrusion 31 is clamped in the third portion 73 through the second portion 72 and the first portion 71.

[0079] In the above embodiment, the clamping groove 7 includes a first portion 71, a second portion 72, and a third portion 73. During use, the protrusion 31 first enters the second portion 72, then the base is rotated so that the protrusion 31 rotates along the first portion 71, and finally enters the third portion 73. The clamping groove 7 with this structure can make the protrusion 31 more stably installed in the clamping groove 7, and further make the base 3 firmly fixed in the drying barrel.

[0080] In some embodiments, a plurality of blocking strips 61 are arranged along the circumferential direction on the upper end surface of the installation groove 6, and a second protective cover (not shown in the figure) with a plurality of pores is wrapped around the outer periphery of the plurality of blocking strips 61.

[0081] In some embodiments, a retaining ring is further provided at the upper end of the blocking strip 61, and the retaining ring is sleeved on the lower end of the baffle 5.

[0082] In the above embodiment, a plurality of blocking strips 61 are arranged at intervals on the upper end surface of the installation groove 6, and the second protective cover is wrapped around the outer periphery of the plurality of blocking strips 61. By providing the second protective cover, the supercritical fluid introduced from the air inlet 11 first passes through the second protective cover after entering the drying barrel 1, and then passes through the first protective cover 2 to dry the wafer. In this way, by providing two layers of protective covers to form a multi-cavity structure, it is possible to further prevent the supercritical fluid from directly impacting the wafer and avoid wafer damage.

[0083] It can be understood that the first protective cover and the second protective cover can be made of the same material.

[0084] In some embodiments, it further includes:

[0085] A temperature sensor (not shown in the figure), which is provided on the drying barrel 1 for monitoring the temperature inside the drying barrel 1;

[0086] A pressure gauge (not shown in the figure), which is provided on the drying barrel 1 for monitoring the pressure inside the drying barrel.

[0087] In the above embodiments, a temperature sensor and a pressure gauge are provided to monitor the temperature and pressure in the drying barrel 1 respectively, so as to ensure that during the drying process, the pressure and temperature in the drying barrel 1 are greater than the critical pressure and critical temperature of the supercritical fluid. Specifically, the temperature sensor can be a thermocouple temperature sensor.

[0088] In some embodiments, a heater (not shown in the figure) is further included, which is used to heat the drying barrel 1 to make the temperature inside the drying barrel 1 reach a predetermined temperature.

[0089] In the above embodiments, the heater can be a heating jacket, and the heating jacket can be sleeved on the outer periphery of the drying barrel 1, and the drying barrel 1 can be heated through the heating jacket so that the temperature inside the drying barrel 1 reaches a predetermined temperature.

[0090] Based on the same inventive concept, the embodiments of the present application also provide a wafer supercritical drying method, including the following steps:

[0091] S1. Provide the above-mentioned wafer supercritical drying equipment;

[0092] S2. Fix the wafer on the wafer carrying mechanism;

[0093] S3. Pass a supercritical fluid into the drying barrel through the air inlet, so that the supercritical fluid dries the wafer;

[0094] Among them, the flow rate of the passed supercritical fluid is 1 to 8000 L / h, and the temperature in the drying barrel is controlled to be greater than the critical temperature of the supercritical fluid, and the pressure is greater than the critical pressure of the supercritical fluid.

[0095] In the wafer supercritical drying method provided by the embodiments of the present application, the passed supercritical fluid can be supercritical carbon dioxide, or supercritical carbon dioxide can be used and other organic solvents such as ethanol and acetone can be doped at the same time. The critical temperature of supercritical carbon dioxide is 31.26 °C, and the critical pressure is 73 atm.

[0096] In some embodiments, the temperature in the drying barrel is controlled to be 20 to 200 °C, and the pressure is 3 to 100 Mpa.

[0097] If supercritical carbon dioxide is used, the temperature in the drying barrel is controlled to be greater than 31.26 °C and the pressure is greater than 73

[0098] atm.

[0099] In some embodiments, the wafer supercritical drying method specifically includes the following steps:

[0100] S1. Fix the wafer on the support rod, then wrap the first protective cover around the outer periphery of the support rod, and then fix the wafer carrying mechanism in the installation groove of the drying barrel;

[0101] S2. Start the heater to heat and dry the drying barrel, so that the temperature inside the drying barrel is greater than the critical temperature of the supercritical fluid and the pressure is greater than the critical pressure of the supercritical fluid, and then start the supercritical fluid generating device to introduce the supercritical fluid into the drying barrel;

[0102] S3. After drying is completed, open the exhaust system to discharge the supercritical fluid inside the drying barrel.

[0103] The above is only the preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer supercritical drying device, characterized in that, Comprising: A drying barrel; A wafer carrier mechanism located inside the drying barrel, which is used to carry wafers; The wafer carrier mechanism includes: a base; a plurality of support rods detachably fixed to the base along the circumference, and a plurality of grooves adapted to the wafers are provided on the support rods from top to bottom; A first protective cover with a plurality of pores thereon, and the wafer carrier mechanism is inside the first protective cover; An installation groove located inside the drying barrel, with protrusions provided on both sides of the base, and clamping grooves corresponding to the protrusions are provided on the inner wall of the installation groove, and the protrusions are clamped in the clamping grooves to fix the base in the installation groove; A plurality of retaining bars are arranged along the circumference on the upper end surface of the installation groove, and a second protective cover with a plurality of pores is wrapped around the outer circumference of the plurality of retaining bars; Wherein, an air inlet is provided on the drying barrel, and the supercritical fluid introduced from the air inlet enters the inside of the first protective cover through the pores on the second protective cover and the pores on the first protective cover.

2. The wafer supercritical drying equipment as described in claim 1, wherein The drying barrel includes a barrel body and a barrel cover covering the barrel body, and the air inlet is provided on the barrel cover; It further includes a baffle located inside the barrel body, the upper end of the baffle is connected to the barrel cover, and the lower end is connected to the upper ends of the plurality of support rods, and the first protective cover is wrapped around the outer circumference of the plurality of support rods.

3. The wafer supercritical drying equipment as described in claim 1, characterized in that, The drying barrel includes a barrel body and a barrel cover covering the barrel body, and the air inlet is provided on the barrel cover; It further includes a baffle located inside the barrel body, the upper end of the baffle is connected to the barrel cover, and the lower end is connected to the upper ends of the plurality of support rods; A protective cover support is provided inside the barrel body, the first protective cover is wrapped around the outer circumference of the protective cover support, the base is located inside the protective cover support, and the outer circumference of the baffle is in contact with the protective cover support.

4. The wafer supercritical drying equipment as described in claim 1, characterized in that, The clamping groove includes a horizontally arranged first part, a second part extending upward from one end of the first part, and a third part extending downward from the other end of the first part, and the protrusion is clamped in the third part through the second part and the first part.

5. The wafer supercritical drying equipment according to claim 1, characterized in that, It further includes: A temperature sensor provided on the drying barrel for monitoring the temperature inside the drying barrel; A pressure gauge provided on the drying barrel for monitoring the pressure inside the drying barrel; A heater for heating the drying barrel to make the temperature inside the drying barrel reach a predetermined temperature.

6. The wafer supercritical drying equipment according to any one of claims 2 to 3, characterized in that An air outlet is provided on the barrel cover on one side of the air inlet, and the distance between the base and the inner wall of the barrel body is not greater than 10 cm.

7. A wafer supercritical drying method, characterized in that Including the following steps: Providing a wafer supercritical drying device as described in any one of claims 1 to 6; Fixing the wafer on the wafer carrier mechanism; Introducing supercritical fluid into the drying barrel through the air inlet to dry the wafer with the supercritical fluid; Wherein, the flow rate of the introduced supercritical fluid is 1 to 8000 L / h, and the temperature inside the drying barrel is controlled to be greater than the critical temperature of the supercritical fluid, and the pressure is greater than the critical pressure of the supercritical fluid.

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