Radio frequency chip testing method, device, testing equipment, medium and testing system

By assigning a unique test frequency sequence to the RF chip, the problem of signal interference in multi-chip testing is solved, improving testing efficiency and making it suitable for batch testing of radar chips.

CN114879014BActive Publication Date: 2026-05-26CALTERAH SEMICON TECH (SHANGHAI) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CALTERAH SEMICON TECH (SHANGHAI) CO LTD
Filing Date
2022-05-17
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

In multi-chip testing of RF chips, the use of the Multi-Site method results in signal frequency interference between chips, leading to low testing efficiency. Existing serial testing methods increase time costs.

Method used

By determining the test frequency points and their order for each RF chip under test, different test frequency points are assigned to each chip within the same time period. Test frequency points are selected using sorting rules and frequency intervals to avoid signal interference, and tests are performed under preset instructions.

Benefits of technology

It effectively avoids mutual interference of signal frequencies during multi-chip testing, improves testing efficiency, and is particularly suitable for batch testing of radar chips.

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Abstract

This invention discloses a method, apparatus, testing equipment, medium, and testing system for testing radio frequency (RF) chips. The method includes: determining the test frequencies of at least two RF chips under test, and the order of the test frequencies for each RF chip under test, wherein the order of the test frequencies satisfies the following condition: each RF chip under test corresponds to a different test frequency within the same testing time period; and testing each RF chip under test according to the test frequency order. This method, by determining the order of the test frequencies for each RF chip under test and testing them according to this order, ensures that in multi-chip testing, each chip corresponds to a different test frequency within the same testing time period, effectively avoiding signal frequency interference between multiple chips during testing, thereby improving chip testing efficiency.
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Description

Technical Field

[0001] The present invention relates to the field of chip testing technology, and in particular to a radio frequency chip testing method, apparatus, testing equipment, medium and testing system. Background Technology

[0002] A radio frequency (RF) chip is an electronic component that converts radio signals into specific radio signal waveforms and transmits them via antenna resonance. To ensure chip quality, finished chips are typically tested.

[0003] Currently, in mass production testing of chips, multi-site testing is commonly used to test multiple chips simultaneously in order to improve production efficiency.

[0004] However, when radio frequency (RF) testing is involved in chip testing, the multi-site approach can lead to signal frequency interference between multiple chips within the same test period. For example, a signal emitted by the Device Under Test (DUT) in chip M (Site-M) might be received by the Golden Unit (GU) in chip N (Site-N), or a signal emitted by the GU in Site-M might be received by the DUT in Site-N. To avoid signal interference during RF testing, serial testing is currently the most common method. This involves testing one chip at a time within each test period. However, serial testing increases time costs and reduces chip testing efficiency. Therefore, how to avoid RF signal frequency interference between chips and improve testing efficiency when using a multi-site testing approach is a pressing technical problem that needs to be solved. Summary of the Invention

[0005] This invention provides a method, apparatus, equipment, medium, and system for testing radio frequency chips, in order to reduce mutual interference of radio frequency signals between multiple chips during simultaneous testing and improve chip testing efficiency.

[0006] In a first aspect, embodiments of the present invention provide a method for testing radio frequency chips, including:

[0007] The test frequency points of at least two radio frequency chips under test are determined, as well as the test frequency point order corresponding to each radio frequency chip under test, wherein the test frequency point order satisfies the following: each radio frequency chip under test corresponds to a different test frequency point in the same time period;

[0008] Each of the radio frequency chips under test is tested according to the test frequency order.

[0009] Optionally, the test frequency order corresponding to each of the tested RF chips can be determined in at least one of the following ways:

[0010] Select a set number of first test frequency points from the preset frequency list, and determine the test frequency point order of each first test frequency point according to the first sorting rule for each RF chip under test.

[0011] Select one second test frequency point from each of at least two preset frequency intervals, and determine the test frequency point order corresponding to each of the second test frequency points according to the second sorting rule;

[0012] The order of test frequency points corresponding to each RF chip under test is determined by the third sorting rule based on the preset characteristic frequency points in the frequency band to be tested.

[0013] Optionally, each of the radio frequency chips under test is tested according to the test frequency order, including:

[0014] Under the control of preset synchronization instructions and / or preset test instructions, the corresponding RF chips under test are tested according to their respective test frequency order.

[0015] Optionally, the radio frequency chip under test includes a radar chip with an antenna packaged in it, the antenna including a transmitting antenna and a receiving antenna.

[0016] Optionally, the number of RF chips under test in the same time period shall not exceed the number of each test frequency point in the test frequency point sequence.

[0017] Optionally, before testing each of the radio frequency chips under test according to the test frequency order, the method further includes:

[0018] For each RF chip under test, the device under test corresponding to the RF chip under test is coupled to the transmitting antenna and / or receiving antenna in the RF chip under test.

[0019] Optionally, it also includes: testing the RF chip under test using the device under test in the following manner:

[0020] The transmit link in the RF chip under test is tested using the device under test, and / or the receive link in the RF chip under test is tested.

[0021] Secondly, embodiments of the present invention also provide an RF chip testing apparatus, comprising:

[0022] A configuration module is used to determine the test frequency points of at least two RF chips under test, and the order of the test frequency points corresponding to each RF chip under test, wherein the test frequency points corresponding to each RF chip under test are different at the same time period.

[0023] The test module is used to test the corresponding RF chip under test according to the test frequency order.

[0024] Thirdly, embodiments of the present invention also provide a testing device, comprising:

[0025] One or more processors;

[0026] Storage device for storing one or more programs;

[0027] The one or more programs are executed by the one or more processors, causing the one or more processors to implement the radio frequency chip testing method provided in the embodiments of the present invention.

[0028] Fourthly, embodiments of the present invention also provide a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the radio frequency chip testing method provided in embodiments of the present invention.

[0029] Fifthly, embodiments of the present invention also provide an RF chip testing system, comprising: at least two RF chips under test and a testing device provided in the embodiments of the present invention, wherein the testing device is connected to each of the RF chips under test.

[0030] This invention provides a method, apparatus, testing equipment, medium, and testing system for testing radio frequency (RF) chips. First, the test frequencies of at least two RF chips under test are determined, along with the order of these test frequencies. The test frequency order satisfies the following condition: each RF chip under test corresponds to a different test frequency within the same testing time period. Then, each RF chip under test is tested according to this test frequency order. By determining the test frequency order for each RF chip under test and testing them according to this order, this embodiment ensures that in multi-chip testing, each chip corresponds to a different test frequency within the same testing time period, effectively avoiding signal frequency interference between multiple chips during testing, thereby improving chip testing efficiency. Using the above testing method, this application is applicable to the batch testing of the transmit and receive links of radar chips used to generate frequency-modulated continuous waves, thereby effectively improving testing efficiency. Attached Figure Description

[0031] Figure 1 This is a flowchart illustrating a radio frequency chip testing method provided in Embodiment 1 of the present invention;

[0032] Figure 2 This is a flowchart illustrating a radio frequency chip testing method provided in Embodiment 2 of the present invention;

[0033] Figure 3This is a schematic diagram illustrating the initialization of test frequency points and test frequency point order according to Embodiment 2 of the present invention.

[0034] Figure 4 This is a schematic diagram of the test frequency order after adjustment according to Embodiment 2 of the present invention;

[0035] Figure 5 This is a schematic diagram of the architecture of an RF chip testing device provided in Embodiment 3 of the present invention;

[0036] Figure 6 This is a schematic diagram of the structure of a testing device provided in Embodiment 4 of the present invention;

[0037] Figure 7 This is a schematic diagram of the structure of an RF chip testing system provided in Embodiment Six of the present invention. Detailed Implementation

[0038] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0039] Before discussing the exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowcharts describe the operations (or steps) as sequential processes, many of these operations can be performed in parallel, concurrently, or simultaneously. Furthermore, the order of the operations can be rearranged. The process can be terminated when its operation is completed, but may also have additional steps not included in the figures. The process can correspond to a method, function, procedure, subroutine, subroutine, etc. Moreover, embodiments and features in the embodiments of the present invention can be combined with each other without conflict.

[0040] The term "comprising" and its variations as used in this invention are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment".

[0041] It should be noted that the concepts of "first" and "second" mentioned in this invention are only used to distinguish the corresponding contents and are not used to limit the order or interdependence.

[0042] It should be noted that the terms "a" and "a plurality of" used in this invention are illustrative rather than restrictive. Those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0043] Example 1

[0044] Figure 1 This is a flowchart illustrating a radio frequency chip testing method provided in Embodiment 1 of the present invention. This method is applicable to chip testing and can be executed by a radio frequency chip testing device. The device can be implemented by software and / or hardware and is generally integrated into the testing equipment. In this embodiment, the testing equipment includes, but is not limited to, automatic test equipment (ATE).

[0045] like Figure 1 As shown in Embodiment 1 of the present invention, a radio frequency chip testing method is provided, which includes the following steps:

[0046] S110. Determine the test frequency points of at least two RF chips under test, and the test frequency point order corresponding to each RF chip under test, wherein the test frequency point order satisfies that: each RF chip under test corresponds to a different test frequency point in the same time period.

[0047] In this context, test frequencies can be considered as fixed frequencies within the test frequency band of the RF chip under test. In this step, to facilitate simultaneous testing of multiple chips, the number of test frequencies for each RF chip under test can remain consistent. It should be noted that to ensure the accuracy of the test results, the selection of test frequencies must include the upper frequency limit, lower frequency limit, and center frequency of the test frequency band. Other test frequencies can be selected within the test frequency band according to fixed frequency intervals or randomly selected; there are no restrictions on this. Other test frequencies can be selected based on actual testing needs, and the number of other frequencies can be flexibly determined according to actual requirements and the size of the test frequency band.

[0048] Furthermore, it should be noted that if the test frequencies of multiple tested RF chips are too close together within the same test period, mutual interference between signal frequencies may occur. Therefore, in this embodiment, a method based on fixed frequency intervals is adopted to select test frequencies. That is, starting from the lowest (or highest) frequency value of the test band, frequencies greater than or equal to a preset value are sequentially selected as test frequencies. This preset value ensures that no signal frequency interference occurs between the selected test frequencies within the same test period. The setting of the preset value is not limited here and can be flexibly set according to the test band size of the tested RF chip and actual needs; for example, if the test band is 76-81GHz, the preset value can be set to 100MHz; if the test band is 500-700MHz, the preset value can be set to 10MHz, etc.

[0049] The test frequency band refers to the frequency range within which the RF chip under test needs to be tested. In this embodiment, the corresponding test frequency band can be determined according to actual needs and the actual frequency band of the RF chip under test. In this step, taking the test frequency band of the RF chip under test as 76-81GHz as an example, if the test frequency points are selected according to a fixed frequency interval of 1GHz, then the lower limit of the test frequency band is 76GHz and the upper limit is 81GHz. For example, when the number of test frequency points is even, the center frequency value can be selected as two test frequency points, namely 78GHz and 79GHz. Then the selected test frequency points can be represented as 76GHz, 77GHz, 78GHz, 79GHz, 80GHz, and 81GHz.

[0050] The test frequency order can be considered as the arrangement of the various test frequencies for a given RF chip under test. Specifically, the test frequency order satisfies the following: each RF chip under test corresponds to a different test frequency within the same time period. This means that during multi-chip testing, the test frequencies for each RF chip under test are different within the same test time period. In other words, the test frequency order for each RF chip under test is mutually exclusive. Even within adjacent test time periods, the test frequency order for each RF chip under test is mutually exclusive, effectively reducing the chance of signal interference between multiple RF chips under test when switching test time slots for different test frequencies within the same time period. The fact that each RF chip under test corresponds to a different test frequency within the same time period can also be considered as, during multi-chip testing, the test frequencies for each RF chip under test within the interference range of the test are different within the same test time period. For example, if adjacent RF chips under test are tested at the same test frequency during the same test period, they will interfere with each other's signals. Therefore, the test frequencies of adjacent RF chips under test will be different, while the test frequencies of non-adjacent RF chips under test may be the same.

[0051] S120. Test each of the radio frequency chips under test according to the test frequency order.

[0052] In this process, each RF chip under test can be tested using an ATE (Automatic Test Equipment) machine according to the determined test frequency order. Furthermore, during the test, each RF chip under test must undergo both transmit and receive signal testing for the same test frequency. However, it should be noted that the transmit and receive signal tests cannot be performed simultaneously; for example, the transmit signal test can be performed first, followed by the receive signal test, or vice versa. This is not a limitation here.

[0053] It should be noted that, in this embodiment, in order to ensure that the test frequency order satisfies the condition that each tested RF chip corresponds to a different test frequency in the same time period, the number of tested RF chips and the number of test frequencies can be limited; for example, in each multi-chip test, the number of tested RF chips does not exceed the number of test frequencies.

[0054] The present invention provides a radio frequency (RF) chip testing method. First, it determines the test frequencies of at least two RF chips under test, and the order of these test frequencies for each chip. The test frequency order satisfies the following condition: each RF chip under test corresponds to a different test frequency within the same test time period. Then, it tests each RF chip according to this test frequency order. This method, by determining the test frequency order for each RF chip under test and testing them according to this order, ensures that in multi-chip testing, each chip corresponds to a different test frequency within the same test time period. This effectively avoids signal frequency interference between multiple chips during testing, thereby improving chip testing efficiency.

[0055] Example 2

[0056] Figure 2 This is a flowchart illustrating a radio frequency chip testing method according to Embodiment 2 of the present invention. Embodiment 2 is a refinement of the above embodiments. In this embodiment, the process of determining the test frequency order corresponding to each tested radio frequency chip is described in detail. It should be noted that technical details not described in detail in this embodiment can be found in any of the above embodiments.

[0057] like Figure 2 As shown in Embodiment 2 of the present invention, a radio frequency chip testing method is provided, which includes the following steps:

[0058] S210. Determine the characteristic frequency points of the frequency band to be tested, wherein the characteristic frequency points include the upper frequency limit, the lower frequency limit, and the center frequency value.

[0059] The frequency band under test can be considered as the test frequency band of the RF chip under test. The characteristic frequency point can be considered as the indicative test frequency point that affects the accuracy of the test results of the RF chip under test and other performance indicators, such as at least one of the upper frequency limit, lower frequency limit and center frequency value of the frequency band under test.

[0060] The center frequency value can be calculated based on the midpoint between the upper and lower frequency limits; alternatively, it can be obtained by first obtaining various test frequencies (including the upper and lower frequency limits of the frequency band under test) according to the set frequency intervals, and then selecting the frequency point in the middle position from among the test frequencies as the center frequency value. It should be noted that if an even number of test frequencies are selected, the center frequency value can be selected from the two test frequencies in the middle position; if an odd number of test frequencies are selected, the center frequency value can be selected from the single test frequency point in the middle position.

[0061] S220. Determine the test frequency points between the lower frequency limit and the center frequency value, and between the center frequency value and the upper frequency value, according to the set frequency interval.

[0062] The frequency interval set can be considered as the frequency difference between each test frequency point. This is not limited here and can be flexibly set according to actual needs and the size of the range of the frequency band to be tested.

[0063] For example, in this step, the upper frequency limit, lower frequency limit, and center frequency value are determined first. The center frequency value can be considered as the center value calculated between the upper and lower frequency limits. Then, the test frequency points are determined according to the set frequency intervals. The specific implementation process is as follows: First, the lower frequency limit (i.e., the minimum value of the frequency band to be tested) and the upper frequency limit (i.e., the maximum value of the frequency band to be tested) are determined based on the size of the frequency band to be tested. The center frequency value is calculated based on the upper and lower frequency limits. Then, the test frequency points between the lower frequency limit and the center frequency value are determined according to the set frequency intervals. Similarly, the test frequency points between the upper frequency limit and the center frequency value are determined according to the set frequency intervals. It should be noted that when determining the test frequency points, the frequency interval used to determine the test frequency points between the lower frequency limit and the center frequency value can be set to the same or different from the frequency interval used to determine the test frequency points between the upper frequency limit and the center frequency value; this step does not limit this.

[0064] Optionally, based on the set redundancy, a first redundancy test frequency point for the lower frequency limit and a second redundancy test frequency point for the upper frequency limit are determined, wherein the test frequency points include the first redundancy test frequency point and the second redundancy test frequency point.

[0065] Redundancy can be considered as an extra quantity from a safety perspective. This quantity ensures that the RF chip under test (DUT) can operate normally in a frequency range outside its operating frequency band (which can be understood as the frequency range in which the DUT can work). In other words, the test frequency range (i.e., the frequency band under test) of the DUT may be larger than its operating frequency band. In this case, the frequency band outside the operating frequency band within the test frequency range can be considered the redundancy of the DUT. It is understandable that the frequency band under test can be larger than the operating frequency band of the DUT. To ensure the comprehensiveness of the measurement results of the DUT, generally, corresponding redundant test frequencies can be determined within the redundancy frequency range and also used as test frequencies. Redundant test frequencies can be considered as fixed frequency points that differ from the lower and upper frequency limits of the frequency band under test by a certain frequency interval. The frequency interval and the number of redundant test frequencies can be set according to the actual frequency range of the DUT and actual needs; no specific limitations are imposed here.

[0066] In this step, taking the selection of one redundant test frequency point on each side of the operating frequency band as an example, a fixed frequency point differing from the lower frequency limit by a certain frequency interval can be determined as the first redundant test frequency point, and a fixed frequency point differing from the upper frequency limit by a certain frequency interval can be determined as the second redundant test frequency point. Then, these two determined redundant test frequency points are also used as test frequencies for chip testing. It should be noted that when performing chip testing, redundant test frequency points can be selected and added to the test frequency points for testing, or only the selected test frequency points within the frequency band under test can be tested; this is not limited here.

[0067] S230. Arrange the test frequency points in a specified order to obtain the test frequency point sequence of an RF chip.

[0068] The specified order can be considered as arranging the selected test frequencies in ascending order; or arranging the selected test frequencies in descending order; or arranging the selected test frequencies randomly, etc.

[0069] S240. Perform at least one cyclic shift on the test frequency points in the test frequency point sequence according to the set step size, and obtain the test frequency point sequence of another RF chip each time the cyclic shift is performed.

[0070] In one embodiment, one of the RF chips under test in each group is first selected as the first RF chip under test, and the test frequencies are sorted in a specified order to obtain a test frequency order for the first RF chip under test, which is then used as the first test frequency order. Then, based on the first test frequency order, the test frequencies in the first test frequency order are cyclically shifted at least once according to a set step size to obtain the second test frequency order corresponding to the second RF chip under test. And so on, the test frequency order corresponding to the remaining RF chips under test in each group can be obtained by cyclically shifting the test frequencies in the test frequency order corresponding to the previous RF chip under test at least once according to a set step size.

[0071] It should be noted that setting the step size can be considered as performing at least one cyclic shift every preset number of test frequency points. The preset number can be one test frequency point, two test frequency points, etc., to ensure that each RF chip under test corresponds to a different test frequency point within the same time period. Thus, as long as the final order of the test frequency points for each RF chip under test ensures that each RF chip under test corresponds to a different test frequency point within the same time period, the task is successful.

[0072] In this step, the test frequency sequence of each RF chip under test can be controlled autonomously by the ATE machine, and each RF chip under test can be tested. Alternatively, the control command for the test frequency sequence can be programmed by a computer or other equipment, and the test frequency sequence of each RF chip under test can be adjusted by the control command. Then, the ATE machine will test each RF chip under test according to the adjusted test frequency sequence.

[0073] S250. Test each of the radio frequency chips under test according to the test frequency order.

[0074] In one embodiment, S230 and S240 can also be replaced by S260 and S270, specifically including:

[0075] S260. Initialize the test frequency points and the test frequency point order corresponding to each of the tested RF chips, wherein the test frequency point order initialized for each of the tested RF chips is the same.

[0076] Initializing the test frequencies can be considered as selecting the same test frequencies for all the RF chips under test in each group. Initializing the order of the test frequencies for each RF chip under test can be considered as setting the arrangement (i.e., the test frequency order) of the test frequencies for each RF chip under test in each group to be the same; the initial arrangement order of the test frequencies is not limited here. In this step, the initialization of the test frequencies and the order of the test frequencies for each RF chip under test can be achieved through programming on a computer or other device.

[0077] S270. Adjust the order of test frequency points corresponding to each of the tested RF chips according to the order adjustment command of the external device.

[0078] The sequence adjustment instruction can be considered as an instruction that controls the adjustment of the test frequency order corresponding to each tested RF chip. The external device can be considered as an electronic device such as a computer or host computer. For example, the sequence adjustment instruction implemented by the external device, such as a computer, can be used to adjust the test frequency order corresponding to each tested RF chip, so that each tested RF chip corresponds to a different test frequency within the same time period. In this step, the method of adjusting the test frequency order is not limited; for example, it can be adjusted by the cyclic shifting method described in S240 above.

[0079] Optionally, the RF chip testing method further includes: grouping the RF chips under test into groups, wherein the number of RF chips under test in each group does not exceed the number of test frequency points; and testing each of the RF chips under test in the order of the test frequency points, specifically including: testing the RF chips under test in each group sequentially at different time periods.

[0080] The tested RF chips can be grouped according to actual needs, chip performance, and the number of required test frequencies. Chip performance can be considered as the operating range of the RF signal; for example, some tested RF chips operate in the 76-81 GHz range, while others operate in the 60-64 GHz range. Tested RF chips with the same operating range can be grouped together for testing, thus enabling testing of RF chips with different operating ranges. During grouping, to ensure that each tested RF chip corresponds to a different test frequency at the same time, the number of tested RF chips in each group should not exceed the number of test frequencies. For example, the number of tested RF chips can be equal to or less than the number of test frequencies; however, this is not a strict limitation.

[0081] In this embodiment, when the RF chips under test are grouped, the number of RF chips under test in each test group can be the same, such as each group being assigned a fixed number of RF chips under test for testing; or they can be different, such as some test groups being assigned 5 RF chips under test, and some test groups being assigned 4 RF chips under test, etc.; this is not limited here.

[0082] In one embodiment, if the number of test frequency points is 10, in order to ensure that the number of RF chips under test does not exceed the number of test frequency points, the grouping method can be to group 10 RF chips under test into one group. If there are fewer than 10 chips remaining at the end, they can also be grouped into one group. In this case, the efficiency of multi-chip testing can reach the highest level.

[0083] In one embodiment, during multi-chip testing, the RF chips under test (DUTs) can be grouped, with each group containing the same number of DUTs. The test frequency order for each DUT within each group is different, while the test frequency order between groups can correspond to and be the same. For example, DUTs 1-4 are in the first group, DUTs 5-8 are in the second group, and so on. In this case, the test frequency order for each DUT in the first group is different, and the test frequency order for each DUT in the second group is also different. However, the test frequency order for DUTs 5-8 in the second group can correspond to the test frequency order for DUTs 1-4 in the first group, i.e., it can be the same as the first group. Similarly, the test frequency order for each subsequent group of DUTs can correspond to the first group. Then, according to the test frequency order, the DUTs in each group are tested sequentially during different test periods. Based on this, efficient testing can also be achieved when there are a large number of RF chips under test, especially when the number of RF chips under test is greater than the number of test frequencies.

[0084] It should be noted that this embodiment does not limit the specific method of determining the test frequency point and the order of test frequency points for the RF chip under test in each group. For details, please refer to any embodiment of this application.

[0085] It should also be noted that steps S210-S230 above are at least one specific example of determining the test frequency points of at least two RF chips under test in step S110 of Embodiment 1. They are combined according to actual test requirements, such as taking into account preset frequency intervals, characteristic frequencies, and the number of test frequencies, selecting test frequencies that include preset characteristic frequencies and a corresponding number of test frequencies greater than or equal to the preset frequency interval. Steps S240-S270 are at least one specific example of determining the order of test frequency points corresponding to each RF chip under test in step S110 of Embodiment 1. They are combined according to actual test requirements. For example, when the determined test frequency points include both characteristic frequencies and test frequencies mentioned in the preset frequency list, the obtained test frequency points are sorted in multiple ways according to their respective sorting rules and assigned to different RF chips under test. For example, each sorting rule is set according to the test position of the RF chip under test, or randomly set, etc. In this way, the purpose of each RF chip under test corresponding to different test frequency points at the same time is achieved.

[0086] Figure 3 This is a schematic diagram of the initialization of test frequency points and test frequency point order provided in Embodiment 2 of the present invention.

[0087] In one embodiment, taking the simultaneous testing of four RF chips under test, with the tested frequency band of the RF chips being 76-81GHz as an example, the specific implementation process is as follows: First, the upper and lower frequency limits are determined to be 76GHz and 81GHz, respectively. Then, the center frequency value and other test frequencies can be selected using a frequency interval of 1GHz. The selected test frequencies can be represented as 76GHz, 77GHz, 78GHz, 79GHz, 80GHz, and 81GHz, where 78GHz and 79GHz can be considered as the selected center frequency values. Then, the selected test frequencies and the test frequency order corresponding to each RF chip under test are initialized, such as... Figure 3 As shown, each tested RF chip after initialization (i.e. Figure 3 The test frequency points for Site1, Site2, Site3, and Site4 are all ordered in ascending order. This indicates that there is signal frequency interference between the tested RF chips, making serial testing the only suitable method.

[0088] Figure 4 This is a schematic diagram illustrating the adjusted test frequency order according to Embodiment 2 of the present invention. The initial test frequency order for each tested RF chip is identical. Based on this, a corresponding order adjustment instruction can be generated through computer programming to adjust the test frequency order for each tested RF chip; for example... Figure 4 As shown, the sequence adjustment instruction is as follows: Site 1 maintains the original test frequency order; Site 2, using Site 1 as a reference, performs a cyclic shift of the test frequencies in the original test frequency order with a step size of 1 to obtain the adjusted test frequency order; and so on, obtaining the adjusted test frequency orders for Site 3 and Site 4 respectively. Finally, each RF chip under test is tested according to the test frequency order. The adjusted test frequency order ensures that each chip has a different test frequency within the same test time period, effectively avoiding the problem of signal frequency interference between multiple chips during testing, thereby improving the chip testing efficiency.

[0089] This invention provides a method for testing radio frequency (RF) chips, which specifies the process of determining the order of test frequencies for each RF chip under test. By adjusting the order of test frequencies for different RF chips under test, this method ensures that each RF chip under test corresponds to a different test frequency within the same time period. This effectively avoids signal frequency interference between multiple chips during multi-chip testing, thereby improving chip testing efficiency. Furthermore, by grouping the RF chips under test for testing, flexible and efficient testing can be achieved, even when there are many RF chips under test or when multiple RF chips have different performance characteristics.

[0090] Optionally, the test frequency order corresponding to each RF chip under test is determined in at least one of the following ways: selecting a set number of first test frequencies from a preset frequency list, and determining the test frequency order corresponding to each RF chip under test according to a first sorting rule; selecting one second test frequency from each of at least two preset frequency intervals, and determining the test frequency order corresponding to each RF chip under test according to a second sorting rule; determining the test frequency order corresponding to each RF chip under test according to a third sorting rule using preset characteristic frequencies in the frequency band to be tested.

[0091] The preset frequency list can be understood as a pre-defined list containing multiple fixed frequencies, which are frequency values ​​within the test frequency band. There is no specific limitation on the fixed frequency values ​​or the number of fixed frequencies included in the preset frequency list; these can be set according to actual needs. The first test frequency point can refer to the test frequency point selected from the preset frequency list. The set quantity can be understood as the pre-defined number of test frequency points selected. There is no specific limitation on the set quantity; for example, all fixed frequencies in the preset frequency list can be selected, or only a portion of the fixed frequencies in the preset frequency list can be selected. The first sorting rule can be understood as a pre-defined rule for sorting the first test frequency points. There is no specific limitation on the first sorting rule; it is sufficient to ensure that the order of the test frequency points corresponding to each tested RF chip is unique after sorting.

[0092] Specifically, a set number of first test frequency points can be selected from the preset frequency list, and the order of the test frequency points corresponding to each tested RF chip can be determined according to the first sorting rule.

[0093] The preset frequency interval can be understood as a pre-set frequency interval. It is understood that the preset frequency interval is within the frequency band to be tested. The second test frequency point can refer to a test frequency point selected from the preset frequency interval. The second sorting rule can be understood as a pre-set rule for sorting the second test frequency points. Here, the second sorting rule is not specifically limited, as long as the order of the test frequency points corresponding to each tested RF chip is mutually exclusive after sorting.

[0094] Specifically, a second test frequency point can be selected from at least two preset frequency intervals, and the order of the selected second test frequency points is determined according to the second sorting rule for each RF chip under test.

[0095] The preset characteristic frequency points can be understood as pre-defined characteristic frequency points. There is no specific limitation on the preset characteristic frequency points here; for example, they may include the upper frequency limit, lower frequency limit, and center frequency value of the frequency band under test. The third sorting rule can be understood as a pre-defined rule for sorting the preset characteristic frequency points. There is no specific limitation on the third sorting rule here, as long as the order of the test frequency points corresponding to each tested RF chip is unique.

[0096] Specifically, the order of test frequency points for each RF chip under test can be determined by the preset characteristic frequency points in the frequency band under test according to the third sorting rule.

[0097] The sorting rules for the first, second, and third sorting rules mentioned above can be the same or different. For example, as mentioned in the example above, each sorting rule is set according to the test location of the RF chip under test, or it can be set randomly, etc.

[0098] It should be noted that, optionally, the number of RF chips under test in the same time period shall not exceed the number of each test frequency point in the test frequency point sequence.

[0099] Understandably, in order to ensure that the test frequency order satisfies the condition that each tested RF chip corresponds to a different test frequency in the same time period, the number of tested RF chips in the same time period (i.e., within the same test time period) shall not exceed the number of each test frequency in the test frequency order.

[0100] Optionally, unlike step S110 in Embodiment 1, the method of testing each RF chip under test according to the test frequency order includes: under the control of preset synchronization instructions and / or preset test instructions, testing the corresponding RF chip under test according to their respective test frequency order.

[0101] The preset synchronization command can be understood as a pre-set command used to control each tested RF chip to synchronously process the corresponding test frequency within the same test time period. To this end, within the same time period, the test equipment outputs the synchronization command based on the test duration of the slowest test frequency, thereby reducing the time slots during test frequency switching, ensuring that at least adjacent tested RF chips are in the same test frequency test environment.

[0102] A preset test command can be understood as a pre-defined instruction that controls each RF chip under test to test its transmit link or receive link sequentially according to the order of the test frequencies. For example, the preset test command could be to test the transmit link first and then the receive link, or vice versa, according to the order of the test frequencies of the corresponding RF chips under test. In this way, the test equipment automatically tests the transmit and receive links sequentially according to the order of the test frequencies based on the test command.

[0103] This embodiment can test the corresponding RF chips under test according to their respective test frequency order under the control of preset synchronization commands and / or preset test commands. For example, under the control of preset synchronization commands, each RF chip under test can synchronously start testing according to the test frequency within the same test time period. Alternatively, under the control of preset test commands (such as testing the transmit link first and then the receive link), each RF chip under test can be tested according to its corresponding test frequency within the same test time period, first testing the transmit link and then the receive link.

[0104] For example, the RF chip under test includes a radar chip with an antenna packaged within it, wherein the antenna includes a transmitting antenna and a receiving antenna. The radar chip can be a miniature sensor based on radar frequency applications, in which an antenna can be packaged for transmitting and receiving corresponding signals. The transmitting antenna can be understood as an antenna used to transmit the corresponding signal; the receiving antenna can be understood as an antenna used to receive the corresponding signal. Therefore, the transmitting antenna is coupled to a receiving waveguide in the test equipment to form a test transmit link; and the receiving antenna is coupled to a transmitting waveguide in the test equipment to form a test receive link.

[0105] For example, the RF chip under test includes an RF transmitter and an RF receiver. The RF transmitter's RF transmit signal pins are connected to the test equipment to form a test transmit link; and the RF receiver's RF receive signal pins are connected to the test equipment to form a test receive link.

[0106] Optionally, before testing each RF chip under test in the order of test frequencies, the method further includes: for each RF chip under test, controlling the device under test corresponding to the RF chip under test to be coupled to the transmitting antenna and / or receiving antenna in the RF chip under test.

[0107] The coupling of the two devices can be understood as adding a capacitor in series between them. Before testing each RF chip under test (DUT) according to the test frequency sequence, for each DUT, the corresponding device under test (DUT) can be coupled to the transmitting antenna and / or receiving antenna in the DUT to facilitate the transmission of transmitted and received signals between the DUT and the DUT during subsequent testing.

[0108] Optionally, before testing each RF chip under test in the order of test frequency points, the device under test corresponding to each RF chip under test can be coupled to the transmitter and / or receiver in the RF chip under test.

[0109] In this context, the transmitter and receiver can be understood as the external pins of the transmitter (also known as the RF transmitting device) and the receiver (also known as the RF receiving device) in the RF chip under test, respectively. The external pins of the transmitter are connected to the corresponding transmitting antenna, and the external pins of the receiver can be connected to the corresponding receiving antenna.

[0110] Optionally, the method further includes: testing the RF chip under test using the device under test in the following manner: testing the transmit link in the RF chip under test using the device under test, and / or testing the receive link in the RF chip under test.

[0111] In this context, a transmit link can refer to a link consisting of a signal transmitter (for generating the transmitted signal), a transmission line (for transmitting the signal), and a transmitting antenna. Similarly, a receive link can refer to a link consisting of a signal receiver, a transmission line, and a receiving antenna. Testing of the transmit and receive links can include: testing transmit and receive power, testing signal attenuation, and testing for any abnormalities in the transmit and receive links.

[0112] When testing an RF chip under test (RDB) using a device under test (DUT), the DUT can be used to test the transmit link and / or the receive link of the RF chip. For example, at least one of the following parameters can be tested: power, radiation performance, and noise level of the transmit and / or receive links.

[0113] Example 3

[0114] Figure 5 This is a schematic diagram of the architecture of an RF chip testing device provided in Embodiment 3 of the present invention. This device can be implemented by software and / or hardware. Figure 5 As shown, the device includes a configuration module 310 and a test module 320.

[0115] The configuration module 310 is used to determine the test frequency points of at least two radio frequency chips under test, and the test frequency point order corresponding to each radio frequency chip under test, wherein the test frequency points corresponding to each radio frequency chip under test are different at the same time period.

[0116] The test module 320 is used to test the corresponding RF chip under test according to the test frequency point sequence.

[0117] In this embodiment, the device first determines the test frequencies of at least two RF chips under test, and the order of these test frequencies, through the configuration module 310. The test frequencies for each RF chip are different within the same testing time period. Then, the testing module 320 tests the corresponding RF chips according to the test frequency order. By determining the test frequency order for each RF chip and testing them accordingly, this device ensures that in multi-chip testing, each chip has a different test frequency within the same testing time period. This effectively avoids signal frequency interference between multiple chips during testing, thereby improving chip testing efficiency.

[0118] Optionally, the test frequency order corresponding to each of the tested RF chips can be determined in at least one of the following ways:

[0119] Select a set number of first test frequency points from the preset frequency list, and determine the test frequency point order of each first test frequency point according to the first sorting rule for each RF chip under test.

[0120] Select one second test frequency point from each of at least two preset frequency intervals, and determine the test frequency point order corresponding to each of the tested RF chips according to a second sorting rule; and

[0121] The order of test frequency points corresponding to each RF chip under test is determined by the third sorting rule based on the preset characteristic frequency points in the frequency band to be tested.

[0122] Optional, test module 320, specifically used for:

[0123] Under the control of preset synchronization instructions and / or preset test instructions, the corresponding RF chips under test are tested according to their respective test frequency order.

[0124] Optionally, the radio frequency chip under test includes a radar chip with an antenna packaged in it, the antenna including a transmitting antenna and a receiving antenna.

[0125] Optionally, the number of RF chips under test in the same time period shall not exceed the number of each test frequency point in the test frequency point sequence.

[0126] Optionally, before testing each of the radio frequency chips under test according to the test frequency order, the method further includes:

[0127] For each RF chip under test, the device under test corresponding to the RF chip under test is coupled to the transmitting antenna and / or receiving antenna in the RF chip under test.

[0128] Optionally, it also includes: testing the RF chip under test using the device under test in the following manner:

[0129] The transmit link in the RF chip under test is tested using the device under test, and / or the receive link in the RF chip under test is tested.

[0130] The above-described RF chip testing apparatus can execute the RF chip testing method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects for executing the method.

[0131] Example 4

[0132] Figure 6 This is a schematic diagram of a testing device provided in Embodiment 4 of the present invention. Figure 6 As shown, the test device provided in Embodiment 4 of the present invention includes: one or more processors 41 and a storage device 42; the processors 41 in the test device may be one or more. Figure 6 Taking a processor 41 as an example; storage device 42 is used to store one or more programs; the one or more programs are executed by the one or more processors 41, so that the one or more processors 41 implement the radio frequency chip testing method as described in any one embodiment of the present invention.

[0133] The testing equipment may also include an input device 43 and an output device 44.

[0134] The processor 41, storage device 42, input device 43, and output device 44 in the test equipment can be connected via a bus or other means. Figure 6 Taking the example of a connection between China and Israel via a bus.

[0135] The storage device 42 in the test equipment serves as a computer-readable storage medium, which can be used to store one or more programs. These programs can be software programs, computer-executable programs, and modules, such as the program instructions / modules corresponding to the RF chip testing method provided in Embodiment 1 or 2 of this invention (e.g., attached...). Figure 5 The modules in the RF chip testing device shown include: a configuration module 310 and a testing module 320. The processor 41 executes various functional applications and data processing of the testing device by running software programs, instructions, and modules stored in the storage device 42, thereby implementing the RF chip testing method in the above method embodiment.

[0136] Storage device 42 may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function; the data storage area may store data created based on the use of the test equipment. Furthermore, storage device 42 may include high-speed random access memory and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other non-volatile solid-state storage device. In some instances, storage device 42 may further include memory remotely located relative to processor 41, which can be connected to the test equipment via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0137] Input device 43 can be used to receive input digital or character information, and to generate key signal inputs related to user settings and function control of the test equipment. Output device 44 may include display devices such as a display screen.

[0138] Furthermore, when one or more programs included in the aforementioned test equipment are executed by one or more processors 41, the program performs the following operations: determining the test frequency points of at least two RF chips under test, and the test frequency point order corresponding to each RF chip under test, wherein the test frequency point order satisfies the following: each RF chip under test corresponds to a different test frequency point in the same time period; and testing each RF chip under test according to the test frequency point order.

[0139] Example 5

[0140] Embodiment 5 of the present invention provides a computer-readable storage medium storing a computer program thereon. When executed by a processor, the program is used to perform a radio frequency chip testing method. The method includes: determining at least two test frequency points of radio frequency chips under test, and the test frequency point order corresponding to each of the radio frequency chips under test, wherein the test frequency point order satisfies the following: each of the radio frequency chips under test corresponds to a different test frequency point in the same time period; and testing each of the radio frequency chips under test according to the test frequency point order.

[0141] Optionally, when executed by a processor, the program can also be used to execute the radio frequency chip testing method provided in any embodiment of the present invention.

[0142] The computer storage medium of this invention can be any combination of one or more computer-readable media. The computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. The computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of computer-readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), flash memory, optical fiber, portable CD-ROM, optical storage device, magnetic storage device, or any suitable combination thereof. The computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0143] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, which can send, propagate, or transmit programs for use by or in connection with an instruction execution system, apparatus, or device.

[0144] Program code contained on a computer-readable medium may be transmitted using any suitable medium, including but not limited to: wireless, wire, optical fiber, or radio frequency (RF), or any suitable combination thereof.

[0145] Computer program code for performing the operations of this invention can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, as well as conventional procedural programming languages ​​such as C or similar languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0146] Example 6

[0147] Figure 7 This is a schematic diagram of the structure of an RF chip testing system provided in Embodiment Six of the present invention. Figure 7 As shown, the RF chip testing system includes at least two RF chips under test 520 and a testing device 510, wherein the testing device 510 is connected to each of the RF chips under test.

[0148] Among them, test equipment 510 can be considered as equipment used for radio frequency chip testing, such as ATE equipment.

[0149] In this embodiment, the test equipment can be used to adjust the test frequency order of the RF chip under test, and then use it for chip testing. Alternatively, the test frequency order of the RF chip under test can be controlled and adjusted by a computer or other device, wherein the computer is connected to the test equipment, and then the test frequency order adjusted by the computer is sent to the test equipment, and the test equipment tests the RF chip under test according to the test frequency order.

[0150] The radio frequency chip testing system provided in this embodiment can be used to execute the radio frequency chip testing methods provided in any of the above embodiments, and has the corresponding functions and beneficial effects.

[0151] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A method for testing radio frequency chips, characterized in that, include: The test frequency points of at least two radio frequency chips under test are determined, as well as the test frequency point order corresponding to each radio frequency chip under test. The test frequency point order satisfies the following conditions: each radio frequency chip under test corresponds to a different test frequency point in the same time period; the number of radio frequency chips under test in the same time period does not exceed the number of each test frequency point in the test frequency point order; and the test frequency point order corresponding to each radio frequency chip under test is different from each other. The process of determining the test frequency point order corresponding to each radio frequency chip under test is as follows: the test frequency points in the test frequency point order are cyclically shifted at least once according to a set step size, and each cyclic shift yields the test frequency point order of another radio frequency chip. Each of the radio frequency chips under test is tested according to the test frequency order.

2. The method according to claim 1, characterized in that, The test frequency order corresponding to each of the tested RF chips shall be determined in at least one of the following ways: Select a set number of first test frequency points from the preset frequency list, and determine the test frequency point order of each first test frequency point according to the first sorting rule for each RF chip under test. Select one second test frequency point from each of at least two preset frequency intervals, and determine the test frequency point order corresponding to each of the second test frequency points according to the second sorting rule; and The order of test frequency points corresponding to each RF chip under test is determined by the third sorting rule based on the preset characteristic frequency points in the frequency band to be tested.

3. The method according to claim 1, characterized in that, Each of the radio frequency chips under test is tested according to the test frequency order, including: Under the control of preset synchronization instructions and / or preset test instructions, the corresponding RF chips under test are tested according to their respective test frequency order.

4. The method according to claim 1, characterized in that, The radio frequency chip under test includes a radar chip with an antenna packaged in it, and the antenna includes a transmitting antenna and a receiving antenna.

5. The method according to claim 1, characterized in that, Before testing each of the radio frequency chips under test according to the test frequency order, the process also includes: For each RF chip under test, the device under test corresponding to the RF chip under test is coupled to the transmitting antenna and / or receiving antenna in the RF chip under test.

6. The method according to claim 5, characterized in that, Also includes: The RF chip under test is tested using the device under test as follows: The transmit link in the RF chip under test is tested using the device under test, and / or the receive link in the RF chip under test is tested.

7. A radio frequency chip testing device, characterized in that, include: A configuration module is used to determine the test frequency points of at least two RF chips under test, and the test frequency point order corresponding to each RF chip under test. The test frequency point order satisfies the following conditions: the test frequency points corresponding to each RF chip under test are different in the same time period; the number of RF chips under test in the same time period does not exceed the number of each test frequency point in the test frequency point order; the test frequency point order corresponding to each RF chip under test is different from each other; the process of determining the test frequency point order corresponding to each RF chip under test is as follows: the test frequency points in the test frequency point order are cyclically shifted at least once according to a set step size, and each cyclic shift obtains the test frequency point order of another RF chip. The test module is used to test the corresponding RF chip under test according to the test frequency order.

8. A testing device, characterized in that, include: One or more processors; Storage device for storing one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the radio frequency chip testing method as described in any one of claims 1-6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When executed by the processor, the program implements the RF chip testing method as described in any one of claims 1-6.

10. A radio frequency chip testing system, characterized in that, include: At least two radio frequency chips under test and the test equipment as described in claim 8, wherein the test equipment is connected to each of the radio frequency chips under test.