Vehicle regional controller integrated power distribution module and power distribution implementation method thereof

Through the distributed power distribution solution of multi-core heterogeneous microprocessors and intelligent high-side driver chips, the complex and heavy wire harnesses in automotive service controllers are solved, and efficient and reliable regional power distribution is achieved, reducing the cost of the whole vehicle and improving the stability of power distribution.

CN114879580BActive Publication Date: 2025-08-08YODO SMART
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Patent Information

Application Number
CN202210661172.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-06-13
Publication Date
2025-08-08
Estimated Expiration
2042-06-13

AI Technical Summary

Technical Problem

The existing automotive service controllers adopt centralized power distribution solutions to lead to complex wiring harnesses, long wiring harness length and high cost. Relays and fuses lead to large volume, large weight, high power consumption and lack of over-temperature overvoltage protection functions.

Method used

Multi-core heterogeneous microprocessors and intelligent high-side driver chips are used to replace traditional relays and fuses, realizing distributed power distribution, with overcurrent and over-temperature reverse connection protection functions, and with current sampling and fault diagnosis capabilities.

Benefits of technology

It reduces the complexity of the vehicle power supply wiring harness, reduces the weight and cost of the vehicle, and improves the stability and reliability of power distribution, reducing electromagnetic radiation and switch jitter.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses an integrated power distribution module for a vehicle regional controller and a power distribution implementation method thereof. The module uses a multi-core heterogeneous microprocessor integrating a microcontroller unit and a microprocessing unit core as the core chip of a service-type regional controller, utilizes a built-in dual-core lock-step microcontroller unit as the control core of the regional power distribution module, and runs regional power distribution software with specific requirements for both real-time performance and safety performance. The module adopts an intelligent high-side driver chip, which not only reduces the size and weight, but also reduces electromagnetic radiation without switch jitter, has better robustness to surge current and inductive loads, has overcurrent, overtemperature and reverse connection protection functions, and has current sampling and fault diagnosis functions, which can quickly locate regional power supply faults. In the case of overcurrent or short-circuit fault state, the module can limit the current or shut down the output, and the power supply can be restored after the fault is eliminated without manual replacement of fuses. The complexity of the vehicle power supply wiring harness is reduced, and efficient regional power distribution management is achieved.
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Description

Technical Field

[0001] The present invention relates to a vehicle service type controller, and in particular to a vehicle regional controller integrated power distribution module used in a vehicle service type controller solution and a power distribution implementation method thereof. Background Art

[0002] Currently, centralized power distribution is commonly used in automobiles. This involves placing a power distribution box in the vehicle's cab to manage power distribution for the vehicle's electronic and electrical components. This power distribution system utilizes a combination of relays and fuses, which provide protection when a short circuit or overcurrent occurs. Furthermore, the body control module (BCM) uses integrated relays and resettable fuses to control the power supply to auxiliary onboard controllers and actuators. Some BCMs employ a hybrid power distribution model, using high-side or low-side MOSFETs to control the power supply to some low-current controllers and actuators, while relays and resettable fuses are used to control the power supply to high-current controllers and actuators.

[0003] like Figure 5 The current centralized power distribution scheme commonly used in automotive applications is shown as follows: All electronic and electrical components in the vehicle are powered by battery A10. Two or more parallel positive power lines (denoted by V+ in the drawings, and V+ in other figures represents the same) and negative power lines (denoted by V- in the drawings, and V- in other figures represents the same) connect battery A10 to the power distribution box C20. A single power distribution box C20 then centrally controls power distribution to multiple electronic and electrical components (ECU_01, ECU_02, and ECU_n). With the increasing electrification and intelligence of vehicles, the centralized power distribution scheme has led to complex wiring harnesses and long power cables, increasing vehicle weight and manufacturing costs.

[0004] With the advancement of automotive electronics and electrification, the number of onboard controllers and actuators is increasing. The centralized power distribution approach leads to complex power wiring and long wiring harnesses, significantly increasing wiring harness costs. Furthermore, the use of relays and fuses for power distribution control is complicated by their bulk and weight, making layout difficult. Relays typically have an on-resistance of around 100 ohms, dissipating significant power. As physical contacts, relays are subject to switch jitter and dry current issues, and are poorly robust against inrush currents. Relay and fuse solutions only provide overcurrent and short-circuit protection, lacking overtemperature and overvoltage protection, and lack fault diagnostics. Summary of the Invention

[0005] The present invention aims to solve the problems that the existing vehicle service controller adopts a centralized power distribution solution, which results in a very complicated vehicle wiring harness, a long wiring harness length, a greatly increased vehicle wiring harness cost, and a large number of relays and fuses required, resulting in a large overall volume and weight, difficult layout, and high power consumption. The present invention provides an integrated power distribution module for a vehicle regional controller and a power distribution implementation method thereof, which can replace the traditional relay and fuse combination, reduce the overall volume and weight of the vehicle service controller, eliminate switch jitter, and provide stable and reliable power distribution.

[0006] The specific technical solution adopted by the present invention to solve the above technical problems is: an integrated power distribution module for a vehicle zone controller, characterized by comprising: a power module, a multi-core heterogeneous microprocessor and an intelligent high-side driver chip;

[0007] The multi-core heterogeneous microprocessor has multiple built-in microcontrol units and microprocessing units. The microcontrol units use a dual-core lockstep mode to process regional power distribution software strategies with specific requirements for real-time performance and safety performance.

[0008] The microprocessing unit communicates with the microcontroller unit via an internal bus and a message mechanism for pre-processing signals from onboard controllers or sensors within the area;

[0009] The power module supplies power to the multi-core heterogeneous microprocessor and peripheral chips;

[0010] The intelligent high-side driver chip is used for high-side output control, current collection and fault diagnosis.

[0011] Using intelligent high-side driver chips to replace the traditional relay and fuse combination not only reduces the size and weight, but also reduces power dissipation by reducing the on-resistance, reduces electromagnetic radiation by eliminating switch jitter, and is more robust to surge currents and inductive loads. It has overcurrent, overtemperature and reverse polarity protection functions, and has current sampling and fault diagnosis functions, which can quickly locate regional power supply faults; in the event of overcurrent or short-circuit faults, it can limit the current or shut down the output, and the power supply can be restored after the fault is eliminated without manual replacement of the fuse; using this distributed regional power distribution module can greatly reduce the complexity of the vehicle power supply harness, reduce costs while achieving efficient and reliable regional power distribution management.

[0012] Preferably, the power module has a built-in watchdog, which monitors the microprocessor software's operating status through question-and-answer communication within a time window. If the microprocessor software fails to operate normally, it triggers a reset signal to reset the microprocessor. During a microprocessor reset, the power module provides a safety output to control the intelligent high-side driver chip to provide continuous power, thereby improving the stability, reliability, and effectiveness of the sustainable power supply provided by the integrated power distribution module for the vehicle's zone controller.

[0013] Preferably, the power module provides a safety output signal. When the watchdog error count exceeds a set value or an internal fault occurs in the microprocessor hardware module, the power module outputs a safety output signal to control the intelligent high-side driver chip to continuously supply power. This improves the stability, reliability and effectiveness of the sustainable power supply of the integrated power distribution module for the vehicle zone controller.

[0014] Preferably, the positive terminal of the power input of the zone controller is first electrically connected to an LC filter circuit and then to a low-resistance P-channel MOSFET for reverse polarity protection, thereby improving the safety and protection of the integrated power distribution module for the vehicle zone controller.

[0015] Preferably, the power input pin of the intelligent high-side driver chip is connected to the emitter of a PNP transistor. The collector of the PNP transistor is connected to the power output pin of the intelligent high-side driver chip after being connected in series with a resistor. A pull-down resistor is also connected to this pin to detect open-circuit faults of the output pin and short-circuit faults to the power supply when the output is turned off. This improves the protection against short-circuit and open-circuit faults in the integrated power distribution module of the vehicle zone controller.

[0016] Preferably, the power module's safety output signal passes through a π-type RC filter circuit consisting of two capacitors and a resistor to remove harmonic interference in the circuit. The signal is then connected to an NPN transistor circuit for level inversion. The converted signal is then connected to one input of an OR gate circuit, thereby enhancing the anti-interference performance of the integrated power distribution module for the vehicle zone controller.

[0017] Preferably, the intelligent high-side driver control signal output by the microprocessor passes through a pull-down resistor and a current-limiting resistor and is then connected to the other input terminal of an OR gate circuit. The two control signals are logically processed by the OR gate circuit to control the output state of the intelligent high-side driver chip, thereby improving the stability, reliability, and effectiveness of the sustainable power supply of the integrated power distribution module for the vehicle zone controller.

[0018] Preferably, the analog current signal output by the intelligent high-side driver chip is converted to a voltage signal via a sampling resistor. This signal is then passed through a current-limiting resistor and a Zener diode for overvoltage protection before being connected to the microprocessor's analog-to-digital conversion channel. The collected voltage signal is linearly correlated with the current signal output by the intelligent high-side driver chip, thereby enhancing the current limiting and overcurrent protection capabilities of the integrated power distribution module in the vehicle zone controller.

[0019] Another object of the present invention is to provide a method for implementing power distribution for an integrated power distribution module for a vehicle zone controller, characterized by employing a two-level power distribution management mode to manage power distribution for the integrated power distribution module described in one of the above technical solutions. The method comprises connecting the battery and the primary power distribution box via two or more parallel positive and negative power lines; connecting the primary power distribution box to multiple zone controllers via power lines, and each zone controller performing two-level power distribution management for the electronic and electrical components within its area. This method overcomes the drawbacks of centralized power distribution, such as complex wiring, bulky overall size, heavy weight, and high interference, while simplifying and simplifying the wiring structure of the integrated power distribution module for the vehicle zone controller, reducing its size and weight. Furthermore, the method reduces power dissipation by reducing on-resistance, reduces electromagnetic radiation by eliminating switch jitter, and improves robustness against surge currents and inductive loads.

[0020] As a preferred option, considering regional power supply safety, a backup battery and a backup primary distribution box are added. The electrical connection method between the backup battery and the backup primary distribution box is the same as that between the battery and the primary distribution box, thereby improving the safety, continuity, reliability and effectiveness of power distribution.

[0021] The beneficial effects of the present invention are: using an intelligent high-side driver chip to replace the traditional relay and fuse combination not only reduces the size and weight, but also reduces power dissipation by reducing the on-resistance, reduces electromagnetic radiation by eliminating switch jitter, is more robust to surge current and inductive loads, has overcurrent, overtemperature and reverse connection protection functions, and has current sampling and fault diagnosis functions, which can quickly locate regional power supply faults; in the case of overcurrent or short-circuit fault state, the current can be limited or the output can be shut down, and the power supply can be restored after the fault is eliminated without manual replacement of the fuse; the use of this distributed regional power distribution module can greatly reduce the complexity of the vehicle power supply harness, reduce costs while achieving efficient and reliable regional power distribution management. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] Figure 1 It is a distributed structural diagram of the integrated power distribution module of the vehicle zone controller and the power distribution implementation method thereof of the present invention.

[0024] Figure 2 It is a schematic diagram of the distribution module structure of the integrated power distribution module of the vehicle zone controller and the power distribution implementation method thereof of the present invention.

[0025] Figure 3 This is a schematic diagram of the intelligent high-side drive circuit structure in the integrated power distribution module of the vehicle zone controller and its power distribution implementation method of the present invention.

[0026] Figure 4This is a schematic diagram of the safety output circuit structure of the integrated power distribution module of the vehicle zone controller and the power distribution implementation method thereof of the present invention.

[0027] Figure 5 This is a schematic diagram of a common centralized power distribution circuit structure in the prior art. DETAILED DESCRIPTION

[0028] Example 1:

[0029] Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 In the embodiment shown, a vehicle zone controller integrated power distribution module includes a power module 10, a multi-core heterogeneous microprocessor 20 and an intelligent high-side driver chip 40;

[0030] The multi-core heterogeneous microprocessor has multiple built-in microcontrol units and microprocessing units. The microcontrol units use a dual-core lockstep mode to process regional power distribution software strategies with specific requirements for real-time performance and safety performance.

[0031] The microprocessing unit communicates with the microcontroller unit via an internal bus and a message mechanism to pre-process signals from multiple onboard controllers or sensors within the area and to provide a service interface to other area controllers or a central computer;

[0032] The power module supplies power to the multi-core heterogeneous microprocessor and peripheral chips;

[0033] The intelligent high-side driver chip is used for high-side output control, current collection and fault diagnosis.

[0034] The power module has a built-in watchdog, which monitors the running status of the microprocessor software based on the question-and-answer communication in the time window, and controls the reset of the microprocessor through the reset signal when the microprocessor software runs abnormally. When the microprocessor is reset, the power module provides a safety output to control the intelligent high-side driver chip to provide continuous power supply to the outside. The power module provides a safety output signal. When the watchdog error count exceeds the set value or an internal fault occurs in the microprocessor hardware module, the power module outputs a safety output signal to control the intelligent high-side driver chip 40 to provide continuous power supply to the outside. The positive pole of the input power of the intelligent high-side driver chip is first electrically connected to the LC filter circuit, and then electrically connected to the extremely low-resistance P-channel MOSFET for reverse connection protection. The power input pin of the intelligent high-side driver chip is connected to the emitter of the PNP transistor, and the collector of the PNP transistor is connected to the power supply output pin of the intelligent high-side driver chip after a series resistor is connected, and a pull-down resistor is connected to the pin to detect the output pin open circuit fault and power short circuit fault when the output is turned off. The power module safety output signal passes through two capacitors ( Figure 4capacitor C9 and capacitor C8) and a resistor ( Figure 4 A π-type RC filter circuit (with resistor R13 in the middle) removes harmonic interference from the circuit. It is then connected to an NPN transistor T3 circuit for level inversion, and the converted signal is connected to one input of an OR gate circuit. The intelligent high-side driver control signal output by the microprocessor passes through a pull-down resistor and a current-limiting resistor and is then connected to the other input of the OR gate circuit. These two control signals are logically processed by the OR gate circuit and used to control the output state of the intelligent high-side driver chip. The analog current signal output by the intelligent high-side driver chip is converted to a voltage signal through a sampling resistor. It then passes through a current-limiting protection resistor and a Zener diode for overvoltage protection before being connected to the microprocessor's analog-to-digital conversion channel. The collected voltage signal is linearly correlated with the current signal output by the intelligent high-side driver chip.

[0035] In this embodiment of the present invention, the power management chip VR5510 in the power module 10 not only provides 3.3V, 1.8V, 1.1V, and 0.8V power to the microprocessor 20 and peripheral chips, but also includes a built-in time-window-based question-and-answer communication window watchdog 11. During operation, the microprocessor 20 must perform question-and-answer watchdog feeding via the I2C communication interface within a set effective time window (the watchdog feeding period and the duty cycle of the effective window can be configured as needed). The power module 10 also includes an internal window watchdog error counter to count window watchdog errors. If the watchdog is not fed within the set time window, the error counter increments by 2. If the watchdog is successfully fed within the set time window, the error counter decrements by 1. When the window watchdog error counter reaches the set maximum value, the power module 10 triggers a microprocessor reset via the RSTB pin and simultaneously controls the safety output pin FS0B to output a safe state. When the microprocessor resumes normal operation after reset and successfully feeds the watchdog via the I2C bus, the power module 10 exits the safe state, and the FS0B pin outputs the default state.

[0036] As mentioned above, when the power module determines that the microprocessor is operating abnormally, it outputs a safe state through the FS0B pin (see Figure 4 ); FS0B pin is an open-drain output and has an internal pull-down resistor to ensure that the power module can output a low-level safety state even when it is powered off or in sleep mode. Figure 4 As shown, the power module safety output signal passes through a π-type RC filter circuit composed of two capacitors and a resistor to remove harmonic interference in the circuit, and then is connected to an NPN transistor circuit for level inversion. The converted signal is connected to an input end of the OR gate circuit. Figure 4The specific implementation circuit uses the 14th resistor R14 to pull up the FS0B pin of the power module to 3.3V, and connects to the π-type RC filter circuit composed of the 9th film capacitor C9, the 13th resistor R13 and the 8th film capacitor C8 to remove harmonic interference in the circuit, and then connects to the NPN transistor T3; when FS0B outputs the default state, it is pulled up by the 14th resistor R14 and processed by the π-type filter circuit, and output to the base high level of the NPN transistor T3. The NPN transistor T3 is turned on, and the B pin connected to the OR gate chip U2 is low. At this time, the OUT pin output of the intelligent high-side driver chip U1 is completely controlled by the GPIO of the microprocessor. When FS0B outputs a safe state, it is pulled up by the 14th resistor R14 and processed by the π-type filter circuit, and output to the base of the NPN transistor T3 at a low level. The NPN transistor T3 is turned off, and the B pin connected to the OR gate chip U2 is high. At this time, no matter whether the microprocessor outputs a high level or a low level, the safety output signal can control the OUT pin of the intelligent high-side driver chip U1 to output power, ensuring that the controllers, sensors and actuators connected to this power pin can be powered normally.

[0037] In addition, the intelligent high-side driver chip U1 also provides a diagnostic enable pin DEN, and the microprocessor 20 can control the diagnostic function of the intelligent high-side driver chip U1 through the GPIO output; the sixth resistor R6 is pulled down to ensure that the fault diagnosis function of the intelligent high-side driver chip is disabled when the microprocessor works abnormally or is reset.

[0038] In an embodiment of the present invention, the intelligent high-side driver chip U1 has an analog current output function. It outputs a current signal through the IS function pin, which is converted into a voltage signal through the eighth resistor R8 sampling resistor. The IS function pin is electrically connected to the eighth resistor R8 and the ninth resistor R9, respectively. The other end of the eighth resistor R8 is electrically connected to the power ground. The tenth resistor R10 and the ninth resistor R9 are connected in series as current-limiting resistors to protect the ADC acquisition channel of the microprocessor 20 from damage caused by overvoltage, reverse polarity, and disconnection of the negative power supply. The cathode of the Zener diode D2 is electrically connected to the series node of the ninth resistor R9 and the tenth resistor R10. The anode of the Zener diode D2 is electrically connected to the power ground. The Zener diode D2 in the signal processing circuit is used to prevent overvoltage from damaging the microprocessor ADC acquisition channel. The thin film capacitor C7 in the signal processing circuit filters the voltage signal input to the microprocessor ADC acquisition channel. The filtering time constant is adjusted as needed to ensure that the voltage signal collected by the ADC is linearly correlated with the output current signal.

[0039] In addition, after the intelligent high-side driver chip diagnoses a fault and takes corresponding protection measures, the current value output by the analog output pin IS is a fixed fault current value, which is outside the current range of the actual power supply output; when the microprocessor detects that the output current value is within the fault state range, the fault type can be determined based on the status of the fault diagnosis enable pin DEN and the output control pin IN.

[0040] One possible implementation of the intelligent high-side driver chip provided by the present invention to control power distribution output is as follows: Figure 3 As shown, the positive power supply of the zone controller's power input (also known as the output of the primary distribution box) is filtered through an LC filter circuit consisting of the first inductor L1 and three large-capacity electrolytic capacitors C1, C2, and C3. It is then connected to a PMOS transistor T1 with an extremely low on-resistance for reverse polarity protection. The source output of PMOS transistor T1 is connected to the VS pin of the BTS70012-1ESP intelligent high-side driver chip U1, which provides internal power to the intelligent high-side driver chip and external power to the channel. A fifth thin-film capacitor C5 is connected near the VS pin to filter the power input to eliminate voltage spikes. The GND pin of the intelligent high-side driver chip U1 is connected to the negative voltage terminal V- of the previous stage via the third resistor R3. This resistor provides reverse voltage protection against input power overvoltage and when driving inductive loads. A fourth thin-film capacitor C4 is connected between the VS pin and the GND pin of the intelligent high-side driver chip U1 to provide some buffering during fast switching.

[0041] In an embodiment of the present invention, the intelligent high-side driver chip U1 supplies power to the controller, actuator or sensor in each area through the OUT output function pin. In order to realize the fault diagnosis when the output stops, the PNP transistor T2 and the first resistor R1 are added to the OUT output function pin for pull-up, and the second resistor R2 is added for pull-down. When the output stops, the PNP transistor T2 is turned on. If an open circuit fault occurs, the voltage of the OUT output function pin is the voltage divided by the VS function pin voltage after passing through the first resistor R1 and the second resistor R2; if a short circuit fault occurs to the power supply, the voltage of the OUT output function pin is the VS function pin voltage value; if no fault occurs, the OUT output function pin voltage value is pulled down by the load, and the voltage value is close to 0V. The sixth film capacitor C6, located near the output connector pin connected to the OUT output function pin, is used for electrostatic protection and high current injection protection. When static electricity is input to the output connector, it is first absorbed by the sixth film capacitor C6, providing electrostatic protection for the intelligent high-side driver chip. When the RF signal of the controller or actuator in each area is coupled to the power line, the sixth film capacitor C6 also plays a certain absorption role, reducing interference with the power line.

[0042] In this embodiment of the present invention, the U2 OR gate chip 30 processes the control signal output by the microprocessor 20 and the safety output signal of the power module 10, then provides a default off output through a pull-down resistor (5th resistor R5). This is then connected to the output control pin IN of the intelligent high-side driver chip U1 through a current-limiting resistor (4th resistor R4). The microprocessor output control uses GPIO, and the external circuit is connected to the A pin of the 74HC1G32 OR gate core U2 through a pull-down resistor (R11) and a current-limiting resistor (R12). When controlling the intelligent high-side driver chip U1 to drive external power, the microprocessor controls the GPIO to output a 3.3V high level, connecting the VCC pin of the OR gate chip U2 to a 3.3V power supply. After logic processing, the Y pin of the OR gate chip U2 outputs a 3.3V high level. After passing through the pull-down resistor (5th resistor R5) and the current-limiting resistor (4th resistor R4), the output pin OUT of the intelligent high-side driver chip U1 is controlled to supply external power. Only when the microprocessor controls the GPIO output to a low level, and the power module 10 output signal, after processing the circuit and then connected to the B pin of the OR gate chip U2, is also at a low level, will the output pin OUT of the intelligent high-side driver chip U1 stop supplying power. The microprocessor chip model used is S32G. Between the microprocessor 20 and the intelligent high-side driver chip 40, there are, but are not limited to, diagnostic control lines and current sampling lines. Between the OR gate chip 30 and the intelligent high-side driver chip 40, there are, but are not limited to, output control lines. Between the power module 10 and the input of the OR gate chip 30, there are, but are not limited to, safety output control lines.

[0043] Replacing traditional relay and fuse combinations with intelligent high-side driver chips not only reduces size and weight, but also lowers power dissipation by minimizing on-resistance, reducing electromagnetic radiation by eliminating switch jitter, and providing greater robustness against inrush currents and inductive loads. They also feature overcurrent, overtemperature, and reverse polarity protection, as well as current sampling and fault diagnosis capabilities, enabling rapid location of regional power supply faults. In the event of an overcurrent or short-circuit fault, they can limit current or shut down the output, restoring power after the fault is resolved without manually replacing fuses. Using this distributed regional power distribution module significantly reduces vehicle wiring harness complexity, lowering costs while enabling efficient and reliable regional power distribution management. Intelligent high-side driver chips feature supply voltage detection, shutting down the output when the supply voltage falls below a low-voltage threshold and triggering overvoltage protection when the supply voltage exceeds a high-voltage threshold. They also offer overcurrent and short-circuit protection, limiting the output current in the event of an overcurrent or short-circuit, restoring normal power supply after the fault is resolved. The overcurrent threshold is configurable via chip peripherals. An example of this approach is the Infineon BTG7090-2EPL intelligent high-side driver chip. The intelligent high-side driver chip has an output current sampling function, outputting analog values to the microprocessor's ADC acquisition channel and providing the microcontroller with the output current value of that channel. The intelligent high-side driver chip also has an over-temperature protection function, which monitors the chip temperature and the rate of temperature rise. When the threshold is exceeded, the power supply output of that channel is shut down. After the over-temperature protection function is triggered, attempts are made to restart the power supply at a certain frequency. If the fault is not resolved after the number of attempts reaches a set value, the channel output is shut down until the microcontroller unit shuts down the output via a control line for a set time, after which the output is re-enabled. The intelligent high-side driver chip also has a fault diagnosis function. When a fault is detected, the set analog value is output via the current sampling output channel to the microprocessor's ADC acquisition channel. The microcontroller can determine whether the intelligent high-side driver has detected a fault based on the ADC sampling value and the diagnostic control signal.

[0044] Example 2:

[0045] Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 In the illustrated embodiment, a method for implementing power distribution for an integrated power distribution module for a vehicle-use regional controller employs a two-level power distribution management model to manage the power distribution of the integrated power distribution module for a vehicle-use regional controller described in Example 1. The battery and the primary power distribution box are connected via two or more parallel positive and negative power lines. The primary power distribution box is connected to multiple regional controllers via power lines, with each regional controller performing two-level power distribution management for the electronic and electrical components within its area. To ensure regional power supply security, a backup battery and a backup primary power distribution box are added. The electrical connection between the backup battery and the backup primary power distribution box is the same as that between the battery and the primary power distribution box.

[0046] As described above, the present invention provides a method for implementing a regional controller integrated power distribution module, such as Figure 2 As shown, the primary power distribution input includes a primary power supply battery A10. Considering safety requirements, a backup primary power supply battery B10 is provided. Both primary power supply battery A10 and backup primary power supply battery B10 are connected to a unified power chip. One embodiment of the power chip is the NXP VR5510 power management chip, forming a power module 10. This power module 10 provides power to the microprocessor 20 and other peripheral chips. A window watchdog is integrated within the power module 10. The microprocessor 20 configures and feeds the watchdog via I2C bus communication. When the microprocessor 20 operates abnormally, the power module 10 triggers the microprocessor 20 to reset and return to normal operation by outputting a reset signal. It also outputs a safety control signal to control the intelligent high-side driver chip to maintain normal output. After the microprocessor resets and resumes normal operation, it stops outputting the safety control signal. The safety output control line and the microprocessor's output control line undergo a logical operation through an OR gate chip 30, which then outputs a control signal to the intelligent high-side driver chip 40 to control the power output.

[0047] The present invention aims at the development of future centralized network structure and distributed power distribution scheme, and integrates regional power distribution module in regional controller 30. Figure 2 As shown. This distributed power distribution solution adopts a hierarchical power distribution method. The battery A10 and the first-level distribution box A20 are connected through two or more parallel positive and negative power lines. The first-level distribution box A20 is connected to multiple regional controllers through power lines. The first-level distribution box A20 then performs primary power distribution to each regional controller. Each regional controller then performs secondary power distribution management for the electronic and electrical components in its area. The regional controllers include 01 regional controller A30, 02 regional controller A31, 03 regional controller A32, and 04 regional controller A33. Figure 2 Only four regional controllers are shown as a representative example. Of course, more regional controllers can be set according to the actual power distribution requirements of the vehicle. Figure 1 、 Figure 2 The V+ corresponding mark shown in the figure represents the positive pole of the power supply and its power lead, and the V- corresponding mark represents the negative pole of the power supply and its power lead.

[0048] Each area controller controls multiple electrical and electronic components A40 ( Figure 2As shown, the electronic and electrical components A40 from the 1st to the nth are arranged in a similar natural number sequence for secondary power distribution management; at the same time, considering the regional power supply safety, a backup battery B11 and a backup first-level distribution box B21 are added, and the electrical connection method between the backup battery B10 and the backup first-level distribution box B21 is the same as the electrical connection method between the battery 10 and the first-level distribution box B20.

[0049] The above is an embodiment of the integrated power distribution module of the regional controller of the present invention. An intelligent high-side driver chip with appropriate on-resistance and maximum current limit can be selected according to the power supply requirements in the area; it can be a single-channel intelligent high-side driver chip or an integrated multi-channel intelligent high-side driver chip, and is not limited to the chip models or chip series listed in this embodiment.

[0050] The above content and structure describe the basic principles, main features, and advantages of the product of the present invention, which should be understood by those skilled in the art. The above examples and description are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and modifications are intended to be within the scope of the invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A vehicle zone controller integrated power distribution module, characterized by: Including power modules, multi-core heterogeneous microprocessors and intelligent high-side driver chips; The multi-core heterogeneous microprocessor has multiple built-in microcontrollers and microprocessing units. The microcontroller unit uses a dual-core lock-step mode to handle regional power distribution software strategies with specific requirements for real-time performance and safety performance. The microprocessing unit communicates with the microcontroller unit via an internal bus and a message mechanism for pre-processing signals from onboard controllers or sensors within the area; The power module supplies power to the multi-core heterogeneous microprocessor and peripheral chips; The intelligent high-side driver chip is used for high-side output control, current collection and fault diagnosis; The power module has a built-in watchdog, which monitors the running status of the microprocessor software based on the question-and-answer communication of the time window, and controls the reset of the microprocessor through a reset signal when the microprocessor software runs abnormally; The power module provides a safety output signal. When the watchdog error count exceeds the set value or an internal fault occurs in the microprocessor hardware module, the power module outputs a safety output signal to control the intelligent high-side driver chip to continue to supply power to the outside. The power module safety output signal passes through a π-type RC filter circuit consisting of two capacitors and a resistor to remove harmonic interference in the circuit, and then is connected to an NPN transistor circuit for level inversion. The converted signal is connected to one input end of an OR gate circuit; the intelligent high-side drive control signal output by the microprocessor passes through a pull-down resistor and a current-limiting resistor and is connected to the other input end of the OR gate circuit. After the two control signals are logically processed by the OR gate circuit, they are used to control the output state of the intelligent high-side drive chip.

2. The vehicle zone controller integrated power distribution module according to claim 1, characterized in that: The positive pole of the power input of the zone controller is first electrically connected to the LC filter circuit, and then electrically connected to the P-channel MOSFET with extremely low resistance for reverse connection protection.

3. The vehicle zone controller integrated power distribution module according to claim 1, characterized in that: The power input pin of the intelligent high-side driver chip is connected to the emitter of the PNP transistor, and the collector of the PNP transistor is connected to the power supply output pin of the intelligent high-side driver chip after being connected in series with a resistor. A pull-down resistor is connected to the pin to detect an open circuit fault of the output pin and a short circuit fault to the power supply when the output is turned off.

4. The vehicle zone controller integrated power distribution module according to claim 1, characterized in that: The current analog signal output by the intelligent high-side driver chip is converted into a voltage signal through a sampling resistor, and then passes through a current limiting protection resistor and a Zener diode for overvoltage protection, and is connected to the analog-to-digital conversion channel of the microprocessor. The collected voltage signal is linearly correlated with the current signal output by the intelligent high-side driver chip.

5. A method for implementing power distribution of an integrated power distribution module in a vehicle zone controller, characterized by: A two-level power distribution management mode is adopted to realize the power distribution management of the integrated power distribution module of the vehicle regional controller according to one of claims 1 to 4, wherein the battery and the first-level distribution box are connected through two or more parallel positive power lines and negative power lines; the first-level distribution box is connected to multiple regional controllers through power lines respectively, and each regional controller performs two-level power distribution management on the electronic and electrical components in its area.

6. The method for implementing power distribution of an integrated power distribution module for a vehicle zone controller according to claim 5, characterized in that: Considering the regional power supply safety, a backup battery and a backup first-level distribution box are added. The electrical connection method between the backup battery and the backup first-level distribution box is the same as that between the battery and the first-level distribution box.

Citation Information

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