Method and structure for setting shielding film on chip

Abstract

The embodiment of the present application provides a chip shielding film setting method and a setting structure, the chip shielding film setting method comprises the following steps: the chip has a protection area, UV glue is coated on the protection area; a shielding film is covered on the chip coated with the UV glue; the UV glue is disglued, and the UV glue and the shielding film on the UV glue are removed together. When the UV glue is coated on the protection area, the coating thickness and the coating position of the UV glue can be accurately controlled, so that the UV glue can accurately protect the protection area, and the disgluing of the UV glue is convenient, and the application range of the chip shielding film setting method and the setting efficiency of the shielding film are improved.

Description

Technical Field

[0001] This application belongs to the field of electronic component technology, specifically, this application relates to a method and structure for setting a shielding film on a chip. Background Technology

[0002] With the continuous development of communication technology, chips are playing an increasingly important role in communication equipment. During use, to prevent interference from external electrical signals and radiation from the chip, a shielding layer is typically placed on the chip.

[0003] To facilitate signal transmission from components on the chip, a protected area that does not require a shielding layer needs to be set on the chip. This necessitates the formation of a shielding layer through selective sputtering. However, existing selective sputtering methods have strict requirements for the size of the protected area and are prone to shielding burrs around the protected area, reducing the applicability and shielding effectiveness of selective sputtering. Summary of the Invention

[0004] One objective of this application is to provide a new technical solution for a method and structure for setting a shielding film on a chip.

[0005] According to a first aspect of the embodiments of this application, a method for setting a shielding film on a chip is provided, comprising:

[0006] The chip has a protective area, and the protective area is coated with UV adhesive.

[0007] A shielding film is applied to the chip coated with UV adhesive;

[0008] The UV adhesive is debonded, causing the UV adhesive and the shielding film on it to fall off together.

[0009] Optionally, a metal layer may be disposed on the protected area before the UV adhesive is applied to the protected area.

[0010] Optionally, the metal layer includes at least one of a Cu layer, an Al layer, and a stainless steel layer.

[0011] Optionally, after applying UV adhesive to the protected area, the process further includes:

[0012] The UV adhesive is then cured.

[0013] Optionally, after curing the UV adhesive, the process further includes:

[0014] Cut the outer edge of the UV adhesive to smooth it out.

[0015] Optionally, the process of cutting the outer edge of the UV adhesive includes laser cutting, mechanical cutting, or plasma cutting.

[0016] Optionally, the chip has multiple protective regions, and each of the multiple protective regions is coated with the UV adhesive.

[0017] According to a second aspect of the embodiments of this application, a structure for setting a shielding film on a chip is provided, comprising:

[0018] A chip having a protective area coated with UV adhesive;

[0019] A shielding film covering the chip.

[0020] Optionally, the chip includes a substrate and a sub-chip disposed on the substrate, and the protection region is disposed on the substrate.

[0021] Optionally, a metal layer is provided between the protected area and the UV adhesive.

[0022] One technical advantage of the embodiments of this application is that:

[0023] This application provides a method for setting a shielding film on a chip. The method includes: the chip having a protective area; coating the protective area with UV adhesive; covering the chip with a shielding film; and removing the UV adhesive, causing the UV adhesive and the shielding film on it to detach together. When applying UV adhesive to the protective area, the coating thickness and position can be precisely controlled, allowing the UV adhesive to provide accurate protection for the protective area. Furthermore, the UV adhesive is easy to remove, improving the applicability and efficiency of the method for setting a shielding film on a chip.

[0024] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0026] Figure 1 A flowchart illustrating a method for setting a shielding film on a chip, as provided in an embodiment of this application;

[0027] Figure 2 A schematic diagram (excluding the shielding layer) of a chip shielding film arrangement structure provided in an embodiment of this application;

[0028] Figure 3 A schematic diagram illustrating the arrangement structure of a shielding film on a chip according to an embodiment of this application;

[0029] Figure 4 This is a schematic diagram illustrating the process of setting up a shielding film on a chip according to an embodiment of this application.

[0030] The components are: 1. Chip; 11. Substrate; 12. Sub-chip; 2. UV adhesive; 3. Shielding film; 4. Metal layer. Detailed Implementation

[0031] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0032] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0033] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0034] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0035] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0036] Reference Figure 1 and Figure 4 This application provides a method for setting a shielding film on a chip. The shielding film is formed on the chip by selective sputtering. The method for setting the shielding film on the chip includes:

[0037] S101. The chip has a protective area, and UV adhesive is coated on the protective area;

[0038] Specifically, to prevent interference from external electrical signals and radiation from the chip, a shielding film can be provided on the chip. However, to facilitate signal transmission of components on the chip, protective areas that do not need to be shielded can also be provided on the chip, allowing the shielding film to be formed by selective sputtering. After coating the protective areas with UV adhesive, the UV adhesive provides excellent protection for the protected areas, preventing the shielding layer from being directly applied to them. Moreover, the UV adhesive is easy to remove, allowing the exposed protective areas to effectively enable signal transmission and control of the components on the chip.

[0039] S102. Cover the chip coated with UV adhesive with a shielding film;

[0040] Specifically, the shielding film can be a copper or aluminum film, and is formed onto the chip using a sputtering process. Since the protective area on the chip is first coated with the UV adhesive, the shielding layer can be avoided from being directly applied to the protective area.

[0041] S103. De-adhesive the UV adhesive, causing the UV adhesive and the shielding film on the UV adhesive to fall off together.

[0042] Specifically, since the UV adhesive is disposed between the protective area and the shielding film, it can separate the area on the chip where the shielding film needs to be applied from the protective area. Furthermore, after the UV adhesive is applied to the protective area, the height of the protective area will be higher than the surrounding area, naturally separating the shielding film covering the UV adhesive from the shielding film covering the surrounding area, thus exposing the edge of the UV adhesive and facilitating the removal of the UV adhesive and the shielding film on it together. To ensure signal transmission through the protective area, the UV adhesive and shielding film on the protective area need to be removed. The UV adhesive can be removed through a debonding process, specifically by heating or by using solvents such as acetone. Simultaneously, the shielding film on the UV adhesive can detach along with the UV adhesive, thereby exposing the complete protective area.

[0043] Furthermore, the protected areas on the chip can take many forms, such as uneven, stepped shapes or irregularly shaped areas. The UV adhesive can be precisely applied using a dispensing machine to accurately coat the protected areas, avoiding the risk of over-plating of the shielding film and enabling coating of small-sized BGA (Ball Grid Array) products.

[0044] Furthermore, since the UV adhesive debonding process is simple and controllable, the chip can be coated with a shielding film on a single chip, or the entire board of chips can be coated with a shielding film simultaneously, thus improving the shielding film processing workflow.

[0045] The method for setting a shielding film on a chip provided in this application includes: the chip having a protective area; coating the protective area with UV adhesive; covering the chip with the UV adhesive and then covering it with a shielding film; and removing the UV adhesive, causing the UV adhesive and the shielding film on it to detach together. When applying UV adhesive to the protective area, the coating thickness and position of the UV adhesive can be precisely controlled, allowing the UV adhesive to accurately protect irregularly shaped areas. Furthermore, the UV adhesive is easy to remove, improving the applicability and efficiency of the method for setting a shielding film on a chip. In addition, the equipment required for the method for setting a shielding film on a chip provided in this application is simple and easy to operate, increasing the UPH (upper hourly output) of the shielding film setting and reducing the setting cost.

[0046] Optionally, see Figure 4 After applying UV adhesive to the protected area, the process further includes:

[0047] The UV adhesive is then cured.

[0048] Specifically, see Figure 4 In step S201, the UV adhesive is applied to the protected area in a liquid state. To prevent the UV adhesive from flowing, it can be rapidly cured by irradiating it with UV light. See [link to relevant documentation]. Figure 4 Step S202 in the process is to ensure that the UV adhesive provides complete protection for the protected area.

[0049] Optionally, see Figure 4 After the UV adhesive is cured, the process further includes:

[0050] Cut the outer edge of the UV adhesive to smooth it out.

[0051] Specifically, after the UV adhesive is applied to the protected area, it needs to be cured. During the curing process, burrs easily form on the edges of the UV adhesive. This causes burrs to appear on the UV adhesive burrs when the shielding film is formed on the UV adhesive, hindering the complete removal of the shielding film from the UV adhesive. Cutting the outer edge of the UV adhesive makes it smooth and flat, avoiding burrs (specifically, both UV adhesive burrs and shielding layer burrs) on the edge. It also facilitates a natural separation between the shielding film covering the UV adhesive and the shielding film surrounding the protected area, ensuring that both the shielding film and the UV adhesive can be completely removed from the protected area together. See details... Figure 4 Steps S203 to S205 in the process.

[0052] In addition, by controlling the cutting dimensions of the outer edge of the UV adhesive during cutting, such as the cutting depth, cutting width, and cutting depth-to-width ratio, the shielding film can be flexibly divided, improving the ease with which the shielding film can be removed from the UV adhesive.

[0053] Optionally, the process of cutting the outer edge of the UV adhesive includes laser cutting, mechanical cutting, or plasma cutting.

[0054] Specifically, laser cutting and plasma cutting can control the cutting depth based on the energy of the laser or the heat of the plasma arc, so as to cut the UV adhesive while ensuring the integrity of the chip; while mechanical cutting can also cut the UV adhesive while avoiding damage to the chip by controlling the cutting precision.

[0055] Optionally, see Figures 2 to 4 Before applying UV adhesive to the protected area, a metal layer is also provided on the protected area.

[0056] Specifically, since the protected area is located on the chip, it can be located on the chip's substrate. When cutting the outer edge of the UV adhesive, excessive cutting depth can easily damage the chip. For example, when the laser energy of laser cutting is high, it may cut into the chip, thereby damaging its structure. However, if a metal layer is placed on the protected area before applying the UV adhesive, the metal layer can be positioned between the UV adhesive and the chip, preventing the laser from penetrating the chip during cutting and ensuring the chip's integrity.

[0057] Optionally, the metal layer includes at least one of a Cu layer, an Al layer, and a stainless steel layer.

[0058] Specifically, because metal layers such as Cu, Al, and stainless steel have high structural strength and can absorb light waves generated by lasers, the metal layers can block the energy of laser cutting when the outer edge of the UV adhesive is cut, such as by laser cutting, thus preventing the laser from damaging the chip.

[0059] Optionally, the chip has multiple protective regions, and each of the multiple protective regions is coated with the UV adhesive.

[0060] Specifically, to realize the signal transmission and control functions in the chip, a large number of components can be set on the chip. This requires setting multiple protection areas on the chip to facilitate signal transmission of the components on the chip. The coating position and coating thickness of the UV adhesive can be flexibly controlled by a coating machine, so that the UV adhesive is coated on multiple protection areas, achieving independent protection for multiple protection areas.

[0061] See Figure 2 and Figure 3 This application embodiment also provides a structure for setting a shielding film on a chip, the structure including:

[0062] The chip 1 and the shielding film 3 are provided. The chip 1 has a protective area coated with UV adhesive 2. The shielding film 3 covers the chip 1 and the shielding film 3 on the protective area is removed together with the UV adhesive 2.

[0063] Specifically, since the protected area does not require a shielding film 3, the UV adhesive 2 and the shielding film 3 on it will detach together after the UV adhesive 2 is desorbed. When the UV adhesive 2 is applied to the protected area, the coating thickness and position of the UV adhesive 2 can be precisely controlled, allowing the UV adhesive 2 to provide accurate protection for irregularly shaped areas. Furthermore, the UV adhesive is easy to desorb, improving the applicability and efficiency of the shielding film 3 installation structure on the chip 1.

[0064] Optionally, see Figure 1 and Figure 2 The chip 1 includes a substrate 11 and a sub-chip 12 disposed on the substrate 11, and the protection area is disposed on the substrate 11.

[0065] Specifically, the sub-chip 12 can be connected to the copper solder joints on the substrate 11 via solder balls. In order to facilitate the transmission and control of signals by the sub-chip 12 through the copper solder joints on the substrate 11, a protective area can be provided on the substrate 11 to ensure the functionality of the sub-chip 12 and the integrity of the chip 1.

[0066] Optionally, see Figure 2 and Figure 3 A metal layer 4 is provided between the protected area and the UV adhesive 2.

[0067] Specifically, since the protected area is located on the chip 1, it can be located on the substrate 11 of the chip 1. When cutting the outer edge of the UV adhesive 2, if the cutting depth is too large, the chip 1 can easily be damaged. For example, if the laser energy of laser cutting is high, it may cut into the chip 1, thereby damaging the structure of the chip 1. However, if the metal layer 4 is provided on the protected area before applying the UV adhesive 2, the metal layer 4 can be placed between the UV adhesive 2 and the chip 1, avoiding penetration of the chip 1 during cutting and ensuring the integrity of the chip 1.

[0068] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A method for setting a shielding film on a chip, characterized in that, include: The chip has a protective area, and the protective area is coated with UV adhesive. A shielding film is applied to the chip coated with UV adhesive; The UV adhesive is debonded, causing the UV adhesive and the shielding film on the UV adhesive to fall off together; After the UV adhesive is cured, the process further includes: Cut the outer edge of the UV adhesive to smooth it out; Before applying UV adhesive to the protected area, a metal layer is also provided on the protected area; The metal layer is used to block the cutting; After the UV adhesive and the shielding film on the UV adhesive are removed together, the metal layer is also removed.

2. The method for setting a shielding film on a chip according to claim 1, characterized in that, The metal layer includes at least one of a Cu layer, an Al layer, and a stainless steel layer.

3. The method for setting a shielding film on a chip according to claim 1, characterized in that, After applying UV adhesive to the protected area, the process also includes: The UV adhesive is then cured.

4. The method for setting a shielding film on a chip according to claim 1, characterized in that, The process of cutting the outer edge of the UV adhesive includes laser cutting, mechanical cutting, or plasma cutting.

5. The method for setting a shielding film on a chip according to claim 1, characterized in that, The chip has multiple protective areas, and each of the multiple protective areas is coated with the UV adhesive.

6. A structure for setting a shielding film on a chip, characterized in that, Prepared using the setting method according to any one of claims 1-5, comprising: Chip (1), the chip (1) having a protective area coated with UV adhesive (2); A shielding film (3) covers the chip (1), and the shielding film (3) on the protected area peels off together with the UV adhesive (2); A metal layer (4) is provided between the protected area and the UV adhesive (2).

7. The chip shielding film arrangement structure according to claim 6, characterized in that, The chip (1) includes a substrate (11) and a sub-chip (12) disposed on the substrate (11), and the protection area is disposed on the substrate (11).

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