A horizontal immersion shower-type tin spraying machine

Abstract

This invention discloses a horizontal immersion spray-type tin plating machine, relating to the field of tin plating machines, comprising: a machine base; a tin cylinder installed inside the machine base, with its upper end positioned above the machine base; a pressurizing system fixedly installed on one side of the upper end of the tin cylinder and connected to the interior of the tin cylinder; a coating roller assembly fixedly installed on the upper end of the tin cylinder, the coating roller assembly including roller mounting seats fixedly installed on both sides of the upper end of the tin cylinder and roller groups, the roller groups being divided into drive roller groups and coating roller groups; a spray assembly installed on the upper end of the tin cylinder; and a leveling air knife assembly installed on one side of the upper end of the tin cylinder. The advantages of this invention are: high production speed, smooth and even tin surface after surface treatment, and uniform and adjustable tin thickness. It effectively solves the problems of uneven tin thickness and small aperture on the board surface after spraying by current vertical tin plating machines on the market, improving the working efficiency and yield of tin plating production and reducing production costs.

Description

Technical Field

[0001] This invention relates to the field of tin spraying machines, and more specifically to a horizontal immersion spray tin spraying machine. Background Technology

[0002] Hot air solder leveling is a step and process in PCB manufacturing. Specifically, the PCB is immersed in a molten solder bath, so that all exposed copper surfaces are covered with solder. Then, a hot air leveling device delivers air knives towards the PCB, and the strong hot air blown from the air knives removes excess solder from both sides of the PCB. Because the surface of the PCB after hot air soldering is the same material as solder paste, the soldering strength and reliability are better. However, existing vertical hot air soldering machines on the market have problems such as uneven solder thickness and small aperture, which affect the quality of PCB soldering and thus reduce the final production yield of the PCB. Summary of the Invention

[0003] To address the aforementioned technical issues, a horizontal immersion spray tinning machine is provided. This technical solution proposes a tinning machine with high production speed, smooth and even tin surface treatment, and adjustable tin thickness. This solves the problems of uneven tin thickness and small aperture on the board surface that occur with current vertical tinning machines on the market. It can improve the working efficiency and yield of tinning production and reduce production costs.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0005] A horizontal immersion spray tinning machine, comprising:

[0006] Base;

[0007] A soldering cylinder is installed inside the machine base, with its upper end positioned above the machine base.

[0008] A pressurizing system is fixedly installed on one side of the upper end of the solder bath and is connected to the inside of the solder bath;

[0009] A coating roller assembly is fixedly installed on the upper end of a soldering cylinder. The coating roller assembly includes roller mounting seats fixedly installed on both sides of the upper end of the soldering cylinder and several roller groups installed between the roller mounting seats on both sides. Each roller group consists of an upper roller and a lower roller. Both the upper roller and the lower roller are rotatably connected to the roller mounting seats. One end of the upper roller extends to the outside of the roller mounting seat and is fixedly connected to a drive gear. One end of the lower roller extends to the outside of the roller mounting seat and is fixedly connected to a driven gear. The drive gear and the driven gear mesh with each other. A coupling is fixedly connected to one side of the drive gear, and the coupling is connected to an external drive device for transmission.

[0010] A spray assembly, which is installed on the upper end of the solder bath;

[0011] A leveling air knife assembly is installed on one side of the upper end of the soldering cylinder.

[0012] Preferably, a pressure regulating base is fixedly connected to the upper end of the pressure roller mounting base at a position corresponding to the roller group. A pressure regulating rod is installed on the pressure regulating base. The lower end of the pressure regulating rod passes through the pressure roller mounting base and abuts against the upper roller. A pressure regulating nut is threaded onto the pressure regulating rod. A pressure regulating spring is sleeved on the pressure regulating rod. The two ends of the pressure regulating spring are respectively connected to the pressure regulating nut and the pressure regulating base.

[0013] Preferably, the solder bath includes a solder bath mounting base, a lower solder bath is fixedly mounted on the upper end of the solder bath mounting base, and an upper solder bath is fixedly mounted on the upper end of the lower solder bath. The upper solder bath consists of an outer upper solder bath and an inner upper solder bath, with the inner upper solder bath located inside the outer upper solder bath. A solder bath stirring tank is provided on one side of the upper solder bath, and a solder bath waste oil discharge tank is provided on one side of the stirring tank. A pressurization channel is provided on one side of the lower solder bath, and the lower solder bath is connected to the stirring tank through the pressurization channel.

[0014] Preferably, the pressurization system includes a molten tin pressurization pump, which is fixedly installed on the upper end of the molten tin mixing tank via a mounting plate, and the lower end of the molten tin pressurization pump is connected to the pressurization channel via a pressurization pipeline.

[0015] Preferably, the roller group is divided into a drive roller group and a coating roller group, and the coating roller group is installed in the tinning inner cylinder area.

[0016] Preferably, the spray assembly includes a spray pump, which is fixedly installed on the upper end of the tin bath stirring tank via a mounting plate. The lower end of the spray pump is connected to a spray plate mounting base via a spray pipe, and a plurality of spray plates are mounted on the upper end of the spray plate mounting base.

[0017] Preferably, the plurality of spray plates are respectively disposed between adjacent coating roller groups.

[0018] Preferably, the leveling air knife assembly includes an upper air knife assembly and a lower air knife assembly, with a gap between the upper air knife assembly and the lower air knife assembly to allow the PCB board to pass through.

[0019] Preferably, the upper air knife assembly includes an upper air cavity, upper air knife adjustment components are installed on both sides of the upper air cavity, an upper air hot air connector is fixedly installed on the outside of the upper air knife adjustment components, an upper air knife plate is installed at the lower end of the upper air cavity, the upper air knife plate communicates with the interior of the upper air cavity, and an upper air knife tip is formed at the lower end of the upper air knife plate.

[0020] Preferably, the lower air knife assembly includes a lower air cavity, lower air regulators are installed on both sides of the lower air cavity, lower air hot air connectors are symmetrically installed on both sides of the front side of the lower air cavity, a lower air knife plate is installed at the upper end of the lower air cavity, the lower air knife plate is connected to the interior of the lower air cavity, a lower air knife tip is opened at the lower end of the lower air knife plate, and the upper air knife tip and the lower air knife tip are arranged alternately opposite each other.

[0021] Compared with the prior art, the advantages of the present invention are as follows:

[0022] This invention uses an adjustable pressure coating roller assembly to adjust the coating pressure on the PCB board, thereby changing the tin spraying thickness on the PCB surface and achieving adjustable tin spraying thickness. The tin spraying thickness can be adjusted according to the actual PCB board specifications.

[0023] This invention adopts a tinning cylinder forming an outer cylinder surrounding an inner cylinder, which maintains the stability of the amount of tin inside the inner tinning cylinder, thereby ensuring the stability of the amount of tin during the tinning process of the PCB board and improving the production yield of the PCB.

[0024] The adjustable air knife pressure of this invention can be adapted to the PCB specifications to flatten excess solder on the PCB, making the solder surface on the PCB smooth and of suitable thickness, effectively ensuring the flatness of the PCB after soldering and ensuring the yield of the soldering process.

[0025] The spray assembly of the present invention supplies molten solder to the spray plate through a spray pump. While replenishing the molten solder in the tinning cylinder, it can also apply high-pressure molten solder to the upper surface of the PCB to enhance the tinning capability of the PCB, thereby improving the tinning process effect of the PCB. Attached Figure Description

[0026] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0027] Figure 2 This is a cross-sectional view of the present invention;

[0028] Figure 3 This is a three-dimensional structural diagram of the tin bath of the present invention;

[0029] Figure 4 This is a cross-sectional view of the solder bath of the present invention;

[0030] Figure 5 This is a three-dimensional structural diagram of the coating roller assembly in this invention;

[0031] Figure 6 The spray assembly in this invention;

[0032] Figure 7 This is a three-dimensional structural diagram of the leveling air knife assembly in this invention;

[0033] Figure 8 This is a side view of the leveling air knife assembly in this invention;

[0034] Figure 9 for Figure 8 A magnified view of a portion of point A in the middle.

[0035] The numbers on the map are:

[0036] 1. Base;

[0037] 2. Soldering bath; 201. Soldering bath mounting base; 202. Lower soldering bath; 2021. Pressurization channel; 203. Inner upper soldering bath; 204. Outer upper soldering bath; 205. Soldering bath mixing tank; 206. Soldering bath waste oil drain tank;

[0038] 3. Pressurization system; 301. Solder melt pressurization pump; 302. Pressurization pipeline;

[0039] 4. Coating roller assembly; 401. Upper roller; 402. Lower roller; 403. Pressure adjusting base; 404. Pressure adjusting rod; 405. Pressure adjusting nut; 406. Pressure adjusting spring; 407. Coupling; 408. Drive gear; 409. Driven gear;

[0040] 5. Spray assembly; 501. Spray pump; 502. Spray plate mounting base; 503. Spray piping; 504. Spray plate;

[0041] 6. Leveling air knife assembly; 601. Upper air cavity; 602. Upper air knife adjustment assembly; 603. Upper hot air connector; 604. Upper air knife plate; 6041. Upper air knife tip; 605. Lower air cavity; 606. Lower air regulator; 607. Lower hot air connector; 608. Lower air knife plate; 6081. Lower air knife tip. Detailed Implementation

[0042] The following description is intended to disclose the invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art.

[0043] Reference Figure 1-2 As shown, a horizontal immersion spray type tin plating machine is characterized by comprising:

[0044] Base 1;

[0045] Soldering bath 2 is installed inside the machine base 1, with its upper end positioned above the machine base 1. Please refer to [link / reference]. Figure 3-4As shown, the solder bath 2 includes a solder bath mounting base 201. A lower solder bath 202 is fixedly mounted on the upper end of the solder bath mounting base 201, and an upper solder bath is fixedly mounted on the upper end of the lower solder bath 202. The upper solder bath consists of an outer upper solder bath 204 and an inner upper solder bath 203. The inner upper solder bath 203 is located inside the outer upper solder bath 204. A solder bath stirring tank 205 is provided on one side of the upper solder bath, and a solder bath waste oil drain tank 206 is provided on one side of the stirring tank 205. A pressurization channel 2021 is opened on one side of the lower solder bath 202, and the lower solder bath 202 is connected to the stirring tank 205 through the pressurization channel 2021. A three-section solder bath structure design is adopted, with the solder bath designed as a lower... The tin bath 202, upper tin bath, and tin bath stirring tank 205 are separate structures. The lower tin bath 202 is used to store molten tin, the upper tin bath is used as a tin immersion tank for tin spraying, and the molten tin inside the tin bath stirring tank 205 is used for spraying tin. The lower tin bath 202 continuously supplies tin to the upper inner tin bath 203. When the amount of tin inside the upper inner tin bath 203 exceeds the set value, it overflows into the upper outer tin bath 204 and returns to the tin bath stirring tank 205 through the upper outer tin bath 204, thus maintaining the stability of the amount of tin inside the upper inner tin bath 203 and effectively ensuring the stability of the surface tin layer thickness of the PCB board during tin spraying.

[0046] The pressurizing system 3 is fixedly installed on one side of the upper end of the solder tank 2 and is connected to the inside of the solder tank 2. The pressurizing system 3 includes a solder liquid pressurizing pump 301, which is fixedly installed on the upper end of the solder tank stirring tank 205 through a mounting plate. The lower end of the solder liquid pressurizing pump 301 is connected to the pressurizing channel 2021 through a pressurizing pipe 302. The solder liquid pressurizing pump 301 pressurizes the pressurizing channel 2021 through the pressurizing pipe 302, so that the lower solder tank 202 continuously supplies solder to the upper solder inner tank 203, ensuring a stable amount of solder in the upper solder inner tank 203.

[0047] Coating roller assembly 4 is fixedly installed on the upper end of tin bath 2. Please refer to [link / reference]. Figure 5As shown, the coating roller assembly 4 includes roller mounting seats fixedly installed on both sides of the upper end of the solder cylinder 2 and several roller groups installed between the roller mounting seats on both sides. The roller group consists of an upper roller 401 and a lower roller 402. Both the upper roller 401 and the lower roller 402 are rotatably connected to the roller mounting seats. One end of the upper roller 401 extends to the outside of the roller mounting seat and is fixedly connected to a drive gear 408. One end of the lower roller 402 extends to the outside of the roller mounting seat and is fixedly connected to a driven gear 409. The drive gear 408 and the driven gear 409 mesh with each other. A coupling 407 is fixedly connected to one side of the drive gear 408. The coupling 407 is connected to an external drive device for transmission. When the PCB board is being coated with solder, the upper roller 401 is driven to rotate by the external drive device. The upper roller drives the lower roller 402 to rotate through the meshing drive gear 408 and driven gear 409, thereby moving the PCB. The roller group is divided into a transmission roller group and a coating roller group. The coating roller assembly is installed in the tinning cylinder 203 area. The coating roller assembly drives the PCB to be immersed in the tinning cylinder 203 for molten solder coating. A pressure regulating base 403 is fixedly connected to the upper end of the pressure roller mounting seat at the corresponding position of the roller assembly. A pressure regulating rod 404 is installed on the pressure regulating base 403. The lower end of the pressure regulating rod 405 passes through the pressure roller mounting seat and abuts against the upper roller 401. A pressure regulating nut 405 is threaded onto the pressure regulating rod 404. A pressure regulating spring 406 is sleeved on the pressure regulating rod 404. The two ends of the pressure regulating spring 406 are respectively connected to the pressure regulating nut 405 and the pressure regulating base 403. When adjusting the pressure of the roller assembly, the compression of the pressure regulating spring 406 is changed by rotating the pressure regulating nut 405, thereby adjusting the elastic force of the pressure regulating spring 406, so that the pressure of the roller assembly can be adjusted during coating, thereby changing the tin spray thickness on the PCB surface, and realizing adjustable spray coating thickness.

[0048] Spray assembly 5 is installed on the upper end of solder bath 2. Please refer to [link / reference]. Figure 6 As shown, the spray assembly 5 includes a spray pump 501, which is fixedly mounted on the upper end of the solder bath 205 via a mounting plate. The lower end of the spray pump 205 is connected to a spray plate mounting base 502 via a spray pipe 503. Several spray plates 504 are mounted on the upper end of the spray plate mounting base 502. The multiple spray plates 504 are respectively arranged between adjacent coating roller groups. The spray pump 501 supplies solder to the spray plates 504. While replenishing the solder bath in the soldering cylinder, it can also apply high-pressure solder to the upper surface of the PCB to enhance the soldering ability of the PCB, thereby improving the soldering effect of the PCB.

[0049] Leveling air knife assembly 6 is installed on one side of the upper end of solder bath 2. Please refer to [link / reference]. Figure 7-9As shown, the leveling air knife assembly 6 includes an upper air knife assembly and a lower air knife assembly, with a gap between them to allow the PCB board to pass through. The upper air knife assembly includes an upper air cavity 601, with upper air knife adjustment components 602 installed on both sides of the upper air cavity 601. An upper air hot air connector 603 is fixedly installed on the outside of the upper air knife adjustment components 602. An upper air blade 604 is installed at the lower end of the upper air cavity 601, communicating with the interior of the upper air cavity 1. An upper air blade tip 6041 is opened at the lower end of the upper air blade 604. The lower air knife assembly includes a lower air cavity 605, with lower air adjusters 606 installed on both sides of the lower air cavity 605. Lower air hot air connectors 607 are symmetrically installed on both sides of the front of the lower air cavity 605. A lower air blade 608 is installed on the upper end of the body 605. The lower air blade 608 is connected to the interior of the lower air cavity 605. A lower air blade tip 6081 is opened at the lower end of the lower air blade 608. The upper air blade tip 6041 and the lower air blade tip 6081 are staggered and opposite to each other. By the staggered blowing of the upper air blade tip 6041 and the lower air blade tip 6081, excess solder on the PCB can be efficiently leveled. The air pressure of the air blade is adjusted by the upper air blade adjustment component 602 and the lower air blade adjuster 606. The air pressure of the air blade can be adjusted according to the PCB specifications to level the excess solder surface on the PCB, making the solder surface on the PCB smooth and of suitable thickness. This effectively ensures the flatness of the PCB after the solder spraying process and ensures the yield of the PCB solder spraying process.

[0050] The working process of this invention is as follows: First, the molten tin is pressurized by the molten tin pressurization pump 301 through the pressurization pipeline 302 to the pressurization channel 2021, so that the molten tin inside the lower molten tin cylinder 202 is continuously supplied to the upper molten tin inner cylinder 203. When the molten tin height inside the upper molten tin inner cylinder 203 reaches half of the coating roller assembly, the molten tin inside the molten tin inner cylinder 203 overflows into the upper molten tin outer cylinder 204, and then returns to the molten tin cylinder stirring tank 205 through the upper molten tin outer cylinder 204. After that, the molten tin to be sprayed is... The PCB board is fed into the drive roller group. Driven by the drive roller group, the PCB board enters the coating roller group and is immersed in the molten solder in the tinning cylinder 203. At the same time, the spray pump 501 supplies molten solder to the spray plate 504 to spray the upper surface of the PCB. After the tinning is completed, the PCB enters the leveling air knife assembly 6. The upper air knife 6041 and the lower air knife 6081 blow against each other alternately to level the excess molten solder on the PCB surface. Then, the PCB is output from the tinning machine and flows into the next station.

[0051] In summary, the advantages of this invention are: fast production speed, smooth and flat tin surface, and uniform and adjustable tin thickness. It effectively solves the problems of uneven tin thickness and small aperture on the board surface after spraying by vertical tin spraying machines on the current market, and can improve the working efficiency and yield of tin spraying production, and reduce production costs.

[0052] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A horizontal immersion spray type tin spraying machine, characterized in that, include: Base (1); Soldering cylinder (2), the soldering cylinder (2) is installed inside the machine base (1), and the upper end of the soldering cylinder (2) is located above the machine base (1); A pressurizing system (3) is fixedly installed on one side of the upper end of the solder bath (2), and the pressurizing system (3) is connected to the inside of the solder bath (2); A coating roller assembly (4) is fixedly installed on the upper end of a tin cylinder (2). The coating roller assembly (4) includes roller mounting seats fixedly installed on both sides of the upper end of the tin cylinder (2) and a number of roller groups installed between the roller mounting seats on both sides. The roller group consists of an upper roller (401) and a lower roller (402). The upper roller (401) and the lower roller (402) are rotatably connected to the roller mounting seats. One end of the upper roller (401) extends to the outside of the roller mounting seat and is fixedly connected to a drive gear (408). One end of the lower roller (402) extends to the outside of the roller mounting seat and is fixedly connected to a driven gear (409). The drive gear (408) and the driven gear (409) mesh with each other. A coupling (407) is fixedly connected to one side of the drive gear (408). The coupling (407) is connected to an external drive device. Spray assembly (5), which is installed on the upper end of the tin bath (2); Leveling air knife assembly (6), the leveling air knife assembly (6) is installed on one side of the upper end of the solder bath (2); The solder bath (2) includes a solder bath mounting base (201), a lower solder bath (202) is fixedly mounted on the upper end of the solder bath mounting base (201), an upper solder bath is fixedly mounted on the upper end of the lower solder bath (202), the upper solder bath is composed of an upper outer solder bath (204) and an upper inner solder bath (203), the upper inner solder bath (203) is located inside the upper outer solder bath (204), a solder bath stirring tank (205) is provided on one side of the upper solder bath, a solder bath waste oil drain tank (206) is provided on one side of the solder bath stirring tank (205), a pressurization channel (2021) is opened on one side of the lower solder bath (202), and the lower solder bath (202) is connected to the solder bath stirring tank (205) through the pressurization channel (2021); The leveling air knife assembly (6) includes an upper air knife assembly and a lower air knife assembly, with a gap between the upper air knife assembly and the lower air knife assembly to allow the PCB board to pass through; The upper air knife assembly includes an upper air cavity (601), upper air knife adjustment components (602) are installed on both sides of the upper air cavity (601), an upper air hot air connector (603) is fixedly installed on the outside of the upper air knife adjustment components (602), an upper air knife plate (604) is installed at the lower end of the upper air cavity (601), the upper air knife plate (604) is connected to the inside of the upper air cavity (601), and an upper air knife tip (6041) is opened at the lower end of the upper air knife plate (604).

2. The horizontal immersion spray tinning machine according to claim 1, characterized in that, A pressure regulating base (403) is fixedly connected to the upper end of the pressure roller mounting seat at the position corresponding to the roller group. A pressure regulating rod (404) is installed on the pressure regulating base (403). The lower end of the pressure regulating rod (405) passes through the pressure roller mounting seat and abuts against the upper roller (401). A pressure regulating nut (405) is threaded onto the pressure regulating rod (404). A pressure regulating spring (406) is sleeved on the pressure regulating rod (404). The two ends of the pressure regulating spring are respectively connected to the pressure regulating nut (405) and the pressure regulating base (403).

3. The horizontal immersion spray tinning machine according to claim 2, characterized in that, The pressurization system (3) includes a molten tin pressurization pump (301), which is fixedly installed on the upper end of the tin tank stirring tank (205) by a mounting plate, and the lower end of the molten tin pressurization pump (301) is connected to the pressurization channel (2021) through a pressurization pipeline (302).

4. A horizontal immersion spray tinning machine according to claim 3, characterized in that, The roller group is divided into a drive roller group and a coating roller group, and the coating roller group is installed in the area of ​​the tinning inner cylinder (203).

5. A horizontal immersion spray tinning machine according to claim 4, characterized in that, The spray assembly (5) includes a spray pump (501), which is fixedly installed on the upper end of the tin bath stirring tank (205) by a mounting plate. The lower end of the spray pump (501) is connected to a spray plate mounting seat (502) through a spray pipe (503). Several spray plates (504) are installed on the upper end of the spray plate mounting seat (502).

6. A horizontal immersion spray tinning machine according to claim 5, characterized in that, Multiple spray plates (504) are respectively disposed between adjacent coating roller groups.

7. A horizontal immersion spray tinning machine according to claim 6, characterized in that, The lower air knife assembly includes a lower air cavity (605), with lower air regulators (606) installed on both sides of the lower air cavity (605). Lower air hot air connectors (607) are symmetrically installed on both sides of the front side of the lower air cavity (605). A lower air knife plate (608) is installed at the upper end of the lower air cavity (605). The lower air knife plate (608) is connected to the interior of the lower air cavity (605). A lower air knife tip (6081) is provided at the lower end of the lower air knife plate (608). The upper air knife tip (6041) and the lower air knife tip (6081) are arranged alternately and oppositely.

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