Non-contact communication medium

Abstract

The non-contact communication medium (1, 1A to 1K) based on the present disclosure has an electronic component (10) and a housing body. The electronic component (10) performs non-contact communication. The housing body (20, 20A to 20K) houses the electronic component (10). In addition, the housing body (20, 20A to 20K) has a main body portion (21, 21A, 21B, 21D, 21E, 21G, 21K), a peg portion (22, 22C, 22D, 22F, 22G, 22H, 22K), and an adhesive layer (23, 23J, 23K). The main body portion (21, 21A, 21B, 21D, 21E, 21G, 21K) has a housing hole (25A, 25B, 25D, 25E, 25G) that houses the electronic component (10). The peg portion (22, 22C, 22D, 22F, 22G, 22H, 22K) is inserted into the housing hole. The adhesive layer (23, 23J, 23K) is located between the inner peripheral surface of the housing hole (25A, 25B, 25D, 25E, 25G) and the outer peripheral surface of the peg portion, and serves to join the main body portion (21, 21A, 21B, 21D, 21E, 21G, 21K) and the peg portion (22, 22C, 22D, 22F, 22G, 22H, 22K).

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a non-contact communication medium. BACKGROUND

[0002] In the past, management of articles using RFID (Radio Frequency Identifier) tags has been performed.

[0003] Patent Document 1 discloses a technology in which, in order to use RFID tags for management of parts that are processed at high temperatures at factories and the like, the RFID tags are sealed with a housing body having thermal insulation. The housing body described in Patent Document 1 has a container that houses the RFID tag and a lid that is joined to the container. The housing body in which the RFID tag is sealed is attached to the part and flows along with the part in manufacturing processes.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT DOCUMENT

[0006] Patent Document 1: Japanese Patent Application Publication No. 2008-129838 SUMMARY

[0007] A non-contact communication medium according to an aspect of the present disclosure has an electronic component and a housing body. The electronic component performs non-contact communication. The housing body houses the electronic component. In addition, the housing body has a main body portion, a peg portion, and an adhesive layer. The main body portion has a housing hole that houses the electronic component. The peg portion is inserted into the housing hole. The adhesive layer is located between an inner peripheral surface of the housing hole and an outer peripheral surface of the peg portion, and serves to join the main body portion and the peg portion. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 is a plan view of a non-contact communication medium according to an embodiment.

[0009] Figure 2 is a cross-sectional view taken along the line II-II shown in Figure 1

[0010] Figure 3 is an enlarged cross-sectional view of a non-contact communication medium according to a first modification.

[0011] Figure 4 is an enlarged cross-sectional view of a non-contact communication medium according to a second modification.

[0012] Figure 5 is an enlarged cross-sectional view of a non-contact communication medium according to a third modification.

[0013] Figure 6 is a cross-sectional view taken along the line VI-VI shown in Figure 5

[0014] ​​Figure 7 is another example of a cross-sectional view in the direction of arrows VI-VI. Figure 5

[0015] Figure 8 is an enlarged cross-sectional view of the non-contact communication medium of the fourth modification example.

[0016] Figure 9 is another example of a cross-sectional view in the direction of arrows IX-IX. Figure 8

[0017] Figure 10 is an enlarged cross-sectional view of the non-contact communication medium of the fifth modification example.

[0018] Figure 11 is another example of a cross-sectional view in the direction of arrows XI-XI. Figure 10

[0019] Figure 12 is an enlarged cross-sectional view of the non-contact communication medium of the sixth modification example.

[0020] Figure 13 is an enlarged cross-sectional view of the non-contact communication medium of the seventh modification example.

[0021] Figure 14 is an enlarged cross-sectional view of the non-contact communication medium of the eighth modification example.

[0022] Figure 15 is an enlarged cross-sectional view of the non-contact communication medium of the ninth modification example.

[0023] Figure 16 is an enlarged cross-sectional view of the non-contact communication medium of the tenth modification example.

[0024] Figure 17 is a side view of the non-contact communication medium of the eleventh modification example.

[0025] Figure 18 is a plan view of the non-contact communication medium of the eleventh modification example.

[0026] Figure 19 is another example of a cross-sectional view in the direction of arrows XIX-XIX. Figure 18

[0027] Figure 20 is an enlarged cross-sectional view of the non-contact communication medium of the twelfth modification example.

[0028] Figure 21 is an enlarged cross-sectional view of the non-contact communication medium of the thirteenth modification example.

[0029] Figure 22 is an enlarged cross-sectional view of the non-contact communication medium of the fourteenth modification example. ​​​​

[0030] Figure 23 is an enlarged sectional view of a non-contact communication medium of a fifteenth modification.

[0031] Figure 24 is an enlarged sectional view of a non-contact communication medium of a sixteenth modification.

[0032] Figure 25 is an enlarged sectional view of a non-contact communication medium of a seventeenth modification.

[0033] Figure 26 is an enlarged sectional view of a non-contact communication medium of an eighteenth modification.

[0034] Figure 27 is an enlarged sectional view of a non-contact communication medium of a nineteenth modification.

[0035] Figure 28 is an enlarged sectional view of a non-contact communication medium of a twentieth modification. Figure 27 is a sectional view in the direction of the arrow XXVIII-XXVIII shown in Fig. 21.

[0036] Figure 29 is an enlarged sectional view of a non-contact communication medium of a twenty-first modification.

[0037] Figure 30 is an enlarged sectional view of a non-contact communication medium of a twenty-second modification. DETAILED DESCRIPTION

[0038] Hereinafter, the modes for implementing the non-contact communication medium based on the present disclosure (hereinafter, referred to as "embodiments") will be described in detail with reference to the drawings. Note that the non-contact communication medium based on the present disclosure is not limited to the present embodiments. In addition, the embodiments can be appropriately combined without causing contradiction in the processing content. In addition, the same reference numerals are given to the same portions in each of the embodiments below, and overlapping description is omitted.

[0039] In addition, in the embodiments shown below, expressions such as "always", "orthogonal", "perpendicular", or "parallel" are sometimes used, but these expressions do not need to be strictly "always", "orthogonal", "perpendicular", or "parallel". That is, each of the above expressions allows, for example, a deviation in manufacturing accuracy, setting accuracy, or the like.

[0040] In addition, in each of the drawings referred to below, in order to make the description easy to understand, the X-axis direction, the Y-axis direction, and the Z-axis direction orthogonal to each other are sometimes defined, and an orthogonal coordinate system in which the positive direction of the Z-axis is the vertical upward direction is shown.

[0041] <Structure of Non-Contact Communication Medium>

[0042] Referring to Figure 1 and Figure 2to explain the structure of the non-contact communication medium of the embodiment. Figure 1 is a plan view of the non-contact communication medium of the embodiment. Figure 2 is Figure 1 is a cross-sectional view taken along the line II-II in FIG. 1.

[0043] As shown in FIG. 2, the non-contact communication medium 1 of the embodiment has an electronic component 10 and a housing 20. The electronic component 10 is, for example, an RFID tag. Figure 1 Figure 2 The electronic component 10 as the RFID has, on a substrate composed of, for example, LTCC (Low Temperature Co-fired Ceramics) or the like, an antenna for non-contact communication, an IC chip that performs non-contact communication via the antenna, and a memory that stores identification information. The electronic component 10 as the RFID is capable of transmitting the identification information stored in the memory to an external device (for example, an RFID reader) by non-contact communication using electromagnetic induction, electric waves, or the like.

[0044] The non-contact communication medium 1 of the embodiment is sometimes used in a high-temperature environment exceeding the heat resistance temperature of the electronic component 10, for example. The non-contact communication medium 1 of the embodiment is mounted to a component that is subjected to plating processing, and is subjected to the plating processing together with the component, for example. The temperature of a plating solution such as molten galvanizing is, for example, 75°C to 500°C. In addition, the non-contact communication medium 1 of the embodiment is sometimes subjected to processing with an acidic or alkaline medicine together with the component. That is, the non-contact communication medium 1 of the embodiment is also used in an acid-alkali environment exceeding the medicine resistance of the electronic component 10.

[0045] Thus, in the non-contact communication medium 1 of the embodiment, in order to protect the electronic component 10 from the high-temperature environment and the acid-alkali environment, the electronic component 10 is sealed with the housing 20.

[0046] On the other hand, in a case where a container in which the electronic component is housed is simply sealed with a lid, there is a possibility that the joint portion between the container and the lid is peeled off during flow in a manufacturing process, for example. In view of this point, the non-contact communication medium 1 of the embodiment has a configuration in which the joint portion of the housing 20 is less likely to be peeled off.

[0047] The housing 20 has an adhesive layer 23, and a main body portion 21 and a peg portion 22 composed of ceramic. The main body portion 21 and the peg portion 22 are joined to each other via the adhesive layer 23.

[0048] The main body portion 21 has a cylindrical shape. The main body portion 21 has flat surfaces (an upper end surface and a lower end surface) that are circular in plan view at both ends, and has a curved surface (an outer peripheral surface) that connects the two end surfaces.

[0049] The main body portion 21 has a cylindrical shape. The main body portion 21 has flat surfaces (an upper end surface and a lower end surface) that are circular in plan view at both ends, and has a curved surface (an outer peripheral surface) that connects the two end surfaces. ​

[0050] A housing hole 25 that houses the electronic component 10 is formed in the first flat surface 211 of the both end surfaces of the main body 21. The housing hole 25 is opened in the central portion of the first flat surface 211. In addition, the housing hole 25 extends vertically with respect to the first flat surface 211. The housing hole 25 has a circular shape in plan view. In addition, the housing hole 25 is an elongated hole, and the opening diameter (length in the X-axis direction in FIG. 1) of the housing hole 25 is smaller than the depth (length in the Z-axis direction in FIG. 1) of the housing hole 25. Figure 2 Figure 2

[0051] The peg 22 has a cylindrical shape. The peg 22 has flat surfaces (upper end surface and lower end surface) of a circular shape in plan view at both ends, and has curved surfaces (outer peripheral surfaces) that connect the both end surfaces. The peg 22 has a circular shape in plan view that is the same as the shape in plan view of the housing hole 25, and is smaller in diameter than the shape in plan view of the housing hole 25.

[0052] The peg 22 is inserted into the housing hole 25. In the state of being inserted into the housing hole 25, the second flat surface 221 of the both end surfaces of the peg 22 is coplanar with the first flat surface 211 of the main body 21. In this way, the peg 22 is inserted in a nested manner with respect to the housing hole 25.

[0053] The adhesive layer 23 is positioned between the inner peripheral surface 251 of the housing hole 25 and the outer peripheral surface 222 of the peg 22. The adhesive layer 23 joins the main body 21 and the peg 22. Thereby, the housing hole 25 is plugged by the peg 22 and the adhesive layer 23. Also, the electronic component 10 housed in the housing hole 25 is sealed. The inside of the housing hole 25 plugged by the peg 22 and the adhesive layer 23 becomes a space. The electronic component 10 is disposed at a position away from the peg 22 and the adhesive layer 23.

[0054] In this way, the non-contact communication medium 1 of the embodiment has a configuration that seals the electronic component 10 inside the housing hole 25 by plugging the housing hole 25 with the peg 22. In the non-contact communication medium 1, the adhesive layer 23 that joins the main body 21 and the peg 22 is positioned between the inner peripheral surface 251 of the housing hole 25 and the outer peripheral surface 222 of the peg 22, that is, inside the housing hole 25. That is, the joining portion of the housing body 20, that is, the adhesive layer 23 is hardly exposed to the outside. Therefore, according to the non-contact communication medium 1 of the embodiment, peeling of the joining portion of the housing body 20 is less likely to occur.

[0055] In addition, in the non-contact communication medium 1 of the embodiment, the second flat surface 221 of the both end surfaces of the peg 22 that is exposed to the outside is coplanar with the first flat surface 211 of the main body 21. In this way, in the non-contact communication medium 1, the peg 22 is not bulged from the main body 21, and therefore, it is less likely that an impact is directly applied to the peg 22. Therefore, according to the non-contact communication medium 1, peeling of the joining portion of the housing body 20 is more unlikely to occur. ​​

[0056] In addition, in the non-contact communication medium 1 of the embodiment, the inside of the housing hole 25 blocked by the peg portion 22 and the adhesive layer 23 becomes a space (cavity). Also, the electronic component 10 is disposed at a position away from the adhesive layer 23. Therefore, heat from the outside is less likely to be transmitted to the electronic component 10.

[0057] As the ceramic constituting the main body portion 21 and the peg portion 22, cordierite, for example, can be used. Cordierite has a small coefficient of thermal expansion, and thus is excellent in thermal shock resistance. In addition, cordierite has a low thermal conductivity, and thus is less likely to transmit heat to the electronic component 10. In this way, by using cordierite, the electronic component 10 can be appropriately protected from a high-temperature environment. Note that the ceramic constituting the main body portion 21 and the peg portion 22 need not necessarily be cordierite. This point will be described later.

[0058] The adhesive layer 23 is constituted by an adhesive. The adhesive only needs to have heat resistance that can withstand the use environment of the non-contact communication medium 1. As such an adhesive, an inorganic adhesive, for example, can be used. In addition, as the adhesive, an adhesive obtained by adding a ceramic powder to an inorganic adhesive can also be used.

[0059] <Manufacturing Method>

[0060] Next, an example of a manufacturing method of the non-contact communication medium 1 of the embodiment will be described.

[0061] First, a powder of cordierite and a powder of a sintering aid are prepared. The sintering aid is, for example, a rare earth oxide (yttrium oxide, cerium oxide, etc.), an alkali metal oxide (lithium oxide, sodium oxide, etc.), an alkaline earth metal (calcium oxide). Note that instead of the powder of cordierite, a substance obtained by mixing magnesium oxide, aluminum oxide, and silicon oxide in a desired composition ratio of cordierite can also be used. Next, the prepared powders and water as a solvent are put into a vibration mill, and are pulverized and mixed to obtain a raw material.

[0062] Next, an organic component such as a binder, a plasticizer, and a release agent is added to the raw material obtained by pulverization and mixing. Thereafter, by stirring them, a slurry is prepared, and the prepared slurry is spray-dried using a spray dryer. Thus, a ceramic particle is obtained.

[0063] Next, the prepared ceramic particle is subjected to powder press forming, and a formed body of the main body portion 21 and the peg portion 22 is obtained.

[0064] Next, debinding is performed by heat-treating the shaped body in an atmospheric atmosphere, a vacuum atmosphere, or a nitrogen atmosphere. Thereafter, the main body portion 21 and the plug portion 22 are obtained by performing firing of the shaped body. Note that, in order to obtain a desired shape, the shaped body of the main body portion 21 and the plug portion 22 or the main body portion 21 and the plug portion 22 after firing can be subjected to a cutting or grinding process.

[0065] Next, after the electronic component 10 is housed in the housing hole 25, the plug portion 22 having the adhesive applied to the outer peripheral surface 222 is inserted into the housing hole 25. Thereby, the main body portion 21 and the plug portion 22 are joined via the adhesive layer 23, and the electronic component 10 housed in the housing hole 25 is sealed. The non-contact communication medium 1 of the embodiment is obtained by the above. Note that, in this case, the adhesive is applied in advance to the outer peripheral surface 222 of the plug portion 22, but the adhesive can be injected into the gap between the plug portion 22 and the housing hole 25 after the plug portion 22 is inserted into the housing hole 25.

[0066] <First Modification>

[0067] Figure 3 is an enlarged sectional view of a non-contact communication medium of a first modification. As shown in Figure 3 , the housing body 20A of the non-contact communication medium 1A of the first modification has a main body portion 21A.

[0068] The housing hole 25A of the main body portion 21A has a bottom surface 252A curved in a concave shape. In this way, the bottom surface 252A of the housing hole 25A is curved, whereby the housing hole 25A (the main body portion 21A) is less likely to be cracked when, for example, the housing body 20A is thermally expanded or thermally shrunk.

[0069] In addition, by curving the bottom surface 252A of the housing hole 25A, the contact area between the bottom surface 252A of the housing hole 25A and the electronic component 10 can be reduced. Thus, heat conduction from the main body portion 21A to the electronic component 10 can be suppressed.

[0070] <Second Modification>

[0071] Figure 4 is an enlarged sectional view of a non-contact communication medium of a second modification. As shown in Figure 4 , the housing body 20B of the non-contact communication medium 1B of the second modification has a main body portion 21B.

[0072] The housing hole 25B of the main body portion 21B has a corner portion 253B curved in a concave shape between a bottom surface 252B, which is, for example, a flat surface, and an inner peripheral surface 251B.

[0073] Thus, the corner 253B between the bottom surface 252B and the inner peripheral surface 251B is bent, and thus the housing hole 25B (the main body portion 21B) is less likely to be cracked when, for example, the housing body 20B is thermally expanded or contracted.

[0074] <Third Modification>

[0075] Figure 5 is a magnified cross-sectional view of the non-contact communication medium of the third modification. Also, Figure 6 is Figure 5 is a cross-sectional view taken along the VI-VI line shown in FIG. 6. As shown in Figure 5 , the housing body 20C of the non-contact communication medium 1C of the third modification has a peg portion 22C.

[0076] The peg portion 22C of the third modification has a plurality of first protrusions 223C protruding from the outer peripheral surface 222C. As shown in Figure 6 , the plurality of (three in this case) first protrusions 223C are arranged equidistantly in the circumferential direction with respect to the outer peripheral surface 222C.

[0077] Thus, the plurality of first protrusions 223C are provided to the outer peripheral surface 222C of the peg portion 22C, and thus the bias (eccentricity) of the peg portion 22C in the housing hole 25 can be suppressed. Thus, the gap between the housing hole 25 and the peg portion 22C is equidistant, and a portion where the adhesive layer 23 is thin is less likely to occur. Therefore, the joint portion of the housing body 20C is less likely to be peeled.

[0078] Here, an example of a case where the first protrusions 223C are in contact with the inner peripheral surface 251 of the housing hole 25 is shown. However, the first protrusions 223C do not necessarily need to be in contact with the inner peripheral surface 251 of the housing hole 25. Also, here, an example of a case where the peg portion 22C has three first protrusions 223C is shown. The number of the first protrusions 223C is not limited to this, and can be at least two or more. For example, in a case where the number of the first protrusions 223C is two, the two first protrusions 223C can be arranged at an interval of 180 degrees with respect to the outer peripheral surface 222C of the peg portion 22C.

[0079] Also, here, an example of a case where the peg portion 22C has a plurality of first protrusions 223C is shown. The peg portion 22C can also have a flange portion 228C (refer to Figure 7 ) protruding from the outer peripheral surface 222C over the entire circumference of the outer peripheral surface 222C. In this case as well, the bias of the peg portion 22C in the housing hole 25 can be suppressed. Also, by being provided in a flange shape, the invasion of plating liquid or the like into the inside of the housing hole 25 can be suppressed. Note that the non-contact communication medium 1C can also have a gap between the inner peripheral surface 251 of the housing hole 25 and the flange portion 228C.

[0080] <Fourth Modification>

[0081] Figure 8 is an enlarged sectional view of the non-contact communication medium of the fourth modification. In addition, Figure 9 is Figure 8 is a sectional view taken along the IX-IX line shown in FIG. 10. As Figure 8 indicated, the housing body 20D of the non-contact communication medium ID of the fourth modification has a main body portion 21D.

[0082] The housing hole 25D of the main body portion 21D has a plurality of second protrusions 254D protruding from the inner peripheral surface 251D. As Figure 9 indicated, the plurality of (three in this case) second protrusions 254D are arranged equidistantly in the circumferential direction with respect to the inner peripheral surface 251D of the housing hole 25D.

[0083] In this way, the plurality of second protrusions 254D are provided to the inner peripheral surface 251D of the housing hole 25D, whereby the skew of the peg portion 22 within the housing hole 25D can be suppressed. As a result, the gap between the housing hole 25 and the peg portion 22C is equidistant, and a portion where the adhesive layer 23 is thin is less likely to occur. Therefore, the joint portion of the housing body 20C is less likely to peel off.

[0084] In addition, the plurality of second protrusions 254D protrude to a position where the peg portion 22 is repeated under the sectional view shown in Figure 9 and come into abutment with the front end surface of the peg portion 22. The electronic component 10 is arranged at a position inside the housing hole 25D from the abutment surface of the second protrusion 254D with the peg portion 22. Therefore, according to the non-contact communication medium ID, when the peg portion 22 is inserted into the housing hole 25D in, for example, a manufacturing process of the non-contact communication medium ID, the front end of the peg portion 22 does not unintentionally come into contact with the electronic component 10, and the electronic component 10 is less likely to be damaged.

[0085] Note that the plurality of second protrusions 254D can be formed integrally with the main body portion 21D. In addition, the plurality of second protrusions 254D can be attached to the main body portion 21D. In the case of being attached to the main body portion 21D, the plurality of second protrusions 254D do not necessarily need to be composed of ceramic. For example, the plurality of second protrusions 254D can be formed of resin or the like having flexibility compared to ceramic.

[0086] < Fifth Modification >

[0087] Figure 10 is an enlarged sectional view of the non-contact communication medium of the fifth modification. In addition, Figure 11 is Figure 10 is a sectional view taken along the XI-XI line shown in FIG. 18. As Figure 10 and Figure 11As shown, the housing 20E of the non-contact communication medium 1E of the fifth modification example has a main body portion 21E.

[0088] The housing hole 25E of the main body portion 21E has a step face 255E extending from the inner peripheral face 251E. In the fifth modification example, the electronic component 10 is disposed at a position further from the opening of the housing hole 25E than the step face 255E. Specifically, the electronic component 10 is disposed on the bottom face 252E of the housing hole 25E.

[0089] Thus, by providing the step face 255E inside the housing hole 25E, it is possible to lengthen the extension distance of the housing hole 25E. Thus, even in the case where a liquid such as plating solution or a gas such as corrosive gas intrudes from the outside into the inside of the housing hole 25E, such a liquid or gas is less likely to reach the electronic component 10. Therefore, it is possible to inhibit a liquid or a gas from the outside from coming into contact with the electronic component 10.

[0090] In addition, the housing 20E of the fifth modification example has a lid portion 27E placed on the step face 255E. The lid portion 27E is composed of, for example, ceramic. The lid portion 27E is fixed inside the housing hole 25E by being sandwiched by the step face 255E and the front end face of the peg portion 22, and plugs the space between the step face 255E and the bottom face 252E inside the housing hole 25E, that is, the space in which the electronic component 10 is housed.

[0091] Thus, by placing the lid portion 27E on the step face 255E, it is possible to double-seal the electronic component 10. Thus, even in the case where a liquid or a gas intrudes from the outside into the inside of the housing hole 25E, it is possible to protect the electronic component 10 from the influence of such a liquid or gas.

[0092] <Sixth Modification Example>

[0093] Figure 12 is an enlarged sectional view of a non-contact communication medium of a sixth modification example. As shown, the housing 20F of the non-contact communication medium 1F of the sixth modification example has a peg portion 22F. Figure 12

[0094] The housing 20F of the sixth modification example fixes the electronic component 10 by sandwiching the electronic component 10 by the front end face 224F of the peg portion 22F and the bottom face 252 of the housing hole 25. Thus, it is possible to inhibit the electronic component 10 from moving inside the housing hole 25.

[0095] The inside of the housing hole 25 is a space, and the electronic component 10 does not come into contact with members other than the front end face 224F of the peg portion 22F and the bottom face 252 of the housing hole 25, such as a filler or the like. Therefore, compared to the case where the electronic component 10 is fixed by a filler or the like, heat from the outside is less likely to be transmitted to the electronic component 10. ​

[0096] Thus, the configuration in which the electronic component 10 is sandwiched by the front end surface 224F of the peg portion 22F and the bottom surface 252 of the housing hole 25 is provided, whereby heat conduction to the electronic component 10 can be suppressed, while suppressing damage such as breakage of the electronic component 10.

[0097] In addition, the front end surface 224F of the peg portion 22F is curved toward the bottom surface 252 of the housing hole 25, in other words, toward the electronic component 10. Thereby, the contact area between the peg portion 22F and the electronic component 10 can be reduced. Thus, heat conduction from the peg portion 22F to the electronic component 10 can be suppressed.

[0098] <Seventh Modification>

[0099] Figure 13 is a magnified cross-sectional view of a non-contact communication medium of a seventh modification. As shown in Figure 13 The housing body 20G of the non-contact communication medium 1G of the seventh modification has a main body portion 21G and a peg portion 22G.

[0100] The housing hole 25G of the main body portion 21G of the seventh modification has a plurality of third protrusions 256G protruding from the bottom surface 252G. In addition, the peg portion 22G of the seventh modification has a plurality of fourth protrusions 225G protruding from the front end surface 224G.

[0101] In the seventh modification, the electronic component 10 becomes a state of being sandwiched by the plurality of third protrusions 256G provided to the bottom surface 252G of the housing hole 25G and the plurality of fourth protrusions 225G provided to the peg portion 22G.

[0102] Thereby, the contact area between the electronic component 10 and the main body portion 21G and the contact area between the electronic component 10 and the peg portion 22G can be reduced. Thus, heat conduction from the main body portion 21G or the peg portion 22D to the electronic component 10 can be suppressed, and movement of the electronic component 10 can be suppressed. In addition, by housing the electronic component 10 between the two third protrusions 256G, positional displacement of the electronic component 10 can be suppressed.

[0103] Here, an example of a case in which the plurality of third protrusions 256G are provided to the bottom surface 252G of the housing hole 25G is shown. This is not limiting, and the main body portion 21G can have at least one third protrusion 256G. In addition, here, an example of a case in which the plurality of fourth protrusions 225G are provided to the front end surface 224G of the peg portion 22G is shown. This is not limiting, and the peg portion 22G can have at least one fourth protrusion 225G.

[0104] Also, here, an example in which protrusions (third protrusions 256G and fourth protrusions 225G) are provided on both the housing hole 25G and the peg portion 22G is shown. The protrusions can be provided on only one of the housing hole 25G and the peg portion 22G, not limited to this.

[0105] <eighth modification>

[0106] Figure 14 is an enlarged cross-sectional view of a non-contact communication medium of an eighth modification. As shown in Figure 14 The housing body 20H of the non-contact communication medium 1H of the eighth modification has a peg portion 22H.

[0107] The front end surface of the peg portion 22H of the eighth modification is recessed, and the recessed surface 226H is, for example, a flat surface.

[0108] In the eighth modification, the edge portion 227H located at the outer periphery of the recessed surface 226H is in contact with the bottom surface 252 of the housing hole 25, and the electronic component 10 is in a state of being housed in the recessed portion of the peg portion 22H.

[0109] Thus, the peg portion 22H of the eighth modification can reduce the amount of movement of the electronic component 10 in the housing hole 25 by housing the electronic component 10 in the recessed portion of the peg portion 22H. Thus, it is possible to suppress damage such as breakage of the electronic component 10.

[0110] <ninth modification>

[0111] Figure 15 is an enlarged cross-sectional view of a non-contact communication medium of a ninth modification. As shown in Figure 15 The housing body 20J of the non-contact communication medium 1J of the ninth modification has an adhesive layer 23J.

[0112] The adhesive layer 23J of the ninth modification overflows from the housing hole 25. The adhesive layer 23J overflows in a ring shape from the gap between the main body portion 21 and the peg portion 22. Note that the adhesive layer 23J can overflow from at least a part of the circumference of the housing body 20J.

[0113] Thus, the adhesive layer 23J overflows from the housing hole 25, and as a result, the main body portion 21 and the peg portion 22 can be more firmly joined.

[0114] <10th modification>

[0115] Figure 16 is an enlarged cross-sectional view of a non-contact communication medium of a tenth modification. As shown in Figure 16As shown, the tenth variation of the contactless communication medium 1K has a spherical housing 20K. Specifically, the main body 21K has a hemispherical shape, and the end face 221K of the plug 22K is curved along the spherical surface of the main body 21K. They are joined by means of an adhesive layer 23K, thereby obtaining a spherical housing 20K.

[0116] This makes the containment body 20K a spherical shape without corners, thereby further suppressing damage such as defects or breakage of the containment body 20K.

[0117] <Variations related to press-fit construction of electronic components>

[0118] Therefore, in conventional technologies, electronic components such as RFID tags can be damaged or broken due to movement within the housing space. There is room for further improvement in mitigating this situation. Consequently, contactless communication media can also have a structure that allows electronic components to be pressed in.

[0119] <Eleventh Variation>

[0120] First, refer to Figures 17-19 This will be used to illustrate the structure of the non-contact communication medium in the eleventh modified example having the above-described press-fit construction. Figure 17 This is a side view of the contactless communication medium in the eleventh variation. Additionally, Figure 18 This is a top view of the contactless communication medium in the eleventh variation. Additionally, Figure 19 yes Figure 18 The cross-sectional view shown in the XIX-XIX line.

[0121] It should be noted that the press-fit structure of the electronic component 10 shown in the eleventh to twenty-first modifications below can be appropriately assembled with the contactless communication medium of the above-described embodiments and the first to tenth modifications.

[0122] like Figures 17-19 As shown, the contactless communication medium 1L of the eleventh variation has an electronic component 10 and a housing 200. The electronic component 10 is, for example, an RFID tag.

[0123] The housing 200 has an adhesive layer 230, and a first base material 210 and a second base material 220 made of ceramic. The first base material 210 and the second base material 220 are joined to each other by the adhesive layer 230. Specifically, the first base material 210 and the second base material 220 have flat surfaces 210a, 220a of substantially the same diameter that face each other. Of the first base material 210 and the second base material 220, the flat surfaces 210a, 220a thereof are joined by the adhesive layer 230. Hereinafter, the flat surface 210a of the first base material 210 is described as "first flat surface 210a", and the flat surface 220a of the second base material 220 is described as "second flat surface 220a".

[0124] The first base material 210 has a housing recess 250 that houses the electronic component 10. The housing recess 250 is open at a central portion of the first flat surface 210a. The first flat surface 210a is blocked by the second flat surface 220a of the second base material 220. Thus, the electronic component 10 is sealed inside the housing 200.

[0125] The adhesive layer 230 is made of an adhesive. The adhesive has only heat resistance that can withstand the use environment of the non-contact communication medium 1L.

[0126] The first base material 210 and the second base material 220 each have a cylindrical shape. Specifically, the first base material 210 and the second base material 220 have flat surfaces (upper end surface and lower end surface) that are circular in plan view at both ends, and have curved surfaces (outer peripheral surfaces) that connect the upper end surface and the lower end surface. The adhesive layer 230 is located between the first flat surface 210a that is the upper end surface of the first base material 210 and the second flat surface 220a that is the lower end surface of the second base material 220. The first base material 210 and the second base material 220 joined by the adhesive layer 230 have a cylindrical shape as a whole (so-called coin type).

[0127] The housing recess 250 is located at the first flat surface 210a of the first base material 210. The electronic component 10 is housed in such a housing recess 250. The inside of the housing recess 250 is a space, and a filler or the like is not located inside the housing recess 250.

[0128] As shown in FIG. 1, the second base material 220 has a housing protrusion 260 that protrudes from the second flat surface 220a into the housing recess 250. Figure 19

[0129] ​Thus, the housing protrusion 260 enters the inside of the housing recess 250, whereby the inside space of the housing recess 250 can be narrowed. Since the inside space of the housing recess 250 is narrowed, even if the electronic component 10 is assumed to move within the inside space of the housing recess 250, the amount of movement thereof is small. Therefore, according to the non-contact communication medium 1L of the eleventh modification example, it is possible to suppress the case where the electronic component 10 is damaged by being moved within the housing recess 250.

[0130] In addition, the non-contact communication medium 1L of the eleventh modification example sandwiches the electronic component 10 with the front end surface 260a of the housing protrusion 260 and the bottom surface 250a of the housing recess 250. Thus, it is possible to suppress the movement of the electronic component 10 within the housing recess 250. In addition, the inside of the housing recess 250 is a space, and the electronic component 10 does not contact with members other than the front end surface 260a of the housing protrusion 260 and the bottom surface 250a of the housing recess 250 (for example, a filler or the like). Therefore, compared to the case where the electronic component 10 is fixed by a filler or the like, heat from the outside is less likely to be transmitted to the electronic component 10.

[0131] Thus, the configuration in which the electronic component 10 is sandwiched with the front end surface 260a of the housing protrusion 260 and the bottom surface 250a of the housing recess 250, whereby it is possible to suppress the heat conduction to the electronic component 10, and to suppress the damage of the electronic component 10.

[0132] In addition, the front end surface 260a of the housing protrusion 260 of the eleventh modification example is curved toward the bottom surface 250a of the housing recess 250, that is, toward the electronic component 10. Thus, it is possible to reduce the contact area between the housing protrusion 260 and the electronic component 10. Therefore, it is possible to suppress the heat conduction from the second substrate 220 to the electronic component 10.

[0133] <Twelfth Modification Example>

[0134] Figure 20 FIG. 12 is an enlarged sectional view of a non-contact communication medium according to a twelfth modification example. As shown in FIG. 12, the housing body 200M of the non-contact communication medium 1M according to the twelfth modification example has a second substrate 220M. Figure 20

[0135] The front end surface of the housing protrusion 260M of the second substrate 220M is recessed in a curved surface shape, and at least a part of the electronic component 10 is housed in the recessed portion. In the twelfth modification example, the electronic component 10 is in point contact with the recessed surface 260M1 of the housing protrusion 260M. The electronic component 10 is in a state of being sandwiched by the recessed surface 260M1 and the bottom surface 250a of the housing recess 250.

[0136] ​In this way, the front end surface of the housing protrusion 260M can also be recessed. In this case, the contact area between the electronic component 10 and the housing protrusion 260M can be reduced. Therefore, heat conduction from the second substrate 220M to the electronic component 10 can be suppressed, and movement of the electronic component 10 can be suppressed.

[0137] <Thirteenth Modification>

[0138] Figure 21 is an enlarged sectional view of a non-contact communication medium of the thirteenth modification. As shown in Figure 21 the housing 200N of the non-contact communication medium IN of the thirteenth modification has a second substrate 220N.

[0139] The front end surface of the housing protrusion 260N of the second substrate 220N is recessed. This recessed surface 260N1 is, for example, a flat surface. The electronic component 10 is in surface contact with such a recessed surface 260N1, and is in a state of being sandwiched by the recessed surface 260N1 and the bottom surface 250a of the housing recess 250.

[0140] In this way, the electronic component 10 is in surface contact with the housing protrusion 260N, and thus movement of the electronic component 10 can be more reliably suppressed. In addition, the edge portion 260N2 located at the outer periphery of the recessed surface 260N1 protrudes toward the bottom surface 250a of the housing recess 250 more than the recessed surface 260N1. Therefore, even if the electronic component 10 moves, by the electronic component 10 hitting the edge portion 260N2, the amount of movement of the electronic component 10 can be reduced, and damage such as breakage of the electronic component 10 can be suppressed.

[0141] <Fourteenth Modification>

[0142] Figure 22 is an enlarged sectional view of a non-contact communication medium of the fourteenth modification. As shown in Figure 22 the housing 200P of the non-contact communication medium IP of the fourteenth modification has a second substrate 220P.

[0143] The front end surface of the housing protrusion 260P of the second substrate 220P is recessed. This recessed surface 260P1 is a flat surface.

[0144] In the fourteenth modification, the edge portion 260P2 located at the outer periphery of the recessed surface 260P1 is in contact with the bottom surface 250a of the housing recess 250, and the electronic component 10 is in a state of being completely housed in the recessed portion of the housing protrusion 260P.

[0145] Thus, the edge portion 260P2 of the housing protrusion 260P can also come into contact with the bottom surface 250a of the housing recess 250. In this case, the housing protrusion 260P also functions as a spacer that defines the interval between the first flat surface 210a and the second flat surface 220a. Therefore, according to the non-contact communication medium 1P of the fourteenth modification example, it is possible to suppress a variation in the thickness of the adhesive layer 230 among a plurality of non-contact communication media 1P. In other words, it is possible to suppress a variation in quality among a plurality of non-contact communication media 1P.

[0146] < Fifteenth Modification Example >

[0147] Figure 23 is a magnified cross-sectional view of a non-contact communication medium of a fifteenth modification example. As shown in Figure 23 , the housing body 200Q that the non-contact communication medium 1Q of the fifteenth modification example has has a second substrate 220Q.

[0148] The housing protrusion 260Q that the second substrate 220Q has has a plurality of protrusions 260Q1 that protrude from the front end surface. In the fifteenth modification example, the electronic component 10 is in a state of being sandwiched by the plurality of protrusions 260Q1 and the bottom surface 250a of the housing recess 250.

[0149] Here, an example of a case where the plurality of protrusions 260Q1 are provided on the front end surface of the housing protrusion 260Q is shown, but the housing protrusion 260Q can have at least one protrusion 260Q1.

[0150] Thus, the housing protrusion 260Q can also have at least one protrusion 260Q1 that protrudes from the front end surface. In this case, it is also possible to reduce the contact area between the electronic component 10 and the housing protrusion 260Q. Therefore, it is possible to suppress heat conduction from the second substrate 220Q to the electronic component 10 and to suppress movement of the electronic component 10.

[0151] In addition, by providing the plurality of protrusions 260Q1, the housing protrusion 260Q comes into contact with the electronic component 10 at multiple points. Thereby, it is possible to reduce the contact area between the electronic component 10 and the housing protrusion 260Q and to more reliably suppress movement of the electronic component 10.

[0152] < Sixteenth Modification Example >

[0153] Figure 24 is a magnified cross-sectional view of a non-contact communication medium of a sixteenth modification example. As shown in Figure 24 , the housing body 200R that the non-contact communication medium 1R of the sixteenth modification example has has, for example, the same second substrate 220Q as the fifteenth modification example.

[0154] In addition, the housing 200R of the sixteenth modification example has the first base material 210R. The first base material 210R has the housing recessed portion 250R. The housing recessed portion 250R has a plurality of protrusions 250R1 protruding from the bottom surface 250a. In the sixteenth modification example, the electronic component 10 becomes a state of being sandwiched by the plurality of protrusions 260Q1 provided to the housing protruded portion 260Q and the plurality of protrusions 250R1 provided to the housing recessed portion 250R.

[0155] Here, an example in which the plurality of protrusions 250R1 is provided to the bottom surface 250a of the housing recessed portion 250R is shown, but the housing recessed portion 250R can have at least one protrusion 250R1.

[0156] In this way, the housing recessed portion 250R can also have at least one protrusion 250R1 protruding from the bottom surface 250a. In this case, it is also possible to reduce the contact area between the electronic component 10 and the housing recessed portion 250R. Therefore, it is possible to suppress the heat conduction from the first base material 210R to the electronic component 10, and to suppress the movement of the electronic component 10.

[0157] In addition, by providing the plurality of protrusions 250R1, the housing recessed portion 250R and the electronic component 10 become in a multi-point contact, and thus it is possible to reduce the contact area between the electronic component 10 and the housing recessed portion 250R, and to more reliably suppress the movement of the electronic component 10.

[0158] In addition, by setting the interval of the two protrusions 250R1 from each other to house the electronic component 10 between the two protrusions 250R1, it is possible to make the positioning of the electronic component 10 easy.

[0159] <Seventeenth Modification Example>

[0160] Figure 25 is an enlarged cross-sectional view of a non-contact communication medium of the seventeenth modification example. As shown in Figure 25 The housing 200S of the non-contact communication medium 1S of the seventeenth modification example has the buffer material 270S1 at the front end surface 260a of the housing protruded portion 260. In addition, the housing 200S has the buffer material 270S2 at the bottom surface 250a of the housing recessed portion 250.

[0161] The buffer materials 270S1, 270S2 are formed using a material having high flexibility compared to the first base material 210 and the second base material 220 composed of ceramic, such as resin or the like. As such a resin, it is possible to appropriately use, for example, silicone, amide-based, imide-based, amide-imide-based resins. In addition, the buffer materials 270S1, 270S2 preferably have heat resistance.

[0162] In the seventeenth modification example, the electronic component 10 is sandwiched by the housing protrusion 260 and the housing recess 250 with the buffer material 270S1, 270S2 interposed therebetween. Therefore, for example, even in the case where the housing body 200S is subjected to an impact, since the buffer material 270S1, 270S2 absorbs the impact, it is possible to suppress the transmission of the impact to the electronic component 10. Therefore, according to the non-contact communication medium 1S of the seventeenth modification example, it is possible to more reliably suppress the damage of the electronic component 10.

[0163] Here, an example in which the buffer material 270S1, 270S2 is provided to both the housing protrusion 260 and the housing recess 250 is shown, but the buffer material 270S1, 270S2 can be provided to at least one of the housing protrusion 260 and the housing recess 250.

[0164] <Eighteenth Modification Example>

[0165] Figure 26 is an enlarged cross-sectional view of a non-contact communication medium of an eighteenth modification example. As shown in Figure 26 , the housing body 200T of the non-contact communication medium 1T of the eighteenth modification example has a second base material 220T.

[0166] The housing protrusion 260T of the second base material 220T of the eighteenth modification example is composed of a buffer material having a higher softness than the first base material 210 and the second base material 220T.

[0167] In this way, the housing protrusion 260T can be formed entirely of the buffer material. Thereby, it is possible to replace the housing protrusion 260T according to, for example, the size of the electronic component 10.

[0168] <Nineteenth Modification Example>

[0169] Figure 27 is an enlarged cross-sectional view of a non-contact communication medium of a nineteenth modification example. In addition, Figure 28 is Figure 27 , a cross-sectional view in the direction of the arrow XXVIII-XXVIII. As shown in Figure 27 , the housing body 200U of the non-contact communication medium 1U of the nineteenth modification example has a second base material 220U.

[0170] As shown in Figure 27 and Figure 28 , the housing protrusion 260U of the second base material 220U has a protrusion 260U1 protruding in a ring shape from the front end surface. In the nineteenth modification example, the electronic component 10 is in a state of being sandwiched by the ring-shaped protrusion 260U1 and the bottom surface 250a of the housing recess 250.

[0171] Thus, the housing protrusion 260U can also have a protrusion 260U1 protruding in a ring shape from the front end surface. Thereby, the contact area between the electronic component 10 and the housing protrusion 260U can be reduced, and the movement of the electronic component 10 can be more reliably suppressed.

[0172] <Twentieth Modification Example>

[0173] Figure 29 is an enlarged sectional view of a non-contact communication medium of a twentieth modification example. As shown in Figure 29 the housing body 200V of the non-contact communication medium 1V of the twentieth modification example has an adhesive layer 230V.

[0174] The adhesive layer 230V of the twentieth modification example overflows from between the first substrate 210 and the second substrate 220. The adhesive layer 230V overflows around the entire circumference of the housing body 200V. Note that the adhesive layer 230V can overflow from only a part of the circumference of the housing body 200V.

[0175] Thus, the adhesive layer 230V overflows from the first substrate 210 and the second substrate 220, and thereby the first substrate 210 and the second substrate 220 can be more firmly joined.

[0176] <Twenty-First Modification Example>

[0177] Figure 30 is an enlarged sectional view of a non-contact communication medium of a twenty-first modification example. As shown in Figure 30 the housing body 200W of the non-contact communication medium 1W of the twenty-first modification example has a spherical shape. Specifically, the first substrate 210W and the second substrate 220W have a semispherical shape, and they are joined by means of the adhesive layer 230W, thereby obtaining the spherical housing body 200W.

[0178] Thus, the housing body 200W is made to have a spherical shape without corners, and thereby the damage such as the defect or the breakage of the housing body 200W can be further suppressed.

[0179] <Other Modification Examples>

[0180] The ceramic constituting the first substrate and the second substrate is not limited to cordierite. For example, the ceramic constituting the first substrate and the second substrate can be Al2O3 (alumina), Si3N4 (silicon nitride), SiC (silicon carbide), Al2TiO5 (aluminum titanate). In addition, the ceramic constituting the first substrate and the second substrate can be a crystallized glass such as Li2O-Al2O3-SiO2.

[0181] The housing preferably has a lightness index L* (value of dimension L in Lab color space representing lightness) of 50 or more. By this, dirt adhering to the housing is easily noticeable, so the replacement timing can be easily determined. In addition, heat is less likely to accumulate compared to the case where the lightness index L* is less than 50 (i.e., the case where it is dark), so heat is less likely to be transmitted to the electronic component. Note that the lightness of the housing can be adjusted depending on, for example, pigments (see, for example, Japanese Patent No. 5762522, Japanese Patent No. 5744045).

[0182] In addition, the color of the first substrate can be different from the color of the second substrate. By this, the visibility of the upper and lower is improved, so the work of mounting the non-contact communication medium to the component to be monitored and the like can be facilitated. For example, when the worker wants to arrange the electronic component at a position closer to the component to be monitored and the like, the first substrate in which the electronic component is housed among the first substrate and the second substrate can be easily determined. By this, the first substrate can be arranged near the component to be monitored and the like.

[0183] In the case where the color of the first substrate is different from the color of the second substrate, the color of the first substrate in which the electronic component is housed can be brighter than the second substrate. By this, the visibility of the upper and lower can be improved, and heat is less likely to be transmitted to the electronic component. In addition to this, the electronic component is preferably distanced from a member having a low lightness index. By this, heat is even less likely to be transmitted to the electronic component.

[0184] The electronic component is not limited to an RFID tag, but can be another electronic component as long as it performs non-contact communication. For example, the electronic component can be a sensor having a non-contact communication function. In addition, the sensor can be a sensor that measures the processing environment of the component to be monitored, such as a temperature sensor.

[0185] The component in which the non-contact communication medium according to the present disclosure is mounted is not limited to a plated component.

[0186] For example, the non-contact communication medium according to the present disclosure can be mounted to a component such as a cast piece manufactured in a foundry of a metal material.

[0187] In addition, the non-contact communication medium according to the present disclosure can be used for article management in a vulcanization process in a manufacturing process of a rubber product.

[0188] The vulcanization step is a step in which, in order to increase the elastic limit of a rubber-based raw material, a chemical reaction of sulfur or peroxide or the like compounded in the raw material is caused to crosslink molecules by applying temperature and time. Note that pressure is also applied in some cases in the vulcanization step. The temperature in the vulcanization step is, for example, 100°C to 200°C. In addition, the pressure in the vulcanization step is, for example, 0.5 MPa to 2 MPa.

[0189] As an example, the non-contact communication medium according to the present disclosure can also be installed in a used tire that is regenerated as a retreaded tire. The retreaded tire is obtained by cutting the surface of the used tire and vulcanizing a new rubber sheet attached thereto.

[0190] As a vulcanization step of the retreaded tire, a remould method and a prevulcanization method are known. The remould method is a method in which a rubber sheet that is not vulcanized is attached to the surface of the used tire and then vulcanized at high temperature and high pressure using a mold. In addition, the prevulcanization method is a method in which a rubber sheet that is vulcanized is attached to the surface of the used tire and then vulcanized at low temperature and low pressure in a vulcanization furnace. The non-contact communication medium according to the present disclosure is applicable to either of the remould method and the prevulcanization method. In particular, the prevulcanization method is directed to small-lot and multi-variety production, and thus the inspection process by hand is more frequent. In contrast, by performing article management by the non-contact communication medium according to the present disclosure, it is possible to reduce labor costs and improve the production efficiency of the retreaded tire.

[0191] The non-contact communication medium according to the present disclosure is preferably installed in a portion other than the tread portion to which the rubber sheet is attached. For example, the non-contact communication medium according to the present disclosure can also be disposed inside the used tire.

[0192] In addition, the non-contact communication medium according to the present disclosure can also be installed in a medical instrument (for example, forceps, a needle holder, or the like).

[0193] In the field of medicine, how to prevent a medical instrument from being left in the body, rationalize the management of the medical instrument, and prevent the wrong medical instrument from being taken during surgery has become a problem. In contrast, by installing the non-contact communication medium according to the present disclosure in the medical instrument, it is possible to manage the medical instruments one by one by the RFID tag, and thus it is possible to contribute to solving the above problems.

[0194] In addition, the non-contact communication medium according to the present disclosure can also be used in marking for determining a lesion site in the body.

[0195] As a marker method in the past, a biological dye coloring method is known. The biological dye coloring method is a method of coloring a lesion site in a body found at the time of examination with a dye. However, in the biological dye coloring method, the coloring range is wide, and in addition, the dye diffuses with the passage of time, so it is difficult to determine the lesion site finely. In addition, as another marker method, a method of leaving a needle or a clip made of metal at a lesion site is proposed. However, this method requires preparation of a CT scanner at the time of surgery, or the like becomes a problem in which radiation exposure of more than a necessary degree is likely to occur.

[0196] In a case where the non-contact communication medium based on the present disclosure is used for a marker, first, the non-contact communication medium based on the present disclosure is left at a lesion site before surgery. Thereafter, in surgery, the distance between, for example, an RFID tag and a sensor antenna, or the like is measured using the sensor antenna, and thus the position of the RFID, that is, the position of the lesion site is estimated.

[0197] In this way, in a case where the non-contact communication medium based on the present disclosure is used for a marker, the non-contact communication medium based on the present disclosure is left in a body, so it is desirable to be as small as possible. In this point, the ceramic constituting the housing of the present disclosure has a high permittivity compared to, for example, resin, and is not easily likely to hinder communication based on an RFID. Therefore, the non-contact communication medium of the present disclosure can be downsized compared to a non-contact communication medium having a housing made of, for example, resin.

[0198] As described above, the non-contact communication medium of the embodiment (as an example, the non-contact communication medium 1, 1A to 1K) has an electronic component (as an example, the electronic component 10) and a housing (as an example, the housing 20, 20A to 20K). The electronic component performs non-contact communication. The housing houses the electronic component. In addition, the housing has a main body portion (as an example, the main body portion 21, 21A, 21B, 21D, 21E, 21G, 21K), a peg portion (as an example, the peg portion 22, 22C, 22D, 22F, 22G, 22H, 22K), and an adhesive layer (as an example, the adhesive layer 23, 23J, 23K). The main body portion has a housing hole (as an example, the housing hole 25A, 25B, 25D, 25E, 25G) that houses the electronic component. The peg portion is inserted into the housing hole. The adhesive layer is located between the inner peripheral surface of the housing hole and the outer peripheral surface of the peg portion, and is used to join the main body portion and the peg portion. Thus, it is possible to provide a non-contact communication medium in which the joined portion of the housing is less likely to peel.

[0199] The bottom surface of the housing hole can also be concavely curved. In addition, the housing hole can have a curved corner portion (as an example, the corner portion 253B) between the inner peripheral surface and the bottom surface. Thus, it is possible to make the housing hole less likely to crack when, for example, the housing is thermally expanded or thermally shrunk.

[0200] The main body portion can have a first flat surface (as an example, first flat surface 211) in which the accommodation hole is formed. The peg portion can have a second flat surface (as an example, second flat surface 221) that is coplanar with the first flat surface. The peg portion does not protrude from the main body portion, so it is difficult to directly apply an impact to the peg portion. Thus, the engagement portion of the accommodation body can be less likely to peel off.

[0201] The peg portion can have a plurality of protrusions (as an example, first protrusions 223C) that protrude from the outer circumferential surface. In addition, the plurality of protrusions of the peg portion can be arranged equidistantly in the circumferential direction with respect to the outer circumferential surface. In addition, the main body portion can have a plurality of protrusions (as an example, second protrusions 254D) that protrude from the inner circumferential surface. Thus, the bias (eccentricity) of the peg portion within the accommodation hole can be suppressed. As a result, the gap between the accommodation hole and the peg portion is uniform, and a portion in which the adhesive layer is thin is less likely to occur, so the engagement portion of the accommodation body can be less likely to peel off.

[0202] The accommodation hole can have a stepped surface (as an example, stepped surface 255E) that protrudes from the inner circumferential surface. The electronic component can be arranged at a position closer to the opening of the accommodation hole than the stepped surface. By providing the stepped surface inside the accommodation hole, the extension distance of the accommodation hole can be lengthened. Thus, even in a case where a liquid such as a plating solution or a gas such as a corrosive gas intrudes into the inside of the accommodation hole from the outside, such a liquid or gas is less likely to reach the electronic component, so the contact of the liquid or gas from the outside with the electronic component can be suppressed.

[0203] The accommodation body can have a cover portion (as an example, cover portion 27E) that is placed on the stepped surface. By placing the cover portion on the stepped surface, the electronic component can be double-sealed. Thus, even in a case where a liquid or a gas intrudes into the inside of the accommodation hole from the outside, the electronic component can be protected from the influence of such a liquid or gas.

[0204] The electronic component can be arranged at a position away from the adhesive layer. Thus, heat from the outside is less likely to be transmitted to the electronic component.

[0205] The front end surface of the peg portion, which opposes the bottom surface of the accommodation hole, can be curved toward the bottom surface and sandwich the electronic component with the bottom surface of the accommodation hole. The front end surface of the peg portion, which is on the bottom surface side of the accommodation hole, can be recessed, and at least a portion of the electronic component can be accommodated in the recessed portion. Thus, the movement of the electronic component within the accommodation hole can be suppressed.

[0206] The main body portion can have at least one protrusion (as an example, third protrusion 256G) that protrudes from the bottom surface of the accommodation hole. Thus, the contact area between the electronic component and the main body portion and the contact area between the electronic component and the peg portion can be reduced. Thus, the heat conduction from the main body portion or the peg portion to the electronic component can be suppressed, and the movement of the electronic component can be suppressed.

[0207] The adhesive layer can also overflow from the housing hole. Thereby, the main body portion and the peg portion can be more firmly joined.

[0208] Further effects and modifications can be readily derived by those skilled in the art, which do not depart from the scope of the application. Therefore, the more broad aspects of the present application are not limited to the specific details and representative embodiments as described above. Thus, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

[0209] Explanation of Reference Numerals:

[0210] 1: Non-contact communication medium

[0211] 10: Electronic component

[0212] 20: Housing body

[0213] 21: Main body portion

[0214] 22: Peg portion

[0215] 23: Adhesive layer

[0216] 25: Housing hole

[0217] 27E: Cover portion

[0218] 211: First flat surface

[0219] 221: Second flat surface

[0220] 222: Outer peripheral surface

[0221] 223C: First protrusion

[0222] 225G: Fourth protrusion

[0223] 251: Inner peripheral surface

[0224] 252: Bottom surface

[0225] 254D: Second protrusion

[0226] 255E: Step surface

[0227] 256G: Third protrusion

Claims

1. A non-contact communication medium, wherein the non-contact communication medium has: an electronic component that performs non-contact communication; and a housing that houses the electronic component, the housing has: a main body portion that has a housing hole that houses the electronic component; a peg portion that is inserted into the housing hole; and an adhesive layer that is located between an inner peripheral surface of the housing hole and an outer peripheral surface of the peg portion, and that bonds the main body portion and the peg portion, the housing hole is a long hole, and an opening diameter of the housing hole is smaller than a depth of the housing hole, the peg portion is columnar.

2. The non-contact communication medium according to claim 1, wherein a bottom surface of the housing hole is concavely curved.

3. The non-contact communication medium according to claim 1, wherein the housing hole has a curved corner portion between an inner peripheral surface and a bottom surface.

4. The non-contact communication medium according to any one of claims 1 to 3, wherein the main body portion has a first flat surface in which the housing hole is formed, the peg portion has a second flat surface that is coplanar with the first flat surface.

5. The non-contact communication medium according to any one of claims 1 to 3, wherein the peg portion has a plurality of protrusions that protrude from the outer peripheral surface.

6. The non-contact communication medium according to claim 5, wherein the plurality of protrusions of the peg portion are equally arranged in a circumferential direction with respect to the outer peripheral surface.

7. The non-contact communication medium according to any one of claims 1 to 3, wherein the housing hole has a plurality of protrusions that protrude from the inner peripheral surface.

8. The non-contact communication medium according to any one of claims 1 to 3, wherein the housing hole has a stepped surface that protrudes from the inner peripheral surface, the electronic component is arranged at a position that is farther from an opening portion of the housing hole than the stepped surface.

9. The non-contact communication medium according to claim 8, wherein the housing has a cover portion that is placed on the stepped surface.

10. The non-contact communication medium according to any one of claims 1 to 3, wherein the electronic component is arranged at a position that is farther from the adhesive layer.

11. The non-contact communication medium according to any one of claims 1 to 3, wherein a front end surface of the peg portion that is opposed to a bottom surface of the housing hole is curved toward the bottom surface, and the electronic component is sandwiched by the front end surface and the bottom surface of the housing hole.

12. The non-contact communication medium according to any one of claims 1 to 3, wherein a front end surface of the peg portion that is on a bottom surface side of the housing hole is recessed, and at least a part of the electronic component is housed in the recessed portion.

13. The non-contact communication medium according to any one of claims 1 to 3, wherein the main body portion has at least one protrusion that protrudes from a bottom surface of the housing hole.

14. The non-contact communication medium according to any one of claims 1 to 3, wherein the adhesive layer overflows from the housing hole.

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