Display panel detection circuit and detection device

Abstract

The application discloses a display panel detection circuit and a detection device. The display panel detection circuit comprises a voltage input end, a sampling resistor and a display panel to be detected. The voltage input end is used for inputting a Power IC voltage. The sampling resistor and the display panel to be detected are connected in parallel and connected to the voltage input end. A first voltage detection end and a second voltage detection end are respectively connected to two ends of the sampling resistor and used for detecting voltages at the two ends of the sampling resistor. According to the technical scheme provided in the application, a sampling resistor is connected in parallel with the display panel to be detected, a certain voltage value is input to the display panel to be detected and the sampling resistor, the voltage at the two ends of the sampling resistor is detected for sampling, the internal resistance of the display panel to be detected is determined according to the detected voltage and the resistance value of the sampling resistor, and a defective product with excessively high internal charge of the display panel to be detected is screened and detected, so that more serious product defect problems caused by product backflow are reduced.

Description

TECHNICAL FIELD

[0001] The present application generally relates to the field of display panel detection, and in particular to a display panel detection circuit and a detection device. BACKGROUND

[0002] Oxide TFT (Thin Film Transistor) products are prone to charge accumulation and residual due to fast electron migration rate. Compared with A-si products, oxide products have an IGZO (Indium Gallium Zinc Oxide Semiconductor) film material on the array substrate. After the IGZO film is formed, the corresponding substrate cannot completely eliminate the static charge on the line body equipment during the roll transfer process. During the production and testing processes, the static charge generated in the production process or the testing process of the panel will cause uneven charge distribution, such as charge accumulation, and the display panel will exhibit vertical or horizontal block abnormalities.

[0003] Similarly, the best Vcom (common electrode voltage of the display panel) adjustment is required during the current function detection test of general products, and the Vcom adjustment process will cause irregular flow and accumulation of internal charges of oxide products. If the Vcom adjustment range is too large, the uneven charge distribution caused by excessive charge accumulation will affect the normal detection of the product and the yield of the product. SUMMARY

[0004] In view of the above defects or deficiencies in the prior art, it is desirable to provide a display panel detection circuit and a detection device.

[0005] In a first aspect, a display panel detection circuit is provided, comprising a voltage input end configured to input a Power IC voltage,

[0006] a sampling resistor and a display panel to be detected, which are connected in parallel to the voltage input end,

[0007] a first voltage detection end and a second voltage detection end connected to both ends of the sampling resistor, respectively, for detecting voltages at both ends of the sampling resistor.

[0008] In a second aspect, a detection device is provided, comprising a voltage input end, a first test pin module, a second test pin module, a sampling resistor, and a panel placement area,

[0009] the voltage input end is connected to the first test pin module and configured to input a Power IC voltage,

[0010] the panel placement area is configured to place a display panel to be detected, and the display panel to be detected is connected to the sampling resistor, the first test pin module, and the second test pin module,

[0011] The first test probe and the second test probe are connected to the two ends of the sampling resistor.

[0012] According to the technical solution provided in the embodiments of this application, by providing a sampling resistor connected in parallel with the display panel to be tested, a certain voltage value is input to the display panel to be tested and the sampling resistor. The voltage across the sampling resistor is sampled, and the voltage across the sampling resistor is also the voltage value across the display panel to be tested. The internal resistance of the display panel to be tested can be determined by the detected voltage and the resistance value of the sampling resistor, thereby screening out defective products with excessive charge accumulation in the display panel to be tested and reducing more serious product defects caused by subsequent product flow. Attached Figure Description

[0013] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0014] Figure 1 This is a schematic diagram of the display panel detection circuit in this embodiment;

[0015] Figure 2 This is a schematic diagram of the detection device in this embodiment. Detailed Implementation

[0016] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0017] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0018] Please refer to Figure 1 This embodiment provides a display panel detection circuit, including a voltage input terminal for inputting Power IC voltage.

[0019] A sampling resistor and a display panel to be tested are connected in parallel and connected to the voltage input terminal.

[0020] The first voltage detection terminal and the second voltage detection terminal are respectively connected to the two ends of the sampling resistor, and are used to detect the voltage across the sampling resistor respectively.

[0021] The detection circuit provided in this embodiment provides a sampling resistor connected in parallel with the display panel to be tested. A certain voltage value is input to the display panel to be tested and the sampling resistor. The voltage across the sampling resistor is sampled, and the voltage across the sampling resistor is the voltage value across the display panel to be tested. The internal resistance of the display panel to be tested can be determined by the detected voltage and the resistance value of the sampling resistor. This allows for the screening and detection of defective products with excessive charge accumulation in the display panel to be tested, reducing the more serious product defects caused by subsequent product flow.

[0022] In the detection circuit provided in this embodiment, the sampling resistor and the display panel to be tested are connected in parallel. Therefore, the internal resistance Rvcom of the display panel to be tested can be calculated by the detected voltage value and the corresponding resistance value of the sampling resistor. For example, the internal resistance of the display panel to be tested is: Rvcom = Vi2 / Vf*Rf; Vf = Vin-Vi2, where Vf is the voltage drop across the sampling resistor Rf, Rf: sampling resistor; Vin: the voltage of the Power IC output from the voltage input terminal; Vi2: the voltage at the other end of the product to be tested; the detected data is used to determine whether there is excessive charge accumulation on the display panel to be tested.

[0023] Furthermore, it also includes an MCU microcontroller connected to the first voltage detection terminal and the second voltage detection terminal, used to detect the voltage difference between the first voltage detection terminal and the second voltage detection terminal.

[0024] In this embodiment, an MCU (Microcontroller Unit) is added between the voltage detection terminals. The MCU collects and processes the voltages of the first and second voltage detection terminals. For example, it calculates the voltage difference between the two detection terminals, or determines the internal resistance of the display panel to be tested based on the calculated voltage difference. Based on the measurement and calculation results, it judges the charge accumulation inside the display panel to be tested and filters out defective products.

[0025] Furthermore, the MCU is also used to issue an alarm when the detected differential pressure exceeds a set range.

[0026] In this embodiment, certain alarm settings can also be configured via an MCU microcontroller. When an abnormal charge accumulation is detected on the display panel, an alarm will be triggered, providing a rapid reminder.

[0027] like Figure 2 As shown, this embodiment also provides a detection device, including a voltage input terminal, a first test probe mold 2, a second test probe mold 4, a sampling resistor, and a panel placement area 6.

[0028] The voltage input terminal is connected to the first test probe 2 and is used to input the Power IC voltage.

[0029] The panel placement area 6 is used to place the display panel to be tested, and the display panel to be tested is connected to the sampling resistor, the first test probe mold 2, and the second test probe mold 4.

[0030] The first test probe 2 and the second test probe 4 are connected to the two ends of the sampling resistor.

[0031] The detection device provided in this embodiment detects the charge accumulation inside the display panel by incorporating the aforementioned detection circuit. Specifically, the voltage input terminal, test probe film, and sampling resistor are integrated and mounted on a single device. Figure 2 The device does not specify the location of the voltage input terminal. This voltage input terminal is connected to the first test needle membrane and inputs the Power IC voltage to the point where the first test needle membrane is located. This voltage input terminal is also connected to the power generation equipment to provide voltage.

[0032] The device also includes a panel placement area for placing the display panel to be tested. A first test film and a second test film are disposed on the side of the panel placement area and connected to the display panel to be tested via the first test film and the second test film. The first test film and the second test film are also connected to both ends of a sampling resistor, realizing the parallel connection of the sampling resistor and the display panel to be tested. The first test film can output the voltage at point V1 in the above-mentioned detection circuit, and the second test film can output the voltage at point V2 in the above-mentioned detection circuit.

[0033] Furthermore, it also includes an MCU microcontroller, which is connected to the first test pin mold 2 and the second test pin mold 4, and is used to detect the pressure difference between the first test pin mold 2 and the second test pin mold 4.

[0034] The device in this embodiment integrates an MCU microcontroller, which detects the voltage at the first and second test needle points. Furthermore, it can also determine the voltage difference between the two points or the internal resistance of the display panel to be tested.

[0035] Furthermore, a test switch 1 is provided between the voltage input port and the first test probe mold, and the test switch 1 is used to turn on when testing is required.

[0036] The device in this embodiment is equipped with a test switch, such as a push-button switch, see [link to relevant documentation]. Figure 2 The image shows a test button. Users can turn on the switch when a test is needed, i.e., press the test button to transmit the voltage from the power generation equipment to the device for corresponding testing.

[0037] Furthermore, it also includes an NG alarm 5, which is connected to the MCU microcontroller and is used to trigger an alarm when the differential pressure detected by the MCU microcontroller exceeds a set value.

[0038] This embodiment uses the aforementioned device to detect the display panel, primarily to detect whether there is excessive charge accumulation in the display panel. Display panels with excessive charge accumulation have a large internal resistance. Therefore, an NG (Not From Good) warning device is directly installed on the detection device to trigger an alarm. When the pressure difference between the first and second test needle films exceeds a set value, or when the calculated internal resistance of the display panel to be tested is greater than a set value, an alarm is triggered, and the corresponding product is intercepted.

[0039] Furthermore, the display panel to be tested includes an integrated circuit, which is connected to the MCU microcontroller.

[0040] The display panel to be tested includes an ITO layer, and the first test probe and the second test probe are respectively connected to the ITO layer.

[0041] In this embodiment, the display panel to be tested is placed in the panel placement area, and the voltage values ​​at two points are tested by connecting the first test pin film and the second test pin film. The first test pin film and the second test pin film are respectively connected to the ITO (indium tin oxide semiconductor transparent conductive film) layer of the display panel to determine whether there is too much charge accumulation in the panel.

[0042] Furthermore, it includes an impedance test meter 3, which integrates the sampling resistor and the MCU microcontroller.

[0043] like Figure 2 The device structure shown integrates the sampling resistor and the MCU microcontroller together, which facilitates the assembly and manufacturing of the device.

[0044] This embodiment also provides the testing steps for the above-mentioned device and testing circuit. First, the display panel to be tested is placed in the panel placement area. During the product testing process, the power generation equipment inputs the power IC voltage, i.e. Figure 1 Vin in

[0045] The MCU microcontroller on the detection device detects the voltage of the first test needle membrane, i.e., voltage V1.

[0046] The voltage V2 of the second test needle membrane is detected.

[0047] The MCU microcontroller determines whether the voltage difference between voltages V1 and V2 is within the normal range. If it exceeds the set range, an alarm is triggered. Preferably, the voltage difference is set to a range of 2K to 3K millivolts. When the detected voltage difference exceeds the above range, an alarm is triggered.

[0048] The display panel products with excessively high internal resistance that triggered the alarm were then baked in an aging oven to release the charge until the internal charge of the product was eliminated before proceeding to the next production process.

[0049] The circuit and detection device provided in this embodiment measure two voltage values ​​and can set the interception range through a microcontroller program. This intercepts products with excessively high internal resistance of the display panel caused by voltage adjustment and internal charge accumulation, thereby reducing irreparable product defects such as excessive charge accumulation caused by subsequent product flow that cannot be eliminated.

[0050] It should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" used above to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention; the directional terms "inner" and "outer" refer to the inside or outside relative to the outline of each component itself. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0051] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0052] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A detection device, characterized in that, Includes voltage input terminals, first test probe mold, second test probe mold, sampling resistor, and panel placement area. The voltage input terminal is connected to the first test probe and is used to input the Power IC voltage. The panel placement area is used to place the display panel to be tested, and the display panel to be tested is connected to a sampling resistor, a first test probe mold, and a second test probe mold. The display panel to be tested includes an ITO layer, and the first test probe mold and the second test probe mold are respectively connected to the ITO layer. The first test probe and the second test probe are connected to the two ends of the sampling resistor; The detection device also includes an MCU microcontroller connected to the first test probe and the second test probe, used to detect the pressure difference between the first test probe and the second test probe. The pressure difference is used to determine the internal resistance of the display panel to be tested. The MCU microcontroller is also used to issue an alarm when the detected pressure difference exceeds a set range, wherein the pressure difference is 2K~3K millivolts.

2. The detection device according to claim 1, characterized in that, A test switch is also provided between the voltage input terminal and the first test probe mold, and the test switch is used to turn on when testing is required.

3. The detection device according to claim 1, characterized in that, It also includes an NG alarm, which is connected to the MCU microcontroller and is used to trigger an alarm when the differential pressure detected by the MCU microcontroller exceeds a set value.

4. The detection device according to claim 1, characterized in that, The display panel to be tested includes an integrated circuit, which is connected to the MCU microcontroller.

5. The detection device according to claim 1, characterized in that, It includes an impedance test meter, which integrates the sampling resistor and the MCU microcontroller.

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