A method for process defect analysis and a method for making a contact point overlay map

Abstract

The present invention discloses a process defect analysis method and a method for making a contact point overlay drawing. The analysis method includes making a contact point overlay drawing cardboard for the equipment of the liquid crystal panel production process; measuring abnormal points and making an abnormal CAD drawing of the liquid crystal panel production process; comparing the abnormal CAD drawing with the contact point overlay drawing cardboard of the equipment to determine the abnormal equipment and abnormal unit; making the abnormal CAD drawing according to the coordinate system. By implementing the present invention, by comparing the abnormal CAD drawing with the contact point overlay drawing cardboard of the equipment, the abnormal equipment and unit can be quickly determined, solving the problem in the existing liquid crystal panel production process that when an abnormality occurs, it is necessary to re-comb the equipment where the abnormality occurs for defect analysis, wasting manpower and not being easy to find, resulting in production delays or a high incidence of abnormal accidents.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid crystal panels, and particularly to a method for analyzing process defects of a liquid crystal panel and a method for making a contact point overlay map. Background Art

[0002] A liquid crystal panel is an important component of a liquid crystal display, and the quality of the liquid crystal panel directly affects the overall performance of the liquid crystal display.

[0003] In the preparation process of a liquid crystal panel, there are multiple forming processes. For example, an array process, a color filter process, a cell assembly process, and a module assembly process. Any non-standard process or design aspect may cause display defects such as point defects, line defects, or uneven display brightness in the liquid crystal panel. In the display screen of the liquid crystal panel, there are full-screen or half-screen spaced horizontal stripes. Such liquid crystal panels are generally directly scrapped, resulting in material waste.

[0004] In order to reduce the impact of the above display defects on the liquid crystal display, it is necessary to detect the prepared liquid crystal panel, find and solve the problems causing the display defects.

[0005] The "defect inspection device for a flat panel display" disclosed in Japanese Patent Laid-Open No. 2009-264865 (Patent Document 1). In the above defect inspection device for a flat panel display, defect inspections are carried out immediately after each process of the TFT (Thin Film Transistor) process, and the inspection results are stored in the defect inspection database of the defect analysis database. Defect inspections are carried out immediately after each process of the color filter process, and the inspection results are stored in the above defect inspection database. Through assembly, the TFT substrate completed in the TFT process and the color filter substrate completed in the color filter process are bonded, then divided into panels, injected with liquid crystal, and subjected to a lighting inspection after sealing. The lighting inspection results of the panels in the above assembly are totaled as the lighting inspection results of the substrates, and compared with the inspection results in the TFT process and the inspection results in the color filter process, thereby determining in which process and operation the defects in the lighting inspection results occur.

[0006] However, the inspection and analysis method of the above defect inspection device introduces inspection processes, which are not only complex but also difficult to determine in which process the defect occurs.

[0007] Therefore, this method of re-combing the defect analysis of the abnormal occurrence equipment wastes manpower and is not easy to find, resulting in high production delays or abnormal accidents. Summary of the Invention

[0008] In the existing liquid crystal panel production process, when an abnormality occurs, it is necessary to re-comb the equipment where the abnormality occurs for defect analysis, which wastes manpower and is not easy to find, resulting in production delays or a high incidence of abnormal accidents.

[0009] In view of the above problems, a process defect analysis method and a method for making a contact point overlay map are proposed. By making CAD drawings of the equipment contact points for each process of the liquid crystal panel production process, scaling the CAD drawings of the equipment contact points for each process proportionally according to the scaling ratio, and making the scaled CAD drawings of the equipment contact points for all processes into an equipment contact point overlay map cardboard. By comparing the abnormal CAD drawing with the equipment contact point overlay map cardboard, the equipment and unit where the abnormality occurs can be quickly determined, solving the problem in the existing liquid crystal panel production process that when an abnormality occurs, it is necessary to re-comb the equipment where the abnormality occurs for defect analysis, which wastes manpower and is not easy to find, resulting in production delays or a high incidence of abnormal accidents.

[0010] A process defect analysis method for analyzing defects of liquid crystal panel products, including:

[0011] Step 100: Make an equipment contact point overlay map cardboard for the liquid crystal panel production process;

[0012] Step 200: Measure the abnormal points and make an abnormal CAD drawing of the liquid crystal panel production process;

[0013] Step 300: Compare the abnormal CAD drawing with the equipment contact point overlay map cardboard to determine the abnormal equipment and abnormal unit;

[0014] Among them, the step 200 includes:

[0015] Step 210: Make the abnormal CAD drawing according to the coordinate system.

[0016] Combined with the liquid crystal panel process defect analysis method of the present invention, in the first possible implementation manner, the step 100 includes:

[0017] Step 110: Make CAD drawings of the equipment contact points for each process of the liquid crystal panel production process;

[0018] Step 120: Scale the CAD drawings of the equipment contact points for each process proportionally according to the scaling ratio;

[0019] Step 130: Make the scaled CAD drawings of the equipment contact points for all processes into an equipment contact point overlay map cardboard.

[0020] Combined with the first possible implementation manner of the present invention, in the second possible implementation manner, the step 110 includes:

[0021] Step 111: Obtain the contact device information of each process in the liquid crystal panel production process;

[0022] Step 112: Obtain the contact unit information of the contact device information according to the contact device information;

[0023] Step 113: Obtain the contact type information of the contact unit according to the contact unit information.

[0024] Combined with the second possible implementation manner of the present invention, in the third possible implementation manner, the step 113 includes:

[0025] Step 1131: Obtain the contact shape of each contact type information in each liquid crystal panel product;

[0026] Step 1132: Obtain the distribution pattern of the contact shape among all liquid crystal panel products in the process.

[0027] Wherein, the distribution pattern includes the horizontal dimension information and the vertical dimension information between the contact shapes.

[0028] Combined with the third possible implementation manner of the present invention, in the fourth possible implementation manner, the step 210 includes:

[0029] Step 211: Establish a coordinate system according to the liquid crystal panel product style and make an abnormal CAD drawing of the abnormal process;

[0030] Step 212: Detect the liquid crystal panel product and obtain the product information of the abnormal occurrence;

[0031] Step 213: Mark the position of the product with abnormal occurrence on the abnormal CAD drawing.

[0032] Combined with the fourth possible implementation manner of the present invention, in the fifth possible implementation manner, the step 213 includes:

[0033] Step 2131: Mark the horizontal dimension information of the position of the product with abnormal occurrence on the abnormal CAD drawing;

[0034] Step 2132: Mark the vertical dimension information of the position of the product with abnormal occurrence on the abnormal CAD drawing.

[0035] Combined with the fifth possible implementation manner of the present invention, in the sixth possible implementation manner, the step 300 includes:

[0036] Step 310: Obtain the production process with abnormal occurrence of the liquid crystal panel product according to the abnormal CAD drawing;

[0037] Step 320: Select the equipment contact point cardboard corresponding to the production process from the equipment contact point cardboard of the layout drawing according to the information of the production process.

[0038] Step 330: Compare the equipment contact point cardboard with the abnormal CAD drawing to quickly determine the equipment and units where the abnormality occurs.

[0039] In a second aspect, a method for making a contact point layout drawing is used to make a contact point layout drawing of a liquid crystal panel product, including:

[0040] Step 400: Make CAD drawings of the equipment contact points corresponding to each process of the liquid crystal panel production process.

[0041] Step 500: Scale the CAD drawings of the equipment contact points of each process proportionally according to the scaling ratio.

[0042] Step 600: Make the scaled CAD drawings of the equipment contact points of all processes into equipment contact point cardboard of the layout drawing.

[0043] Combined with the method for making a contact point layout drawing described in the second aspect, in a first possible implementation manner, the step 400 includes:

[0044] Step 410: Obtain the contact equipment information of each process of the liquid crystal panel production process.

[0045] Step 420: Obtain the contact unit information of the contact equipment information according to the contact equipment information.

[0046] Step 430: Obtain the contact type information of the contact unit according to the contact unit information.

[0047] Combined with the first possible implementation manner of the second aspect, in a second possible implementation manner, the step 430 includes:

[0048] Step 431: Obtain the contact shape of each contact type information in each liquid crystal panel product.

[0049] Step 432: Obtain the distribution pattern of the contact shape in all liquid crystal panel products in the process.

[0050] Wherein, the distribution pattern includes:

[0051] The horizontal dimension information between the contact shapes; and

[0052] The vertical dimension information between the contact shapes.

[0053] Implementing the process defect analysis method and the contact point overlay drawing production method of the present invention, by producing CAD drawings of the equipment contact points corresponding to each process of the liquid crystal panel production process, equally scaling the CAD drawings of the equipment contact points of each process according to the scaling ratio, and producing the CAD drawings of the equipment contact points of all processes after scaling into equipment contact point overlay drawing cardboard. By comparing the abnormal CAD drawings with the equipment contact point overlay drawing cardboard, the equipment and units where the abnormality occurs can be quickly determined, solving the problems in the existing liquid crystal panel production process that when an abnormality occurs, it is necessary to re-comb the equipment where the abnormality occurs for defect analysis, wasting manpower and being not easy to find, resulting in production delays or a high incidence of abnormal accidents. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0055] Figure 1 It is a schematic diagram of the first embodiment of a process defect analysis method in the present invention;

[0056] Figure 2 It is a schematic diagram of the second embodiment of a process defect analysis method in the present invention;

[0057] Figure 3 It is a schematic diagram of the third embodiment of a process defect analysis method in the present invention;

[0058] Figure 4 It is a schematic diagram of the fourth embodiment of a process defect analysis method in the present invention;

[0059] Figure 5 It is a schematic diagram of the fifth embodiment of a process defect analysis method in the present invention;

[0060] Figure 6 It is a schematic diagram of the sixth embodiment of a process defect analysis method in the present invention;

[0061] Figure 7 It is a schematic diagram of the seventh embodiment of a process defect analysis method in the present invention;

[0062] Figure 8 It is a schematic diagram of the first embodiment of a contact point overlay drawing production method in the present invention;

[0063] Figure 9 It is a schematic diagram of the second embodiment of a contact point overlay drawing production method in the present invention;

[0064] Figure 10 It is a schematic diagram of the third embodiment of a method for making a contact point position overlay diagram in the present invention;

[0065] Figures 11 - 20 It is a schematic diagram of an embodiment of a contact point position overlay diagram in the present invention. Detailed implementation manners

[0066] Next, the technical solutions in the present invention will be clearly and completely described in conjunction with the accompanying drawings in the invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0067] In the existing liquid crystal panel production process, when an abnormality occurs, it is necessary to re-comb the equipment where the abnormality occurs for defect analysis, which wastes manpower and is not easy to find, resulting in production delays or a high incidence of abnormal accidents.

[0068] In view of the above problems, a method and system for analyzing process defects of a liquid crystal panel are proposed.

[0069] As Figure 1 , Figure 1 It is a schematic diagram of the first embodiment of a method for analyzing process defects in the present invention; it is used to analyze the defects of liquid crystal panel products, including step 100: making a cardboard of the equipment contact point position overlay diagram of the liquid crystal panel production process; step 200: measuring the abnormal points and making an abnormal CAD diagram of the liquid crystal panel production process; step 300: comparing the abnormal CAD diagram with the cardboard of the equipment contact point position overlay diagram to determine the abnormal equipment and abnormal units; among them, step 200 includes: step 210: making an abnormal CAD diagram according to the coordinate system. By making a CAD diagram of the equipment contact points for each process of the liquid crystal panel production process, scaling the CAD diagrams of the equipment contact points for each process proportionally according to the scaling ratio, and making the scaled CAD diagrams of the equipment contact points for all processes into a cardboard of the equipment contact point position overlay diagram, by comparing the abnormal CAD diagram with the cardboard of the equipment contact point position overlay diagram, the equipment and units where the abnormality occurs can be quickly determined, solving the problem that in the existing liquid crystal panel production process, when an abnormality occurs, it is necessary to re-comb the equipment where the abnormality occurs for defect analysis, which wastes manpower and is not easy to find, resulting in production delays or a high incidence of abnormal accidents.

[0070] From the start to the end of product production, the equipment point positions contacted are made into normal CAD drawings, the contact points are marked, and then scaled according to the ratio to make a cardboard of the equipment contact point position overlay diagram. When an abnormality is found, measure the abnormal points from the abnormal CAD diagram of this process, mark the abnormal points, and then find the matching points from the equipment contact point position overlay diagram to confirm the abnormal equipment.

[0071] Preferably, as Figure 2 , Figure 2 is a schematic diagram of the second embodiment of a process defect analysis method in the present invention; Step 100 includes: Step 110, making a CAD drawing of the equipment contact points corresponding to each process of the liquid crystal panel production process; Step 120, scaling the CAD drawing of the equipment contact points of each process proportionally according to the scaling ratio; Step 130, making the scaled CAD drawings of the equipment contact points of all processes into a set of equipment contact point cardboard.

[0072] The set of equipment contact point cardboard is conducive to comparing and matching the abnormal CAD drawing of the process with abnormal conditions with the points in the set of cardboard, so as to quickly find out the abnormal equipment and units.

[0073] Preferably, as Figure 3 , Figure 3 is a schematic diagram of the third embodiment of a process defect analysis method in the present invention; Step 110 includes: Step 111, obtaining the contact equipment information of each process of the liquid crystal panel production process; Step 112, obtaining the contact unit information of the contact equipment information according to the contact equipment information; Step 113, obtaining the contact type information of the contact unit according to the contact unit information.

[0074] Preferably, as Figure 4 , Figure 4 is a schematic diagram of the fourth embodiment of a process defect analysis method in the present invention; Step 113 includes: Step 1131, obtaining the contact shape of each contact type information in each liquid crystal panel product; Step 1132, obtaining the distribution pattern of the contact shape in all liquid crystal panel products in the process.

[0075] The distribution pattern refers to the distribution diagram of the contact points in the process CAD, and obtaining the shape of each contact point and the distance position relationship between the contact points is conducive to comparison and quickly finding out abnormal equipment or abnormal units.

[0076] Among them, the distribution pattern includes the horizontal dimension information and the vertical dimension information between the contact shapes.

[0077] For example, as Figures 11 - 20 , Figures 11 - 20It is a schematic diagram of an embodiment of the contact point position sleeve diagram in the present invention. Suppose the production process of the liquid crystal panel includes processes such as UPK glass-taking robot, UPKCV1 pin-topping, UPKCV unit, CV1-4 unit, CV5 unit, CV6 unit, INDEX robot fork, A3DRE15 robot fork, TA unit, VCR stage unit, etc. In the UPK glass-taking robot process, the contact device information is the glass-taking robot, the contact unit is the suction cup, and the contact type information includes the circular imprint shape and the distance information of the circular imprint shape. If there is a problem in this process, the CAD diagram made in real time in this process is an abnormal CAD diagram. By comparing the abnormal CAD diagram of this process with the normal equipment contact point position sleeve diagram cardboard, it is determined whether there is an abnormality in the glass-taking robot or a problem with the suction cup.

[0078] Preferably, as Figure 5 , Figure 5 It is a schematic diagram of the fifth embodiment of a process defect analysis method in the present invention; step 210 includes: step 211, establishing a coordinate system according to the liquid crystal panel product style and making an abnormal CAD diagram of the abnormal process; step 212, detecting the liquid crystal panel product to obtain the product information with abnormalities; step 213, marking the position of the product with abnormalities on the abnormal CAD diagram.

[0079] Preferably, as Figure 6 , Figure 6 It is a schematic diagram of the sixth embodiment of a process defect analysis method in the present invention; step 213 includes: step 2131, marking the horizontal dimension information of the position of the product with abnormalities on the abnormal CAD diagram; step 2132, marking the vertical dimension information of the position of the product with abnormalities on the abnormal CAD diagram.

[0080] Preferably, as Figure 7 , Figure 7 It is a schematic diagram of the seventh embodiment of a process defect analysis method in the present invention; step 300 includes: step 310, obtaining the production process with abnormalities of the liquid crystal panel product according to the abnormal CAD diagram; step 320, selecting the equipment contact point cardboard corresponding to the production process from the equipment contact point position sleeve diagram cardboard according to the information of the production process; step 330, comparing the equipment contact point cardboard with the abnormal CAD diagram to quickly determine the equipment and unit with abnormalities.

[0081] As Figure 8 , Figure 8It is a schematic diagram of the first embodiment of a method for manufacturing a contact point position overlay diagram in the present invention; a method for manufacturing a contact point position overlay diagram of a device, used to manufacture a contact point position overlay diagram of a liquid crystal panel product, including: Step 400, manufacturing a CAD diagram of the contact point positions of the device corresponding to each process of the liquid crystal panel production process; Step 500, performing equal-proportion scaling on the CAD diagram of the contact point positions of the device for each process according to the scaling ratio; Step 600, manufacturing the CAD diagrams of the contact point positions of the device for all processes after scaling into a contact point position overlay diagram cardboard.

[0082] As Figure 9 , Figure 9 It is a schematic diagram of the second embodiment of a method for manufacturing a contact point position overlay diagram in the present invention; Step 400 includes: Step 410, obtaining the contact device information of each process of the liquid crystal panel production process; Step 420, obtaining the contact unit information of the contact device information according to the contact device information; Step 430, obtaining the contact type information of the contact unit according to the contact unit information.

[0083] Among them, as Figure 10 , Figure 10 It is a schematic diagram of the third embodiment of a method for manufacturing a contact point position overlay diagram in the present invention; Step 430 includes: Step 431, obtaining the contact shape of each contact type information in each liquid crystal panel product; Step 432, obtaining the distribution pattern of the contact shape among all liquid crystal panel products in the process; among them, the distribution pattern includes: the horizontal dimension information between the contact shapes and the vertical dimension information between the contact shapes.

[0084] Implementing the process defect analysis method and the method for manufacturing a contact point position overlay diagram of the device in the present invention, by manufacturing a CAD diagram of the contact point positions of the device corresponding to each process of the liquid crystal panel production process, performing equal-proportion scaling on the CAD diagram of the contact point positions of the device for each process according to the scaling ratio, and manufacturing the CAD diagrams of the contact point positions of the device for all processes after scaling into a contact point position overlay diagram cardboard, by comparing the abnormal CAD diagram with the contact point position overlay diagram cardboard, it is possible to quickly determine the device and unit where the abnormality occurs, and solve the problem in the existing liquid crystal panel production process that when an abnormality occurs, it is necessary to re-comb the device where the abnormality occurs for defect analysis, wasting manpower and not being easy to find, resulting in production delays or a high incidence of abnormal accidents.

[0085] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A process defect analysis method for analyzing defects in liquid crystal panel products, characterized in that, Including: Step 100: Produce a cardboard template of the equipment contact points for the liquid crystal panel production process; Step 200: Measure abnormal points and produce an abnormal CAD drawing of the liquid crystal panel production process; Step 300: Compare the abnormal CAD drawing with the cardboard template of the equipment contact points to determine the abnormal equipment and abnormal units; Among them, the step 200 includes: Step 210: Produce the abnormal CAD drawing according to the coordinate system; The step 100 includes: Step 110: Produce a CAD drawing of the equipment contact points for each process of the liquid crystal panel production process; Step 120: Scale the CAD drawing of the equipment contact points for each process proportionally according to the scaling ratio; Step 130: Produce a cardboard template of the equipment contact points by combining the scaled CAD drawings of the equipment contact points for all processes; The step 110 includes: Step 111: Obtain the contact equipment information for each process of the liquid crystal panel production process; Step 112: Obtain the contact unit information of the contact equipment according to the contact equipment information; Step 113: Obtain the contact type information of the contact unit according to the contact unit information; The step 113 includes: Step 1131: Obtain the contact shape of each contact type information in each liquid crystal panel product; Step 1132: Obtain the distribution pattern of the contact shape among all liquid crystal panel products in the process; Among them, the distribution pattern includes the horizontal dimension information and the vertical dimension information between the contact shapes; the distribution pattern refers to the distribution drawing of the contact points in the process CAD drawing, that is, the CAD drawing of the equipment contact points; The step 210 includes: Step 211: Establish a coordinate system according to the liquid crystal panel product style and produce an abnormal CAD drawing of the abnormal process; Step 212: Detect the liquid crystal panel products and obtain the product information of the abnormal products; Step 213: Mark the positions of the abnormal products on the abnormal CAD drawing; The step 213 includes: Step 2131: Mark the horizontal dimension information of the positions of the abnormal products on the abnormal CAD drawing; Step 2132: Mark the vertical dimension information of the positions of the abnormal products on the abnormal CAD drawing; The step 300 includes: Step 310: Obtain the abnormal production process of the liquid crystal panel product according to the abnormal CAD drawing; Step 320: Select the cardboard of the equipment contact points corresponding to the production process from the cardboard template of the equipment contact points according to the information of the production process; Step 330: Compare the cardboard of the equipment contact points with the abnormal CAD drawing to quickly determine the abnormal equipment and units.

2. A method for manufacturing a contact point overlay pattern for manufacturing a contact point overlay pattern of a liquid crystal panel product, characterized in that, Including: Step 400: Produce a CAD drawing of the equipment contact points for each process of the liquid crystal panel production process; Step 500: Scale the CAD drawing of the equipment contact points for each process proportionally according to the scaling ratio; Step 600: Produce a cardboard template of the equipment contact points by combining the scaled CAD drawings of the equipment contact points for all processes; The step 400 includes: Step 410: Obtain the contact equipment information for each process of the liquid crystal panel production process; Step 420: Obtain the contact unit information of the contact device information according to the contact device information; Step 430: Obtain the contact type information of the contact unit according to the contact unit information; The said step 430 includes: Step 431: Obtain the contact shape of each contact type information in each liquid crystal panel product; Step 432: Obtain the distribution pattern of the contact shape among all liquid crystal panel products in the process; Wherein, the said distribution pattern includes: the horizontal dimension information between the contact shapes; and the vertical dimension information between the contact shapes; The said distribution pattern refers to the distribution diagram of the contact points in the process CAD, that is, the equipment contact point CAD diagram.

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