Chip heat exchange component and electronic device

Abstract

Provided is a chip heat exchange component and an electronic device. The chip heat exchange component includes a flat heat pipe and a thermoelectric cooler; the flat heat pipe is in a plate shape and includes a surrounding portion and a protruding portion. The surrounding portion encloses a through accommodation space for accommodating a chip therein; the protruding portion protrudes outward from the surrounding portion and is used for connecting to the housing of the electronic device; a receiving groove is provided at or near the junction of the protruding portion and the surrounding portion of the flat heat pipe, and the receiving groove is used for receiving the thermoelectric cooler; the thermoelectric cooler is configured to be disposed in the receiving groove and has a first end and a second end. The first end is close to the accommodation space, and the second end is far from the accommodation space. The thermoelectric cooler is configured such that when powered on, the first end performs convective heat exchange on the chip in the accommodation space through the surrounding portion of the flat heat pipe, and the second end performs outward heat conduction through the protruding portion of the flat heat pipe connected to the housing of the electronic device. Thus, the thinness of electronic products can be balanced with the heat exchange of the chip.

Description

Technical Field

[0001] The present disclosure relates to the field of chips, and in particular, to a chip heat exchange component and an electronic device. Background Art

[0002] Currently, electronic products such as smart phones, laptop computers, and liquid crystal TVs tend to be thin. It is necessary to balance the thinness of electronic products and the heat exchange of chips at the same time. Summary of the Invention

[0003] In view of the problems in the background art, the purpose of the present disclosure is to provide a chip heat exchange component and an electronic device, which can balance the thinness of electronic products and the heat exchange of chips.

[0004] Thus, in some embodiments, a chip heat exchange component includes a flat heat pipe and a thermoelectric cooler; the flat heat pipe is in a plate shape, and the flat heat pipe includes a surrounding portion and a protruding portion. The surrounding portion defines a receiving space that penetrates through the surrounding portion in the thickness direction of the flat heat pipe, and the receiving space is used to receive a chip therein; the protruding portion protrudes outward from the surrounding portion, and the protruding portion is used to connect to the housing of the electronic device; the flat heat pipe is provided with a receiving groove at or near the junction of the protruding portion and the surrounding portion, and the receiving groove is used to receive the thermoelectric cooler; the thermoelectric cooler is configured to be disposed in the receiving groove of the flat heat pipe. The thermoelectric cooler has a first end that serves as a cold end or a hot end and a second end that serves as a hot end or a cold end. The first end is close to the receiving space, and the second end is far from the receiving space. The thermoelectric cooler is configured to, when powered on, perform convective heat exchange on the chip in the receiving space through the surrounding portion of the flat heat pipe at the first end, and perform outward heat conduction through the protruding portion of the flat heat pipe connected to the housing of the electronic device at the second end.

[0005] In some embodiments, the first end and the second end of the thermoelectric cooler are vertically disposed in the receiving groove and are respectively in contact with the corresponding walls of the receiving groove; the thermoelectric cooler further has a plurality of thermoelectric particles, and the plurality of thermoelectric particles are horizontally connected in series between the first end and the second end.

[0006] In some embodiments, the thermoelectric cooler is detachably clamped in the receiving groove through the first end and the second end.

[0007] In some embodiments, the top surface and the bottom surface of the thermoelectric cooler do not exceed the top opening and the bottom opening of the receiving groove respectively.

[0008] In some embodiments, the protruding portion of the flat heat pipe has a first horizontal section, a bending section, and a second horizontal section. The first horizontal section extends horizontally outward from the surrounding portion, the bending section bends upward from the first horizontal section, and the second horizontal section extends horizontally outward from the bending section; the receiving groove is disposed on the first horizontal section.

[0009] In some embodiments, the horizontal plane where the bottom opening of the receiving groove is located is higher than the bottom surface of the surrounding portion of the flat heat pipe, and the thermoelectric cooling sheet is installed in the receiving groove such that the bottom surface of the thermoelectric cooling sheet is higher than the bottom surface of the surrounding portion of the flat heat pipe.

[0010] In some embodiments, the contour of the inner wall of the surrounding portion is configured to be complementary to the shape of the entire outer periphery of the chip.

[0011] In some embodiments, the thermoelectric cooling sheet further has two pins, and the two pins respectively extend downward from the ends of the two thermoelectric particles located at both ends in the series conduction path among the plurality of thermoelectric particles, and the two pins are used for detachably inserting into the circuit board of the electronic device to be electrically connected to the circuit board.

[0012] In some embodiments, an electronic device includes a chip, a circuit board, a power supply, and a housing. The electronic device further includes a temperature sensor and the aforementioned chip heat exchange assembly, and the chip heat exchange assembly is disposed on the surface of the circuit board; the chip is received in the receiving space of the surrounding portion of the flat heat pipe and is electrically connected to the circuit board; the protruding portion of the heat exchange assembly is connected to the housing; the thermoelectric cooling sheet is received in the receiving groove of the flat heat pipe and is electrically connected to the circuit board; the power supply is electrically connected to the thermoelectric cooling sheet and the chip via the circuit board; the temperature sensor is disposed on the circuit board and is electrically connected to the circuit board, the temperature sensor is located in the receiving space of the surrounding portion of the flat heat pipe and is spaced apart from the chip and the surrounding portion of the flat heat pipe, the temperature sensor is used for sensing the temperature of the chip, and the temperature sensor is electrically connected to the chip via the circuit board; the chip is configured to: control the on / off, current direction, and current magnitude of the thermoelectric cooling sheet and the power supply according to the temperature sensed by the temperature sensor via the circuit board to correspondingly start or stop the operation of the thermoelectric cooling sheet, make the thermoelectric cooling sheet heat or cool, and control the power of the thermoelectric cooling sheet.

[0013] In some embodiments, the outer shape of the electronic device is a plate shape in which the thickness direction of the electronic device is consistent with the thickness direction of the circuit board and the thickness direction of the flat heat pipe.

[0014] The beneficial effects of the present disclosure are as follows: The surrounding portion encloses a receiving space that penetrates the surrounding portion along the thickness direction of the flat heat pipe, and the receiving space is used for receiving the chip therein. That is to say, the flat heat pipe and the chip both lie flat on the surface of the circuit board, which is beneficial to the thinning of the electronic device. The thermoelectric cooling sheet is used to be disposed in the receiving groove of the flat heat pipe, which is beneficial to the miniaturization of the electronic device. The combination of the flat heat pipe and the thermoelectric cooling sheet enhances the heat exchange of the chip and even the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is an exploded view of an electronic device according to the present disclosure.

[0016] Figure 2 is Figure 1Partial assembly diagram.

[0017] Figure 3 is Figure 1 An enlarged view of the flat heat pipe of the chip heat exchange component of the electronic device.

[0018] Figure 4 is Figure 1 An enlarged view of the thermoelectric cooling chip of the chip heat exchange component of the electronic device.

[0019] Among them, the reference numerals are explained as follows:

[0020] 100 Electronic device G2 Bottom opening

[0021] 1 Chip heat exchange component 12 Thermoelectric cooling chip

[0022] 11 Flat heat pipe 121 First end

[0023] 111 Surrounding part 122 Second end

[0024] S Receiving space 123 Thermoelectric particles

[0025] 111a Bottom surface 124 Top surface

[0026] 111b Inner wall 125 Bottom surface

[0027] 112 Protrusion 126 Pin

[0028] 112a First horizontal section 2 Chip

[0029] 112b Bending section 3 Circuit board

[0030] 112c Second horizontal section 4 Power supply

[0031] G Receiving groove 5 Housing

[0032] G1 Top opening 6 Temperature sensor Detailed implementation manners

[0033] The accompanying drawings illustrate embodiments of the present disclosure, and it will be understood that the disclosed embodiments are only examples of the present disclosure, and the present disclosure can be implemented in various forms. Therefore, the specific details disclosed herein should not be construed as limiting, but only as the basis of the claims and as a representative basis for teaching those of ordinary skill in the art to implement the present disclosure in various ways.

[0034] Referring to Figures 1 to 4 , the electronic device 100 includes a chip heat exchange component 1, a chip 2, a circuit board 3, a power supply 4, a housing 5, and a temperature sensor 6.

[0035] The chip heat exchange component 1 is disposed on the board surface 31 of the circuit board 3. The chip heat exchange component 1 includes a flat heat pipe 11 and a thermoelectric cooler 12. The combination of the flat heat pipe 11 and the thermoelectric cooler 12 enhances the heat exchange with the chip 2 and even with the circuit board 3.

[0036] The flat heat pipe 11 is in a plate shape. The flat heat pipe 11 includes a surrounding portion 111 and a protruding portion 112.

[0037] The surrounding portion 111 defines a receiving space S that penetrates through the surrounding portion 111 in the thickness direction of the flat heat pipe 11 for receiving the chip 2 therein. That is to say, both the flat heat pipe 11 and the chip 2 lie flat on the board surface 31 of the circuit board 3. Thus, in the thickness direction of the electronic device 100 (i.e., the thickness direction of the circuit board 3), the maximum dimension occupied by the surrounding portion 111 of the flat heat pipe 11 and the chip 2 is based on the larger one of the two, which is conducive to the thinning of the electronic device 100. When the thickness of the surrounding portion 111 of the flat heat pipe 11 is greater than or equal to the thickness of the chip 2, the entire circumference of the chip 2 can fully exchange heat with the surrounding portion 111 of the flat heat pipe 11, which further improves the heat exchange efficiency between the flat heat pipe 11 and the chip 2. In addition, by receiving the chip 2 in the surrounding portion 111, it is beneficial to provide protection for the chip 2 in two dimensions, longitudinally and laterally, when the electronic device 100 is subjected to an external impact. Especially when the thickness of the surrounding portion 111 of the flat heat pipe 11 is greater than the thickness of the chip 2, the surrounding portion 111 of the flat heat pipe 11 can provide anti-external impact protection for the chip 2 in three dimensions, longitudinally, laterally, and in the thickness direction. In addition, in combination with the shape and arrangement of the surrounding portion 111, the surrounding portion 111 not only exchanges heat with the chip 2 but also exchanges heat with the circuit board 3, thereby enabling the circuit board 3 of the electronic device 100 to also be at a constant and appropriate operating temperature. Thus, it is possible to take into account both the thinning of the electronic device 100 and the heat exchange of the chip 2 and even the circuit board 3.

[0038] In one example, the contour of the inner wall 111b of the surrounding portion 111 is configured to be complementary to the shape of the entire outer periphery of the chip 2. Thus, the compactness of the assembly between the surrounding portion 111 and the chip 2 can be improved.

[0039] The protruding portion 112 protrudes outward from the surrounding portion 111. The protruding portion 112 is used to connect to the housing 5. Thus, the chip 2, the surrounding portion 111, the protruding portion 112, and the housing 5 form a heat transfer path. In one example, as Figure 1 and Figure 2 shown, the circuit board 3 is usually long in the longitudinal direction ( Figure 1 the left - right direction in Figure 1In the front-rear direction), it is a short rectangular thin plate, and the protruding portion 112 preferably protrudes outward from the surrounding portion 111 along the longitudinal direction, so that the space in the longitudinal direction of the board surface 31 of the circuit board 3 can be fully utilized, the length of the protruding portion 112 can be increased, thereby increasing the heat exchange volume of the flat heat pipe 11 and improving the heat exchange efficiency.

[0040] The flat heat pipe 11 is provided with a receiving groove G at or near the junction of the protruding portion 112 and the surrounding portion 111, and the receiving groove G is used to receive the thermoelectric cooling sheet 12.

[0041] The thermoelectric cooling sheet 12 is used to be arranged in the receiving groove G of the flat heat pipe 11. Specifically, the thermoelectric cooling sheet 12 is received in the receiving groove G of the flat heat pipe 11 and is electrically connected to the circuit board 3. The thermoelectric cooling sheet 12 is received in the receiving groove G of the flat heat pipe 11, reducing the space occupation rate of the chip heat exchange assembly 1, which is beneficial to the miniaturization of the electronic device 100. The thermoelectric cooling sheet 12 has a first end 121 serving as a cold end or a hot end and a second end 122 serving as a hot end or a cold end. The first end 121 is close to the receiving space S, and the second end 122 is far from the receiving space S. The thermoelectric cooling sheet 12 is configured such that when energized, the first end 121 performs convective heat exchange on the chip 2 in the receiving space S through the surrounding portion 111 of the flat heat pipe 11, and the second end 122 performs outward heat conduction through the protruding portion 112 of the flat heat pipe 11 connected to the housing 5.

[0042] As Figure 4 shown, both the first end 121 and the second end 122 are flat plates, and in contrast Figure 1 and Figure 2 , the first end 121 and the second end 122 of the thermoelectric cooling sheet 12 are erected in the receiving groove G and are respectively in contact with the corresponding walls of the receiving groove G, so that the large areas of the plate surfaces of the first end 121 and the second end 122 can be fully utilized for heat exchange, improving the overall heat exchange capacity of the chip heat exchange assembly 1. When the first end 121 serves as the cold end and the second end 122 serves as the hot end, the chip heat exchange assembly 1 is used to cool the chip 2. When the first end 121 serves as the hot end and the second end 122 serves as the cold end, the chip 2 heat exchange assembly 1 is used to heat the chip 2, so that the chip 2 can be maintained at a constant and appropriate operating temperature.

[0043] As Figure 4 shown, the thermoelectric cooling sheet 12 also has a plurality of thermoelectric particles 123, and the plurality of thermoelectric particles 123 are horizontally connected in series between the first end 121 and the second end 122. The thermoelectric particles 123 can be prepared from any suitable material.

[0044] For the convenience of assembly, in one example, the thermoelectric cooling sheet 12 is detachably clamped in the receiving groove G through the first end 121 and the second end 122.

[0045] In one example, the top surface 124 and the bottom surface 125 of the thermoelectric cooling chip 12 do not extend beyond the top opening G1 and the bottom opening G2 of the receiving groove G respectively. Thus, the entire area of the plate surfaces of the first end 121 and the second end 122 of the thermoelectric cooling chip 12 is used for heat exchange with the flat heat pipe 11, thereby improving the heat exchange capacity between the flat heat pipe 11 and the chip 2. In addition, the receiving groove G also provides protection for the thermoelectric cooling chip 12, preventing external impact forces or accidental contact of the thermoelectric cooling chip 12 by hand from both sides in the thickness direction of the flat heat pipe 11 during installation, which may cause the thermoelectric cooling chip 12 to move in the thickness direction of the flat heat pipe 11 and partially come out of the receiving groove G, thereby reducing the heat exchange efficiency of the thermoelectric cooling chip 12.

[0046] In one example, as Figure 3 shown, the protruding portion 112 of the flat heat pipe 11 has a first horizontal section 112a, a bending section 112b, and a second horizontal section 112c. The first horizontal section 112a extends horizontally outward from the surrounding portion 111, the bending section 112b bends upward from the first horizontal section 112a, and the second horizontal section 112c extends horizontally outward from the bending section 112b; the receiving groove G is provided in the first horizontal section 112a. The setting of the bending section 112b is beneficial to improving the buffering performance of the flat heat pipe 11 when resisting external impacts, thereby reducing the deformation or displacement of the flat heat pipe 11 under external impacts, and ensuring the heat exchange stability of the flat heat pipe 11. The first horizontal section 112a is connected to the second horizontal section 112c via the upward-bending bending section 112b, so that a space is formed between the second horizontal section 112c and the plate surface 31 of the circuit board 3, and any electronic components required by the electronic device 100 can be arranged in this space, improving the space utilization rate and being beneficial to the compactness and miniaturization of the electronic device 100.

[0047] The horizontal plane where the bottom opening G2 of the receiving groove G is located is higher than the bottom surface 111a of the surrounding portion 111 of the flat heat pipe 11, and the thermoelectric cooling chip 12 is installed in the receiving groove G such that the bottom surface 125 of the thermoelectric cooling chip 12 is higher than the bottom surface 111a of the surrounding portion 111 of the flat heat pipe 11. That is to say, the bottom surface 111a of the surrounding portion 111 of the flat heat pipe 11 is in contact with the plate surface 31 of the circuit board 3, and the receiving groove G and the thermoelectric cooling chip 12 are spaced apart from the plate surface 31 of the circuit board 3 by a certain distance. This avoids external impacts directly acting on the receiving groove G of the first horizontal section 112a and the thermoelectric cooling chip 12 via the plate surface 31 of the circuit board 3, and improves the working stability of the thermoelectric cooling chip 12.

[0048] In one example, as Figure 4As shown, the thermoelectric cooling chip 12 also has two pins 126. The two pins 126 respectively extend downward from the ends of two thermoelectric particles 123 located at both ends in the series conduction path among the plurality of thermoelectric particles 123. The two pins 126 are used to be detachably inserted into the circuit board 3 of the electronic device 100 (the circuit board 3 is provided with conductive through holes (not shown)) to be electrically connected to the circuit board 3. In this way, the thermoelectric cooling chip 12 is electrically connected to the internal circuit of the circuit board 3 via the two pins 126, which is beneficial for the chip 2 described later to control the thermoelectric cooling chip 12 via the internal circuit of the circuit board 3 and the two pins 126. At the same time, it can also make full use of the power supply 4 of the electronic device 100 as the power supply of the thermoelectric cooling chip 12, without setting a separate power supply for the thermoelectric cooling chip 12, improving the integration degree of the electronic device 100, reducing components, and lowering costs. In addition, the two pins 126 are also beneficial for the suspended positioning of the first end 121 and the second end 122 of the thermoelectric cooling chip 12 relative to the board surface 31 of the circuit board 3, thereby enhancing the working stability of the thermoelectric cooling chip 12 described above. The two pins 126 can be detachably inserted into the circuit board 3 of the electronic device 100 by means of press fitting.

[0049] The chip 2 is housed in the accommodation space S of the surrounding portion 111 of the flat heat pipe 11 and is electrically connected to the circuit board 3. The chip 2 is configured such that the chip 2 controls the on / off of the thermoelectric cooling chip 12 and the power supply 4, the current direction, and the current magnitude of the thermoelectric cooling chip 12 via the circuit board 3 according to the temperature sensed by the temperature sensor 6, so as to start or stop the operation of the thermoelectric cooling chip 12, make the thermoelectric cooling chip 12 heat or cool, and control the power of the thermoelectric cooling chip 12 accordingly. It should be noted that the change in the current direction of the thermoelectric cooling chip 12 makes the aforementioned first end 121 serve as the cold end or the hot end, and the corresponding second end 122 serves as the hot end and the cold end. By controlling the power of the thermoelectric cooling chip 12, the heat exchange capacity of the chip heat exchange assembly 1 can be changed in real time, thereby ensuring the long-term working stability of the chip 2.

[0050] The circuit board 3 is in a flat shape. A circuit (not shown) is provided inside the circuit board 3.

[0051] The power supply 4 is electrically connected to the thermoelectric cooling chip 12 and the chip 2 via the circuit board 3. The power supply 4 can be a secondary battery, and the secondary battery can be a plate-type secondary battery, which is beneficial for improving the thinness of the electronic device 100.

[0052] The housing 5 is made of any suitable material, for example, a thermally conductive insulating material is used for injection molding.

[0053] The temperature sensor 6 is disposed on the circuit board 3 and electrically connected to the circuit board 3. The temperature sensor 6 is located within the accommodation space S of the surrounding portion 111 of the flat heat pipe 11 and spaced apart from the chip 2 and the surrounding portion 111 of the flat heat pipe 11. The temperature sensor 6 is used to sense the temperature of the chip 2, and the temperature sensor 6 is electrically connected to the chip 2 via the circuit board 3.

[0054] Based on the above and as Figure 1 and Figure 2 shown, the outer shape of the electronic device 100 is plate-shaped with the thickness direction of the electronic device 100 being consistent with the thickness directions of the circuit board 3 and the flat heat pipe 11, which is beneficial to improving the thinness of the electronic device 100.

[0055] Multiple exemplary embodiments are described with the above detailed description, but this document is not intended to be limited to the explicitly disclosed combinations. Thus, unless otherwise stated, the various features disclosed herein can be combined together to form multiple additional combinations not shown for the sake of brevity.

Claims

1. A chip heat exchange component (1), characterized in that, The chip heat exchange component (1) is used to be arranged on the board surface (31) of the circuit board (3); The chip heat exchange component (1) includes a flat heat pipe (11) and a thermoelectric cooling sheet (12); The flat heat pipe (11) is plate-shaped, and the flat heat pipe (11) includes a surrounding portion (111) and a protruding portion (112), The surrounding portion (111) defines a receiving space (S) that penetrates through the surrounding portion (111) in the thickness direction of the flat heat pipe (11), and the receiving space (S) is used to receive the chip (2) therein; The protruding portion (112) protrudes outward from the surrounding portion (111), and the protruding portion (112) is used to be connected to the housing (5) of the electronic device (100); The flat heat pipe (11) is provided with a receiving groove (G) at or near the junction of the protruding portion (112) and the surrounding portion (111), and the receiving groove (G) is used to receive the thermoelectric cooling sheet (12); The thermoelectric cooling sheet (12) is used to be arranged in the receiving groove (G) of the flat heat pipe (11). The thermoelectric cooling sheet (12) has a first end (121) as the cold end and a second end (122) as the hot end. The first end (121) is close to the receiving space (S), and the second end (122) is far from the receiving space (S). The thermoelectric cooling sheet (12) is configured such that when powered on, the first end (121) conducts convective heat exchange with the chip (2) in the receiving space (S) through the surrounding portion (111) of the flat heat pipe (11), and the second end (122) conducts outward heat conduction through the protruding portion (112) of the flat heat pipe (11) connected to the housing (5) of the electronic device (100); The first end (121) and the second end (122) of the thermoelectric cooling sheet (12) are erected in the receiving groove (G) and are respectively in contact with the corresponding walls of the receiving groove (G); The thermoelectric cooling sheet (12) also has a plurality of thermoelectric particles (123), and the plurality of thermoelectric particles (123) are horizontally connected in series between the first end (121) and the second end (122); The thermoelectric cooling sheet (12) also has two pins (126). The two pins (126) respectively extend downward from the ends of the two thermoelectric particles (123) located at both ends in the series conduction path among the plurality of thermoelectric particles (123). The two pins (126) are used to be detachably inserted into the circuit board (3) of the electronic device (100) to be electrically connected to the circuit board (3). The two pins (126) suspend and position the first end (121) and the second end (122) of the thermoelectric cooling sheet (12) relative to the board surface (31) of the circuit board (3); The horizontal plane where the bottom opening (G2) of the receiving groove (G) is located is higher than the bottom surface (111a) of the surrounding portion (111) of the flat heat pipe (11), and the thermoelectric cooling sheet (12) is installed in the receiving groove (G) such that the bottom surface (125) of the thermoelectric cooling sheet (12) is higher than the bottom surface (111a) of the surrounding portion (111) of the flat heat pipe (11).

2. The chip heat exchange component (1) according to claim 1, characterized in that, The thermoelectric cooling sheet (12) is detachably clamped in the receiving groove (G) through the first end (121) and the second end (122).

3. The chip heat exchange assembly (1) according to claim 1, characterized in that The top surface (124) and the bottom surface (125) of the thermoelectric cooling sheet (12) do not exceed the top opening (G1) and the bottom opening (G2) of the receiving groove (G), respectively.

4. The chip heat exchange assembly (1) according to claim 1, characterized in that The protruding portion (112) of the flat heat pipe (11) has a first horizontal section (112a), a bending section (112b) and a second horizontal section (112c). The first horizontal section (112a) extends horizontally outward from the surrounding portion (111), the bending section (112b) bends upward from the first horizontal section (112a), and the second horizontal section (112c) extends horizontally outward from the bending section (112b). The receiving groove (G) is arranged on the first horizontal section (112a).

5. The chip heat exchange assembly (1) according to claim 1, characterized in that The contour of the inner wall (111b) of the surrounding portion (111) is configured to be complementary to the shape of the entire outer periphery of the chip (2).

6. An electronic device (100), comprising a chip (2), a circuit board (3), a power supply (4) and a housing (5), characterized in that, The electronic device (100) further includes a temperature sensor (6) and the chip heat exchange assembly (1) according to any one of claims 1-5. The chip heat exchange assembly (1) is arranged on the board surface (31) of the circuit board (3). The chip (2) is received in the receiving space (S) of the surrounding portion (111) of the flat heat pipe (11) and is electrically connected to the circuit board (3). The protruding portion (112) of the heat exchange assembly is connected to the housing (5). The thermoelectric cooling sheet (12) is received in the receiving groove (G) of the flat heat pipe (11) and is electrically connected to the circuit board (3). The power supply (4) is electrically connected to the thermoelectric cooling sheet (12) and the chip (2) via the circuit board (3). The temperature sensor (6) is arranged on the circuit board (3) and is electrically connected to the circuit board (3). The temperature sensor (6) is located in the receiving space (S) of the surrounding portion (111) of the flat heat pipe (11) and is spaced apart from the chip (2) and the surrounding portion (111) of the flat heat pipe (11). The temperature sensor (6) is used to sense the temperature of the chip (2), and the temperature sensor (6) is electrically connected to the chip (2) via the circuit board (3). The chip (2) is configured to: control the on / off, current direction and current magnitude of the thermoelectric cooling sheet (12) and the power supply (4) according to the temperature sensed by the temperature sensor (6) via the circuit board (3), so as to correspondingly start or stop the operation of the thermoelectric cooling sheet (12), heat or cool the thermoelectric cooling sheet (12), and adjust the power of the thermoelectric cooling sheet (12).

7. The electronic device (100) according to claim 6, characterized in that, The outer shape of the electronic device (100) is a plate shape in which the thickness direction of the electronic device (100) is consistent with the thickness direction of the circuit board (3) and the thickness direction of the flat heat pipe (11).

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