Valve box module, semiconductor device manufacturing system and method for manufacturing semiconductor device

Abstract

Embodiments of the present invention relate to a semiconductor device manufacturing system and a method for manufacturing a semiconductor device. The semiconductor device manufacturing system includes a valve box module, a controller, a purge gas source, and at least one semiconductor manufacturing tool. The valve box module includes at least one rod and a first gas pipeline in fluid communication with the at least one rod. In addition, the first gas pipeline includes a pneumatic valve and a pressure transmitter downstream of the pneumatic valve. The controller is connected to the pneumatic valve and the pressure transmitter of the first gas pipeline. The purge gas source is in fluid communication with the first gas pipeline. The at least one semiconductor manufacturing tool is coupled to the at least one rod.

Description

Technical Field

[0001] The embodiments of the present invention relate to a valve box module, a semiconductor device manufacturing system and a method for manufacturing a semiconductor device. Background Art

[0002] In general, a VMB (valve manifold box) for outputting and inputting semiconductor process gas includes a process gas line coupled to a process gas source, a plurality of rods respectively coupled to a plurality of semiconductor manufacturing tools, and a purge gas line coupled to a purge gas source. The purge gas line connects the rods and is configured to supply the purge gas into the rods, and the process gas line connects the rods and is configured to supply the process gas into the rods. Therefore, the VMB is configured to supply process gas from a single process gas line to different rods at the same time and to supply purge gas from a single purge gas line to different rods at the same time.

[0003] Before the semiconductor manufacturing tool is detached from the rod, the rod should be purged with a purge gas from a purge gas line. Summary of the invention

[0004] An embodiment of the present invention relates to a valve box module for a semiconductor device manufacturing system, comprising: at least one rod; and a first gas pipeline, which is fluidically connected to the at least one rod and is configured to supply a purge gas to the at least one rod; wherein the first gas pipeline comprises a pneumatic valve and a pressure transmitter downstream of the pneumatic valve, and wherein the pneumatic valve is configured to cooperate with the pressure transmitter.

[0005] An embodiment of the present invention relates to a semiconductor device manufacturing system, which includes: a valve box module, which includes: at least one rod; and a first gas pipeline, which is fluidically connected to the at least one rod, wherein the first gas pipeline includes a pneumatic valve and a pressure transmitter downstream of the pneumatic valve; a controller, which connects the pneumatic valve and the pressure transmitter of the first gas pipeline; a purge gas source, which is fluidically connected to the first gas pipeline; and at least one semiconductor manufacturing tool, which is coupled to the at least one rod.

[0006] An embodiment of the present invention relates to a method for manufacturing a semiconductor device, which includes: evacuating a rod, wherein the rod is fluidically connected to a semiconductor manufacturing tool; opening a purge valve of a first gas line, wherein the first gas line is fluidically connected to the rod; opening the valve of the first gas line to allow the purge gas to flow into the first gas line, wherein the valve is upstream of the purge valve; controlling a pneumatic valve and a pressure transmitter of the first gas line by a controller to perform a purge process, wherein the pneumatic valve and the pressure transmitter are positioned between the valve and the purge valve, and wherein the pressure transmitter is downstream of the pneumatic valve; when the pressure transmitter detects a first pressure value, the controller opens the pneumatic valve to allow the purge gas to flow into the rod, and when the pressure transmitter detects a second pressure value, the controller closes the pneumatic valve to prevent the purge gas from flowing into the rod, wherein the second pressure value is higher than the first pressure value; and alternating the opening of the pneumatic valve to allow the purge gas to flow into the rod and the closing of the pneumatic valve to prevent the purge gas from flowing into the rod for several cycles. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Aspects of the present disclosure are best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with standard industry practice, various components are not drawn to scale. In fact, the dimensions of the various components may be arbitrarily increased or reduced for clarity of discussion.

[0008] Figure 1 is a schematic diagram of a semiconductor device manufacturing system according to some embodiments of the present invention.

[0009] Figure 2 is a flow chart representing exemplary operations of a method for manufacturing a semiconductor device by a semiconductor device manufacturing system according to some embodiments of the present invention.

[0010] Figure 3 is another flow chart representing exemplary operations of a method for manufacturing a semiconductor device by a semiconductor device manufacturing system according to some embodiments of the present invention.

[0011] Figure 4 is another flow chart representing exemplary operations of a method for manufacturing a semiconductor device by a semiconductor device manufacturing system according to some embodiments of the present invention.

[0012] Figure 5 is another flow chart representing exemplary operations of a method for manufacturing a semiconductor device by a semiconductor device manufacturing system according to some embodiments of the present invention.

[0013] Figure 6is another flow chart representing exemplary operations of a method for manufacturing a semiconductor device by a semiconductor device manufacturing system according to some embodiments of the present invention. DETAILED DESCRIPTION

[0014] The following disclosure provides many different embodiments or examples for implementing the different features of the provided theme. The specific examples of components and arrangements will be described below to simplify this disclosure. Of course, these are only examples and are not intended to be limiting. For example, in the following description, forming a first member above or on a second member may include an embodiment in which the first member and the second member that directly contact are formed, and may also include an embodiment in which an additional member may be formed between the first member and the second member so that the first member and the second member may not directly contact. In addition, this disclosure may repeat element symbols and / or letters in various examples. This repetition is for simplicity and clarity and does not itself indicate the relationship between the various embodiments and / or configurations discussed.

[0015] It is intended that this description of the illustrative embodiments be read in conjunction with the accompanying drawings, which should be considered as part of the entire written description. In the description of the embodiments disclosed herein, any reference to direction or orientation is intended only to facilitate description and is in no way intended to limit the scope of the present disclosure. Relative terms such as "lower", "upper", "horizontal", "vertical", "above", "below", "upward", "downward", "top" and "bottom" and their derivatives (such as "horizontally", "downwardly", "upwardly", etc.) should be interpreted as reference orientations, as described or shown in the figures discussed below. These relative terms are only for convenience of description and do not require the device to be constructed or operated in a specific orientation. Unless otherwise expressly described, terms such as "attach", "attach", "connect" and "interconnect" refer to relationships and removable or rigid attachments or relationships in which structures are fixed or attached to each other directly or indirectly through intervening structures. In addition, the features and benefits of the present disclosure are illustrated by reference to the embodiments. Therefore, the present disclosure is clearly not limited to such embodiments that illustrate some possible non-limiting combinations of features that may exist alone or in other combinations of features; the scope of the present disclosure is defined by the appended claims.

[0016] A common valve manifold box (VMB) is a separate dedicated device unit for delivering gas from a single source container to multiple usage points. The VMB has an inlet port for receiving gas from a gas cabinet, wherein the port is coupled to a gas distribution line from the gas cabinet, and the VMB is used to divide the gas flow from the gas cabinet distribution line into multiple streams, which are discharged from multiple outlets of the valve manifold box. The gas pressure of the distributed gas flow can be adjusted at such locations, for example, by providing a flow control valve, regulator, flow restriction orifice or other gas pressure regulating element at each individual outlet of the gas cabinet or VMB.

[0017] The VMB is typically constructed to allow independent monitoring, control and maintenance of each so-called process "stem," ie, the portion of the flow circuit associated with a given outlet port of the VMB and used to supply gas from the VMB to an associated downstream process tool.

[0018] The independent nature of the respective rods associated with the VMB and supplied from a single gas supply in a gas cabinet coupled to the VMB allows for termination of gas flow through one or more of the rods connected to corresponding ones of multiple semiconductor tools served by the single gas supply in the gas cabinet without interrupting gas flow through other rods serving other process tools.

[0019] Before the process tool is detached from the VMB, a manual cycle purge should be performed on the rod coupled to the process tool.

[0020] The present disclosure provides a semiconductor device manufacturing system that instantly and efficiently purges a rod coupled to a process tool before the process tool is detached from a VMB or the like.

[0021] Figure 1 is a schematic diagram of a semiconductor device manufacturing system 1 according to some embodiments of the present invention. In some embodiments of the present invention, the semiconductor device manufacturing system 1 includes a valve box module 10, a controller 20 connected to the valve box module 10, a process gas source 110 connected to the valve box module 10, a purge gas source 120 connected to the valve box module 10, and semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37, 38 connected to the valve box module 10. The purge gas source 120 is configured to provide a purge gas. In some embodiments of the present invention, the purge gas includes nitrogen.

[0022] In some embodiments of the present invention, the valve box module 10 includes a process gas line 11, a purge gas line 12, and rods 131, 132, 133, 134, 135, 136, 137, and 138. The process gas line 11 can be connected to the rods 131, 132, 133, 134, 135, 136, 137, and 138 and is coupled to the rods 131, 132, 133, 134, 135, 136, 137, and 138 in gas flow communication. The purge gas line 12 can be connected to the rods 131, 132, 133, 134, 135, 136, 137, and 138 and is coupled to the rods 131, 132, 133, 134, 135, 136, 137, and 138 in gas flow communication.

[0023] The process gas line 11 may be coupled to a process gas source 110 and include a valve 111. The valve 111 is configured to selectively open or close to control the flow of process gas from the process gas source 110 into the VMB 10 and the process gas line (downstream of the valve 111). In some embodiments of the present invention, the process gas line 11 may further include an expansion port 112.

[0024] like Figure 1 , the process gas line 11 may be connected to rods 131, 132, 133, 134, 135, 136, 137, and 138. The rod 131 may include a first valve 1311, a regulator valve 1312, a pressure transmitter 1313, and a second valve 1314, and the rod 131 may be further connected to the semiconductor manufacturing tool 31. The rod 132 may include a first valve 1321, a regulator valve 1322, a pressure transmitter 1323, and a second valve 1324, and the rod 132 may be further connected to the semiconductor manufacturing tool 32. The rod 133 may include a first valve 1331, a regulator valve 1332, a pressure transmitter 1333, and a second valve 1334, and the rod 133 may be further connected to the semiconductor manufacturing tool 33. The stem 134 may include a first valve 1341, a regulator valve 1342, a pressure transmitter 1343, and a second valve 1344, and the stem 134 may be further connected to the semiconductor manufacturing tool 34. The stem 135 may include a first valve 1351, a regulator valve 1352, a pressure transmitter 1353, and a second valve 1354, and the stem 135 may be further connected to the semiconductor manufacturing tool 35. The stem 136 may include a first valve 1361, a regulator valve 1362, a pressure transmitter 1363, and a second valve 1364, and the stem 136 may be further connected to the semiconductor manufacturing tool 36. The stem 137 may include a first valve 1371, a regulator valve 1372, a pressure transmitter 1373, and a second valve 1374, and the stem 137 may be further connected to the semiconductor manufacturing tool 37. The stem 138 may include a first valve 1381, a regulator valve 1382, a pressure transmitter 1383, and a second valve 1384, and the stem 138 may be further connected to the semiconductor manufacturing tool 38. These valves in the respective stems may be selectively opened or closed to facilitate the flow of process gas through the stem containing the open valves to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37, and / or 38 as operated at a given time in the semiconductor manufacturing operation.

[0025] In addition, the purge gas line 12 may be coupled to a purge gas source 120. In some embodiments of the present invention, the purge gas line 12 includes a valve 121, a regulator valve 122, a pneumatic valve 123, a check valve 124, and a pressure transmitter 125. The valve 121 may be adjacent to the purge gas source 120 and configured to be selectively opened or closed to control the purge gas from the purge gas source 120 into the purge gas line 12. The regulator valve 122 is downstream of the valve 121. The pneumatic valve 123 is downstream of the regulator valve 122. The check valve 124 is downstream of the pneumatic valve 123. The pressure transmitter 125 is downstream of the check valve 124. In addition, referring to Figure 1 , the corresponding rods 131, 132, 133, 134, 135, 136, 137 and 138 are coupled to the purge gas pipeline 12, and the purge gas pipeline 12 includes corresponding purge gas pipeline loops containing purge valves 1201, 1202, 1203, 1204, 1205, 1206, 1207 and 1208 to provide purge gas flows to the rods 131, 132, 133, 134, 135, 136, 137 and 138, respectively. Figure 1 , the purge valves 1201 , 1202 , 1203 , 1204 , 1205 , 1206 , 1207 , and 1208 may be adjacent to the junctions between the respective purge gas line loops of the purge gas line 12 and the respective rods 131 , 132 , 133 , 134 , 135 , 136 , 137 , and 138 .

[0026] The pneumatic valve 123 and the pressure transmitter 125 may be connected to the controller 20. In some embodiments of the present invention, the controller 20 includes a programmable logic controller (PLC). The pressure transmitter 125 is configured to detect the gas pressure in the purge gas pipeline 12 and / or detect the gas pressure in the rods 131, 132, 133, 134, 135, 136, 137, and / or 138 when the purge valves 1201, 1202, 1203, 1204, 1205, 1206, 1207, and / or 1208 are opened. In addition, the pressure transmitter 125 may transmit the pressure value detected by it to the controller 20. The user may know the gas pressure in the purge gas pipeline 12 and / or the rods 131, 132, 133, 134, 135, 136, 137, and / or 138 through the controller 20. The controller 20 may control the pneumatic valve 123 based on the pressure value from the pressure transmitter 125. In some embodiments of the present invention, when the pressure transmitter 125 detects that the air pressure value in the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 reaches a specific pressure value, the controller 20 can open the pneumatic valve 123 so that the purge gas from the purge gas source 120 passes through the pneumatic valve 123 and then flows into the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 by opening the purge valves 1201, 1202, 1203, 1204, 1205, 1206, 1207 and / or 1208. In some embodiments of the present invention, when the pressure transmitter 125 detects that the gas pressure value in the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 reaches another specific pressure value, the controller 20 may close the pneumatic valve 123 to prevent the purge gas from flowing into the rods 131, 132, 133, 134, 135, 136, 137 and / or 138. In other words, the pneumatic valve 123 may cooperate with the pressure transmitter 125.

[0027] Figure 2 is a flow chart representing exemplary operations of a method for manufacturing a semiconductor device by a semiconductor device manufacturing system according to some embodiments of the present invention. Figure 2 The method 500 shown in the figures involves purging the stems 131, 132, 133, 134, 135, 136, 137 and / or 138 of the valve box module 10 before the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 are detached from the stems 131, 132, 133, 134, 135, 136, 137 and / or 138 of the valve box module 10.

[0028] In operation 501, the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached are evacuated until the gas pressure in the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 is equal to or less than 0 psi.

[0029] In operation 502, purge valves 1201, 1202, 1203, 1204, 1205, 1206, 1207 and / or 1208 of a purge gas line loop fluidly connected to stems 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached are opened.

[0030] In operation 503 , the valve 121 of the purge gas line 12 is opened so that the purge gas from the purge gas source 120 flows into the VMB 10 and the purge gas line (downstream of the valve 121 ).

[0031] In operation 504, a purge process is performed. The controller 20 is configured to drive the pneumatic valve 123 and the pressure transmitter 125 of the purge gas line 12. The pressure transmitter 125 is configured to detect the gas pressure in the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached and transmit the detected pressure value thereof to the controller 20. In addition, the controller 20 is configured to open the pneumatic valve 123 based on the pressure value detected by the pressure transmitter 125 so that the purge gas flows into the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached, or to close the pneumatic valve 123 so that the purge gas cannot flow into any rod.

[0032] In some embodiments of the present invention, in the initial stage, the pneumatic valve 123 is closed and the pressure transmitter 125 is driven to detect the air pressure in the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached. In operation 5041, because the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached are continuously evacuated and the pneumatic valve 123 is closed, the pressure transmitter 125 can detect that the air pressure in the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 is equal to or less than 0 psi. When the pressure transmitter 125 detects that the gas pressure in the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached reaches a first predetermined pressure value, the controller 20 is configured to open the pneumatic valve 123 so that the purge gas from the purge gas source 120 flows into the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached. In some embodiments of the present invention, the first predetermined pressure value is equal to or less than 0 psi. In operation 5043, gas pressure in rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached increases after pneumatic valve 123 is opened and purge gas flows into the rods. When the pressure transmitter 125 detects that the gas pressure in the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached reaches a second predetermined pressure value, the controller 20 is configured to close the pneumatic valve 123 so that the purge gas is blocked from flowing into the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached. In some embodiments of the present invention, the second predetermined pressure value is greater than 0 psi. Furthermore, after closing the pneumatic valve, the gas pressure in the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached decreases as the rods continue to be evacuated.When the pressure transmitter 125 detects that the gas pressure in the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached reaches a first predetermined pressure value, the controller 20 reopens the pneumatic valve 123 so that the purge gas flows into the rods again.

[0033] Operations 5041 and 5043 may be performed a predetermined number of times (e.g., X times) or a number of cycles. In some embodiments of the present invention, the predetermined number of cycles is 5 to 20 cycles. In some embodiments of the present invention, the predetermined number of cycles is 8 to 10 cycles. In some embodiments of the present invention, the predetermined number of cycles is 10 cycles. In some embodiments of the present invention, the predetermined number of cycles is greater than 20 cycles.

[0034] In operation 505, after performing operations 5041 and 5043 a predetermined number of times or a number of cycles, the valve 121 of the purge gas pipeline 12 is returned to closed and the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached are continuously evacuated so that the purge gas remaining in the rods is released from the rods until there is no purge gas in the rods.

[0035] In operation 506, purge valves 1201, 1202, 1203, 1204, 1205, 1206, 1207 and / or 1208 of the purge gas pipeline circuit fluidly connected to the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached are closed.

[0036] The method 500 will be further described below using the process of detaching the semiconductor manufacturing tools 31 and 33 as a reference. After the semiconductor manufacturing tools 31 and 33 are detached from the valve box module 10, as described in operation 501, the rods 131 and 133 of the valve box modules 10 respectively coupled to the semiconductor manufacturing tools 31 and 33 are evacuated until the gas pressure in the rods 131 and 133 is equal to or less than 0 psi.

[0037] As illustrated in operation 502, purge valves 1201 and 1203, which are in communication with stems 131 and 133, respectively, are opened.

[0038] As illustrated in operation 503 , the valve 121 of the purge gas line 12 is opened so that the purge gas from the purge gas source 120 flows into the purge gas line 12 .

[0039] As illustrated in operation 504, the pneumatic valve 123 and the pressure transmitter of the purge gas line 12 are driven by the controller 20. As illustrated in operation 5041, the controller 20 is configured to open the pneumatic valve 123 when the pressure transmitter detects that the gas pressure in the rods 131 and 133 reaches a first predetermined pressure value (i.e., 0 psi), so that the purge gas flows into the rods 131 and 133. After the pneumatic valve 123 is opened and the purge gas flows into the rods 131 and 133, the gas pressure in the rods 131 and 133 increases. As illustrated in operation 5043, when the pressure transmitter 125 detects that the gas pressure in the rods 131 and 133 reaches a second predetermined pressure value (i.e., 20 psi), the controller 20 is configured to close the pneumatic valve 123 so that the purge gas cannot flow into the rods 131 and 133. After the pneumatic valve 123 is closed by the controller 20, the gas pressure in the rods 131 and 133 decreases because the rods 131 and 133 continue to be evacuated. When the pressure transmitter 125 detects that the gas pressure in the rods 131 and 133 reaches the first predetermined pressure value again, the controller 20 is configured to reopen the pneumatic valve 123 so that the purge gas again flows into the rods 131 and 133. Such operations 5041 and 5043 are performed for a predetermined number of cycles (i.e., 20 times).

[0040] As illustrated in operation 505 , after operations 5041 and 5043 are performed a predetermined number of cycles, valve 121 of purge gas line 12 is closed and rods 131 and 133 are continuously evacuated so that purge gas remaining in rods 131 and 133 is discharged from rods 131 and 133 .

[0041] As illustrated in operation 506 , the purge valves 1201 and 1203 are closed. Then, the semiconductor manufacturing tools 31 and 33 may be detached from the valve box module 10 .

[0042] Figure 3 is a flow chart representing exemplary operations of a method for manufacturing a semiconductor device by a semiconductor device manufacturing system according to some embodiments of the present invention. Figure 3 The method 600 shown in FIG. 6 involves reporting an alarm signal when a pressure transmitter detects that the purge gas pressure fails to reach a first predetermined pressure value or a second predetermined pressure value.

[0043] As described in operation 5041, when the pressure transmitter 125 detects that the gas pressure in the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached reaches a first predetermined pressure value, the controller 20 is configured to open the pneumatic valve 123 so that the purge gas from the purge gas source 120 flows into the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached. The gas pressure in the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached increases after the pneumatic valve 123 is opened and the purge gas flows into the rods. Then, when the gas pressure in the rods reaches a second predetermined pressure value, the controller 20 closes the pneumatic valve 123 to prevent the flow into the rods. In operation 5042, the pressure transmitter 125 is configured to detect whether the gas pressure in the rods reaches the second predetermined pressure value when the pneumatic valve 123 is opened. After the pressure transmitter 125 detects that the gas pressure in the rods cannot reach the second predetermined pressure value, the controller 20 is configured to report an alarm signal to alert the user (operation 601). Conversely, when the pressure transmitter 125 detects that the gas pressure in the rod reaches the second predetermined pressure value, the controller 20 is configured to close the pneumatic valve 123 to prevent the purge gas from flowing into the rod, as illustrated in operation 5043 .

[0044] In addition, after the pneumatic valve 123 is closed, the gas pressure in the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached is reduced. Then, when the gas pressure in the rod reaches the first predetermined pressure value, the controller 20 opens the pneumatic valve 123 to allow the purge gas to flow into the rod. In operation 5044, when the pneumatic valve 123 is closed, the pressure transmitter 125 is configured to detect whether the gas pressure in the rod reaches the first predetermined pressure value. After the pressure transmitter 125 detects that the gas pressure in the rod cannot reach the first predetermined pressure value, the controller 20 is configured to report an alarm signal to alert the user (operation 602). Conversely, when the pressure transmitter 125 detects that the gas pressure in the rod reaches the first predetermined pressure value, the controller 20 is configured to open the pneumatic valve 123 so that the purge gas flows into the rod, as illustrated in operation 5041 .

[0045] Operations 5041, 5042, 5043, and 5044 may be performed a predetermined number of times (e.g., X times) or a number of cycles. In some embodiments of the invention, the predetermined number of cycles is 5 to 20 cycles. In some embodiments of the invention, the predetermined number of cycles is 8 to 10 cycles. In some embodiments of the invention, the predetermined number of cycles is 10 cycles. In some embodiments of the invention, the predetermined number of cycles is greater than 20 cycles.

[0046] The method 600 will be further described below using the process of detaching the semiconductor manufacturing tools 31 and 33 as a reference. After the semiconductor manufacturing tools 31 and 33 are detached from the valve box module 10, the purge process is performed on the rods 131 and 133 respectively coupled to the semiconductor manufacturing tools 31 and 33. As illustrated in operation 5041, when the pressure transmitter 125 detects that the gas pressure in the rods 131 and 133 reaches a first predetermined pressure value (i.e., 0 psi), the controller 20 is configured to open the pneumatic valve 123 to allow the purge gas to flow from the purge gas source 120 into the rods 131 and 133, and thus increase the gas pressure in the rods 131 and 133. The pneumatic valve 123 is opened until the gas pressure in the rods 131 and 133 reaches a second predetermined pressure value (i.e., 20 psi). As illustrated in operation 5042, after the pressure transmitter 125 detects that the gas pressure in the rods 131 and 133 cannot reach 20 psi, the controller 20 is configured to report an alarm signal (operation 601). In addition, when the pressure transmitter 125 detects that the air pressure in the rods 131 and 133 reaches 20 psi, the controller 20 is configured to close the pneumatic valve 123 to prevent the purge gas from flowing into the rods 131 and 133, as described in operation 5043. In addition, the air pressure in the rods 131 and 133 decreases because the purge gas cannot flow into the rods 131 and 133. The pneumatic valve 123 is closed until the air pressure in the rods 131 and 133 reaches 0 psi. As described in operation 5044, after the pressure transmitter 125 detects that the air pressure in the rods 131 and 133 cannot reach 0 psi, the controller 20 is configured to report an alarm signal (operation 602). In addition, when the pressure transmitter 125 detects that the air pressure in the rods 131 and 133 reaches 0 psi, the controller 20 is configured to open the pneumatic valve 123 to allow the purge gas to flow into the rods 131 and 133, as described in operation 5041. Such operations 5041, 5042, 5043 and 5044 are performed a predetermined number of cycles (ie, 20 times).

[0047] Figure 4 is a flow chart representing exemplary operations of a method for manufacturing a semiconductor device by a semiconductor device manufacturing system according to some embodiments of the present invention. Figure 4 The method 700 shown in involves reporting an alarm signal when the controller finds that the cycle time of operations 5041 and 5043 is greater than a predetermined unit time.

[0048] As described in operation 5041, when the pressure transmitter 125 detects that the gas pressure in the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached reaches a first predetermined pressure value, the controller 20 is configured to open the pneumatic valve 123 so that the purge gas from the purge gas source 120 flows into the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached. The gas pressure in the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached increases after the pneumatic valve 123 is opened. In addition, as illustrated in operation 5043, when the pressure transmitter 125 detects that the gas pressure in the rods reaches a second predetermined pressure value, the controller 20 is configured to close the pneumatic valve 123 to prevent the purge gas from flowing into the rods, as illustrated in operation 5043. After closing the pneumatic valve 123, the gas pressure in the rods decreases. When the pressure transmitter 125 detects that the gas pressure in the rods reaches a first predetermined pressure value, the controller 20 is configured to open the pneumatic valve 123 to allow the purge gas to flow into the rods, as illustrated in operation 5041. Operations 5041 and 5043 may be performed a predetermined number of times (e.g., X times) or a number of cycles. In operation 5045, the controller 20 is configured to monitor the cycle time of operations 5041 and 5043 during the execution of operations 5041 and 5043. After the controller 20 finds that the cycle time of operations 5041 and 5043 is greater than a predetermined unit time, the controller 20 is configured to report an alarm signal to remind the user (operation 701).

[0049] Figure 5 is a flow chart representing exemplary operations of a method for manufacturing a semiconductor device by a semiconductor device manufacturing system according to some embodiments of the present invention. Figure 5 The method 800 shown in involves reporting a notification signal when the controller finds that operations 5041 and 5043 are executed a predetermined number of times.

[0050] As illustrated in operation 504, operations 5041 and 5043 may be performed for a predetermined number of cycles. In operation 801, after the controller 20 finds that operations 5041 and 5043 have been performed for a predetermined number of cycles, the controller 20 is configured to report a processing signal to alert the user.

[0051] Figure 6is a flow chart representing exemplary operations of a method for manufacturing a semiconductor device by a semiconductor device manufacturing system according to some embodiments of the present invention. Figure 6 The method 9 shown in involves reporting an alarm signal when a pressure transmitter detects that the gas pressure in a rod coupled to a semiconductor manufacturing tool to be detached is greater than a first predetermined pressure value.

[0052] As illustrated in operation 505, after performing operations 5041 and 5043 for a predetermined number of times or cycles, the valve 121 of the purge gas line 12 is closed and the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached are continuously evacuated so that the purge gas remaining in the rods is discharged from the rods. In operation 901, after the pressure transmitter 125 detects that the gas pressure in the rods is greater than the first predetermined pressure value after the purge gas valve is closed, the controller 20 is configured to report an alarm signal to alert the user (operation 902). Conversely, as described in operation 506, when the pressure transmitter 125 detects that the gas pressure in the rod is a first predetermined pressure value, the purge valves 1201, 1202, 1203, 1204, 1205, 1206, 1207 and / or 1208 of the purge gas pipeline loop fluidly connected to the rods 131, 132, 133, 134, 135, 136, 137 and / or 138 coupled to the semiconductor manufacturing tools 31, 32, 33, 34, 35, 36, 37 and / or 38 to be detached are closed.

[0053] In view of the above, the pressure transmitter 125 is configured to monitor the gas pressure in the valve box module 10 during the purge process.

[0054] It will be further appreciated that the above system can be used to more efficiently perform a purge process on a valve box module. A user can set the number of purge cycles and pressure settings through a controller and then the purge process can be automatically performed. The number of semiconductor manufacturing tools that need to be purged and disassembled can be increased. In addition, the safety of disassembling semiconductor manufacturing tools can be improved because the purge process can be accurately and reliably performed.

[0055] According to some embodiments of the present invention, a valve box module for a semiconductor device manufacturing system includes at least one rod and a first gas inlet. The first gas inlet is in fluid communication with the at least one rod and is configured to supply a purge gas into the at least one rod. The first gas line may include a pneumatic valve and a pressure transmitter downstream of the pneumatic valve. In addition, the pneumatic valve is configured to cooperate with the pressure transmitter.

[0056] According to some other embodiments of the present invention, a semiconductor device manufacturing system includes a valve box module, a controller, a purge gas source, and at least one semiconductor manufacturing tool. The valve box module includes at least one rod and a first gas pipeline in fluid communication with the at least one rod. In addition, the first gas pipeline includes a pneumatic valve and a pressure transmitter downstream of the pneumatic valve. The controller is connected to the pneumatic valve and the pressure transmitter of the first gas pipeline. The purge gas source is in fluid communication with the first gas pipeline. The at least one semiconductor manufacturing tool is coupled to the at least one rod.

[0057] According to some other embodiments of the present invention, a method for manufacturing a semiconductor device includes: evacuating a rod, wherein the rod is fluidically connected to a semiconductor manufacturing tool; opening a purge valve of a first gas pipeline, wherein the first gas pipeline is fluidically connected to the rod; opening the valve of the first gas pipeline to allow the purge gas to flow into the first gas pipeline, wherein the valve is upstream of the purge valve; controlling a pneumatic valve and a pressure transmitter of the first gas pipeline by a controller to perform a purge process, wherein the pneumatic valve and the pressure transmitter are positioned between the valve and the purge valve, and wherein the pressure transmitter is downstream of the pneumatic valve; when the pressure transmitter detects a first predetermined pressure value, the controller opens the pneumatic valve to allow the purge gas to flow into the rod, and when the pressure transmitter detects a second predetermined pressure value, the controller closes the pneumatic valve to prevent the purge gas from flowing into the rod, wherein the second predetermined pressure value is higher than the first predetermined pressure value; and alternating the opening of the pneumatic valve to allow the purge gas to flow into the rod and the closing of the pneumatic valve to prevent the purge gas from flowing into the gas outlet rod for a predetermined number of times.

[0058] The features of several embodiments have been summarized above so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art will appreciate that they can easily use the present disclosure as a basis for designing or modifying other processes and structures to implement the same purposes and / or achieve the same advantages of the embodiments introduced herein. Those skilled in the art will also recognize that such equivalent constructions should not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and modifications to the present disclosure without departing from the spirit and scope of the present disclosure.

[0059] Explanation of symbols

[0060] 1:Semiconductor device manufacturing system

[0061] 9: Methods

[0062] 10: Valve Box Module / Valve Manifold Box (VMB)

[0063] 11: Processing gas pipeline

[0064] 12:Purification gas pipeline

[0065] 20: Controller

[0066] 31:Semiconductor manufacturing tools

[0067] 32:Semiconductor manufacturing tools

[0068] 33:Semiconductor manufacturing tools

[0069] 34:Semiconductor manufacturing tools

[0070] 35:Semiconductor manufacturing tools

[0071] 36:Semiconductor manufacturing tools

[0072] 37:Semiconductor manufacturing tools

[0073] 38:Semiconductor manufacturing tools

[0074] 110: Processing gas source

[0075] 111: Valve

[0076] 112: Expansion port

[0077] 120:Purification gas source

[0078] 121: Valve

[0079] 122: Regulator valve

[0080] 123: Pneumatic valve

[0081] 124: Check valve

[0082] 125: Pressure transmitter

[0083] 131: Rod

[0084] 132: Rod

[0085] 133: Rod

[0086] 134: Rod

[0087] 135: Rod

[0088] 136: Rod

[0089] 137: Rod

[0090] 138: Rod

[0091] 500:Method

[0092] 501: Operation

[0093] 502: Operation

[0094] 503: Operation

[0095] 504: Operation

[0096] 505: Operation

[0097] 506: Operation

[0098] 600: Method

[0099] 601: Operation

[0100] 602: Operation

[0101] 700: Method

[0102] 701: Operation

[0103] 800: Method

[0104] 801: Operation

[0105] 1201:Purge valve

[0106] 1202:Purge valve

[0107] 1203:Purge valve

[0108] 1204:Purge valve

[0109] 1205:Purge valve

[0110] 1206:Purge valve

[0111] 1207:Purge valve

[0112] 1208:Purge valve

[0113] 1311: First valve

[0114] 1312: Regulator valve

[0115] 1313: Pressure transmitter

[0116] 1314: Second valve

[0117] 1321: First valve

[0118] 1322: Regulator valve

[0119] 1323: Pressure transmitter

[0120] 1324: Second valve

[0121] 1331: First valve

[0122] 1332: Regulator valve

[0123] 1333:Pressure Transmitter

[0124] 1334: Second valve

[0125] 1341: First Valve

[0126] 1342: Regulator valve

[0127] 1343:Pressure Transmitter

[0128] 1344: Second valve

[0129] 1351: First Valve

[0130] 1352: Regulator valve

[0131] 1353:Pressure Transmitter

[0132] 1354: Second valve

[0133] 1361: First Valve

[0134] 1362: Regulator valve

[0135] 1363:Pressure Transmitter

[0136] 1364: Second valve

[0137] 1371: First Valve

[0138] 1372: Regulator valve

[0139] 1373:Pressure Transmitter

[0140] 1374: Second valve

[0141] 1381: First Valve

[0142] 1382: Regulator valve

[0143] 1383:Pressure Transmitter

[0144] 1384: Second valve

[0145] 5041: Operation

[0146] 5042: Operation

[0147] 5043: Operation

[0148] 5044: Operation

[0149] 5045: Operation.

Claims

1. A valve box module for a semiconductor device manufacturing system, comprising: At least one shot; and a first gas line in fluid communication with the at least one rod and configured to supply a purge gas into the at least one rod; wherein the first gas pipeline comprises a pneumatic valve and a pressure transmitter downstream of the pneumatic valve, and wherein the pneumatic valve is disposed between a purge gas source and the pressure transmitter, the pneumatic valve being configured to cooperate with the pressure transmitter; wherein the first gas pipeline is connected to the at least one rod at a junction, and the pressure transmitter is disposed between the pneumatic valve and the junction; The pressure transmitter located in the first gas pipeline for supplying the purge gas is used to detect the pressure value when the at least one rod is continuously pumped; the pneumatic valve arranged between the purge gas source and the pressure transmitter is used to alternately open and close in response to the pressure value detected by the pressure transmitter when the at least one rod is continuously pumped. 2 . The valve box module of claim 1 , further comprising a second gas line in fluid communication with the at least one rod and configured to supply a process gas into the at least one rod. 3 . The valve box module of claim 1 , wherein the first gas line includes a valve upstream of the pneumatic valve, and wherein the valve is configured to be selectively opened or closed to control the purge gas passing through the first gas line. 4 . The valve box module of claim 3 , wherein the first gas line includes a regulator valve between the valve and the pneumatic valve. 5 . The valve box module of claim 1 , wherein the first gas line includes a purge valve adjacent to the junction between the stem and the first gas line. 6 . The valve box module of claim 1 , wherein the first gas line comprises a check valve between the pneumatic valve and the pressure transmitter.

7. A semiconductor device manufacturing system, comprising: A purified gas source for providing purified gas; A valve box module, comprising: At least one stroke; and a first gas pipeline in fluid communication with the purge gas source and the at least one rod for supplying the purge gas to the at least one rod, wherein the first gas pipeline comprises a pneumatic valve and a pressure transmitter downstream of the pneumatic valve, the pneumatic valve being disposed between the purge gas source and the pressure transmitter, the first gas pipeline being connected to the at least one rod at a junction, and the pressure transmitter being disposed between the pneumatic valve and the junction; a controller connected to the pneumatic valve and the pressure transmitter of the first gas pipeline, wherein the pressure transmitter in the first gas pipeline for supplying the purge gas is used to detect a pressure value when the at least one rod is continuously evacuated, and the controller is used to receive the pressure value detected by the pressure transmitter when the at least one rod is continuously evacuated, and alternately open and close the pneumatic valve disposed between the purge gas source and the pressure transmitter according to the pressure value; and At least one semiconductor manufacturing tool is coupled to the at least one rod.

8. The semiconductor device manufacturing system of claim 7, wherein the valve box module comprises a second gas pipeline in fluid communication with the at least one rod, and wherein the semiconductor device manufacturing system comprises a process gas source in fluid communication with the second gas pipeline.

9. The semiconductor device manufacturing system according to claim 7, wherein when the pressure value reaches a first predetermined pressure value, the controller is configured to open the pneumatic valve; when the pressure value reaches a second predetermined pressure value higher than the first predetermined pressure value, the controller is configured to close the pneumatic valve. 10 . The semiconductor device manufacturing system of claim 7 , wherein the controller is configured to report an alarm signal based on the pressure value from the pressure transmitter.

11. The semiconductor device manufacturing system according to claim 7, wherein the controller comprises a programmable logic controller.

12. A method for manufacturing a semiconductor device, comprising: evacuating a rod, wherein the rod is in fluid communication with a semiconductor manufacturing tool; opening a purge valve of a first gas line, wherein the first gas line is in fluid communication with the stem and the first gas line is connected to the stem at a junction; opening a valve of the first gas line to allow purge gas to flow from a purge gas source into the first gas line, wherein the valve is upstream of the purge valve; a pneumatic valve and a pressure transmitter of the first gas pipeline controlled by a controller to perform a purge process, wherein the pneumatic valve is disposed between the purge gas source and the pressure transmitter, the pneumatic valve and the pressure transmitter are positioned between the valve and the purge valve, and wherein the pressure transmitter located in the first gas pipeline into which the purge gas flows is disposed between the pneumatic valve and the junction; When the pressure value detected by the pressure transmitter when the rod is continuously evacuated reaches a first predetermined pressure value, the controller opens the pneumatic valve disposed between the purge gas source and the pressure transmitter to allow the purge gas to flow into the rod, and when the pressure value detected by the pressure transmitter when the rod is continuously evacuated reaches a second predetermined pressure value, the controller closes the pneumatic valve disposed between the purge gas source and the pressure transmitter to prevent the purge gas from flowing into the rod, wherein the second predetermined pressure value is higher than the first predetermined pressure value; and Opening the pneumatic valve to allow the purge gas to flow into the rod and closing the pneumatic valve to prevent the purge gas from flowing into the rod are alternately cycled several times.

13. The method of claim 12, wherein the first predetermined pressure value is less than or equal to 0 psi and wherein the second predetermined pressure value is greater than 0 psi.

14. The method according to claim 12, further comprising: After alternating several cycles of opening the pneumatic valve to allow the purge gas to flow into the rod and closing the pneumatic valve to prevent the purge gas from flowing into the gas outlet rod, the valve of the first gas line is returned to closed and the purge gas remaining in the rod is exhausted.

15. The method according to claim 14, further comprising: The purge valve of the first gas line is returned to closed after returning the valve of the first gas line to closed and exhausting the purge gas remaining in the rod.

16. The method according to claim 12, wherein the controller is configured to report an alarm signal after the pneumatic valve is opened and the pressure value detected by the pressure transmitter is lower than the second predetermined pressure value, or after the pneumatic valve is closed and the pressure value detected by the pressure transmitter is higher than the first predetermined pressure value.

17. The method of claim 12, wherein the controller is configured to report an alarm signal when a cycle time of alternating between opening the pneumatic valve to allow the purge gas to flow into the rod and closing the pneumatic valve to prevent the purge gas from flowing into the gas outlet rod is greater than a unit time.

18. The method of claim 14, wherein the controller is configured to report an alarm signal by the controller when the pressure transmitter detects a pressure value greater than 0 psi after the valve of the first gas line is returned to closed and the purge gas remaining in the rod is exhausted.

19. The method of claim 12, further comprising: The pressure of the purge gas is monitored during the purge process.

20. The method of claim 12, wherein the controller is configured to report a notification signal after a number of cycles of alternating between opening the pneumatic valve to allow the purge gas to flow into the rod and closing the pneumatic valve to prevent the purge gas from flowing into the gas outlet rod.

Images