Non-contact deposition system including a jetting assembly

Abstract

A non-contact deposition system includes a jetting assembly including at least one microvalve. The microvalve includes an orifice plate defining an orifice therethrough. An actuation beam is disposed in spaced relation to the orifice plate. The actuation beam includes a base portion and a cantilever portion extending from the base portion toward the orifice and movable between a closed position and an open position. A seal structure including a sealing member is disposed at an overlap of the cantilever portion. A fluid manifold is coupled to the microvalve and defines a fluid reservoir containing a pressurized fluid. When the actuation beam is in the closed position, the cantilever portion is positioned such that the seal structure seals the orifice to close the microvalve, and in the open position, fluid is dispensed from the orifice toward a substrate and deposited thereon.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Provisional Application Serial No. 62 / 929,271, filed November 1, 2019, the contents of which are incorporated herein by way of consolidation. Technical Field

[0003] This disclosure generally relates to the field of microvalves fabricated using microelectromechanical systems (MEMS) technology. More specifically, this disclosure relates to non-contact deposition systems including injection assemblies with MEMS microvalves. Background Technology

[0004] Traditional dispensing and deposition systems have several drawbacks. For example, in biological or biomedical applications, solutions containing chemicals, biochemicals, or biomolecules are typically deposited manually onto a substrate using a pipette. Automated systems have been developed capable of simultaneously pipetting multiple solutions onto a substrate. However, these systems often still use pipette tips, and even when solutions are not deposited through the tips, multiple orifices remain exposed to air. Other deposition systems, such as microarray printed assemblies, contact the substrate and use the surface tension of the fluid to deposit the fluid. Such deposition assemblies suffer from inaccurate droplet size and volume, and must be evaporated in a controlled environment to prevent solvent evaporation.

[0005] Similar drawbacks exist in deposition systems used for printing or marking. For example, continuous inkjet printers have certain inherent defects that are difficult to eliminate. For instance, the process of generating droplets from the ink supply source can cause ink to drip in undesirable directions (e.g., away from the target), leading to maintenance needs. Additionally, replenishment fluid is lost over time due to evaporation, requiring constant replenishment. Other maintenance costs are also incurred, such as orifice plate repair due to degradation. Furthermore, the orifices or openings from which the fluid is ejected are typically kept open to air, which can cause solvent to evaporate from the fluid, leading to blockage and eventual failure of conventional deposition systems.

[0006] Finally, when the fluid to be dispensed is a gas (such as air), conventional deposition systems or valves that control gas dispensing are generally large and heavy, require excessive electrical energy, and sometimes fail due to mechanical problems caused by the various components they contain. For these and other reasons, there is a need for improved dispensing and deposition devices. Summary of the Invention

[0007] The embodiments described herein generally relate to non-contact deposition systems, and particularly to systems including a jet assembly containing a microvalve. The microvalve comprises an orifice defined in an orifice plate and an actuation beam that can be held in a closed position in its default position to seal the orifice, and selectively opened to jet fluid and deposit it onto a substrate.

[0008] In some embodiments, the non-contact deposition system includes a spray assembly comprising at least one microvalve. Each microvalve includes an orifice plate comprising a first surface and a second surface. The orifice plate includes an orifice extending from the first surface to the second surface. A spacer member is disposed on the first surface and offset from the orifice. A valve seat surrounds the orifice and defines an opening in fluid communication with the orifice. An actuation beam is disposed on and extends from the spacer member toward the orifice. The actuation beam includes a piezoelectric material layer and is movable between a closed position and an open position by applying an electrical signal to the piezoelectric material layer. A sealing member is disposed at an end of the actuation beam. A fluid manifold is coupled to the microvalve and defines a fluid reservoir containing pressurized fluid around the actuation beam. When no electrical signal is applied to the piezoelectric material layer, the actuation beam is in the closed position, and the sealing member surface of the sealing member contacts the orifice plate to seal the orifice and close the microvalve. Furthermore, in the open position, fluid is sprayed from the orifice toward a substrate and deposited thereon.

[0009] In another embodiment, the non-contact deposition system further includes: a platform spaced apart from the injection assembly and configured to receive a substrate on which fluid is to be deposited; and a motion mechanism coupled to at least one of the injection assembly or the platform and configured to provide three-dimensional motion to the injection assembly or the platform to deposit fluid at a predetermined location on the substrate.

[0010] In another embodiment, the substrate includes a histopathology sectioning kit, and the fluid therein contains a cell staining agent.

[0011] In another embodiment, the substrate includes a circuit board, and the fluid includes a conductive fluid, a semiconductor fluid, or a piezoelectric fluid.

[0012] In another embodiment, the substrate comprises fabric, ceramic tile, engineered wood, or laminate, and the fluid comprises at least one of conductive ink, coating, nanocoating, or antimicrobial coating.

[0013] In another embodiment, the substrate includes a carrier sheet, and the fluid contains a solution of at least one of a chemical, a biochemical, or a biomolecule, and the non-contact deposition system is configured to deposit an array of droplets of the solution onto the carrier sheet.

[0014] In another embodiment, the substrate comprises a microporous plate defining a plurality of micropores, and wherein the fluid comprises a solution of at least one of a chemical, a biochemical, or a biomolecule, and wherein a non-contact deposition system is configured to deposit a volume of solution into each of the plurality of micropores.

[0015] In another embodiment, the fluid comprises a polymer, and the non-contact deposition system is configured to deposit multiple polymer layers to form a three-dimensional object with a predetermined shape.

[0016] In another embodiment, the non-contact deposition system further includes: an insert disposed on and coupled to a fluid manifold; and a carrier disposed on and coupled to the insert, such that the orifice plate, the fluid manifold, the insert, and the carrier collectively define the boundary of a fluid reservoir, the carrier further defining a first fluid channel configured to deliver a first fluid to the fluid reservoir.

[0017] In another embodiment, the carrier further includes a second fluid channel configured to deliver a second fluid, different from the first fluid, to a fluid reservoir.

[0018] In another embodiment, the injection assembly is configured to selectively deliver a first fluid, a second fluid, or a mixture containing the first and second fluids through the orifice, the mixture being formed within the fluid reservoir.

[0019] In another embodiment, the substrate comprises an artificial fingernail or a real fingernail, wherein a first fluid comprises a first fingernail color and a second fluid comprises a second fingernail color.

[0020] In another embodiment, the substrate includes a color mixing plate, and the first fluid and the second fluid include at least one of powder, liquid or gel.

[0021] In another embodiment, the carrier defines an inner volume, and a compressible fluid container containing fluid is disposed within the inner volume.

[0022] In another embodiment, the internal volume of the carrier is filled with a compressed gas configured to apply pressure to a compressible fluid container, which causes fluid to flow through a fluid channel into a fluid reservoir.

[0023] In another embodiment, a biasing member is disposed within the inner volume and is configured to apply pressure to the compressible fluid container, which causes the fluid to flow through a fluid passage into a fluid reservoir.

[0024] In another embodiment, the fluid comprises one of ink, paint, solvent, biological solution, biochemical solution, chemical solution, physiological fluid, adhesive, powder, gel, dye, cell staining agent, colloidal solution, emulsion, or suspension.

[0025] In another embodiment, the fluid includes a volatile fluid or a gas-sensitive fluid, and the injection assembly is configured to restrict the fluid from being exposed to air in an environment outside the injection assembly.

[0026] In another embodiment, the aperture array is defined in an aperture plate.

[0027] In another embodiment, the array includes a rectangular array, a square array, a semi-circular array, an elliptical array, a polygonal array, or an asymmetric array.

[0028] In another embodiment, the actuating beam includes a non-active portion, an adjustment layer, and an actuating portion containing at least one piezoelectric material layer, wherein the adjustment layer has a predetermined adjustment stress such that, in the closed position, the sealing member contacts the valve seat and applies force to the valve seat so as to fluid seal the orifice.

[0029] In another embodiment, the fluid is a gaseous fluid.

[0030] In another embodiment, a tactile interface device is provided, which is included in the non-contact deposition system of any of the foregoing embodiments herein.

[0031] In some embodiments, the non-contact deposition system includes a spray assembly containing at least one microvalve. The at least one microvalve includes an orifice plate having a first surface and a second surface. The orifice plate includes a hole extending from the first surface to the second surface. An actuation beam is spaced apart from the orifice plate. The actuation beam includes a base and a cantilever portion. The cantilever portion extends from the base toward the hole such that its overlap overlaps with the hole. The actuation beam is movable between a closed position and an open position. A sealing structure containing a sealing member is disposed at the overlap of the cantilever portion. A fluid manifold is coupled to the microvalve and defines a fluid reservoir containing pressurized fluid around the actuation beam. When the actuation beam is in the closed position, the cantilever portion is positioned such that the sealing structure seals the hole to close the microvalve. In the open position, fluid is dispensed from the hole to a substrate and deposited thereon.

[0032] In another embodiment, the actuating beam includes a piezoelectric material layer and is movable between a closed position and an open position in response to an electrical signal applied to the piezoelectric material.

[0033] In another embodiment, when the micro-valve is in the closed position, no electrical signal is applied to the piezoelectric material.

[0034] In another embodiment, the non-contact deposition system further includes: a platform spaced apart from the injection assembly and configured to receive a substrate; and a motion mechanism coupled to at least one of the injection assembly or the platform and configured to provide three-dimensional motion to the injection assembly or the platform to deposit fluid at a predetermined location on the substrate.

[0035] In another embodiment, the substrate includes a histopathology sectioning kit, and the fluid contains a cell staining agent.

[0036] In another embodiment, the substrate includes a circuit board, and the fluid includes a conductive fluid, a semiconductor fluid, or a piezoelectric fluid.

[0037] In another embodiment, the substrate comprises fabric, ceramic tile, engineered wood, or laminate, and the fluid comprises at least one of conductive ink, coating, nanocoating, or antimicrobial coating.

[0038] In another embodiment, the substrate includes a carrier sheet, and the fluid contains a solution of at least one of a chemical or a biomolecule, and the non-contact deposition system is configured to deposit an array of droplets of the solution onto the carrier sheet.

[0039] In another embodiment, the substrate includes a microporous plate defining a plurality of micropores, and wherein the fluid comprises a solution of at least one of a chemical, a biochemical, or a biomolecule, and wherein the non-contact deposition system is configured to deposit a volume of solution in each of the plurality of micropores.

[0040] In another embodiment, the fluid comprises a polymer, and the non-contact deposition system is configured to deposit multiple polymer layers to form a three-dimensional object having a predetermined shape.

[0041] In another embodiment, the non-contact deposition system further includes: an insert disposed on and coupled thereto on the fluid manifold; and a carrier disposed on and coupled thereto on the insert, such that the orifice plate, the fluid manifold, the insert, and the carrier collectively define the boundary of the fluid reservoir, the carrier further defining a first fluid channel configured to deliver a first fluid to the fluid reservoir.

[0042] In another embodiment, the carrier further includes a second fluid channel configured to deliver a second fluid, different from the first fluid, to the fluid reservoir.

[0043] In another embodiment, the injection assembly is configured to selectively deliver a first fluid, a second fluid, or a mixture containing the first and second fluids through the orifice, the mixture being formed within the fluid reservoir.

[0044] In another embodiment, the substrate comprises artificial or real nails, wherein the first fluid comprises a first nail color and the second fluid comprises a second nail color.

[0045] In another embodiment, the substrate includes a color mixing plate, and the first fluid and the second fluid comprise at least one of a powder, a liquid, or a gel.

[0046] In another embodiment, the carrier system defines an internal volume and a compressible fluid container containing fluid disposed within that internal volume.

[0047] In another embodiment, the internal volume of the carrier is filled with compressed gas configured to apply pressure to a compressible fluid container, which causes fluid to flow through a fluid channel into the fluid reservoir.

[0048] In another embodiment, a biasing member is disposed within the inner volume and is configured to apply pressure to the compressible fluid container, the pressure causing the fluid to flow through a fluid passage into the fluid reservoir.

[0049] In another embodiment, the fluid comprises one of ink, paint, solvent, biological solution, biochemical solution, chemical solution, physiological fluid, adhesive, powder, gel, dye, cell staining agent, colloidal solution, emulsion, or suspension.

[0050] In another embodiment, the fluid includes a volatile fluid or a gas-sensitive fluid, and the injection assembly is configured to restrict the fluid from being exposed to air in an environment outside the injection assembly.

[0051] In another embodiment, the perforated plate is an array defining a plurality of holes.

[0052] In another embodiment, the array includes a rectangular array, a square array, a semi-circular array, an elliptical array, a polygonal array, or an asymmetric array.

[0053] In another embodiment, the actuating beam includes a non-active portion, an adjustment layer, and an actuating portion containing the at least one piezoelectric material layer, wherein the adjustment layer has a predetermined adjustment stress such that, in the closed position, the sealing member contacts the valve seat and applies force to the valve seat so as to fluid seal the orifice.

[0054] In another embodiment, the miniature valve further includes a valve seat surrounding the orifice, the valve seat defining an opening in fluid communication with the orifice.

[0055] In another embodiment, the fluid is a gaseous fluid.

[0056] In another embodiment, the tactile interface device includes the non-contact deposition system of any of the foregoing embodiments herein.

[0057] It should be understood that all combinations of the foregoing concepts and additional concepts discussed in more detail below (assuming that such concepts are not contradictory) are considered part of the inventive subject matter disclosed herein. In particular, all combinations of the claimed subject matter appearing after this disclosure are considered part of the inventive subject matter disclosed herein. Attached Figure Description

[0058] The foregoing and other features of this disclosure will become apparent from the accompanying drawings, the following description, and the appended claims. It should be understood that these drawings depict only a few embodiments according to this disclosure and are therefore not intended to limit the scope of the disclosure, which will be described with additional specificity and detail using the accompanying drawings.

[0059] Figure 1 This is a perspective view of the injection assembly disposed in the support according to an example embodiment.

[0060] Figure 2 for Figure 1 An exploded view of the injection assembly shown.

[0061] Figure 3 for Figure 1 The diagram shows a schematic cross-sectional view of the injection assembly.

[0062] Figure 4 is Figure 1 The diagram shows a plan view of the injection assembly.

[0063] Figure 5A This is a cross-sectional view of an injection assembly containing a micro-valve according to an example embodiment.

[0064] Figure 5B This is a cross-sectional view of an injection assembly containing a micro-valve according to another example embodiment.

[0065] Figure 6 A cross-sectional view is provided to provide a more detailed view of the injection assembly shown in Figure 5.

[0066] Figure 7A This is a cross-sectional view of the actuation beam of the miniature valve according to an example embodiment; Figure 7B According to another example embodiment Figure 7A The front view cross-section of the actuating beam is shown.

[0067] Figure 8 This is a schematic diagram of a non-contact deposition system according to an embodiment.

[0068] Figures 9-14 For substrates according to various embodiments and through Figure 8 A schematic diagram of the fluid deposited on the substrate by the system.

[0069] Figure 15 According to the embodiments, it is possible to Figure 8 A schematic diagram of the jet assembly used in a non-contact deposition system.

[0070] Figures 16-18 To enable various embodiments to be implemented Figure 8 A schematic diagram of the jet assembly used in the non-contact deposition system is shown.

[0071] Figures 19-23 This is a schematic diagram of a perforated plate with different shaped arrays of multiple holes extending through it, according to various embodiments.

[0072] Figure 24 According to the embodiments Figure 8 A schematic diagram of a non-contact deposition system for depositing fluids on a microporous plate.

[0073] In the accompanying drawings, unless otherwise specifically indicated, similar symbols generally denote similar components. The illustrative embodiments described in the detailed description, drawings, and claims are not intended to be limiting. Other embodiments and modifications may be utilized without departing from the spirit or scope of the subject matter set forth herein. It will be readily appreciated that the aspects of this disclosure described herein and shown in the figures can be arranged, substituted, combined, and designed in various different configurations, all of which are conceived and form part of this disclosure. Detailed Implementation

[0074] The embodiments described herein generally relate to non-contact deposition systems, and more particularly to systems including a jet assembly containing a microvalve. The microvalve comprises an orifice defined in an orifice plate and an actuation beam that can be held in a closed position in its default position to seal the orifice, and selectively opened to jet fluid and deposit it onto a substrate.

[0075] Before referring to the accompanying drawings which provide detailed descriptions of exemplary embodiments, it should be understood that this application is not limited to the details or methods set forth in the specification or illustrated in the drawings. It should also be understood that the terminology is for descriptive purposes only and should not be considered limiting.

[0076] Referring generally to the accompanying drawings, this document describes an injection assembly containing multiple microvalves and a non-contact deposition system incorporating such an assembly. The microvalves described herein employ an actuation beam with a sealing member disposed thereon. This actuation beam allows for the customization of the microvalves to eliminate or reduce various drawbacks of conventional techniques involving continuous injection assemblies. For example, in various embodiments, the microvalves include a spacer member disposed between the actuation beam and an orifice plate. The spacer member maintains a gap between a first end of the actuation beam and an orifice within the orifice plate to prevent extrusion film damping of the actuation beam. The actuation beam extends from the spacer member above the orifice, and the sealing member extends toward the orifice to directly contact the orifice, or to contact a valve seat that may be disposed around or at the edge of the orifice. Thus, without any electrical energy being applied to the actuation beam, the sealing member will seal the orifice. In other words, the default position of the actuation beam (e.g., configured by careful selection of the materials contained therein) is that the microvalves are closed. Therefore, the fluids {e.g., inks, paints, solvents, biological solutions, biochemical solutions, chemical solutions, physiological fluids (e.g., blood, urine, saliva, plasma, cerebrospinal fluid), adhesives, powders, gels, dyes, cell staining agents, colloidal solutions, suspensions, emulsions, etc.} contained in the microvalve are isolated from the external environment of the injection assembly. This eliminates fluid evaporation, thereby reducing clogging. Furthermore, the restricted evaporation allows for the use of faster-drying fluids, permitting deposition at higher rates than conventional systems.

[0077] To ensure proper sealing of the microvalve described herein, a compatible relationship must be maintained between the sealing member disposed on the actuation beam and the valve seat. Maintaining this relationship involves adjusting numerous factors related to the construction of the injection assembly. In one aspect, steps are taken to ensure the appropriate dimensions of the various components of the microvalve. For example, in some embodiments, the spacer member and sealing member described herein are formed in a single manufacturing step (e.g., by etching a portion of the wafer in a single etching step to form the spacer member and sealing member) to ensure they have the same thickness. Constructing these components in this way allows for precise control over the configuration of components attached to the actuation beam, such as the size of the sealing member and the length of the actuation beam. This allows the sealing member to be precisely aligned with the valve seat to ensure sufficient sealing is formed between the valve seat and the sealing member, or between the orifice plate and the sealing member. Furthermore, manufacturing the sealing member and spacer member in this way allows these structures to share a common thickness that contributes to proper spacing between the actuation beam and the orifice plate. A fluid manifold is coupled to the microvalve and defines a fluid reservoir around the microvalve, thereby allowing fluid to deposit on the substrate when the actuation beam is in the open position.

[0078] Therefore, multiple components of the injection assembly described herein are configured to establish a seal at the interface between the sealing member and the orifice, and / or, taking into account the valve seat, multiple components of the injection assembly described herein are configured to establish a seal at the interface between the sealing member and the orifice. Adequate sealing helps prevent fluid leakage from the orifice, which occurs in conventional continuous injection assemblies. Advantageously, the microvalve used herein can be customized to provide the desired droplet size. For example, in one embodiment, the diameter of the orifice in the orifice plate is approximately 60 micrometers. In certain embodiments, the thickness of the orifice plate can range from 60 to 900 micrometers (e.g., 350 micrometers). In some embodiments, the diameter-to-length ratio of the orifice can range from 1:1 to 15:1. An electrical signal can be applied to the actuating beam, which, via at least one piezoelectric material layer contained therein, causes the actuating beam to temporarily disengage from the valve seat to form a fluid outlet at the valve seat and the orifice for a predetermined time (e.g., based on the desired droplet frequency). Therefore, based on the orifice volume and droplet frequency, a certain volume of fluid is injected from the orifice to form droplets disposed on a substrate, thereby producing a desired mark, pattern, solution, or object. In various embodiments, with a droplet frequency configured at 10 kHz, the microvalve used herein can produce droplets with a volume of approximately 600 pL. This is larger than conventional deposition systems that typically produce droplets with a volume of only about 30 pL. Due to this larger droplet size, the injection assembly described herein can utilize a larger injection distance, thereby enabling image formation on the desired object at a greater distance than conventional systems.

[0079] The various embodiments of the non-contact deposition system incorporating the jet assembly described herein offer advantages such as: (1) preventing fluid evaporation by keeping the microvalve closed in its default position when fluid deposition is not being performed; (2) reducing power consumption by using only the power required to open the microvalve; (3) allowing accurate deposition of fluid volumes from 500 pL to 5 mL or even larger; (4) allowing deposition of a wide variety of fluids, including but not limited to inks, conductive inks, coatings, dyes, cell staining agents, polymers, adhesives, suspensions, emulsions, nanocoatings, antimicrobial coatings, powders, biological solutions, biochemical solutions, chemical solutions, etc.; (5) allowing deposition of multiple fluids from a single microvalve; (6) integrating pumping capabilities to eliminate the need for external pumping or compression systems to supply pressurized fluid to the jet assembly; and (7) enabling the deposition of fluids using a variety of patterns by allowing movement in a predetermined pattern and / or providing orifices defined in an orifice plate.

[0080] As described herein, when used to describe the actuation beam of a microvalve, the term "default position" describes the position of the actuation beam relative to various other components of the microvalve when no control signal (e.g., charge, current, or voltage) is applied to the actuation beam. In other words, the default position is the position of the actuation beam (and any components attached to it) when the actuation beam is in a passive state.

[0081] For reference Figure 1 The image shows a perspective view of a spray assembly 100 disposed in a carrier 150 according to an exemplary embodiment. The spray assembly 100 includes a valve body 102 attached to a carrier 108. The carrier 150 includes a generally circular body having an opening therein adapted to receive the spray assembly 100. The body of the carrier 150 may include recesses 118 extending from its peripheral edges to facilitate attachment of the carrier 150 to a marking device. The valve body 102 may be an assembly of the marking device. In an exemplary embodiment, the valve body 102 is used in a non-contact deposition system containing a pressurized fluid supply source.

[0082] As described herein, valve body 102 includes an input fluid manifold attached to a plurality of microvalves. The microvalves and the input fluid manifold form a fluid pressurization chamber or reservoir configured to retain fluid received from an external fluid supply source. In other embodiments, valve body 102 may define a plurality of fluid pressurization chambers, each corresponding to at least a portion of the plurality of microvalves. In such embodiments, each fluid pressurization chamber may be filled with a different colored fluid (e.g., different colored inks such as black, green, yellow, cyan, etc. or different fluids) to provide the ability to deposit multiple fluids. In various embodiments, the microvalves include an actuation beam configured to move (e.g., bend, flex, twist, etc.) upon application of a voltage to temporarily open fluid outlets at a plurality of orifices in an orifice plate. Droplets are thus ejected from the fluid outlets onto a target to produce a desired marking pattern on the target.

[0083] As shown, circuit board 104 is attached to the side of carrier 108. Circuit board 104 may include multiple electrical paths and (e.g., via wiring harness) provide connection points between valve body 102 and electrical controller. Electrical controller may provide control signals via electrical paths to control the actuation of actuation beams of multiple microvalves included in valve body 102. The structure and function of such microvalves will be described in more detail herein. In some embodiments, circuit board 104 itself includes a microcontroller for generating and providing control signals to actuate the microvalves.

[0084] An identification tag 106 is attached to the injection assembly 100. In some embodiments, the identification tag 106 includes internal memory configured to store various forms of information about the injection assembly 100 (e.g., manufacturing information, serial number, valve calibration information, setpoints, etc.). For example, in one embodiment, the identification tag 106 is a radio frequency identification (RFID) tag configured to transmit the stored information in a receptive manner in response to receiving a predetermined identifier from an external device. Therefore, information about the injection assembly 100 can be retrieved quickly and efficiently.

[0085] For reference Figure 2 This diagram shows an exploded view of an injection assembly 100 according to an example embodiment. The carrier 108 includes a front side 110, a rear side 112, and a side 124. In various embodiments, a valve body 102 is attached to the front side 110 via an adhesive. The rear side 112 has a shroud 116 disposed thereon. The shroud 116 includes orifices 120 that provide supply ports for fluid (e.g., ink) to be deposited onto a target via the valve body 102. For example, in some embodiments, fluid (e.g., ink) is supplied to the valve body 102 via a first of the orifices 120 (e.g., via an inlet supply line or hose), circulates through the valve body 102, and exits from the valve body 102 via a second of the orifices 120. In other words, the fluid is recirculated through a fluid pressurization chamber. A diaphragm may be positioned in each of the orifices 120 and configured to allow a fluid delivery pin or fluid return pin to pass through its insertion to allow fluid communication into the fluid pressurization chamber while maintaining a fluid seal of the injection assembly 100. Although not shown, in some embodiments, a heating element (e.g., a resistance wire) may be positioned close to the valve body 102 or carrier 108 (e.g., surrounding or coupled to its sidewalls). The heating element may be used to selectively heat the fluid (e.g., ink) contained within the fluid pressurization chamber to maintain the fluid at a desired temperature.

[0086] The front side 110 includes a cavity adapted to receive the valve body 102, such that the valve body 102 is securely mounted to the front side 110 (e.g., via adhesive). A circuit board 104 is attached to the carrier 108 via a side 124. As shown, this side 124 includes mounting pins 126. In various embodiments, the circuit board 104 includes slots arranged in a manner corresponding to the mounting pins 126, and is adapted to receive the mounting pins 126 to align the circuit board 104 with the carrier 108.

[0087] As shown, circuit board 104 has a flexible circuit 114 attached thereto. The flexible circuit 114 extends from circuit board 104 at an angle and is attached to a carrier 108 immediately adjacent to the front side surface 110. The valve body 102 and circuit board 104 are arranged perpendicular to each other as the flexible circuit 114 extends around the angular boundary of the front side surface 110. Circuit board 104 also includes a controller interface 122, which includes electrical connection members (e.g., pins) configured to receive control signals, for example, from a deposition system controller.

[0088] As described herein, in various embodiments, the flexible circuit 114 may be disposed between the fluid manifold and the carrier 108; or an insert may be disposed between the carrier 108 and the valve body 102 to facilitate electrical connections between the electrodes forming the flexible circuit 114 and the plurality of microvalves contained in the valve body 102. In some embodiments, the flexible circuit 114 is attached to the front side 110 via a mounting member 148. An opening in the flexible circuit 114 is aligned with a diaphragm in the carrier 108 to provide a fluid inlet to a fluid pressurization chamber formed via the valve body 102.

[0089] For reference Figure 3 It shows a schematic diagram of various components of the injection assembly 100 according to an example embodiment. For example, Figure 3 Can describe Figure 1 The figure shows a cross-sectional view of the injection assembly 100 at line II. As shown, the valve body 102 extends from the front side 110 of the carrier 108 via an insert 170. The insert 170 provides structural support to ensure maximum performance of the various components in the valve body 102.

[0090] Valve body 102 includes an inlet fluid manifold 162 and a plurality of microvalves 164 attached to the inlet fluid manifold 162. The microvalves 164 and the inlet fluid manifold 162 form a fluid pressurization chamber 166 (e.g., via orifices 120 in a housing 116 attached to a rear side 112) for receiving fluid (e.g., a combination of ink and replenishment fluid) from a pressurized fluid supply source. In various embodiments, the fluid supply source includes a fluid reservoir and a pump configured to supply pressurized fluid to the injection assembly 100 via a supply line coupled to carrier 108. In various embodiments, the fluid supply source supplies pressurized fluid between 7 PSI and 15 PSI when one or more of the microvalves 164 are open. For example, in one embodiment, the fluid pressure is approximately 10 PSI when one or more microvalves are open. Carrier 108 may include an inner cavity configured to receive pressurized fluid and deliver fluid to the fluid pressurization chamber 166. In various embodiments, a pressure differential can be maintained between the fluid pressurization chamber and the fluid supply source to drive fluid out of the valve body 102. A pressure sensor may be disposed in the valve body 102 and / or the carrier 108 to determine the pressure differential and / or pumping pressure of the fluid pumped through the valve body 102.

[0091] The inlet fluid manifold 162 may include a glass structure containing channels forming a fluid pressurization chamber. Typically, the microvalve 164 includes an actuation beam spaced apart from orifices on an orifice plate and held at a front side 110, from which fluid is ejected. The actuation beam may include at least one piezoelectric material layer configured to deflect in response to a received control signal (e.g., a voltage waveform provided via a controller interface 122 on circuit board 104). As described herein, the application of this electrical signal causes the microvalve 164 to open, releasing a droplet at the orifice plate. The droplet advances a projection distance 192 onto a substrate 190 to create a desired pattern on the substrate 190. The structure and function of the various components of the microvalve 164 are described in more detail herein. In other embodiments, the actuation beam may include a stainless steel actuation beam (e.g., having a length of approximately 1 mm). In other embodiments, the actuation beam may include a bi-morph beam having two piezoelectric material layers disposed on either side of a substrate layer (e.g., a substrate silicon layer or a stainless steel layer). An electrical signal (e.g., voltage) can be applied to either of the piezoelectric layers to cause the actuated beam to bend toward the corresponding piezoelectric layer. The two piezoelectric layers may comprise the same piezoelectric material or different piezoelectric materials. In a particular embodiment, different electrical signals can be applied to each of the piezoelectric layers to cause the actuated beam to bend or fold toward the hole at a predetermined distance.

[0092] While the embodiments described herein generally depict the actuating beam as containing a piezoelectric material, other actuation mechanisms may be used in other embodiments. For example, in some embodiments, the actuating beam may include capacitive coupling for moving the actuating beam. In other embodiments, the actuating beam may include electrostatic coupling. In other embodiments, the actuating beam may include magnetic coupling (e.g., an electromagnetic structure actuated by an electromagnet) for moving the beam. In other embodiments, the actuating beam may include a temperature-sensitive bimetallic strip configured to move in response to temperature changes.

[0093] Insert 170 typically adds rigidity to various parts of valve body 102. For example, insert 170 may be configured to be more rigid than the components of valve body 102 (e.g., orifice plate, actuation beam, etc.) to counteract stresses arising from attaching such components to each other. For example, insert 170 may be attached to valve body 102 to counteract stresses arising from adhesives used to attach carrier 108 to valve body 102. Additionally, insert 170 may counteract stresses at the interface between input fluid manifold 162 and microvalve 164.

[0094] Referring now to Figure 4, a plan view of the injection assembly 100 according to an exemplary embodiment is shown. Figure 4 shows along... Figure 2Figure 4 shows a plan view of the valve body 102 at line II-II. Therefore, Figure 4 shows a plan view at the interface between the inlet fluid manifold 162 and the orifice plate. The inlet fluid manifold 162 includes a first opening 172 and a second opening 174. The first opening 172 exposes a plurality of micro-valve 164 to form a fluid pressurization chamber 166 configured to retain fluid contained from a fluid supply source.

[0095] In the illustrated example, the plurality of microvalves 164 include a plurality of actuating beams 176 aligned in a single row. Each of the plurality of actuating beams 176 has a sealing member 178 disposed at its end. In some embodiments, the sealing member 178 aligns with and contacts a valve seat disposed at a plurality of orifices in an orifice plate to prevent fluid from escaping from the fluid pressurization chamber 166 without any electrical signal. The injection assembly 100 is shown to include 52 actuating beams 176 forming 52 microvalves 164. In other embodiments, the injection assembly 100 may include any number of actuating beams.

[0096] In various embodiments, each of the plurality of actuation beams 176 extends from a member disposed below the boundary between the first opening 172 and the second opening 174. Each of the members may include an electrical connection exposed via the second opening 174. An electrical contact pad 180 is provided at each of the electrical connections. A bonding wire electrically connects each of the electrical connections to the controller interface 122 via the electrical contact pad 180. Thus, each of the actuation beams 176 can receive an electrical signal via the electrical contact pad 180. In some embodiments, belt automatic bonding (TAB) may be used to electrically connect each of the electrical connections to the controller interface.

[0097] The boundary between the first opening 172 and the second opening 174 isolates the electrical contact pad 180 from the fluid contained in the reservoir formed by the fluid opening 172. Additionally, it is advantageous that the electrical contact pad 180 is located below the inlet fluid manifold 162. This means that the electrical connections between the actuating beams 176 are located inside the carrier 108 and are protected from degradation and external contamination.

[0098] To isolate the electrical contact pad 180 from the fluid contained in the fluid pressurization chamber 166, an adhesive structure 182 is provided on the inlet fluid manifold 162. The adhesive structure 182 couples the inlet fluid manifold 162 to the orifice plate. As shown in FIG4, the adhesive structure 182 forms a “track” around each of the first opening 172 and the second opening 174. The track provides a barrier for fluid seeping between the inlet fluid manifold 162 and the orifice plate. For example, the track may be composed of several concentric rectangular rings of adhesive material (e.g., photoresist, such as bisphenol A type phenolic epoxy propylene ether photoresist sold under the trademark SU-8, or polymethyl methacrylate, polydimethylsiloxane, silicone rubber, etc.) around each of the first opening 172 and the second opening 174. Segments of adhesive material may cut through multiple of the rectangular rings to form a compartment for receiving the seeping fluid. This adhesive structure 182 facilitates fluid isolation between the micro-valve 164 and the electrical contact pad 180.

[0099] For reference Figure 5A It shows a cross-sectional view of an injection assembly 200 including a micro-valve 230 according to an example embodiment. In some embodiments, the injection assembly 200 is about Figure 1 , Figure 2 , Figure 3 The example embodiment of the injection assembly 200 is illustrated in Figure 4. As shown, the injection assembly 200 includes a carrier 202 attached to a valve body 298 via a structural layer 222. In some embodiments, the structural layer 222 may be part of the carrier 202.

[0100] The carrier 202 includes an upper portion 204 and a housing portion 206 extending from the edge of the upper portion 204. The upper portion 204 includes a diaphragm 208 through which pressurized ink is supplied. The housing portion 206 defines a chamber provided with a valve body 298. The valve body 298 includes an inlet fluid manifold 210 and a microvalve 230. As shown, the inlet fluid manifold 210 and the microvalve 230 define a reservoir 300 configured to hold a volume of pressurized fluid received from an external fluid supply source via the diaphragm 208. In various embodiments, the pressurized fluid held in the reservoir 300 may include, but is not limited to, ink, paint, solvent, biological solution, biochemical solution, chemical solution, physiological fluid (e.g., blood, urine, saliva, plasma, cerebrospinal fluid), adhesive, powder, gel, dye, cell staining agent, colloidal solution, suspension, emulsion, or any other suitable liquid.

[0101] The carrier 202 can be formed of plastic, ceramic, or any other suitable material. The carrier 202 facilitates operation of the injection assembly 200 by providing structural support to the valve body 298. For example, in some embodiments, the peripheral edge of the valve body 298 is attached to the housing portion 206 via an adhesive layer 302 disposed on the inner surface of the housing portion 206. This adhesive helps maintain the desired relative positioning between the microvalve 230 and the inlet fluid manifold 210.

[0102] In various embodiments, the inlet fluid manifold 210 is pre-formed and then attached to an additional component of the injection assembly 200. The fluid manifold 210 is formed from a body 310 having any suitable thickness (e.g., 500 micrometers) (e.g., formed of glass, silicon, silica, etc.). As shown, the inlet fluid manifold 210 is pre-formed to include a first channel 212 and a second channel 214. In the illustrated embodiment, the first channel 212 and the second channel 214 are substantially linear and parallel to each other, but the inlet fluid manifold 210 can be arranged according to the needs of the arrangement of the microvalve to be mounted thereon. The first channel 212 is formed with a width 304, which has a predetermined relationship with the length 312 of the cantilever portion 308 of the actuation beam 240 of the microvalve 230. For example, the first channel 212 may be formed with a width 304 greater than a threshold amount of the desired length 312 of the cantilever portion 308. The second channel 214 provides a path for forming an electrical connection between the actuation beam 240 and the flexible circuit 216, which is achieved via a bonding wire 220 extending between the actuation beam 240 and the flexible circuit 216. Advantageously, this configuration internalizes the electrical connection between the actuation beam 240 and the flexible circuit 216. In other words, this electrical connection between the components is not outside the carrier 202 and is therefore less prone to degradation. In various embodiments, the first channel 212 and / or the second channel 214 may have multiple sloping sidewalls.

[0103] As shown, the second channel 214 is substantially filled with a sealant 218. The sealant 218 may comprise an epoxy resin or any other suitable material. The sealant 218 encapsulates the electrical connection formed between the bonding wire 220, the flexible circuit 216, and the actuating beam 240, and is configured to protect the bonding wire 220 from physical damage, moisture, and corrosion. Therefore, the sealant 218 ensures that sufficient electrical connection is maintained between the flexible circuit 216 and the actuating beam 240 to facilitate the provision of electrical control signals to the actuating beam 240 to move it and open and close the micro-valve 230.

[0104] A portion 314 of the input fluid manifold 210 separating the first channel 212 and the second channel 214 serves as a barrier to prevent fluid contained in the reservoir 300 from flowing to the electrical connections. Therefore, the input fluid manifold 210 serves as a portion of the reservoir 300 for receiving pressurized fluid from an external fluid supply source and as an insulating barrier between the pressurized fluid and any electrical connections contained in the injection assembly 200. The first channel 212 and the second channel 214 can be formed using any suitable process (e.g., via sandblasting, physical or chemical etching, drilling, etc.). In some embodiments, the input fluid manifold 210 is made of silicon, silica, ceramic, or any other suitable material, rather than glass.

[0105] Continue to refer to Figure 5A The micro-valve 230 includes an orifice plate 250 attached to the actuation beam 240. The orifice plate 250 can be formed of any suitable material, such as glass, stainless steel, nickel, nickel containing another electroplated metal layer (e.g., stainless steel), polyimide (e.g., polyimide film (Kapton)), or photoresist (e.g., SU-8, polymethyl methacrylate, etc.). The orifice plate 250 is substantially planar and includes a hole 260 extending between a first surface and a second surface relative to the first surface. In various embodiments, the hole 260 is substantially cylindrical and has a central axis perpendicular or substantially perpendicular to the surface of the orifice plate 250. A valve seat 270 is disposed on the inner surface 316 of the orifice plate 250 immediately adjacent to the hole 260. In various embodiments, the valve seat 270 includes a compliant material surrounding or substantially surrounding the hole 260. In some embodiments, the valve seat 270 is constructed of an epoxy-based adhesive (such as SU-8 photoresist). In other embodiments, the valve seat 270 may be formed of a moldable polymer, such as polydimethylsiloxane or silicone rubber. The valve seat 270 defines an internal opening 318 of a substantially aligned orifice 260 to create an outlet for pressurized fluid contained in the reservoir 300. In a particular embodiment, the valve seat 270 may be removed such that the sealing member surface of the actuating beam 240 contacts the orifice plate 250 surrounding the orifice 260 to seal the orifice 260 and close the micro-valve 230.

[0106] The actuating beam 240 includes a base 306 and a cantilever 308. The base 306 extends below a portion 314 of the input fluid manifold 210 that separates the first channel 212 and the second channel 214. As shown, the base 306 includes an electrical connection 294 in the region overlapping with the second channel 214. The electrical connection 294 includes an electrode through which an electrical connection is formed with a flexible circuit 216 via a bonding wire 220. The cantilever 308 extends from the portion 314 of the input fluid manifold 210 into the reservoir 300. As shown, the cantilever 308 is disposed on a spacer member 280, thus spatially separating the cantilever 308 from the orifice plate 250. Therefore, space exists on either side of the cantilever 308 such that the actuating beam 240 can bend toward and / or away from the orifice plate 250 by applying an electrical signal thereto via the electrical connection 294. The spacer member 280 is configured to prevent compressive film damping of the actuating beam.

[0107] The cantilever portion 308 has a length 312 such that it extends a predetermined distance from the boundary of the reservoir 300. In various embodiments, the predetermined distance is specifically chosen such that a portion 292 of the cantilever portion 308 overlaps with the valve seat 270 and the bore 260. The sealing member 290 extends from a portion 292 of the actuating beam 240 of the overlapping bore 260. In some embodiments, the shape of the sealing member 290 is configured to substantially correspond to the shape of the bore 260. For example, in one embodiment, both the bore 260 and the sealing member 290 are substantially cylindrical, wherein the sealing member 290 has a larger outer diameter. This configuration helps the sealing member 290 to completely cover the bore 260 to form a seal between the sealing member 290 and the valve seat 270. In other embodiments, the bore 260 may have any other shape, such as star-shaped, square, rectangular, polygonal, elliptical, or asymmetrical. In a particular embodiment, the valve seat 270 may define a recessed dimension and be shaped to receive the sealing member 290. In various embodiments, the orifice plate 250 and orifice 260 may be formed of a non-wetting (e.g., hydrophobic) material, such as silicon or polytetrafluoroethylene (Teflon). In other embodiments, a non-wetting (e.g., hydrophobic) coating may be disposed on the inner wall of the orifice 260. Such a coating may include, for example, polytetrafluoroethylene, nanoparticles, oleophilic coatings, or any other suitable coating.

[0108] In various embodiments, the spacer member 280 and the sealing member 290 are made of the same material and have equal or substantially equal thicknesses 320 and 322 (e.g., silicone, SU-8, silicone rubber, polymethyl methacrylate, etc.). In this embodiment, the lower surfaces of the spacer member 280 and the sealing member 290 are aligned with each other when the actuation beam 240 extends parallel to the orifice plate 250. When the actuation beam 240 is in the closed position (as described herein), the surface of the sealing member 290 contacts the valve seat 270 to close the fluid outlet formed at the orifice 260 (e.g., the sealing member surface of the sealing member 290 may be configured to extend approximately 2 micrometers below the lower surface of the spacer member 280 if the valve seat 270 is not present). The valve seat 270 and the sealing member 290 can be sized such that when the actuating beam 240 is in the closed position (e.g., when an electrical signal is removed from or applied to the actuating beam 240 via a welding wire), a sufficient surface area of ​​the sealing member 290 contacts the valve seat 270 to prevent fluid from flowing from the reservoir 300 into the orifice 260. For example, the sealing member 290 may have a diameter or cross-section larger than that of the valve seat 270.

[0109] Various aspects of the injection assembly 200 are designed to ensure a sufficient seal is formed between the valve seat 270 and the sealing member 290. For example, a structural layer 222 disposed on the inlet manifold 210 prevents the orifice plate 250 from bending due to stress induced thereon by the adhesive that couples the components of the micro-valve 230 to each other and the micro-valve 230 to the housing portion 206. In various embodiments, the structural layer 222 is configured to have greater stiffness than the orifice plate 250 to perform this function. The structural layer 222 may be made of silicon or any other suitable material. As shown, the structural layer 222 includes a protrusion 224 extending from its main portion. The protrusion 224 is attached to the upper surface of the inlet manifold 210 (e.g., at the boundary between the first channel 212 and the second channel 214). In some embodiments, the protrusion 224 is omitted. A seal is formed at the protrusion 224 via, for example, an adhesive disposed between the structural layer 222 and the flexible circuit 216. The protrusion 224 provides a gap over the inlet manifold 210. This gap facilitates the arrangement of sealant 218 to completely cover all contact points between the solder wire 220 and the flexible circuit 216. In some embodiments, the carrier 202 includes a structural layer 222, such that the carrier 202 provides rigidity.

[0110] On the other hand, the actuation beam 240 is configured such that when in the closed position, a tight seal is formed at the interface between the valve seat 270 and the sealing member 290. The actuation beam 240 may include at least one piezoelectric material layer. The piezoelectric material layer may include lead titanate (PZT) or any suitable material. The piezoelectric material layer has electrodes electrically connected thereto. In various embodiments, a bonding wire 220 is attached to the electrodes such that an electrical signal from the flexible circuit 216 is provided to the piezoelectric material layer via the electrodes. The electrical signal causes the actuation beam 240 to move (e.g., bend, rotate, etc.) relative to its default position. In other embodiments, the actuation beam 240 may include a stainless steel actuation beam (e.g., having a length of about 1 mm). In other embodiments, the actuation beam 240 may include a dual piezoelectric chip beam having two piezoelectric material layers disposed on either side of a substrate layer (e.g., a substrate silicon layer). An electrical signal (e.g., a voltage) may be applied to either of the piezoelectric layers to cause the actuation beam 240 to bend toward the corresponding piezoelectric layer. The two piezoelectric layers may comprise the same piezoelectric material or different piezoelectric materials. In a particular embodiment, different electrical signals may be applied to each of the piezoelectric layers to bend or deflect the actuated beam a predetermined distance.

[0111] As shown, the bonding wire 220 is attached to the actuating beam 240 at its electrical connection 294. The electrical connection 294 includes a bonding wire pad (e.g., made of gold or platinum) electrically connected to at least one electrode within the actuating beam 240. Advantageously, the electrical connection 294 separates the cantilever portion 308 of the actuating beam 240. In other words, the electrical connection 294 separates the fluid contained in the injection assembly 200 via a seal formed at a plurality of connection points connecting the inlet fluid manifold 210 and the actuating beam 240. In some embodiments, the bonding wire 220 and / or sealant 218 may be led out through an opening provided in the orifice plate 250.

[0112] In various embodiments, the actuation beam 240 is configured such that the closed position is its default position. In other words, the various layers in the actuation beam 240 are configured such that the actuation beam 240 bends toward the orifice 260 due to the force provided by the pressurized fluid contained in the reservoir 300. Adjustment layers within the actuation beam 240 can be configured to be under compressive stress to cause the actuation beam 240 to bend toward the orifice 260. Due to this curvature, the sealing member 290 contacts the valve seat 270 even without any electrical signal applied to the actuation beam 240 to close the orifice 260. The degree of curvature can be specifically selected to form a tight seal at the interface between the sealing member 290 and the valve seat 270 when the actuation beam 240 is in the default position. Advantageously, this pre-set sealing member prevents evaporation of the fluid contained in the injection assembly 200, thus preventing blockages and other defects.

[0113] like Figure 5AAs shown, the actuation beam 240 bends away from the orifice plate 250. This bending is achieved by applying an electrical signal to the actuation beam 240 via a flexible circuit 216. For example, the flexible circuit 216 may be electrically connected to an external controller to provide the electrical signal to the actuation beam 240.

[0114] like Figure 5A As shown, an electrical signal is applied to temporarily deviate the actuation beam 240 from its default position. For example, in various embodiments, the actuation beam 240 moves upward away from the orifice 260 such that a portion of the sealing member surface of the sealing member 290 is at least 10 micrometers away from the upper surface of the valve seat 270. In one embodiment, the central portion of the sealing member surface is approximately 15 micrometers away from the valve seat 270 at the peak of its vibration mode. Thus, an opening is temporarily formed between the valve seat 270 and the sealing member 290. The opening provides a path for a given volume of fluid to enter the orifice 260 to form droplets at the outer surface of the orifice plate 250. The droplets are deposited onto the substrate to form a pattern, which is determined via a control signal provided to each of the actuation beams 240 of each of the microvalves 230 of the injection assembly 200. As understood, the frequency at which the actuation beam 240 moves away from its default position to a position such as that shown in FIG. 5 can be varied with implementation. In various embodiments, the natural frequency of the actuation beam 240 can be in the range of 1-30 kHz and can depend on the length, width, thickness, and / or stiffness of the actuation beam 240. For example, in one embodiment, the actuation beam 240 oscillates at a frequency of about 12 kHz. However, in other embodiments, the actuation beam 240 can oscillate at a lower (e.g., 10 kHz) or higher (e.g., 20 kHz) frequency.

[0115] For reference Figure 5B It shows a cross-sectional view of an injection assembly 200b containing a micro-valve 230b according to an example embodiment. In some embodiments, the injection assembly 200b is about Figure 1 , Figure 2 , Figure 3 The example embodiment of the injection assembly 100 described in Figure 4. As shown, the injection assembly 200b includes a carrier 202b attached to the valve body 298b via an insert 222b.

[0116] The carrier 202b includes an upper portion 204b and a housing portion 206b extending from the edge of the upper portion 204b. A fluid channel 211b is provided in the upper portion 204b. A diaphragm 208b (e.g., a rubber or foam diaphragm) is positioned at the inlet of the fluid channel 211b, and a filter 213b is positioned at the outlet of the fluid channel 211b. A housing 203b (e.g., a plastic or glass housing) is positioned on the carrier 202b such that the diaphragm 208b is positioned between and fixed therebetween the carrier 202b and the housing 203b. An opening 209b may be defined in the housing 203b and corresponds to the inlet of the fluid channel 211b. A fluid connector 10b is coupled to the housing 203b or the inlet of the fluid channel 211b. The fluid connector 10b includes an insertion pin 12b configured to pierce the diaphragm 208b and thereby be disposed in the fluid channel 211b. The fluid connector 10b is configured to pump pressurized fluid to the inlet fluid manifold 210b of the injection assembly 200b via the insertion pin 12b. Furthermore, the filter 213b is configured to filter particles from the fluid before it enters the fluid manifold 210b. In some embodiments, the insertion pin 12b may be formed of or coated with a non-wetting material (e.g., a hydrophobic material such as polytetrafluoroethylene). In other embodiments, the insertion pin 12b may include a heating element, or an electric current may be supplied to the insertion pin 12b to heat it, thereby allowing fluid flowing through it to enter the inlet fluid manifold 210b. In other embodiments, a metal needle or any other heating element may be provided in the inlet fluid manifold 210b to heat the fluid contained therein.

[0117] The housing portion 206b defines a chamber or boundary in which a valve body 298b is disposed. The valve body 298b includes an inlet fluid manifold 210b and a micro-valve 230b. As shown, the inlet fluid manifold 210b and the micro-valve 230b define a reservoir 300, which is configured to hold a volume of pressurized fluid received from an external fluid supply source via a diaphragm 208b. In various embodiments, the pressurized fluid held within the reservoir 300b includes inks, paints, solvents, biological solutions, biochemical solutions, chemical solutions, physiological fluids (e.g., blood, urine, saliva, plasma, cerebrospinal fluid), adhesives, powders, gels, dyes, cell staining agents, colloidal solutions, suspensions, emulsions, or any other suitable liquid.

[0118] In various embodiments, the inlet fluid manifold 210b is pre-formed and then attached to an additional component of the injection assembly 200b. For example, the fluid manifold 210b can be formed from a glass body 310b having any suitable thickness (e.g., 500 micrometers). As shown, the inlet fluid manifold 210b is pre-formed to include a first channel 212b and a second channel 214b. The first channel 212b is formed with a width 304b, which is predetermined to be related to the length 312b of the cantilever portion 308b of the actuation beam 240b of the microvalve 230b. The second channel 214b provides a path for forming an electrical connection between the actuation beam 240b and the flexible circuit 216b, which is achieved via a bonding wire 220b extending between the actuation beam 240b and the flexible circuit 216b.

[0119] As shown in the figure, the second channel 214b is substantially filled with sealant 218b. Sealant 218b ensures proper electrical connection between the flexible circuit 216b and the actuation beam 240b to facilitate the provision of electrical control signals to the actuation beam 240b to cause its movement, thereby opening and closing the micro valve 230b, and protecting the bonding wire 220b from physical damage or moisture as described herein.

[0120] A portion 314b of the input fluid manifold 210b separating the first channel 212b and the second channel 214b serves as a barrier to prevent fluid contained in the reservoir 300b from flowing to the electrical connection. Therefore, the input fluid manifold 210b serves as both a reservoir 300b for receiving pressurized fluid from an external fluid supply source and an insulating barrier between the pressurized fluid and any electrical connections contained in the injection assembly 200b.

[0121] The miniature valve 230b includes an orifice plate 250b attached to an actuating beam 240b. The orifice plate 250b is substantially planar and includes an orifice 260b extending between its surfaces. A valve seat 270b is disposed on an inner surface 316b of the orifice plate 250b adjacent to the orifice 260b. The valve seat 270b defines an inner opening 318b substantially aligned with the orifice 260b to create an outlet for pressurized fluid contained in the reservoir 300b. In a particular embodiment, the valve seat 270b may be removed such that the sealing member surface of the sealing member 290 contacts the orifice plate 250b surrounding the orifice 260b to seal the orifice 260b and close the miniature valve.

[0122] The actuating beam 240b includes a base 306b and a cantilever portion 308b. The base 306b extends below a portion 314b of the input fluid manifold 210b, thereby separating the first channel 212b and the second channel 214b. As shown, the base 306b includes an electrical connection portion 294b in the region overlapping with the second channel 214b. The electrical connection portion 294b includes an electrode through which an electrical connection is formed with the flexible circuit 216b via a bonding wire 220b. The cantilever portion 308b extends from the portion 314b of the input fluid manifold 210b into the reservoir 300b. As shown, the cantilever portion 308b is disposed on the spacer member 280b, thus spatially separating the cantilever portion 308b from the orifice plate 250b.

[0123] The cantilever portion 308b has a length of 312b, such that the cantilever portion 308b extends a predetermined distance from the boundary of the reservoir 300b. In various embodiments, the predetermined distance is specifically selected such that a portion 292b of the cantilever portion 308b overlaps with the valve seat 270b and the orifice 260b. The sealing member 290b extends from a portion 292b of the actuating beam 240b of the overlapping orifice 260b. In some embodiments, the shape of the sealing member 290b is configured to substantially correspond to the shape of the orifice 260b.

[0124] Flexible circuit 216b is positioned on the glass body 310b and a portion 314b of the inlet fluid manifold 210b, and coupled thereto via a first adhesive layer (e.g., SU-8, silicone rubber, etc.). Insert 222b is positioned between the upper portion 204b of the carrier 202b and the inlet fluid manifold 210b to create a gap between the upper portion 204b and the inlet fluid manifold 210b. This allows sufficient space for the placement of sealant 218 and increases the volume of the inlet fluid manifold 210b. Figure 5B As shown, the insert 222b is positioned and coupled to a portion of the flexible circuit 216b via a second adhesive layer 223b (e.g., SU-8, silicone, or any other adhesive). Furthermore, the insert 222b is coupled to the sidewall of the upper portion 204b of the carrier 202b immediately adjacent to the microvalve 230b via a third adhesive layer 225b (e.g., SU-8, silicone, or any other adhesive).

[0125] The insert 222b may be formed of a robust, flat, and rigid material (e.g., plastic, silicon, glass, ceramic, etc.) and disposed on the inlet fluid manifold 210b to prevent the orifice plate 250b from bending due to stress caused thereon by the adhesive that couples the components of the micro-valve 230b to each other and to the housing portion 206b. In various embodiments, the insert 222b is configured to have greater rigidity than the orifice plate 250b to perform this function.

[0126] On the other hand, the actuating beam 240b is configured such that, when in the closed position, a tight seal is formed at the interface between the valve seat 270b and the sealing member 290b. The actuating beam 240b may include at least one piezoelectric material layer (e.g., lead titanate (PZT) or any suitable material). The piezoelectric material layer has electrodes electrically connected thereto, and a bonding wire 220b is attached to the electrodes such that an electrical signal from the flexible circuit 216b is provided to the piezoelectric material layer via the electrodes. The electrical signal causes the actuating beam 240b to move (e.g., bend, rotate, etc.) relative to its default position.

[0127] As shown in the figure, the welding wire 220b is attached to the actuating beam 240b at its electrical connection 294b, which is basically similar to the figure above. Figure 5A The injection assembly 200 describes the weld line 220. In various embodiments, the actuating beam 240b is configured such that the closed position is in its default position, as described regarding Figure 5A Detailed description of the actuating beam 240.

[0128] like Figure 5B As shown, the actuation beam 240b bends away from the perforated plate 250b. This bending is achieved by applying an electrical signal to the actuation beam 240b via a flexible circuit 216b. For example, the flexible circuit 216b may be electrically connected to a circuit board 215b (e.g., a printed circuit board) extending along the sidewall of the carrier 202b perpendicular to the longitudinal axis of the actuation beam 240b. An identification tag 217b (e.g., identification tag 106) may be positioned between the circuit board 215b and the sidewall of the carrier 202b. An electrical connector 219b is electrically coupled to the circuit board 215b and configured to electrically connect the flexible circuit 216b to an external controller that provides the electrical signal transmitted to the actuation beam 240b via the circuit board 215b.

[0129] like Figure 5B As shown, an electrical signal is applied to temporarily deviate the actuation beam 240b from its default position. For example, in various embodiments, the actuation beam 240b moves upward away from the orifice 260b, such that a portion of the sealing member surface of the sealing member 290b is at least 10 micrometers away from the upper surface of the valve seat 270b, as per [reference to...]. Figure 5A Detailed description of the actuating beam 240.

[0130] For reference Figure 6 It illustrates, according to an exemplary embodiment, regarding Figure 5A A more detailed view depicting the various components of the injection assembly 200 is provided. As shown, the actuation beam 240 includes an actuation section 242, an adjustment layer 244, and a non-active layer 246. The non-active layer 246 serves as the base for the adjustment layer 244 and the actuation section 242. The structure of the actuation section 242 and the adjustment layer 244 is referenced in relation to... Figures 7A-7BMore detailed description. In some embodiments, the non-active layer 246 is formed using silicon or other suitable materials. In some embodiments, the non-active layer 246, the spacer 280, and the sealing member 290 are all formed using the same material (e.g., integrally formed using a silicon wafer). In an example embodiment, the non-active layer 246, the spacer 280, and the sealing member 290 are formed using a dual silicon-based insulator (SOI) wafer.

[0131] Spacer 280 is shown to include an intermediate layer inserted between two surrounding layers. In an example embodiment, the intermediate layer and non-active layer 246 comprise two silicon layers of a dual-SOI silicon wafer, with surrounding layers disposed on either side of the intermediate layer containing a silicon oxide layer. In this example, sealing member 290 and spacer 280 are formed by etching the surfaces of the dual-SOI silicon wafer relative to actuator 242. The oxide layer is used to control or stop an etching process, for example, removing the entire intermediate layer forming spacer 280 in the region separating spacer 280 and sealing member 290. This process provides precise control over the width and thickness of spacer 280 and sealing member 290.

[0132] As understood, the dimensions of the sealing member 290 can affect the resonant frequency of the actuating beam 240. A significant amount of material disposed at or near the ends of the actuating beam 240 typically results in a lower resonant frequency. Additionally, this significant amount of material can affect the default curvature of the actuating beam 240 caused by pressurized fluid contact. Therefore, the desired dimensions of the sealing member 290 influence various other design choices for the actuating beam 240. These design choices relate to… Figure 7AMore detailed description. In some embodiments, the sealing member 290 is sized based on the dimensions of the orifice 260. In some embodiments, the sealing member 290 is substantially cylindrical and its diameter is approximately 1.5 times the diameter of the orifice 260. For example, in one embodiment, when the diameter of the orifice 260 is approximately 60 micrometers, the diameter of the sealing member 290 is approximately 90 micrometers. This configuration facilitates alignment between the sealing member 290 and the orifice 260 such that the sealing member 290 completely covers the orifice 260 when contacting the valve seat 270. In another embodiment, the sealing member 290 is sized such that its surface area is approximately twice the surface area of ​​the orifice 260 (e.g., the diameter of the spacer member 280 may be approximately 150 micrometers, while the diameter of the orifice 260 is approximately 75 micrometers). This embodiment provides a larger tolerance for misalignment between the sealing member 290 and the orifice 260 to facilitate a seal between the valve seat 270 and the sealing member 290. In other embodiments, the diameter of the sealing member 290 may be 2, 2.5, 3, 3.5, or 4 times the diameter of the orifice 260. In various embodiments, the length-to-diameter ratio of the orifice 260 may range from 1:1 to 15:1. This ratio can affect the shape, size, and / or volume of the fluid droplets ejected through the orifice 260 and may vary depending on the specific application.

[0133] Advantageously, the gap 324 between the spacer member 280 and the sealing member 290 creates a spacer portion 326 of a certain volume between the actuating beam 240 and the orifice plate 250. The volume of the spacer portion 326 prevents the squeezing air film damping of the oscillation of the actuating beam 240. In other words, insufficient spacing between the orifice plate 250 and the actuating beam 240 will result in resistance because air must enter and / or leave the space of the spacer portion 326 when the actuating beam 240 opens and closes the orifice 260. The larger spacer volume created by the spacer member 280 reduces this resistance, thus facilitating the actuating beam 240 to oscillate at a faster frequency.

[0134] Continue to refer to Figure 6 The orifice plate 250 includes a base layer 252 and an intermediate layer 254. For example, in one embodiment, the base layer 252 comprises a silicon layer, and the intermediate layer 254 comprises a silicon oxide layer. In the illustrated embodiment, a portion of the intermediate layer 254 immediately adjacent to the orifice 260 is removed, and a first portion of the valve seat 270 is disposed directly on the base layer 252, while a second portion of the valve seat 270 is disposed on the intermediate layer 254. It should be understood that in alternative embodiments, the intermediate layer 254 extends to the boundary of the orifice 260, and the valve seat 270 is disposed on the intermediate layer 254. In other embodiments, the cross-section of the removed portion of the intermediate layer 254 may be equal to or larger than the cross-section of the valve seat 270, such that the valve seat 270 is entirely disposed on the base layer 252.

[0135] Due to the strict spatial relationship between the spacer 280 and the valve seat 270, the attachment of the spacer 280 to the orifice plate 250 is performed in a manner that allows precise control of the distance between the actuation beam 240 and the orifice plate 250. As shown, an adhesive layer 256 is used to attach the spacer 280 to the orifice plate 250. In various embodiments, a precise amount of epoxy-based adhesive (e.g., SU-8, polymethyl methacrylate, silicone, etc.) is first applied to an intermediate layer 254, upon which the combination of the spacer 280 and the actuation beam 240 is placed. The adhesive is then cured to form an adhesive layer 256 with a precisely controlled thickness. For example, in some embodiments, the lowermost surface of the spacer 280 is substantially aligned with the upper surface of the valve seat 270. Any desired relationship between these surfaces can be achieved to create a properly sealing relationship between the sealing member 290 and the valve seat 270 when the actuation beam 240 is in a predetermined position. In various embodiments, the adhesive layer 256 and the valve seat 270 can be formed from the same material (e.g., SU-8) during a single lithography process.

[0136] In various embodiments, once the actuation beam 240 and orifice plate 250 are attached to each other via adhesive layer 256 (e.g., to form a micro-valve 230), an additional adhesive layer 248 is applied around the actuation beam 240. The additional adhesive layer 248 is used to attach the inlet fluid manifold 210 to the actuation beam 240. An insert (e.g., insert 222b) may be positioned on the inlet fluid manifold 210 and coupled thereto via a second adhesive layer 225. In some embodiments, the additional adhesive layer 248 and the second adhesive layer 225 may comprise the same material as adhesive layer 256.

[0137] For reference Figure 7A The figure shows a more detailed view of the actuated beam 240 according to an example embodiment and not to scale. As shown, the actuated beam 240 includes a non-active layer 246, an adjustment layer 244, a barrier layer 400, a first electrode portion 402, an actuation portion 242, a second electrode portion 404, and a passivation structure 406. As will be understood, in various alternative embodiments, the actuated beam 240 may include more or fewer layers.

[0138] In some embodiments, adjustment layer 244 is disposed directly on non-active layer 246. Adjustment layer 244 generally serves as an adhesive layer to facilitate the deposition of the additional layer described herein. Additionally, as described herein, the thickness of adjustment layer 244 can play a critical role in determining the overall curvature of actuation beam 240 when it is in its default position. Generally, adjustment layer 244 is configured to have a predetermined adjustment stress such that, in the closed position, sealing member 290 of actuation beam 240 contacts and applies force to valve seat 270 to fluidly seal orifice 260. In some embodiments, in the absence of an electrical signal, the predetermined adjustment stress is configured to bend actuation beam 240 toward orifice 260 such that, without valve seat 270, the sealing member surface of sealing member 290 will be positioned below the lower surface of spacer member 280 at a predetermined distance (e.g., 2 micrometers). For example, adjustment layer 244 can be placed under compressive stress due to the deposition of the additional layer described herein. Therefore, when the actuating beam 240 is in the default position, the thicker the adjustment layer 244, the greater the curvature of the actuating beam 240 toward the hole 260.

[0139] The barrier layer 400 serves as a barrier to prevent the diffusion of material contained in the first piezoelectric layer 414 into the conditioning layer 244. If left uncontrolled, this migration can lead to harmful mixing effects between the constituent materials in the layers, thus adversely affecting performance. In various embodiments, the barrier layer 400 is made of, for example, oxide pins or carbon dioxide pins. As shown, the first electrode portion 402 includes an adhesive layer 408 and a first electrode 410. The adhesive layer 408 facilitates the deposition of the first electrode 410 onto the barrier layer 400 and prevents material in the first electrode 410 from diffusing into other layers. In various embodiments, the adhesive layer 408 is made of titanium. The first electrode 410 may be made of platinum or gold to provide a conductive path for supplying electrical signals to the actuation portion 242. In some embodiments, the first electrode portion 402 is only included in the selection portion of the actuation beam 240. For example, the first electrode portion 402 may be included near and / or within the electrical connection portion 294.

[0140] The actuating portion 242 can be formed from a single layer or multiple layers of any suitable piezoelectric material. In the illustrated example, the actuating portion includes a growth template or seed layer 412 and a piezoelectric layer 414. The growth template layer 412 serves as a seed layer to facilitate the growth of the piezoelectric layer 414 with the desired texture (e.g., {001} crystal structure and corresponding texture) to ensure maximum piezoelectric response. In some embodiments, the growth template layer 412 is made of lead titanate. The piezoelectric layer 414 can be made of any suitable material, such as lead titanate (PZT).

[0141] The piezoelectric layer 414 can be deposited using any method, such as vacuum deposition or sol-gel deposition techniques. In some embodiments, the thickness of the piezoelectric layer 414 can be in the range of about 20-200 micrometers (e.g., 20, 30, 40, 50, 60, 70, 80, 90, 100, 120, 140, 160, 180, or 100 micrometers) and is adapted to produce a deflection of about 10 micrometers at the end of the actuation beam 240 when an electrical signal is applied thereto. A 10-micrometer deflection (e.g., causing the surface of the sealing member 290 to deviate from the valve seat 270 by slightly less than this amount) is sufficient to generate droplets at the orifice 260 having the desired size. In some embodiments, the piezoelectric lateral coefficient (d31 value) of the piezoelectric layer 414 is about 140 to 160 pm / V. This value may cause a suitable deflection of the actuation beam 240 generated by the electrical signals provided to the first electrode portion 402 and the second electrode portion 404.

[0142] As shown in the figure, a second electrode portion 404 is disposed on the actuation portion 242. In various embodiments, the second electrode portion 404 is structurally similar to the first electrode portion 402 described herein. Therefore, applying a voltage to the first electrode portion 402 and / or the second electrode portion 404 induces stress in the piezoelectric layer 414, causing the entire actuation beam 240 to bend away from the orifice plate 250. By applying a periodic control signal to the first electrode portion 402 and the second electrode portion 404, the periodic cycling of the actuation beam 240 generates droplets output from the orifice 260 at a desired frequency. Although Figure 7A The first electrode portion 402 and the second electrode portion 404 are shown overlapping each other, but in other locations, the first electrode portion 402 and the second electrode portion 404 may not overlap. This can limit or prevent electron overflow between the first electrode portion 402 and the second electrode portion 404, which could potentially damage the piezoelectric layer 414 or cause an electrical short circuit.

[0143] Figure 7A The material shown can extend substantially entirely through the length of the actuating beam 240. Therefore, there is overlap between the electrode portions 402 and 404 and the reservoir formed via the micro-valve 230. In various embodiments, the fluid contained in the reservoir 300 is conductive and / or corrosive to the material forming the first electrode portion 402 and the second electrode portion 404. Therefore, electrode portions 402 and 404 are preferably isolated from the fluid reservoir 501 to prevent the fluid contained in the reservoir 300 from contacting electrode portions 402 and 404.

[0144] In this regard, the passivation structure 406 is configured to provide such isolation. In the illustrated example, the passivation structure 406 includes a dielectric layer 416, an insulating layer 418, and a barrier layer 420. The barrier layer 420 may be made of silicon nitride, which serves as a barrier layer to prevent the diffusion of water molecules and ions contained in the fluid, thus preventing corrosion of the electrode portions 402 and 404. In some embodiments, the insulating layer 418 includes a silicon dioxide layer with compressive stress that substantially balances the tensile stress in the barrier layer 420. The dielectric layer 416 may be made of aluminum oxide to prevent oxidation of the additional layers contained in the actuation beam 240. In some embodiments, an additional metal layer is disposed on the barrier layer 420. For example, the metal layer may be made of tantalum oxide or any other suitable chemically resistant metal to further enhance the protective properties of the passivation structure 406. In a particular embodiment, the barrier layer 420 may be formed of polytetrafluoroethylene (Teflon) or parylene. In other embodiments, at least a portion of the actuation beam 240 (i.e., Figure 7A The structure formed by the layers shown can be covered or coated with a layer of polytetrafluoroethylene or parylene. This coating can prevent the formation of microcracks in the multiple layers of the actuating beam 240. In other embodiments, the coating may include a metallic layer, such as a tantalum or palladium layer.

[0145] The addition of the passivation structure 406 can significantly affect the default position of the actuation beam 240. This is because the passivation structure 406 is offset from the compressive neutral axis 422 of the actuation beam 240. As shown, the neutral axis 422 is within the non-active layer 246, meaning that the electrode portion 404 and the passivation structure 406 are furthest from it within the actuation beam 240. In this case, the tensile or compressive stress induced in such a layer will significantly affect the default curvature of the actuation beam 240. Therefore, the thickness of the adjustment layer 244 is selected based on the structure of the various constituent layers of the passivation structure 406.

[0146] Figure 7B This is a front cross-sectional view of the actuated beam 240, showing the configuration of each layer included in the actuated beam according to an exemplary embodiment, but not shown to scale. As shown, the actuated beam 240 includes a non-active layer 246, an adjustment layer 244, and a barrier layer 400, as per [reference to...]. Figure 7A The description is as follows. The first electrode portion 402 includes an adhesive layer 408 (e.g., titanium oxide) positioned on the barrier layer 400 and a conductive layer or electrode 410 (e.g., platinum or gold) positioned thereon. The width of the first electrode portion 402 is configured to be smaller than the width of the barrier layer 400, such that the end of the electrode portion 402 in the direction perpendicular to the longitudinal axis of the actuation beam 240 is located within a plurality of ends of the barrier layer 400 in the same direction.

[0147] An actuating portion 242, comprising a seed layer 412 and a piezoelectric layer 414, is conformally disposed on the first electrode portion 402 to extend beyond the lateral ends of the first electrode portion 402 and to contact the barrier layer 400. Thus, the piezoelectric layer completely surrounds or encapsulates at least a portion of the first electrode portion 402 that overlaps with or is adjacent to the second electrode portion 404. The second electrode portion 404 includes an adhesive layer 403 (e.g., titanium) and a conductive layer 405 (e.g., platinum or gold). In some embodiments, the second electrode portion 404 may include only the conductive layer 405 directly disposed on the piezoelectric layer 414 (i.e., the adhesive layer 403 is omitted). Because the actuating portion 242 overlaps and extends beyond multiple ends of the first electrode portion 402, the actuating portion effectively electrically isolates the first electrode portion 402 from the second electrode portion 404 to prevent electron spillover and current migration that could impair the performance of the actuating beam 240.

[0148] The passivation structure 406 conformally coats the exposed portions of each of the other layers 246, 244, 400, 402, 242, and 404. However, the bottom surface of the non-active layer 246 may not be coated with the passivation structure 406. The passivation structure 406 may include a dielectric layer 416, an insulating layer 418, a barrier layer 420, and a top passivation layer 424. The barrier layer 420 may be composed of silicon nitride, which acts as a barrier layer to prevent the diffusion of water molecules and ions contained in the fluid, thus preventing corrosion of the electrode portions 402 and 404. However, silicon nitride is typically under tensile stress once deposited on the remaining layers. The insulating layer 418 is configured to counteract this tensile stress. For example, in some embodiments, the insulating layer 418 comprises a silicon dioxide layer with compressive stress that substantially balances the tensile stress in the barrier layer 420. In various embodiments, the barrier layer 420 may be positioned below the insulating layer 418. The dielectric layer 416 may be composed of aluminum oxide, titanium oxide, tin oxide, or zinc oxide to prevent oxidation of the additional layers contained in the actuation beam 240. Therefore, the passivation structure 406 serves to prevent both corrosion and oxidation in the actuation beam 240 (two major sources of defects due to the presence of fluid), thereby ensuring the long-term performance of the microvalve 230. Furthermore, a top passivation layer 424 is disposed on the barrier layer 420 and may comprise a layer of polytetrafluoroethylene or parylene. This coating prevents the formation of microcracks in the multiple layers of the actuation beam 240 and also prevents plasma discharge in the underlying layers (e.g., the buried layer may be exposed to plasma discharge during subsequent process operations). In certain embodiments, the top passivation layer 424 may comprise a metal layer, such as a tantalum or palladium layer. In some embodiments, an additional metal layer is disposed on the barrier layer 420. For example, the metal layer may be composed of tantalum oxide or any other suitable chemically resistant metal to further enhance the protective properties of the passivation structure 406.

[0149] In some embodiments, the non-contact deposition system may include a spray assembly, such as any of the spray assemblies described herein. For example, Figure 8 This is a schematic diagram of a non-contact deposition system 10 including a spray assembly 500 according to an embodiment. The spray assembly 500 includes a micro-valve 530 coupled to a carrier 504 via an insert 522.

[0150] The miniature valve 530 includes an orifice plate 550, which includes a first surface 551 and a second surface 553 opposite to the first surface 551. An orifice 560 extends from the first surface 551 to the second surface 553. The orifice plate 550 may be substantially similar to orifice plates 250 / 250b, and therefore will not be described in further detail herein. In some embodiments, a valve seat 570 may surround the orifice 560. The valve seat 570 defines an opening 518 in fluid communication with the orifice 560. The valve seat 570 may be substantially similar to valve seats 270 / 270b, and therefore will not be described in further detail herein.

[0151] A spacer member 579 is disposed on a first surface 551 and offset from the hole 560. An actuating beam 540 is disposed on the spacer member 579. The actuating beam 540 extends from the spacer member 579 toward the hole 560. The actuating beam 540 includes a piezoelectric material layer and is movable between a closed position and an open position by applying an electrical signal to the piezoelectric material layer. A sealing member 588 is disposed on the end of the actuating beam 540 and overlaps with the hole 560.

[0152] For example, when no electrical signal (e.g., voltage or differential voltage) is applied to the piezoelectric material layer, the actuation beam 540 is in a closed position (e.g., in its default state). In the closed position, the sealing member surface 589 of the sealing member 588 contacts the valve seat 570 (or the orifice plate 550 in embodiments where the miniature valve 530 does include the valve seat 570) to seal the orifice 560 and close the miniature valve 530. In the open position, the actuation beam 540 bends or deflects away from the orifice 560 such that the sealing member 588 no longer seals the orifice 560, and fluid can be ejected from the orifice 560 toward the substrate 590. The actuation beam 540 may be substantially similar to the actuation beam 240 / 240b or any other actuation beam described herein, and therefore will not be described in further detail herein.

[0153] A fluid manifold 514 is coupled to a miniature valve and defines a fluid reservoir 501 around an actuation beam 540. The fluid manifold 514 may be substantially similar to fluid manifolds 314 / 314b, and therefore will not be described in further detail herein. In some embodiments, an insert 522 may be disposed on and coupled to the fluid manifold 514. The insert 522 may be substantially similar in structure and function to insert 222b, and therefore will not be described in further detail herein.

[0154] Furthermore, a carrier 502 may be disposed on and coupled to the insert 522, such that the orifice plate 550, fluid manifold 514, insert 522, and carrier 502 collectively define the boundary of the fluid reservoir 501. The carrier 502 includes a base 504 disposed on and coupled to the insert 522 to define a portion of the boundary of the fluid reservoir 501. A sidewall 505 extends from the base 504 away from the microvalve 530, such that the carrier defines a fluid passage 511 through which it passes. A diaphragm 508 (e.g., a rubber or foam diaphragm) may be positioned at the inlet of the fluid passage 511, and a filter 513 may be positioned at the outlet of the fluid passage 511. A housing 503 (e.g., a plastic or glass housing) may be positioned on the sidewall 505, such that the diaphragm 508 is positioned between and fixed therebetween the sidewall 505 forming the fluid passage 511 and the housing 503. An opening 509 may be defined within a housing 503 and correspond to the inlet of a fluid passage 511. A fluid connector 51 may be coupled to the opening 509 of the housing 503 or the fluid passage 511 (e.g., via a fluid coupler). The fluid connector 51 may include an insertion needle 52 configured to pierce and pass through a diaphragm 508 into the fluid passage 511. The fluid connector 51 is configured to provide pressurized fluid to a fluid reservoir 501 via the insertion needle 52 (e.g., pressurization via a pump positioned upstream of the fluid connector 51). Furthermore, a filter 513 is configured to first filter particles from the fluid before delivering the fluid to the fluid reservoir 501. In some embodiments, the carrier 502 and the needle 52 may be substantially similar to carrier 202b and needle 12b, and therefore will not be described in further detail herein.

[0155] Although not in order to be clear Figure 8 As shown, however, the injection assembly 500 may include any other components as described with respect to injection assemblies 200 / 200b. Such components may include, for example, flexible circuitry 216 / 216b, wire bonding 220 / 220b, sealant 218 / 218b, electrical connector 219b, circuit board 215b, or any other components as described with respect to injection assemblies 200 / 200b. These components may have the same structure as described herein, perform the same function, and be located in the same position. It should be understood that, although... Figure 8 The non-contact deposition system 10 shown includes a single jet assembly 500; however, in other embodiments, the non-contact deposition system 10 may include multiple jet assemblies 500. In such embodiments, each of the multiple jet assemblies 500 may be configured to deposit the same fluid on multiple corresponding substrates or to deposit multiple fluids on the same or different substrates.

[0156] In some embodiments, the non-contact deposition system 10 may further include a platform 580 spaced apart from a microvalve 530 of the injection assembly 500, on which a substrate 590 is positioned. In some embodiments, a motion mechanism 50 may be coupled to the injection assembly 500 via a coupling member 52 (e.g., a coupling rod, bearing, or frame). Although shown as coupled to a carrier 502, in other embodiments, the motion mechanism 50 may be coupled to an insert 522, a fluid manifold 514, or any other part of the injection assembly 500. The motion mechanism 50 may include a servo motor, a rail assembly, or any other component configured to provide two-dimensional (in the XY plane) or three-dimensional (in the XYZ plane) motion to the injection assembly 500 to allow the deposition fluid to be positioned at a predetermined location on the substrate 590. In other embodiments, the motion mechanism 50 may be additionally or alternatively coupled to the platform 580 and configured to move the platform 580, thereby moving the substrate 590 relative to the injection assembly 500.

[0157] As previously described herein, fluid reservoir 501 is filled with pressurized fluid supplied by fluid connector 51 via fluid channel 511. By applying an electrical signal (e.g., differential voltage) to actuation beam 540, fluid is selectively ejected from orifice 560, causing the cantilever of actuation beam 540 to move away from orifice 560 and open microvalve 530. Droplets of fluid are ejected from orifice 560 onto substrate 590 and deposited thereon as fluid deposition 592 (e.g., droplets, patterns, marks, etc.).

[0158] The fluid can include any suitable fluid, depending on the specific application for which the non-contact deposition system 10 is to be used. The fluid can be a liquid, gel, powder, or colloidal solution. Suitable fluids can include, but are not limited to, inks, coatings, solvents, biological solutions, biochemical solutions, chemical solutions, physiological fluids, adhesives, powders, gels, dyes, cell staining agents, colloidal solutions, emulsions, suspensions, etc. In various embodiments, the fluid can include volatile fluids (e.g., solvent-based solutions such as inks, coatings, or adhesives) or gas-sensitive fluids (e.g., fluids containing components oxidized by oxygen in the air). In some embodiments, the non-contact deposition system 10 can be configured to deposit high-viscosity fluids in the viscosity range of 5-20 centipoise without the need for an external pump to pressurize the fluid for supply to the jet assembly 500. Furthermore, by supplying pressurized fluid to the jet assembly 500 (e.g., pumped via an external pump), the non-contact deposition system 10 is capable of depositing fluids with viscosities up to 100 centipoise.

[0159] The injection assembly 500 is configured to limit the fluid's exposure to air present in the external environment. For example, the default position of the microvalve 530 can be the closed position as described herein. Therefore, the fluid contained in the fluid reservoir 501 is only exposed to air when the microvalve 530 is open, thus limiting air exposure. This increases fluid lifetime and avoids the need for a controlled environment to perform deposition operations, thereby reducing costs.

[0160] Substrate 590 may include any suitable substrate. Figures 9-14 This is a schematic diagram of various substrates on which fluid can be deposited using a non-contact deposition system 10. (Reference) Figure 9 In some embodiments, the substrate may include a histopathology slide cassette 690. The histopathology slide cassette 690 may include a plurality of slots 691, each configured to hold a different cell or tissue sample. In this embodiment, the fluid may include a cell staining agent, and the non-contact deposition system 10 may be configured to deposit the same staining agent in each slot 691 or deposit different staining agents in different slots 691 (e.g., via a plurality of microvalve included in the non-contact deposition system 10). In some embodiments, the fluid may include ink, and the non-contact deposition system 10 may be configured to deposit ink onto the histopathology slide cassette 690 to form a mark 692 (e.g., a logo, barcode, serial number, etc.) on the histopathology slide cassette 690.

[0161] In some embodiments, the substrate may include Figure 10 The slide 790 is shown. For example, slide 790 may include a microscope slide and may be formed of glass or plastic. In this embodiment, the fluid may contain a chemical, biological, or biochemical solution. Biochemical or biological solutions may include, for example, solutions containing biomolecules in physiological buffers or solvents (e.g., proteins (e.g., antibodies, antigens, enzymes, protein fractions, etc.)), oligonucleotides, DNA strands, cell lysates, etc. In some embodiments, the solution may also include a gelling agent (e.g., sol-gel or hydrogel) or a polymerizing agent. The non-contact deposition system 10 may be configured to deposit an array of droplets 794 of solution (e.g., 500 pL to 10 nL volume droplets) onto slide 790 to form a microarray, which may be analyzed using a fluorescent probe or any other suitable analytical technique. In some embodiments, the non-contact deposition system 10 may also be configured to deposit ink onto slide 790 to form a mark 792 thereon (e.g., a logo, barcode, serial number, etc.).

[0162] In other embodiments, the substrate may comprise fabrics (e.g., cotton, nylon, polyester, elastic yarn, rayon, carpet, etc.), ceramic tiles, engineered wood panels, or laminates. In this embodiment, the non-contact deposition system 10 can be configured to deposit any suitable fluid thereon, such as conductive inks (e.g., conductive silver ink, polyvinyl dioxythiophene (PEDOT), polypyrrole (PPy) etc.), coatings, nano-coatings, or antimicrobial coatings. For example, Figure 11 The illustration shows a fabric 890 that may include an outer garment made of any suitable material described herein. A non-contact deposition system 10 can be used to deposit conductive ink onto the fabric 890 in a predetermined pattern to form an electrical component 894 (e.g., a resistor, electrode wire, or contact) on the surface of the fabric 890. Furthermore, the non-contact deposition system 10 can also be configured to deposit ink onto the fabric 890 to form a mark 892 thereon. Similarly, Figure 13 A substrate 1090 is shown, which may include fabrics (e.g., cotton, nylon, polyester, elastic yarn, rayon, carpet, etc.), ceramic tiles, engineered wood panels, or laminates, and a non-contact deposition system 10 is used to deposit a coating 1092, such as a nano-coating or an antimicrobial coating, on the substrate 1090. Figure 14 A substrate 1190 is shown, which may include fabrics (e.g., cotton, nylon, polyester, elastic yarn, rayon, carpet, etc.), ceramic tiles, engineered wood, or laminates, and a non-contact deposition system is configured to deposit ink or coating on the substrate 1090 to form a pattern 1192 on the substrate 1090.

[0163] In some embodiments, the substrate may include a circuit board. For example... Figure 12 A circuit board 990 is shown, for example, a printed circuit board (PCB). The non-contact deposition system 10 can be configured to deposit conductive fluids, such as conductive silver ink, polyvinyl dioxythiophene (PEDOT), polypyrrole (PPy), etc., semi-conductive fluids (e.g., hydrogenated amorphous silicon mixed with arsenic, selenium, and / or tellurium), or piezoelectric fluids, to print circuitry onto the circuit board 990. For example, Figure 12 An exemplary circuit is shown, comprising an electrode wire 994 between two contacts 996 printed on a circuit board 990 by a non-contact deposition system 10. In other embodiments, the non-contact deposition system 10 may also be used, for example, to deposit ink or paint on the circuit board 990 to form a mark 992 on the circuit board 990. The non-contact deposition system 10 may form multitasking electrical connections on the circuit board 990.

[0164] In some embodiments, the non-contact deposition system 10 is capable of printing fruit and vegetable labels or tags that are adhesively attached to food items to provide various information (e.g., price, sales date, country of origin, etc.). For example, the non-contact deposition system 10 can be configured to deposit adhesive onto such labels and print markings thereon.

[0165] In some embodiments, the fluid may contain a polymer that can transform its phase to a solid state (e.g., molten plastic that solidifies upon cooling or a liquid polymer that polymerizes upon exposure to air). In this embodiment, the non-contact deposition system 10 may be configured to deposit multiple polymer layers on a substrate 590 to form a three-dimensional object with a predetermined shape. For example, the motion mechanism 50 may be configured to move the jet assembly 500 along a predetermined path, such that multiple polymer layers are sequentially deposited on the substrate to form the three-dimensional object. In other words, the non-contact deposition system 10 can be used for 3D printing.

[0166] In some embodiments, the injection assembly can be configured to receive multiple fluids. For example, Figure 15 This is a schematic diagram of a spray assembly 1200 that can be used in a non-contact deposition system 10 according to an embodiment. The spray assembly 1200 includes: a microvalve 530 including an orifice plate 550 defining an orifice 560 therethrough; and an actuating beam 540 having a sealing member 588 disposed at its tip overlapping the orifice 560, as previously described herein. Unlike the spray assembly 500, the spray assembly 1200 includes a carrier 1202 disposed on and coupled to an insert 522, such that the orifice plate 550, fluid manifold 514, insert 522, and carrier 1202 collectively define the boundary of a fluid reservoir 501.

[0167] The carrier 1202 includes a base 1204 disposed on and coupled to the insert 522. A sidewall 1205 extends from the base 1204 away from the microvalve 530. However, unlike the injection assembly 500, the sidewall 1205 defines a first fluid channel 1211a and a second fluid channel 1211b through the carrier 1202. A first diaphragm 1208a is positioned at the inlet of the first fluid channel 1211a, and a second diaphragm 1208b is positioned at the inlet of the second fluid channel 1211b. Furthermore, a first filter 1213a and a second filter 1213b are positioned at the outlets of the first fluid channel 1211a and the second fluid channel 1211b, respectively. A housing 1203 can be positioned on the sidewall 1205 such that the diaphragms 1208a / b are positioned between and fixed therebetween the sidewall 1205 forming the fluid channels 1211a / b. Openings 1209a / b are formed in the housing 1203 and correspond to the inlet of fluid channel 121la / b.

[0168] A first fluid connector 51a is coupled to a first opening 1209a, and a second fluid connector 51b is coupled to a second opening 1209b defined in a housing 1203. The first opening 1209a and the second opening 1209b correspond to the inlets of the first fluid channel 1211a and the second fluid channel 1211b, respectively (e.g., via a fluid coupler). The fluid connectors 51a / b include corresponding insertion pins 52a / b configured to pierce and pass through a diaphragm 1208a / b and thus disposed in the fluid channel 1211a / b.

[0169] A first fluid connector 51a is configured to deliver a first fluid into a first fluid channel 1211a, and a second fluid connector 51b is configured to deliver a second fluid, different from the first fluid, into the second fluid channel 1211b. Thus, the first fluid channel 121a is configured to deliver the first fluid (e.g., ink or paint of a first color), and the second fluid channel 121b is configured to deliver the second fluid (e.g., ink or paint of a second color different from the first color) into the fluid reservoir 501. The injection assembly 1200 can be configured to selectively deposit the first fluid, the second fluid, or a mixture thereof formed within the fluid reservoir 501 onto a substrate (e.g., substrate 590). For example, the first fluid can be selectively delivered into the fluid reservoir 501 via the first fluid connector 51a and deposited onto the substrate (e.g., substrate 590 or any other substrate described herein). Delivery of the first fluid via the first fluid connector 51a can be selectively stopped, and the second fluid can then be delivered into the fluid reservoir 501 via the second fluid connector 51b. In other embodiments, each of the first fluid connector 51a and the second fluid connector 51b can simultaneously deliver a first fluid and a second fluid to the fluid reservoir 501, such that a mixture thereof is formed in the fluid reservoir 501. The mixture is then selectively deposited onto a substrate via a microvalve 530. Although Figure 15 A carrier containing two fluid channels 1211a / b is shown, but any number of fluid channels may be provided in the carrier 1202, such that any number of fluids may be delivered to the fluid reservoir 501 for individual deposition on the substrate or for deposition of at least a portion of a mixture thereof on the substrate.

[0170] The spray assembly 1200 can be used for any suitable application to deposit its fluids or mixtures onto a substrate. For example, in some embodiments, the substrate may include artificial or real nails. In such embodiments, the first fluid may contain a first nail color, and the second fluid may contain a second nail color different from the first nail color. The spray assembly 1200 can be configured to deposit a predetermined pattern of the first color, the second color, or a mixture thereof onto a real or artificial nail. In other embodiments, the substrate may include a color mixing palette (e.g., a palette for mixing artistic colors or hair dyes), and the first and second fluids may include powders, liquids, and / or gels that are mixed in the reservoir 501 or deposited separately on the palette such that they can be mixed thereon.

[0171] In some embodiments, the injection assembly may include a predetermined fluid supply source and a pressurization mechanism for pressurizing the fluid within a fluid reservoir, eliminating the need for an external fluid connector. For example, the carrier of the injection assembly may define an internal volume containing fluid. The fluid may be contained in a compressible fluid container disposed within the internal volume and may be under a constant pressure. In this embodiment, the carrier or a portion thereof may be removable.

[0172] For example, Figure 16 This is a schematic diagram of an injection assembly 1300 according to an embodiment. The injection assembly 1300 includes a microvalve 530 and a carrier 1310 coupled to the microvalve 530. The carrier 1310 includes a first carrier portion 1302 coupled to the microvalve 530. The first carrier portion 1302 may be substantially similar to the carrier 502, and therefore will not be described in further detail herein. The carrier 1310 also includes a second carrier portion 1320 disposed on and coupled to the first carrier portion 1302. The second carrier portion 1320 includes a second carrier portion housing 1322 defining an inner volume 1324. A compressible fluid container 1326 (e.g., a flexible bag or sac containing fluid) is disposed in the inner volume. A needle 1321 can fluidly couple the compressible fluid container 1326 to a fluid passage 1311 defined in the first carrier portion 1302, as previously described herein.

[0173] A portion of the internal volume of the compressible fluid container 1326 is filled with compressed gas (e.g., compressed air or nitrogen). The compressed gas applies a constant pressure to the compressible fluid container 1326, causing it to deliver pressurized fluid to the fluid reservoir 501 through needle 1321 and fluid passage 1311. When the micro-valve 530 opens and fluid is ejected from orifice 560, the continuous gas pressure acting upon it causes the compressible fluid container 1326 to deliver more fluid to the fluid reservoir 501. Thus, a separate fluid connector and fluid pressurization supply source can be removed from the non-contact deposition system containing the injection assembly 1300.

[0174] In some embodiments, once the fluid containing the second portion 1320 of the carrier is depleted, the injection assembly 1300 can be replaced with a new injection assembly. In other embodiments, the carrier 1310 or a portion thereof can be removably coupled to a microvalve, which can be replaced with a new carrier 1310 or a portion thereof once the fluid contained therein is depleted. For example, the second portion 1320 of the carrier can be removably coupled to the first portion 1302 of the carrier, for example, via a fastening mechanism (e.g., clip, protrusion, pawl, recess, etc.), belt, screw, pin, etc. Once all the fluid contained in the compressible fluid container 1326 has been delivered to the fluid reservoir 510, the user can replace the second portion 1320 of the carrier with a new one filled with fluid.

[0175] Figure 17 This is a schematic diagram of an injection assembly 1400 according to another embodiment. The injection assembly 1400 includes a microvalve 530 and a carrier 1410 coupled to the microvalve 530. The carrier 1410 includes a first carrier portion 1402 coupled to the microvalve 530. The first carrier portion 1402 may be substantially similar to the carrier 502, and therefore will not be described in further detail herein. The carrier 1410 also includes a second carrier portion 1420 disposed on and coupled to the first carrier portion 1402. The second carrier portion 1420 includes a second carrier portion housing 1422 defining an internal volume 1424 in which a compressible fluid container 1426 is disposed. A needle 1421 can fluidly couple the compressible fluid container 1426 to a fluid passage 1411 defined in the first carrier portion 1402, as previously described herein.

[0176] Unlike carrier 1310, carrier 1410 includes a biasing member 1428 disposed within an inner volume 1424, which can be coupled to a pressure plate 1429 that contacts a compressible fluid container 1426. The biasing member 1428 facilitates the orientation of the pressure plate 1429 toward the compressible fluid container 1426 to apply pressure to the compressible fluid container 1426. This pressure causes fluid to communicate through fluid passage 1411 into a fluid reservoir 501.

[0177] Figure 18This is a schematic diagram of an injection assembly 1500 according to another embodiment. The injection assembly 1500 includes a microvalve 530 and a carrier 1510 coupled to the microvalve 530. The carrier 1510 includes a first carrier portion 1502 coupled to the microvalve 530 and a second carrier portion 1520 coupled to the first carrier portion 1502. The first carrier portion 1502 is substantially similar to the first carrier portion 1302. Unlike the second carrier portion 1320, the second carrier portion 1520 includes a diaphragm 1526 that divides the internal volume of the second carrier portion 1520 into a first volume 1524 and a second volume 1525. The first volume 1524 is filled with a compressed gas (e.g., compressed air or nitrogen), and the second volume 1525 is filled with fluid. The compressed gas applies pressure to the diaphragm 1526 and to the fluid, thereby allowing the fluid to flow into a fluid reservoir 501.

[0178] While various embodiments of the injection assembly shown herein include a single orifice, in other embodiments, an array of orifices may be defined in any suitable manner on the orifice plate of the injection assembly. For example, Figure 19 An embodiment of a perforated plate 1650 is shown, which includes an array of a plurality of holes defined in a circular pattern. Figure 20 Another embodiment of the perforated plate 1750 is shown, which includes an array of holes 1760 defined in a semi-circular pattern. Figure 21 Another embodiment of the perforated plate 1850 is also shown, which includes an array of holes 1860 defined in an elliptical pattern. Figure 22 Another embodiment of the perforated plate 1950 is shown, which includes an array of holes 1960 defined in an octagonal pattern. Figure 23 Another embodiment of the perforated plate 2050 is shown, which includes an array of holes 2060 defined in an asymmetrical pattern.

[0179] In some embodiments, the microvalve containing orifice plates 1650, 1750, 1850, 1950, and 2050 may include a single actuation beam for depositing fluid through each of the plurality of orifices 1660, 1760, 1860, 1960, and 2060. For example, a sealing member (e.g., sealing member 588) of the actuation beam (e.g., actuation beam 540) may be large enough to overlap and seal each of the plurality of orifices 1660, 1760, 1860, 1960, and 2060 in the closed position of the microvalve, such that when the actuation beam is moved to the open position, fluid is ejected through each of the plurality of orifices 1660, 1760, 1860, 1960, and 2060. In other embodiments, a proprietary actuating beam can be associated with a corresponding orifice among a plurality of orifices 1660, 1760, 1860, 1960, and 2060, allowing fluid to be selectively deposited through one or more of orifices 1660, 1760, 1860, 1960, and 2060 based on a specific application. It will be understood that, although Figures 19-23 The illustration shows a specific pattern of holes, but in other embodiments, the holes may be defined in the perforated plate in any suitable pattern. All such arrangements should be considered within the scope of the invention.

[0180] In some embodiments, any of the non-contact deposition systems described herein can be configured to deposit fluid onto a microporous plate. For example, Figure 24 This is a schematic diagram of a non-contact deposition system 10 having a microwell plate 2190 disposed on a platform 580. The microwell plate 2190 defines a plurality of micropores 2192 (e.g., arranged in a rectangular array). In some embodiments, the microwell plate 2190 may comprise an array of micropores 2192 arranged in any suitable configuration (e.g., a 2:3 rectangular matrix) (e.g., 6, 12, 24, 48, 96, 384, 1,536, 3,456, or 9,600 micropores). Each micropore 2192 may be configured to hold a volume of fluid, for example, in the range of 10 nL to 10 mL.

[0181] In this embodiment, the fluid may include a solution of chemical, biochemical, and / or biomolecules, and the non-contact deposition system 10 may be configured to deposit a volume of solution in each of the plurality of microwells. For example, the fluid may include solutions used for performing enzyme immunoassay (ELISA), polymerase chain reaction (PCR), cell culture, filtration, separation, optical detection, reaction mixing, microbial activity detection, etc. In some embodiments, the non-contact deposition system 10 may include a plurality of spray assemblies 500, each spray assembly being configured to deposit a separate solution in a corresponding microwell 2192. In other embodiments, the non-contact deposition system 10 may include a spray assembly 1200 instead of a spray assembly 500 or any other spray assembly that can deposit multiple fluids on the microwell plate 1290.

[0182] In a further embodiment, the deposition system containing the injection assembly and microvalve is configured to dispense a gaseous fluid. This fluid is referred to collectively as a gaseous fluid. The type of gas is not limited and can be one or more of air, oxygen, nitrogen, carbon dioxide, hydrogen, or rare gases. Examples of rare gases include one or more of helium, neon, hydrogen, krypton, gas, and radon. In some configurations, the gaseous fluid may include one or more liquid particles, such as atomized water. However, in other configurations, the gaseous fluid does not include any added liquid particles. It should be noted that even when the gaseous fluid does not include any added liquid particles, there will still be some measurable amount of liquid particles entering the system, such as moisture condensation from compressed atmospheric gas.

[0183] When the deposition system is configured to dispense gaseous fluid, the pressure of the gaseous fluid in the reservoir of the injection assembly or microvalve is higher than the atmospheric pressure surrounding the deposition system, injection assembly, or microvalve. This ensures that the gaseous fluid is ejected from the orifice into the atmosphere. In some embodiments, the pressure can be varied during operation to provide different uses or different operational effects for the same deposition system.

[0184] When a deposition system is configured to dispense gaseous fluid, it can be incorporated into a variety of devices. For example, such a deposition system can be incorporated into one or more of screening equipment, dehydrators, air knives, jet cleaners, liquid aerators, sprayers, optical cleaners, surface cleaners, and tactile interface devices. Examples of tactile interface devices incorporating the deposition system described herein include one or more of headsets, hand protection, gloves configured to fit the hands, foot protection, boots configured to fit the feet, trousers, shirts, protection for any part of the skin, head protection, and face protection. Such tactile interface devices direct gaseous fluid to the wearer or user, thereby enabling the wearer or user to experience tactile sensations.

[0185] As used herein, the terms “about” and “close” generally refer to plus or minus 10% of the stated value. For example, about 0.5 would include 0.45 and 0.55, about 10 would include 9 to 11, and about 1000 would include 900 to 1100.

[0186] As used herein, the terms “coupled,” “connected,” etc., refer to two components joining each other directly or indirectly. Such joining can be fixed (e.g., permanent) or movable (e.g., removable or releasable). Such joining can be achieved in the case where two components or two components and any other intermediate components are integrally formed into a single unit, or in the case where two components and any other intermediate components are attached to each other.

[0187] References to element positions (e.g., "top", "bottom", "above", "below", etc.) herein are used only to describe the orientation of the various elements in the accompanying drawings. It should be noted that the orientation of the various elements may differ according to other exemplary embodiments, and this disclosure is intended to cover such variations.

[0188] The construction and arrangement of the elements shown in the exemplary embodiments are merely illustrative. Although only a few embodiments of this disclosure are described in detail, those skilled in the art will understand that many modifications can be made (e.g., variations in the size, dimensions, structure, shape and proportions, parameter values, mounting arrangements, material use, color, orientation, etc.) of various components without substantially departing from the novel teachings and advantages of the detailed subject matter. For example, an element shown as integrally formed may be composed of multiple parts or elements, the positions of the elements may be reversed or changed, and the nature and number of individual elements may be altered or changed.

[0189] Additionally, the term "exemplary" is used to indicate that it is an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "example" is not necessarily to be construed as superior or advantageous to other embodiments or designs (and the term "device" is not intended to imply that a device embodiment is necessarily an extraordinary or superior example). Rather, the use of the term "exemplary" is intended to present concepts in a specific manner. Therefore, all device modifications are intended to be included within the scope of this invention. Other substitutions, modifications, alterations, and omissions may be made to the design, operating conditions, and arrangements of preferred embodiments and other exemplary embodiments without departing from the scope of the appended claims.

[0190] It is important to note that the constructions and arrangements of the various embodiments presented herein are merely illustrative. While only a few embodiments are described in detail herein, those skilled in the art will understand that many modifications can be made (e.g., variations in the size, dimensions, structure, shape, proportions, parameter values, mounting arrangements, materials, colors, orientations, etc.) without substantially departing from the novel teachings and advantages of the objectives described herein. Furthermore, it should be understood that the features of the embodiments disclosed herein, as will be apparent to those skilled in the art, can be combined with features of other embodiments disclosed herein. Other substitutions, modifications, alterations, and omissions may also be made in the design, operating conditions, and arrangements of the various exemplary embodiments without departing from the scope of this disclosure.

[0191] While this specification contains numerous specific implementation details, these should not be construed as limiting the scope of any invention or any claimable invention, but rather as descriptions of features characteristic of particular embodiments of a particular invention. In the context of a single implementation, certain features described herein may also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment may also be implemented individually or in any suitable sub-combination in multiple embodiments. Furthermore, while features may be described above as functioning in certain combinations and even initially claimed as such, one or more features from a claimed combination may be removed from that combination in some cases, and the claimed combination may be for sub-combinations or variations thereof.

Claims

1. A non-contact deposition system, the non-contact deposition system comprising: Injection assembly, the injection assembly comprising: At least one miniature valve, each miniature valve comprising: An orifice plate, the orifice plate including a first surface and a second surface, the orifice plate including a portion extending from the first surface to the second surface. Holes on the second surface; A spacer member disposed on the first surface, the spacer member being offset from the hole; A valve seat surrounding the orifice, the valve seat defining an opening in fluid communication with the orifice; An actuating beam, disposed on the spacer member and extending from the spacer member toward the hole, the actuating beam including a piezoelectric material layer, movable between a closed position and an open position by applying an electrical signal to the piezoelectric material layer; and A sealing member disposed at the end of the actuating beam; and A fluid manifold, coupled to the microvalve and defining a fluid reservoir containing pressurized fluid around the actuation beam, When no electrical signal is applied to the piezoelectric material layer, the actuating beam is in the closed position, and the sealing member surface of the sealing member contacts the orifice plate to seal the orifice and close the micro valve. In the open position, fluid is sprayed from the orifice onto the substrate and deposited on the substrate. The volume of the sprayed fluid is configurable based on the adjustment of the actuation frequency of the actuating beam, and the projection distance of the spray assembly is configurable based on the volume of the sprayed fluid.

2. The non-contact deposition system according to claim 1, further comprising: A platform, spaced apart from the injection assembly, and configured to house a substrate on which the fluid is to be deposited; as well as A motion mechanism coupled to at least one of the injection assembly or the platform and configured to provide three-dimensional motion to the injection assembly or the platform to deposit fluid at a predetermined location on the substrate.

3. The non-contact deposition system according to claim 2, wherein, The substrate includes a circuit board, and the fluid includes a conductive fluid, a semi-conductive fluid, or a piezoelectric fluid.

4. The non-contact deposition system according to claim 2, wherein, The substrate includes a substrate sheet, wherein the fluid comprises a solution of at least one of a chemical, a biochemical, or a biomolecule, and wherein the non-contact deposition system is configured to deposit an array of droplets of the solution onto the substrate sheet.

5. The non-contact deposition system according to claim 2, wherein, The substrate includes a microporous plate defining a plurality of micropores, wherein the fluid includes a solution of at least one of a chemical, a biochemical, or a biomolecule, and wherein the non-contact deposition system is configured to deposit a volume of the solution in each of the plurality of micropores.

6. The non-contact deposition system according to claim 2, wherein, The fluid comprises a polymer, and wherein, The non-contact deposition system is configured to deposit multiple layers of the polymer to form a three-dimensional object with a predetermined shape.

7. The non-contact deposition system according to claim 2, wherein, The fluid includes one of the following: ink, paint, solvent, biological solution, biochemical solution, chemical solution, physiological fluid, adhesive, powder, gel, dye, cell staining agent, colloidal solution, emulsion, or suspension.

8. The non-contact deposition system according to claim 1, wherein, The fluid is a gaseous fluid.

9. A tactile interface device, the tactile interface device comprising the non-contact deposition system according to claim 1.

10. A non-contact deposition system, the non-contact deposition system comprising: Injection assembly, the injection assembly comprising: At least one miniature valve, said at least one miniature valve comprising: An orifice plate, the orifice plate including a first surface and a second surface, the orifice plate including holes extending from the first surface to the second surface; An actuating beam, configured to be spaced apart from the orifice plate, the actuating beam including a base and a cantilever portion extending from the base towards the orifice such that the overlapping portion of the cantilever portion overlaps with the orifice, the actuating beam being movable between a closed position and an open position; and A sealing structure, the sealing structure including a sealing member disposed at the overlapping portion of the cantilever; and A fluid manifold, coupled to the microvalve and defining a fluid reservoir containing pressurized fluid around the actuation beam, When the actuating beam is in the closed position, the cantilever is positioned such that the sealing structure member seals the orifice to close the micro-valve, and in the open position, the fluid is distributed from the orifice to the substrate and deposited on the substrate, wherein the volume of the injected fluid is configurable based on the adjustment of the actuation frequency of the actuating beam, and the projection distance of the injection assembly is configurable based on the volume of the injected fluid.

11. The non-contact deposition system according to claim 10, further comprising: A platform, spaced apart from the injection assembly and configured to receive the substrate; as well as A motion mechanism coupled to at least one of the injection assembly or the platform and configured to provide three-dimensional motion to the injection assembly or the platform to deposit the fluid at a predetermined location on the substrate.

12. The non-contact deposition system according to claim 11, wherein, The substrate includes a circuit board, and the fluid includes a conductive fluid, a semiconductor fluid, or a piezoelectric fluid.

13. The non-contact deposition system according to claim 11, wherein, The substrate includes a substrate sheet, wherein the fluid comprises a solution of at least one of a chemical or a biochemical, and wherein the non-contact deposition system is configured to deposit an array of droplets of the solution onto the substrate sheet.

14. The non-contact deposition system according to claim 11, wherein, The substrate includes a microporous plate defining a plurality of micropores, wherein the fluid comprises a solution of at least one of a chemical, a biochemical, or a biomolecule, and wherein the non-contact deposition system is configured to deposit a volume of the solution in each of the plurality of micropores.

15. The non-contact deposition system according to claim 11, wherein, The fluid comprises a polymer, and wherein, The non-contact deposition system is configured to deposit multiple layers of the polymer to form a three-dimensional object with a predetermined shape.

16. The non-contact deposition system according to claim 11, wherein, The fluid includes one of the following: ink, paint, solvent, biological solution, biochemical solution, chemical solution, physiological fluid, adhesive, powder, gel, dye, cell staining agent, colloidal solution, emulsion, or suspension.

17. The non-contact deposition system according to claim 10, wherein, The fluid is a gaseous fluid.

18. A tactile interface device, the tactile interface device comprising the non-contact deposition system according to claim 10.

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