Method and equipment for detecting MiniLED welding quality based on 3D confocal sensor

Abstract

The present invention provides a method and device for detecting MiniLED welding quality based on a 3D confocal sensor, which can realize reliable MiniLED welding quality detection, use a 3D confocal sensor to scan a MiniLED light-emitting backplane to obtain original 3D data; extract data of a target detection area; project the 3D data into 2D data through projection transformation, and establish a projection mapping relationship; superimpose material reflection intensity information of coordinates corresponding to the 3D data obtained by the 3D confocal sensor on the 2D projection map; segment the coordinate information of the edge of the MiniLED and the edge of the metal electrode from the superimposed projection map; detect whether there is a MiniLED patch missing or a deviation in the plane; calculate the average bonding height and bonding inclination angle of the MiniLED; and output the detection result.

Description

Technical Field

[0001] The display panel production process of the present application involves MiniLED welding detection technology, and more specifically, it particularly involves a method and equipment for detecting MiniLED welding quality based on a 3D confocal sensor. Background Art

[0002] "MiniLED cold soldering detection" is to perform welding inspection on each soldered MiniLED chip and IC chip on the MiniLED light-emitting backplane, to check for abnormal conditions such as cold soldering, leaking solder joints, short circuits, missing parts, damage, and misalignment, to ensure the quality of the output backplane products before entering the next process.

[0003] Most of the existing MiniLED welding process quality inspections rely on 2D visual routine and power-on luminescence inspections. This conventional inspection has two problems: On the one hand, 2D and power-on inspections can only detect welding leaks, missing parts, and misalignment, and it is difficult to detect other process problems. Some MiniLEDs with welding problems do not show abnormal luminescence in a short-term power-on inspection, so it is difficult to accurately detect welding dark defects, resulting in a low overall product life and difficulty in improving the yield rate. On the other hand, a single chip with a welding short circuit abnormality usually causes abnormal luminescence of the entire row or column. It is difficult for 2D inspection to locate the specific welding abnormality position, and welding repairs are generally abandoned and the entire board is directly scrapped, resulting in high mass production costs and difficulty in promoting the technology.

[0004] The existing 3D laser line scan detection equipment maps structured light onto the surface of the object, and then the receiver obtains the reflected deformed texture, and finally converts it into the 3D shape of the scanned object. The clarity of the scan depends on the reception of a clear structured light texture. However, since the light-emitting part of the MiniLED chip is made of transparent material, and the printed electrodes and glass substrate on the backplane also have a mixture of transparent and metal materials, the exposure brightness of conventional 3D line scan structured light on different materials varies greatly. While ensuring that the metal part is scanned clearly, it is difficult to capture the transparent area of ​​the LED chip and the surface of the transparent glass of the substrate, which makes it difficult for the detection system to obtain good quality data on the integrity of the chip and the relative height in all directions after welding, which leads to a low detection rate and even worse results than the 2D solution. Summary of the invention

[0005] In response to the above problems, the present invention provides a method and device for detecting MiniLED welding quality based on a 3D confocal sensor, which can adapt to the mixed material scanning of the MiniLED light-emitting backplane, can accurately obtain the position of the MiniLED chip and the metal electrode, and extract the position, fitting height, and posture information of the MiniLED welding on the substrate, thereby realizing reliable MiniLED welding quality detection.

[0006] The technical solution is as follows: A method for detecting MiniLED welding quality based on a 3D confocal sensor, characterized in that it includes the following steps:

[0007] Use 3D confocal sensor to scan MiniLED light-emitting backplane to obtain original 3D data;

[0008] Extracting data of a target detection area from the original 3D data, wherein the target monitoring area includes a substrate electrode exposed area and a MiniLED area;

[0009] Through projection transformation, the data of the target detection area is projected into 2D data, and a projection mapping relationship between 3D data and 2D data is established;

[0010] Overlaying the material reflection intensity information of the coordinates corresponding to the 3D data acquired by the 3D confocal sensor on the 2D projection image;

[0011] According to the different reflection intensity information of the material, the coordinate information of the edge of the MiniLED and the edge of the metal electrode is segmented from the superimposed projection image;

[0012] Use the coordinate information of the edge of the MiniLED and the edge of the metal electrode to detect whether there is a missing MiniLED patch or an in-plane deviation;

[0013] Based on the coordinate information and projection mapping relationship of the edge of the MiniLED, the average bonding height and bonding angle of the MiniLED are calculated;

[0014] Output the detection results.

[0015] Furthermore, when establishing a projection mapping relationship between 3D data and 2D data, projection is performed in the vertical direction, the 3D data is projected into 2D data from above, the x- and y-axis coordinates of the 2D data are matched one by one with the x- and y-axis coordinates of the coordinate points in the 3D data, and the Z-axis coordinates of the coordinate points in the 3D data are normalized to obtain a z depth map.

[0016] Furthermore, according to the different reflection intensity information of the material, the Sobel gradient operator is used to extract the edges of the MiniLED and the edges of the metal electrode in the x and y axis directions in the plane.

[0017] Furthermore, based on the coordinate information and projection mapping relationship of the edge of the MiniLED, the height difference in the Z-axis direction between the inner and outer sides of the edge of the MiniLED is counted, and the average bonding height and bonding inclination of the MiniLED are calculated, specifically including:

[0018] Use the Sobel gradient operator to obtain the horizontal and vertical edges of MiniLED;

[0019] Expand the edge images in each direction to 5 pixels in width;

[0020] According to the projection mapping relationship, the z-axis coordinate values ​​corresponding to the edges in each direction are found from the projection mapping table;

[0021] Calculate the range and standard deviation of the z-axis coordinate values ​​in each direction;

[0022] The average value of the standard deviation in each direction is taken as the average chip bonding height;

[0023] Find the X-axis coordinate and Y-axis coordinate of the corresponding point in the contour map from the projection mapping table, calculate the X-axis coordinate range and the Y-axis coordinate range, and obtain the horizontal and vertical widths of the chip;

[0024] Transverse bonding inclination angle = arctan [(lateral range - lateral standard deviation) * 2 / chip X-axis width];

[0025] Longitudinal lamination inclination angle = arctan[(longitudinal range - longitudinal standard deviation)*2 / chip Y-axis width].

[0026] Furthermore, the detection results including the missing status of MiniLED patches, the displacement in the X and Y axis directions in the plane, the average bonding height and the bonding inclination angle are visualized and output.

[0027] A device for detecting MiniLED welding quality based on a 3D confocal sensor, comprising:

[0028] A motion module, wherein the motion module comprises a multi-axis robot;

[0029] A 3D scanning module, wherein the 3D scanning module includes a 3D confocal sensor, and the motion module is capable of driving the 3D scanning module to scan the MiniLED light-emitting backplane.

[0030] The measuring module is capable of executing the above-mentioned method for detecting MiniLED welding quality based on a 3D confocal sensor.

[0031] Furthermore, it also includes: a safety assurance module for alarming.

[0032] A computer device comprises: a processor, a memory and a program; the program is stored in the memory, and the processor calls the program stored in the memory to execute the above-mentioned method for detecting MiniLED welding quality based on a 3D confocal sensor.

[0033] A computer-readable storage medium is used to store a program, and the program is used to execute the above-mentioned method for detecting MiniLED welding quality based on a 3D confocal sensor.

[0034] The present invention uses a 3D confocal sensor and the characteristic of its structured light being a continuous spectrum. Through the chromatic aberration of the received structured light, the multi-layer 3D data of different materials of MiniLED, printed metal electrode and transparent substrate can be accurately obtained, thereby ensuring that the system accurately extracts the welding position, bonding height and posture information of MiniLED on the substrate; adds the height direction patch welding state detection of MiniLED, evaluates the bonding quality of a single chip from multiple aspects such as the chip bonding height and tilt angle, thereby troubleshooting the problems of insufficient solder, cold soldering, uneven soldering and other dark diseases that cannot be detected by 2D detection equipment; at the same time, utilizing the different reflectivity of structured light of different materials, the received structured light intensity is used to distinguish different materials, thereby solving the problem of inability to detect MiniLED chips and metal electrode positions caused by conventional 3D line scanning, which is particularly suitable for mixed material scanning of MiniLED light-emitting backplanes. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic diagram of the steps of a method for detecting MiniLED welding quality based on a 3D confocal sensor in an embodiment;

[0036] Figure 2 This is a schematic diagram of the MiniLED being soldered off-center on the MiniLED light-emitting backplane;

[0037] Figure 3 This is a schematic diagram of the MiniLED soldering warping abnormality on the MiniLED light-emitting backplane;

[0038] Figure 4 This is a schematic diagram of a MiniLED with uneven solder on the MiniLED light-emitting backplane, resulting in cold soldering;

[0039] Figure 5 A schematic diagram showing excessive solder when MiniLED is soldered on a MiniLED light-emitting backplane;

[0040] Figure 6 A partial schematic diagram of a MiniLED when insufficient solder appears on the MiniLED light-emitting backplane;

[0041] Figure 7 This is a partial schematic diagram obtained by scanning the MiniLED light-emitting backplane with conventional 3D line scanning;

[0042] Figure 8 A partial schematic diagram of a method for detecting MiniLED welding quality based on a 3D confocal sensor, obtained by scanning a MiniLED light-emitting backplane;

[0043] Fig. 9A schematic diagram of the steps of a method for detecting MiniLED welding quality based on a 3D confocal sensor in another embodiment;

[0044] Fig.10 It is a block diagram of a device for detecting MiniLED welding quality based on a 3D confocal sensor in an embodiment;

[0045] Fig.11 It is a block diagram of a device for detecting MiniLED welding quality based on a 3D confocal sensor in an embodiment;

[0046] Fig.12 FIG. 4 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0047] In the present invention, each embodiment is only intended to illustrate the aspects of the present invention and should not be construed as limiting.

[0048] It should also be noted that in the embodiments of the present invention, for the sake of clarity and simplicity, only a portion of the parts or components may be shown, but those of ordinary skill in the art will understand that under the teachings of the present invention, the required parts or components may be added according to the needs of the specific scenario. In addition, unless otherwise specified, the features in different embodiments of the present invention may be combined with each other. For example, a feature in the second embodiment may be used to replace a corresponding or functionally identical or similar feature in the first embodiment, and the resulting embodiment also falls within the disclosure scope or recorded scope of the present application.

[0049] In addition, the numbering of the steps of the methods of the present invention does not limit the execution order of the method steps. Unless otherwise specified, the method steps can be executed in different orders.

[0050] First, the principle on which the present invention is based is explained.

[0051] like Figure 2 , 3 , 4, 5, 6, Figure 2 It shows that the MiniLED is soldered off-center on the MiniLED light-emitting backplane; Figure 3 It shows that the MiniLED has abnormal soldering warping on the MiniLED light-emitting backplane, which may cause uneven brightness. Figure 4 It shows that the MiniLED has uneven solder on the MiniLED light-emitting backplane, resulting in cold soldering, which may cause the MiniLED to fail to emit light. Figure 5 It shows that when MiniLED is soldered on the MiniLED light-emitting backplane, there is too much solder, which can easily lead to a short circuit. Figure 6 It shows that there is insufficient solder on the MiniLED light-emitting backplane, which can easily lead to cold soldering and desoldering.

[0052] With regard to these MiniLED welding quality issues, traditional 2D cannot detect some defects, and conventional 3D line scanning cannot adapt to the mixed material scanning of the MiniLED light-emitting backplane. Therefore, the present invention provides a method for detecting MiniLED welding quality based on a 3D confocal sensor.

[0053] The present invention will be further described below in conjunction with specific embodiments with reference to the accompanying drawings.

[0054] See Figure 1 A method for detecting MiniLED welding quality based on a 3D confocal sensor of the present invention at least comprises the following steps:

[0055] Step 1: Use a 3D confocal sensor to scan the MiniLED light-emitting backplane to obtain original 3D data;

[0056] Step 2: Extracting data of the target detection area from the original 3D data, wherein the target monitoring area includes the exposed substrate electrode area and the MiniLED area;

[0057] Step 3: Project the data of the target detection area into 2D data through projection transformation, and establish a projection mapping relationship between 3D data and 2D data;

[0058] Step 4: Overlaying the material reflection intensity information of the coordinates corresponding to the 3D data acquired by the 3D confocal sensor on the 2D projection image;

[0059] Step 5: According to the different reflection intensity information of the material, the coordinate information of the edge of the MiniLED and the edge of the metal electrode is segmented from the superimposed projection image;

[0060] Step 6: Use the coordinate information of the edge of the MiniLED and the edge of the metal electrode to detect whether there is a missing MiniLED patch or an in-plane deviation;

[0061] Step 7: Based on the coordinate information of the edge of the MiniLED and the projection mapping relationship, calculate the average bonding height and bonding angle of the MiniLED;

[0062] Step 8: Output the detection results.

[0063] The method of the present invention can effectively detect the welding condition of MiniLED on the substrate and the printed electrode, and accurately and quantitatively measure the height, offset, and inclination of the chip after welding, and accurately determine various abnormalities and deficiencies in the MiniLED welding process from all aspects, so as to ensure the consistency and quality of the output products, assist in the optimization of the patch welding process, and thus improve the yield rate;

[0064] Specifically in one embodiment of the present invention, a method for detecting MiniLED welding quality based on a 3D confocal sensor specifically includes the following steps:

[0065] Step 1: The operator places the MiniLED light-emitting backplane on the loading fixture. Different sizes of light guide plates need to correspond to different fixtures. Then the product carrier adsorbs and fixes the MiniLED light-emitting backplane. At the same time, the 3D confocal sensor moves to the pre-scanning position. Then the motion module drives the 3D confocal sensor to move to the scanning position, and then executes the scanning process. The 3D confocal sensor scans the MiniLED light-emitting backplane to obtain the original 3D data;

[0066] Step 2: Extract the data of the target detection area from the original 3D data. The target monitoring area includes the exposed area of ​​the substrate electrode and the MiniLED area. In this embodiment, the multi-layer scanning characteristics of the 3D confocal sensor are utilized. Since the electrodes in the patch area are printed on a transparent substrate, and the transparent substrates in other areas are covered with an opaque white coating, the area with a multi-layer scanning structure can be quickly segmented to quickly locate the area where each MiniLED to be detected is located. Because the non-exposed area of ​​the MiniLED light-emitting backplane is a white non-transparent coating with consistent material and consistent reflection intensity, the reflection intensity of the metal electrode and the MiniLED part is extremely high. Figure 8 , the non-exposed part of the data can be separated directly by screening the reflection intensity, and the remaining data is the data to be detected;

[0067] Step 3: Through projection transformation, the data of the target detection area is projected into 2D data, and a projection mapping relationship between 3D data and 2D data is established. When establishing the projection mapping relationship between 3D data and 2D data, projection is performed in the vertical direction, and the 3D data is projected into 2D data from top view. The x and y axis coordinates of the 2D data correspond to the x and y axis coordinates of the coordinate point in the 3D data one by one, and the Z axis coordinates of the coordinate point in the 3D data are normalized to 0-255, and a z depth map is obtained. At the same time, an X, Y, and Z axis coordinate mapping table is established. The three-dimensional coordinates including X, Y, and Z in 3D can be directly queried from the pixel row and column position of the 2D data. In this embodiment, an 8-bit depth map is used, and the single pixel value range of the image is 0-255. Therefore, when mapping 3D to the z depth map, the Z value needs to be normalized to 0-255 to avoid exceeding the pixel grayscale range;

[0068] Step 4: Overlay the material reflection intensity information of the coordinates corresponding to the 3D data obtained by the 3D confocal sensor on the 2D projection map. The material reflection intensity information is normalized to 0-255 and overlaid with the 2D projection map. The reflection intensity information is the material reflectivity value of a single 3D point, which is directly acquired by the sensor and can be regarded as the fourth dimension information of a single 3D point. Map the three dimensions of "XY-reflection intensity" of 3D to the 2D reflection intensity map (normalized to 0-255), and then overlay the 2D projection map and the reflection intensity map. The final grayscale image is used to extract the edge image;

[0069] Step 5: According to the different reflection intensity information of the material, the coordinate information of the edge of the MiniLED and the edge of the metal electrode is segmented from the superimposed projection image. Specifically, according to the different reflection intensity information of the material, the edge of the MiniLED and the edge of the metal electrode in the x and y axis directions in the plane are extracted using the Sobel gradient operator;

[0070] Step 6: Use the coordinate information of the edge of the MiniLED and the edge of the metal electrode to compare the coordinate information to detect whether there is a missing MiniLED patch or a deviation in the plane, and use the edge information to check whether the MiniLED is accurately overlapped and has no deviation;

[0071] Step 7: Based on the coordinate information and projection mapping relationship of the edge of the MiniLED, the height difference in the Z-axis direction between the inner and outer sides of the edge of the MiniLED is counted, and the average bonding height and bonding angle of the MiniLED are calculated, including:

[0072] Use the Sobel gradient operator in the z depth map to obtain the horizontal and vertical edges of the MiniLED;

[0073] Expand the edge images in each direction to 5 pixels in width;

[0074] According to the projection mapping relationship, the z-axis coordinate values ​​corresponding to the edges in each direction are found from the projection mapping table. These z values ​​include the points on the chip and the points on the adjacent substrate surface.

[0075] Calculate the range and standard deviation of the z-axis coordinate values ​​in each direction;

[0076] The average value of the standard deviation in each direction is taken as the average chip bonding height;

[0077] Find the X-axis coordinate and Y-axis coordinate of the corresponding point in the contour map from the projection mapping table, calculate the X-axis coordinate range and the Y-axis coordinate range, and obtain the horizontal and vertical widths of the chip;

[0078] Transverse bonding inclination angle = arctan [(lateral range - lateral standard deviation) * 2 / chip X-axis width];

[0079] Longitudinal lamination inclination angle = arctan[(longitudinal range - longitudinal standard deviation)*2 / chip Y-axis width].

[0080] Step 8: Visualize the inspection results including the missing status of MiniLED patches, the displacement in the X and Y axis directions within the plane, the average bonding height and the bonding inclination angle.

[0081] Figure 7 The local schematic diagram obtained by conventional 3D line scanning of the MiniLED light-emitting backplane is shown. It only contains the MiniLED and IC chip data with 3D spatial information, and it is difficult to identify the location of metal electrodes and solder joints. Figure 8 This is a partial schematic diagram of the method for detecting MiniLED welding quality based on 3D confocal sensor of the present invention, which is obtained by scanning the MiniLED light-emitting backplane; it contains MiniLED and IC chip data with superimposed intensity information, and the exposed metal electrode under the chip can be clearly seen, so that the welding quality can be effectively detected.

[0082] The method of this embodiment solves the problem that some defects of MiniLED cannot be detected by traditional 2D detection methods and equipment. It uses 3D confocal sensor scanning automatic detection to replace 2D detection, adds z-direction patch welding status detection of MiniLED, and evaluates the bonding quality of a single chip from multiple aspects such as chip bonding height and tilting angle, so as to troubleshoot hidden defects such as insufficient solder, cold soldering, and uneven soldering that cannot be detected by 2D.

[0083] The method of this embodiment solves the problem that conventional 3D line scanning cannot adapt to the scanning of mixed materials such as MiniLED backlight substrates. It uses a 3D confocal line scanning sensor and the characteristic that its structured light is a continuous spectrum. The multi-layer 3D data of different materials such as MiniLED, printed metal electrodes and transparent substrates can be accurately obtained through the color difference of the received structured light, ensuring that the system can accurately extract the welding position, bonding height and posture information of MiniLED on the substrate; at the same time, the different reflectivity of different materials to structured light is used to distinguish different materials based on the received structured light intensity, solving the problem of conventional 3D line scanning being unable to scan MiniLED chips and metal electrode positions well.

[0084] The method of this embodiment improves the detection rate, accurately locates defects, and enhances process controllability. It uses a 3D confocal sensor to scan the product globally, and uses the "reflection intensity information" and "3D spatial information" of structured light of different materials to accurately extract the 3D status information of MiniLED, substrate, and metal solder joints. It accurately counts the soldering anomalies of each MiniLED chip and the detailed status of the finished product, so that AOI (automatic optical inspection) can provide accurate data support for closed-loop optimization of the process.

[0085] See Fig. 9 Another method for detecting MiniLED welding quality based on a 3D confocal sensor of the present invention at least includes the following steps:

[0086] Step 1: Use a 3D confocal sensor to scan the MiniLED light-emitting backplane to obtain original 3D data;

[0087] Step 2: Project the 3D data into 2D data through projection transformation, and establish a projection mapping relationship between the 3D data and the 2D data;

[0088] Step 3: Overlaying the material reflection intensity information of the coordinates corresponding to the 3D data acquired by the 3D confocal sensor on the 2D projection image;

[0089] Step 4: Extract the data of the target detection area from the superimposed projection image. The target monitoring area includes the exposed area of ​​the substrate electrode and the MiniLED area;

[0090] Step 5: According to the different reflection intensity information of the material, the coordinate information of the edge of the MiniLED and the edge of the metal electrode is segmented from the superimposed projection image;

[0091] Step 6: Use the coordinate information of the edge of the MiniLED and the edge of the metal electrode to detect whether there is a missing MiniLED patch or an in-plane deviation;

[0092] Step 7: Based on the coordinate information of the edge of the MiniLED and the projection mapping relationship, calculate the average bonding height and bonding angle of the MiniLED;

[0093] Step 8: Output the detection results.

[0094] In this embodiment, the method is different from the previous embodiment in that the timing of extracting the target detection area is adjusted. In practice, the target detection area can be extracted from the 3D data stage or the 2D data stage.

[0095] See Fig.10 In an embodiment of the present invention, a device for detecting MiniLED welding quality based on a 3D confocal sensor is also provided, comprising:

[0096] Motion module 1, the motion module includes a multi-axis robot, and a 3-axis robot is used in this embodiment;

[0097] 3D scanning module 2, the 3D scanning module includes a 3D confocal sensor, and the motion module 1 can drive the 3D scanning module to scan 2MiniLED light-emitting backplanes.

[0098] The measuring module 3 executes the method for detecting the welding quality of MiniLED based on the 3D confocal sensor in the above-mentioned embodiment.

[0099] The operator places the MiniLED light-emitting backplane on the loading and fixing fixture. Different sizes of light guide plates require corresponding different fixtures. Then the product carrier adsorbs and fixes the MiniLED light-emitting backplane. At the same time, the 3D confocal sensor moves to the pre-scanning position. Then the motion module drives the 3D confocal sensor to the scanning position, and then executes the scanning process. The 3D confocal sensor scans the MiniLED light-emitting backplane to obtain the original 3D data. At the same time, the measurement module 3 will automatically calculate and measure the data after the scanning is completed. When the scanning and calculation of all detection areas are completed, the visualization end will automatically display the detection results.

[0100] The device in this embodiment uses a 3D confocal line scan sensor in conjunction with a three-axis robot to scan the entire MiniLED backlight panel at one time to detect whether the soldering status of the entire MiniLED chip panel meets the parameter requirements. It can also check the soldering status of a single chip. If it does not meet the requirements, the user can choose to adjust the parameters, or directly report NG and record the data.

[0101] Fig.11 In an embodiment of the present invention, a device for detecting MiniLED welding quality based on a 3D confocal sensor further includes:

[0102] Safety assurance module 4, safety assurance module 4 specifically includes interactive alarm, operation alarm, and result alarm. Interactive alarm means that during the operation of the equipment, once human intervention occurs, the equipment will immediately stop running and alarm; operation alarm means whether the conditions for the next operation are met during the operation of the equipment, such as abnormal air pressure value of the product adsorbed by the carrier, inadequate product loading, and inability to operate the machine. Such abnormalities will cause an alarm; result alarm is used for batch testing, and an alarm will be issued to prompt production personnel for products that do not meet the test standards.

[0103] In an embodiment of the present invention, a computer device is also provided, comprising: a processor, a memory and a program;

[0104] The program is stored in the memory, and the processor calls the program stored in the memory to execute the above-mentioned method for detecting MiniLED welding quality based on 3D confocal sensor.

[0105] The computer device may be a terminal, and its internal structure diagram may be as follows: Fig.12 As shown. The computer device includes a processor, a memory, a network interface, a display screen and an input device connected by a bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a method for detecting MiniLED welding quality based on a 3D confocal sensor is implemented. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covered on the display screen, or a key, trackball or touchpad set on the housing of the computer device, or an external keyboard, touchpad or mouse, etc.

[0106] The memory may be, but is not limited to, a random access memory (RAM), a read only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable read-only memory (EEPROM), etc. The memory is used to store programs, and the processor executes the programs after receiving the execution instruction.

[0107] The processor can be an integrated circuit chip with signal processing capabilities. The above-mentioned processor can be a general-purpose processor, including a central processing unit (Central Processing Unit, referred to as: CPU), a network processor (Network Processor, referred to as: NP), etc. The processor can also be other general-purpose processors, digital signal processors (Digital Signal Processor, DSP), application-specific integrated circuits (Application Specific Integrated Circuit, ASIC), field programmable gate arrays (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc. The various methods, steps and logic block diagrams disclosed in the embodiments of the present application can be implemented or executed. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc.

[0108] Those skilled in the art will understand that Fig.12 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0109] In an embodiment of the present invention, a computer-readable storage medium is further provided, and the computer-readable storage medium is used to store a program, and the program is used to execute the above-mentioned method for detecting MiniLED welding quality based on a 3D confocal sensor.

[0110] Those skilled in the art will appreciate that the embodiments of the embodiments of the present invention may be provided as methods, computer devices, or computer program products. Therefore, the embodiments of the present invention may take the form of complete hardware embodiments, complete software embodiments, or embodiments combining software and hardware. Moreover, the embodiments of the present invention may take the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0111] The embodiments of the present invention are described with reference to flowcharts of methods, computer devices, or computer program products according to the embodiments of the present invention. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal device generate a device for implementing the functions specified in the flowchart.

[0112] These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing terminal device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction device that implements the functions specified in the flowchart.

[0113] The above is a detailed introduction to the method, equipment, computer device, and computer-readable storage medium for detecting MiniLED welding quality based on a 3D confocal sensor provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A method for detecting MiniLED welding quality based on a 3D confocal sensor, characterized in that: The following steps are involved: Use 3D confocal sensor to scan MiniLED light-emitting backplane to obtain original 3D data; Retrieving data of a target detection area, wherein the target monitoring area includes a substrate electrode exposed area and a MiniLED area; Through projection transformation, 3D data is projected into 2D data, and a projection mapping relationship between 3D data and 2D data is established; Overlaying the material reflection intensity information of the coordinates corresponding to the 3D data acquired by the 3D confocal sensor on the 2D projection image; According to the different reflection intensity information of the material, the coordinate information of the edge of the MiniLED and the edge of the metal electrode is segmented from the superimposed projection image; Use the coordinate information of the edge of the MiniLED and the edge of the metal electrode to detect whether there is a missing MiniLED patch or an in-plane deviation; Based on the coordinate information and projection mapping relationship of the edge of the MiniLED, the average bonding height and bonding angle of the MiniLED are calculated; Output the detection results.

2. According to claim 1, a method for detecting MiniLED welding quality based on a 3D confocal sensor is characterized in that: When establishing a projection mapping relationship between 3D data and 2D data, projection is performed in the vertical direction, the 3D data is projected into 2D data from above, the x- and y-axis coordinates of the 2D data are matched one by one with the x- and y-axis coordinates of the coordinate points in the 3D data, and the Z-axis coordinates of the coordinate points in the 3D data are normalized to obtain a z depth map.

3. The method for detecting MiniLED welding quality based on a 3D confocal sensor according to claim 2 is characterized in that: According to the different reflection intensity information of the material, the Sobel gradient operator is used to extract the edges of the MiniLED and the edges of the metal electrode in the x and y axis directions in the plane.

4. The method for detecting MiniLED welding quality based on a 3D confocal sensor according to claim 3 is characterized in that: Based on the coordinate information and projection mapping relationship of the edge of the MiniLED, the height difference in the Z-axis direction on both sides of the edge of the MiniLED is counted, and the average bonding height and bonding angle of the MiniLED are calculated, including: Use the Sobel gradient operator to obtain the horizontal and vertical edges of MiniLED; Expand the edge images in each direction to 5 pixels in width; According to the projection mapping relationship, the z-axis coordinate values ​​corresponding to the edges in each direction are found from the projection mapping table; Calculate the range and standard deviation of the z-axis coordinate values ​​in each direction; The average value of the standard deviation in each direction is taken as the average chip bonding height; Find the X-axis coordinate and Y-axis coordinate of the corresponding point in the contour map from the projection mapping table, calculate the X-axis coordinate range and the Y-axis coordinate range, and obtain the horizontal and vertical widths of the chip; Transverse bonding inclination angle = arctan [(lateral range - lateral standard deviation) * 2 / chip X-axis width]; Longitudinal lamination inclination angle = arctan[(longitudinal range - longitudinal standard deviation)*2 / chip Y-axis width].

5. The method for detecting MiniLED welding quality based on a 3D confocal sensor according to claim 1, characterized in that: The inspection results including the missing status of MiniLED patches, the deviation in the X and Y axis directions in the plane, the average bonding height and the bonding inclination angle are visualized and output.

6. A device for detecting MiniLED welding quality based on a 3D confocal sensor, characterized in that: include: A motion module, wherein the motion module comprises a multi-axis robot; A 3D scanning module, wherein the 3D scanning module includes a 3D confocal sensor, and the motion module is capable of driving the 3D scanning module to scan the MiniLED light-emitting backplane; The measuring module is capable of executing the method for detecting MiniLED welding quality based on a 3D confocal sensor as described in claim 1.

7. The device for detecting MiniLED welding quality based on 3D confocal sensor according to claim 6, characterized in that: Also includes: The safety protection module is used for alarm.

8. The device for detecting MiniLED welding quality based on a 3D confocal sensor according to claim 6, characterized in that: It also includes a fixing fixture for fixing the product to be tested, and the fixing fixture is provided with a carrier capable of adsorbing the product to be tested.

9. A computer device, characterized in that: It includes: It includes a processor, a memory and a program; the program is stored in the memory, and the processor calls the program stored in the memory to execute the method for detecting MiniLED welding quality based on a 3D confocal sensor as described in claim 1.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium is used to store a program, and the program is used to execute the method for detecting MiniLED welding quality based on a 3D confocal sensor as described in claim 1.

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