Film forming apparatus, method for manufacturing electronic device, and method for maintaining film forming source

Abstract

The present invention provides a film formation device capable of saving space and improving maintenance of a film formation source, a method for manufacturing an electronic device, and a method for maintaining a film formation source. The film formation device is characterized in that an opening and closing portion (10a) capable of moving at least one member constituting a film formation source (100) from the inside to the outside of a chamber (10) and from the outside to the inside of the chamber (10) is provided at a position apart from a position where a substrate holding member (11) is arranged on a top plate of the chamber (10), and a moving member is configured to reciprocally move the film formation source (100) between a position facing a substrate (P) held by the substrate holding member (11) during film formation and a position directly below an opening portion (10b) opened by the opening and closing portion (10a).

Description

Technical Field

[0001] This invention relates to a film-forming apparatus for forming a thin film on a substrate using a film-forming source, a method for manufacturing electronic devices, and a method for maintaining the film-forming source. Background Technology

[0002] In film-forming apparatuses used for forming films on the surface of large-area substrates, techniques for forming films while reciprocating a film-forming source are known. In the technique disclosed in Patent Document 1, a substrate holding member is provided above the chamber for holding the substrate, and a moving member is provided below the chamber for reciprocating the film-forming source. Patent Document 2 discloses a technique for maintaining a cathode unit disposed inside the chamber by pulling it out from the side of the chamber.

[0003] Prior technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-94548

[0006] Patent Document 2: Japanese Patent Application Publication No. 2014-162951

[0007] In the film-forming apparatus disclosed in Patent Document 1, which forms a film while reciprocating a film-forming source, the space between the substrate holding member and the moving member is often narrow. Therefore, maintenance of the film-forming source presents operational difficulties. Patent Document 2 includes a mechanism for moving the film-forming source from the side of the chamber to the outside of the chamber. However, this solution requires a large amount of space and may not be considered sufficient. Summary of the Invention

[0008] The purpose of this invention is to provide a technology that can improve the maintainability of film-forming devices while saving space.

[0009] Solution for solving the problem

[0010] To address the aforementioned issues, the film-forming apparatus of the present invention is characterized in that...

[0011] The film-forming device has the following features:

[0012] Chamber;

[0013] A film-forming source, disposed inside the chamber, is used to form a thin film on a substrate; and

[0014] The moving component causes the film-forming source to move relative to the substrate.

[0015] The top plate of the chamber has an opening and closing portion located vertically above a portion of the movement range of the film-forming source. This opening and closing portion is used to move at least one component constituting the film-forming source from the interior of the chamber to the exterior and from the exterior of the chamber to the interior.

[0016] According to the present invention, by using a moving member to move the film-forming source to a position directly below the opening opened by the opening and closing portion, it is possible to move the film-forming source out of the chamber by simply suspending at least one component constituting the film-forming source. Furthermore, it is possible to move the film-forming source into the chamber by simply suspending at least one component constituting the film-forming source.

[0017] The effects of the invention

[0018] As described above, according to the present invention, it is possible to improve the maintainability of the film-forming source while achieving space saving. Attached Figure Description

[0019] Figure 1 This is a schematic structural diagram showing the internal structure of the film-forming apparatus of an embodiment of the present invention from above.

[0020] Figure 2 This is a schematic structural diagram showing the internal structure of the film-forming apparatus according to an embodiment of the present invention.

[0021] Figure 3 This is a schematic structural diagram showing the internal structure of the film-forming apparatus according to an embodiment of the present invention.

[0022] Figure 4 This is a schematic structural diagram of the film-forming source according to an embodiment of the present invention.

[0023] Figure 5 This is a schematic structural diagram showing the internal structure of the film-forming apparatus according to an embodiment of the present invention.

[0024] Figure 6 This is a schematic structural diagram illustrating the maintenance of the film-forming source in an embodiment of the present invention.

[0025] Figure 7 This is a schematic structural diagram illustrating the maintenance of the film-forming source in an embodiment of the present invention.

[0026] Figure 8 This is a schematic cross-sectional view representing an example of an electronic device.

[0027] Explanation of reference numerals in the attached figures

[0028] 1. Film forming apparatus, 10. Chamber, 10a. Opening and closing part, 10b. Opening part, 11. Substrate holding part, 100. Film forming source, 110. Target, 120. Support block, 130. End block, 140. Drive source, 200. Drive device, 210. Atmosphere chamber, P. Substrate. Detailed Implementation

[0029] Hereinafter, with reference to the accompanying drawings, embodiments will be described in detail by way of example for carrying out the present invention. However, unless otherwise specified, the dimensions, materials, shapes, relative arrangements, etc., of the constituent components described in this embodiment are not intended to limit the scope of the present invention.

[0030] (Example)

[0031] Reference Figures 1 to 7 This section explains the film-forming apparatus and the maintenance method of the film-forming source according to embodiments of the present invention. Furthermore, in this embodiment, a sputtering apparatus will be used as an example of a film-forming apparatus for explanation. Figure 1 This is a schematic structural diagram showing the internal structure of the film-forming apparatus of an embodiment of the present invention from above. Figure 2 Is Figure 1 The cross-sectional view as seen from the direction of arrow V1. Figure 3 Is Figure 1 The cross-sectional view as seen from the direction of arrow V2. Figure 4 These are schematic structural diagrams of the film-forming source according to an embodiment of the present invention. (a) is a schematic structural diagram of a portion of the film-forming source viewed from the front, and (b) is a cross-sectional view AA in (a). Figure 5 This is a schematic structural diagram showing the internal structure of the film-forming apparatus according to an embodiment of the present invention, illustrating the situation during maintenance. Figure 6 and Figure 7 This is a schematic structural diagram illustrating the maintenance of the film-forming source in an embodiment of the present invention.

[0032] [Overall structure of the film-forming device]

[0033] Reference Figures 1-3 The overall structure of the film-forming apparatus of this embodiment will be explained. The film-forming apparatus 1 of this embodiment includes: a chamber 10 with an internal vacuum atmosphere; a film-forming source 100 disposed within the chamber 10; and a drive device 200 having a moving component for moving the film-forming source 100.

[0034] Within the chamber 10, there is a substrate holding member 11 for holding the substrate P and a mask holding member 12 for holding the mask M. These holding members keep the substrate P and the mask M stationary during the film deposition process (sputtering process). Furthermore, regarding the substrate holding member 11 and the mask holding member 12, which are simplified in the accompanying drawings, these holding members are configured to precisely adjust the positional relationship between the substrate P and the mask M.

[0035] Chamber 10 is an airtight container, and its interior is maintained under vacuum (or reduced pressure) by exhaust pump 20. By opening gas supply valve 30 and supplying gas into chamber 10, the gas atmosphere (or pressure zone) can be appropriately changed to a suitable one for processing. Chamber 10 is electrically grounded as a whole through grounding circuit 40.

[0036] The drive unit 200 includes an atmospheric chamber 210, a moving component for moving the atmospheric chamber 210, and an atmospheric arm 240 driven by the movement of the atmospheric chamber 210. The moving component includes a pair of guide rails 221 and 222, a rotating shaft 231 extending through the atmospheric chamber 210, a pair of gears 232 on both sides of the rotating shaft 231, and a drive source 233 such as a motor for rotating the rotating shaft 231. Racks are respectively provided on the pair of guide rails 221 and 222, each meshing with one of the gears 232. Based on this structure, the rotating shaft 231 is rotated by the drive source 233, thereby enabling the atmospheric chamber 210 to reciprocate along the pair of guide rails 221 and 222. Thus, the moving component in this embodiment employs a so-called rack and pinion mechanism. However, the drive mechanism for reciprocating the atmospheric chamber 210 is not limited to a rack and pinion mechanism; various known technologies such as ball screw mechanisms can be used.

[0037] The interior of the atmospheric chamber 210 is hollow and communicates with the exterior of the chamber 10 through the interior of the atmospheric arm 240. Therefore, the interior of the atmospheric chamber 210 is exposed to the atmosphere. With this structure, the wiring 51, which is connected to the power supply 50 located outside the chamber 10, and the cooling pipe 61, which is connected to the coolant supply device 60, which is also located outside the chamber 10, can be connected to the film-forming source 100.

[0038] Thus, the atmospheric arm 240 is provided to house the wiring 51 connected to the power supply 50 located outside the chamber 10 and the cooling pipe 61 connected to the coolant supply device 60 within the cavity of the movable atmospheric box 210. That is, the interior of the atmospheric arm 240 is formed by a cavity, and the atmospheric arm 240 moves in tandem with the movement of the atmospheric box 210. More specifically, the atmospheric arm 240 includes a first arm 241 and a second arm 242. One end of the first arm 241 is rotatably mounted relative to the bottom plate of the chamber 10. Furthermore, one end of the second arm 242 is pivotally supported to rotatably relative to the other end of the first arm 241, and the other end of the second arm 242 is pivotally supported to rotatably relative to the atmospheric box 210.

[0039] The driving device 200 configured as described above enables the film-forming source 100, which is fixed on the atmosphere box 210, to reciprocate together with the atmosphere box 210. Thus, by operating the film-forming source 100 during the movement of at least one of the outgoing and returning paths, a film-forming operation (sputtering) can be performed on the substrate P. Therefore, even when forming a film on a large substrate P, by using the driving device 200 to move the film-forming source 100 while performing the film-forming operation, a thin film can be continuously formed from one end of the substrate P towards the other end.

[0040] [Film-forming device]

[0041] Reference Figure 4 This describes an example of a film-forming source 100 applicable to the film-forming apparatus 1 of this embodiment. The film-forming source 100 includes a target 110 and a pair of support blocks 120 and end blocks 130 serving as support members at both ends of the target 110. In this embodiment, two targets 110 are provided, and one support block 120 and one end block 130 supporting the two ends of the two targets 110 are also provided on each of the two targets 110. However, in the film-forming apparatus of the present invention, the number of targets is not limited. The target 110 is a cylindrical component that rotates during sputtering, also referred to as a rotating cathode. The support blocks 120 and end blocks 130 are fixed to the upper surface of the atmosphere chamber 210. The target 110 includes a cylindrical target body 111 and an electrode, i.e., a cathode 112, disposed on its inner circumference. Furthermore, the target 110 is supported by the support blocks 120 and end blocks 130 and is rotatable, rotating during sputtering by a drive source 140 such as a motor. In addition, in the case of a sputtering apparatus using magnetron sputtering, a magnet is provided inside the cathode 112 in order to generate a magnetic field (leakage magnetic field) between the target 110 and the substrate P.

[0042] In the film-forming source 100 configured as described above, plasma is generated between the target 110 and the chamber 10, which serves as the anode, by applying a voltage of a certain value or higher. Furthermore, particles of the target material are emitted from the target 110 (target body 111) by collisions between cations in the plasma and the target 110. The emitted particles repeatedly collide, and neutral atoms of the target material in the emitted particles accumulate on the substrate P. Thus, a thin film composed of the constituent atoms of the target 110 is formed on the substrate P (film-forming process). In addition, in the case of magnetron sputtering, the aforementioned leakage magnetic field allows the plasma to be concentrated in a predetermined area between the target 110 and the substrate P. Therefore, due to efficient sputtering, the deposition rate of the target material onto the substrate P can be increased. Furthermore, in the film-forming source 100 of this embodiment, the target 110 is configured to rotate during sputtering. Therefore, the consumption area of ​​the target 110 (the etched area caused by erosion) does not concentrate in one area, improving the utilization efficiency of the target 110.

[0043] [Structures related to the maintenance of the film-forming source]

[0044] In this embodiment, an opening / closing portion 10a is provided on the top plate of the chamber 10 at a position away from the placement position of the substrate holding member 11. This opening / closing portion 10a is provided to allow at least one component constituting the film-forming source 100 to be moved out of the chamber 100 and inward from the outside of the chamber 10 during maintenance of the film-forming source 100. Furthermore, the moving member of the drive device 200 is configured to reciprocate between a position facing the substrate P held on the substrate holding member 11 during film formation and a position directly below the opening 10b opened by the opening / closing portion 10a. That is, the movement range of the film-forming source 100 includes at least a position below the substrate P in the vertical direction. The opening / closing portion 10a is located above at least a portion of the movement range of the film-forming source 100 in the vertical direction. Additionally, as... Figure 5 As shown, the substrate holding member 11 and the opening / closing portion 10 are configured such that the projection of the opening / closing portion 10 along the vertical direction does not overlap with the substrate P during film deposition. Furthermore, as... Figure 7 As shown, the atmosphere chamber 210 has a base plate 211, side wall portions 212 arranged around the base plate 211, and a top plate portion 213 detachably disposed relative to the side wall portions 212. Furthermore, at least a portion of the side wall portions 212 is formed by a door portion 212a, which is used to open the interior of the atmosphere chamber 210 during maintenance. A drive source 140 for rotating the target 110 is fixed to the inner wall surface of the top plate portion 213.

[0045] [Maintenance methods for film-forming sources]

[0046] The maintenance method for film-forming source 100 includes: moving the process (refer to...) Figure 5 The film-forming source 100 is moved to a position directly below the opening 10b opened by the opening / closing part 10a via the moving component of the drive device 200; a release step is performed to disconnect at least one component constituting the film-forming source 100 from other components of the film-forming apparatus; and a removal step is performed to lift the at least one component and remove it from the opening 10b to the outside of the chamber 10. Regarding the maintenance of the film-forming source 100, there are cases where only the target 110 is replaced and cases where the entire film-forming source 100 is replaced. The "moving step" is the same for both; the "release step" and "removal step" will be described separately below.

[0047] [Maintenance involving target replacement only]

[0048] If only the target is replaced, firstly, disconnect the target 110 from the support block 120 (refer to...). Figure 6(a)). For example, they are secured by threads; remove the screws. Next, disconnect the target 110 and end block 130 (see...). Figure 6 (b)). For example, they are fixed by fitting together, and their connection is released by pulling the target 110 out of the end block 130. Then, the target 110 is lifted by the lifting member 510 of the crane 500, which is made of wire rope, hooks, etc., and moved out of the chamber 10 from the opening 10b opened by the opening and closing part 10a (see reference). Figure 5 as well as Figure 6 (c)). Then, the new or repaired target 110 is moved from the opening 10b into the interior of the chamber 10 and connected to the end block 130 and the support block 120. Figure 5 The diagram shows a structure in which the crane 500 is suspended from the ceiling (top plate) of the chamber 10, but a structure in which the crane is suspended from the ceiling of a factory where the chamber 10 is located can also be used.

[0049] [Replacement of the entire membrane source system for maintenance]

[0050] With the membrane source 100 replaced as a whole, the connection between the side wall portion 212 and the top plate portion 213 in the atmospheric chamber 210 is released (see reference). Figure 7 (a)). For example, they are secured by threads, and the screws are removed. Next, the door 212a is opened, and the connector 51a of the wiring 51 connecting the film source 100 side and the power supply 50 side is disconnected. In addition, the connection of the piping connection 61a of the cooling pipe 61 connecting the film source 100 side and the coolant supply device 60 side is also released (see reference). Figure 7 (b)). Then, the film-forming source 100 (target 110, support block 120, end block 130, drive source 140) and the top plate 213 of the atmospheric chamber 210 are lifted as a single unit by the lifting member 510 of the crane 500, which is composed of wire ropes, hooks, etc., and moved out from the opening 10b opened through the opening and closing part 10a to the outside of the chamber 10 (see reference). Figure 5 and Figure 7 (c)). In addition, afterward, with the new or repaired film-forming source 100 and the top plate portion 213 integrated, it is moved into the interior of the chamber 10 through the opening portion 10b, and the top plate portion 213 and the side wall portion 212 are connected.

[0051] [Advantages of the maintenance method for the film-forming apparatus and film-forming source in this embodiment]

[0052] According to the maintenance method of the film-forming apparatus 1 and the film-forming source 100 of this embodiment, by using a moving member to move the film-forming source 100 to a position directly below the opening 10b opened by the opening / closing portion 10a of the chamber 10, it is possible to move it out of the chamber 10 from the opening 10b simply by lifting at least one component constituting the film-forming source 100. Therefore, even if the space between the substrate holding member 11 located at the top of the chamber 10 and the moving member located at the bottom of the chamber 10 is narrow, the work in this narrow space can be reduced, and maintainability can be improved. In addition, since it is not necessary to move the film-forming source 100 from the side of the chamber 10 to the outside of the chamber 10, space can be saved.

[0053] [Electronic Device Manufacturing Apparatus (Manufacturing Method)]

[0054] The film-forming apparatus 1 shown in the above embodiment can be used as a manufacturing apparatus for manufacturing electronic devices. Hereinafter, reference will be made to... Figure 8 An apparatus for manufacturing electronic devices and an electronic device manufactured by the apparatus will be described. The film deposition apparatus 1 can be used to deposit and form thin films (organic films, metal films, metal oxide films, etc.) on a substrate P (including structures with laminates formed on the surface of the substrate P) during the manufacturing of various electronic devices, optical components, etc., such as semiconductor devices, magnetic devices, and electronic components. More specifically, the film deposition apparatus 1 is preferably used in the manufacturing of electronic devices such as light-emitting elements, photoelectric conversion elements, and touch panels. In this embodiment, the film deposition apparatus 1 is particularly preferably suitable for the manufacturing of organic light-emitting elements such as organic EL (ElectroLuminescence) elements and organic photoelectric conversion elements such as organic thin-film solar cells. Furthermore, electronic devices also include display devices (e.g., organic EL display devices) equipped with light-emitting elements, lighting devices (e.g., organic EL lighting devices), and sensors equipped with photoelectric conversion elements (e.g., organic CMOS image sensors).

[0055] Figure 8 This illustrates an example of an organic EL element manufactured by an electronic device manufacturing apparatus. The illustrated organic EL element has, sequentially, films formed on a substrate P, including an anode F1, a hole injection layer F2, a hole transport layer F3, an organic light-emitting layer F4, an electron transport layer F5, an electron injection layer F6, and a cathode F7. The film-forming apparatus 1 of this embodiment is particularly suitable for use when forming laminated films such as electron injection layers, metal films used for electrodes (cathode, anode), and metal oxides on organic films by sputtering. Furthermore, film formation is not limited to organic films; any combination of materials capable of being sputtered, such as metal materials and oxide materials, can be laminated on multiple surfaces.

[0056] (other)

[0057] In the above embodiments, the film-forming apparatus 1 is shown to be a sputtering apparatus and the film-forming source 100 is equipped with a target 110, etc. However, in the present invention, for example, it can also be applied to the case where the film-forming apparatus is a vacuum evaporation apparatus and the film-forming source is an evaporation source.

Claims

1. A film-forming apparatus, characterized in that, The film-forming device has the following features: Chamber; A film-forming source, disposed inside the chamber, is used to form a thin film on a substrate; and The moving component causes the film-forming source to move relative to the substrate. The top plate of the chamber has an opening and closing portion located vertically above a portion of the movement range of the film-forming source. This opening and closing portion is used to move at least one component constituting the film-forming source from the interior to the exterior of the chamber and from the exterior to the interior of the chamber. The film-forming source has the following characteristics: The cylindrical target is configured to emit particles for forming a thin film on a substrate by sputtering, and rotates during sputtering; A pair of support members are fixed to the upper surface of an atmospheric chamber configured to move via the movable component, supporting both ends of the target; as well as The driving source causes the target to rotate. The air chamber has: a base plate; side walls configured to surround the base plate; and a top plate configured to be detachable relative to the side walls. The target, the pair of support members, the drive source fixed to the top plate, and the top plate are moved out of the opening and closing part to the outside of the chamber and into the inside of the chamber in an integrated state.

2. The film-forming apparatus according to claim 1, characterized in that, The film-forming apparatus also includes a substrate holding member disposed inside the chamber and holding the substrate. The moving component causes the film-forming source to reciprocate between a position in the vertical direction facing the substrate of the substrate holding component and a position in the vertical direction below the opening and closing portion during the film-forming action.

3. The film-forming apparatus according to claim 2, characterized in that, The projection of the opening / closing portion into the vertical direction does not overlap with the substrate held by the substrate holding member during film formation.

4. The film-forming apparatus according to any one of claims 1 to 3, characterized in that, The at least one component is moved out and in by a crane.

5. A method for manufacturing an electronic device, characterized in that, The method for manufacturing the electronic device includes a film-forming step of forming a film on the substrate using the film-forming apparatus according to any one of claims 1 to 4.

6. A method for maintaining a film-forming source, which is a method for maintaining a film-forming apparatus, said film-forming apparatus comprising: The chamber has an opening and closing mechanism on its top plate; A film-forming source, disposed inside the chamber, is used to form a thin film on a substrate; and The moving component causes the film-forming source to move relative to the substrate. Its features are, The maintenance method of this film-forming source has the following characteristics: In the moving process, the film-forming source is moved to a position below the vertical direction of the opening and closing part by means of the moving component; The disconnection process involves detaching at least one component constituting the film-forming source from other components of the film-forming apparatus; and The removal process involves moving at least one component from the opening / closing part to the outside of the chamber. The film-forming source has the following characteristics: A cylindrical target, configured to emit particles for forming a thin film on a substrate via sputtering, and rotating during sputtering; and A pair of support members, fixed to the upper surface of an atmospheric chamber configured to move via the movable component, support both ends of the target. and, The atmospheric chamber has: a base plate; side walls configured to surround the base plate; and a top plate configured to be detachable from the side walls. A drive source for rotating the target is fixed to the top plate. In the release process, the connection between the top plate portion and the side wall portion is released. In the removal process, the target, the pair of support members, the drive source, and the top plate are moved out of the chamber as a single unit.

7. A method for manufacturing an electronic device, characterized in that, The manufacturing method of this electronic device has the following characteristics: The process of maintaining the film-forming apparatus using the maintenance method described in claim 6; and The film-forming device, after maintenance, is used to perform the film-forming process on the substrate.

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