Photoresist composition, optical film, and method for manufacturing optical film

Abstract

The present disclosure provides a photoresist composition, including an alkali-soluble resin, a photopolymerizable compound, a photoinitiator, a thermal initiator, a black colorant, and a solvent, wherein the photopolymerizable compound accounts for 15-85 mass percent of the composition, and includes at least one ethylenically unsaturated monomer and at least one epoxy compound. The present disclosure also provides an optical film and a method for manufacturing an optical film.

Description

TECHNICAL FIELD

[0001] The present application relates to a photoresist composition, and more particularly to a photoresist composition for low-temperature processing, and an optical film and a method for manufacturing the same. BACKGROUND

[0002] A patterned light-shielding film such as a black matrix or a black column spacer is generally formed in a display device. A photosensitive composition for forming the light-shielding film contains a binder, a colorant, and a photopolymerizable compound, and the like. In recent years, display devices have been developed to be flexible, and are manufactured using a flexible substrate instead of a glass substrate. Most flexible substrates contain an organic material such as a plastic film. Since the heat resistance of a plastic substrate is lower than that of a glass substrate, the heat hardening temperature of the photosensitive composition needs to be reduced. However, the light-shielding film needs to have desired resistance and mechanical properties. In addition, a catalyst is generally used at a lower heat hardening temperature. However, the catalyst often has poor solubility and generates foreign matter, and has poor compatibility with the photosensitive composition. SUMMARY

[0003] One object of some embodiments of the present application is to provide a photoresist composition for low-temperature processing.

[0004] Another object of some embodiments of the present application is to provide an optical film prepared by low-temperature processing, which has a desired light transmittance and has good resistance and mechanical properties.

[0005] In some embodiments of the present application, the photoresist composition includes (A) an alkali-soluble resin; (B) a photopolymerizable compound; (C) a photo initiator; (D) a thermal initiator; (E) a black colorant; and (F) a solvent; wherein the (B) photopolymerizable compound accounts for 15 to 85 mass% of the composition, and contains at least one ethylenically unsaturated monomer and at least one epoxy compound.

[0006] In one embodiment of the present application, the (A) alkali-soluble resin described above is an acrylic resin, and has a molecular weight of 2,000 to 50,000.

[0007] In one embodiment of the present application, the (A) alkali-soluble resin described above is composed of monomer structures represented by the following Formula i, Formula ii, Formula iii, Formula iv, and Formula v,

[0008]

[0009] In one embodiment of the present application, the at least one ethylenically unsaturated monomer described above has a structure represented by Formula (I), and the at least one epoxy compound has a structure represented by Formula (II), wherein R1and R2of Formula (I) are each independently an alkyl group or an alkoxy group having 1 to 12 carbon atoms, and n = 3 to 12; R' and R" of Formula (II) are the same or different from each other, and each is independently hydrogen, a hydroxyl group, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or -(R a ) n -R b , at least one of R' and R" described above is -(R a ) n -R b ; at this time, R a is hydrogen, an alkylene group having 1 to 10 carbon atoms, -R5-O-R6-, or -R7-C(=O)O-R8-, at this time, R5to R8are the same or different from each other, and each is independently an alkylene group having 1 to 10 carbon atoms; R b is hydrogen, a mercapto group, an isocyanate group, a carboxyl group, a hydroxyl group, an amine group, a urea group, a carbamate group, a (meth)acrylate group, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a cycloalkyl group having 3 to 15 carbon atoms, a heterocycloalkyl group having 3 to 15 carbon atoms, an aryl group having 6 to 20 carbon atoms, or a heteroaryl group having 5 to 20 carbon atoms; x is an integer of 1 to 500; y is an integer of 1 to 500; n is an integer of 0 or 1,

[0010]

[0011] (R'SiO1.5)x(R"SiO1.5)y

[0012] (II).

[0013] In one embodiment of the present application, the (B) photopolymerizable compound described above includes dipentaerythritol hexaacrylate (DPHA) and an organic-inorganic hybrid resin.

[0014] In one embodiment of the present application, the organic-inorganic hybrid resin described above is a hybrid resin formed by mixing nano-silica into a resin.

[0015] In one embodiment of the present application, the (B) photopolymerizable compound described above further includes a multifunctional urethane acrylate.

[0016] In one embodiment of the present application, the weight ratio of the at least one ethylenically unsaturated monomer and the at least one epoxy compound described above ranges from 1:5 to 5:1.

[0017] In one embodiment of the present application, the (C) photoinitiator described above is an oxime ester photoinitiator, and the (D) thermal initiator is an ionic thermal acid initiator.

[0018] In one embodiment of the present application, the (E) black colorant described above comprises an organic black pigment.

[0019] In one embodiment of the present application, the (F) solvent described above comprises a compound having a structure shown in Formula (III), wherein R3and R4may be ether, alcohol, or acetate linking groups.

[0020]

[0021] In one embodiment of the present application, the (F) solvent described above is propylene glycol monomethyl ether acetate (PGMEA).

[0022] In one embodiment of the present application, the photoresist composition described above can further comprise an additive, and the additive can comprise a fluorine-based surfactant.

[0023] In one embodiment of the present application, the photoresist composition described above can further comprise an additive, and the additive can comprise a fluorine-based surfactant.

[0024] In one embodiment of the present application, the optical film described above further has an optical density of not less than 3 and a thickness of 2 ± 0.1 μm.

[0025] In one embodiment of the present application, the photoresist composition described above can further comprise an additive, and the additive can comprise a fluorine-based surfactant.

[0026] In one embodiment of the present application, the step of patterning the film layer described above further comprises exposing and developing the film layer.

[0027] In one embodiment of the present application, the step of patterning the film layer described above further comprises exposing and developing the film layer.

[0028] In one embodiment of the present application, the step of patterning the film layer described above further comprises exposing and developing the film layer.

[0029] In one embodiment of the present application, the second temperature heating temperature and the first temperature heating temperature are not more than 120°C.

[0030] The present application can form an optical film having chemical resistance and mechanical properties by photo-hardening and thermal hardening at a temperature of not more than 150°C without adding a catalyst, because the (B) photopolymerizable compound comprises at least one ethylenically unsaturated monomer and at least one epoxy compound.

[0031] The above description is only a summary of the technical solutions of the present application. In order to make the technical solutions of the present application more clearly understood and implemented, and to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail. DETAILED DESCRIPTION

[0032] Unless otherwise defined, the low temperature referred to in the present disclosure is less than or equal to 170°C, and preferably 90-150°C; the high temperature is greater than 170°C, and preferably 200-240°C.

[0033] The present application provides a photoresist composition which can be used in low-temperature processing. The photoresist composition of the present application comprises (A) an alkali-soluble resin, (B) a photopolymerizable compound, (C) a photoinitiator, (D) a thermal initiator, (E) a black colorant, and (F) a solvent. The (A) alkali-soluble resin can be an acrylic resin composed of acrylic acid, acrylic acid derivatives as polymerization monomers, and preferably has a molecular weight of 2,000-50,000. The (B) photopolymerizable compound accounts for 15-85% of the mass percentage of the photoresist composition, and comprises at least one ethylenically unsaturated monomer and at least one epoxy compound, wherein the at least one epoxy compound can react with the (D) thermal initiator.

[0034] (A) Alkali-soluble resin

[0035] The (A) alkali-soluble resin in several embodiments of the present application is not particularly limited, but can be, for example, benzyl (meth)acrylate, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, cyclohexyl (meth)acrylate, isobonyl (meth)acrylate, ethylhexyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxy-3-chloropropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, glycerol (meth)acrylate, 2-methoxybutyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, 4-methoxybutyl (meth)acrylate, 5-methoxy-2-pentyl (meth)acrylate, 6-methoxy-2-hexyl (meth)acrylate, 7-methoxy-2-heptyl (meth)acrylate, 8-methoxy-2-octyl (meth)acrylate, 9-methoxy-2-nonyl (meth)acrylate, 10-methoxy-2-decyl (meth)acrylate, 11-methoxy-2-undecyl (meth)acrylate, 12-methoxy-2-dodecyl (meth)acrylate, 13-methoxy-2-tridecyl (meth)acrylate, 14-methoxy-2-tetradecyl (meth)acrylate, 15-methoxy-2-pentadecyl (meth)acrylate, 16-methoxy-2-hexadecyl (meth)acrylate, 17-methoxy-2-heptadecyl (meth)acrylate, 18-methoxy-2-octadecyl (meth)acrylate, 19-methoxy-2-nonadecyl (meth)acrylate, 20-methoxy-2-icosyl (meth)acrylate, 21-methoxy-2-heneicosyl (meth)acrylate, 22-methoxy-2-docosyl (meth)acrylate, 23-methoxy-2-tricosyl (meth)acrylate, 24-methoxy-2-tetracosyl (meth)acrylate, 25-methoxy-2-pentacosyl (meth)acrylate, 26-methoxy-2-hexacosyl (meth)acrylate, 27-methoxy-2-heptacosyl (meth)acrylate, 28-methoxy-2-octacosyl (meth)acrylate, 29-methoxy-2-nonacosyl (meth)acrylate, 30-methoxy-2-(3-methoxybutyl(meth)acrylate), ethoxydiethyleneglycol(meth)acrylate, methoxytriethyleneglycol(meth)acrylate, methoxytripropyleneglycol(meth)acrylate, poly(ethyleneglycol)methylether(meth)acrylate, phenoxydiethyleneglycol(meth)acrylate, p-nonylphenoxypolyethyleneglycol(meth)acrylate, p-nonylphenoxypolypropyleneglycol(meth)acrylate, glycidyl(meth)acrylate, dicyclopentanyl(meth)acrylate, dicyclopentenyl(meth)acrylate, dicyclopentenyloxyethyl(meth)acrylate, isobonyl(meth)acrylate, adamentyl(meth)acrylate, stearyl(meth)acrylate, hexyl(meth)acrylate, heptyl(meth)acrylate, octyl(meth)acrylate, nonyl(meth)acrylate, decyl(meth)acrylate, lauryl(meth)acrylate, methyl α-hydroxymethyl(meth)acrylate, methyl α-hydroxyethyl(meth)acrylate, methyl α-hydroxypropyl(meth)acrylate, methyl α-hydroxybutyl(meth)acrylate, methyl α-hydroxypentyl(meth)acrylate, methyl α-hydroxyhexyl(meth)acrylate, methyl α-hydroxyheptyl(meth)acrylate, methyl α-hydroxyoctyl(meth)acrylate, methyl α-hydroxynonyl(meth)acrylate, methyl α-hydroxydecyl(meth)acrylate, methyl α-hydroxylauryl(meth)acrylate, methyl α-hydroxystearyl(meth)acrylate, methyl α-hydroxyadamentyl(meth)acrylate, methyl α-hydroxydicyclopentanyl(meth)acrylate, methyl α-hydroxydicyclopentenyl(meth)acrylate, methyl α-hydroxydicyclopentenyloxyethyl(meth)acrylate, methyl α-hydroxyisobonyl(meth)acrylate, methyl α-hydroxyadamentyl(meth)acrylate, methyl α-hydroxyoctadecyl(meth)acrylate, methyl α-hydroxyeicosyl(meth)acrylate, methyl α-hydroxydocosyl(meth)acrylate, methyl α-hydroxytricosyl(meth)acrylate, methyl α-hydroxytetracosyl(meth)acrylate, methyl α-hydroxypentacosyl(meth)acrylate, methyl α-hydroxyhexacosyl(meth)acrylate, methyl α-hydroxyheptacosyl(meth)acrylate, methyl α-hydroxyoctacosyl(meth)acrylate, methyl α-hydroxynonacosyl(meth)acrylate, methyl α-hydroxytriacontyl(meth)acrylate, methyl α-hydroxyphenyl(meth)acrylate, methyl α-hydroxynaphthyl(meth)acrylate, methyl α-hydroxybenzyl(meth)acrylate, methyl α-hydroxyphenethyl(meth)acrylate, methyl α-hydroxyphenylpropyl(meth)acrylate, methyl α-hydroxyphenylbutyl(meth)acrylate, methyl α-hydroxyphenylpentyl(meth)acrylate, methyl α-hydroxyphenylhexyl(meth)acrylate, methyl α-hydroxyphenylheptyl(meth)acrylate, methyl α-hydroxyphenyloctyl(meth)acrylate, methyl α-hydroxyphenylnonyl(meth)acrylate, methyl α-hydroxyphenyldecyl(meth)acrylate, methyl α-hydroxyphenyllauryl(meth)acrylate, methyl α-hydroxyphenylstearyl(meth)acrylate, methyl α-hydroxyphenyladamentyl(meth)acrylate, methyl α-hydroxyphenyldicyclopentanyl(meth)acrylate, methyl α-hydroxyphenyldicyclopentenyl(meth)acrylate, methyl α-hydroxyphenyldicyclopentenyloxyethyl(meth)acrylate, methyl α-hydroxyphenylisobonyl(meth)acrylate, methyl α-hydroxyphenyladamentyl(meth)acrylate, methyl α-hydroxyphenyloctadecyl(meth)acrylate, methyl α-hydroxyphenyleicosyl(meth)acrylate, methyl α-hydroxyphenylethyl α-hydroxymethyl acrylate, propyl α-hydroxymethyl acrylate, butyl α-hydroxymethyl acrylate, and the like. In one embodiment of the present application, the (A) alkali-soluble resin can be composed of monomer structures represented by the following Formula i, Formula ii, Formula iii, Formula iv, and Formula v,

[0036]

[0037] (B) photopolymerizable compound

[0038] The (B) photopolymerizable compound in several embodiments of the present application is not particularly limited, but preferably can include at least one ethylenically unsaturated monomer and at least one epoxy compound. In several embodiments of the present application, the weight ratio of the at least one ethylenically unsaturated monomer and the at least one epoxy compound can range from 1:5 to 5:1, in other embodiments of the present application, it can also range from 1:2 to 2:1, and in further embodiments of the present application, it can also be 1:1.

[0039] The epoxy compound is not particularly limited, and can be, for example, a bisphenol type epoxy resin, a novolac type epoxy resin, a glycidyl ester type epoxy resin, a glycidyl amine type epoxy resin, a linear aliphatic epoxy resin, an alicyclic epoxy resin, a biphenyl type epoxy resin, and the like. In one embodiment of the present application, the epoxy compound can be a siloxane compound, a compound having the structure represented by the following Formula (II), wherein R', R" are the same as or different from each other, and each independently is hydrogen, a hydroxyl group, a C1-C10 alkyl group, a C1-C10 alkoxy group, or -(R a ) n -R b , at least one of the above R' and R" is -(R a ) n -R b ; at this time, R aIt is hydrogen, a C1-C10 alkylene group, -R5-O-R6- or -R7-C(=O)O-R8-, where R5 to R8 may be the same or different from each other, and each is independently a C1-C10 alkylene group; R b The radicals are hydrogen, mercapto, isocyanate, carboxyl, hydroxyl, amino, urea, carbamate, (meth)acrylate, C1-C10 alkyl, C1-C10 alkoxy, C3-C15 cycloalkyl, C3-C15 heterocycloalkyl, C6-C20 aryl, or C5-C20 heteroaryl; x is an integer from 1 to 500; y is an integer from 1 to 500; n is an integer of 0 or 1. Further, (B) the photopolymerizable compound may comprise an organic-inorganic hybrid resin having an epoxy compound, preferably a hybrid resin formed by incorporating nano-silica into the resin.

[0040] (R'SiO1.5)x(R"SiO1.5)y

[0041] (II).

[0042] The ethylenically unsaturated monomer in the (B) photopolymerizable compound in several embodiments of the present application is not particularly limited and can be, for example, polyethyleneglycol mono(meth)acrylate, polypropyleneglycol mono(meth)acrylate, phenoxyethyl(meth)acrylate, polyethyleneglycol(meth)acrylate, polypropyleneglycol(meth)acrylate, trimethylolethane triacrylate, trimethylolpropane triacrylate, neopentylglycol(meth)acrylate, pentaerythritol tetraacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, or the like. In one embodiment of the present application, the ethylenically unsaturated monomer has a structure represented by Formula (I), wherein R1, R2are alkyl or alkoxy groups having a carbon number of 1 to 12, and n = 3 to 12.

[0043]

[0044] (C) photoinitiator

[0045] The (C) photoinitiator in some embodiments of the present application is not particularly limited and can be, for example, an acetophenone-based compound, a biimidazole-based compound, a triazine-based compound, an oxime-based compound, or the like. In some embodiments of the present application, the (C) photoinitiator can preferably be an oxime-based compound, such as 1,2-octadione-1-(4-phenylthio)phenyl-2-(o-benzoyloxime), ethanone-1-(9-ethyl)-6-(2-methylbenzoyl-3-yl)-1-(o-acetyloxime), N-1919 (Adeka), OXE-01, OXE-02, OXE-3.

[0046] (D) thermal initiator

[0047] The (D) thermal initiator in some embodiments of the present application is not particularly limited and any suitable thermal initiator can be used, such as an ionic thermal acid initiator or a thermal radical initiator. The thermal initiator can include, but is not limited to, a thermal-activated curing agent for epoxy groups, which can release a strong acid at high temperatures to catalyze the crosslinking reaction of epoxy groups. The thermal acid initiator can be, for example, any onium salt having a complex anion of BF4-, PF6-, SbF6-, CF3SO3-, and (C6F5)4B-, such as a sulfonium salt and an iodonium salt. The thermal acid initiator can be selected from, for example, K-PURE, CXC-1612, CXC-1614, TAG-2172, TAG-2179, TAG-2678, TAG 2689 (King Industries), and SI-45, SI-60, SI-80, SI-100, SI-110, SI-150 (San-Ei Chemical Industries, Inc.).

[0048] (E) black colorant

[0049] The (E) black colorant in the photoresist composition of the present application is not particularly limited and can include carbon black, a black pigment, or a combination thereof, and can further include a color pigment. The black pigment is an organic black pigment such as a lactam black, an aniline black, and a perylene-based black pigment. In one embodiment of the present application, the black pigment is a perylene-based black pigment. The (E) black colorant preferably imparts high light blocking, low electrical conductivity, and good transmittance in the near-infrared region to the photoresist composition and the optical film formed therefrom.

[0050] (F) solvent

[0051] The (F) solvent in the photoresist composition of the present application is not particularly limited and can be one or a mixture of two or more. In one embodiment of the present application, the (F) solvent includes a compound having a structure represented by formula (III), wherein R3and R4may be an ether, an alcohol, or an acetate linking group,

[0052]

[0053] The photoresist composition of the present application can further include one or more additives such as a surfactant, a dispersant, an antioxidant, a UV absorber, a thermal polymerization inhibitor, a leveling agent, and the like. In one embodiment of the present application, the surfactant used is a fluorine-based surfactant.

[0054] The components and amounts of the photoresist composition of the present application are illustrated in Table 1 below, wherein the ratio of the ethylenically unsaturated monomer to the epoxy compound can be between 5:1 and 1:5, and the (C) photoinitiator can be selected from the OXE series.

[0055] Table 1: Photoresist composition of Examples 1-5

[0056]

[0057] Photoresist compositions of Comparative Examples 1-5 were also prepared. The main differences between Comparative Examples 1-5 and the present application are in the composition of the (B) photopolymerizable compound (Comparative Examples 1-2, 4-5) and the colorant composition (Comparative Examples 2-5), as shown in Table 2 below.

[0058] Table 2: Photoresist composition of Comparative Examples 1-5

[0059]

[0060]

[0061] Several embodiments of the present application also provide an optical film made from the aforementioned photoresist composition, and a method of manufacturing an optical film, comprising the steps of: applying the aforementioned photoresist composition to a substrate; heating the photoresist composition at a first temperature and forming a film layer; patterning the film layer; and heating the film layer at a second temperature and forming an optical film, wherein the patterning comprises exposing and developing the film layer. The first temperature is not greater than 170°C, preferably not greater than 150°C, more preferably not greater than 120°C, or even lower, such as not greater than 90°C. The second temperature is not greater than 170°C, more preferably not greater than 150°C. In one embodiment of the present application, the step of heating the film layer at a second temperature comprises heating the film layer at a temperature less than 150°C and greater than 90°C, such as heating the film layer at 120°C for 30 minutes. After completion, an optical film having a thickness of 2 ± 0.1 μm is formed. Embodiment 6 below exemplifies the method of manufacturing an optical film of the present application.

[0062] Embodiment 6: Method of manufacturing an optical film

[0063] The photoresist compositions of embodiments 1-5 were spin-coated onto a substrate, and the substrate was then placed on a hot plate maintained at 90°C for 2 minutes to form a film layer on the substrate. The substrate can be a glass or plastic substrate. Subsequently, the film layer was exposed. A photomask was placed on the film layer, and the film layer and photomask were irradiated with ultraviolet light. The photomask used in this embodiment had a line / space pattern with a specification of 1-50 μm and a transmittance that gradually changed in the range of 1% to 100%, and the ultraviolet light irradiation was performed at an interval of 200 μm under the conditions of 1 kW high-pressure mercury lamp at 200 mJ / cm2, without any special optical filter, and the mercury lamp contained all g, h, and i rays.

[0064] An aqueous KOH solution (0.045%) was used as a developing solution in this embodiment, and the exposed film layer was immersed in the developing solution for 60 seconds. After development, the film layer was washed with distilled water and dried with nitrogen, and then heated in an oven set at 120°C for 30 minutes to obtain an optical film of the present application. The compositions of comparative examples 1-5 were also used to form optical films in the same manner.

[0065] The optical films formed from the compositions of embodiments 1-5 and comparative examples 1-5 were further evaluated. The evaluation included optical film thickness, transmittance, optical density, chemical resistance, and mechanical properties. Embodiment 7 below exemplifies the evaluation method and presents the evaluation results for each optical film.

[0066] Embodiment 7: Evaluation method and evaluation results

[0067] Optical film thickness: The obtained optical film was measured by a contact film thickness meter, Alpha step (manufactured by Veeco), to confirm that it had a thickness of 2 ± 0.1 μm.

[0068] Transmittance: The transmittance of wavelengths from 200 to 1,100 nm was confirmed using a visible spectrophotometer (U-2900HITACHI). If the transmittance of visible light of 380 to 700 nm was ≦ 2% and the transmittance of infrared light of 850 nm and 940 nm was ≧ 80%, the result was evaluated as O. If the transmittance of visible light of 380 to 700 nm was > 2% or the transmittance of infrared light of 850 nm and 940 nm was < 80%, the result was evaluated as X.

[0069] Optical density: The OD value (Optical Density) was measured using an optical density meter. If the OD was ≧ 3.0, the result was evaluated as O. If the OD was < 3.0, the result was evaluated as X.

[0070] Resistance to alcohol: The resistance to alcohol was evaluated by wiping the film with alcohol. If there was no residual color after 50 back-and-forth wipes, the result was evaluated as O. If there was slight residual color after 50 back-and-forth wipes, the result was evaluated as Δ. If there was severe residual color after 50 back-and-forth wipes, the result was evaluated as X.

[0071] Mechanical properties: The mechanical properties were evaluated using a semi-automatic pencil hardness. The results of the evaluation of the optical films made from the photoresist compositions are shown in Table 3.

[0072] Table 3

[0073]

[0074] As can be seen from Tables 1 to 3, the photoresist compositions of the embodiments of the present application, which were made without a catalyst at a temperature of not more than 150°C, produced optical films having a thickness of 2 ± 0.1 μm and passed the tests for transmittance, optical density, resistance to alcohol, and mechanical properties. In the embodiments of the present application, the epoxy compound reacted with the (D) thermal initiator, thereby imparting sufficient resistance to alcohol and mechanical properties to the optical films of the embodiments of the present application. In contrast, the comparative examples, even if the amount of the photopolymerizable compound of the ethylenically unsaturated monomer was increased, could not achieve the effects of the embodiments of the present application under the same production conditions. In the embodiments of the present application, the organic black pigment imparted an optical density of OD > 3.0 to the optical films and a transmittance of < 2% for visible light of wavelengths of 380 to 700 nm and a transmittance of ≧ 80% for infrared light of wavelengths of 850 nm and 940 nm. Based on this, the present application is suitable for various substrates and can be used as a photoresist element for conventional glass substrates and organic flexible film substrates.

[0075] The above merely describes preferred embodiments of the present application, and is not intended to limit the present application in any form. Although the present application has been disclosed with the preferred embodiments as above, it is not intended to limit the present application. Any person skilled in the art can make some changes or modifications to the above disclosed methods and technical contents to make equivalent embodiments with equivalent changes, without departing from the technical solution of the present application. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application, without departing from the technical solution of the present application, still belongs to the scope of the technical solution of the present application.

Claims

1. A photoresist composition, characterized in that, include: (A) Alkali-soluble resin; (B) Photopolymerizable compounds; (C) Photoinitiator; (D) Thermal initiator; (E) a black colorant; wherein (E) the black colorant comprises an organic black pigment; and (F) Solvent; The photopolymerizable compound (B) comprises at least one vinyl unsaturated monomer and at least one epoxy compound, wherein the weight ratio of the at least one vinyl unsaturated monomer and the at least one epoxy compound ranges from 1:5 to 5:1, and the at least one epoxy compound has the structure shown in formula (II), wherein R' and R" in formula (II) are the same or different from each other, and are each independently hydrogen, hydroxyl, C1-C10 alkyl, C1-C10 alkoxy or -(R a ) n -R b At least one of R' and R" above is -(R a ) n -R b At this time, R a It is hydrogen, a C1-C10 alkylene group, -R5-O-R6- or -R7-C(=O)O-R8-, where R5 to R8 may be the same or different from each other, and each is independently a C1-C10 alkylene group; R b The radical group can be hydrogen, mercapto, isocyanate, carboxyl, hydroxyl, amino, urea, carbamate, (meth)acrylate, C1-C10 alkyl, C1-C10 alkoxy, C3-C15 cycloalkyl, C3-C15 heterocycloalkyl, C6-C20 aryl, or C5-C20 heteroaryl; x is an integer from 1 to 500; y is an integer from 1 to 500; n is an integer of 0 or 1. (R'SiO1.5)x(R"SiO1.5)y (II).

2. The photoresist composition as described in claim 1, characterized in that, The alkali-soluble resin (A) is an acrylic resin with a molecular weight of 2,000 to 50,000.

3. The photoresist composition as described in claim 2, characterized in that, The (A) alkali-soluble resin is composed of monomer structures shown in formulas i, ii, iii, iv and v.

4. The photoresist composition as described in claim 1, characterized in that, The at least one ethylene unsaturated monomer has the structure shown in formula (I), wherein R1 and R2 in formula (I) are alkyl or alkoxy groups having 1 to 12 carbon atoms, and n = 3 to 12.

5. The photoresist composition as described in claim 1, characterized in that, The photopolymerizable compound (B) comprises dipentaerythritol hexaacrylate and an organic-inorganic hybrid resin.

6. The photoresist composition as described in claim 5, characterized in that, The organic-inorganic hybrid resin is a hybrid resin formed by incorporating nano-silica into a resin.

7. The photoresist composition as described in claim 1, characterized in that, The photopolymerizable compound (B) comprises a multifunctional polyurethane acrylate.

8. The photoresist composition as described in claim 1, characterized in that, The photoinitiator (C) is an oxime ester-based photoinitiator, and the thermal initiator (D) is an ionic thermal acid initiator.

9. The photoresist composition as described in claim 1, characterized in that, The solvent (F) comprises a compound having the structure shown in formula (III), wherein R3 and R4 can be ether, alcohol, or acetate linking groups.

10. The photoresist composition as described in claim 9, characterized in that, The solvent (F) is propylene glycol monomethyl ether acetate.

11. The photoresist composition as claimed in claim 1, characterized in that, The photoresist composition also includes additives, and the additives contain at least a fluorinated surfactant.

12. An optical film, characterized in that, Made from the photoresist composition according to any one of claims 1 to 11, and having a transmittance of less than or equal to 2% for light with wavelengths of 380 to 700 nm, and a transmittance of greater than or equal to 80% for light with wavelengths of 850 nm and 940 nm.

13. The optical film as claimed in claim 12, characterized in that, The optical film has an optical density of not less than 3 and a thickness of 2 ± 0.1 μm.

14. A method for manufacturing an optical film, characterized in that, include: The photoresist composition as described in any one of claims 1 to 11 is coated on a substrate; The photoresist composition is heated at a first temperature to form a film layer; Pattern the film layer; as well as The film layer is heated at a second temperature to form the optical film, wherein the optical film has a transmittance of less than or equal to 2% for light with wavelengths of 380 to 700 nm, and a transmittance of greater than or equal to 80% for light with wavelengths of 850 nm and 940 nm.

15. The manufacturing method as described in claim 14, characterized in that, The step of patterning the film layer includes exposing and developing the film layer.

16. The manufacturing method as described in claim 14, characterized in that, The step of heating at the second temperature includes heating the film layer at a temperature greater than 90°C and less than 150°C.

17. The manufacturing method as described in claim 16, characterized in that, The step of heating at the second temperature includes heating the film layer at a temperature of 120°C for 30 minutes to form the optical film having a thickness of 2 ± 0.1 μm.

18. The manufacturing method as described in claim 14, characterized in that, The heating temperature at the second temperature and the heating temperature at the first temperature are not greater than 120°C.

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