Wafer transfer robot, wafer manufacturing apparatus, and wafer transfer method

Abstract

The application discloses a wafer conveying mechanical arm, a wafer manufacturing device and a wafer conveying method, and belongs to the technical field of semiconductor processes, and solves the problem that various pollutants in the atmosphere environment during the conveying process of a wafer on a wafer conveying mechanical arm can cause pollution to the wafer and lead to the generation of defects in the wafer in the subsequent manufacturing process. The wafer conveying mechanical arm comprises a blade base body and a gas supply unit for providing protective gas, a through hole connected with the gas supply unit is formed in the blade base body, and the protective gas is sprayed to the upper surface of the blade base body through the through hole. The wafer conveying method comprises the following steps: spraying the protective gas to the upper surface of the blade base body of the wafer conveying mechanical arm; conveying the wafer from an equipment front end module to the blade base body, and the protective gas always protects the wafer; and conveying the wafer to a transmission module by the blade base body. The wafer conveying mechanical arm, the wafer manufacturing device and the wafer conveying method can be used for wafer manufacturing.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor process technology, specifically relating to a wafer transfer robotic arm, wafer manufacturing equipment, and wafer transfer method. Background Technology

[0002] In semiconductor manufacturing processes, wafer fabrication equipment typically comprises a LoadPort Module (LPM), an Equipment Front End Module Interlock (EFEM), a Transfer Module (TM), and a Process Module (PM), connected in sequence. The transfer of wafers between the EFEM and the Transfer Module requires a wafer transfer robotic arm.

[0003] In the existing technology, during the transfer of wafers on the wafer transfer robot arm, the wafers are always in an atmospheric environment. Various pollutants in the atmospheric environment will contaminate the wafers. At the same time, oxygen in the atmospheric environment will also oxidize the wafers, resulting in defects in the wafers during subsequent manufacturing processes. Summary of the Invention

[0004] Based on the above analysis, the present invention aims to provide a wafer transfer robotic arm, wafer manufacturing equipment, and wafer transfer method, which solves the problem in the prior art that various pollutants in the atmospheric environment can contaminate the wafer during the transfer process on the wafer transfer robotic arm, leading to defects in the wafer during subsequent manufacturing processes.

[0005] The objective of this invention is mainly achieved through the following technical solutions:

[0006] The present invention provides a wafer transfer robotic arm, including a blade substrate and an air supply unit for providing protective gas. The blade substrate has through holes connected to the air supply unit, so that the protective gas is sprayed through the through holes onto the upper surface of the blade substrate.

[0007] Furthermore, the number of the aforementioned through holes is multiple.

[0008] Furthermore, the number of through holes is greater than or equal to 42.

[0009] Furthermore, the blowing directions of the air outlets of the multiple through holes are different in both the width and thickness directions of the blade substrate.

[0010] Furthermore, the blowing direction of the multiple through-holes is fan-shaped in the width direction of the blade substrate.

[0011] Furthermore, multiple through holes are arranged in multiple rows along the thickness direction of the blade substrate.

[0012] Furthermore, multiple through holes are provided at the connection end of the blade substrate.

[0013] Furthermore, multiple blind holes are opened at the suspended end of the blade substrate, and connecting pipes are installed inside the blade substrate. The blind holes are connected to the through holes through the connecting pipes.

[0014] Furthermore, a rotating plate is provided at the air outlet of the aforementioned through hole and / or the air outlet of the blind hole.

[0015] Furthermore, the aforementioned wafer transfer robotic arm also includes a rotating shaft, with both ends of the rotating shaft rotatably connected to the inner walls of through holes and / or blind holes, and one end of the rotating plate fixedly connected to the rotating shaft.

[0016] Furthermore, a groove for accommodating the wafer is formed on the upper surface of the blade substrate, a through hole is formed in the groove wall near the connecting end of the blade substrate, and a blind hole is formed in the groove wall near the suspended end of the blade substrate.

[0017] Furthermore, the groove wall near the connection end of the blade substrate is inclined, so that the end of the wafer near the connection end of the blade substrate has a certain gap with the bottom of the groove.

[0018] Furthermore, the shape of the aforementioned through hole is zigzag.

[0019] The present invention also provides a wafer manufacturing apparatus, including an equipment front-end module, a transmission module, and a wafer transfer robotic arm disposed between the equipment front-end module and the transmission module, wherein the wafer transfer robotic arm is the wafer transfer robotic arm provided above.

[0020] Furthermore, the aforementioned wafer casting equipment also includes a loading / unloading module and a processing module, which are connected sequentially to each other.

[0021] The present invention also provides a wafer transfer method, comprising the following steps:

[0022] Protective gas is sprayed onto the upper surface of the blade substrate of the wafer transfer robot arm;

[0023] The wafer is transferred from the front-end module of the equipment to the blade substrate, and the protective gas always protects the wafer;

[0024] The blade substrate transfers the wafer to the transmission module, thus completing the wafer transfer.

[0025] Furthermore, the blowing direction of the aforementioned protective gas is different in both the width and thickness directions of the blade substrate.

[0026] Furthermore, the blowing direction of the aforementioned protective gas is fan-shaped in the width direction of the blade substrate.

[0027] Furthermore, protective gas is sprayed onto the wafer from the connection end of the blade substrate.

[0028] Furthermore, protective gas is sprayed onto the wafer from both the connecting end and the suspended end of the blade substrate, wherein the flow rate of protective gas sprayed from the connecting end of the blade substrate is greater than the flow rate of protective gas sprayed from the suspended end of the blade substrate.

[0029] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0030] a) In the wafer transfer robotic arm provided by this invention, through holes are formed in the blade substrate, and protective gas is introduced into the through holes to blow onto the upper surface of the blade substrate. In this way, the wafer is always under the protection of protective gas during the process of being transferred from the front-end module of the equipment to the transfer module, thereby reducing the contamination of the wafer by various pollutants in the atmospheric environment and the oxidation of the wafer caused by oxygen in the atmospheric environment, thus greatly improving the yield of the wafer in the semiconductor process.

[0031] (b) In the wafer transfer robotic arm provided by this invention, the blowing directions of the air outlets of the multiple through holes are different in both the width and thickness directions of the blade substrate. This is because the wafer has a certain width and thickness. The different blowing directions of the air outlets in the width direction of the multiple through holes allow for blowing of the wafer in the width direction. Furthermore, the different blowing directions in the thickness direction of the multiple through holes allow for blowing of both the upper and lower surfaces of the wafer in the thickness direction, thus enabling the protective gas to protect all surfaces of the wafer.

[0032] c) In the wafer transfer robotic arm provided by this invention, the blowing directions of the air outlets of the multiple through holes are fan-shaped distributed along the width direction of the blade substrate. This allows the protective gas flowing out of the multiple through holes to blow onto the upper and / or lower surfaces of the wafer from various directions, thereby substantially completely covering the wafer surface along the width direction of the blade substrate. Furthermore, the multiple through holes are arranged in multiple rows along the thickness direction of the blade substrate, and the protective gas flowing out of these multiple rows of through holes can blow onto the upper and lower surfaces of the wafer from various directions, substantially completely covering the sides, upper surface, and lower surface of the wafer.

[0033] d) In the wafer transfer robotic arm provided by the present invention, multiple through holes are provided at the connection end of the blade substrate. In this way, the air supply unit for supplying air to the through holes can be directly connected to the through holes. The air supply connection line is relatively simple, and the wafer transfer robotic arm is also easier to process, which is more conducive to industrial application.

[0034] e) In the wafer transfer robotic arm provided by the present invention, the through hole serves as the main blowing hole, which plays a major protective role for the wafer. However, it is worth noting that the flow rate of the protective gas decreases as it moves away from the through hole, and the blowing effect of the protective gas gradually weakens, resulting in contamination or oxidation still occurring on the side of the wafer near the suspended end of the blade substrate. The blind hole is connected to the through hole through a connecting pipe and serves as a secondary blowing hole. In this way, the protective gas flowing out of the blind hole can play an auxiliary protective role for the wafer and provide supplementary blowing to the side of the wafer near the suspended end of the blade substrate.

[0035] f) The wafer transfer robotic arm provided by the present invention has a rotating plate installed at the air outlet of the aforementioned through hole and / or the air outlet of the blind hole. In this way, under the action of the protective airflow, the rotating plate can vibrate, thereby appropriately changing the direction of the protective airflow, so that the protective airflow can cover the gap between two adjacent through holes and / or two adjacent blind holes. At the same time, the real-time change of the protective airflow can also form a blowing effect on the surface of the wafer, thereby further improving the protective effect of the wafer transfer robotic arm on the wafer.

[0036] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the written description and the accompanying drawings. Attached Figure Description

[0037] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0038] Figure 1 This is a schematic diagram of the wafer transfer robotic arm provided in Embodiment 1 of the present invention. The arrow indicates the direction of protective gas blowing.

[0039] Figure 2 This is a front view of the wafer transfer robotic arm provided in Embodiment 1 of the present invention, with the arrow pointing in the direction of protective gas blowing.

[0040] Figure 3 for Figure 2 Right view of detail A;

[0041] Figure 4 for Figure 2 Front sectional view of detail A;

[0042] Figure 5 for Figure 4 Front sectional view of detail B;

[0043] Figure 6This is a structural block diagram of the wafer manufacturing equipment provided in Embodiment 2 of the present invention. The arrows indicate the direction of wafer movement.

[0044] Figure label:

[0045] 1-Blade substrate; 2-Through hole; 3-Blind hole; 4-Connecting pipe; 5-Rotating blade; 6-Wafer; 7-Loading and unloading module; 8-Equipment front-end module; 9-Transmission module; 10-Processing module; 11-Wafer transfer robotic arm; 12-Rotating shaft. Detailed Implementation

[0046] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which form part of the present invention and are used together with the invention to illustrate the principles of the invention.

[0047] Example 1

[0048] This embodiment provides a wafer transfer robotic arm; see [link / reference] Figures 1 to 5 It includes a blade base 1 and an air supply unit for providing protective gas. A through hole 2 connected to the air supply unit is provided on the blade base 1, so that the protective gas is sprayed through the through hole 2 onto the upper surface of the blade base 1.

[0049] Compared with existing technologies, the wafer transfer robotic arm provided in this embodiment has through holes 2 formed on the blade substrate 1, through which protective gas is introduced and sprayed onto the upper surface of the blade substrate 1. In this way, during the process of the wafer 6 being interlocked from the equipment front-end module to the transfer module, it is always under the protection of protective gas, thereby reducing the contamination of the wafer 6 by various pollutants in the atmospheric environment and the oxidation of the wafer 6 by oxygen in the atmospheric environment, thus greatly improving the yield of the wafer 6 in semiconductor processes.

[0050] It is worth noting that the blade base 1 has a certain width, and in order to expand the blowing area of ​​the protective gas, the number of the above-mentioned through holes 2 is multiple.

[0051] For example, the number of vias 2 is greater than or equal to 42. In this way, by providing multiple vias 2, a larger range of blowing can be performed on the blade substrate 1 in the width direction, so that the protective gas can more effectively protect the wafer 6, thereby further improving the yield of the wafer 6 in the semiconductor process.

[0052] To further expand the blowing area of ​​the protective gas, the blowing directions of the outlets of the multiple through holes 2 are different in both the width and thickness directions of the blade substrate 1. This is because the wafer 6 has a certain width and thickness. The different blowing directions of the outlets of the multiple through holes 2 in the width direction of the blade substrate 1 allow for blowing of the wafer 6 in the width direction, while the different blowing directions in the thickness direction allow for blowing of the upper and lower surfaces of the wafer 6 in the thickness direction. This ensures that the protective gas can protect all surfaces of the wafer 6.

[0053] For example, in order to further expand the spraying area of ​​the protective gas in the width direction of the blade substrate 1, the spraying directions of the outlets of the multiple through holes 2 are fan-shaped in the width direction of the blade substrate 1. In this way, the protective gas flowing out of the multiple through holes 2 can spray the upper and / or lower surfaces of the wafer 6 from various directions, thereby substantially completely covering the surface of the wafer 6 in the width direction of the blade substrate 1.

[0054] Similarly, exemplarily, in order to further expand the spraying area of ​​the protective gas in the thickness direction of the blade substrate 1, multiple through holes 2 are arranged in multiple rows along the thickness direction of the blade substrate 1. In this way, the protective gas flowing out of the multiple rows of through holes 2 can spray the upper and lower surfaces of the wafer 6 from various directions, and can substantially completely cover the side, upper and lower surfaces of the wafer 6.

[0055] For ease of description, the end of the blade base 1 that is connected to the robot body is called the connecting end, and the end of the blade base 1 that is not connected to the robot body is called the suspended end.

[0056] From the perspective of processing and air supply connection, multiple through holes 2 can be set at the connection end of the blade base 1. In this way, the air supply unit used to supply air to the through holes 2 can be directly connected to the through holes 2. The air supply connection line is relatively simple, and the processing of the wafer transfer robot arm is also relatively easy, which is more conducive to industrial application.

[0057] Considering the blowing area and the protection of wafer 6, multiple blind holes 3 are provided at the suspended end of the blade substrate 1. A connecting pipe 4 is installed inside the blade substrate 1, and the blind holes 3 are connected to the through holes 2 through the connecting pipe 4. This is because the through holes 2, as the main blowing holes, play a primary role in protecting wafer 6. However, it is worth noting that the protective gas flow rate decreases along the direction gradually away from the through holes 2, and the blowing effect of the protective gas gradually weakens, resulting in contamination or oxidation still existing on the side of wafer 6 near the suspended end of the blade substrate 1. The blind holes 3, connected to the through holes 2 through the connecting pipe 4, serve as secondary blowing holes. In this way, the protective gas flowing out of the blind holes 3 can provide auxiliary protection for wafer 6, supplementing the blowing of the side of wafer 6 near the suspended end of the blade substrate 1.

[0058] Considering the gap between two adjacent through holes 2 and / or two adjacent blind holes 3, the wafer 6 position corresponding to this gap may be inaccessible to protective gas. Therefore, a rotating plate 5 is provided at the air outlet of the through hole 2 and / or the air outlet of the blind hole 3. In this way, under the action of the protective gas flow, the rotating plate 5 can rotate in real time, thereby appropriately changing the direction of the protective gas flow. This allows the protective gas flow to cover the gap between two adjacent through holes 2 and / or two adjacent blind holes 3. At the same time, the real-time change of the protective gas flow can also create a sweeping effect on the surface of the wafer 6, thereby further improving the protective effect of the wafer transfer robot arm on the wafer 6.

[0059] It should be noted that, in practical applications, although the setting of the rotating plate 5 will increase the airflow resistance of the protective gas and reduce the flow rate of the protective gas, this effect can be compensated by increasing the flow rate of the protective gas, which will not be elaborated here.

[0060] Understandably, to achieve the installation of the rotating plate 5, the aforementioned wafer transfer robotic arm also includes a rotating shaft 12. Both ends of the rotating shaft 12 are rotatably connected to the inner walls of the through-hole 2 and / or blind hole 3, respectively, and one end of the rotating plate 5 is fixedly connected to the rotating shaft 12. Thus, when the protective gas flow interacts with the rotating plate, due to the instability of the protective gas flow, the rotating shaft can rotate relative to the inner walls of the through-hole 2 and / or blind hole 3, thereby achieving the rotation of the rotating plate 5.

[0061] Specifically, regarding the structure of the blade substrate, a groove for accommodating the wafer is formed on the upper surface of the blade substrate, through holes are formed in the groove wall near the connecting end of the blade substrate, and blind holes are formed in the groove wall near the suspended end of the blade substrate.

[0062] To facilitate wafer placement and removal, the groove wall near the connecting end of the blade substrate is inclined, so that the connecting end of the wafer near the blade substrate has a certain gap with the bottom of the groove, thus facilitating wafer placement and removal.

[0063] In order to deliver nitrogen gas to the surface of the wafer, the via is, for example, zig-shaped.

[0064] Example 2

[0065] This embodiment provides a wafer manufacturing equipment; see [link to relevant documentation] Figure 6 It includes a device front-end module 8, a transmission module 9, and a wafer transfer robotic arm 11 located between the device front-end module 8 and the transmission module 9. The wafer transfer robotic arm 11 is the wafer transfer robotic arm 11 provided in Embodiment 1.

[0066] Compared with the prior art, the beneficial effects of the wafer manufacturing equipment provided in this embodiment are basically the same as those of the wafer transfer robotic arm 11 provided in Embodiment 1, and will not be described in detail here.

[0067] It is understandable that the structure of the aforementioned wafer casting equipment specifically includes a loading and unloading module 7 and a processing module 10, with the loading and unloading module 7, the equipment front-end module 8, the transmission module 9, and the processing module 10 connected in sequence.

[0068] Example 3

[0069] This embodiment provides a wafer transfer method, including the following steps:

[0070] Turn on the air supply unit to spray protective air onto the upper surface of the blade substrate;

[0071] The wafer is transferred from the front-end module of the equipment to the blade substrate, and the protective gas always protects the wafer;

[0072] The blade substrate transfers the wafer to the transmission module, thus completing the wafer transfer.

[0073] Compared with the prior art, the beneficial effects of the wafer transfer method provided in this embodiment are basically the same as those of the wafer transfer robotic arm provided in Embodiment 1, and will not be described in detail here.

[0074] To further expand the spraying area of ​​the protective gas, the spraying direction of the protective gas is different in both the width and thickness directions of the blade substrate. This is because the wafer has a certain width and thickness. The different spraying directions of the protective gas in the width direction allow for spraying the wafer across its entire width. Furthermore, the different spraying directions of the multiple through-hole outlets in the thickness direction allow for spraying the upper and lower surfaces of the wafer across its entire thickness, thus ensuring that the protective gas can protect all surfaces of the wafer.

[0075] For example, the protective gas is sprayed in a fan-shaped pattern along the width of the blade substrate. This allows the protective gas to be sprayed from all directions onto the wafer surface, essentially completely covering it.

[0076] For ease of description, the end of the blade base that is connected to the robot body is called the connecting end, and the end of the blade base that is not connected to the robot body is called the suspended end.

[0077] From the perspective of processing and gas supply connection, the protective gas is sprayed onto the wafer from the connection end of the blade substrate. In this way, the gas supply unit used to supply gas to the through hole can be directly connected to the through hole. The gas supply connection line is relatively simple, and the processing of the wafer transfer robot arm is also relatively easy, which is conducive to industrial application.

[0078] Considering the blowing area and wafer protection, protective gas is sprayed onto the wafer from both the connecting end and the suspended end of the blade substrate. The flow rate of the protective gas sprayed from the connecting end is greater than that from the suspended end. This is because the flow rate of the protective gas gradually decreases as it moves away from the via, weakening its blowing effect. This results in contamination or oxidation still existing on the side of the wafer closest to the suspended end of the blade substrate. Protective gas is sprayed from both sides of the wafer, with the gas from the connecting end providing primary protection and the gas from the suspended end providing secondary protection.

[0079] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A wafer transfer robotic arm, characterized in that, It includes a blade substrate and an air supply unit for providing protective gas. The blade substrate has through holes connected to the air supply unit, so that the protective gas is sprayed through the through holes onto the upper surface of the blade substrate. Multiple through holes are provided at the connecting end of the blade base; multiple blind holes are opened at the suspended end of the blade base; a connecting pipe is provided in the blade base; the blind holes are connected to the through holes through the connecting pipe. The air outlet of the through hole and / or the air outlet of the blind hole are provided with a rotating plate. Under the action of the protective air flow, the rotating plate rotates in real time, changing the direction of the protective air flow, so that the protective air flow covers the gap between two adjacent through holes and / or two adjacent blind holes. The upper surface of the blade substrate has a groove for accommodating the wafer, the through hole is formed in the groove wall near the connecting end of the blade substrate, and the blind hole is formed in the groove wall near the suspended end of the blade substrate. The groove wall near the connecting end of the wafer to the blade substrate is inclined, so that there is a gap between the connecting end of the wafer near the blade substrate and the bottom of the groove.

2. The wafer transfer robotic arm according to claim 1, characterized in that, The number of through holes is multiple.

3. The wafer transfer robotic arm according to claim 1, characterized in that, The blowing direction of the air outlets of the multiple through holes is different in both the width and thickness directions of the blade substrate.

4. The wafer transfer robotic arm according to claim 3, characterized in that, The air outlets of the multiple through holes are fan-shaped in the width direction of the blade body.

5. The wafer transfer robotic arm according to claim 3, characterized in that, Multiple through holes are arranged in multiple rows along the thickness direction of the blade substrate.

6. A wafer manufacturing equipment, characterized in that, The device includes a front-end module, a transmission module, and a wafer transfer robotic arm disposed between the front-end module and the transmission module, wherein the wafer transfer robotic arm is the wafer transfer robotic arm as described in any one of claims 1 to 5.

7. The wafer manufacturing equipment according to claim 6, characterized in that, It also includes a loading and unloading module and a processing module, which are connected in sequence.

8. A wafer transfer method, characterized in that, Using the wafer manufacturing equipment as described in claim 6 or 7, the wafer transfer method includes the following steps: Protective gas is sprayed onto the upper surface of the blade substrate of the wafer transfer robot arm; The wafer is transferred from the front-end module of the equipment to the blade substrate, and the protective gas always protects the wafer; The blade substrate transfers the wafer to the transmission module, thus completing the wafer transfer.

Images