Vibration damping devices and electronic equipment for audio units

Abstract

This disclosure relates to a vibration damping device for an audio unit, which is connected to the mid-frame of an electronic device. At least one vibration propagation path exists between the audio unit and the housing of the electronic device. The vibration damping device is configured to change the propagation frequency of vibration waves emitted by the audio unit in at least one vibration propagation path. This disclosure, by changing the propagation frequency in the vibration propagation path through the vibration damping device, avoids exciting the vibration of a vibrating body, reduces the vibration effect of the electronic device, and improves the user experience when holding the electronic device.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and in particular to a vibration damping device and electronic equipment for an audio unit. Background Technology

[0002] The mainstream audio unit design for electronic devices uses an earpiece unit as the upper sound source and a speaker unit as the lower sound source. The earpiece unit, for example, is an 8mm x 09mm audio unit (referred to as 0809). The 0809 only provides the earpiece function, converting the electrical signals received by the electronic device into sound waves that the user can hear. Therefore, the external audio output of the electronic device relies solely on the speaker unit, which can be, for example, a 12mm x 16mm audio unit (referred to as 1216). The 1216 has a core and a cabinet to function as an external speaker.

[0003] With societal progress and the continuous innovation of electronic devices, many manufacturers are increasingly focusing on the audio playback performance of these devices. To enhance the user experience, additional speaker units are being added to make the audio sound produced in speaker mode more immersive and satisfy users' demands for superior sound quality.

[0004] The upper sound source of an electronic device may use a 10mm x 12mm audio unit (referred to as 1012). The 1012 has a core, allowing the upper sound source to function as both a handset for answering voice calls and a speaker for playing audio. The upper and lower sound sources together create stereo sound, enhancing the stereo effect of audio playback and improving the user experience.

[0005] Both the upper and lower sound sources of electronic devices have front and rear sound cavities. The rear sound cavity of the lower sound source of electronic devices is usually sealed with a cabinet to achieve a deep bass effect.

[0006] The enclosure occupies a large amount of space, leaving less room for other components and affecting the layout of internal components in electronic devices. Therefore, the upper sound source of electronic devices usually utilizes the space between the battery casing and the device casing as a rear sound cavity, forming an open rear cavity for the upper sound source to avoid the enclosure occupying too much space. However, when the upper sound source of an electronic device emits sound, it causes the vibrating body to vibrate, affecting the user experience. Summary of the Invention

[0007] To overcome the problems existing in the related technologies, this disclosure provides a vibration damping device and electronic device for an audio unit.

[0008] According to a first aspect of the present disclosure, a vibration damping device for an audio unit is provided, which is connected in conjunction with the mid-frame of an electronic device.

[0009] There is at least one vibration propagation path between the audio unit and the housing of the electronic device, and the vibration damping device is configured to change the propagation frequency of the vibration wave emitted by the audio unit in the at least one vibration propagation path.

[0010] Optionally, the vibration damping device includes a first vibration damping part and / or a second vibration damping part, and the vibration propagation path includes an air propagation path and / or a physical propagation path;

[0011] The first damping part is configured to change the propagation frequency of the vibration wave emitted by the audio unit in the air propagation path.

[0012] The second damping element is configured to change the propagation frequency of the vibration wave emitted by the audio unit in the propagation path of the entity.

[0013] Optionally, the first damping part is disposed corresponding to the sound output part of the audio unit. Along the propagation direction of the vibration wave emitted by the audio unit, the first damping part is disposed downstream of the sound output part of the audio unit, and the first damping part is used to block the vibration wave emitted by the audio unit.

[0014] Optionally, the audio unit is assembled and connected to the second vibration damping part, and the second vibration damping part is connected to the mid-frame of the electronic device to form the physical propagation path;

[0015] The second vibration damping part has a preset weight.

[0016] Optionally, the first vibration damping part and the second vibration damping part are fixedly connected by injection molding, and the first vibration damping part is mounted on the middle frame of the electronic device through the second vibration damping part.

[0017] Optionally, the second damping portion forms an accommodating space, and the audio unit is mounted in the accommodating space.

[0018] Optionally, the inner peripheral sidewall of the accommodating space is formed with a flange. In the installed state, the flange abuts against the audio unit to restrict the movement of the audio unit relative to the accommodating space.

[0019] Optionally, the outer peripheral sidewall of the second vibration damping part is formed with a plurality of sound outlet channels communicating with the accommodating space.

[0020] Optionally, the vibration damping device further includes a connecting structure, through which the first vibration damping part and / or the second vibration damping part are detachably connected to the middle frame.

[0021] Optionally, the connection structure includes a first connection portion connected to the middle frame and a second connection portion connected to the first connection portion;

[0022] The second connection portion is formed on the first damping portion and / or the second damping portion.

[0023] Optionally, the first connecting part includes a connecting body and a plurality of connecting through holes formed in the connecting body, and the second connecting part includes a plurality of connecting protrusions, wherein the plurality of connecting through holes correspond one-to-one with the plurality of connecting protrusions and are plugged into each other.

[0024] Optionally, the first damping part is formed with a fitting groove, and a portion of the structure of the connecting body is embedded in the fitting groove.

[0025] Optionally, the connecting structure is provided on the first vibration damping part and / or the second vibration damping part by injection molding.

[0026] Optionally, the vibration damping device further includes a plurality of support portions disposed on the first vibration damping portion. In the installed state, the plurality of support portions are used to support the audio unit, so that a predetermined distance is formed between the audio unit and the first vibration damping portion.

[0027] Optionally, the vibration damping device further includes an adhesive portion disposed on the first vibration damping portion, and the audio unit is bonded to the first vibration damping portion through the adhesive portion.

[0028] Optionally, the vibration damping device further includes a foam portion disposed in the first vibration damping part, and in the installed state, the audio unit is connected to the foam portion.

[0029] Optionally, the outer peripheral sidewall of the second vibration damping part is provided with a snap-fit ​​part, and the second vibration damping part is snap-fitted to the middle frame through the snap-fit ​​part.

[0030] According to a second aspect of the present disclosure, an electronic device is provided, including a mid-frame and an audio unit. The electronic device further includes a vibration damping device for the audio unit as described above, wherein the audio unit is mounted on the mid-frame via the vibration damping device.

[0031] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: This disclosure changes the propagation frequency in the vibration propagation path by using a vibration damping device to avoid exciting the vibration of the vibrating body, reduce the vibration effect of electronic devices, and improve the user experience when holding electronic devices.

[0032] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0033] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0034] Figure 1 A schematic diagram of a vibration damping device for an audio unit, according to an exemplary embodiment.

[0035] Figure 2 A schematic diagram of an audio unit shown according to an exemplary embodiment.

[0036] Figure 3 A schematic diagram of a vibration damping device for an audio unit, according to an exemplary embodiment.

[0037] Figure 4 An exploded schematic diagram of an audio unit and a vibration damping device for the audio unit, according to an exemplary embodiment.

[0038] Figure 5 An exploded schematic diagram of an audio unit and a vibration damping device for the audio unit, according to an exemplary embodiment.

[0039] Figure 6 A schematic diagram of a vibration damping device for an audio unit, according to an exemplary embodiment.

[0040] Figure 7 An exploded schematic diagram of a vibration damping device for an audio unit, according to an exemplary embodiment.

[0041] Figure 8 An exploded schematic diagram of a vibration damping device for an audio unit, according to an exemplary embodiment.

[0042] Figure 9 A schematic diagram of a first damping section and a second damping section is shown according to an exemplary embodiment.

[0043] Figure 10 A schematic diagram of a first damping section and a second damping section is shown according to an exemplary embodiment.

[0044] Figure 11 A schematic diagram of the first connecting portion shown according to an exemplary embodiment. Detailed Implementation

[0045] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims.

[0046] In related technologies, to solve the problem of vibration of the vibrator inside electronic devices, electronic manufacturers have used methods such as attaching foam between the vibrator and the entire electronic device to support the vibrator and prevent it from vibrating. However, this method is not ideal. When a user holds the electronic device, the vibration effect is similar to touching the surface of a high-powered speaker, resulting in a poor user experience.

[0047] In related technologies, to solve the vibration problem of vibrators, electronic manufacturers have used methods such as adhesive tape to stick the vibrator in place and prevent it from vibrating. However, this method makes it difficult to disassemble the vibrator, which is not conducive to later maintenance. Moreover, the disassembly process can easily damage the vibrator, increasing maintenance costs.

[0048] This disclosure provides a vibration damping device for an audio unit, which is connected to the mid-frame of an electronic device. At least one vibration propagation path exists between the audio unit and the housing of the electronic device. The vibration damping device is configured to change the propagation frequency of the vibration wave emitted by the audio unit in at least one vibration propagation path. By changing the propagation frequency in the vibration propagation path through the vibration damping device, vibration of the vibrating body is avoided, the vibration effect of the electronic device is reduced, and the user experience when holding the electronic device is improved.

[0049] In one exemplary embodiment, such as Figure 1 , Figure 2 As shown, a vibration damping device for an audio unit is connected in conjunction with the mid-frame of an electronic device (not shown). The audio unit 1 can be, for example, the upper sound source of the electronic device, which may be a 10mm x 12mm speaker unit. The audio unit 1 and the lower sound source (not shown) of the electronic device together constitute the sound source of the electronic device to enhance the stereo effect of the electronic device and meet the user's needs. A sound output section 11 is provided on one side of the audio unit 1 to output the audio sound of the electronic device. The sound output section 11 may include multiple sound holes to improve the sound output effect.

[0050] It should be noted that the use of a 10mm x 12mm speaker unit for audio unit 1 is only for illustrative purposes and does not constitute a limitation on this application. Audio unit 1 is not limited to the above-mentioned model; audio unit 1 may fulfill both earpiece and external speaker functions.

[0051] In this embodiment, we still refer to Figure 1 , Figure 2 As shown, there is at least one vibration propagation path between the audio unit 1 and the housing of the electronic device (not shown in the figure). The vibration device is configured to change the propagation frequency of the vibration wave emitted by the audio unit 1 in the at least one vibration propagation path, so as to reduce the impact of the vibration wave on the electronic device and improve the user experience.

[0052] In one exemplary embodiment, such as Figure 2 , Figure 3 As shown, the vibration damping device includes a first damping part 2, which is made of, for example, plastic material by injection molding. The molten liquid is heated to melt it, pressurized to make it flow, and cooled to solidify it to form the first damping part 2.

[0053] The vibration propagation path includes an air propagation path, and the first damping part 2 is configured to change the propagation frequency of the vibration wave emitted by the audio unit 1 in the air propagation path. The vibration wave is, for example, the sound wave generated when the audio unit 1 emits sound, and the sound wave propagates into the air through the sound outlet 11.

[0054] In this embodiment, we still refer to Figure 2 , Figure 3 As shown, the first vibration damping part 2 may be in the form of a plate. The first vibration damping part 2 may be installed to the middle frame of the electronic device by screws. The first vibration damping part 2 may also be bonded to the middle frame of the electronic device.

[0055] The first vibration damping part 2 is disposed corresponding to the sound output part 11 of the audio unit 1, along the propagation direction of the vibration wave emitted by the audio unit 1 (refer to...). Figure 1 (As shown in the Z-axis direction), the first damping part 2 is disposed downstream of the sound output part 11 of the audio unit 1. The first damping part 2 is used to block the vibration waves emitted by the audio unit 1. The size of the first damping part 2 is sufficient to block the sound output part 11 of the audio unit 1, so as to ensure that the sound waves will not propagate to the vibrating body (not shown in the figure) and avoid resonance. The first damping part 2 blocks the sound waves of the audio unit 1 and changes the direction of sound wave propagation, so that the sound waves will not propagate directly along the air to the vibrating body and avoid affecting the vibrating body.

[0056] In this embodiment, when the first damping part 2 blocks sound propagation, the sound wave is attenuated, resulting in a reduction in the energy of the sound wave, which is insufficient to excite the natural frequency of the vibrating body, ensuring that the vibrating body does not resonate. Simultaneously, the first damping part 2 can also shield a localized area of ​​the electronic device's casing, reducing vibration when the user holds the electronic device and improving the user experience. The vibrating body can be, for example, a battery casing, or other components within the electronic device.

[0057] It should be noted that the first vibration damping part 2 and the audio unit 1 can be separate or integrated. For example, along the propagation direction of the vibration waves emitted by the audio unit 1, the first vibration damping part 2 can be positioned at a first predetermined distance downstream of the sound output part 11 of the audio unit 1, achieving a separate installation effect. Alternatively, the first vibration damping part 2 can be bonded to the audio unit 1 to form an integrated unit, with a second predetermined distance between them, exposing the sound output part 11 of the audio unit 1. This ensures that the sound output part 11 is not blocked by the first vibration damping part 2, allowing the sound waves of the audio unit 1 to propagate normally in the air. The specific connection method between the first vibration damping part 2 and the audio unit 1 depends on the actual design requirements.

[0058] In one exemplary embodiment, such as Figure 2 , Figure 4 As shown, the vibration damping device also includes a second vibration damping part 3, which is also made of plastic material and manufactured by injection molding. The vibration propagation path includes a physical propagation path. The second vibration damping part 3 is configured to change the propagation frequency of the vibration wave emitted by the audio unit 1 in the physical propagation path. The vibration wave is, for example, a stress wave generated when the audio unit 1 emits sound, which propagates from the audio unit 1 to the frame of the electronic device, and then through the frame to the vibrating body (not shown in the figure).

[0059] In this embodiment, we still refer to Figure 2 , Figure 4 As shown, the audio unit 1 is assembled and connected to the second vibration damping part 3, which is connected to the mid-frame of the electronic device to form a physical propagation path. The second vibration damping part 3 may be a frame structure, and the audio unit 1 may be snap-fitted to it or glued to it. The audio unit 1 is mounted to the mid-frame of the electronic device (not shown in the figure) via the second vibration damping part 3. The second vibration damping part 3 may be mounted to the mid-frame of the electronic device via screws or glued to it.

[0060] The second vibration damping part 3 has a preset weight, which increases the overall weight of the audio unit 1 when it is assembled with the second vibration damping part 3. When the audio unit 1 emits sound, the stress wave generated by the audio unit 1 propagates to the second vibration damping part 3 and then to the mid-frame of the electronic device. This weakens the stress wave during its propagation, effectively reducing the vibration effect when the user holds the electronic device and improving the user experience. At the same time, because the stress wave received by the mid-frame of the electronic device is attenuated, the energy of the stress wave is insufficient to propagate to the vibrator, making it difficult to excite the vibrator, thus effectively reducing the impact of the audio unit 1 on the vibrator (not shown in the figure).

[0061] In this embodiment, by providing a second damping part 3 on the audio unit 1, the propagation frequency of stress waves in the solid is reduced, and the transmission of stress waves to the vibrating body is changed, making the vibrating body less likely to be excited and avoiding the phenomenon of resonance of the vibrating body.

[0062] In one exemplary embodiment, such as Figure 1 , Figure 5 , Figure 9 As shown, the vibration damping device includes a first damping part 2 and a second damping part 3. The vibration propagation path includes an air propagation path and a physical propagation path. The first damping part 2 is configured to change the propagation frequency of the vibration wave emitted by the audio unit 1 in the air propagation path, where the vibration wave in the air propagation path is, for example, a sound wave. The second damping part 3 is configured to change the propagation frequency of the vibration wave emitted by the audio unit 1 in the physical propagation path, where the vibration wave in the physical propagation path is, for example, a stress wave.

[0063] In this embodiment, we still refer to Figure 1 , Figure 5 As shown, the first damping part 2 blocks the sound waves from the audio unit to change the direction of sound wave propagation, preventing the sound waves from propagating along the air to the vibrating body (not shown in the figure). The second damping part 3 increases the weight of the audio unit 1, and the stress waves generated by the audio unit 1 propagate through the second damping part 3 to the mid-frame of the electronic device (not shown in the figure), thus weakening the stress waves during their propagation through the physical body. The first damping part 2 and the second damping part 3 work synchronously, respectively changing the propagation frequency of the vibration waves in the air propagation path and the physical propagation path, preventing the vibration waves from propagating to the vibrating body. The vibrating body is not easily excited, and resonance does not occur, effectively reducing the impact of the audio unit 1 on the vibrating body. Furthermore, when the user holds the electronic device, the vibration problem of the electronic device is improved, enhancing the user experience.

[0064] In this embodiment, the first vibration damping part 2 and the second vibration damping part 3 are fixedly connected by injection molding, so that the first vibration damping part 2 and the second vibration damping part 3 can be integrally molded, reducing assembly steps and improving installation efficiency. For example, the first vibration damping part 2 can be mounted on the mid-frame of an electronic device via the second vibration damping part 3.

[0065] In this embodiment, refer to Figure 9As shown, the second vibration damping part 3 is, for example, a frame structure. The second vibration damping part 3 includes, for example, a first vibration damping plate 31, a second vibration damping plate 32, a third vibration damping plate 33, and a fourth vibration damping plate 34 connected sequentially. The first vibration damping plate 31, the second vibration damping plate 32, the third vibration damping plate 33, and the fourth vibration damping plate 34 enclose each other, forming an accommodating space 35 within the second vibration damping part 3. The audio unit 1 is installed within the accommodating space 35. Specifically, the first vibration damping plate 31 and the third vibration damping plate 33 are arranged opposite each other, as are the second vibration damping plate 32 and the fourth vibration damping plate 34. The first vibration damping plate 31, for example, has an opening 311 communicating with the accommodating space 35, through which the audio unit 1 can be installed into the accommodating space 35. In the installed state, the outer peripheral sidewall of the audio unit 1 can contact and connect with the inner peripheral sidewall of the accommodating space 35, ensuring the stability of the audio unit 1, preventing the audio unit 1 from shaking within the accommodating space 35, and ensuring that the audio unit 1 will not collide, further protecting the audio unit 1.

[0066] The first damping part 2 is, for example, a plate structure. The first damping part 2 is used to close one side opening of the accommodating space 35 to block the sound output part 11 of the audio unit 1 and prevent sound waves from propagating along the air to the vibrating body.

[0067] To further improve the installation effect of the audio unit 1, a flange 351 is formed on the inner peripheral sidewall of the accommodating space 35. The flange 351 is, for example, located at the edge of the third damping plate 33 and the fourth damping plate 34, and is, for example, a protruding structure extending beyond the surface of the inner peripheral sidewall of the accommodating space 35. In the installed state, the flange 351 can abut against the audio unit 1 to restrict the movement of the audio unit 1 relative to the accommodating space 35 and prevent the audio unit 1 from detaching from the accommodating space 35. For example, the flange 351 abuts against the side of the audio unit 1 away from the sound output portion 11, pressing the audio unit 1 within the accommodating space 35, so that the audio unit 1 contacts and connects with the first damping portion 2, ensuring that the audio unit 1 can be stably installed within the accommodating space 35.

[0068] It should be noted that the positions of the flange 351 and the opening 311 described above are only for explaining this embodiment and do not constitute a limitation on this application. The flange 351 and the opening 311 can also be provided on other vibration damping plates as needed.

[0069] In this embodiment, we still refer to Figure 9As shown, the vibration damping device also includes multiple support parts 21, which are disposed on the first vibration damping part 2. The support parts 21 are, for example, protruding structures, extending beyond the surface of the first vibration damping part 2 and distributed along its edges. In the installed state, the multiple support parts 21 support the audio unit 1, creating a predetermined distance between the audio unit 1 and the first vibration damping part 2. This predetermined distance is, for example, 3mm, to prevent the first vibration damping part 2 from blocking the sound output part 11 of the audio unit 1, ensuring that the audio unit 1 is not affected when playing audio. Simultaneously, the support parts 21 are in contact with the surface edge of the audio unit 1, resulting in better support and preventing uneven support force on the audio unit 1, which could lead to tilting and affect the stability of the audio unit 1.

[0070] Among them, still refer to Figure 9 As shown, the outer peripheral sidewall of the second damping part 3 also forms a plurality of sound outlet channels 36 communicating with the accommodating space 35. The sound outlet channels 36 are respectively along the length of the audio unit 1 (refer to the reference). Figure 9 (shown in the X-axis direction) and width direction (refer to) Figure 9 Extending along the X-axis (as shown), and penetrating the outer peripheral sidewall of the second damping part 3. When the audio unit 1 plays audio, the sound waves propagate through the sound outlet 11 to the accommodating space 35, and then from the accommodating space 35 to the sound outlet channel 36, realizing the function of an external speaker and ensuring the acoustic performance of the audio unit 1.

[0071] In this embodiment, we still refer to Figure 9 As shown, the vibration damping device also includes an adhesive portion 22 disposed on the first vibration damping part 2, through which the audio unit 1 is bonded to the first vibration damping part 2. The adhesive portion 22 is, for example, a weak adhesive, disposed in the middle of the first vibration damping part 2 to avoid blocking the sound outlet 11 of the audio unit 1, thus preventing any impact on the sound output of the audio unit 1. The bonding of the audio unit 1 to the first vibration damping part 2 via the adhesive portion 22 makes the connection between the two more reliable and also facilitates later maintenance. When disassembling the audio unit 1, the audio unit 1 and the first vibration damping part 2 will not be damaged, reducing maintenance costs.

[0072] In this embodiment, we still refer to Figure 9 As shown, the vibration damping device also includes a foam portion 23 disposed on the first vibration damping part 2. In the installed state, the audio unit 1 is connected to the foam portion 23. The foam portion 23 can play the role of vibration damping and energy absorption, and prevent the audio unit 1 from becoming electrically charged, thereby improving the safety performance of the audio unit 1 and preventing the audio unit 1 from becoming electrically charged, thus avoiding safety hazards.

[0073] In one exemplary embodiment, such as Figure 1 , Figure 2 , Figures 5-11As shown, the vibration damping device also includes a connecting structure 4, through which the vibration damping device mounts the mid-frame of the electronic device (not shown in the figure). The connecting structure 4 includes, for example, a first connecting portion 41 connected to the mid-frame, and a second connecting portion 42 connected to the first connecting portion 41.

[0074] In one example, such as Figure 6 As shown, when the vibration wave is a sound wave, the first damping part 2 is detachably connected to the middle frame (not shown) via the connecting structure 4. The connecting structure 4 is injection molded onto the first damping part 2. The second connecting part 42 of the connecting structure 4 is formed on the first damping part 2, and both the second connecting part 42 and the first damping part 2 can be made of plastic material and integrally molded, reducing process steps and improving production efficiency. The first connecting part 41 can be made of iron material and injection molded onto the second connecting part 42 of the first damping part 2, so that the damping device forms an iron-plastic composite, improving the strength of the damping device and extending its service life. The first damping part 2 is connected to the first connecting part 41 via the second connecting part 42, and the second connecting part 42 is installed to the middle frame of the electronic device via the first connecting part 41, simplifying the assembly process and improving assembly efficiency.

[0075] In another example, such as Figure 6 As shown, when the vibration wave is a stress wave, the second damping part 3 is detachably connected to the middle frame (not shown in the figure) through the connecting structure 4. For example, a second connecting part 42 is formed in the second damping part 3, allowing the second damping part 3 to be connected to the first connecting part 41 via the second connecting part 42. The second connecting part 42 is then mounted to the middle frame of the electronic device via the first connecting part 41. It is understood that the connecting structure 4 is also injection molded onto the second damping part 3. The form and material of the connecting structure 4 have been explained in the above example. The connection method between the connecting structure 4 and the second damping part 3 is the same as the connection method between the connecting structure 4 and the first damping part 2, and will not be repeated here.

[0076] In another example, such as Figure 6 As shown, when the vibration wave is a sound wave and a stress wave, the first damping part 2 and the second damping part 3 are detachably connected to the middle frame through the connecting structure 4. The second connecting part 42 can be formed on either the first damping part 2 or the second damping part 3, and the first damping part 2 and the second damping part 3 are fixedly connected, such that the first damping part 2 or the second damping part 3 is connected to the first connecting part 41 through the second connecting part 42.

[0077] Of course, it is understandable that, in order to improve the connection effect, both the first damping part 2 and the second damping part 3 are provided with a second connecting part 42 to improve the reliability of the connection.

[0078] In this embodiment, refer to Figures 7-11 As shown, the first connecting part 41 includes, for example, a connecting body 411 and a plurality of connecting through holes 412 formed in the connecting body 411. The second connecting part 42 includes a plurality of connecting protrusions 421. The plurality of connecting through holes 412 correspond one-to-one with the plurality of connecting protrusions 421 and are plugged in and connected.

[0079] In one example, refer to Figures 7-11 As shown, the connecting body 411 includes a first plate 4111 and a second plate 4112 at a first predetermined angle to the first plate 4111, wherein the first predetermined angle may be, for example, 90°. A plurality of connecting through holes 412 are respectively disposed on the first plate 4111 and the second plate 4112, and the plurality of connecting through holes 412 penetrate the first plate 4111 and the second plate 4112.

[0080] Among them, still refer to Figures 7-11 As shown, multiple connecting protrusions 421 can be respectively disposed on the first damping part 2 and the second damping part 3. For example, some of the connecting protrusions 421 are formed on the side of the first damping part 2 away from the accommodating space 35 and protrude from the surface of the first damping part 2. The first plate 4111 is inserted into and connected to one of the connecting protrusions 421 of the first damping part 2 through a connecting through hole 412 thereon. Another portion of the connecting protrusions 421 can be disposed on the inner peripheral sidewall of the accommodating space 35, and another portion of the connecting protrusions 421 are formed, for example, on the second damping plate 32 of the second damping part 3. The second plate 4112 is inserted into and connected to the other portion of the connecting protrusions 421 of the second damping part 3 through a connecting through hole 412 thereon. In this example, the connecting structure 4 is connected to the first damping part 2 and the second damping part 3 respectively, improving the reliability of the connection.

[0081] Of course, it is understood that the above examples are only used to explain this embodiment and do not constitute a limitation on this application. The connecting protrusion 421 can also be set separately in the first vibration damping part 2 or the second vibration damping part 3, and is not limited to being set separately in the first vibration damping part 2 and the second vibration damping part 3, and the specific setting position of the connecting protrusion 421 is subject to the actual design requirements.

[0082] In this example, to ensure the flatness of the first damping part 2, a fitting groove 24 is formed on the side of the first damping part 2 away from the receiving space 35. A portion of the structure connecting the body 411 is embedded in the fitting groove 24. This portion of the structure connecting the body 411 is, for example, the first plate 4111. The fitting groove 24 is formed by a recess in the surface of the first damping part 2 towards the receiving space 35, and a connecting protrusion 421 is formed on the bottom wall of the fitting groove 24. The depth of the fitting groove 24 is greater than or equal to the thickness of the first plate 4111 connecting the body 411, ensuring that, in the installed state, the surface of the first plate 4111 is lower than or flush with the opening of the fitting groove 24. This prevents the first damping part 2 from protruding out of the fitting groove 24, which could cause unevenness and sharp edges, thereby damaging other components inside the electronic device.

[0083] In this example, the connecting body 411 further includes at least one connecting lug 4113 fixedly connected to the second plate 4112. The connecting lug 4113 has a second predetermined angle relative to the second plate 4112, such as 90°. The connecting lug 4113 extends from the edge of the second body 4112 in a direction away from the first plate 4111, and the connecting structure 4 is mounted to the middle frame via the connecting lug 4113. The connecting lug 4113 is screwed to the middle frame, for example, to form a detachable connection.

[0084] Meanwhile, to further improve the connection effect and ensure the stability of the vibration damping device, a snap-fit ​​part 37 is provided on the outer peripheral side wall of the second vibration damping part 3. The snap-fit ​​part 37 is provided, for example, on the fourth vibration damping plate 34 of the second vibration damping part 3. The snap-fit ​​part 37 is, for example, a rectangular protrusion protruding from the surface of the fourth vibration damping plate 34. The second vibration damping part 3 is snap-fitted to the middle frame of the electronic device through the snap-fit ​​part 37, which further improves the stability of the vibration damping device.

[0085] The vibration damping device for the audio unit provided in this disclosure changes the propagation frequency of the vibration wave emitted by the audio unit 1 in the vibration propagation path through the first damping part 2 and the second damping part 3, reduces the vibration amplitude, avoids exciting the natural frequency of the vibrating body, changes the vibration state of the electronic device, and improves the user experience when holding the electronic device.

[0086] This disclosure also provides an electronic device, such as a mobile phone or tablet computer. The electronic device includes a mid-frame and an audio unit, which is, for example, the upper sound source of the electronic device. The audio unit is used to play audio information and receive voice information, providing sound services to the user. The audio unit and the lower sound source of the electronic device together form stereo sound, ensuring acoustic performance and providing consumers with a pleasant music experience.

[0087] The electronic device also includes a vibration damping device for the audio unit in all the above embodiments. The audio unit is mounted on the middle frame through the vibration damping device to change the propagation frequency of the vibration wave emitted by the audio unit in the vibration propagation path, so as to prevent the vibration wave from directly hitting the vibrating body, reduce the vibration effect of the electronic device, and improve the user experience.

[0088] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.

[0089] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A vibration damping device for an audio unit, which is connected in conjunction with the mid-frame of an electronic device, characterized in that, There is at least one vibration propagation path between the audio unit and the housing of the electronic device. The vibration damping device is configured to change the propagation frequency of the vibration wave emitted by the audio unit in the at least one vibration propagation path. The vibration propagation path includes a physical propagation path. The vibration damping device includes a second vibration damping part, which is configured to change the propagation frequency of the vibration wave emitted by the audio unit in the physical propagation path. The second vibration damping part forms an accommodating space, the audio unit is installed in the accommodating space, the audio unit is assembled and connected to the second vibration damping part, and the second vibration damping part is connected to the mid-frame of the electronic device to form the physical propagation path; The second vibration damping part has a preset weight to increase the overall weight of the audio unit.

2. The vibration damping device for the audio unit according to claim 1, characterized in that, The vibration damping device includes a first vibration damping part, and the vibration propagation path includes an air propagation path; The first damping part is configured to change the propagation frequency of the vibration wave emitted by the audio unit in the air propagation path.

3. The vibration damping device for the audio unit according to claim 2, characterized in that, The first damping part is disposed corresponding to the sound output part of the audio unit. Along the propagation direction of the vibration wave emitted by the audio unit, the first damping part is disposed downstream of the sound output part of the audio unit. The first damping part is used to block the vibration wave emitted by the audio unit.

4. The vibration damping device for the audio unit according to claim 2, characterized in that, The first vibration damping part and the second vibration damping part are fixedly connected by injection molding, and the first vibration damping part is installed on the middle frame of the electronic device through the second vibration damping part.

5. The vibration damping device for the audio unit according to claim 1, characterized in that, The inner peripheral sidewall of the accommodating space is formed with a flange. In the installed state, the flange abuts against the audio unit to restrict the movement of the audio unit relative to the accommodating space.

6. The vibration damping device for the audio unit according to claim 1, characterized in that, The outer peripheral sidewall of the second vibration damping part has multiple sound outlet channels that communicate with the accommodating space.

7. The vibration damping device for the audio unit according to claim 2, characterized in that, The vibration damping device further includes a connecting structure, through which the first vibration damping part and / or the second vibration damping part are detachably connected to the middle frame.

8. The vibration damping device for the audio unit according to claim 7, characterized in that, The connection structure includes a first connection part connected to the middle frame, and a second connection part connected to the first connection part; The second connection portion is formed on the first damping portion and / or the second damping portion.

9. The vibration damping device for the audio unit according to claim 8, characterized in that, The first connecting part includes a connecting body and a plurality of connecting through holes formed in the connecting body. The second connecting part includes a plurality of connecting protrusions, and the plurality of connecting through holes correspond one-to-one with the plurality of connecting protrusions and are plugged into each other.

10. The vibration damping device for the audio unit according to claim 9, characterized in that, The first vibration damping part has a fitting groove, and part of the structure of the connecting body is embedded in the fitting groove.

11. The vibration damping device for the audio unit according to claim 7, characterized in that, The connecting structure is installed in the first vibration damping part and / or the second vibration damping part by injection molding.

12. The vibration damping device for the audio unit according to claim 2, characterized in that, The vibration damping device also includes multiple support parts, which are disposed on the first vibration damping part. In the installed state, the multiple support parts are used to support the audio unit, so that a predetermined distance is formed between the audio unit and the first vibration damping part.

13. The vibration damping device for the audio unit according to claim 2, characterized in that, The vibration damping device further includes an adhesive portion disposed on the first vibration damping portion, and the audio unit is bonded to the first vibration damping portion through the adhesive portion.

14. The vibration damping device for the audio unit according to claim 2, characterized in that, The vibration damping device also includes a foam portion disposed in the first vibration damping part, and in the installed state, the audio unit is connected to the foam portion.

15. The vibration damping device for the audio unit according to claim 2, characterized in that, The outer peripheral sidewall of the second vibration damping part is provided with a snap-fit ​​part, and the second vibration damping part is snap-fitted to the middle frame through the snap-fit ​​part.

16. An electronic device, comprising a mid-frame and an audio unit, characterized in that, The electronic device further includes a vibration damping device for an audio unit as described in any one of claims 1-15, the audio unit being mounted on the mid-frame via the vibration damping device.

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