Grooved annular heating atomization core and its preparation method

Abstract

The present invention discloses a groove annular heating atomizing core and a preparation method thereof. The groove annular heating atomizing core includes: a ceramic substrate having a first surface and a second surface disposed opposite to each other, the first surface being provided with a first groove, the second surface being provided with a plurality of oil seepage holes, and the oil seepage holes being communicated with the first groove; a heating structure disposed at least in the first groove, and the heating structure covering at least a part of the oil seepage holes. The groove annular heating atomizing core provided by the embodiment of the present invention not only makes the atomizing core more reliable, better controls the temperature consistency, has a wider heating area, and more uniform temperature field control; on the other hand, the array-type oil seepage holes can accurately control the oil seepage speed and quantity during the working process of the atomizing core, and maintain a better atomizing effect.

Description

Technical Field

[0001] The present invention particularly relates to a groove annular heating atomizing core and a preparation method thereof, belonging to the technical field of atomizers. Background Art

[0002] Atomization technology is a process of turning a liquid into small droplets in a certain way. Currently, the main atomization methods include high-pressure gas atomization, ultrasonic atomization, microwave heating atomization, resistance heating atomization, etc. As the "heart" of atomization technology, the atomizing core determines the atomization effect.

[0003] Currently, the commonly used atomizing core structure is as Figure 1 , which forms a heating resistor on a porous ceramic through a printing process. The fine micropores in the porous ceramic are the key to the stable liquid guiding and liquid locking functions of the ceramic atomizing core. Due to surface tension and capillary action, the liquid can uniformly penetrate into the atomizing core and adsorb on the surface of the atomizing core.

[0004] Compared with other atomization methods, during the heating process of the porous ceramic atomizing core, its temperature will rise faster and the temperature uniformity is better. However, since the resistance paste is prepared by a screen printing process and then undergoes high-temperature sintering and other processes, on the one hand, high-temperature sintering will cause the shrinkage of the resistance paste, resulting in the discreteness of the resistance; on the other hand, since the porous ceramic substrate has a microporous structure, during the printing process, the resistance paste will penetrate into the pores, causing defects such as broken wires and open circuits. For the atomizing core with an alloy film as the heating structure, during its heating working state, due to the problem of the difference in thermal expansion coefficients, voids will be generated between the alloy film and the porous ceramic, thereby affecting the atomization effect. Summary of the Invention

[0005] The main purpose of the present invention is to provide a groove annular heating atomizing core and a preparation method thereof, so as to overcome the deficiencies in the prior art.

[0006] To achieve the foregoing invention purpose, the technical solutions adopted by the present invention include:

[0007] An embodiment of the present invention provides a groove annular heating atomizing core, including:

[0008] A ceramic substrate, the ceramic substrate has a first surface and a second surface arranged back to back, the first surface is provided with a first groove, the second surface is provided with a plurality of oil seepage holes, and the oil seepage holes are communicated with the first groove;

[0009] A heating structure, at least a part of the heating structure is arranged in the first groove, and at least part of the oil seepage holes are distributed outside the orthographic projection area of the heating structure, and the heating structure is used to heat the fluid medium entering the first groove from the oil seepage holes, so that the fluid medium is heated and atomized.

[0010] The embodiments of the present invention also provide a method for preparing the grooved annular heating atomization core, including:

[0011] Providing a ceramic substrate, and processing a first groove on the first surface of the ceramic substrate;

[0012] Forming a heating resistor in the first groove;

[0013] Processing a plurality of oil seepage holes penetrating through the ceramic substrate in the area corresponding to the heating resistor on the second surface of the ceramic substrate, and connecting the oil seepage holes with the first groove, so that the fluid medium introduced from the oil seepage holes can contact the heating resistor, wherein the second surface is arranged opposite to the first surface.

[0014] Compared with the prior art, the advantages of the present invention include:

[0015] An grooved annular heating atomization core provided by the embodiments of the present invention not only makes the atomization core more reliable, better controls the temperature consistency, has a wider heating area, and more uniform temperature field control; on the other hand, a plurality of arrayed oil seepage holes in the grooved annular heating atomization core provided by the embodiments of the present invention can precisely control the oil seepage speed and quantity during the working process of the atomization core, and maintain a better atomization effect. Description of the Drawings

[0016] Figure 1 is a porous ceramic atomization core sample in the prior art;

[0017] Figure 2 is a schematic structural diagram of a grooved annular heating atomization core provided in Embodiment 1 of the present invention;

[0018] Figure 3 is a schematic preparation process diagram of a grooved annular heating atomization core provided in Embodiment 1 of the present invention;

[0019] Figure 4 is a schematic structural diagram of the preparation process of a grooved annular heating atomization core provided in Embodiment 1 of the present invention;

[0020] Figure 5 is a schematic structural diagram of a grooved annular heating atomization core provided in Embodiment 2 of the present invention. Detailed Embodiments

[0021] In view of the deficiencies in the prior art, the inventors of this case have proposed the technical solution of the present invention through long-term research and a large number of practices. The following will further explain the technical solution, its implementation process, principles, etc.

[0022] An embodiment of the present invention provides an atomizing core that can be simple in process, good in performance, and high in precision, and is applicable in application fields such as electronic cigarettes, humidifiers, facial steamers, fog machines, and medical atomizers.

[0023] In order to overcome the disadvantages of the atomizing core of porous ceramics prepared by thick film printing and alloy film sheets at present, the present invention proposes to form an annular heating structure on a dense ceramic substrate by printing or deposition; on the other hand, by etching, the aperture size and quantity of the oil seepage holes can be precisely controlled.

[0024] An embodiment of the present invention provides a groove annular heating type atomizing core, including:

[0025] A ceramic substrate, the ceramic substrate has a first surface and a second surface arranged back to back, the first surface is provided with a first groove, the second surface is provided with a plurality of oil seepage holes, and the oil seepage holes are communicated with the first groove;

[0026] A heating structure, at least a part of the heating structure is arranged in the first groove, and at least part of the oil seepage holes are distributed outside the orthographic projection area of the heating structure, and the heating structure is used to heat the fluid medium entering the first groove from the oil seepage holes, so that the fluid medium is heated and atomized.

[0027] In a specific embodiment, the first surface of the ceramic substrate has a first area and a second area, the second area surrounds the first area, wherein, the first groove is arranged in the first groove, and a part of the heating structure is arranged in the first area and another part is arranged in the second area.

[0028] In a specific embodiment, the heating structure includes at least one annular heating resistor, and there is no overlapping area between the oil seepage hole and the orthographic projection area of the heating resistor on its own axial direction.

[0029] In a specific embodiment, the resistance of the heating resistor is 0.5 - 5 ohms.

[0030] In a specific embodiment, the material of the heating resistor includes any one metal of Ni, Cr, Au, Pt, Mo, W or an alloy formed by two or more metals.

[0031] In a specific embodiment, the thickness of the heating resistor is 100nm - 500μm.

[0032] In a specific embodiment, a metal pad is further arranged in the second area of the first surface of the ceramic substrate, and the metal pad is electrically connected to the heating structure.

[0033] In a specific embodiment, a plurality of the oil seepage holes are arranged at intervals in an array.

[0034] In a specific embodiment, the plurality of oil seepage holes may be uniformly distributed or non-uniformly distributed.

[0035] In a specific embodiment, the aperture of the oil seepage hole is 10 μm - 100 μm, and the pitch is 10 μm - 10 mm.

[0036] In a specific embodiment, the number of the oil seepage holes is 10 - 5000.

[0037] In a specific embodiment, a second groove is provided on the second surface of the ceramic substrate, and the oil seepage holes are provided at the bottom of the second groove. Wherein, the depth ratio of the first groove to the second groove is (1 - 100)∶(10 - 300), and the ratio of the thickness of the ceramic substrate remaining between the first groove and the second groove to the depth of the first groove is (20 - 300)∶(1 - 100).

[0038] In a specific embodiment, the depth of the first groove is 10 μm - 1000 μm, the depth of the second groove is 100 μm - 3000 μm, and the thickness of the ceramic substrate remaining between the first groove and the second groove is 200 μm - 3000 μm.

[0039] In a specific embodiment, the ceramic substrate includes a ceramic substrate.

[0040] The embodiment of the present invention also provides a preparation method of the groove annular heating type atomization core, including:

[0041] Providing a ceramic substrate, and processing a first groove on the first surface of the ceramic substrate;

[0042] Forming a heating resistor in the first groove;

[0043] Processing a plurality of oil seepage holes penetrating through the ceramic substrate in the area corresponding to the heating resistor on the second surface of the ceramic substrate, and connecting the oil seepage holes with the first groove, so that the fluid medium introduced from the oil seepage holes can contact the heating resistor, wherein the second surface is arranged opposite to the first surface.

[0044] In a specific embodiment, the preparation method includes: processing a second groove in the area corresponding to the first groove on the second surface of the ceramic substrate, and then processing a plurality of the oil seepage holes at the bottom of the second groove.

[0045] In a specific embodiment, the preparation method includes: making pads on the first surface of the ceramic substrate, and electrically connecting the pads with the heating structure.

[0046] The technical solution, its implementation process, principle, etc. will be further explained below in conjunction with the accompanying drawings and specific implementation cases. Unless otherwise specified, the etching, deposition, patterning processes, equipment, etc. adopted in the embodiments of the present invention can be known to those skilled in the art.

[0047] A groove annular heating atomization core provided by an embodiment of the present invention uses a dense ceramic as a ceramic substrate, mainly including two parts of structures; a ceramic substrate part and a heating part. The heating part mainly includes a heating structure, and the heating structure is mainly a heating resistor, which uses a metal material to conduct electricity to achieve the heating function; the central area of the first groove of the ceramic substrate part has a plurality of oil seepage holes formed by etching and distributed in an array, and the heating structure is correspondingly distributed around the plurality of oil seepage holes. The plurality of oil seepage holes can control the oil seepage rate and the amount of oil seepage. Among them, the fluid medium in the embodiments of the present invention mainly refers to e-liquid, etc.

[0048] Embodiment 1

[0049] Please refer to Figure 2 , a groove annular heating atomization core, including a ceramic substrate 100 and a heating structure 200. The ceramic substrate 100 has a first surface and a second surface arranged back to back. The first surface is provided with a first groove 110, and the second surface is provided with a plurality of oil seepage holes 130. The oil seepage holes 130 are communicated with the first groove 110; the heating structure 200 is arranged in the first groove 110, and the fluid medium entering from the oil seepage holes 130 can contact the heating structure 200 and be heated and atomized.

[0050] In this embodiment, the heating structure 200 includes a heating resistor having an annular structure. It can be understood that the heating resistor itself has an annular structure, or the plurality of heating resistors included in the heating structure 200 are integrally annular.

[0051] In this embodiment, the resistance of the heating resistor is 0.5 - 5 ohms. The material of the heating resistor can be any one of the metals Ni, Cr, Au, Pt, Mo, W or an alloy formed by two or more metals. The thickness of the heating resistor is 100 nm - 500 μm.

[0052] In this embodiment, the first surface of the ceramic substrate 100 has a first area and a second area. The second area surrounds the first area. The first groove 110 is arranged in the first area. A part of the heating structure 200 is arranged in the first groove 110 of the first area, and another part is arranged in the second area. In addition, a metal pad 400 is also arranged in the second area, and the metal pad 400 is electrically connected to the heating structure 200.

[0053] In this embodiment, an outlet of the oil seepage hole 130 is formed at the bottom of the first groove 110. The outlet of the oil seepage hole 130 is located in the middle area of the bottom of the first groove 110. The heating structure 200 is arranged in other areas of the bottom of the first groove 110 and distributed around the middle area. It can be understood that the oil seepage hole is not covered by the heating structure 200.

[0054] In this embodiment, a plurality of the oil seepage holes 130 are arranged at intervals in an array. The aperture of the oil seepage hole 130 is 10μm - 100μm, and the spacing is 10μm - 10mm.

[0055] In this embodiment, a second groove 120 is provided on the second surface of the ceramic substrate 100. The oil seepage hole 130 is arranged in the ceramic substrate remaining between the second groove 120 and the first groove 110, and the oil seepage hole 130 is respectively communicated with the first groove 110 and the second groove 120. Among them, the orthographic projection areas of the first groove 110 and the second groove 120 are the same, and the depth ratio of the first groove 110 to the second groove 120 is (1 - 100)∶(10 - 300). The thickness of the ceramic substrate 100 remaining between the first groove 110 and the second groove 120 and the depth ratio of the first groove 110 is (20 - 300)∶(1 - 100).

[0056] For example, the depth of the first groove 110 is 10μm - 1000μm, that of the second groove 120 is 100μm - 3000μm, and the thickness of the ceramic substrate remaining between the first groove 110 and the second groove 120 is 200μm - 3000μm.

[0057] It should be noted that the positions of the first groove 110 and the second groove 120 may correspond to each other. It can be understood that the orthographic projection area of one of the first groove 110 and the second groove 120 may be located within the orthographic projection area of the other or completely coincide.

[0058] In this embodiment, the ceramic substrate 100 may be a ceramic substrate. The ceramic substrate 100 is mainly made of dense ceramic as the base material. The dense ceramic raw materials are mixed by methods such as roller, three - dimensional, and planetary mixing, and then formed into a dense ceramic substrate by methods such as injection molding or isostatic pressing. After that, it is pre - fired and then sintered at high temperature. The manufacturing process of the ceramic substrate 100 is not specifically limited and described here.

[0059] Please refer to Figure 3 and Figure 4 , a preparation method of a groove - shaped annular heating atomizing core may include the following steps:

[0060] 1) Use alumina ceramic powder materials with a particle size of about 200 μm as raw materials for making ceramic substrates, and control the particle size distribution through screening;

[0061] 2) Use a drum charger or the like to mix the alumina ceramic powder materials with additives such as glass frit and stearic acid. Among them, the mass percentages of the alumina ceramic powder materials and the additives are 5% and 15% respectively;

[0062] 3) Use a hot press grouting machine or the like to inject the mixed slurry into the prepared mold to form a ceramic substrate blank of the atomizing core with strength;

[0063] 4) Place the ceramic substrate blank of the atomizing core in a programmable oven, and heat the temperature in the programmable oven to 200 °C to perform degreasing treatment of organic solvents on the ceramic substrate blank of the atomizing core;

[0064] 5) Use a muffle furnace or the like to pre-burn the degreased ceramic substrate blank, control the pre-burning temperature at 500 - 600 °C, and adjust the pre-burning time according to specific circumstances;

[0065] 6) Use a high-temperature sintering furnace to perform overall sintering on the pre-burned ceramic substrate blank, control the sintering temperature at 1100 - 1200 °C, and control the sintering time at 1 - 1.5 hours to obtain the described ceramic substrate;

[0066] 7) Process and form a first groove 110 on the first surface of the sintered ceramic substrate and a second groove 120 on the second surface through etching or the like, and make the first groove 110 and the second groove 120 correspond to each other. Among them, the first surface and the second surface are arranged back to back;

[0067] 8) Through deposition or the like, perform patterning of metal Ni / Cr on the first surface of the ceramic substrate, thereby forming a heating resistor for heating on the first surface, and use the heating resistor as a heating structure. Among them, a part of the heating resistor is arranged in the peripheral area inside the first groove 110, and the other part is arranged outside the first groove 110. The resistance of the heating resistor is 1 - 1.5 ohms;

[0068] 9) Use laser etching to make a plurality of oil seepage holes 130 distributed in an array in the middle area at the bottom of the second groove 120 of the ceramic substrate. The oil seepage holes 130 penetrate the ceramic substrate along the thickness direction and are in communication with the first groove, and control the diameter of the oil seepage holes 130 to be 10 μm - 100 μm, and the spacing to be 10 μm - 10 mm. Among them, the peripheral area is distributed around the middle area;

[0069] 10) The pad 400 is fabricated on the first surface of the ceramic substrate, and the pad 400 is electrically connected to the heating resistor. Then, a metal nickel wire with a diameter of about 0.5 μm is welded to the pad by spot welding or the like.

[0070] Embodiment 2

[0071] Please refer to Figure 5 , the structure of a groove annular heating type atomizing core in this embodiment is basically the same as that in Embodiment 1. The differences are as follows:

[0072] A plurality of blind holes 140 are further formed in the area corresponding to the heating resistor at the bottom of the first groove 110 of the ceramic substrate 100. The depth of the blind holes is 1 / 3 - 1 / 2 of the depth of the oil seepage holes 130. The aperture of the blind holes is 1 - 2 times the aperture of the oil seepage holes. The distance between the blind holes can be 0.5 - 1.5 times the distance between the oil seepage holes. Moreover, each blind hole is filled with a transition layer 500, which is sintered and formed by a mixture of metal particles and ceramic particles. Among them, the metal particles are of the same material as the heating resistor, the ceramic particles are of the same material as the ceramic substrate, and the heating resistor is directly bonded to the transition layer 500.

[0073] For the groove annular heating type atomizing core provided in this embodiment, on the one hand, it can utilize the characteristic that the transition layer itself has good compatibility with the heating resistor and the ceramic substrate to strengthen the bonding force between the heating resistor and the ceramic substrate from the perspective of materials science. On the other hand, the transition layer is used as an anchor point to strengthen the bonding between the two from the mechanical perspective, overcoming problems such as warping and detachment that may be caused by the difference in thermal expansion coefficient between the heating resistor and the ceramic substrate. In addition, the existence of these blind holes and the transition layer can also form a three-dimensional heating path in the ceramic substrate (the heating resistor is in surface contact with the ceramic substrate surface, presenting surface heating. These transition layers penetrate deep into the ceramic substrate, so an additional heating dimension is added), further improving the heating efficiency and heating uniformity.

[0074] The groove annular heating type atomizing core provided by the embodiment of the present invention has higher reliability, better control of temperature consistency, a wider heating area, and more uniform temperature field control. On the other hand, for the groove annular heating type atomizing core provided by the embodiment of the present invention, the arrayed oil seepage holes can precisely control the oil seepage speed and quantity during the operation of the atomizing core, maintaining a better atomizing effect.

[0075] An atomizing core with a groove-shaped annular heating structure provided by an embodiment of the present invention. The annular heating structure enables a more uniform temperature field in the overall area where the e-liquid is atomized, avoiding inconsistent atomization speeds of the e-liquid caused by uneven temperature field distribution during the atomization process, which may lead to discomfort in taste. On the other hand, the array of oil seepage holes can more precisely control the speed and quantity of oil replenishment, enabling timely e-liquid replenishment after atomization. Moreover, the consistency of the pores can fully ensure that the oil replenishment speed is consistent, thus guaranteeing the overall atomization effect of the atomizing core.

[0076] Most of the current atomizing core structures mainly use S-shaped heating wires, resulting in poor uniformity of the thermal field distribution on the overall surface and a large difference in the thermal temperature gradient. Therefore, there is a relatively large difference in the taste of e-liquid atomization. In contrast, the annular heating structure in the present invention can largely maintain the uniformity of the thermal field distribution and fully maintain the consistency of the temperature gradient in the heating area where the e-liquid is atomized, thereby ensuring the uniformity of e-liquid atomization and enhancing the taste of the e-liquid.

[0077] It should be understood that the above embodiments are only for explaining the technical concept and features of the present invention, and their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly. However, the protection scope of the present invention cannot be limited thereby. Any equivalent changes or modifications made according to the spirit and essence of the present invention should be covered within the protection scope of the present invention.

Claims

1. A groove-shaped annular heating atomization core, characterized in that, Comprising: A ceramic substrate having a first surface and a second surface disposed opposite to each other. The first surface is provided with a first groove, and the second surface is provided with a plurality of oil seepage holes that communicate with the first groove. The first surface of the ceramic substrate has a first region and a second region, and the second region surrounds the first region. Among them, the first groove is provided in the first region. A heating structure, at least a part of the heating structure is disposed in the first groove of the first region, and another part is disposed in the second region; the top surface of the heating structure disposed in the second region and the top surface of the heating structure disposed in the first groove of the first region form a height difference; and at least part of the oil seepage holes are distributed outside the orthographic projection region of the heating structure. The heating structure is used to heat the fluid medium entering the first groove from the oil seepage holes, so that the fluid medium is heated and atomized. The heating structure includes a heating resistor. A plurality of blind holes are formed in the region of the bottom of the first groove of the ceramic substrate corresponding to the heating resistor. Each blind hole is filled with a transition layer sintered from a mixture of metal particles and ceramic particles.

2. The groove-shaped annular heating atomization core according to claim 1, characterized in that: The heating structure includes at least one annular heating resistor, and there is no overlapping region between the oil seepage holes and the orthographic projection region of the heating resistor on its own axial direction.

3. The groove-shaped annular heating atomization core according to claim 2, wherein: The resistance of the heating resistor is 0.5 - 5 ohms.

4. The groove-shaped annular heating atomization core according to claim 2, wherein: The material of the heating resistor includes any one of metals such as Ni, Cr, Au, Pt, Mo, W or an alloy formed by two or more metals.

5. The recessed annular heating atomizing core according to claim 2, wherein: The thickness of the heating resistor is 100 nm - 500 μm.

6. The groove annular heating atomization core according to claim 1, wherein: A metal pad is further provided on the second region of the first surface of the ceramic substrate, and the metal pad is electrically connected to the heating structure.

7. The groove-shaped annular heating atomization core according to claim 1, characterized in that: The plurality of oil seepage holes are arranged in an array at intervals. Among them, the aperture of the oil seepage hole is 10 μm - 100 μm, and the spacing is 10 μm - 10 mm.

8. The recessed annular heating atomization core according to claim 1, wherein: The second surface of the ceramic substrate is provided with a second groove, and the oil seepage holes are provided at the bottom of the second groove. Among them, the depth ratio of the first groove to the second groove is (1 - 100):(10 - 300), and the ratio of the thickness of the ceramic substrate remaining between the first groove and the second groove to the depth of the first groove is (20 - 300):(1 - 100).

9. The recessed annular heating atomization core according to claim 8, wherein: The ceramic substrate includes an alumina ceramic substrate.

10. The preparation method of the groove-shaped annular heating atomization core according to any one of claims 1-9, characterized in that, Comprising: Providing a ceramic substrate, and machining a first groove on the first surface of the ceramic substrate. Forming a heating resistor in the first groove. Machining a plurality of oil seepage holes penetrating through the ceramic substrate in the region of the second surface of the ceramic substrate corresponding to the heating resistor, and making the oil seepage holes communicate with the first groove, so that the fluid medium introduced from the oil seepage holes can contact the heating resistor, wherein the second surface is disposed opposite to the first surface.

11. The preparation method according to claim 10, wherein, Comprising: Machining a second groove in the region of the second surface of the ceramic substrate corresponding to the first groove, and then machining a plurality of the oil seepage holes at the bottom of the second groove.

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