A power tool

Abstract

This application provides a control system and a power tool, belonging to the field of electrical heat dissipation technology. The control system includes a control box, a heating element, a heat dissipation assembly, insulating filler, and a main control board. The control box has a receiving cavity and a heat dissipation vent communicating with the receiving cavity. The heating element is located inside the receiving cavity. The heat dissipation assembly is connected to the heating element and passes through the heat dissipation vent so that the heat dissipation assembly is partially located outside the receiving cavity. The insulating filler is located inside the receiving cavity to isolate the heating element from the side of the heat dissipation vent facing away from the receiving cavity. The main control board is connected to the heating element. The control system and power tool of this application can reduce the possibility of circuit damage and improve heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of electrical heat dissipation technology, and more particularly to a control system and a power tool. Background Technology

[0002] Power tools in related technologies, taking angle grinders as an example, may experience problems such as circuit damage or heat dissipation difficulties during operation. Summary of the Invention

[0003] In view of this, embodiments of this application aim to provide a control system and power tool that can reduce the possibility of circuit damage and improve heat dissipation efficiency.

[0004] To achieve the above objectives, a first aspect of this application provides a control system, comprising:

[0005] The control box has a receiving cavity and a heat dissipation vent communicating with the receiving cavity;

[0006] The heating element is located within the receiving cavity;

[0007] A heat dissipation component is connected to the heat-generating device, and the heat dissipation component passes through the heat dissipation vent so that the heat dissipation component is partially located outside the receiving cavity;

[0008] Insulating filler, located within the receiving cavity, isolates the heating element from the side of the heat dissipation vent opposite to the receiving cavity; and

[0009] The main control board is connected to the heating device.

[0010] In one embodiment, the heat dissipation component includes:

[0011] The circuit layer is at least partially connected to the heat-generating device;

[0012] An insulating layer, at least partially located on the side of the circuit layer opposite to the heating device, wherein the circuit layer is disposed on the insulating layer; and

[0013] A heat sink is disposed on the side of the insulating layer away from the heat-generating device. The insulating layer is capable of transferring the heat emitted by the heat-generating device to the heat sink. The heat sink is at least partially located on the side of the heat dissipation vent away from the receiving cavity.

[0014] In one embodiment, the heat sink includes:

[0015] A thermally conductive substrate is disposed on the side of the insulating layer opposite to the heat-generating device, the insulating layer being capable of transferring heat emitted by the heat-generating device to the thermally conductive substrate; and

[0016] The heat sink body is detachably connected to the side of the thermally conductive substrate away from the insulating layer, and the heat sink body is at least partially located on the side of the heat dissipation vent away from the receiving cavity.

[0017] In one embodiment, the thermally conductive substrate is located within the receiving cavity, and the thermally conductive substrate and the control box are arranged to form a gap extending circumferentially along the thermally conductive substrate. The insulating filler is at least partially filled in the gap to isolate the heat-generating device from the side of the heat dissipation vent that is away from the receiving cavity.

[0018] In one embodiment, the circuit layer, the insulating layer, and the thermally conductive substrate are connected in sequence.

[0019] In one embodiment, the heat-generating device is in surface contact with the heat dissipation assembly.

[0020] In one embodiment, the heating device is a chopper switch of a chopper circuit.

[0021] In one embodiment, the insulating filler is capable of solidifying from a liquid state to a solid state at room temperature.

[0022] In one embodiment, the main control board is located within the receiving cavity, and the side of the main control board and the heat dissipation vent facing away from the receiving cavity is isolated by the insulating filler.

[0023] A second aspect of this application provides an electric tool, comprising:

[0024] The outer casing has an electronic control area and an air inlet and an air outlet connected to the electronic control area;

[0025] The control system corresponding to the above one is located within the electronic control area;

[0026] The wind turbine is located within the housing; and

[0027] The main unit is used to drive the fan wheel to rotate so that the airflow flows sequentially through the air inlet, the heat dissipation component and the air outlet.

[0028] In one embodiment, the host has a working part, and along the arrangement direction of the receiving cavity and the heat dissipation vent, the heat dissipation vent is located on the side of the receiving cavity facing the working part.

[0029] In one embodiment, the housing further forms an installation cavity and a transition vent that connects the installation cavity and the electrical control area respectively. The impeller is located in the installation cavity, and the transition vent is located between the electrical control area and the installation cavity. Along the arrangement direction of the receiving cavity and the heat dissipation vent, the transition vent is located on the side of the receiving cavity facing the heat dissipation vent. When the impeller rotates, the airflow flows sequentially through the air inlet, the heat dissipation component, the transition vent, the installation cavity, and the air outlet.

[0030] In one embodiment, the control system further includes an operating mechanism that passes through the housing and is connected to the main control board. The operating mechanism is located on the side of the control box away from the heat dissipation vent.

[0031] In one embodiment, the main control board is located within the receiving cavity, and the main control board and the side of the heat dissipation vent facing away from the receiving cavity are isolated by the insulating filler. The control system further includes a first electrolytic capacitor connected to the main control board. The first electrolytic capacitor is used to suppress the current peak on the output side of the rectifier circuit of the main control board. The first electrolytic capacitor is disposed through the heat dissipation vent so that the first electrolytic capacitor is partially located on the side of the heat dissipation vent facing away from the receiving cavity. The first electrolytic capacitor is cylindrical, and the axial span of the first electrolytic capacitor is greater than the radial span of the first electrolytic capacitor. The axial direction of the first electrolytic capacitor is parallel to the main control board.

[0032] The control system of this application embodiment, on the one hand, allows airflow to pass through the heat dissipation assembly and carry away the heat conducted from the heat-generating device to the heat dissipation assembly, thereby effectively dissipating heat from the heat-generating device and improving heat dissipation efficiency. On the other hand, because the insulating filler located in the receiving cavity isolates the heat-generating device from the side of the heat dissipation vent away from the receiving cavity, the heat-generating device is sealed within the receiving cavity by the filler. Even if there is dust, moisture, and conductive debris in the airflow passing through the heat dissipation assembly at the heat dissipation vent, these dust, moisture, and conductive debris cannot penetrate the insulating filler in the receiving cavity and contact the heat-generating device, reducing the possibility of circuit damage. Therefore, the control system of this application embodiment can both reduce the possibility of circuit damage and improve heat dissipation efficiency. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the structure of a power tool according to an embodiment of this application, showing the internal structure of the power tool;

[0034] Figure 2 This is a perspective view of the power tools according to an embodiment of this application;

[0035] Figure 3 This is an exploded view of the control system according to an embodiment of this application, showing the heat dissipation components and heat-generating devices;

[0036] Figure 4 This is an assembly diagram of the heat-generating device and the heat dissipation assembly according to an embodiment of this application. The diagram shows the side of the heat dissipation assembly facing the heat-generating device, but the heat sink body is not shown.

[0037] Figure 5 This is an exploded view of the control system according to an embodiment of this application. The heat dissipation components and heat-generating devices are not shown in the figure. The figure shows the state in which the first electrolytic capacitor is separated from the main control board.

[0038] Figure 6 This is a schematic diagram of the control system according to an embodiment of this application. Heat dissipation components and heat-generating devices are not shown in the figure.

[0039] Figure 7 This is a schematic diagram of the control system according to an embodiment of this application. The diagram shows the side of the control box facing the heat dissipation vent.

[0040] Figure 8 for Figure 7 A schematic diagram of a cross-sectional view at position BB rotated 90 degrees clockwise, where the insulating layer and circuit layer are not shown;

[0041] Figure 9 Figure 8 A schematic diagram of the C-direction view rotated 90 degrees clockwise;

[0042] Figure 10 for Figure 8 A magnified view at position D in the middle;

[0043] Figure 11 This is an assembly diagram of the control box and the thermally conductive substrate according to an embodiment of this application. The diagram shows the state of the potting resin in the cavity. The heat sink body, circuit layer, insulating layer and heat-generating device in the cavity are not shown in the diagram.

[0044] Figure 12 for Figure 1 The view from direction A in the figure shows the tail cover, which is not shown.

[0045] Figure 13 This is a circuit diagram of a power tool according to an embodiment of this application, showing the power adjustment section of the circuit diagram.

[0046] Explanation of reference numerals in the attached drawings: Control system 100; Control box 1; Receiving cavity 11; Heat dissipation vent 12; Heating device 2; Heat dissipation assembly 3; Heat sink 33; Thermal conductive substrate 331; Reference surface 3311; Heat sink body 332; Insulating filler 4; Sealing surface 41; Main control board 5; Rectifier circuit 501; Chopper circuit 502; Gap 6; First operating mechanism 71; Second operating mechanism 72; First electrolytic capacitor 8; Mounting substrate 9; Baffle plate 10; Outer shell 200; Electrical control area 201; Air inlet 202; Mounting cavity 204; Transition vent 205; Housing 206; Tail cover 207; Fan wheel 300; Motor 401; Transmission component 402; Grinding wheel 403; Working part 404. Detailed Implementation

[0047] It should be noted that, unless otherwise specified, the embodiments and technical features in the embodiments of this application can be combined with each other, and the detailed descriptions in the specific implementation should be understood as explanations of the purpose of this application and should not be regarded as undue limitations on this application.

[0048] As part of the inventive concept of this application, before describing the embodiments of this application, it is necessary to analyze the reasons why power tools may experience circuit damage or heat dissipation difficulties in related technologies, and obtain the technical solutions of the embodiments of this application through reasonable analysis.

[0049] In related technologies, the heating element of power tools needs heat dissipation. A fan is used to direct external airflow past the heating element to cool it. However, dust, moisture, and even conductive debris in the air can enter the power tool and flow past the heating element. For example, when the power tool is used as an angle grinder, conductive debris is generated during grinding of metal materials. When the heating element is exposed above the insulating filler, the airflow passing near it can effectively dissipate heat, but dust, moisture, and even conductive debris in the airflow can damage the circuitry connected to the heating element. Conductive debris and moisture, in particular, can cause short circuits, resulting in serious damage. When the heating element is isolated from the airflow by insulating filler, the possibility of damage to the circuitry is reduced. However, some insulating fillers have poor thermal conductivity, making it difficult for the heating element enclosed within them to dissipate heat effectively, potentially leading to overheating. Taking an angle grinder as an example, the external power supply for an angle grinder is AC, such as 220V, 50Hz AC. However, the angle grinder is not directly driven by the external power supply. The motor of the angle grinder may be a DC motor. The 220V, 50Hz AC power from the external power supply needs to be converted into DC power by the angle grinder's control system to drive the angle grinder. For example, if the angle grinder is connected to a 220V, 50Hz power supply, the 220V, 50Hz AC power is converted into DC power by the rectifier circuit 501. The DC power is then chopped by the chopper circuit 502 to form the U phase, V phase, and W phase before supplying power to the DC motor. The chopper switch in the chopper circuit 502 will emit a relatively large amount of heat during operation. Therefore, it is necessary to dissipate heat from the chopper switch in the chopper circuit 502. However, the exposed chopper switch may be affected by dust, moisture, and conductive debris in the airflow, causing damage to the circuit connected to the chopper switch.

[0050] Therefore, this application provides an embodiment of an electric tool. Please refer to [link to embodiment]. Figure 1 and Figure 2The power tool includes a housing 200, a control system 100, a fan 300, and a main unit. The housing 200 has an electrical control area 201 and an air inlet 202 and an air outlet communicating with the electrical control area 201. The control system 100 is located within the electrical control area 201. The fan 300 is located within the housing. The main unit drives the fan 300 to rotate, causing airflow to sequentially pass through the air inlet 202, the control system 100, and the air outlet. Thus, the control system 100 generates heat during the operation of the power tool. The main unit drives the fan 300 to rotate, causing air from outside the housing to enter the housing and flow through the control system 100 to dissipate heat.

[0051] In one embodiment, the power tool can be an angle grinder.

[0052] It is understandable that power tools can also refer to other power tools besides angle grinders.

[0053] For the control system 100 in this application embodiment, please refer to... Figure 1 , Figure 3 , Figure 4 , Figure 7 and Figure 8 It includes a heating element 2 and a main control board 5, with the main control board 5 connected to the heating element 2. Thus, the heating element 2 is connected to the corresponding circuit in the main control board 5, and the heating element 2 generates heat during the operation of the corresponding circuit.

[0054] In one embodiment, please refer to Figure 3 , Figure 4 , Figure 7 , Figure 9 , Figure 10 as well as Figure 11The control system 100 also includes a control box 1, a heat dissipation assembly 3, and insulating filler 4. The control box 1 has a receiving cavity 11 and a heat dissipation vent 12 communicating with the receiving cavity 11. The heating element 2 is located inside the receiving cavity 11. The heat dissipation assembly 3 is connected to the heating element 2 and passes through the heat dissipation vent 12 so that the heat dissipation assembly 3 is partially located outside the receiving cavity 11. The insulating filler 4 is located inside the receiving cavity 11 to isolate the heating element 2 from the side of the heat dissipation vent 12 opposite to the receiving cavity 11. With this structure, on the one hand, airflow passing through the heat dissipation assembly 3 carries away the heat conducted from the heating element 2 to the heat dissipation assembly 3, thereby better dissipating heat from the heating element 2 and improving heat dissipation efficiency. On the other hand, because the insulating filler 4 located in the receiving cavity 11 isolates the heating element 2 from the side of the heat dissipation vent 12 away from the receiving cavity 11, the heating element 2 is sealed within the receiving cavity 11 by the filler. Even if there is dust, moisture, and conductive debris in the airflow of the heat dissipation component 3 flowing through the heat dissipation vent 12, these dust, moisture, and conductive debris cannot penetrate the insulating filler 4 in the receiving cavity 11 and contact the heating element 2, reducing the possibility of circuit damage. Therefore, the control system 100 of this application embodiment can both reduce the possibility of circuit damage and improve heat dissipation efficiency, which is beneficial for the better operation of the control system 100 and the power tool.

[0055] In one embodiment, the control box 1 is made of an insulating material. For example, the control box 1 is made of plastic.

[0056] In one embodiment, please refer to Figure 1 The main unit drives the impeller 300 to rotate so that airflow passes sequentially through the air inlet 202, the heat dissipation component 3, and the air outlet. Thus, when the main unit drives the impeller 300 to rotate, the rotating impeller 300 causes air from outside the housing to enter the electrical control area 201 through the air inlet 202. The airflow entering the electrical control area 201, under the action of the fan, flows through the heat dissipation component 3 to dissipate heat from the heat dissipation component 3. After passing through the heat dissipation component 3, the airflow flows out from the air outlet to the outside of the housing, so that the airflow continuously flows through the heat dissipation component 3 inside the housing, thereby dissipating heat from the heat dissipation component 3.

[0057] In one embodiment, please refer to Figure 1 Along the axial direction of the impeller 300, the air outlet is located on the leeward side of the impeller 300. This facilitates the airflow inside the casing to flow out of the casing from the air outlet under the action of the impeller 300.

[0058] In one embodiment, please refer to Figure 2 The outer casing 200 has an air inlet 202 on at least one side along a preset direction.

[0059] In one embodiment, please refer to Figure 2 The outer casing 200 has air inlets 202 on both sides of the opposite side along the preset direction.

[0060] In one embodiment, please refer to Figure 1 , Figure 2 , Figure 8 as well as Figure 11 The preset directions are intersected in the arrangement direction of the receiving cavity 11 and the heat dissipation vent 12.

[0061] In one embodiment, the preset direction is perpendicular to the arrangement direction of the receiving cavity 11 and the heat dissipation vent 12.

[0062] In one embodiment, please refer to Figure 13 The heating element 2 can be the chopper switch of the chopper circuit 502.

[0063] In one embodiment, please refer to Figure 13 The chopper circuit 502 contains multiple chopper switches.

[0064] In one embodiment, please refer to Figure 13 The chopper circuit 502 contains 6 chopper switches.

[0065] In one embodiment, the chopper switch is a power device.

[0066] In one embodiment, the power device used as a chopper switch can be an insulated gate bipolar transistor (IGBT).

[0067] In one embodiment, the power device serving as the chopper switch can be a metal-oxide-semiconductor field-effect transistor (MOSFET).

[0068] It is understandable that, in addition to being connected to the main control board 5, the other terminals of the heating device 2 may also be interconnected via circuitry, so that the main control board 5, the heating device 2, and the circuit layer form a relatively complete control loop. For example, in terms of circuit structure, it may be necessary to connect the collector terminals of multiple IGBTs together, or it may be necessary to connect the drain terminals of multiple IGBTs together.

[0069] In one embodiment, the heat dissipation assembly 3 includes a circuit layer, an insulating layer, and a heat sink 33. The circuit layer is at least partially connected to the heat-generating device 2. The insulating layer is at least partially located on the side of the circuit layer away from the heat-generating device 2, and the circuit layer is disposed on the insulating layer. The heat sink 33 is disposed on the side of the insulating layer away from the heat-generating device 2, and the insulating layer can transfer the heat dissipated by the heat-generating device 2 to the heat sink 33. The heat sink 33 is at least partially located on the side of the heat dissipation vent 12 away from the receiving cavity 11. With this structure, since the circuit layer is at least partially connected to the heat-generating device 2, the terminals on the heat-generating device 2 that need to be interconnected can be connected together through the circuit layer of the heat dissipation assembly 3 as needed. The heat sink 33 is mostly made of metal and has a certain degree of conductivity. The fact that the heat sink 33 is disposed on the side of the insulating layer away from the heat-generating device 2 allows the insulating layer to insulate the heat sink 33 from the circuit layer and the heat-generating device 2, which can, to a certain extent, prevent the terminals of the heat-generating device 2 from unnecessarily conducting with the heat sink 33, and also prevent the circuit layer from unnecessarily conducting with the heat sink 33. The heat generated by the heating device 2 is transferred to the heat sink 33 through the insulating layer, and the heat is dissipated by the air cooling of the heat sink 33.

[0070] Understandably, the insulating layer can transfer the heat emitted by the heating device 2 to the heat sink 33. The insulating layer has good thermal conductivity and can be made of materials known in the prior art.

[0071] In one embodiment, the insulating layer has a plate-like structure.

[0072] In one embodiment, the insulating layer is in a solid state at room temperature.

[0073] In one embodiment, the insulating layer may be made of silicone grease.

[0074] In one embodiment, please refer to Figure 3 , Figure 4 , Figure 7 as well as Figure 8The heat sink 33 includes a thermally conductive substrate 331 and a heat sink body 332. The thermally conductive substrate 331 is disposed on the side of the insulating layer away from the heat-generating device 2, and the insulating layer can transfer the heat emitted by the heat-generating device 2 to the thermally conductive substrate 331. The heat sink 332 is detachably connected to the side of the thermally conductive substrate 331 away from the insulating layer, and the heat sink body 332 is at least partially located on the side of the heat dissipation vent 12 away from the receiving cavity 11. This structural design, through the thermally conductive substrate 331, circuit layer, insulating layer, and insulating filler 4, effectively encloses the heating device 2 within the receiving cavity 11. Dust, moisture, or conductive debris in the airflow cannot affect the heating device 2 enclosed within the receiving cavity 11. The thermally conductive substrate 331 not only encloses the heating device 2 but also facilitates the installation of the heat sink body 332. The heat sink body 332 is detachably connected to the thermally conductive substrate 331. Even if the heat sink body 332 is removed from the thermally conductive substrate 331, it will not affect the enclosed position of the heating device 2 within the receiving cavity 11, thus eliminating reliance on the heat sink body 332 for enclosing the heating device 2. Even if the heat sink body 332 exposed outside the insulating filler 4 is damaged, it can be removed for maintenance and then reinstalled. The maintenance process of the heat sink body 332 will not damage the related structures enclosing the heating device 2, reducing maintenance costs.

[0075] In one embodiment, thermally conductive filler may be used to fill the space between the thermally conductive substrate 331 and the heat sink body 332. For example, thermally conductive silicone grease may be used to fill the space between the thermally conductive substrate 331 and the heat sink body 332.

[0076] In one embodiment, please refer to Figure 1 , Figure 3 ,as well as Figures 5-11 The thermally conductive substrate 331 is located within the receiving cavity 11. The thermally conductive substrate 331 and the control box 1 form a gap 6 extending circumferentially along the thermally conductive substrate 331. The insulating filler 4 at least partially fills the gap 6 to isolate the heat-generating device 2 from the side of the heat dissipation vent 12 away from the receiving cavity 11. With this structure, the insulating filler 4 at the gap 6 can stably hold the thermally conductive substrate 331 within the receiving cavity 11 of the control box 1, and the heat-generating device 2 is sealed more tightly, reducing the possibility of dust, moisture, and conductive debris affecting the heat-generating device 2 and damaging the circuit.

[0077] In one embodiment, the circuit layer, the insulating layer, and the thermally conductive substrate 331 are connected sequentially. With this structure, the circuit layer, the insulating layer, and the thermally conductive substrate 331 are connected together as a single unit, facilitating the installation of the heat-generating device 2 and enabling modular fabrication of the circuit layer, the insulating layer, and the thermally conductive substrate 331.

[0078] In one embodiment, the circuit layer is made of copper foil.

[0079] In one embodiment, the thermally conductive substrate 331 is an aluminum substrate.

[0080] In one embodiment, the heat sink body 332 is made of aluminum.

[0081] In one embodiment, the heat sink body 332 includes heat dissipation fins.

[0082] In one embodiment, please refer to Figure 4 The heat-generating device 2 is in surface contact with the heat dissipation component 3. This structural configuration provides a large heat transfer area between the heat-generating device 2 and the heat dissipation component 3, which facilitates the conduction of heat generated by the heat-generating device 2 to the heat dissipation component 3.

[0083] In one embodiment, the IGBT is in contact with the heat dissipation component on three sides.

[0084] In one embodiment, the heating element 2 is soldered to the heat dissipation assembly 3.

[0085] In one embodiment, the heating element 2 and the heat dissipation component 3 are welded by surface mount welding.

[0086] In one embodiment, please refer to Figure 7 and Figure 8 The main control board 5 is located inside the housing cavity 11, and the side of the main control board 5 and the heat dissipation vent 12 facing away from the housing cavity 11 is isolated by insulating filler 4. With this structure, the main control board 5 is sealed inside the housing cavity 11, and dust, moisture and conductive debris in the airflow will hardly come into contact with the main control board 5 and cause circuit damage.

[0087] Understandably, the main control board 5 generates relatively little heat, so there is no need to overly consider the heat dissipation of the main control board 5, which is sealed within the containment cavity 11.

[0088] In one embodiment, the insulating filler 4 can solidify from a liquid state to a solid state at room temperature. With this structure, the liquid insulating filler 4 can flow within the receiving cavity 11 to fill the corresponding positions within the cavity 11 according to the shape of the heating device 2, etc., with almost no dead corners, effectively insulating and isolating the heating device 2. After the liquid insulating filler 4 flows and fills the corresponding positions in the receiving cavity 11, it solidifies to remain in a solidified state, thus ensuring that the heating component is well sealed within the receiving cavity 11 and is unaffected by the placement of the control box 1. For example, after the liquid insulating filler 4 solidifies, regardless of whether the heat dissipation vent 12 faces upward, downward, left, or right, or even if the heat dissipation vent 12 is flipped, the solidified insulating filler 4 can still seal the heating device 2 within the receiving cavity 11.

[0089] It should be explained that room temperature refers to the normal indoor temperature without any temperature treatment (e.g., heating, cooling, etc.). For example, room temperature can be 25°C.

[0090] Understandably, the room temperature can be in the range of 10℃ to 30℃.

[0091] In one embodiment, the insulating filler 4 can be a resin. At room temperature, the resin can be liquid, and adding a curing agent to the resin can solidify the liquid resin into a solid state.

[0092] In one embodiment, the heat dissipation vent 12 is facing upwards, and liquid insulating filler 4 is injected into the receiving cavity 11 where the heating device 2 is located to seal the heating device 2 in the receiving cavity 11, and the liquid insulating filler 4 is solidified into a solid state.

[0093] In one embodiment, please refer to Figure 8 , Figure 10 as well as Figure 11 The surface of the thermally conductive substrate 331 facing away from the heat-generating device 2 is the reference surface 3311, and the surface of the insulating filler 4, which solidifies from liquid to solid, facing the heat sink body 332 is the sealing surface 41, which coincides with the reference surface 3311.

[0094] In one embodiment, please refer to Figure 1 and Figure 2 The main unit has a working section 404, which is used to process materials accordingly.

[0095] In one embodiment, please refer to Figure 1 and Figure 2 The main unit includes a motor 401, a transmission component 402, and a grinding wheel 403. The motor 401 drives the transmission component 402 to rotate the grinding wheel 403, which can be used to grind materials. The working part 404 is located on the grinding wheel 403.

[0096] In one embodiment, the grinding wheel 403 can be a grinding wheel.

[0097] In one embodiment, please refer to Figure 1 The motor 401 is connected to the transmission component 402 for driving, and the grinding wheel 403 is sleeved on the output shaft of the transmission component 402 and rotates with the output shaft of the transmission component 402.

[0098] In one embodiment, the transmission component 402 includes two meshing bevel gears, the output shaft of the motor 401 is drivenly connected to one of the bevel gears, and the other bevel gear is sleeved on the output shaft of the transmission component 402.

[0099] In one embodiment, please refer to Figure 1The wind turbine 300 is connected to the motor 401 for driving, and the motor 401 drives the wind turbine 300 to rotate.

[0100] It is understandable that power tools may generate dust and conductive debris during material processing. To avoid dust falling on themselves, operators will try to keep the working part 404 facing downwards. Therefore, in one embodiment, please refer to... Figure 1 , Figure 8 , Figure 10 as well as Figure 11 Along the arrangement of the receiving cavity 11 and the heat dissipation vent 12, the heat dissipation vent 12 is located on the side of the receiving cavity 11 facing the working part 404. With this structure, when the operator operates the power tool with the working part 404 facing downwards, the heat dissipation vent 12 is located on the side of the receiving cavity 11 facing the working part 404, so that the heat dissipation vent 12 is approximately below the receiving cavity 11. Due to factors such as gravity, even if the airflow carrying dust and conductive debris passes through the heat dissipation vent 12 below the receiving cavity 11, the dust and conductive debris in the airflow are unlikely to accumulate in the receiving cavity 11 of the control box 1, reducing the impact of dust and debris on the heat-generating device 2.

[0101] In one embodiment, please refer to Figure 8 and Figure 11 The arrangement direction of the receiving cavity 11 and the heat dissipation vent 12 is as shown by arrow R5 in the figure.

[0102] In one embodiment, please refer to Figure 1 and Figure 12 The outer casing 200 also forms a mounting cavity 204 and a transition vent 205 that connects the mounting cavity 204 and the electrical control area 201. The impeller 300 is located within the mounting cavity 204. When the impeller 300 rotates, the airflow sequentially flows through the air inlet 202, the heat dissipation component 3, the transition vent 205, the mounting cavity 204, and the air outlet. This structural configuration allows the direction of airflow from the electrical control area 201 to the electrical control area 201 to be controlled via the transition vent 205. The position of the transition vent 205 can be set according to actual needs so that the airflow in the electrical control area 201 flows towards the transition vent 205.

[0103] It is understandable that, since the heat dissipation component 3 passes through the heat dissipation vent 12 and is partially located outside the receiving cavity 11, the airflow in the electronic control area 201 needs to flow through the heat dissipation component 3 at the heat dissipation vent 12 as much as possible to improve the heat dissipation efficiency of the heat dissipation component 3 for the heat-generating device 2. Therefore, in one embodiment, please refer to... Figure 1 and Figure 12The transition vent 205 is located between the electrical control area 201 and the mounting cavity 204. Along the arrangement direction of the receiving cavity 11 and the heat dissipation vent 12, the transition vent 205 is located on the side of the receiving cavity 11 facing the heat dissipation vent 12. With this structure, the airflow within the electrical control area 201 needs to exit through the transition vent 205 located between the electrical control area 201 and the mounting cavity 204. Since the arrangement direction of the receiving cavity 11 and the heat dissipation vent 12 is on the side of the receiving cavity 11 facing the heat dissipation vent 12, most of the airflow from the electrical control area 201 to the transition vent 205 will pass through the heat dissipation component 3 at the heat dissipation vent 12, which is beneficial to heat dissipation efficiency.

[0104] In one embodiment, please refer to Figure 1 The motor 401 is located inside the mounting cavity 204, and the airflow flowing to the mounting cavity 204 through the transition air vent 205 can cool the motor 401.

[0105] In one embodiment, please refer to Figure 9 The control system 100 also includes an operating mechanism, which is installed in the housing 200 and connected to the main control board 5. Along the arrangement direction of the receiving cavity 11 and the heat dissipation vent 12, the operating mechanism is located on the side of the control box 1 facing away from the heat dissipation vent 12. With this structure, since the transition vent 205 is located on the side of the receiving cavity 11 facing the heat dissipation vent 12 along the arrangement direction of the receiving cavity 11 and the heat dissipation vent 12, the airflow entering the electrical control area 201 through the air inlet 202 is mainly affected by the transition vent 205 and flows primarily from the side of the control box 1 facing the heat dissipation vent 12. The airflow entering the electrical control area 201 through the air inlet 202 hardly flows through the side of the control box 1 facing away from the heat dissipation vent 12. Positioning the operating mechanism on the side of the control box 1 facing away from the heat dissipation vent 12 minimizes the impact of the airflow flowing through the heat dissipation vent 12 on the operating mechanism, reducing the likelihood of dust, moisture, and conductive debris in the airflow damaging the circuitry connected to the operating mechanism. Furthermore, the operating mechanism is located on the side of the control box 1 away from the heat dissipation vent 12, so that the operating mechanism no longer occupies space on the main control board 5, and the space on the side of the control box 1 away from the heat dissipation vent 12 is fully utilized.

[0106] In one embodiment, please refer to Figure 9 The operating mechanism includes a first operating mechanism 71 and a second operating mechanism 72. The first operating mechanism 71 and the second operating mechanism 72 are respectively disposed at different positions in the housing 200 so that the operator can operate the first operating mechanism 71 and / or the second operating mechanism 72 from different positions in the housing 200.

[0107] In one embodiment, please refer to Figure 9The first operating mechanism 71 is a first start switch, used to start or stop the power tool. The second operating mechanism 72 is a second start switch or a speed control potentiometer.

[0108] In one embodiment, the first operating mechanism 71 and the second operating mechanism 72 are arranged in a front-rear direction, with the first operating mechanism 71 located in front of the second operating mechanism 72.

[0109] In one embodiment, please refer to Figure 1 The direction "forward" is indicated by arrow R1 in the diagram, and the direction "backward" is indicated by arrow R2. The direction "up" or "top" is indicated by arrow R3, and the direction "down" or "bottom" is indicated by arrow R4.

[0110] It is understood that when the first operating mechanism 71 is a first start switch and the second operating mechanism 72 is a second start switch, the operator can start or stop the power tool using the first start switch or the second start switch, depending on the actual operational convenience required. For example, the power tool can be started or stopped using either the first start switch located at the front or the second start switch.

[0111] Understandably, when the first operating mechanism 71 is a first start switch and the second operating mechanism 72 is an adjustment potentiometer, the operator can start and stop the power tool using the first start switch. When the power tool is in the start state, the output speed of the power tool can be adjusted using the speed adjustment potentiometer. For example, if the power tool is an angle grinder, the speed of the grinding wheel can be adjusted using the speed adjustment potentiometer.

[0112] In one embodiment, the three-phase output terminals connected to the main control board 5 are at least partially located on the side of the control box 1 away from the heat dissipation vent 12, and the three-phase output terminals are connected to the motor 401 to supply power to the motor 401. The fact that the three-phase output terminals are partially located on the side of the control box 1 away from the heat dissipation vent 12 can reduce the impact of dust, moisture, and conductive debris in the airflow of the electrical control area 201 on the relative output terminals.

[0113] In one embodiment, please refer to Figure 9 The three-phase output terminals include the U-phase output terminal, the V-phase output terminal, and the W-phase output terminal.

[0114] In one embodiment, please refer to Figure 13 The AC power supply connected to the main control board 5 is rectified by the rectifier circuit 501 of the main control board 5 to convert AC power into DC power.

[0115] In one embodiment, the rectifier circuit 501 performs full-wave rectification of the alternating current.

[0116] It is understandable that the DC power obtained by rectifying AC power through rectifier circuit 501 is pulsating DC power. The characteristic of pulsating DC power is that although the direction of the current remains unchanged, the magnitude of the current will change.

[0117] In one embodiment, please refer to Figure 1 , Figure 3 , Figures 5-7 ,as well as Figure 13 The control system 100 also includes a first electrolytic capacitor 8 connected to the main control board 5. The first electrolytic capacitor 8 is used to suppress the current peak on the output side of the rectifier circuit 501 of the main control board 5. With this structure, the first electrolytic capacitor 8 connected to the main control board 5 suppresses the current peak of the pulsating current on the output side of the rectifier circuit 501, thereby smoothing the pulsating current on the output side of the rectifier circuit 501 of the main control board 5, and thus obtaining DC power that is better suited for chopping processing by the chopper circuit 502.

[0118] In one embodiment, please refer to Figure 9 and Figure 13 The DC power is chopped by the chopper circuit 502 to form the U phase, V phase and W phase, and then supplied to the DC motor 401.

[0119] In one embodiment, please refer to Figure 3 , Figure 5 , Figure 6 as well as Figure 7 The control system 100 also includes a mounting base plate 9, through which the first electrolytic capacitor 8 is mounted to the main control board 5.

[0120] In one embodiment, please refer to Figure 13 The first electrolytic capacitor 8 is connected to the output side of the rectifier circuit 501 and the input side of the chopper circuit 502.

[0121] In one embodiment, please refer to Figure 13 The first electrolytic capacitor 8 is connected in parallel with the rectifier circuit 501 and the chopper circuit 502, respectively.

[0122] In one embodiment, please refer to Figure 13 The first electrolytic capacitor 8 is connected between the rectifier circuit 501 and the chopper circuit 502.

[0123] In one embodiment, please refer to Figure 13 The number of first electrolytic capacitors 8 can be two, and the two first electrolytic capacitors 8 are connected in parallel.

[0124] In one embodiment, please refer to Figure 3 ,as well as Figures 5-8When the main control board 5 is located in the receiving cavity 11, the main control board 5 and the side of the heat dissipation vent 12 away from the receiving cavity 11 are isolated by the insulating filler 4. The first electrolytic capacitor 8 is inserted through the heat dissipation vent 12 so that the first electrolytic capacitor 8 is partially located on the side of the heat dissipation vent 12 away from the receiving cavity 11. With this structural configuration, since the main control board 5 is isolated by the insulating filler 4, the first electrolytic capacitor 8 is connected to the main control board 5, which means that the first electrolytic capacitor 8 is partially isolated by the insulating filler 4. Since the first electrolytic capacitor 8 is partially located on the side of the heat dissipation vent 12 away from the receiving cavity 11, the first electrolytic capacitor 8 is partially exposed outside the insulating filler 4. The part of the first electrolytic capacitor 8 connected to the main control board 5 is isolated by the insulating filler 4, while the part of the first electrolytic capacitor 8 exposed outside has no electrical connection. Dust, moisture and conductive debris in the airflow have almost no significant impact on the part of the first electrolytic capacitor 8 exposed outside the insulating filler 4. The partial exposure of the first electrolytic capacitor 8 outside the insulating filler 4 is conducive to the heat dissipation of the first electrolytic capacitor 8 by the airflow flowing through the heat dissipation vent 12.

[0125] In one embodiment, please refer to Figure 3 ,as well as Figures 5-8 The first electrolytic capacitor 8 is cylindrical, and its axial span is greater than its radial span. The axis of the first electrolytic capacitor 8 is parallel to that of the main control board 5. With this structure, the span of the first electrolytic capacitor 8 along the arrangement direction of the receiving cavity 11 and the heat dissipation vent 12 is approximately the same as its radial span. The space occupied by the first electrolytic capacitor 8 along the arrangement direction of the receiving cavity 11 and the heat dissipation vent 12 is relatively small. This reduces the obstruction of the airflow through the heat dissipation vent 12, minimizing vibration and facilitating smoother airflow through the heat dissipation vent 12 in the electronic control area 201. This, in turn, improves the heat dissipation efficiency of the heat dissipation component 3 at the heat dissipation vent 12.

[0126] In one embodiment, please refer to Figure 3 ,as well as Figures 5-8 The two first electrolytic capacitors 8 are arranged parallel to the main control board 5.

[0127] In one embodiment, the pins connecting the two first electrolytic capacitors 8 to the main control board 5 are immersed in the insulating filler 4. This reduces the possibility of creepage between the two first electrolytic capacitors 8. Exemplarily, the pins connecting the two first electrolytic capacitors 8 to the main control board 5 are immersed in resin.

[0128] In one embodiment, the control system 100 further includes a second electrolytic capacitor connected to the main control board 5 and connected to the constant voltage power supply circuit of the main control board 5. The second electrolytic capacitor is located inside the receiving cavity 11, and the insulating filler 4 isolates the second electrolytic capacitor and the side of the heat dissipation vent 12 away from the receiving cavity 11. Since the current flowing through the second electrolytic capacitor in the constant voltage power supply circuit is small, the heat generated is small. Even though the second electrolytic capacitor is isolated in the receiving cavity 11 by the insulating filler 4, the small amount of heat dissipated by the second electrolytic capacitor can be dissipated in time, preventing the second electrolytic capacitor from overheating and affecting its normal operation.

[0129] In one embodiment, a constant voltage power supply circuit is used to supply power to the control section in the main control board 5. For example, the constant voltage power supply circuit is used to supply power to the processor of the main control board 5.

[0130] In one embodiment, please refer to Figure 1 and Figure 2 The outer casing 200 includes a housing 206 and a tail cover 207 that are connected to each other, and the housing 206 and the tail cover 207 enclose an electronic control area 201.

[0131] In one embodiment, please refer to Figure 1 The mounting cavity 204 is formed in the housing 206.

[0132] In one embodiment, a transition vent 205 is formed in the housing 206.

[0133] In one embodiment, please refer to Figure 2 The air inlet 202 is formed on the tail cover 207.

[0134] In one embodiment, the air outlet is formed in the housing 206.

[0135] In one embodiment, it can be understood that the control system 100 of this application embodiment can be used not only for heat dissipation of the chopper switch of the angle grinder, but also for heat dissipation of other components that have both heat dissipation and insulation requirements.

[0136] In one embodiment, the control box 1 is rectangular in shape.

[0137] In one embodiment, please refer to Figure 12 The power tool also includes a baffle plate 10, which is disposed on the side of the control box 1 away from the heat dissipation vent 12 to restrict the airflow of the power control area 201 from the side of the control box 1 away from the heat dissipation vent 12 to the mounting cavity 204.

[0138] In one embodiment, the first electrolytic capacitor 8 is located behind the chopper switch. This allows for the cooling of components with lower heat generation first, followed by the cooling of components with higher heat generation.

[0139] The various embodiments / implementations provided in this application can be combined with each other without creating contradictions.

[0140] The above are merely preferred embodiments of this application and are not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A power tool characterized by comprising: The application relates to a cooling device, comprising: a shell, which is formed with an electric control area and an air inlet and an air outlet communicating with the electric control area; a control system, which is located in the electric control area; a wind wheel, which is located in the shell; and a main machine, which is used for driving the wind wheel to rotate so that air flows through the air inlet, a heat dissipation assembly and the air outlet in sequence; a wind shield; the control system comprises a control box, which is provided with a containing cavity and a heat dissipation air outlet communicating with the containing cavity; the wind shield is arranged on a side of the control box which is away from the heat dissipation air outlet; a heating device, which is located in the containing cavity, and the heating device is a chopping switch of a chopping circuit; a heat dissipation assembly, which is connected with the heating device, and the heat dissipation assembly is arranged through the heat dissipation air outlet so that the heat dissipation assembly is partially located outside the containing cavity; the heat dissipation assembly comprises: an electric circuit layer, which is at least partially connected with the heating device, and terminals required to be connected with each other on the heating device are connected in common through the electric circuit layer of the heat dissipation assembly; an insulating layer, which is at least partially located on a side of the electric circuit layer which is away from the heating device, and the electric circuit layer is arranged on the insulating layer; and a heat radiator, which is arranged on a side of the insulating layer which is away from the heating device; the heat radiator comprises a heat-conducting base plate and a heat radiator body, the heat-conducting base plate is arranged on a side of the insulating layer which is away from the heating device, and the heat radiator body is detachably connected to a side of the heat-conducting base plate which is away from the insulating layer, the heating device is in surface contact with the heat dissipation assembly; insulating filler, which is located in the containing cavity so as to isolate the heating device from a side of the heat dissipation air outlet which is away from the containing cavity; a surface of the heat-conducting base plate which is away from the heating device is a reference surface, a surface of the heat radiator body which is away from the insulating filler is a sealing surface, and the sealing surface is coincident with the reference surface; and a main control board, which is connected with the heating device, and the main control board is located in the containing cavity, a side of the main control board and the heat dissipation air outlet which is away from the containing cavity is isolated through the insulating filler, the heat-conducting base plate and the main control board are oppositely arranged along the thickness direction of the main control board and are spaced apart; the insulating layer can transfer the heat generated by the heating device to the heat-conducting base plate, and the heat radiator body is at least partially located on a side of the heat dissipation air outlet which is away from the containing cavity; the heat-conducting base plate is located in the containing cavity, the heat-conducting base plate and the control box enclose a gap which extends along the circumferential direction of the heat-conducting base plate, the insulating filler is at least partially filled in the gap so as to isolate the heating device from a side of the heat dissipation air outlet which is away from the containing cavity, and the electric circuit layer, the insulating layer and the heat-conducting base plate are sequentially connected. The insulating filler can be solidified from a liquid state to a solid state at room temperature.

2. The power tool of claim 1, wherein, The main machine has a working part, and along the arrangement direction of the containing cavity and the heat dissipation air outlet, the heat dissipation air outlet is located on a side of the containing cavity which is towards the working part.

3. The power tool of claim 1, wherein, ​ 4. The power tool of claim 1, wherein, The shell is further formed with a mounting cavity and a transition air outlet respectively communicating with the mounting cavity and the electric control area, the wind wheel is located in the mounting cavity, the transition air outlet is located between the electric control area and the mounting cavity, and along the arrangement direction of the containing cavity and the heat dissipation air outlet, the transition air outlet is located on the side of the containing cavity facing the heat dissipation air outlet, when the wind wheel rotates, the air flow sequentially flows through the air inlet, the heat dissipation assembly, the transition air outlet, the mounting cavity and the air outlet.

5. The power tool of claim 4, wherein, The control system further comprises an operating mechanism, the operating mechanism is arranged in the shell and connected with the main control board, and the operating mechanism is located on the side of the control box away from the heat dissipation air outlet.

6. The power tool of claim 1, wherein, The main control board is located in the containing cavity, the main control board and the side of the heat dissipation air outlet away from the containing cavity are isolated by the insulating filler; the control system further comprises a first electrolytic capacitor connected with the main control board, the first electrolytic capacitor is used for inhibiting the current peak value on the output side of the rectifier circuit of the main control board, the first electrolytic capacitor is arranged in the heat dissipation air outlet so that the first electrolytic capacitor is partially located on the side of the heat dissipation air outlet away from the containing cavity, the first electrolytic capacitor is in a cylindrical shape, the axial span of the first electrolytic capacitor is greater than the radial span of the first electrolytic capacitor, and the axial direction of the first electrolytic capacitor is parallel to the main control board.

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