Method and system for characterizing microstructure of ceramic material based on surface height information

Abstract

The application discloses a ceramic material microstructure characterization method and system based on surface height information, and comprises the following steps: after cutting and sampling of ceramic and ceramic matrix composite materials, the cutting surface is pretreated to obtain a ceramic sample; three-dimensional topography information of the surface of a micro area to be measured of the ceramic sample is collected, and after processing through magnification and leveling, height information of the three-dimensional topography of the surface is obtained; based on the height information, the microstructure characteristics of the surface of the micro area to be measured are generated; the application does not need to spray gold / carbon / platinum on the surface of the non-conductive ceramic matrix composite material, does not need to be vacuumized, and avoids micro-damage and reaction caused by the action of a scanning electron microscope electron beam and material surface substances, so that the microstructure structure characterization of the ceramic matrix composite material can be obtained through a non-destructive method, the height information difference of ceramic composition phase abrasion is detected and projected as a two-dimensional image, and the application has principle innovation and good contrast and characterization efficiency.

Description

Technical Field

[0001] This invention relates to the field of material microstructure testing and characterization, and particularly to a method and system for characterizing the microstructure of ceramic materials based on surface height information. Background Technology

[0002] Ceramics and ceramic matrix composites typically combine the properties of different constituent phases to compensate for each other's weaknesses. They possess excellent mechanical properties (hardness, strength, etc.), acid and alkali resistance, oxidation resistance, wear resistance, and unique functional characteristics, and are widely used in various industries such as aerospace, machinery, nuclear industry, and electronic communications. For example, silicon carbide ceramics and silicon carbide-based ceramic composites have advantages such as high hardness, low density, high strength, corrosion resistance, oxidation resistance, and high thermal conductivity, and are often used as high-temperature materials, semiconductor materials, wear-resistant materials, and metallurgical raw materials; alumina ceramics and alumina-based ceramic composites have good high-temperature resistance, mechanical strength, and conductivity, and can be used in thick-film integrated circuits, cermet cutting tools, artificial bones, joints, dentures, corrosion-resistant coatings, aerospace thermal protection systems, engine gaskets, missile nose cones, etc.; zirconia and zirconia-based composites have good mechanical properties, low coefficient of expansion, wear resistance, corrosion resistance, and good chemical stability, and are used in engine parts, pumps, bearings, seals, biological joints, dentures, cutting tools, etc.; boron carbide ceramics and boron carbide-based ceramic composites, due to their ultra-high hardness, are used as bulletproof armor materials for equipment and lightweight bulletproof vests, etc.

[0003] Microstructure testing and characterization techniques for ceramic materials serve as fundamental support technologies for understanding the internal structure of ceramic materials, revealing structure-property relationships, and realizing material design. They play an irreplaceable and crucial role in the entire industrial chain of ceramics and ceramic-based composite materials. Developing novel rapid testing and characterization techniques for the microstructure of ceramic materials is of great significance for accelerating the research and development of ceramics and ceramic-based composite materials. The microstructure characterization of ceramic materials is typically achieved through techniques such as optical microscopy (OM), scanning electron microscopy (SEM), transmission electron microscopy (TEM), and scanning transmission microscopy (STEM). Among these, optical microscopy and scanning electron microscopy can achieve rapid observation of the microstructure of any region in bulk ceramic samples. Scanning electron microscopy utilizes a finely focused electron beam to interact with matter, and through the analysis of backscattered and secondary electron information carrying material structural information, it obtains the analytical characterization of the two-dimensional microstructure of the surface. However, when observing the microstructure of ceramic materials using scanning electron microscopy, it is necessary to perform gold / carbon / platinum sputtering treatment on non-conductive or poorly conductive ceramic materials, observe under high vacuum, and the interaction of the focused electron beam with the matter causes some damage, exhibiting micro-damage characteristics and requiring a long characterization time. Optical microscopy utilizes optical principles (transmission, refraction, reflection, diffraction, etc.) to rapidly observe the microstructure of ceramic materials. Because it eliminates the need for vacuuming, gold / carbon / platinum sputtering, and other processes, it offers rapid and efficient observation. For efficient, non-destructive, and rapid characterization of millimeter-micrometer scale structures, optical microscopy is commonly used. However, when observing uncorroded sample surfaces, optical microscopy sometimes suffers from poor contrast, hindering clear observation of the microstructure. For example, when observing directionally solidified B4C-SiC eutectic ceramic composites, the B4C and SiC phases have similar intensities, resulting in a blurred microstructure that is difficult to identify and characterize. It is noteworthy that the wear resistance of the constituent phases in ceramic materials varies, potentially leading to differences in surface height during polishing. High-precision detection and analysis of these differences in three-dimensional surface morphology can potentially establish a projective characterization of the two-dimensional microstructure. Furthermore, white-light interferometry, a novel technique for characterizing the three-dimensional morphology of sample surfaces, boasts a Z-axis accuracy of up to 0.1 nm, enabling ultra-high-precision detection of surface three-dimensional morphology information. By combining the height information response differences generated during mechanical polishing of ceramic material surfaces with the high-precision detection of surface height information by a white light interferometer three-dimensional profilometer, it is expected that the microstructure of ceramics and ceramic matrix composites can be rapidly tested and analyzed. Summary of the Invention

[0004] To address the problems of existing technologies, the present invention aims to provide a method and system for characterizing the microstructure of ceramic materials based on surface height information. This method involves mechanically grinding and polishing ceramics and ceramic matrix composites, then using a white-light interferometric 3D profilometer to precisely acquire the three-dimensional wear height information of the ceramic sample surface. By setting appropriate display parameters, rapid analysis and characterization of the microstructure of ceramics and ceramic matrix composites can be achieved. Since this invention eliminates the need for surface etching, gold / carbon / platinum spraying, and vacuuming of ceramics and ceramic matrix composites, it offers advantages such as good contrast, speed, and non-destructive characterization, enabling efficient and rapid characterization of the microstructure of ceramics and ceramic matrix composites. This invention reveals the differences in wear resistance response of the constituent phases of ceramic materials, using three-dimensional information acquisition and analysis as the imaging method for microstructure, representing an innovation in imaging principles.

[0005] To achieve the above objectives, this invention provides a method and system for characterizing the microstructure of ceramic materials based on surface height information, comprising the following main steps:

[0006] After cutting and sampling ceramics and ceramic matrix composites, ceramic samples are obtained by pre-treating the cut surfaces.

[0007] The three-dimensional morphology information of the surface of the micro-area to be tested of the ceramic sample is collected. After processing through steps such as magnification and calibration, the height information of the three-dimensional morphology information is obtained.

[0008] Based on height information, the microstructure characteristics of the surface of the micro-region to be measured are generated.

[0009] Preferably, during the cutting and sampling process of ceramics and ceramic matrix composites, the ceramics and ceramic matrix composites include carbide ceramics and ceramic matrix composites, oxide ceramics and ceramic matrix composites, boride ceramics and ceramic matrix composites, nitride ceramics and ceramic matrix composites, etc.

[0010] Preferably, sampling rules are formulated based on the shape, testing requirements, and conductivity of the ceramics and ceramic matrix composites;

[0011] Choose diamond wire cutting or metal wire cutting methods, and cut ceramics and ceramic matrix composites by setting appropriate processing parameters;

[0012] After cutting, ceramics and ceramic matrix composites are mechanically ground and surface polished using a metallographic grinding and polishing machine to obtain ceramic samples.

[0013] Preferably, during the process of obtaining ceramic samples, appropriate types and models of abrasive paper, types of abrasive paste / polishing liquid, and particle sizes are selected based on the hardness and wear resistance of the ceramic and ceramic matrix composite materials.

[0014] The grinding sequence, grinding time, grinding intensity, and grinding and polishing machine speed are set. The ceramics and ceramic matrix composites are mechanically ground and surface polished using a metallographic grinding and polishing machine until the surface of the ceramics and ceramic matrix composites shows a smooth mirror reflection and no obvious scratches or damage are observed under an optical microscope, thus obtaining ceramic samples.

[0015] Preferably, before collecting the three-dimensional morphology information of the surface of the micro-area to be tested of the ceramic sample, the area to be tested is marked as appropriate;

[0016] Collect three-dimensional topographic information of the surface of the area to be measured after positioning and marking.

[0017] Preferably, during the positioning and marking process, if there are obvious defect information in the feature information, positioning and marking may not be performed. The defect information includes cracks, pores, etc.

[0018] This invention also discloses a microstructure characterization system for ceramic materials based on surface height information, comprising:

[0019] The sample preparation control module is used to control the equipment by setting sample preparation process parameters, cut and sample ceramics and ceramic matrix composites, and pre-treat the cut surfaces to obtain ceramic samples;

[0020] The data acquisition module is used to acquire three-dimensional morphological information of the surface of the test area of ​​the ceramic sample;

[0021] The data processing and characterization module is used to perform magnification, calibration and other steps on the three-dimensional topography information to obtain the height information of the three-dimensional topography information and generate the microstructure characteristics of the surface of the area to be tested.

[0022] Preferably, the ceramic material microstructure characterization system further includes a positioning marker module;

[0023] The marking module is used to locate the area to be measured and determine whether there is significant feature information. When the judgment result is yes, the surface of the micro area to be measured does not need to be marked. When the judgment result is no, the surface of the micro area to be measured is marked.

[0024] The present invention discloses the following technical effects:

[0025] Compared with the imaging principles of optical microscopes and scanning electron microscopes, the principle is different. It is based on the difference in wear resistance of each phase of the ceramic composition, which leads to the difference in the three-dimensional surface wear height information of each phase during the polishing process. This information is detected and projected into two-dimensional microstructure information to obtain the microstructure characterization of the micro-area. Therefore, the imaging principle of this invention is innovative.

[0026] Compared with scanning electron microscopy, it eliminates the need for gold / carbon / platinum spraying on the surface of non-conductive ceramic matrix composites, eliminates the need for vacuuming, and avoids micro-damage and reactions caused by the interaction between the electron beam of the scanning electron microscope and the material surface. In other words, the microstructure characterization of ceramic matrix composites can be obtained through non-destructive methods.

[0027] Compared with optical microscopy, which suffers from poor contrast and difficulty in clearly observing the microstructure of some ceramic materials (such as B4C-SiC eutectic ceramic self-generated composites), this invention detects the differences in wear height information of ceramic phases and projects them into a two-dimensional contour map. This invention still has good contrast and characterization efficiency for such ceramic materials with poor contrast (such as B4C-SiC eutectic ceramic self-generated composites). Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a flowchart illustrating the implementation of a method and system for characterizing the microstructure of ceramic materials based on surface height information, as described in this invention.

[0030] Figure 2 This is a contour map of the three-dimensional surface morphology of a local area of ​​a directionally solidified B4C-SiC eutectic ceramic matrix composite material, acquired using a white light interferometer.

[0031] Figure 3 Contour map of the micro-area to be observed for directional solidification of B4C-SiC eutectic ceramic matrix composite material ( Figure 2 (Micro-area magnification of data acquired by white light interferometer 3D profilometer);

[0032] Figure 4 Three-dimensional view of the micro-area to be observed in the directionally solidified B4C-SiC eutectic ceramic matrix composite material ( Figure 3 (Micro-area corresponds to 3D view);

[0033] Figure 5 For the height variation of the micro-region under observation along the cross section of the directionally solidified B4C-SiC eutectic ceramic matrix composite material (along... Figure 3 (middle section line);

[0034] Figure 6 Scanning electron microscope (SEM) images of micro-regions corresponding to directional solidification of B4C-SiC eutectic ceramic matrix composites. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0036] like Figures 1-6 As shown, this invention provides a method and system for characterizing the microstructure of ceramic materials based on surface height information, comprising the following main steps:

[0037] After cutting and sampling ceramics and ceramic matrix composites, ceramic samples are obtained by pre-treating the cut surfaces.

[0038] The three-dimensional morphology information of the micro-area surface to be tested of the ceramic sample is collected. After processing through steps such as magnification and calibration, the height information of the three-dimensional morphology information is obtained.

[0039] Based on height information, the microstructure characteristics of the surface of the micro-region to be measured are generated.

[0040] More preferably, during the cutting and sampling process of ceramics and ceramic matrix composites, the ceramics and ceramic matrix composites include carbide ceramics and ceramic matrix composites, oxide ceramics and ceramic matrix composites, boride ceramics and ceramic matrix composites, nitride ceramics and ceramic matrix composites, etc.

[0041] More preferably, sampling rules are formulated based on the shape, testing requirements, and conductivity of the ceramics and ceramic matrix composites;

[0042] Choose diamond wire cutting or metal wire cutting methods, and cut ceramics and ceramic matrix composites by setting appropriate processing parameters;

[0043] After cutting, ceramics and ceramic matrix composites are mechanically ground and surface polished using a metallographic grinding and polishing machine to obtain ceramic samples.

[0044] More preferably, during the process of obtaining ceramic samples, appropriate types and models of abrasive paper, types of abrasive paste / polishing liquid, and particle sizes are selected based on the hardness and wear resistance of the ceramic and ceramic matrix composite materials.

[0045] The grinding sequence, grinding time, grinding intensity, and grinding and polishing machine speed are set. The ceramics and ceramic matrix composites are mechanically ground and surface polished using a metallographic grinding and polishing machine until the surface of the ceramics and ceramic matrix composites shows a smooth mirror reflection and no obvious scratches or damage are observed under an optical microscope, thus obtaining ceramic samples.

[0046] More preferably, the micro-area to be tested in the collected ceramic sample is located and marked.

[0047] More preferably, during the positioning and marking process, if there is defect information with obvious characteristics in the feature information, positioning and marking processing may not be performed. The defect information includes cracks and pores.

[0048] This invention also discloses a microstructure characterization system for ceramic materials based on surface height information, comprising:

[0049] The sample preparation control module is used to control the equipment by setting sample preparation process parameters, to cut and sample ceramics and ceramic matrix composites, and to pre-treat the cut surfaces to obtain ceramic samples.

[0050] The data acquisition module is used to acquire the three-dimensional morphology information of the surface of the micro-area to be tested in the ceramic sample;

[0051] The data processing and characterization module is used to perform magnification, calibration, and other steps on the three-dimensional morphology information to obtain the height information of the three-dimensional morphology information; it is used to generate the microstructure characteristics of the surface of the micro-area to be measured based on the height information.

[0052] More preferably, the ceramic material microstructure characterization system further includes a labeling module;

[0053] The marking module is used to locate the area to be tested and determine whether the sample to be tested needs to be marked. When the sample has significant defects or other characteristic areas, it is not necessary to mark the surface of the micro-area to be tested. When there are no significant defects, the surface of the micro-area to be tested is marked.

[0054] This invention provides a method and system for characterizing the microstructure of ceramic materials based on surface height information. By mechanically grinding and polishing ceramics and ceramic matrix composites, and based on the differences in wear resistance of each phase in the composite ceramic, combined with the rapid acquisition of three-dimensional morphological differences in the surface of each phase in the micro-region, the method rapidly characterizes the two-dimensional microstructure features of the corresponding micro-region through processes such as leveling the observed area and adjusting the Z-axis height display range. This invention has the advantages of eliminating the need for gold / carbon / platinum sputtering, vacuuming, and etching of the sample, and enabling non-destructive testing of the ceramic surface, thus achieving rapid testing and characterization of the microstructure of ceramics and ceramic matrix composites.

[0055] The present invention adopts the following specific implementation scheme:

[0056] S1, sampling and cutting of ceramics and ceramic matrix composites;

[0057] S2 utilizes a fully automatic metallographic grinding and polishing machine to perform mechanical grinding and surface polishing on ceramics and ceramic matrix composites;

[0058] S3. Use a microhardness tester or nanoindenter to perform localization characterization on the ceramic sample, depending on the situation.

[0059] S4. High-precision acquisition of three-dimensional morphology information of the surface of the micro-area to be measured is achieved using a white light interferometer three-dimensional profilometer.

[0060] S5. Using data processing software, the test results of the three-dimensional morphology of the surface of the micro-area to be measured are amplified and leveled.

[0061] S6, by setting the Z-axis display height range, obtains the microstructure display of the micro-area to be tested in the ceramic material.

[0062] In step S1, sampling and cutting of ceramics and ceramic matrix composites are performed, specifically including:

[0063] Based on the shape, testing requirements, and conductivity of ceramics and ceramic matrix composites, appropriate sampling rules are formulated, diamond wire cutting or metal wire cutting methods are selected, and appropriate processing parameters are set to cut ceramics and ceramic matrix composites.

[0064] In step S2, a fully automatic metallographic grinding and polishing machine is used to mechanically grind and polish the ceramics and ceramic matrix composites, specifically including:

[0065] Based on the properties of ceramics and ceramic matrix composites such as hardness and wear resistance, select appropriate types and models of abrasive paper, types and particle sizes of abrasive paste / polishing liquid, set appropriate grinding sequence, grinding time, grinding intensity, and grinding and polishing machine speed, and use a fully automatic metallographic grinding and polishing machine to mechanically grind and polish the ceramics and ceramic matrix composites. When the sample surface shows a mirror-like smoothness and no obvious scratches or damage are observed under an optical microscope, the surface polishing requirements are met.

[0066] In step S3, a microhardness tester or nanoindenter is used as needed to perform localization characterization on the ceramic sample, specifically including:

[0067] As needed, use a micro Vickers hardness tester or a nanoindenter to mark the ceramics and ceramic matrix composites.

[0068] When there are obvious identifiable feature areas on the polished surface of ceramic materials, no marking is required, such as obvious cracks or pores.

[0069] In step S4, a white light interferometer is used to collect the three-dimensional morphology information of the surface of the micro-area to be measured, specifically including:

[0070] Place the sample to be tested under the microscope lens of the white light interferometer 3D profilometer (Bruker Contour GT / K) and adjust the instrument status; use the white light interferometer 3D profilometer to set appropriate acquisition parameters to obtain the 3D height information of the surface of the ceramic material micro-area with different precision;

[0071] In step S5, the data processing software (Vision64) is used to perform magnification, calibration and other processing on the collected results to obtain the three-dimensional height information distribution of the local area to be observed.

[0072] In step S6, a suitable Z-axis display height range is set to obtain the display and characterization of the microstructure characteristics of the corresponding micro-area on the surface of the ceramic matrix composite material;

[0073] The ceramics and ceramic matrix composites mentioned in this invention include carbide ceramics and ceramic matrix composites, oxide ceramics and ceramic matrix composites, boride ceramics and ceramic matrix composites, nitride ceramics and ceramic matrix composites, etc.

[0074] The rapid characterization method mentioned in this invention will be described in detail below with specific implementation examples.

[0075] Example 1: This implementation case uses a self-generated B4C-SiC eutectic ceramic composite material with high gradient directional solidification in a light-suspended zone as the object. The microstructure characteristics of this ceramic matrix composite material are characterized and analyzed, such as... Figure 1 The implementation process is shown below, and includes the following specific steps:

[0076] Step 1: Rod-shaped directional solidified B4C-SiC eutectic ceramic self-generated composite material is prepared by using high gradient xenon lamp light source light suspension zone melting directional solidification melting technology. According to the shape, conductivity and testing requirements of the ceramic material sample, sampling rules are set, and wire cutting is used to set appropriate cutting processing parameters to obtain the cross section of the central region of the rod.

[0077] Step two: Select silicon carbide sandpaper and silicon dioxide (or diamond) polishing slurry, wherein the sandpaper grades are 100#, 200#, 400#, 800#, 1200#, 1500#, and 2000#, and the particle sizes of the silicon dioxide (or diamond) polishing slurry are 2.0μm, 1.5μm, and 0.5μm, respectively. Set the mechanical grinding and polishing process and the speed of the fully automatic metallographic grinding and polishing machine (50rpm~300rpm) to obtain the directionally solidified B4C-SiC eutectic ceramic self-generated composite material through mechanical grinding and polishing. Obtain a polished surface with a mirror-smooth surface and no obvious scratches observed under an optical microscope, which meets the requirements of the present invention for sample testing.

[0078] Step 3: Using a micro Vickers hardness tester or nanoindenter, mark the sample according to the material characteristics. If there are obvious characteristic areas, positioning marks are not necessary.

[0079] Step 4: Using a white light interferometer (Bruker Contour GT / K), adjust the interference fringes and set the acquisition parameters to quickly acquire the three-dimensional height information of a local area on the surface of the directional solidified B4C-SiC eutectic ceramic to be observed.

[0080] Step 5: Using data processing software (Vision64), open the OPDX format acquisition results, zoom in on the area to be observed in contour map mode, and save, open, and level the micro-area to be observed.

[0081] Step 6: Using data processing software (Vision64), set the height display range of the Z-axis in contour map mode, adjust the color, contrast, etc., and output the image to obtain a rapid characterization of the microstructure of the micro-area to be observed.

[0082] like Figure 2 The image shown is a contour map of the three-dimensional height information collection results for a local area; Figure 3 Contour map of the micro-area to be observed ( Figure 2 (Magnified contour map of the micro-area); Figure 4 This is a three-dimensional view of the micro-area to be observed. It can be seen that the height differences between different phases are significant after mechanical polishing. By combining ceramic mechanical polishing with the acquisition of three-dimensional height information using a white light interferometer, direct observation of different phase compositions can be achieved. For example... Figure 5 As shown, along Figure 3 The changes in the height information of the midsection line reveal significant differences in height information among different constituent phases. Furthermore, although the midsection line height information includes both constituent phase height information and macroscopic sample profile information (~Δh), within this micro-region, the influence of the macroscopic profile information on Δh is only about 0.1 μm, far smaller than the midsection line length L and the microstructure size (~10 μm). Therefore, the influencing factors are negligible, enabling direct and rapid observation of the microstructure within this micro-region. Figure 6 The image shown is a scanning electron microscope image of the corresponding micro-region, compared with... Figure 3 The results show good agreement, indicating that the method of the present invention can be used to directly achieve rapid observation and characterization of the microstructure of ceramics and ceramic matrix composites.

[0083] In the description of this invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0084] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0085] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A method for characterizing the microstructure of a ceramic material based on surface height information, characterized in that, The method comprises the following steps: After cutting and sampling the ceramic material, the ceramic sample is obtained by pre-treating the cutting surface; during the process of obtaining the ceramic sample, the type and model of the grinding sandpaper, the type and particle size of the grinding paste / polishing liquid are selected according to the hardness and wear resistance of the ceramic material; The ceramic material is mechanically ground and surface polished by a metallographic polishing machine to obtain the ceramic sample until the surface of the ceramic material presents mirror reflection smoothness and no obvious scratch damage is observed under an optical microscope, by setting appropriate grinding sequence, grinding time, grinding intensity and polishing machine speed. The three-dimensional topography information of the surface of the micro area to be measured of the ceramic sample is collected by using a white light interference three-dimensional profilometer, and the height information of the three-dimensional topography information is obtained after amplification and leveling steps. Based on the height information, the microstructure features of the surface of the micro area to be measured are generated, specifically including: the difference in wear height information of the three-dimensional surfaces of each phase is caused by the difference in wear resistance of each phase of the ceramic composition during the polishing process, the information is detected and projected as two-dimensional microstructure information, and the microstructure of the micro area is obtained.

2. The ceramic material microstructure characterization method based on surface height information according to claim 1, wherein: According to the shape, test requirements and electrical conductivity of the ceramic material, a sampling rule is formulated; The ceramic material is cut by setting appropriate processing parameters through diamond wire cutting or metal wire cutting; The ceramic material after cutting is mechanically ground and surface polished by a metallographic polishing machine to obtain the ceramic sample.

3. The ceramic material microstructure characterization method based on surface height information according to claim 1, wherein: Before collecting the three-dimensional topography information of the surface of the micro area to be measured of the ceramic sample, the micro area to be measured is marked according to the situation; The three-dimensional topography information of the surface of the micro area to be measured after marking is collected.

4. The ceramic material microstructure characterization method based on surface height information according to claim 3, wherein: During the marking process, if there is obvious feature information in the area to be marked, the marking is not performed, wherein the defect information includes cracks and pores.

5. The ceramic material microstructure characterization method based on surface height information according to claim 3, wherein: The ceramic material microstructure characterization system based on surface height information for executing the ceramic material microstructure characterization method comprises: A sample preparation control module is used to control the equipment by setting sample preparation process parameters to cut and sample the ceramic material, and then pre-treat the cutting surface to obtain the ceramic sample; A data acquisition module is used to collect the three-dimensional topography information of the surface of the micro area to be measured of the ceramic sample; A data processing and characterization module is used to amplify and level the three-dimensional topography information to obtain the height information of the three-dimensional topography information, and generate the microstructure features of the surface of the micro area to be measured.

6. The method of claim 5, wherein the method further comprises: querying, observing and analyzing the information of the region to be measured, and providing a positioning reference; if there is a typical feature shape in the region to be measured on the surface of the sample, no positioning mark is made; otherwise, a positioning mark is made.

7. The method of claim 5, wherein the method further comprises: a marking module.

8. The method of claim 7, wherein the marking module is used to provide a positioning reference for the information query, observation and analysis of the region to be measured, and if there is a typical feature shape in the region to be measured on the surface of the sample, no positioning mark is made; otherwise, a positioning mark is made.

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