Electronic package and method for manufacturing the same

Abstract

The present application relates to an electronic package and a method for manufacturing the same. The electronic package comprises a carrier, an electronic component, a plurality of conductive components, a metal sheet and a molding layer. The electronic component is disposed on the carrier and electrically connected to the carrier. The plurality of conductive components are disposed on the carrier and electrically connected to a ground circuit on the carrier. The metal sheet is disposed above the electronic component and is in electrical contact with the plurality of conductive components. The molding layer is formed between the carrier and the metal sheet and covers the electronic component and the plurality of conductive components. The present application further provides a method for manufacturing the above-mentioned electronic package.

Description

Technical Field

[0001] The present application relates to the field of semiconductors, and in particular to an electronic package and a method for manufacturing the same. Background Art

[0002] The conventional method of forming an electromagnetic shielding structure on an electronic package is to first set a plurality of metal pillars arranged in a fence shape around the electronic component, and then use a sealing material to form a molding layer covering the electronic component and the metal pillars. After that, the top of the molding layer is ground to expose the metal pillars, and then a metal layer is plated to combine it with the metal pillars.

[0003] The traditional method requires grinding away part of the forming layer and plating a metal layer, which not only wastes materials but also increases the manufacturing process. Summary of the invention

[0004] Based on this, it is necessary to provide an electronic package and a method for manufacturing the same in order to address the problems of wasting materials and increasing manufacturing processes in traditional methods.

[0005] The present application provides an electronic package with an electromagnetic shielding structure and a manufacturing method thereof, which does not waste materials and does not increase manufacturing processes.

[0006] An electronic package comprises a carrier, an electronic component, a plurality of conductive components, a metal sheet and a molding layer. The electronic component is arranged on the carrier and electrically connected to the carrier. The plurality of conductive components are arranged on the carrier and electrically connected to a ground circuit on the carrier. The plurality of conductive components comprise a plurality of first conductive components and a plurality of second conductive components. The plurality of first conductive components are arranged side by side and surround the electronic component. The plurality of second conductive components are arranged side by side and surround the plurality of first conductive components, and respectively face the gaps between two adjacent ones of the plurality of first conductive components. The metal sheet is arranged above the electronic component and electrically contacts the plurality of conductive components. The molding layer is formed between the carrier and the metal sheet and covers the electronic component and the plurality of conductive components.

[0007] The manufacturing method of an electronic package in one embodiment of the present application includes: preparing a carrier; setting an electronic component on the carrier and electrically connecting the electronic component to the carrier; setting multiple conductive components on the carrier and electrically connecting the multiple conductive components to the ground circuit on the carrier; providing a metal sheet, wherein the metal sheet is arranged facing the electronic component and the multiple conductive components; providing a sealing material and heating the sealing material to melt it; making the metal sheet electrically contact with the multiple conductive components; and curing the sealing material to form a molded layer, wherein the molded layer is formed between the metal sheet and the carrier and covers the electronic component and the multiple conductive components.

[0008] In the method for manufacturing an electronic package in one embodiment of the present application, the electronic component is shielded by the metal sheet, and the plurality of conductive components are used to introduce the received electromagnetic signal into the grounding end of the carrier in a grounding manner. Therefore, the electronic package manufactured according to the method for manufacturing an electronic package of the present application can reduce the chance of the electronic component in the package being subject to electromagnetic interference during operation, thereby maintaining the normal operation of the electronic package.

[0009] The manufacturing method of the electronic package provided in the present application does not need to grind off part of the molding layer and implement additional sputtering or coating processes to form an electromagnetic shielding structure, thereby avoiding material waste and reducing manufacturing processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the following will briefly introduce the drawings required for use in the embodiments or the conventional technology description. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. When read in conjunction with the drawings, the structure of the present application is best understood from the following detailed description. It should be noted that according to standard practices in the industry, various components are not drawn to scale. In fact, for the sake of clarity, the sizes of various components can be arbitrarily increased or decreased.

[0011] Figure 1 It is a three-dimensional schematic diagram of a first embodiment of the electronic package of the present application.

[0012] Figure 2 It is a cross-sectional schematic diagram of the first embodiment of the electronic package of the present application.

[0013] Figure 3 FIG. 1 is another cross-sectional schematic diagram of the first embodiment of the electronic package of the present application.

[0014] Figure 4 It is a three-dimensional schematic diagram of a second embodiment of the electronic package of the present application.

[0015] Figure 5 It is a cross-sectional schematic diagram of a second embodiment of the electronic package of the present application.

[0016] Figure 6 It is a three-dimensional schematic diagram of a third embodiment of the electronic package of the present application.

[0017] Figure 7 It is a cross-sectional schematic diagram of a third embodiment of the electronic package of the present application.

[0018] Figure 8It is a three-dimensional schematic diagram of a fourth embodiment of the electronic package of the present application.

[0019] Fig. 9 It is a cross-sectional schematic diagram of a fourth embodiment of the electronic package of the present application.

[0020] Fig.10 For production Figure 1 The schematic diagram of the step structure of the electronic package shown.

[0021] Fig.11 For production Figure 1 The schematic diagram of the step structure of the electronic package shown.

[0022] Fig.12 For production Figure 1 The schematic diagram of the step structure of the electronic package shown.

[0023] Fig.13 For production Figure 1 The schematic diagram of the step structure of the electronic package shown.

[0024] Fig.14 For production Figure 1 The schematic diagram of the step structure of the electronic package shown.

[0025] Fig.15 For production Figure 1 The schematic diagram of the step structure of the electronic package shown.

[0026] Description of reference numerals:

[0027] 110 Carrier Board

[0028] 111 First Surface

[0029] 112 Second Surface

[0030] 114 Conductive circuit layer

[0031] 120 Electronic components

[0032] 130 Conductive Column

[0033] 132 Solder Bumps

[0034] 150 Metal Sheet

[0035] 160 Metal Wire

[0036] 161 First Metal Wire

[0037] 162 Second Metal Wire

[0038] 170 Forming layer

[0039] 175 Sealing Materials

[0040] 260 vertical wire

[0041] 261 First Metal Wire

[0042] 262 Second Metal Wire

[0043] 360 Conductive Column

[0044] 361 First Conductive Pillar

[0045] 362 Second conductive column

[0046] 460 Conductive Block

[0047] 461 First conductive block

[0048] 462 second conductive block DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0050] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. are based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0051] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0052] Please refer to Figures 1 to 3The present application provides an electronic package that includes a carrier board 110 in a first embodiment. A conductive circuit layer 114 is disposed on the carrier board 110. The carrier board 110 has a first surface 111 and a second surface 112 opposite to each other, and the first surface 111 and the second surface 112 are located in different planes. For example, the first surface 111 is a top surface and the second surface 112 is a bottom surface, but it is not limited thereto.

[0053] An electronic component 120 is disposed on the first surface 111 of the carrier 110. The electronic component 120 is electrically connected to the carrier 110. The electronic component 120 may be an active component or a passive component.

[0054] In a specific embodiment, the electronic component 120 may be a chip, and is connected to the carrier 110 using a flip chip technology. Further, the electronic component 120 has an active surface, on which a plurality of conductive pillars 130 are disposed, and each of the plurality of conductive pillars 130 is fixed to the first surface 111 of the carrier 110 using a solder bump 132. The electronic component 120 is electrically connected to the carrier 110 using the plurality of conductive pillars 130.

[0055] A plurality of conductive components are further disposed on the first surface 111 of the carrier 110 , and are electrically connected to a ground circuit on the carrier 110 through a conductive circuit layer 114 .

[0056] In a specific embodiment, the plurality of conductive elements are formed by bonding wires in a wire bonding process, so the plurality of conductive elements are formed by metal wires 160 and present an arched body, i.e., an arc shape, and both ends of each of the metal wires 160 are bonded to the carrier 110. The height of the plurality of arc-shaped metal wires 160 is greater than the height of the electronic component 120, and is disposed around the electronic component 120.

[0057] In one embodiment, the plurality of metal wires 160 are arranged like a fence around the electronic component 120 .

[0058] In another specific embodiment of the present application, the plurality of metal wires 160 include a plurality of first metal wires 161 and a plurality of second metal wires 162. The plurality of second metal wires 162 are arranged around the plurality of first metal wires 161. Further, two closed rings can be defined on the carrier 110, namely a first ring and a second ring. The first ring and the second ring are substantially rectangular, wherein the first ring surrounds the electronic component 120, and the second ring surrounds the first ring and the electronic component 120. The plurality of first metal wires 161 are arranged side by side in the shape of the first ring. The plurality of second metal wires 162 are arranged side by side in the shape of the second ring, and face the gaps between two adjacent ones of the plurality of first metal wires 161, respectively.

[0059] A metal sheet 150 is disposed above the electronic component 120, and its bottom surface is in direct contact with the arc-shaped top of the arc-shaped plurality of metal wires 160 to achieve the purpose of electrical contact with the plurality of metal wires 160. A molding layer 170 is also formed on the first surface 111 of the carrier 110. The molding layer 170 is a sealing material. The molding layer 170 is formed between the metal sheet 150 and the carrier 110, and covers the plurality of metal wires 160 and the electronic component 120.

[0060] In a specific embodiment, the sealing material may be epoxy resin.

[0061] According to the electronic package provided by the present application, the plurality of conductive components may also be composed of other forms of conductive components, that is, Figures 1 to 3 The arc-shaped metal wire 160 can be replaced by other forms of conductive components.

[0062] Furthermore, the conductive component may be composed of conductive components in the form of strips or blocks. Figure 4 and Figure 5, which are respectively a three-dimensional schematic diagram and a cross-sectional schematic diagram of a second embodiment of the electronic package of the present application. The conductive component shown in the figure is composed of a plurality of vertical metal wires 260, which are arranged roughly vertically on the carrier 110. The lower ends of the plurality of vertical metal wires 260 are fixed on the carrier 110 and are electrically connected to the ground circuit on the carrier 110 through the conductive circuit layer 114. The upper ends of the plurality of vertical metal wires 260 directly contact the bottom surface of the metal sheet 150 to achieve the purpose of electrical contact with the metal sheet 150. The plurality of vertical metal wires 260 include a plurality of first metal wires 261 and a plurality of second metal wires 262. The plurality of first metal wires 261 are arranged around the electronic component 120. The plurality of second metal wires 262 are arranged around the electronic component 120 and the plurality of first metal wires 261. The plurality of first metal wires 261 are arranged side by side to form a ring-like fence. The second metal wires 262 are arranged side by side to form a ring-shaped fence and respectively face the gap between two adjacent ones of the first metal wires 261 .

[0063] See also Figure 6 and Figure 7 , Figure 6 and Figure 7 The three-dimensional schematic diagram and the cross-sectional schematic diagram of the third embodiment of the electronic package provided by the present application are respectively shown. The conductive component shown in the figure is composed of a plurality of columnar conductive columns 360, which are arranged roughly vertically on the carrier 110. The lower ends of the plurality of conductive columns 360 are fixed on the carrier 110 and are electrically connected to the ground circuit on the carrier 110 through the conductive circuit layer 114. The upper ends of the plurality of conductive columns 360 directly contact the bottom surface of the metal sheet 150 to achieve the purpose of electrical contact with the metal sheet 150. The plurality of conductive columns 360 include a plurality of first conductive columns 361 and a plurality of second conductive columns 362. The plurality of first conductive columns 361 are arranged around the electronic component 120. The plurality of second conductive columns 362 are arranged around the electronic component 120 and the plurality of first conductive columns 361. The plurality of first conductive columns 361 are arranged side by side to form a ring-like fence. The second conductive pillars 362 are arranged side by side to form a ring-shaped fence and respectively face the gaps between two adjacent ones of the first conductive pillars 361 .

[0064] See also Figure 8 and Fig. 9 , Figure 8 and Fig. 9They are respectively a three-dimensional schematic diagram and a cross-sectional schematic diagram of the fourth embodiment of the electronic package of the present application. The conductive component shown in the figure is composed of a plurality of spherical conductive blocks 460. The bottom of the plurality of conductive blocks 460 is fixed on the carrier 110 and electrically connected to the ground circuit on the carrier 110 through the conductive circuit layer 114. The top of the plurality of conductive blocks 460 directly contacts the bottom surface of the metal sheet 150 to achieve the purpose of electrical contact with the metal sheet 150. The plurality of conductive blocks 460 include a plurality of first conductive blocks 461 and a plurality of second conductive blocks 462. The plurality of first conductive blocks 461 are arranged around the electronic component 120. The plurality of second conductive blocks 462 are arranged around the electronic component 120 and the plurality of first conductive blocks 461. The plurality of first conductive blocks 461 are arranged side by side to form a ring-shaped fence. The plurality of second conductive blocks 462 are arranged side by side to form a ring-shaped fence, and face the gap between two adjacent ones of the plurality of first conductive blocks 461 respectively.

[0065] See also Figures 10 to 15 , Figures 10 to 15 For production Figure 1 The schematic diagram of the step structure of the electronic package shown.

[0066] like Fig.10 As shown, according to the manufacturing method of the electronic package of the present application: first, prepare a carrier 110, the carrier 110 has a first surface 111 and a second surface 112 opposite to each other, and the first surface 111 and the second surface 112 are located in different planes. The carrier 110 is provided with a conductive circuit layer 114.

[0067] like Fig.11 As shown, according to the manufacturing method of the electronic package of the present application, an electronic component 120 is disposed on the first surface 111 of the carrier 110 and is electrically connected to the carrier 110 .

[0068] The electronic component 120 may be an active component or a passive component. In a specific embodiment, the electronic component 120 may be a chip and connected to the carrier 110 using flip chip technology. Further, a plurality of conductive pillars 130 are disposed on the active surface of the electronic component 120. The plurality of conductive pillars 130 are each fixed to the first surface 111 of the carrier 110 using a solder bump 132. Therefore, the electronic component 120 is electrically connected to the carrier 110 using the plurality of conductive pillars 130.

[0069] like Fig.12As shown, according to the manufacturing method of the electronic package of the present application, a plurality of metal wires 160 as conductive components are arranged around the electronic component 120 on the first surface 111 of the carrier 110. The plurality of metal wires 160 are electrically connected to the grounding circuit on the carrier 110 through the conductive circuit layer 114, and the height thereof is greater than the height of the electronic component 120.

[0070] In one embodiment, the plurality of metal wires 160 are formed by wire bonding, and both ends of each of the metal wires 160 are bonded to the carrier 110. The height of the plurality of arc-shaped metal wires 160 is greater than the height of the electronic component 120.

[0071] In another specific embodiment of the present application, the plurality of metal wires 160 include a plurality of first metal wires 161 and a plurality of second metal wires 162. The plurality of second metal wires 162 are arranged around the plurality of first metal wires 161, and the arrangement method is as follows: Figure 1 and 3 It should be noted that, in order to simplify the diagram, Fig.12 The metal line 160 behind the electronic component 120 is omitted.

[0072] like Fig.13 As shown, according to the method for manufacturing an electronic package of the present application, Fig.12 The structure shown is inverted, and a metal sheet 150 is placed underneath it so that the metal sheet 150 faces the electronic component 120 and the plurality of metal lines 160. Then, a sealing material 175 is placed on the metal sheet 150 so that the sealing material 175 is located between the metal sheet 150 and the carrier 110.

[0073] In a specific embodiment, the sealing material 175 may be epoxy resin. In addition, the sealing material 175 may be a powder or block sealing material. Fig.13 The sealing material 175 shown is a powdered sealing material.

[0074] like Fig.14 As shown, according to the method for manufacturing an electronic package of the present application, the metal sheet 150 is heated to melt the sealing material 175 thereon, and at this time, the sealing material 175 is transformed into a liquid state and expands in volume.

[0075] like Fig.15As shown, according to the manufacturing method of the electronic package of the present application, the carrier 110 is brought close to the metal sheet 150 so that the metal sheet 150 is in direct contact with the arc-shaped portions of the plurality of metal wires 160 to achieve the purpose of electrical contact with the plurality of metal wires 160. After the sealing material 175 is solidified and cooled to form the molding layer 170 covering the plurality of metal wires 160 and the electronic component 120, the electronic package of the present application is completed.

[0076] about Figures 4 to 9 The electronic package shown is made in a similar manner Figure 1 Further, the plurality of vertical metal lines 260, the plurality of conductive pillars 360 or the plurality of conductive blocks 460 as the plurality of conductive components are respectively Figures 4 to 9 The plurality of vertical metal lines 260, the plurality of conductive pillars 360 or the plurality of conductive blocks 460 are disposed on the carrier 110 in the manner shown and are electrically connected to the ground circuit on the carrier 110 through the conductive circuit layer 114. The plurality of vertical metal lines 260, the plurality of conductive pillars 360 or the plurality of conductive blocks 460 are disposed to surround the electronic component 120, and the height thereof is greater than the height of the electronic component 120.

[0077] In order Figures 13 to 15 In the manufacturing method shown, the carrier 110 is placed upside down on the metal sheet 150. The metal sheet 150 is heated to melt the sealing material 175 thereon. When the sealing material 175 is melted, the carrier 110 is brought close to the metal sheet 150 so that the metal sheet 150 is in direct contact with the plurality of vertical metal lines 260, the plurality of conductive pillars 360 or the plurality of conductive blocks 460. After the sealing material 175 is solidified and cooled to form the molding layer 170 that covers the electronic component 120 and the plurality of vertical metal lines 260, the plurality of conductive pillars 360 or the plurality of conductive blocks 460, the manufacturing process is completed. Figure 4-Figure 5 , Figure 6-Figure 7 or Figure 8-Figure 9 The electronic package shown.

[0078] In the electronic package of the present application, the electronic components are shielded by the metal sheet, and the plurality of conductive components are used to introduce the received electromagnetic signals into the grounding end of the carrier in a grounding manner. Therefore, according to the electronic package of the present application, the chance of the electronic components in the package being subjected to electromagnetic interference during operation can be reduced, thereby maintaining the normal operation of the electronic package.

[0079] According to the manufacturing method of the electronic package of the present application, it is not necessary to grind off part of the molding layer and implement additional sputtering or coating processes to form the electromagnetic shielding structure, thus avoiding material waste and reducing manufacturing processes.

[0080] Although the present application has been disclosed with the aforementioned embodiments, they are not intended to limit the present application. Any person with ordinary knowledge in the technical field to which the present application belongs can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application shall be determined by the scope of the attached patent application.

[0081] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0082] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A method for manufacturing an electronic package, characterized in that: Include: Prepare a carrier board; Disposing an electronic component on the carrier board and electrically connecting the electronic component to the carrier board; Disposing a plurality of conductive components on the carrier board, and electrically connecting the plurality of conductive components to a ground circuit on the carrier board; providing a metal sheet; Placing the carrier upside down on the metal sheet so that the metal sheet faces the electronic component and the plurality of conductive components; Placing a sealing material on the metal sheet, and heating the metal sheet to melt the sealing material; When the sealing material is melted, the carrier is brought close to the metal sheet so that the metal sheet is in electrical contact with the plurality of conductive components; as well as The sealing material is cured to form a molding layer, wherein the molding layer is formed between the metal sheet and the carrier and covers the electronic component and the plurality of conductive components.

2. The method for manufacturing an electronic package according to claim 1, wherein: The plurality of conductive components are a plurality of metal wires, and the method for manufacturing the electronic package further comprises: The two ends of each metal wire are bonded to the carrier board by a wire bonding process.

3. The method for manufacturing an electronic package according to claim 1, wherein: The sealing material is a powdery sealing material.

4. The method for manufacturing an electronic package according to claim 1, wherein: The plurality of conductive components are disposed around the electronic component.

5. The method for manufacturing an electronic package as claimed in claim 1, characterized in that: The multiple conductive components include multiple first conductive components and multiple second conductive components. The multiple first conductive components are arranged side by side and surround the electronic components. The multiple second conductive components are arranged side by side and surround the multiple first conductive components. The multiple second conductive components respectively face the gaps between two adjacent ones of the multiple first conductive components.

6. The method for manufacturing an electronic package as claimed in claim 1, wherein: The plurality of conductive components are vertical metal lines, conductive pillars or conductive blocks.

7. An electronic package manufactured by the method for manufacturing an electronic package as claimed in claim 1, characterized in that: Include: a carrier board; an electronic component, disposed on the carrier board and electrically connected to the carrier board; A plurality of conductive components are disposed on the carrier board and electrically connected to the ground circuit on the carrier board, wherein the plurality of conductive components include a plurality of first conductive components and a plurality of second conductive components, the plurality of first conductive components are disposed side by side and surround the electronic component, the plurality of second conductive components are disposed side by side and surround the plurality of first conductive components, and the plurality of second conductive components respectively face the gaps between two adjacent ones of the plurality of first conductive components; a metal sheet disposed above the electronic component and electrically contacting the plurality of conductive components; and A molding layer is formed between the carrier and the metal sheet and covers the electronic components and the plurality of conductive components.

8. The electronic package according to claim 7, wherein: The plurality of conductive components are a plurality of metal wires, and two ends of each of the metal wires are connected to the carrier.

9. The electronic package according to claim 8, wherein: The plurality of metal wires are arc-shaped metal wires, and the metal sheet is in direct contact with the arc-shaped portions of the plurality of metal wires.

Images