Wafer cleaning apparatus and wafer cleaning method

Abstract

The present invention relates to a wafer cleaning device, comprising: a cleaning tank containing a cleaning liquid; a wafer clamping structure for clamping a wafer, including a connecting rod and at least two clamping rods located on opposite sides of the connecting rod, a clamping groove is provided on a surface of one clamping rod close to the other clamping rod, the clamping groove includes a connecting surface parallel to the connecting rod, and a clamping surface connected to the connecting surface, the clamping surface is located on a side of the connecting surface away from the connecting rod, and the clamping surface is an inclined surface extending from one end of the connecting surface in a direction away from the connecting rod; a moving structure for controlling the lifting movement of the wafer clamping structure so that the wafer clamped by the wafer clamping structure is immersed in the cleaning liquid contained in the cleaning tank; a rotating structure for controlling the rotation of the wafer clamping structure when the wafer is immersed in the cleaning liquid to drive the cleaning liquid to rotate, so that there is a gap between the wafer clamping structure and the wafer. The present invention also relates to a wafer cleaning method.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and particularly to a wafer cleaning device and a wafer cleaning method. Background Art

[0002] In the related art, the cleaning of wafers is generally carried out by means of liquid medicine spraying, but there is a splashing phenomenon, and bubbles are easily generated. Moreover, the spraying structure moves above the wafer, which is likely to cause secondary contamination of the wafer, resulting in poor cleaning effect. In addition, in the related art, the clamped part of the wafer cannot come into contact with the liquid medicine and cannot be cleaned. Summary of the Invention

[0003] In order to solve the above technical problems, the present invention provides a wafer cleaning device and a wafer cleaning method to solve the problems of poor wafer cleaning quality and the inability to clean the clamped part of the wafer.

[0004] To achieve the above object, the technical solution adopted in the embodiment of the present invention is: a wafer cleaning device, comprising:

[0005] A cleaning tank containing a cleaning liquid;

[0006] A wafer clamping structure for clamping a wafer, comprising a connecting rod and at least two clamping rods located on opposite sides of the connecting rod. A clamping groove is provided on a surface of one clamping rod close to the other clamping rod. The clamping groove includes a connecting surface parallel to the connecting rod and a clamping surface connected to the connecting surface. The clamping surface is located on the side of the connecting surface away from the connecting rod, and the clamping surface is an inclined surface extending from one end of the connecting surface in a direction away from the connecting rod;

[0007] A moving structure for controlling the lifting movement of the wafer clamping structure so that the wafer clamped by the wafer clamping structure is immersed in the cleaning liquid contained in the cleaning tank;

[0008] A rotating structure for controlling the rotation of the wafer clamping structure when the wafer is immersed in the cleaning liquid to drive the cleaning liquid to rotate, so that there is a gap between the wafer clamping structure and the wafer.

[0009] Optionally, the rotating structure is connected to the connecting rod through a transmission rod, and the transmission rod is connected to one side of the center of the connecting rod so that the wafer clamping structure performs eccentric rotation.

[0010] Optionally, in the extending direction of the connecting rod, the distance between the transmission rod and the center point of the connecting rod is 1-2 mm.

[0011] Optionally, the transmission rod is hollow, a connecting hole connected to the transmission rod is provided on the connecting rod, and the transmission rod is connected to a liquid inlet pipe to spray cleaning liquid on a side of the wafer close to the connecting rod for pre-cleaning.

[0012] Optionally, a cleaning pipe is also included for spraying cleaning liquid onto a side of the wafer away from the connecting rod.

[0013] Optionally, the wafer clamping structure includes three clamping rods connected to the connecting rod, and the angle between any two adjacent clamping rods is 120 degrees.

[0014] Optionally, the cleaning tank includes a first side wall and a second side wall opposite to each other, and in a direction perpendicular to the bottom of the cleaning tank, a height of the first side wall is smaller than a height of the second side wall.

[0015] Optionally, a liquid inlet is provided at one end of the second side wall close to the bottom of the cleaning tank, and the wafer cleaning device also includes a cleaning liquid providing structure for continuously providing cleaning liquid to the liquid inlet during the wafer cleaning process, so that the cleaning liquid continuously overflows from the port of the cleaning tank on the side of the first side wall.

[0016] The embodiment of the present invention further provides a wafer cleaning method, which uses the above-mentioned wafer cleaning device to clean a wafer, and the wafer cleaning method includes:

[0017] Immersing the wafer in the cleaning solution in the cleaning tank;

[0018] Controlling the wafer clamping structure to rotate, so as to drive the cleaning liquid to rotate, so that a gap exists between the wafer and the wafer clamping structure;

[0019] While controlling the wafer to rotate, the wafer clamping structure is controlled to rise so that the wafer is separated from the cleaning liquid;

[0020] The wafer holding structure is controlled to rotate so as to dry the wafer.

[0021] Optionally, the wafer is pre-cleaned while being immersed in the cleaning solution.

[0022] The beneficial effects of the present invention are as follows: the wafer is clamped by inverting the wafer clamping structure, and during the cleaning process, the wafer clamping structure is controlled to rotate to drive the cleaning liquid to rotate, and the force of the cleaning liquid is utilized to create a gap between the wafer and the wafer clamping structure, so that the wafer is separated from the wafer clamping structure, thereby solving the problem that the wafer clamping part cannot be cleaned. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram showing the structure of a wafer cleaning device in an embodiment of the present invention;

[0024] Figure 2 Schematic diagram showing the state of the wafer being clamped in the embodiment of the present invention;

[0025] Figure 3 Schematic diagram showing the wafer cleaning process in the embodiment of the present invention. Detailed implementation manners

[0026] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present invention fall within the scope of protection of the present invention.

[0027] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0028] Referring to Figure 1 , this embodiment provides a wafer 100 cleaning device, including:

[0029] A cleaning tank 1 containing a cleaning liquid;

[0030] A wafer 100 clamping structure for clamping the wafer 100, including a connecting rod 21 and at least two clamping rods 22 located on opposite sides of the connecting rod 21. A clamping groove is provided on one side of one clamping rod 22 close to the other clamping rod 22. The clamping groove includes a connecting surface 231 parallel to the connecting rod 21 and a clamping surface 232 connected to the connecting surface 231. The clamping surface 232 is located on the side of the connecting surface 231 away from the connecting rod 21, and the clamping surface 232 is an inclined surface extending from one end of the connecting surface 231 in a direction away from the connecting rod 21;

[0031] A moving structure for controlling the lifting movement of the wafer 100 clamping structure so that the wafer 100 clamped by the wafer 100 clamping structure is immersed in the cleaning liquid contained in the cleaning tank 1;

[0032] The rotating structure is used to control the rotation of the wafer 100 clamping structure when the wafer 100 is immersed in the cleaning liquid, so as to drive the cleaning liquid to rotate, so that a gap is formed between the wafer 100 clamping structure and the wafer 100.

[0033] In this embodiment, an inverted wafer 100 clamping structure is used to clamp the wafer 100. The wafer 100 clamping structure is located directly above the cleaning tank 1 (or the wafer 100 clamping structure is moved to directly above the cleaning tank 1), and moves downward so that the wafer 100 is immersed in the cleaning liquid. In this embodiment, the clamping tank is composed of a connecting surface 231 and an inclined clamping surface 232. During the cleaning process, the rotation of the wafer 100 clamping structure does not directly drive the wafer 100 to rotate. Since the wafer 100 is immersed in the cleaning liquid, the rotating structure controls the rotation of the wafer 100 clamping structure to drive the cleaning liquid to rotate. Under the rotation of the cleaning liquid, a gap is generated between the wafer 100 and the clamping tank, and the gap is filled with the cleaning liquid, that is, the wafer 100 is separated from the wafer 100 clamping structure and floats in the cleaning liquid, so that the wafer 100 as a whole is fully in contact with the cleaning liquid, thereby solving the problem that the clamping part of the wafer 100 cannot contact the cleaning liquid and cannot be cleaned.

[0034] In this embodiment, the wafer 100 is cleaned by being immersed in the cleaning liquid as a whole, and the wafer 100 is isolated from the outside world to avoid secondary contamination. Compared with the method of spraying the cleaning liquid, it avoids splashing of the cleaning liquid and prevents the generation of bubbles.

[0035] In an exemplary embodiment, the rotating structure is connected to the connecting rod 21 via a transmission rod 3 , and the transmission rod 3 is connected to one side of the center of the connecting rod 21 , so that the wafer 100 clamping structure performs eccentric rotation.

[0036] refer to Figure 1 In the extension direction of the connecting rod 21, the center line 200 of the connecting rod 21 is located on one side of the axial center line 300 of the transmission rod.

[0037] When cleaning is completed and the wafer 100 is controlled to separate from the cleaning liquid, the wafer 100 clamping structure is controlled to rise by the moving structure while controlling the eccentric rotation of the wafer 100 clamping structure, which can destroy the liquid surface tension of the cleaning liquid and reduce the resistance of the wafer 100 to separate from the cleaning liquid.

[0038] After cleaning, the wafer 100 clamping structure is controlled to move away from the cleaning liquid, and then the wafer 100 clamping structure is controlled to continue to rotate. Under the action of centrifugal force, the wafer 100 is dried and the reaction difference between the center and the edge of the wafer 100 is avoided during the cleaning process.

[0039] In an exemplary embodiment, in the extending direction of the connecting rod 21, the distance between the center point of the transmission rod 3 and the connecting rod 21 is 1-2 mm, but this is not limiting.

[0040] In an exemplary embodiment, the transmission rod 3 is provided with a hollow interior. A connecting hole 201 connected to the transmission rod 3 is provided on the connecting rod 21. The transmission rod 3 is communicated with a liquid inlet pipe to spray cleaning liquid on the surface of the wafer 100 close to the connecting rod 21 for pre-cleaning.

[0041] Through the pre-cleaning arrangement, the pollutants brought into the cleaning liquid by the wafer 100 are reduced, and the cleaning quality is improved.

[0042] Exemplarily, an external thread is provided on the outer peripheral surface of one end of the transmission rod 3, and an internal thread is provided on the inner side surface of the connecting hole 201. The transmission rod 3 and the connecting hole 201 are connected by a screwing method, but this is not limiting.

[0043] In an exemplary embodiment, the wafer 100 cleaning device further includes a cleaning pipe for spraying cleaning liquid on the surface of the wafer 100 away from the connecting rod 21.

[0044] The cleaning pipe includes a nozzle for spraying cleaning liquid on the surface of the wafer 100 away from the connecting rod 21. Through the cooperation of the hollow transmission rod 3 and the cleaning pipe, pre-cleaning is performed on two surfaces of the wafer 100, enhancing the cleaning effect.

[0045] Reference Figure 2 , in an exemplary embodiment, the wafer 100 clamping structure includes three clamping rods 22 connected to the connecting rod 21, and the angle between any two adjacent clamping rods 22 is 120 degrees.

[0046] The three-point fixing method enhances the stability of the clamping of the wafer 100.

[0047] In an exemplary embodiment, the cleaning tank 1 includes opposite first side walls 12 and second side walls. In the direction perpendicular to the bottom 11 of the cleaning tank 1, the height of the first side wall 12 is less than the height of the second side wall 13.

[0048] With the above-mentioned asymmetric setting of the cleaning tank 1, when the wafer 100 is separated from the cleaning liquid, it is beneficial to reduce the resistance of the wafer 100 clamping mechanism to rise, and it is beneficial to weaken the stress influence of the tension generated by the liquid medicine on the wafer 100 body.

[0049] In an exemplary embodiment, in a direction perpendicular to the bottom 11 of the cleaning tank 1, the difference in height between the first sidewall 12 and the second sidewall 13 is 0.5 mm - 2 mm, for example, it can be 1 mm, but it is not limited thereto.

[0050] In an exemplary embodiment, a liquid inlet 14 is provided at one end of the second sidewall 13 close to the bottom 11 of the cleaning tank 1. The wafer 100 cleaning device further includes a cleaning liquid supply structure for continuously supplying cleaning liquid to the liquid inlet 14 during the process of cleaning the wafer 100, so that the cleaning liquid continuously overflows from the port of the cleaning tank 1 on the side of the first sidewall 12.

[0051] During the cleaning process, cleaning liquid is continuously supplied through the liquid inlet 14, and the cleaning liquid overflows from the first sidewall 12 to ensure the purity of the cleaning liquid and avoid the presence of contaminants in the cleaning liquid, which may affect the cleaning effect of the wafer 100.

[0052] Reference Figure 3 In addition, an embodiment of the present invention further provides a method for cleaning a wafer 100, which uses the above-described wafer 100 cleaning device to clean the wafer 100. The method for cleaning the wafer 100 includes:

[0053] Immersing the wafer 100 in the cleaning liquid in the cleaning tank 1;

[0054] Controlling the rotation of the wafer 100 clamping structure to drive the rotation of the cleaning liquid, so that there is a gap between the wafer 100 and the wafer 100 clamping structure;

[0055] While controlling the rotation of the wafer 100, controlling the upward movement of the wafer 100 clamping structure to separate the wafer 100 from the cleaning liquid;

[0056] Controlling the rotation of the wafer 100 clamping structure to dry the wafer 100.

[0057] In an exemplary embodiment, when the wafer 100 is immersed in the cleaning liquid, pre-cleaning of the wafer 100 is performed.

[0058] It can be understood that the above embodiments are only exemplary embodiments adopted to illustrate the principle of the present invention. However, the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.

Claims

1. A wafer cleaning device, characterized in that, Comprising: A cleaning tank containing a cleaning liquid; A wafer clamping structure for clamping a wafer, including a connecting rod and at least two clamping rods located on opposite sides of the connecting rod. On one side of one clamping rod close to the other clamping rod, a clamping groove is provided. The clamping groove includes a connecting surface parallel to the connecting rod and a clamping surface connected to the connecting surface. The clamping surface is located on the side of the connecting surface away from the connecting rod, and the clamping surface is an inclined surface extending from one end of the connecting surface in a direction away from the connecting rod; A moving structure for controlling the lifting movement of the wafer clamping structure so that the wafer clamped by the wafer clamping structure is immersed in the cleaning liquid contained in the cleaning tank; A rotating structure for controlling the rotation of the wafer clamping structure when the wafer is immersed in the cleaning liquid to drive the cleaning liquid to rotate. Under the rotational action of the cleaning liquid, a gap is generated between the wafer and the clamping groove; 2. The wafer cleaning device according to claim 1, characterized in that, The rotating structure is connected to the connecting rod through a transmission rod. The transmission rod is connected to one side of the center of the connecting rod so that the wafer clamping structure performs eccentric rotation; 3. The wafer cleaning device according to claim 2, characterized in that, In the extending direction of the connecting rod, the distance between the transmission rod and the center point of the connecting rod is 1 - 2 mm; 4. The wafer cleaning device according to claim 2, wherein The transmission rod is hollow. A connecting hole connected to the transmission rod is provided on the connecting rod. The transmission rod is communicated with a liquid inlet pipe to spray a cleaning liquid on the side of the wafer close to the connecting rod for pre-cleaning; 5. The wafer cleaning apparatus according to claim 4, characterized in that, It further includes a cleaning pipe for spraying a cleaning liquid on the side of the wafer away from the connecting rod; 6. The wafer cleaning device according to claim 1, wherein, The wafer clamping structure includes three clamping rods connected to the connecting rod, and the angle between any two adjacent clamping rods is 120 degrees; 7. The wafer cleaning device according to claim 1, characterized in that, The cleaning tank includes opposite first side walls and second side walls. In the direction perpendicular to the bottom of the cleaning tank, the height of the first side wall is less than the height of the second side wall; 8. The wafer cleaning device according to claim 7, wherein, An inlet port is provided at one end of the second side wall close to the bottom of the cleaning tank. The wafer cleaning device further includes a cleaning liquid supply structure for continuously supplying a cleaning liquid to the inlet port during the process of cleaning the wafer, so that the cleaning liquid continuously overflows from the side of the port of the cleaning tank where the first side wall is located; 9. A wafer cleaning method, characterized in that, When cleaning a wafer using the wafer cleaning device according to any one of claims 1 - 8, the wafer cleaning method includes: Immersing the wafer in the cleaning liquid in the cleaning tank; Controlling the rotation of the wafer clamping structure to drive the cleaning liquid to rotate. Under the rotational action of the cleaning liquid, a gap is generated between the wafer and the clamping groove; While controlling the rotation of the wafer, controlling the wafer clamping structure to rise so that the wafer is separated from the cleaning liquid; Controlling the rotation of the wafer clamping structure to dry the wafer; 10. The wafer cleaning method according to claim 9, wherein Performing pre-cleaning on the wafer when the wafer is immersed in the cleaning liquid.

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