A method of wrapping a wafer in a semiconductor process apparatus and a semiconductor process apparatus

Abstract

The embodiment of the present application provides a wafer packaging method in a semiconductor process equipment and a semiconductor process equipment, the method comprises the following steps: obtaining wafer recipe information of a wafer boat; when the number of detection wafers participating in a process task in the wafer boat is a first configuration number, and the number of product wafers participating in the process task is less than a second configuration number, determining whether to support moving edge fill wafers; if the moving edge fill wafers are supported, when the number of edge fill wafers participating in the process task in the wafer boat is greater than or equal to a third configuration number, moving the edge fill wafers according to a wafer position loading mode, so that the product wafers in the wafer boat are packaged by the edge fill wafers. In the embodiment of the present application, the method for packaging the product by moving the edge fill wafers can meet the process requirement and save the loss of filling the product wafers.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a method for wrapping wafers in a semiconductor process apparatus and a semiconductor process apparatus. Background Technology

[0002] With the development of modern technology, semiconductors are becoming increasingly important in modern life. The core components of most electronic products, such as computers, mobile phones, or digital recorders, are closely related to semiconductors. As a result, the number of products that machines need to process is increasing, and the requirements for product packaging processes are becoming more and more stringent.

[0003] Currently, in existing technologies, if the number of products to be processed by the machine is relatively small and cannot meet the pre-configured number of wafers, the remaining positions are filled using either the "leaving empty" method or the "filling with wafers" method. The "leaving empty" method involves placing the wafers sequentially according to the wafer loading pattern, leaving the remaining positions empty. While this saves on filler wafers, the lack of wafer enclosure can affect the processing results. The "filling with wafers" method involves placing the wafers sequentially according to the wafer loading pattern, then completely filling the remaining positions with filler wafers. However, this results in waste of filler wafers, especially after certain special processing steps where they cannot be recycled. Summary of the Invention

[0004] In view of the above problems, embodiments of the present invention are proposed to provide a wafer wrapping method in a semiconductor process apparatus and a corresponding semiconductor process apparatus to overcome or at least partially solve the above problems.

[0005] To address the aforementioned problems, this invention discloses a method for wrapping wafers in a semiconductor process apparatus. The semiconductor process apparatus includes a process chamber, a crystal boat is provided within the process chamber, and multiple edge-filled wafers are placed at both ends of the crystal boat. The method includes:

[0006] Obtain wafer formulation information for the crystal boat; the wafer formulation information includes a first configuration quantity for the test wafers, a second configuration quantity for the product wafers, a wafer position loading mode, and a third configuration quantity for the edge-filling wafers;

[0007] When the number of detection wafers participating in the process task in the crystal boat is the first configuration number and the number of product wafers participating in the process task is less than the second configuration number, it is determined whether to support moving the edge filling wafer;

[0008] If the movement of the edge-filled wafers is supported, then when the number of edge-filled wafers participating in the process task in the ship is greater than or equal to the third configuration number, the edge-filled wafers are moved according to the wafer position loading mode so that the product wafers in the ship are wrapped by the edge-filled wafers.

[0009] Optionally, when the number of edge-filled wafers participating in the process task in the wafer boat is greater than or equal to the third configuration number, moving the edge-filled wafers according to the wafer position loading mode so that the product wafers in the wafer boat are wrapped by the edge-filled wafers includes:

[0010] When the number of edge-filled wafers participating in the process task in the crystal boat is greater than or equal to the third configuration number, according to the wafer position loading mode, the edge-filled wafers at the upper end of the crystal boat are moved above the product wafer and adjacent to the product wafer, and / or the edge-filled wafers at the lower end of the crystal boat are moved below the product wafer and adjacent to the product wafer.

[0011] Optionally, the upper end of the crystal boat has a first number of edge-filled wafers, and the lower end has a second number of edge-filled wafers;

[0012] The step of moving the edge-filled wafer at the upper end of the wafer boat above and adjacent to the product wafer, and / or moving the edge-filled wafer at the lower end of the wafer boat below and adjacent to the product wafer, according to the wafer position loading mode, includes:

[0013] When the wafer position loading mode is the first loading mode of placing wafers from top to bottom, determine the number of empty product wafers in the wafer boat;

[0014] If the number of spare product wafers is greater than or equal to the second number, then all the edge-filling wafers of the second number at the lower end of the crystal boat are moved to below the product wafer and adjacent to the product wafer;

[0015] If the number of spare product wafers is less than the second number, then the edge-filling wafer at the lower end of the crystal boat, which is the same number as the number of spare product wafers, is moved to the bottom of the product wafer and adjacent to the product wafer.

[0016] Optionally, the step of moving the edge-filled wafer at the upper end of the wafer boat to above and adjacent to the product wafer according to the wafer position loading mode, and / or moving the edge-filled wafer at the lower end of the wafer boat to below and adjacent to the product wafer, further includes:

[0017] When the wafer position loading mode is the second loading mode of placing wafers from bottom to top, determine the number of empty product wafers in the crystal boat;

[0018] If the number of spare product wafers is greater than or equal to the first number, then all the edge-filling wafers of the first number at the top of the crystal boat are moved above the product wafers and adjacent to the product wafers.

[0019] If the number of spare product wafers is less than the first number, then the edge-filling wafers at the top of the crystal boat, which are the same number as the number of spare product wafers, are moved above the product wafers and adjacent to them.

[0020] Optionally, the step of moving the edge-filled wafer at the upper end of the wafer boat to above and adjacent to the product wafer according to the wafer position loading mode, and / or moving the edge-filled wafer at the lower end of the wafer boat to below and adjacent to the product wafer, further includes:

[0021] When the wafer placement loading mode is the third loading mode, which places wafers from the middle to both ends, the number of spare product wafers in the wafer boat is determined.

[0022] If the number of empty product wafers at the upper end of the crystal boat is greater than or equal to the first number, and the number of empty product wafers at the lower end of the crystal boat is greater than or equal to the second number, then all the edge-filling wafers of the first number at the upper end of the crystal boat are moved above the product wafer and adjacent to the product wafer, and all the edge-filling wafers of the second number at the lower end of the crystal boat are moved below the product wafer and adjacent to the product wafer.

[0023] If the number of empty product wafers at the upper end of the crystal boat is less than the first number, and the number of empty product wafers at the lower end of the crystal boat is less than the second number, then the edge-filling wafers at the upper end of the crystal boat, which are the same number as the number of empty product wafers, are moved above the product wafers and adjacent to the product wafers, and the edge-filling wafers at the lower end of the crystal boat, which are the same number as the number of empty product wafers, are moved below the product wafers and adjacent to the product wafers.

[0024] If the number of empty product wafers at the upper end of the crystal boat is greater than or equal to the first number, and the number of empty product wafers at the lower end of the crystal boat is less than the second number, then all the edge-filling wafers of the first number at the upper end of the crystal boat are moved above the product wafer and adjacent to the product wafer, and the edge-filling wafers of the same number at the lower end of the crystal boat as the number of empty product wafers are moved below the product wafer and adjacent to the product wafer.

[0025] If the number of empty product wafers at the upper end of the crystal boat is less than the first number, and the number of empty product wafers at the lower end of the crystal boat is greater than or equal to the second number, then the edge-filling wafers at the upper end of the crystal boat, which are the same number as the number of empty product wafers, are moved above the product wafers and adjacent to them. All the edge-filling wafers at the lower end of the crystal boat, representing the second number, are moved below the product wafers and adjacent to them.

[0026] Optionally, the step of determining whether to support moving the edge-filling wafer when the number of inspection wafers participating in the process task in the crystal boat is the first configuration number and the number of product wafers participating in the process task is less than the second configuration number further includes:

[0027] If the movement of the edge-filled wafer is not supported, a wafer alarm is triggered, and the problem is handled through either the first or the second processing method.

[0028] The first processing method is to terminate the process task; the second processing method is to ignore the wafer alarm.

[0029] Optionally, determining whether to support moving the edge-filling wafer when the number of inspection wafers participating in the process task in the crystal boat is the first configuration number and the number of product wafers participating in the process task is less than the second configuration number includes:

[0030] When the number of detection wafers participating in the process task in the crystal boat is the first configuration number and the number of product wafers participating in the process task is less than the second configuration number, it is determined whether to support filling of product wafers.

[0031] If the filling of the product wafer is not supported, then determine whether moving the edge-filled wafer is supported.

[0032] Optionally, when the number of detection wafers participating in the process task in the crystal boat is the first configuration number, the number of product wafers participating in the process task is the second configuration number, and the number of edge-filling wafers participating in the process task in the crystal boat is less than the third configuration number, a wafer alarm is triggered and processed by the first processing method.

[0033] Optionally, the wafer formulation information further includes a fourth configuration quantity for the filled product wafers, and the method further includes:

[0034] When the number of detection wafers participating in the process task in the crystal boat is the first configuration number, the number of product wafers participating in the process task is the second configuration number, the number of edge filling wafers participating in the process task in the crystal boat is the third configuration number, and the number of filling product wafers participating in the process task in the crystal boat is less than the fourth configuration number, a wafer alarm is triggered and processed by the first processing method.

[0035] This invention also discloses a semiconductor process apparatus, which includes a process chamber, a crystal boat, and multiple edge-filled wafers placed at both ends of the crystal boat. The semiconductor process apparatus further includes:

[0036] A controller is used to acquire wafer formulation information for a wafer boat; the wafer formulation information includes a first configuration number of test wafers, a second configuration number of product wafers, a wafer position loading mode, and a third configuration number of edge-filling wafers; when the number of test wafers participating in the process task in the wafer boat is the first configuration number and the number of product wafers participating in the process task is less than the second configuration number, it determines whether it supports moving the edge-filling wafers; if it supports moving the edge-filling wafers, then when the number of edge-filling wafers participating in the process task in the wafer boat is greater than or equal to the third configuration number, according to the wafer position loading mode, the edge-filling wafers are moved so that the product wafers in the wafer boat are wrapped by the edge-filling wafers.

[0037] Optionally, the controller is configured to, when the number of edge-filled wafers participating in the process task in the wafer boat is greater than or equal to the third configuration number, move the edge-filled wafers at the upper end of the wafer boat above the product wafer and adjacent to the product wafer according to the wafer position loading mode, and / or move the edge-filled wafers at the lower end of the wafer boat below the product wafer and adjacent to the product wafer.

[0038] Optionally, the upper end of the crystal boat has a first number of edge-filled wafers, and the lower end has a second number of edge-filled wafers;

[0039] The controller is configured to determine the number of empty product wafers in the wafer boat when the wafer position loading mode is a first loading mode of placing wafers from top to bottom; if the number of empty product wafers is greater than or equal to the second number, then all the edge-filling wafers of the second number at the lower end of the wafer boat are moved below the product wafer and adjacent to the product wafer; if the number of empty product wafers is less than the second number, then the edge-filling wafers of the same number at the lower end of the wafer boat are moved below the product wafer and adjacent to the product wafer.

[0040] Optionally, the controller is configured to determine the number of spare product wafers in the crystal boat when the wafer position loading mode is a second loading mode of placing wafers from bottom to top; if the number of spare product wafers is greater than or equal to the first number, then all the edge-filling wafers of the first number at the top of the crystal boat are moved above the product wafer and adjacent to the product wafer; if the number of spare product wafers is less than the first number, then the edge-filling wafers at the top of the crystal boat with the same number of spare product wafers are moved above the product wafer and adjacent to the product wafer.

[0041] Optionally, the controller is configured to determine the number of spare product wafers in the wafer boat when the wafer placement loading mode is a third loading mode in which wafers are placed from the middle to both ends; if the number of spare product wafers at the upper end of the wafer boat is greater than or equal to the first number, and the number of spare product wafers at the lower end of the wafer boat is greater than or equal to the second number, then all the edge-filling wafers of the first number at the upper end of the wafer boat are moved above the product wafer and adjacent to the product wafer, and all the edge-filling wafers of the second number at the lower end of the wafer boat are moved below the product wafer and adjacent to the product wafer; if the number of spare product wafers at the upper end of the wafer boat is less than the first number, and the number of spare product wafers at the lower end of the wafer boat is less than the second number, then the edge-filling wafers of the same number at the upper end of the wafer boat are moved above the product wafer and adjacent to the product wafer, and the edge-filling wafers of the second number at the lower end of the wafer boat are moved below the product wafer and adjacent to the product wafer; if the number of spare product wafers at the upper end of the wafer boat is less than the first number, and the number of spare product wafers at the lower end of the wafer boat is less than the second number, then the edge-filling wafers of the same number at the upper end of the wafer boat are moved above the product wafer and adjacent to the product wafer, and the edge-filling wafers of the same number at the lower end of the wafer boat are moved below the product wafer and adjacent to the product wafer. The same edge-filled wafers are moved to the bottom of the product wafer and adjacent to it. If the number of empty product wafers at the upper end of the crystal boat is greater than or equal to the first number, and the number of empty product wafers at the lower end of the crystal boat is less than the second number, then all the edge-filled wafers of the first number at the upper end of the crystal boat are moved to the top of the product wafer and adjacent to it, and the edge-filled wafers of the same number as the empty product wafers at the lower end of the crystal boat are moved to the bottom of the product wafer and adjacent to it. If the number of empty product wafers at the upper end of the crystal boat is less than the first number, and the number of empty product wafers at the lower end of the crystal boat is greater than or equal to the second number, then the edge-filled wafers of the same number as the empty product wafers at the upper end of the crystal boat are moved to the top of the product wafer and adjacent to it, and the edge-filled wafers of the second number at the lower end of the crystal boat are moved to the bottom of the product wafer and adjacent to it.

[0042] Optionally, the controller is further configured to trigger a wafer alarm if it does not support moving the edge to fill the wafer, and process the alarm using a first processing method or a second processing method; wherein, the first processing method is to terminate the process task; and the second processing method is to ignore the wafer alarm.

[0043] Optionally, the controller is further configured to determine whether filling of product wafers is supported when the number of detection wafers participating in the process task in the crystal boat is the first configured number and the number of product wafers participating in the process task is less than the second configured number; if filling of product wafers is not supported, then determine whether moving the edge filling wafers is supported.

[0044] Optionally, the controller is further configured to trigger a wafer alarm and process it through a first processing method when the number of detection wafers participating in the process task in the wafer boat is the first configuration number, the number of product wafers participating in the process task is the second configuration number, and the number of edge-filling wafers participating in the process task in the wafer boat is less than the third configuration number.

[0045] Optionally, the wafer formulation information further includes a fourth configuration quantity for filler product wafers. The controller is also configured to trigger a wafer alarm and process it through a first processing method when the number of detection wafers participating in the process task in the wafer boat is the first configuration quantity, the number of product wafers participating in the process task is the second configuration quantity, the number of edge filler wafers participating in the process task in the wafer boat is the third configuration quantity, and the number of filler product wafers participating in the process task in the wafer boat is less than the fourth configuration quantity.

[0046] The embodiments of the present invention have the following advantages:

[0047] In this embodiment of the invention, a semiconductor process apparatus includes a process chamber, a crystal boat having multiple vertically arranged slots, and multiple edge-filled wafers placed at both ends of the crystal boat. The method includes: acquiring wafer recipe information for the crystal boat; wherein the wafer recipe information includes a first configuration quantity for test wafers, a second configuration quantity for product wafers, a wafer position loading mode, and a third configuration quantity for edge-filled wafers; when the number of test wafers participating in the process task in the crystal boat is the first configuration quantity and the number of product wafers participating in the process task is less than the second configuration quantity, determining whether moving edge-filled wafers is supported; if moving edge-filled wafers is supported, then when the number of edge-filled wafers participating in the process task in the crystal boat is greater than or equal to the third configuration quantity, moving the edge-filled wafers according to the wafer position loading mode, so that the product wafers in the crystal boat are wrapped by the edge-filled wafers. This embodiment of the invention uses a method of wrapping products with moving edge-filled wafers, which can meet process requirements and save on the loss of filled product wafers. The fewer the number of products and the more special the process conditions, the more filled product wafers are saved by using the method of wrapping products with moving edge-filled wafers. Attached Figure Description

[0048] Figure 1This is a top view of a vertical furnace equipment conveying system provided in an embodiment of the present invention;

[0049] Figure 2 This is a flowchart illustrating the steps of a wafer wrapping method in a semiconductor process apparatus provided by an embodiment of the present invention;

[0050] Figure 3 This is a schematic diagram of a vertical furnace for filling product wafers and a moving edge for filling wafer wrapping, provided by an embodiment of the present invention;

[0051] Figure 4 This is a logic flowchart of a vertical furnace machine for calculating materials and adding moving edge filling of wafers, provided by an embodiment of the present invention.

[0052] Figure 5 This is a structural block diagram of a semiconductor process equipment provided in an embodiment of the present invention. Detailed Implementation

[0053] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0054] Before semiconductor processing equipment begins operation, users can pre-configure the wafer type and quantity, process recipe, and transport path in the equipment's editing interface. The equipment can then process the wafers according to the recipe information. In practice, the actual number of wafers processed may be less than the pre-configured number, impacting the process. For example, if the actual number of wafers processed is less than the pre-configured number, it can be addressed by leaving empty slots or using extradummy wafers. Leaving empty slots involves placing wafers on the wafer boat according to the wafer loading pattern, leaving the remaining space empty. However, because the wafers are not fully encased, this can affect the processing results. Using extradummy wafers involves placing wafers on the wafer boat according to the wafer loading pattern, then completely filling the remaining space with extradummy wafers. This results in wasted extradummy wafers, especially since some special processes require them to be reusable after completion.

[0055] A vertical furnace is a type of semiconductor process equipment. The following explanation uses a vertical furnace as an example. Figure 1 The diagram shows the structure of a vertical furnace, which may include:

[0056] (1) Two wafer cassette loading devices (SMIF: System Management Interface Forum): The wafer cassette loading device is a bridge between the external environment and the equipment. Wafer cassettes can be placed on SMIF_A and SMIF_B. Wafer carriers can be placed inside the wafer cassettes. The wafer carriers have 25 slots for storing wafers. The wafer cassette loading device has a door opening mechanism to open the wafer cassette door.

[0057] (2) A wafer carrier robot, abbreviated as STM: responsible for the transfer of wafer carriers. STM can transfer wafer carriers from the SMIFA / SMIFB, LoadLockC / LoadLockD and Stocker Shelf.

[0058] (3) A wafer storage unit: A wafer storage unit is used to place wafer carriers. A wafer storage unit can hold up to 21 wafer carriers. The component on the wafer storage unit that holds the wafer carriers is called a rack. A wafer storage unit has multiple racks for storing different types of wafers. Different types of wafers are placed on different racks according to the type of wafer.

[0059] (4) Two Load Locks: The load locks can hold wafer carriers and serve as a bridge for the wafer to enter the process chamber. The load locks contain bump monitoring sensors to monitor the bumps of the wafer carriers placed on them.

[0060] (5) A wafer transfer robot (WTM): responsible for wafer transfer and also includes a push function. The wafer transfer robot can transfer wafers from the wafer carrier in the locking container and the wafer boat in the PM process chamber. The wafer transfer robot is available with 1 finger or 5 fingers, and can pick up or place 1 or 5 wafers at a time.

[0061] (6) A PM (Processing Module) chamber: used for performing corresponding process operations. The process chamber contains a wafer boat for placing wafers. The number of wafers participating in the process in the process chamber is determined by the number of slots in the wafer boat; currently, there are two types of wafer boats: Slot171 and Slot143.

[0062] The transfer process of a vertical furnace can be as follows: material enters the machine – material loading – process treatment – ​​material unloading – material removal from the machine.

[0063] 1) Material entry into the machine: The process by which the user places the wafer carrier device into SMIF_A or SMIF_B, and then the wafer robot transfers the wafer carrier device in the wafer carrier in SMIF_A or SMIF_B to the rack in the wafer storage device is called material entry into the machine.

[0064] 2) Loading materials: The wafer carrier robot places the wafer carriers sequentially from the rack to LoadLock_C or LoadLock_D. The wafer carrier robot then transfers the wafers from the wafer carriers in the locking container to the wafer boat in the PM process chamber. The process of the wafer carrier robot then transporting the wafer carriers back to the rack is called loading materials.

[0065] 3) Processing: The process by which the crystal boat enters the process chamber to participate in the processing is called processing.

[0066] 4) Unloading materials: The wafer carrier robot places the wafer carrier from the rack to LoadLock_C or LoadLock_D in sequence. The wafer carrier robot puts the wafers that have completed the process on the wafer boat back into the wafer carrier on the locked container in sequence. The process of the wafer carrier robot then transporting the wafer carrier back to the rack is called unloading materials.

[0067] 5) Material Removal Machine: The process by which the user places an empty wafer cassette into SMIF_A or SMIF_B, and then the wafer carrier robot transfers the wafer carrier from the wafer cassette on the rack to the wafer cassette on SMIF_A or SMIF_B, is called the material removal machine.

[0068] The core concept of this invention is that if the number of product wafers that the semiconductor process equipment actually needs to process is relatively small and cannot meet the pre-configured quantity, a method of wrapping the product with moving edge filling wafers can be used. This method can both meet the process requirements and save on the waste of filling product wafers. The smaller the number of products and the more special the process conditions, the more product wafers are saved by using the method of wrapping the product with moving edge filling wafers.

[0069] Reference Figure 2 This diagram illustrates a flowchart of a wafer wrapping method in a semiconductor process apparatus according to an embodiment of the present invention. The semiconductor process apparatus includes a process chamber, a crystal boat, and multiple edge-filled wafers placed at both ends of the crystal boat. The method may specifically include the following steps:

[0070] Step 201: Obtain wafer formulation information for the crystal boat; the wafer formulation information includes a first configuration quantity for the test wafers, a second configuration quantity for the product wafers, a wafer position loading mode, and a third configuration quantity for the edge-filling wafers;

[0071] In this embodiment of the invention, the semiconductor process equipment includes a process chamber containing a crystal boat, the crystal boat having multiple vertically arranged slots. Edge-filled wafers can be placed at either end of the crystal boat or stored in the machine for multiple processing cycles. The ends of the crystal boat within the process chamber exhibit the worst temperature and airflow uniformity during the processing tasks.

[0072] Before starting the process task, set a first configuration quantity for the inspection wafers, a second configuration quantity for the product wafers, and a third configuration quantity for the edge filling wafers;

[0073] Before starting the process task, the wafer position loading mode on the wafer boat can also be set. The wafer position loading mode can include a loading mode for placing wafers from top to bottom, a loading mode for placing wafers from bottom to top, and a loading mode for placing wafers from the middle to both ends.

[0074] The product wafer is the target wafer for the process task. Since the product wafer needs to be absolutely clean, it is not necessary to directly test the thickness and other parameters of the product wafer after the process task is completed. It is only allowed to participate in the process once in the machine.

[0075] Test wafers can be used to test the parameters of the test wafer after the process is completed. The test results of the test wafer can indirectly reflect the parameters and quality of the product wafer. It is only allowed to participate in the process once in the machine.

[0076] Step 202: When the number of detection wafers participating in the process task in the crystal boat is the first configuration number and the number of product wafers participating in the process task is less than the second configuration number, determine whether it is supported to move the edge filling wafer;

[0077] In this embodiment of the invention, after the process task starts, if the number of detection wafers participating in the process task is greater than or less than the first configuration number, a wafer alarm is triggered, and the process task is terminated or the wafer alarm is ignored.

[0078] When the number of test wafers participating in the process task in the crystal boat is the first configuration number, it is determined whether the number of product wafers participating in the process task is the second configuration number. If the number of product wafers is greater than the second configuration number, a wafer alarm is triggered, and the process task is terminated or the wafer alarm is ignored.

[0079] If the number of product wafers is less than the number in the second configuration, then determine whether the process task supports filling the product wafer into the wafer boat. If it does not support filling the product wafer, then determine whether the process task supports moving the edge to fill the wafer.

[0080] In this embodiment of the invention, step 202 may include the following sub-steps:

[0081] Sub-step S11: When the number of detection wafers participating in the process task in the crystal boat is the first configuration number and the number of product wafers participating in the process task is less than the second configuration number, determine whether to support filling of product wafers.

[0082] In sub-step S12, if the filling of the product wafer is not supported, it is determined whether the movement of the edge-filled wafer is supported.

[0083] For example, before determining whether edge-filling of the wafer is supported, it is also necessary to determine whether the wafer boat in this process task supports wafer filling. If the wafer boat in this process task supports wafer filling, then wafer filling is used. Whether the wafer boat in this process task supports wafer filling is set before starting the process task, and the specific setting can be determined according to the actual situation. This embodiment of the invention does not limit this.

[0084] For example, if filler wafers are supported, the number of filler wafers is calculated based on a pre-set wafer position loading mode, and the position of the filler wafer on the wafer boat is determined. Generally, filler wafers are used on the wafer boat to fill all vacant slots. The specific method can be determined according to actual conditions, and this embodiment of the invention does not impose any limitations on this.

[0085] Step 203: If moving the edge-filled wafers is supported, then when the number of edge-filled wafers participating in the process task in the wafer boat is greater than or equal to the third configuration number, the edge-filled wafers are moved according to the wafer position loading mode so that the product wafers in the wafer boat are wrapped by the edge-filled wafers.

[0086] In this embodiment of the invention, if the process task supports moving edge-filled wafers, when the number of edge-filled wafers participating in the process task in the wafer boat is greater than or equal to the third configuration number, the edge-filled wafers are moved according to the wafer position loading mode, thereby determining the distribution mode of the edge-filled wafers in the wafer boat.

[0087] Based on the pre-set wafer position loading mode, the number of edge-filled wafers that can be supported for movement is calculated, and the position of the edge-filled wafer to be moved on the wafer boat is determined.

[0088] In this embodiment of the invention, step 203 may include the following sub-steps:

[0089] Sub-step S21: When the number of edge-filled wafers participating in the process task in the crystal boat is greater than or equal to the third configuration number, according to the wafer position loading mode, the edge-filled wafers at the upper end of the crystal boat are moved above the product wafer and adjacent to the product wafer, and / or the edge-filled wafers at the lower end of the crystal boat are moved below the product wafer and adjacent to the product wafer.

[0090] For example, edge-filled wafers can be disposed at both ends of a wafer boat. Depending on the wafer placement loading mode, the edge-filled wafer at the upper end of the wafer boat is moved above the product wafer, and / or the edge-filled wafer at the lower end of the wafer boat is moved below the product wafer. The wafer placement loading mode can be a top-to-bottom loading mode, a bottom-to-top loading mode, or a middle-to-end loading mode. The wafer placement loading mode is set before the start of the process task.

[0091] In this embodiment of the invention, sub-step S21 may include sub-steps S2101-S2103:

[0092] Sub-step S2101: When the wafer position loading mode is the first loading mode of placing wafers from top to bottom, determine the number of empty product wafers in the wafer boat.

[0093] For example, when the preset wafer placement loading mode is the first loading mode of placing wafers from top to bottom, the number of empty product wafers in the wafer boat can be determined by the number of product wafers actually participating in the process task and the second configuration number of product wafers. In the first loading mode of placing wafers from top to bottom, wafers are loaded starting from the top region of the wafer boat, leaving the bottom region of the wafer boat empty.

[0094] Sub-step S2102: If the number of spare product wafers is greater than or equal to the second number, then all the edge-filling wafers of the second number at the lower end of the crystal boat are moved to the bottom of the product wafer and adjacent to the product wafer.

[0095] In sub-step S2103, if the number of spare product wafers is less than the second number, the edge-filling wafer at the lower end of the crystal boat, which is the same as the number of spare product wafers, is moved to the bottom of the product wafer and adjacent to the product wafer.

[0096] For example, the number of spare product wafers is determined by the number of product wafers actually participating in the process task and the second configuration number for the product wafers. If the number is greater than or equal to the second number, all edge-filled wafers of the second number at the bottom of the crystal boat can be moved below the product wafers; if the number is less than the second number, the edge-filled wafers at the bottom of the crystal boat that are the same as the number of spare product wafers can be moved below the product wafers.

[0097] In this embodiment of the invention, sub-step S21 may include sub-steps S2104-S2106:

[0098] Sub-step S2104: When the wafer position loading mode is the second loading mode of placing wafers from bottom to top, determine the number of empty product wafers in the crystal boat;

[0099] When the pre-set wafer placement loading mode is the second loading mode of placing wafers from bottom to top, the number of empty product wafers in the wafer boat can be determined by the number of product wafers actually participating in the process task and the number of second configurations for the product wafers. Specifically, the second loading mode of placing wafers from bottom to top means that wafers are loaded starting from the bottom region of the wafer boat, leaving the top region of the wafer boat empty.

[0100] Sub-step S2105: If the number of spare product wafers is greater than or equal to the first number, then all the edge-filling wafers of the first number at the top of the crystal boat are moved above the product wafers and adjacent to the product wafers.

[0101] In sub-step S2106, if the number of spare product wafers is less than the first number, the edge-filling wafers at the top of the crystal boat, which are the same number as the number of spare product wafers, are moved above the product wafers and adjacent to them.

[0102] For example, the number of spare product wafers is determined by the number of product wafers actually participating in the process task and the number of second configurations for the product wafers. If the number is greater than or equal to the first number, all edge-filled wafers of the first number at the top of the crystal boat can be moved above the product wafers. If the number is less than the first number, the edge-filled wafers at the top of the crystal boat that are the same number as the number of spare product wafers can be moved above the product wafers.

[0103] In this embodiment of the invention, sub-step S21 may include sub-steps S2107-S2111:

[0104] Sub-step S2107: When the wafer position loading mode is the third loading mode of placing wafers from the middle to both ends, determine the number of empty product wafers in the crystal boat.

[0105] For example, when the pre-set wafer placement loading mode is the third loading mode of placing wafers from the middle to both ends, the number of spare product wafers in the wafer boat can be determined by the number of product wafers actually participating in the process task and the second configuration number of product wafers. Specifically, the third loading mode of placing wafers from the middle to both ends means that wafers are loaded starting from the middle area of ​​the wafer boat, using the middle slot on the wafer boat as a reference, and trying to ensure an even distribution across the top and bottom. If there are not enough wafers, such as one wafer being missing, the wafer is placed in the upper area.

[0106] Sub-step S2108: If the number of empty product wafers at the upper end of the crystal boat is greater than or equal to the first number, and the number of empty product wafers at the lower end of the crystal boat is greater than or equal to the second number, then all the edge-filling wafers of the first number at the upper end of the crystal boat are moved above the product wafer and adjacent to the product wafer, and all the edge-filling wafers of the second number at the lower end of the crystal boat are moved below the product wafer and adjacent to the product wafer.

[0107] Sub-step S2109: If the number of empty product wafers at the upper end of the crystal boat is less than the first number, and the number of empty product wafers at the lower end of the crystal boat is less than the second number, then the edge-filling wafers at the upper end of the crystal boat, which are the same number as the number of empty product wafers, are moved above the product wafers and adjacent to the product wafers; and the edge-filling wafers at the lower end of the crystal boat, which are the same number as the number of empty product wafers, are moved below the product wafers and adjacent to the product wafers.

[0108] In sub-step S2110, if the number of empty product wafers at the upper end of the crystal boat is greater than or equal to the first number, and the number of empty product wafers at the lower end of the crystal boat is less than the second number, then all the edge-filling wafers of the first number at the upper end of the crystal boat are moved above the product wafer and adjacent to the product wafer, and the edge-filling wafers of the same number at the lower end of the crystal boat as the number of empty product wafers are moved below the product wafer and adjacent to the product wafer.

[0109] In sub-step S2111, if the number of empty product wafers at the upper end of the crystal boat is less than the first number, and the number of empty product wafers at the lower end of the crystal boat is greater than or equal to the second number, then the edge-filling wafers at the upper end of the crystal boat, which are the same number as the number of empty product wafers, are moved above the product wafers and adjacent to the product wafers, and all the edge-filling wafers at the lower end of the crystal boat, which are the second number, are moved below the product wafers and adjacent to the product wafers.

[0110] For example, the number of spare product wafers is determined by the number of product wafers actually participating in the process task and the second configuration number of the product wafers. If the number of spare product wafers at the upper end of the crystal boat is greater than or equal to the first number, then all the edge-filling wafers of the first number at the upper end of the crystal boat are moved above and adjacent to the product wafers. If the number of spare product wafers at the upper end of the crystal boat is less than the first number, then the edge-filling wafers of the same number at the upper end of the crystal boat are moved above and adjacent to the product wafers. If the number of spare product wafers at the lower end of the crystal boat is greater than or equal to the second number, then all the edge-filling wafers of the second number at the lower end of the crystal boat are moved below and adjacent to the product wafers. If the number of spare product wafers at the lower end of the crystal boat is less than the second number, then the edge-filling wafers of the same number at the lower end of the crystal boat are moved below and adjacent to the product wafers.

[0111] To enable those skilled in the art to better understand the embodiments of the present invention, an example is provided below to illustrate the embodiments of the present invention:

[0112] In reference Figure 3 This is a schematic diagram of a vertical furnace machine for filling product wafers and moving edge-filling wafers, provided in an embodiment of the present invention. When the number of detection wafers participating in the process task in the crystal boat meets the material conditions and the number of product wafers participating in the process task is less than the configured number of product wafers, this process task does not support filling product wafers, but supports moving the edge-filling wafers. Then, according to the wafer position loading mode, the distribution mode of the edge-filling wafers in the crystal boat is re-determined.

[0113] Assuming P represents the product wafer, SD represents the edge-filling wafer, M represents the detection wafer, and ED represents the filled product wafer, the LoadMapRecipe is edited to provide the wafer recipe information for the wafer boat. TopDown mode is the first loading mode, placing wafers from top to bottom; BottomUp mode is the second loading mode, placing wafers from bottom to top; and Central mode is the third loading mode, placing wafers from the center outwards. This example uses a wafer boat with 143 slots.

[0114] Edit LoadMapRecipe: Requires 117 P values, P type List <int>={133, 132...87, 85...17, 16}; The required number of SDs is 25, and the SD type is List. <int>={143, 142……136, 135, 134, 15, 14……3, 2, 1}; Requires 1 M-type quantity; Set the arrangement mode of the wafers on the crystal boat to TopDown mode, BottomUp mode, and Central mode.

[0115] The actual number of selected process tasks P is 75; the number of M is 1; the number of SDs that can participate in process tasks in the machine is 25; and the number of EDs is 100.

[0116] Determine the number of idle Ps. The number of idle Ps is the number of required Ps minus the number of Ps currently actually participating in the process task: 117 - 75 = 42.

[0117] To obtain the number of movable SDs, based on the SD type list, the number of movable SDs at the top is 10, and the number of movable SDs at the bottom is 15.

[0118] 1) When the arrangement mode of the wafers on the wafer boat is set to Top-Down mode.

[0119] Since the number of free Ps is greater than the number of movable SDs at the bottom, all the SDs at the bottom need to be moved to wrap the Ps. Specifically, the P-type List uses indices 0 to 74 to store the actual Ps. The P-type list minus these 15 slot positions results in a List... <int>= {133, 132...87, 85..., 59, 58, 42, 41...17, 16}, SD type list, after deleting the original Slot position slot15 from slot1 and adding a new position slot57 to slot43, List <int>= {143, 142, 141, 140, 139, 138, 137, 136, 135, 134, 57, 56...45, 44, 43}. The actual location of P is in List. <int>={133, 132……87, 85……59, 58}.

[0120] 2) When the wafer arrangement mode on the wafer boat is set to BottomUp mode.

[0121] Since the number of free P's is greater than the number of movable SD's at the top, all the SD's at the top need to be moved to wrap the P's. Specifically, the P-type List uses indices 0 to 74 to store the actual P's. Subtracting these 10 slot positions from the P-type list results in a List... <int>= {133, 132...103, 102, 91, 90...87, 85...17, 16}, SD type list, delete the original Slot position moved from slot 143 to slot 134, add a new position from slot 101 to slot 92, then List <int>={101, 100, 99, 98, 97, 96, 95, 94, 93, 92, 15, 14...3, 2, 1}, where P is actually placed in List. <int>={91, 90……87, 85……17, 16}.

[0122] 3) When the wafer arrangement mode on the wafer boat is set to Central mode.

[0123] Since the number of empty Ps at the top of the crystal boat is greater than the number of movable SDs at the top, and the number of empty Ps at the bottom of the crystal boat is greater than the number of movable SDs at the bottom, it is necessary to move all the SDs at both ends by the corresponding number. First, determine that the index of the middle position Slot71 in the P-type List is 61. Second, determine that the actual Ps will be evenly placed from the middle position, wrapping the upper SDs above the Ps and wrapping the lower SDs below the Ps. The P-type list, after subtracting the 10 wrapped slots above and 15 wrapped slots below, will be a list... <int>= {133, 132...121, 120, 109, 108...87, 85...35, 34, 18, 17, 16}, SD type list after deleting the original position and adding the new position to the list. <int>={119……110,33……19}, where P is actually placed in List. <int>={109, 108……87, 85……35, 34}.

[0124] In this embodiment of the invention, the method may further include:

[0125] If the movement of the edge-filled wafer is not supported, a wafer alarm is triggered, and the problem is handled through either the first or the second processing method.

[0126] The first processing method is to terminate the process task; the second processing method is to ignore the wafer alarm.

[0127] For example, when the number of detection wafers participating in the process task in the crystal boat is the first configuration number, the number of product wafers participating in the process task is less than the second configuration number, the crystal boat does not support filling product wafers, and does not support moving the edge to fill wafers, a wafer alarm is triggered, the process task is terminated, or the wafer alarm is ignored.

[0128] In embodiments of the present invention, it may further include:

[0129] When the number of detection wafers participating in the process task in the crystal boat is the first configuration number, the number of product wafers participating in the process task is the second configuration number, and the number of edge-filling wafers participating in the process task in the crystal boat is less than the third configuration number, a wafer alarm is triggered and processed by the first processing method.

[0130] For example, if the number of inspection wafers and product wafers participating in the process task both meet the pre-configured number, and the number of edge-filling wafers participating in the process task is less than the pre-configured number, a wafer alarm is triggered, and the process task is terminated.

[0131] For example, in practical applications, edge-filled wafers are stored in the equipment, and generally, enough edge-filled wafers are placed before the process task. Furthermore, if the number of edge-filled wafers participating in the process task in the wafer boat is less than the third configuration number, the process task can be paused, and edge-filled wafers can be added to the equipment, thereby allowing the process task to continue.

[0132] In embodiments of the present invention, it may further include:

[0133] The wafer formulation information also includes a fourth configuration quantity for the filled product wafers;

[0134] When the number of detection wafers participating in the process task in the crystal boat is the first configuration number, the number of product wafers participating in the process task is the second configuration number, the number of edge filling wafers participating in the process task in the crystal boat is the third configuration number, and the number of filling product wafers participating in the process task in the crystal boat is less than the fourth configuration number, a wafer alarm is triggered and processed by the first processing method.

[0135] For example, when the number of inspection wafers, product wafers, and edge-filling wafers participating in the process task all meet the pre-configured number, if the number of filling product wafers participating in the process task is less than the pre-configured number, a wafer alarm is triggered, and the process task is terminated.

[0136] In this embodiment of the invention, a semiconductor process apparatus includes a process chamber, a crystal boat having multiple vertically arranged slots, and multiple edge-filled wafers placed at both ends of the crystal boat. The method includes: acquiring wafer recipe information for the crystal boat; wherein the wafer recipe information includes a first configuration quantity for test wafers, a second configuration quantity for product wafers, a wafer position loading mode, and a third configuration quantity for edge-filled wafers; when the number of test wafers participating in the process task in the crystal boat is the first configuration quantity and the number of product wafers participating in the process task is less than the second configuration quantity, determining whether moving edge-filled wafers is supported; if moving edge-filled wafers is supported, then when the number of edge-filled wafers participating in the process task in the crystal boat is greater than or equal to the third configuration quantity, moving the edge-filled wafers according to the wafer position loading mode, so that the product wafers in the crystal boat are wrapped by the edge-filled wafers. This embodiment of the invention uses a method of wrapping products with moving edge-filled wafers, which can meet process requirements and save on the loss of filled product wafers. The fewer the number of products and the more special the process conditions, the more filled product wafers are saved by using the method of wrapping products with moving edge-filled wafers.

[0137] To enable those skilled in the art to better understand the process of encapsulating semiconductor process equipment according to embodiments of the present invention, a complete example is provided below. (Refer to...) Figure 4 This is a logic flowchart of material calculation in a vertical furnace after adding a moving SD, provided by an embodiment of the present invention. Specifically, it may include the following steps:

[0138] Assuming P is the product wafer, SD is the edge-filled wafer, M is the detection wafer, ED is the filled product wafer, LoadMapRecipe is the wafer recipe information for the wafer boat, Move queue is the motion queue, Job is the process task, Abort is the process task termination, and continue is the wafer alarm ignoring.

[0139] Step 1: Use the LoadMapRecipe editor. Based on the wafer recipe information of the wafer boat, configure the quantity of inspection wafers, product wafers, edge-filled wafers, and filled product wafers before starting the process task, and set the wafer position loading mode; the wafer position loading mode can be a top-down wafer placement mode, a bottom-up wafer placement mode, or a center-to-end wafer placement mode.

[0140] Step 2: Select the P and M type materials to participate in the Job. Before starting the process task, select the quantity of product wafers and the number of wafers to be inspected in the actual process task.

[0141] Step 3, start the job.

[0142] Step 4: Obtain all SD and ED type materials that can participate in the process. After starting the process task, obtain the quantity of all edge-filled wafers and filled product wafers that can participate in this process task from the machine.

[0143] Step 5, check material conditions. This involves checking whether the quantities of product wafers, inspection wafers, edge-filled wafers, and filled product wafers actually involved in the process task meet the wafer formulation information of the wafer boat.

[0144] Step 6: Determine if the quantity of M meets the condition. Compare the number of wafers to be tested in the process task with the first configuration quantity. If the number of wafers to be tested is greater than the first configuration quantity, a multi-wafer alarm is triggered. The process task can be terminated, or the multi-wafer alarm can be ignored and the subsequent material judgment can proceed. If the number of wafers to be tested is less than the first configuration quantity, a few-wafer alarm is triggered. The process task can be terminated, or the few-wafer alarm can be ignored and the subsequent material judgment can proceed.

[0145] Step 7: Determine if the quantity of P meets the conditions. If the detected wafer meets the material conditions, determine if the product wafer meets the material conditions. If the quantity of the product wafer is greater than the second configuration quantity, a multi-product wafer alarm is triggered, and the process task is terminated or the multi-product wafer alarm is ignored. If the quantity of the product wafer is less than the second configuration quantity, determine if filling with product wafers is supported. If filling is not supported, continue to determine if moving edge filling with wafers is supported. If moving edge filling with wafers is not supported, a shortage of product wafers alarm is triggered. The process task can be terminated, or this shortage of product wafers alarm can be ignored, and subsequent material judgment can be performed. The missing product wafer positions are left empty. If the quantity of the product wafer is less than the second configuration quantity and filling with product wafers is supported, proceed to step 8; if the quantity of the product wafer is less than the second configuration quantity, filling with product wafers is not supported, but moving edge filling with wafers is supported, then the distribution of wafers on the wafer boat is re-determined according to the wafer position loading mode of the wafer formula information.

[0146] Step 8: Determine if the number of SDs meets the requirements. If the actual number of edge-filled wafers participating in the process task is less than the configured number of edge-filled wafers, a short edge-filled wafer alarm is triggered, and the process task is terminated. If the actual number of edge-filled wafers participating in the process task is not less than the configured number of edge-filled wafers, proceed to step 9.

[0147] Step 9: Determine if the ED meets the material requirements. If the actual number of filled product wafers participating in the process task is less than the configured number of filled product wafers, a short-filling product wafer alarm is triggered, and the process task is terminated. If the actual number of filled product wafers participating in the process task is not less than the configured number of filled product wafers, proceed to step 10.

[0148] Step 10: Remove excess material after sorting. Based on the above material conditions, excess filled product wafers and edge-filled wafers are removed by sorting.

[0149] Step 11, Set Material Priorities. Set the priorities for product wafers, inspection wafers, filled product wafers, and edge-filled wafers during the transport process.

[0150] Step 12: Proceed to scheduling calculation. Based on the wafer position loading mode set above, recalculate the wafer distribution on the wafer boat by rearranging the wafer sequence.

[0151] Step 13, Generate Move Queue. A move queue is generated based on the wafer priority and the recalculated wafer distribution on the wafer boat.

[0152] Step 14, Move Order. Based on the movement queue, the product wafers, inspection wafers, filled product wafers, and edge-filled wafers in the process chamber are transferred to the slots in the wafer boat.

[0153] Step 15, the Job runs normally.

[0154] It should be noted that, for the sake of simplicity, the method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments of the present invention are not limited to the described order of actions, because according to the embodiments of the present invention, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions involved are not necessarily essential to the embodiments of the present invention.

[0155] Reference Figure 5 This diagram illustrates a structural block diagram of a semiconductor process apparatus according to an embodiment of the present invention. The semiconductor process apparatus 501 includes a process chamber, a crystal boat having a plurality of vertically arranged slots, and a plurality of edge-filled wafers placed at both ends of the crystal boat; it also includes:

[0156] Controller 5011 is used to acquire wafer recipe information for a crystal boat; the wafer recipe information includes a first configuration number for inspection wafers, a second configuration number for product wafers, a wafer position loading mode, and a third configuration number for edge-filling wafers; when the number of inspection wafers participating in the process task in the crystal boat is the first configuration number and the number of product wafers participating in the process task is less than the second configuration number, it determines whether it supports moving the edge-filling wafers; if it supports moving the edge-filling wafers, then when the number of edge-filling wafers participating in the process task in the crystal boat is greater than or equal to the third configuration number, according to the wafer position loading mode, the edge-filling wafers are moved so that the product wafers in the crystal boat are wrapped by the edge-filling wafers.

[0157] In an optional embodiment of the present invention, the controller is configured to, when the number of edge-filled wafers participating in the process task in the wafer boat is greater than or equal to the third configuration number, move the edge-filled wafers at the upper end of the wafer boat above the product wafer and adjacent to the product wafer according to the wafer position loading mode, and / or move the edge-filled wafers at the lower end of the wafer boat below the product wafer and adjacent to the product wafer.

[0158] In an optional embodiment of the present invention, the upper end of the crystal boat has a first number of edge-filled wafers and the lower end has a second number of edge-filled wafers. The controller is configured to determine the number of empty product wafers in the crystal boat when the wafer position loading mode is a first loading mode of placing wafers from top to bottom; if the number of empty product wafers is greater than or equal to the second number, then all the edge-filled wafers of the second number at the lower end of the crystal boat are moved below the product wafer and adjacent to the product wafer; if the number of empty product wafers is less than the second number, then the edge-filled wafers at the lower end of the crystal boat with the same number of empty product wafers are moved below the product wafer and adjacent to the product wafer.

[0159] In an optional embodiment of the present invention, the controller is configured to determine the number of spare product wafers in the wafer boat when the wafer position loading mode is a second loading mode of placing wafers from bottom to top; if the number of spare product wafers is greater than or equal to the first number, then all the edge-filling wafers of the first number at the top of the wafer boat are moved above the product wafer and adjacent to the product wafer; if the number of spare product wafers is less than the first number, then the edge-filling wafers at the top of the wafer boat with the same number of spare product wafers are moved above the product wafer and adjacent to the product wafer.

[0160] In an optional embodiment of the present invention, the controller is configured to determine the number of spare product wafers in the wafer boat when the wafer position loading mode is a third loading mode in which wafers are placed from the middle to both ends; if the number of spare product wafers at the upper end of the wafer boat is greater than or equal to the first number, and the number of spare product wafers at the lower end of the wafer boat is greater than or equal to the second number, then all the edge-filling wafers of the first number at the upper end of the wafer boat are moved above the product wafer and adjacent to the product wafer, and all the edge-filling wafers of the second number at the lower end of the wafer boat are moved below the product wafer and adjacent to the product wafer; if the number of spare product wafers at the upper end of the wafer boat is less than the first number, and the number of spare product wafers at the lower end of the wafer boat is less than the second number, then the edge-filling wafers of the same .... Edge-filling wafers of the same number as the product wafers are moved to the bottom of the product wafer and adjacent to it. If the number of empty product wafers at the upper end of the crystal boat is greater than or equal to the first number, and the number of empty product wafers at the lower end of the crystal boat is less than the second number, then all edge-filling wafers of the first number at the upper end of the crystal boat are moved to the top of the product wafer and adjacent to it, and edge-filling wafers of the same number as the empty product wafers at the lower end of the crystal boat are moved to the bottom of the product wafer and adjacent to it. If the number of empty product wafers at the upper end of the crystal boat is less than the first number, and the number of empty product wafers at the lower end of the crystal boat is greater than or equal to the second number, then edge-filling wafers of the same number as the empty product wafers at the upper end of the crystal boat are moved to the top of the product wafer and adjacent to it, and edge-filling wafers of the second number at the lower end of the crystal boat are moved to the bottom of the product wafer and adjacent to it.

[0161] In an optional embodiment of the present invention, the controller is further configured to trigger a wafer alarm if it does not support moving the edge-filled wafer, and process the alarm using a first processing method or a second processing method; wherein the first processing method is to terminate the process task; and the second processing method is to ignore the wafer alarm.

[0162] In an optional embodiment of the present invention, the controller is further configured to determine whether filling of product wafers is supported when the number of detection wafers participating in the process task in the crystal boat is the first configured number and the number of product wafers participating in the process task is less than the second configured number; if filling of product wafers is not supported, then determine whether moving the edge filling wafer is supported.

[0163] In an optional embodiment of the present invention, the controller is further configured to trigger a wafer alarm and process it through a first processing method when the number of detection wafers participating in the process task in the wafer boat is the first configuration number, the number of product wafers participating in the process task is the second configuration number, and the number of edge-filling wafers participating in the process task in the wafer boat is less than the third configuration number.

[0164] In an optional embodiment of the present invention, the wafer formulation information further includes a fourth configuration quantity for filler product wafers. The controller is further configured to trigger a wafer alarm and process it through a first processing method when the number of detection wafers participating in the process task in the wafer boat is the first configuration quantity, the number of product wafers participating in the process task is the second configuration quantity, the number of edge filler wafers participating in the process task in the wafer boat is the third configuration quantity, and the number of filler product wafers participating in the process task in the wafer boat is less than the fourth configuration quantity.

[0165] In summary, in this embodiment of the invention, the semiconductor process equipment includes a process chamber, which is equipped with a crystal boat. The crystal boat has multiple vertically arranged slots, and multiple edge-filled wafers are placed at both ends of the crystal boat. The method includes: acquiring wafer recipe information for the crystal boat; wherein, the wafer recipe information includes a first configuration number for test wafers, a second configuration number for product wafers, a wafer position loading mode, and a third configuration number for edge-filled wafers; when the number of test wafers participating in the process task in the crystal boat is the first configuration number and the number of product wafers participating in the process task is less than the second configuration number, determining whether moving edge-filled wafers is supported; if moving edge-filled wafers is supported, then when the number of edge-filled wafers participating in the process task in the crystal boat is greater than or equal to the third configuration number, according to the wafer position loading mode, the edge-filled wafers are moved so that the product wafers in the crystal boat are wrapped by the edge-filled wafers. This embodiment of the invention uses a method of wrapping products with moving edge-filled wafers, which can both meet process requirements and save on the loss of filled product wafers. The fewer the number of products and the more special the process conditions, the more filled product wafers are saved by using the method of wrapping products with moving edge-filled wafers.

[0166] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0167] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, apparatus, or computer program products. Therefore, embodiments of the present invention can take the form of entirely hardware embodiments, entirely software embodiments, or embodiments combining software and hardware aspects. Furthermore, embodiments of the present invention can take the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0168] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0169] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing terminal device to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0170] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal equipment, causing a series of operational steps to be performed on the computer or other programmable terminal equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable terminal equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0171] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0172] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0173] The above provides a detailed description of a wafer wrapping method and a semiconductor process apparatus provided by the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.< / int> < / int> < / int> < / int> < / int> < / int> < / int> < / int> < / int> < / int> < / int>

Claims

1. A method for wrapping a wafer in a semiconductor process apparatus, characterized in that, The semiconductor process equipment includes a process chamber, the process chamber is equipped with a crystal boat, and multiple edge-filled wafers are placed at both ends of the crystal boat. The method includes: Obtain wafer formulation information for the crystal boat; the wafer formulation information includes a first configuration quantity for the test wafers, a second configuration quantity for the product wafers, a wafer position loading mode, and a third configuration quantity for the edge-filling wafers; the wafer position loading mode includes: a loading mode for placing wafers from top to bottom, a loading mode for placing wafers from bottom to top, and a loading mode for placing wafers from the middle to both ends; When the number of detection wafers participating in the process task in the crystal boat is the first configuration number and the number of product wafers participating in the process task is less than the second configuration number, it is determined whether to support moving the edge filling wafer; If the movement of the edge-filled wafers is supported, then when the number of edge-filled wafers participating in the process task in the ship is greater than or equal to the third configuration number, the edge-filled wafers are moved according to the wafer position loading mode so that the product wafers in the ship are wrapped by the edge-filled wafers.

2. The method according to claim 1, characterized in that, When the number of edge-filled wafers participating in the process task in the wafer boat is greater than or equal to the third configuration number, the edge-filled wafers are moved according to the wafer position loading mode so that the product wafers in the wafer boat are wrapped by the edge-filled wafers, including: When the number of edge-filled wafers participating in the process task in the crystal boat is greater than or equal to the third configuration number, according to the wafer position loading mode, the edge-filled wafers at the upper end of the crystal boat are moved above the product wafer and adjacent to the product wafer, and / or the edge-filled wafers at the lower end of the crystal boat are moved below the product wafer and adjacent to the product wafer.

3. The method according to claim 2, characterized in that, The upper end of the crystal boat has a first number of edge-filled wafers, and the lower end has a second number of edge-filled wafers; The step of moving the edge-filled wafer at the upper end of the wafer boat above and adjacent to the product wafer, and / or moving the edge-filled wafer at the lower end of the wafer boat below and adjacent to the product wafer, according to the wafer position loading mode, includes: When the wafer position loading mode is the first loading mode of placing wafers from top to bottom, determine the number of empty product wafers in the wafer boat; If the number of spare product wafers is greater than or equal to the second number, then all the edge-filling wafers of the second number at the lower end of the crystal boat are moved to below the product wafer and adjacent to the product wafer; If the number of spare product wafers is less than the second number, then the edge-filling wafer at the lower end of the crystal boat, which is the same number as the number of spare product wafers, is moved to the bottom of the product wafer and adjacent to the product wafer.

4. The method according to claim 3, characterized in that, The step of moving the edge-filled wafer at the upper end of the wafer boat above and adjacent to the product wafer, and / or moving the edge-filled wafer at the lower end of the wafer boat below and adjacent to the product wafer, according to the wafer position loading mode, further includes: When the wafer position loading mode is the second loading mode of placing wafers from bottom to top, determine the number of empty product wafers in the crystal boat; If the number of spare product wafers is greater than or equal to the first number, then all the edge-filling wafers of the first number at the top of the crystal boat are moved above the product wafers and adjacent to the product wafers. If the number of spare product wafers is less than the first number, then the edge-filling wafers at the top of the crystal boat, which are the same number as the number of spare product wafers, are moved above the product wafers and adjacent to them.

5. The method according to claim 3 or 4, characterized in that, The step of moving the edge-filled wafer at the upper end of the wafer boat above and adjacent to the product wafer, and / or moving the edge-filled wafer at the lower end of the wafer boat below and adjacent to the product wafer, according to the wafer position loading mode, further includes: When the wafer placement loading mode is the third loading mode, which places wafers from the middle to both ends, the number of spare product wafers in the wafer boat is determined. If the number of empty product wafers at the upper end of the crystal boat is greater than or equal to the first number, and the number of empty product wafers at the lower end of the crystal boat is greater than or equal to the second number, then all the edge-filling wafers of the first number at the upper end of the crystal boat are moved above the product wafer and adjacent to the product wafer, and all the edge-filling wafers of the second number at the lower end of the crystal boat are moved below the product wafer and adjacent to the product wafer. If the number of empty product wafers at the upper end of the crystal boat is less than the first number, and the number of empty product wafers at the lower end of the crystal boat is less than the second number, then the edge-filling wafers at the upper end of the crystal boat, which are the same number as the number of empty product wafers, are moved above the product wafers and adjacent to the product wafers, and the edge-filling wafers at the lower end of the crystal boat, which are the same number as the number of empty product wafers, are moved below the product wafers and adjacent to the product wafers. If the number of empty product wafers at the upper end of the crystal boat is greater than or equal to the first number, and the number of empty product wafers at the lower end of the crystal boat is less than the second number, then all the edge-filling wafers of the first number at the upper end of the crystal boat are moved above the product wafer and adjacent to the product wafer, and the edge-filling wafers of the same number at the lower end of the crystal boat as the number of empty product wafers are moved below the product wafer and adjacent to the product wafer. If the number of empty product wafers at the upper end of the crystal boat is less than the first number, and the number of empty product wafers at the lower end of the crystal boat is greater than or equal to the second number, then the edge-filling wafers at the upper end of the crystal boat, which are the same number as the number of empty product wafers, are moved above the product wafers and adjacent to them. All the edge-filling wafers at the lower end of the crystal boat, representing the second number, are moved below the product wafers and adjacent to them.

6. The method according to claim 1, characterized in that, The step of determining whether to support moving the edge-filling wafer when the number of inspection wafers participating in the process task in the crystal boat is the first configuration number and the number of product wafers participating in the process task is less than the second configuration number further includes: If the movement of the edge-filled wafer is not supported, a wafer alarm is triggered, and the problem is handled through either the first or the second processing method. The first processing method is to terminate the process task; the second processing method is to ignore the wafer alarm.

7. The method according to claim 1, characterized in that, When the number of inspection wafers participating in the process task in the crystal boat is the first configuration number and the number of product wafers participating in the process task is less than the second configuration number, determining whether to support moving the edge-filling wafers includes: When the number of detection wafers participating in the process task in the crystal boat is the first configuration number and the number of product wafers participating in the process task is less than the second configuration number, it is determined whether to support filling of product wafers. If the filling of the product wafer is not supported, then determine whether moving the edge-filled wafer is supported; If filling of product wafers is supported, and the number of edge-filled wafers actually participating in the process task is not less than the number of configured edge-filled wafers, and the number of filled product wafers actually participating in the process task is not less than the number of configured filled product wafers, then excess filled product wafers and edge-filled wafers are removed by sorting; the priorities of product wafers, inspection wafers, filled product wafers, and edge-filled wafers are set during the transfer process; the distribution of wafers on the wafer boat is determined according to the wafer position loading mode; a motion queue is generated according to the priorities and the distribution mode; and the product wafers, inspection wafers, filled product wafers, and edge-filled wafers in the process chamber are transferred to the slots of the wafer boat according to the motion queue.

8. The method according to claim 1, characterized in that, Also includes: When the number of detection wafers participating in the process task in the crystal boat is the first configuration number, the number of product wafers participating in the process task is the second configuration number, and the number of edge-filling wafers participating in the process task in the crystal boat is less than the third configuration number, a wafer alarm is triggered and processed by the first processing method.

9. The method according to claim 1, characterized in that, The wafer formulation information also includes a fourth configuration quantity for the filled product wafers, and the method further includes: When the number of detection wafers participating in the process task in the crystal boat is the first configuration number, the number of product wafers participating in the process task is the second configuration number, the number of edge filling wafers participating in the process task in the crystal boat is the third configuration number, and the number of filling product wafers participating in the process task in the crystal boat is less than the fourth configuration number, a wafer alarm is triggered and processed by the first processing method.

10. A semiconductor process apparatus, characterized in that, The semiconductor process equipment includes a process chamber, a crystal boat is provided in the process chamber, and multiple edge-filled wafers are placed at both ends of the crystal boat. The semiconductor process equipment also includes: A controller is used to acquire wafer formulation information for a wafer boat; the wafer formulation information includes a first configuration quantity for inspection wafers, a second configuration quantity for product wafers, a wafer position loading mode, and a third configuration quantity for edge-filling wafers; the wafer position loading mode includes: a loading mode for placing wafers from top to bottom, a loading mode for placing wafers from bottom to top, and a loading mode for placing wafers from the middle to both ends; when the number of inspection wafers participating in the process task in the wafer boat is the first configuration quantity and the number of product wafers participating in the process task is less than the second configuration quantity, it is determined whether it is supported to move the edge-filling wafers; if it is supported to move the edge-filling wafers, then when the number of edge-filling wafers participating in the process task in the wafer boat is greater than or equal to the third configuration quantity, according to the wafer position loading mode, the edge-filling wafers are moved so that the product wafers in the wafer boat are wrapped by the edge-filling wafers.

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