Display panel, display device, and forming method of display panel

Abstract

This application relates to a display panel, a display device, and a method for forming a display panel. The display panel includes: a substrate, and a plurality of pixel islands, connecting lines, a magnetic adsorption layer, and a transition line disposed on the substrate; wherein, the substrate has a via, which is formed by a recess in the substrate starting from one side of its thickness direction and extending along the thickness direction, and the wall surrounding the via includes a sidewall and a bottom wall; the plurality of pixel islands and the via are located on the same side of the substrate; the magnetic adsorption layer is disposed on the sidewall; the transition line is disposed on the side of the magnetic adsorption layer away from the sidewall, and the transition line is electrically connected to the connecting lines and the pixel islands. The display panel, display device, and method for forming a display panel provided in the embodiments of this application can ensure the electrical connection requirements between the pixel islands and the connecting lines.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a display device and a forming method of the display panel. BACKGROUND

[0002] Display panels are commonly used products in people's daily life. Usually, display panels are made of rigid materials such as glass. The size of the display panel is fixed, and the fragile structure is fragile. Therefore, the concept of stretchable display panel is proposed.

[0003] The existing stretchable display panel usually disconnects the electrodes of the light emitting unit for the purpose of ensuring stretchability, and then connects the electrodes through a switching line and a bridging line. The existing switching line setting position causes the display panel to have the defect of poor electrical connection between the light emitting unit and the bridging line after forming, which affects the normal display of the display panel. SUMMARY

[0004] The present application provides a display panel, a display device and a forming method of the display panel, which can ensure the electrical connection between the pixel island and the connecting line.

[0005] In one aspect, the present application provides a display panel, comprising:

[0006] A substrate, the substrate is provided with a connecting line and a via hole, the via hole is formed by recessing from one side of the substrate in the thickness direction and along the thickness direction, and the wall part enclosing the via hole includes a side wall and a bottom wall;

[0007] A plurality of pixel islands, the plurality of pixel islands and the via hole are located on the same side of the substrate;

[0008] A magnetic adsorption layer, disposed on the side wall;

[0009] A switching line, disposed on the side of the magnetic adsorption layer away from the side wall, the switching line is electrically connected with the connecting line and the pixel island.

[0010] According to one aspect of the present application, the magnetic adsorption layer includes a colloid layer and a magnetic body disposed in the colloid layer, and the colloid layer is bonded to the side wall.

[0011] According to one aspect of the present application, the magnetic body includes at least one of iron single substance, cobalt single substance, nickel single substance, aluminum-nickel alloy, iron-chromium alloy and magnesium-zinc alloy.

[0012] According to one aspect of the present application, each pixel island includes at least one light emitting unit; the light emitting unit includes a first electrode, an organic material layer and a second electrode which are sequentially stacked in the thickness direction, the first electrode is located between the second electrode and the substrate in the thickness direction, and the switching line is disposed in the same layer as the second electrode and is electrically connected with the second electrode.

[0013] According to an aspect of embodiments of the present application, the substrate includes a plurality of bearing areas and a plurality of bridge areas, the plurality of bearing areas are arranged at intervals and adjacent two bearing areas are connected by a bridge area, at least part of the bridge areas are provided with at least part of the connection lines, at least part of the bearing areas are provided with the via holes, each pixel island is located in one of the bearing areas,

[0014] The substrate includes a substrate, a device layer arranged on the substrate in layers, and a planarization layer arranged on a side of the device layer away from the substrate, the device layer includes a pixel circuit located in a bearing area, the pixel circuit is electrically connected with a light emitting unit, the light emitting unit is located on a side of the planarization layer away from the substrate, and the planarization layer is provided with a via hole in part of each bearing area.

[0015] According to an aspect of embodiments of the present application, the device layer includes two or more conductive layers and insulating layers alternately distributed along the thickness direction, and the connection line is formed in one of the conductive layers.

[0016] According to an aspect of embodiments of the present application, the included angle between the side wall and the bottom wall is an acute angle or a right angle.

[0017] According to an aspect of embodiments of the present application, one end of the adapter line away from the bottom wall is electrically connected with the pixel island, and the other end of the adapter line close to the bottom wall is electrically connected with the connection line.

[0018] According to an aspect of embodiments of the present application, the connection line is at least partially exposed in the via hole, and the adapter line is electrically connected with the part of the connection line exposed in the via hole.

[0019] According to an aspect of embodiments of the present application, the connection line is at least partially extended along the thickness direction and exposed in the part of the via hole, and the part of the connection line is arranged on the side wall.

[0020] On the other hand, according to an aspect of embodiments of the present application, a display device is provided, which includes the display panel described above.

[0021] In yet another aspect, according to an aspect of embodiments of the present application, a forming method of a display panel is provided, which includes:

[0022] providing a substrate;

[0023] forming a pixel island, a connection line, a via hole, and an adapter line on the side wall in each via hole on the substrate in sequence, the via hole is formed by recessing the substrate from one side in the thickness direction of the substrate along the thickness direction, the wall part enclosing the via hole includes a side wall and a bottom wall, and the adapter line is electrically connected with the connection line and the pixel island.

[0024] According to another aspect of embodiments of the present application, the step of forming a magnetic adsorption layer on the side wall of each via hole includes:

[0025] providing a glue solution mixed with a magnetic body;

[0026] The glue solution mixed with the magnetic body is applied to the sidewall of each via hole;

[0027] The glue solution mixed with the magnetic body is cured to form a magnetic adsorption layer.

[0028] According to another aspect of the embodiments of the present application, each pixel island includes at least one light emitting unit; the light emitting unit includes a first electrode, an organic material layer and a second electrode which are sequentially stacked in a thickness direction; and the step of forming the pixel islands on the substrate and forming the transfer lines on the magnetic adsorption layer in each via hole includes:

[0029] forming a first electrode layer on the substrate and patterning the first electrode layer to form a plurality of first electrodes;

[0030] forming an organic material layer on the first electrode layer;

[0031] forming a second electrode layer on the organic material layer to form a second electrode, and part of the material forming the second electrode layer is deposited to the sidewall of the via hole under the magnetic adsorption of the magnetic adsorption layer, and a transfer line electrically connected to the second electrode and the connecting line is formed.

[0032] According to another aspect of the embodiments of the present application, the magnetic adsorption layer is formed on the sidewall of each via hole before the organic material layer is formed on the first electrode layer;

[0033] When the organic material layer is formed on the first electrode layer, the organic material layer is broken at the sidewall of the via hole to expose the magnetic adsorption layer on the sidewall of the via hole.

[0034] The display panel, the display device and the forming method of the display panel provided by the embodiments of the present application, the display panel includes a substrate, and a plurality of pixel islands, a connecting line, a magnetic adsorption layer and a transfer line arranged on the substrate; wherein the substrate is provided with a via hole, the via hole is formed by recessing the substrate in a thickness direction of the substrate from one side of the thickness direction, and the wall part enclosing the via hole includes a sidewall and a bottom wall; the plurality of pixel islands and the via hole are located on the same side of the substrate; the magnetic adsorption layer is arranged on the sidewall; the transfer line is arranged on the side of the magnetic adsorption layer away from the sidewall, and the transfer line is electrically connected to the connecting line and the pixel island.

[0035] Since the magnetic adsorption layer has a magnetic force adsorption effect on the conductive material such as metal used to form the transfer line, it is beneficial to form the transfer line on the sidewall of the via hole. The transfer line is arranged on the sidewall of each via hole and electrically connected to the pixel island and the corresponding connecting line, which can ensure the display requirements of the display panel. Moreover, arranging the transfer line on the sidewall of the via hole can effectively avoid the transfer line being blocked by other materials in the via hole during the forming process, ensuring the electrical connection requirements of the transfer line, the connecting line and the pixel island, and further ensuring the electrical connection requirements between the pixel island and the connecting line, and optimizing the display effect of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0036] The features, advantages, and technical effects of the exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0037] Figure 1 is a top view of a partial structure of a display panel of one embodiment of the present application;

[0038] Figure 2 is Figure 1 is a sectional view along direction A-A in

[0039] Figure 3 is Figure 2 is an enlarged view at B in

[0040] Figure 4 is a sectional view of a display panel of another embodiment of the present application;

[0041] Figure 5 is a flowchart of a forming method of a display panel of one embodiment of the present application;

[0042] Figures 6 to 13 is a structure diagram corresponding to part of steps of a forming method of a display panel of one embodiment of the present application.

[0043] wherein:

[0044] 10 - substrate; 10a - bearing region; 10b - bridge region;

[0045] 11 - substrate; 111 - via hole; 111a - side wall; 111b - bottom wall;

[0046] 12 - device layer; 121 - pixel circuit; 12a - active layer; 12b - first insulating layer; 12c - first metal layer; 12d - second insulating layer; 12e - third insulating layer; 12f - third metal layer;

[0047] 13 - planarization layer; 14 - connection line; 15 - pixel definition layer;

[0048] 20 - pixel island; 21 - light emitting unit; 211 - first electrode; 212 - organic material layer; 213 - second electrode;

[0049] 30 - transfer line;

[0050] 40 - magnetic adsorption layer; 41 - colloid layer; 42 - magnetic body, 50 - filling layer.

[0051] In the drawings, the same parts are designated with the same reference numerals. The accompanying drawings are not drawn to scale. DETAILED DESCRIPTION

[0052] Features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one of ordinary skill in the art that the present application can be practiced without some or all of these specific details. The description of the embodiments is merely illustrative of the present application and is not intended to limit the present application, as is apparent to one of ordinary skill in the art. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one of ordinary skill in the art that the present application can be practiced without some or all of these specific details. In other instances, well known structures and functions have not been described in detail in order to avoid obscuring the present application. Also, the description is not to be considered limiting in scope in that the features, structures, or characteristics described can be combined in any suitable manner in one or more embodiments.

[0053] The orientation words appearing in the following description are the directions shown in the drawings, and are not intended to limit the specific structure of the true display panel, display device, and forming method of the display panel. In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be directly connected, or indirectly connected. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0054] An organic light emitting diode (OLED) is an active light emitting display device, which has the advantages of self-emission, wide viewing angle, high contrast, low power consumption, wide color gamut, thinness, and the like. Display panels are commonly used in people's daily life. Usually, display panels are made of rigid materials such as glass. The size of the display panel is fixed, and the fragile structure is fragile. Therefore, the concept of stretchable display panel has been proposed.

[0055] In the stretchable display panel, the cathode of the light emitting unit is a thin metal with a thickness of 13-15 nm, which does not have stretchability. Therefore, the stretchable display panel needs to separate the cathodes between the light emitting units, and then connect the separated electrodes with the cathode traces through the adapter lines. The existing display panel is usually provided with a cathode via hole, and an adapter line is arranged on the bottom wall of the cathode via hole, so as to connect the separated electrodes with the cathode traces through the adapter line, in order to ensure the stretchability thereof.

[0056] However, when the electrode is a cathode, the transition line is formed before the organic material layer of the organic light emitting diode is generally deposited in a whole surface, so that the bottom wall of the via hole will cover the organic material layer, resulting in a situation that the formed transition line cannot be connected with the cathode trace. If the organic material layer in the via hole is removed by laser etching and ashing, and then the cathode is deposited, the process will be more complex, and the impurities generated after ashing will pollute the chamber and affect the normal display of the display panel.

[0057] To solve the above technical problems, the display panel, the display device and the forming method of the display panel are provided, which can ensure the electrical connection between the pixel island and the connecting line.

[0058] Please refer to Figures 1 to 3 As shown in the figure, the display panel provided by the embodiment of the present application includes a substrate 10, a pixel island 20, a connecting line 14 and a transition line 30.

[0059] The substrate 10 is provided with the connecting line 14 and a via hole 111. The via hole 111 is formed by recessing the substrate 10 from one side in the thickness direction X of the substrate 10 and along the thickness direction X. The wall part surrounding the via hole 111 includes a side wall 111a and a bottom wall 111b. The plurality of pixel islands 20 and the via hole 111 are located on the same side of the substrate 10.

[0060] Optionally, the substrate 10 includes a plurality of bearing areas 10a and a plurality of bridge areas 10b. The plurality of bearing areas 10a are arranged at intervals, and two adjacent bearing areas 10a are connected by the bridge area 10b. At least part of the bridge area 10b is provided with at least part of the connecting line 14, and at least part of the bearing area 10a is provided with the via hole 111. Optionally, the connecting line 14 can be at least partially exposed to the via hole 111. The number of pixel islands 20 is a plurality, and each pixel island 20 is located in one of the bearing areas 10a. Each pixel island 20 includes at least one light emitting unit 21. Each via hole 111 is provided with a transition line 30, and the transition line 30 is stacked on the side wall 111a and electrically connected with the connecting line 14 and the light emitting unit 21.

[0061] The display panel can be a flexible display panel. The display panel can include an organic light emitting diode display panel. The display panel can be a stretchable display panel.

[0062] Please continue to refer to Figures 1 to 3 As an optional embodiment, the display panel provided by the embodiment of the present application further includes a magnetic adsorption layer. The magnetic adsorption layer 40 is arranged on the side wall 111a. The transition line 30 is arranged on the side of the magnetic adsorption layer 40 away from the side wall 111a, and the transition line 30 is electrically connected with the connecting line 14 and the pixel island 20.

[0063] The side wall 111a is provided with a magnetic adsorption layer 40 clamped between the side wall 111a and the adapter wire 30. Optionally, the magnetic adsorption layer 40 can be arranged on the side wall 111a of each via hole 111. The magnetic adsorption layer 40 is clamped between the side wall 111a and the adapter wire 30. The magnetic adsorption layer 40 can be in direct contact with the side wall 111a. The magnetic adsorption layer 40 can be in direct contact with the adapter wire 30.

[0064] By arranging the magnetic adsorption layer 40, when the adapter wire 30 is formed in the via hole 111, the metal material entering the via hole 111 can be adsorbed and deposited on the side wall 111a of the via hole 111 by the magnetic adsorption effect of the magnetic adsorption layer 40, which is beneficial to the formation of the adapter wire 30 on the side wall 111a of the via hole 111.

[0065] The display panel provided by the embodiment of the present application includes a substrate 10, a plurality of pixel islands 20, a connection line 14, a magnetic adsorption layer 40 and an adapter wire 30 arranged on the substrate 10. The substrate 10 is provided with a via hole 111 formed by recessing from one side of the substrate 10 in the thickness direction X and along the thickness direction X. The wall part enclosing the via hole 111 includes a side wall 111a and a bottom wall 111b. The plurality of pixel islands 20 and the via hole 111 are located on the same side of the substrate 10. The magnetic adsorption layer 40 is arranged on the side wall 111a. The adapter wire 30 is arranged on the side of the magnetic adsorption layer 40 away from the side wall 111a, and the adapter wire 30 is electrically connected with the connection line 14 and the pixel island 20. Since the magnetic adsorption layer 40 has a magnetic force adsorption effect on the conductive material such as metal used to form the adapter wire 30, the adapter wire 30 is beneficial to be formed on the side wall 111a of the via hole 111. The adapter wire 30 is arranged on the side wall 111a of the via hole 111 and electrically connected with the pixel island 20 and the corresponding connection line 14, which can ensure the display requirement and stretchable requirement of the display panel. Moreover, arranging the adapter wire 30 on the side wall of the via hole can effectively avoid the adapter wire being blocked by other materials in the forming process, ensure the electrical connection requirement between the adapter wire and the connection line and the pixel island, and further ensure the electrical connection requirement between the pixel island and the connection line, thereby optimizing the display effect of the display panel.

[0066] Optionally, the magnetic adsorption layer 40 can completely cover the side wall 111a of the via hole 111, and the size of the magnetic adsorption layer 40 along the direction X is equal to the size of the side wall 111a along the direction X. Of course, in some examples, the magnetic adsorption layer 40 can cover part of the side wall 111a of the via hole 111, that is, the size of the magnetic adsorption layer 40 along the direction X is slightly smaller than the size of the side wall 111a along the direction X, as long as the magnetic adsorption effect on the metal material can be met, and the electrical connection requirement between the formed adapter wire 30 and the connection line 14 and the light emitting unit 21 can be ensured.

[0067] As an optional implementation, the display panel provided by the embodiment of the present application, the magnetic adsorption layer 40 comprises a colloid layer 41 and a magnetic body 42 arranged in the colloid layer 41, and the colloid layer 41 is bonded to the side wall 111a. The magnetic adsorption layer 40 adopts the above form, which is simple in structure and conducive to forming the magnetic adsorption layer 40 on the side wall 111a, and can ensure the magnetic adsorption requirement of the adapter wire 30 in the forming process.

[0068] In some optional embodiments, the display panel provided by the embodiment of the present application, the magnetic body 42 comprises at least one of iron single substance, cobalt single substance, nickel single substance, iron-chromium alloy and magnesium-zinc alloy. The magnetic body 42 adopts the above form, which is good in magnetic adsorption effect on metal and easy to obtain.

[0069] Optionally, the magnetic body 42 can only comprise one of iron single substance, cobalt single substance, nickel single substance, iron-chromium alloy and magnesium-zinc alloy, and of course, the magnetic body 42 can also comprise two or more of iron single substance, cobalt single substance, nickel single substance, iron-chromium alloy and magnesium-zinc alloy. As long as the adsorption effect can be ensured, the metal material entering the via hole 111 can be adsorbed and deposited on the side wall 111a of the via hole 111, which is conducive to the forming of the adapter wire 30 on the side wall 111a of the via hole 111.

[0070] As an optional implementation, the display panel provided by the embodiment of the present application, the thickness of the colloid layer 41 can be any value between 100 nm and 1000 nm, including the two end values of 100 nm and 1000 nm. The content of the magnetic body 42 in the colloid layer 41 is any value between 30% and 50%, including the two end values of 30% and 50%. Through the above setting, the content of the magnetic body 42 can be ensured, and the magnetic adsorption requirement of the metal material used to form the adapter wire 30 can be ensured.

[0071] Optionally, the included angle between the side wall 111a and the bottom wall 111b is an acute angle or a right angle. The shape of the via hole 111 can comprise one or more of a cylindrical shape, a circular truncated cone shape, a cuboid shape and a square shape, and the embodiment of the present application does not limit this.

[0072] As shown in Figures 1 to 3 some optional examples, the included angle between the side wall 111a and the bottom wall 111b of the via hole 111 can be a right angle. Optionally, the via hole 111 is a cylindrical hole.

[0073] Please refer to Figure 4 , in some embodiments, the included angle between the side wall 111a and the bottom wall 111b of the via hole 111 can be an acute angle, which can be any angle greater than 0° and less than 90°, and optionally greater than 45° and less than 90°. Optionally, the via hole 111 is a circular truncated cone.

[0074] As an optional implementation, the via hole 111 can be filled with a filling layer 50 to insulate and protect the transfer line 30 and the like. The filling layer 50 can include an organic layer and / or an inorganic layer and the like.

[0075] Optionally, the display panel can further include an encapsulation layer located on the side of the pixel island 20 away from the substrate 10. Part of the encapsulation layer can be filled in the via hole. The encapsulation layer can include organic layers and inorganic layers alternately stacked along the direction X. The encapsulation layer can be used to block water and oxygen. Part of the encapsulation layer can be used as the filling layer 50 to fill in the via hole 111.

[0076] In some optional embodiments, the connection line 14 is at least partially exposed to the via hole 111, and the transfer line 30 is electrically connected to the part of the connection line 14 exposed to the via hole 111, so as to facilitate the electrical connection between the connection line 14 and the transfer line 30. The part of the connection line 14 exposed to the via hole 111 can be arranged on the bottom wall 111b, and the transfer line 30 is connected to the part of the connection line 14 exposed to the bottom wall 111b of the via hole 111.

[0077] In some optional examples, the connection line 14 is at least partially extended along the thickness direction X and the part of the connection line 14 exposed to the via hole 111 is arranged on the side wall 111a, and the transfer line 30 is electrically connected to the part of the connection line 14 exposed to the side wall 111a of the via hole 111. By making the connection line 14 at least partially extended along the thickness direction X and exposed to the via hole 111, when the metal material is adsorbed and deposited on the side wall 111a of the via hole 111, at least part of the side wall 111a of the via hole 111 is covered, so that the transfer line 30 can stably contact the connection line 14 even if the size of the transfer line 30 along the direction X is small, ensuring the electrical connection between the transfer line 30 and the connection line 14, and reducing the forming size of the transfer line 30 and the difficulty of the manufacturing process.

[0078] Optionally, the transfer line 30 located on the side wall 111a of the via hole 111 has a projection area on the substrate 10 smaller than the projection area of the via hole 111 on the substrate 10. The connection line 14 and the transfer line 30 can be in contact. The display panel provided by the embodiments of the present application can make the substrate 10 have a plurality of bearing areas 10a and a plurality of bridge areas 10b, the plurality of bearing areas 10a are arranged at intervals and two adjacent bearing areas 10a are connected through the bridge area 10b, each bridge area 10b is provided with a connection line 14, each bearing area 10a is provided with a via hole 111, the via hole 111 is formed by the substrate 10 starting from one side of the thickness direction X of the substrate 10 and recessing along the thickness direction X, and each pixel island 20 includes at least one light emitting unit 21 and is located in one of the bearing areas 10a. This can not only meet the display requirements, but also make the display panel have a stretchable performance by arranging the bridge area 10b and the via hole 111. The bridge area 10b can be stretched.

[0079] Since the wall part enclosing the via hole 111 includes the side wall 111a and the bottom wall 111b, the adapter line 30 is stacked on the side wall 111a of each via hole 111 and electrically connected to the corresponding connecting line 14 and the light emitting unit 21, which can ensure the display requirements of the display panel. Moreover, the adapter line 30 is stacked on the side wall 111a of the via hole 111, which can effectively avoid the adapter line 30 being blocked by other materials such as the organic material layer in the process of forming, ensuring the electrical connection requirements of the adapter line 30, the connecting line 14 and the light emitting unit 21, and further ensuring the electrical connection requirements between the light emitting unit 21 and the connecting line 14, thereby optimizing the display effect of the display panel.

[0080] Referring back to Figures 1 to 3 As an optional implementation, the display panel provided by the embodiment of the application includes a substrate 10, a device layer 12 stacked on the substrate 11, and a planarization layer 13 disposed on the side of the device layer 12 away from the substrate 11, the device layer 12 includes a pixel circuit 121 located in the bearing area 10a and a connecting line 14 located in the bridging area 10b, the pixel circuit 121 is electrically connected to the light emitting unit 21, the light emitting unit 21 is located on the side of the planarization layer 13 away from the substrate 11, and the planarization layer 13 is provided with a via hole 111 on the part of each bearing area 10a.

[0081] The display panel provided by the embodiment of the application has the via hole 111 disposed on the planarization layer 13 of the substrate 11, which can be partially located on the planarization layer 13 or entirely located on the planarization layer 13. Through the above arrangement, the formation of the adapter line 30 and the electrical connection between the light emitting unit 21 and the connecting line 14 are facilitated.

[0082] Optionally, the substrate 11 can be a flexible substrate and can be made of a flexible material. In some optional examples, polyimide PI, polyethylene terephthalate PET, or a surface-treated polymer soft film can be used as the material, which can meet the display and stretchable requirements.

[0083] As an optional implementation, the device layer 12 includes two or more conductive layers and insulating layers alternately distributed along the thickness direction X, and the connecting line 14 is formed in one of the conductive layers. Through the above arrangement, the formation of the connecting line 14 is facilitated, and through the above arrangement, the electrical connection between the connecting line 14 and the light emitting unit 21 through the adapter line 30 can be ensured. The conductive layer can include a metal layer.

[0084] Optionally, the bridge region 10b is formed in two directions, such as horizontal direction and vertical direction. The bridge region 10b is mainly formed in two directions, such as horizontal direction and vertical direction. The bridge region 10b in one direction can be provided with at least one of the first voltage line, the second voltage line and the data connection line. The bridge region 10b in the other direction can be provided with the gate connection line (i.e. the scan line) and the light-emitting control line.

[0085] As an optional implementation, the light-emitting unit 21 includes a first electrode 211, an organic material layer 212 and a second electrode 213 stacked along the thickness direction X. In the thickness direction X, the first electrode 211 is located between the second electrode 213 and the substrate 10. The adapter line 30 is arranged in the same layer as the second electrode 213 and is electrically connected to the second electrode 213.

[0086] Through the above arrangement, the adapter line 30 can be formed, and the electrical connection requirement of the adapter line 30 and the second electrode 213 can be ensured.

[0087] The adapter line 30 can be arranged in the same layer as the second electrode 213 and electrically connected to the second electrode 213. The adapter line 30 and the second electrode 213 can be made of the same material. The adapter line 30 and the second electrode 213 can be formed by the same process.

[0088] Optionally, the first electrode 211 can be an anode of the light-emitting unit 21, and the second electrode 213 can be a cathode of the light-emitting unit 21. The connection line 14 can include a cathode trace. The cathode trace can be electrically connected to the cathode through the adapter line 30.

[0089] Optionally, the first electrode 211 can be a cathode of the light-emitting unit 21, and the second electrode 213 can be an anode of the light-emitting unit 21. The connection line 14 can include an anode trace. The anode trace can be electrically connected to the anode through the adapter line 30.

[0090] Since the light emitting unit 21 is formed on the substrate 10 in the process of forming, the first electrode 211 electrically connected with the pixel circuit 121 is formed first, then the organic material layer 212 is formed, and then the second electrode is formed, and the organic material layer 212 is generally formed by full evaporation, so that the bottom wall 111b of the via hole 111 is covered with the organic material layer 212. If the jumper wire 30 is formed on the bottom wall 111b of the via hole 111, the jumper wire 30 and the connecting wire 14 will be affected by the barrier of the organic material layer 212, which is not conducive to the electrical connection between the jumper wire 30 and the connecting wire 14 and the light emitting unit 21. Since the magnetic adsorption layer 40 has a magnetic force adsorption effect on the conductive material such as metal used to form the jumper wire 30, the jumper wire 30 is formed on the side wall 111a of the via hole 111, the jumper wire 30 is arranged on the side wall 111a of the via hole 111 and electrically connected with the pixel island 20 and the corresponding connecting wire 14, which can ensure the display requirement and stretchable requirement of the display panel. Moreover, arranging the jumper wire 30 on the side wall of the via hole can effectively avoid the jumper wire being blocked by other materials in the via hole during the forming process, ensure the electrical connection requirement between the jumper wire and the connecting wire and the pixel island, and further ensure the electrical connection requirement between the pixel island and the connecting wire, and optimize the display effect of the display panel.

[0091] The display panel provided by the embodiment of the present application can effectively avoid the barrier of the organic material layer 212 of the bottom wall 111b of the via hole 111 to the jumper wire 30 by making the second electrode 213 a cathode, and the jumper wire 30 is arranged in the same layer as the second electrode 213 and electrically connected with the second electrode 213, and at the same time, the jumper wire 30 is arranged on the side wall 111a of the via hole 111, which can ensure the electrical connection requirement between the jumper wire 30 and the light emitting unit 21 and the connecting wire 14.

[0092] Optionally, the display panel provided by the embodiment of the present application can include one or more than two light emitting units 21, and each light emitting unit 21 can be used as a sub-pixel. Three light emitting units 21 emitting different colors of light, such as red, green and blue, can form a pixel unit.

[0093] Optionally, each bearing area 10a can include a via hole 111, and the plurality of light emitting units 21 can share the same via hole 111, and be electrically connected to the connecting line 14 through the switching line 30 on the sidewall 111a of the via hole 111. Of course, this is an optional embodiment, and in some examples, two or more via holes 111 can be provided in each bearing area 10a, and the two or more via holes 111 are arranged at intervals around the bearing area 10a and are electrically connected. The plurality of light emitting units 21 located in the same bearing area 10a can be arranged one-to-one with the via holes 111, and are electrically connected to the switching line 30 on the sidewall 111a of the via hole 111. Of course, two or more light emitting units 21 can also share one via hole 111 and be electrically connected to the switching line 30 on the sidewall 111a of the via hole 111, as long as the electrical connection between the light emitting element 21 and the connecting line 14 through the switching line 30 can be met.

[0094] The display panel provided by the embodiments of the present application can form the switching line 31 on the sidewall 111a of the via hole 111 by means of evaporation or magnetron sputtering metal material film forming, etc. Of course, this is an optional embodiment, and is not limited thereto.

[0095] As an optional embodiment, the connecting line 14 of the display panel provided by the embodiments of the present application can extend in a curve in the plane. Optionally, the connecting line 14 can extend linearly in an S shape or helically. Through the above arrangement, the display panel is straightened from the zigzag shape in the stretching process, and will not be broken.

[0096] Optionally, the connecting line 14 can be located in the bridge area 10b and extend to the bearing area 10a, so as to facilitate electrical connection with the switching line 30.

[0097] It can be understood that the above embodiments are all exemplified by taking the via hole 111 as a cylindrical shape, which is an optional embodiment, but is not limited to the above form.

[0098] Optionally, the organic material layer 212 can include one or more of a hole injection layer, a hole transport layer, an electron blocking layer, an organic light emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer. The mask plate used for one or more of the hole injection layer, the hole transport layer, the electron blocking layer, the organic light emitting layer, the hole blocking layer, the electron transport layer, and the electron injection layer can be the same mask plate as the mask plate used for the second electrode layer.

[0099] Referring to Figures 5 to 13 In another aspect, the embodiments of the present application also provide a forming method of a display panel, which can be used to form the display panel provided by the above embodiments, and the forming method includes:

[0100] S100, providing a substrate 10.

[0101] The substrate 10 can include a plurality of bearing areas 10a and a plurality of bridge areas 10b, the plurality of bearing areas 10a are arranged at intervals, and two adjacent bearing areas 10a are connected by a bridge area 10b.

[0102] In S200, the pixel island 20, the connection line 14, the via hole 111, and the magnetic adsorption layer 40 and the transfer line 30 formed on the sidewall 111a of each via hole 111 in sequence are formed on the substrate 10. The via hole 111 is formed by recessing the substrate 10 from one side in the thickness direction X and along the thickness direction X. The wall part enclosing the via hole 111 includes the sidewall 111a and the bottom wall 111b. The transfer line 30 is electrically connected with the connection line 14 and the pixel island 20.

[0103] At least part of the bridge area 10b is provided with at least part of the connection line 14, and at least part of the bearing area 10a is provided with the via hole 111. The pixel island 20 can include at least one light emitting unit 21, and the transfer line 30 is electrically connected with the connection line 14 and the light emitting unit 21. The pixel island 20 is formed in each bearing area 10a.

[0104] The forming method of the display panel provided by the embodiments of the present application can form the magnetic adsorption layer 40 and the transfer line 30 on the sidewall 111a of the via hole 111, set the transfer line 30 on the sidewall 111a of each via hole 111, and electrically connect the light emitting unit 21 with the corresponding connection line 14, which can not only ensure the display requirements of the display panel, but also effectively avoid the transfer line 30 from being blocked by other materials in the via hole 111 during the forming process, ensure the electrical connection requirements of the transfer line 30 with the connection line 14 and the light emitting unit 21, and further ensure the electrical connection requirements between the pixel island 20 and the connection line 14, thereby optimizing the display effect of the formed display panel. The setting of the magnetic adsorption layer 40 enables the metal material entering the via hole 111 to be adsorbed and deposited on the sidewall 111a of the via hole 111 by the magnetic adsorption effect of the magnetic adsorption layer 40 when the transfer line 30 is formed in the via hole 111, which is beneficial to the formation of the transfer line 30 on the sidewall 111a of the via hole 111.

[0105] The forming method of the display panel provided by the present application can be used to manufacture the display panel provided by each of the above embodiments, and therefore has the beneficial effects of the above embodiments, which will not be described here.

[0106] The forming sequence of the pixel island 20, the connection line 14, the via hole 111, the magnetic adsorption layer 40, and the transfer line 30 can be set as needed, which is not limited in the present application.

[0107] Optionally, in step S100, the substrate 10 is provided, and the step of forming the connection line 14 on the substrate 10 comprises:

[0108] The substrate 11 is provided, which can be made of a flexible material;

[0109] The buffer layer is formed on the substrate 11;

[0110] The pixel circuit 121 and the connection line 14 are formed on the buffer layer, the pixel circuit 121 can include a plurality of thin film transistor structures and a storage capacitor, etc., the pixel circuit 121 is arranged in the bearing area 10a, and the connection line 14 is arranged in the bridging area 10b.

[0111] Optionally, the step of forming the pixel circuit 121 and the connection line 14 on the buffer layer comprises:

[0112] The active layer 12a is formed on the buffer layer and is patterned, so that the part of the active layer 12a located in the bridging area 10b is removed.

[0113] The first insulating layer 12b is formed on the patterned active layer 12a.

[0114] The first metal layer 12c is formed on the first insulating layer 12b and is patterned to form a gate electrode and a first capacitor electrode covering at least part of the active layer 12a in the bearing area 10a.

[0115] The second insulating layer 12d is formed on the patterned first metal layer 12c.

[0116] The second metal layer is formed on the second insulating layer 12d and is patterned to form a second capacitor electrode in the bearing area 10a.

[0117] The third insulating layer 12e is formed on the patterned second metal layer.

[0118] The third metal layer 12f is formed on the third insulating layer 12e and is patterned to form a source electrode and a drain electrode respectively electrically connected to the source region and the drain region of the active layer in the bearing area 10a, and to form the connection line 14 in the bridging area 10b, forming Figure 6 the structure shown in the figure.

[0119] The planarization layer 13 is formed on the patterned third metal layer 12f and is patterned to form a via hole 111 and a connection hole exposing the drain electrode, the via hole 111 is located in the bearing area 10a, and the connection hole is located in the bearing area 10a, forming Figure 7 the structure shown in the figure.

[0120] The forming method provided by the embodiment of the present application can make the metal material used for forming the adapter wire 30 adsorbed to the sidewall 111a of the via hole 111 under the action of the magnetic adsorption layer 40, which is beneficial to the forming of the adapter wire 30.

[0121] As an optional implementation, the step of forming the magnetic adsorption layer 40 on the sidewall 111a of each via hole 111 includes:

[0122] The glue solution mixed with the magnetic body 42 is provided.

[0123] The glue solution mixed with the magnetic body 42 is applied to the sidewall 111a of each via hole 111.

[0124] The glue solution mixed with the magnetic body 42 is solidified to form the magnetic adsorption layer 40.

[0125] The forming method provided by the embodiment of the present application can facilitate the forming of the magnetic adsorption layer 40, simplify the forming process of the magnetic adsorption layer 40, and ensure the magnetic adsorption effect on the metal material used for forming the adapter wire 30. Moreover, by coating the glue solution mixed with the magnetic body 42 in the via hole 111, and solidifying the glue solution to form the magnetic adsorption layer 40, when the metal material used for forming the adapter wire is evaporated into the via hole 111, the metal material is directly deposited on the sidewall of the via hole 111 under the action of the magnetic force of the magnetic material, and will not be directly deposited on the organic material at the bottom of the via hole 111, which can avoid the problem that the cathode material in the via hole 111 cannot be directly connected to the adapter wire 30 due to the blockage of the organic material.

[0126] As an optional implementation, the forming method provided by the embodiment of the present application applies the glue solution mixed with the magnetic body 42 to the sidewall 111a of each via hole 111 and the bottom wall 111b of each via hole 111, that is, the glue solution mixed with the magnetic body 42 is applied to the entire surface, which is convenient to operate. Then, the step of solidifying the glue solution mixed with the magnetic body 42 to form the magnetic adsorption layer 40 includes:

[0127] The structure formed by solidifying the glue solution mixed with the magnetic body 42 is post-processed to remove the solidified structure of the glue solution on the bottom wall, so as to form the magnetic adsorption layer 40 only on the sidewall 111a of the via hole 111.

[0128] Optionally, the post-processing includes exposure, etching, cleaning and the like.

[0129] Optionally, in the step of providing the glue solution mixed with the magnetic bodies 42, the content of the magnetic bodies 42 in the glue layer 41 can be any value between 30% and 50%, including the two end values of 30% and 50%. Through the above setting, the content of the magnetic bodies 42 can be ensured, and thus the magnetic adsorption requirement on the metal material used to form the jumper 30 can be ensured.

[0130] As shown in Figures 9 to 12 , as an optional implementation, the forming method provided by the embodiment of the application includes the following steps S200:

[0131] forming a first electrode layer on the substrate 10 and patterning to form a plurality of first electrodes 211.

[0132] forming an organic material layer 212 on the first electrode layer.

[0133] forming a second electrode layer on the organic material layer 212 to form a second electrode 213, and part of the material forming the second electrode layer is deposited to the sidewall 111a of the via 111 under the magnetic adsorption of the magnetic adsorption layer 40, and forms the jumper 30 electrically connected with the second electrode 213 and the connection line 14.

[0134] Optionally, before forming the organic material layer on the first electrode layer, the magnetic adsorption layer 40 is formed on the sidewall 111a of each via 111; when forming the organic material layer 212 on the first electrode layer, the organic material layer 212 is broken at the sidewall 111a of the via 111 to expose the magnetic adsorption layer 40 on the sidewall 111a of the via 111. Optionally, the mask plate used for forming the organic material layer 212 and the second electrode layer is the same mask plate, so that the mask plate does not need to be replaced, thereby simplifying the process, avoiding the replacement of the mask plate, the need for repositioning, and the like, and affecting the production efficiency.

[0135] As shown in Figure 11 , the organic material layer 212 formed by the general mask evaporation can be broken at the sidewall 111a of the via 111, and the organic material layer 212 located at the bottom wall 111b of the via 111 is not in contact with (spaced apart from) the sidewall 111a, or the organic material layer 212 located at the bottom wall 111b of the via 111 is partially in contact with the sidewall 111a and is in contact with the side of the sidewall 111a close to the bottom wall 111b. As shown in Figure 12 , the second electrode layer can be formed by the general mask evaporation. The organic material layer 212 formed by the general mask evaporation covers the surface located outside the via 111 and connected with one end of the sidewall 111a of the via 111 away from the bottom wall 111b, and at least part of the bottom wall 111b of the via 111.

[0136] The part of the material forming the second electrode layer is deposited to the sidewall 111a of the via 111 under the magnetic attraction of the magnetic attraction layer 40, and forms the transfer line 30 electrically connected with the second electrode 213 and the connecting line 14, and will not be deposited to the organic material layer in the via 111, so as to ensure the connection stability of the second electrode 213 and the transfer line 30.

[0137] Optionally, the step of forming the first electrode 211 layer on the substrate 10 and patterning to form a plurality of first electrodes 211 located in the bearing area 10a comprises:

[0138] The first electrode layer is formed on the planarization layer 13 and is patterned to form the first electrode 211 located in the bearing area 10a and electrically connected with the drain electrode. Optionally, the first electrode 211 is an anode, and the second electrode 213 is a cathode.

[0139] As shown in Figure 13 Optionally, the forming method provided by the embodiments of the present application further comprises: etching the second electrode layer between the light emitting units 21, and the gray etching step of the organic material layer 212 on the bottom wall 111b of the via 111, so as to increase the stretchability of the display panel.

[0140] Optionally, as shown in Figure 9 The via 111 can penetrate the pixel defining layer 15. The via 111 can penetrate the planarization layer 13. Optionally, the via 111 can penetrate the pixel defining layer 15 and the planarization layer 13, etc. The magnetic attraction layer 40 can cover the sidewall of the pixel defining layer 15 and the planarization layer 13 towards the via 111. The pixel defining layer 15 can be provided with a plurality of pixel openings, and the pixel openings expose the first electrode. The light emitting material layer can be located in the pixel opening. One pixel opening can correspond to one light emitting unit.

[0141] In another aspect, the present application also provides a display device comprising the display panel provided by the above embodiments. The display device comprises the display panel provided by the above embodiments, and thus has good stretchability and ensures the display effect.

[0142] The display device can comprise a mobile phone, a tablet computer, etc. The display device provided by the present application comprises the display panel provided by the above embodiments, and thus has the beneficial effects of the above embodiments, which will not be repeated here.

[0143] Although the present application has been described with reference to the preferred embodiments, various modifications can be made to it without departing from the scope of the present application, and equivalent components can be substituted therefor. In particular, the technical features mentioned in each embodiment can be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate provided with a connection line and a via hole, the via hole being formed by recessing a side of the substrate in a thickness direction of the substrate, and a wall portion enclosing the via hole comprising a side wall and a bottom wall; a plurality of pixel islands located on the same side of the substrate as the via hole; a magnetic adsorption layer provided on the side wall; a transfer line provided on a side of the magnetic adsorption layer away from the side wall, the transfer line being electrically connected with the connection line and the pixel islands.

2. The display panel of claim 1, wherein, The magnetic adsorption layer comprises a colloid layer and a magnetic body provided in the colloid layer, and the colloid layer is bonded to the side wall.

3. The display panel of claim 2, wherein, The magnetic body comprises at least one of iron, cobalt, nickel, aluminum-nickel alloy, iron-chromium alloy, and magnesium-zinc alloy.

4. The display panel of claim 1, wherein, Each of the pixel islands comprises at least one light-emitting unit, and the light-emitting unit comprises a first electrode, an organic material layer, and a second electrode which are sequentially stacked in the thickness direction, the first electrode being located between the second electrode and the substrate in the thickness direction, and the transfer line being provided in the same layer as the second electrode and electrically connected with the second electrode.

5. The display panel of claim 4, wherein, The substrate comprises a plurality of bearing areas and a plurality of bridge areas, the plurality of bearing areas being spaced apart and connected by the bridge areas between adjacent two bearing areas, at least part of the bridge areas being provided with at least part of the connection line, at least part of the bearing areas being provided with the via hole, and each of the pixel islands being located in one of the bearing areas. The substrate comprises a substrate, a device layer stacked on the substrate, and a planarization layer provided on a side of the device layer away from the substrate, the device layer comprising a pixel circuit located in the bearing area, the pixel circuit being electrically connected with the light-emitting unit, the light-emitting unit being located on a side of the planarization layer away from the substrate, and the planarization layer being provided with the via hole in part of each of the bearing areas.

6. The display panel of claim 5, wherein, The device layer comprises two or more conductive layers and insulating layers which are alternately distributed in a thickness direction, and the connection line is formed in one of the conductive layers.

7. The display panel of claim 1, wherein, An included angle between the side wall and the bottom wall is an acute angle or a right angle.

8. The display panel of claim 1, wherein, An end of the transfer line away from the bottom wall is electrically connected with the pixel island, and an end of the transfer line close to the bottom wall is electrically connected with the connection line.

9. The display panel of claim 1, wherein, At least part of the connection line is exposed in the via hole, and the transfer line is electrically connected with the part of the connection line exposed in the via hole.

10. The display panel of claim 1, wherein, At least part of the connection line extends in the thickness direction and is provided on the side wall in the part exposed in the via hole.

11. A display device, characterized by comprising: The display panel comprises the display panel according to any one of claims 1 to 10.

12. A method of forming a display panel, the method comprising: The display panel comprises: providing a substrate, forming pixel islands, a connection line, a via hole, and a magnetic adsorption layer and a transfer line sequentially on a side wall in each of the via holes on the substrate, the via hole being formed by recessing a side of the substrate in a thickness direction of the substrate, and a wall portion enclosing the via hole comprising a side wall and a bottom wall; the transfer line being electrically connected with the connection line and the pixel islands.

13. The method of forming a display panel according to claim 12, wherein The step of forming the magnetic adsorption layer on the side wall of each of the via holes comprises: providing a colloid solution mixed with a magnetic body; applying the colloid solution mixed with the magnetic body to the side wall of each of the via holes; and drying the colloid solution mixed with the magnetic body on the side wall of each of the via holes. The glue liquid mixed with the magnetic body is solidified to form the magnetic adsorption layer.

14. The display panel forming method according to claim 12, wherein Each of the pixel islands includes at least one light emitting unit; the light emitting unit includes a first electrode, an organic material layer and a second electrode which are sequentially stacked in the thickness direction; the step of forming the pixel islands on the substrate and forming the transfer lines on the magnetic adsorption layer in each of the via holes includes: forming a first electrode layer on the substrate and patterning to form a plurality of first electrodes; forming an organic material layer on the first electrode layer; forming a second electrode layer on the organic material layer to form a second electrode, and part of the material forming the second electrode layer is deposited to the sidewall of the via hole under the magnetic adsorption of the magnetic adsorption layer, and the transfer line electrically connected with the second electrode and the connecting line is formed.

15. The method of forming a display panel according to claim 14, wherein, forming a magnetic adsorption layer on the sidewall of each of the via holes before forming the organic material layer on the first electrode layer; when forming the organic material layer on the first electrode layer, the organic material layer is broken at the sidewall of the via hole to expose the magnetic adsorption layer on the sidewall of the via hole.

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