Core, speaker module and electronic device

Abstract

The present application discloses a core, a speaker module and an electronic device. The core includes: a magnetic circuit system, a voice coil, an annular diaphragm group and a connector. The magnetic circuit system forms a magnetic gap, one end of the voice coil extends into the magnetic gap, the diaphragm group surrounds the periphery of the magnetic circuit system, one end of the connector is connected to the diaphragm group, and the other end of the connector is connected to the portion of the voice coil located outside the magnetic gap. According to the core of the present application, the diaphragm group is surrounded by the periphery of the magnetic circuit system, and the diaphragm group is connected to the portion of the voice coil located outside the magnetic gap by using a connector. The space on the periphery of the magnetic circuit system can be used to arrange the diaphragm group, and provide a vibration space for the vibration of the diaphragm group, which is conducive to reducing the thickness of the core.

Description

Technical Field

[0001] The present application relates to the field of terminal technology, and in particular to a core, a speaker module and an electronic device. Background Art

[0002] Speaker modules are used to convert audio electrical signals such as music and voice into sound. They have the function of supporting audio playback, so they have been increasingly widely used in electronic devices such as televisions, speakers, mobile phones, tablets, and laptops.

[0003] With the development of electronic equipment technology, electronic devices have more and more functions and more and more functional modules are integrated into electronic devices, which leads to limited internal layout space of electronic devices. The existing structural design of speaker modules is not conducive to further optimization of the structure and size of electronic devices and still needs to be improved. Summary of the Invention

[0004] The embodiments of the present application provide a core, a speaker module and an electronic device. The core has a small thickness. When the speaker module including the core is used in an electronic device, it is beneficial to further optimize the structure and size of the electronic device.

[0005] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0006] First, a core according to an embodiment of the present application includes: a magnetic circuit system, a voice coil, an annular diaphragm assembly, and a connector. The magnetic circuit system forms a magnetic gap, one end of the voice coil extends into the magnetic gap, and the diaphragm assembly surrounds the outer periphery of the magnetic circuit system. One end of the connector is connected to the diaphragm assembly, and the other end of the connector is connected to the portion of the voice coil located outside the magnetic gap.

[0007] According to the core of the embodiment of the present application, the diaphragm assembly surrounds the periphery of the magnetic circuit system and is connected to the portion of the voice coil located outside the magnetic gap using a connector. This not only achieves the connection between the voice coil and the diaphragm assembly, but also utilizes the space around the magnetic circuit system to accommodate the diaphragm assembly and provide vibration space for the diaphragm assembly, thereby reducing the thickness of the core and achieving a highly compact structure. This, in turn, helps reduce the space occupied by the speaker module in the electronic device, optimizes the internal structural layout of the electronic device, and also helps optimize the size of the electronic device.

[0008] In some embodiments of the first aspect of the present application, the connecting member includes: a first part and a second part. The first part is cylindrical, and the first part surrounds the outer circumference of the magnetic circuit system and is connected to the diaphragm group. The second part and the voice coil are located on the same side of the magnetic circuit system and are connected between the first part and the voice coil. By setting the first part to be cylindrical, it is convenient for the first part to be connected to the diaphragm group in the entire circumferential direction of the diaphragm group, which not only helps to improve the reliability of the connection between the first part and the diaphragm group, but also helps to realize that the first part drives the entire diaphragm group to vibrate in the axial direction of the voice coil. In addition, by making the second part and the voice coil located on the same side of the magnetic circuit system, it is convenient for the second part to connect the voice coil and the first part, and avoid interference between the first part and the magnetic circuit system. At the same time, the structure is simple and easy to process and manufacture.

[0009] In some embodiments of the first aspect of the present application, the second portion includes a first sub-portion, the first sub-portion being in the shape of an annular flat plate, the outer peripheral edge of the first sub-portion being connected to an end of the first portion remote from the magnetic circuit system, and the inner edge of the first sub-portion being radially directed toward the voice coil. The first sub-portion can be connected to the first portion along the entire circumference of the first portion, which not only improves the reliability of the connection between the first sub-portion and the first portion, but also facilitates force transmission between the first sub-portion and the first portion along the entire circumference of the first portion, thereby facilitating the first portion to drive the entire diaphragm assembly to vibrate in the axial direction of the voice coil.

[0010] In some embodiments of the first aspect of the present application, the second portion further includes a second sub-portion, the second sub-portion being connected to the inner peripheral edge of the first sub-portion. The second sub-portion is inclined radially inward of the voice coil toward the magnetic circuit system and is connected to the voice coil. This arrangement can at least partially prevent the second sub-portion from inhibiting axial movement of the voice coil, while also facilitating transmission of vibration generated by voice coil displacement to the diaphragm assembly.

[0011] In some embodiments of the first aspect of the present application, the second portion further includes a third sub-portion. The third sub-portion is cylindrical and connected to the inner circumferential wall of the second sub-portion. The inner circumferential wall of the third sub-portion is in contact with and connected to the outer circumferential wall of the voice coil, thereby improving the connection reliability between the connector and the voice coil.

[0012] In some embodiments of the first aspect of the present application, the connecting member is a one-piece member, which has a high connection strength and a simple processing technology.

[0013] In some embodiments of the first aspect of the present application, a connecting flange is provided on the outer peripheral wall of the first portion, and the connecting flange can be stacked and connected to the diaphragm assembly, thereby further improving the connection reliability between the connecting member and the diaphragm assembly.

[0014] In some embodiments of the first aspect of the present application, the core further includes: a dustproof ball top, and the dustproof ball top cover is arranged at an end of the voice coil away from the magnetic circuit system.

[0015] In some embodiments of the first aspect of the present application, the dustproof dome and the connecting piece are integrated into one piece, thereby improving the connection strength between the dustproof dome and the connecting piece.

[0016] In some embodiments of the first aspect of the present application, the core further includes: a basin frame, a diaphragm group, a connector, a voice coil, and a magnetic circuit system located within the basin frame, the outer peripheral edge of the diaphragm group being connected to the inner peripheral wall of the basin frame, the diaphragm group, the connector, the voice coil, and the dustproof dome dividing the space within the basin frame into a first cavity and a second cavity, the first cavity being located on a side of the diaphragm group adjacent to the bottom wall of the basin frame, the magnetic circuit system being located within the first cavity, and the first cavity forming a front cavity. Since the first cavity is the front cavity, when the speaker module is operating, the vibration of the diaphragm group drives the airflow in the front cavity out of the front cavity, which can take away the heat in the magnetic circuit system, thereby improving the heat dissipation effect of the magnetic circuit system.

[0017] In some embodiments of the first aspect of the present application, multiple second sound outlet channels are formed on the peripheral wall of the frame and / or the bottom wall of the frame. Thus, when the speaker module is operating, heat in the magnetic circuit system can be carried away by airflow through the second sound outlet channels on the frame, thereby improving the heat dissipation effect of the magnetic circuit system.

[0018] In some embodiments of the first aspect of the present application, the core further includes a centering support plate, which is located on the side of the bottom wall of the diaphragm group facing away from the basin frame, the outer peripheral edge of the centering support plate is connected to the basin frame, and the inner peripheral edge of the centering support plate is connected to the connecting piece or the voice coil.

[0019] In some embodiments of the first aspect of the present application, the centering support is mounted at the opening of the base frame. This increases the distance between the centering support and the diaphragm assembly, thereby providing vibration space for the centering support itself and the diaphragm assembly, preventing interference between the two, and ensuring operational reliability of the centering support and the diaphragm assembly.

[0020] In some embodiments of the first aspect of the present application, the inner peripheral edge of the centering spider may be stacked with the first sub-portion and supported and fixed by the first sub-portion.

[0021] In some embodiments of the first aspect of the present application, the bottom wall of the basin frame has a mounting hole, and the end of the magnetic circuit system facing away from the dustproof ball top is mounted in the mounting hole. This not only facilitates the installation of the magnetic circuit system, but also facilitates heat dissipation of the magnetic circuit system through the mounting hole.

[0022] In some embodiments of the first aspect of the present application, the magnetic circuit system includes a first sound outlet channel opposite the dustproof dome, the first sound outlet channel communicating with the mounting hole, and a magnetic gap surrounding the periphery of the first sound outlet channel. Thus, when the speaker module is operating, a portion of the sound waves generated by the diaphragm assembly vibrating the air within the first cavity can be discharged through the first sound outlet channel, thereby removing heat from the magnetic circuit system and improving the heat dissipation effect of the magnetic circuit system.

[0023] In some embodiments of the first aspect of the present application, the magnetic circuit system includes: a first magnetic conductor, a magnet, and a second magnetic conductor, wherein the magnet and the second magnetic conductor cooperate with the first magnetic conductor to define a magnetic gap. This not only simplifies the structure but also facilitates assembly.

[0024] In some embodiments of the first aspect of the present application, the first magnetic conductor is a U iron, the magnet is installed in the first magnetic conductor and connected to the inner bottom wall of the first magnetic conductor, the second magnetic conductor is located on the side of the magnet away from the bottom wall of the first magnetic conductor, and the outer peripheral wall of the second magnetic conductor, the outer peripheral wall of the magnet and the inner peripheral wall of the first magnetic conductor define a magnetic gap.

[0025] In some embodiments of the first aspect of the present application, the magnet and the second magnetic conductor are both annular in shape, a through hole is provided in the bottom wall of the first magnetic conductor, and the inner circumferential wall of the magnet, the inner circumferential wall of the second magnetic conductor, and the inner circumferential wall of the through hole define a first sound outlet channel. This not only simplifies the structure but also facilitates fabrication.

[0026] In some embodiments of the first aspect of the present application, the first magnetic conductor (5251) is a T-iron, which includes a T-iron chassis and a central magnetic column. The central magnetic column is arranged in the middle of the T-iron chassis, the magnet is located on the T-iron chassis and surrounds the outer periphery of the central magnetic column, the second magnetic conductor is located at the end of the magnet away from the T-iron chassis and surrounds the outer periphery of the central magnetic column, and a magnetic gap is defined between the inner peripheral wall of the second magnetic conductor, the inner peripheral wall of the magnet, and the outer peripheral wall of the central magnetic column.

[0027] In some embodiments of the first aspect of the present application, the first sound outlet channel is formed in the first magnetic conductor and penetrates the central magnetic conductor and the T-iron chassis along the axial direction of the central magnetic conductor.

[0028] In some embodiments of the first aspect of the present application, a step is provided on the inner circumferential wall of the mounting hole, and a positioning tongue is provided on the outer circumferential wall of the magnetic circuit system at an end facing away from the voice coil, the positioning tongue engaging with the step. This arrangement allows the positioning tongue and the step to be utilized during assembly of the magnetic circuit system and the frame, thereby improving assembly efficiency.

[0029] In some embodiments of the first aspect of the present application, a positioning step is formed on the peripheral wall of the basin frame, and the peripheral edge of the diaphragm assembly is connected to the positioning step. In this way, the positioning step can be used to position and install the diaphragm assembly, which is conducive to improving installation efficiency.

[0030] In a second aspect, a speaker module according to an embodiment of the present application includes: a shell and a core in any of the above technical solutions, the shell has a mounting opening, the core is mounted at the mounting opening, and the diaphragm group and the shell define a closed rear cavity.

[0031] In some embodiments of the second aspect of the present application, at least a portion of the magnetic circuit system is located outside the housing, which is beneficial to heat dissipation of the magnetic circuit system.

[0032] Since the speaker module provided in the embodiment of the present application includes the core of the above technical solution, the two can solve the same technical problems and achieve the same technical effects.

[0033] In a third aspect, an electronic device according to an embodiment of the present application includes: a housing, a circuit board and the above-mentioned speaker module, the housing has a sound outlet hole, the speaker module has a sound outlet channel, the circuit board and the speaker module are both arranged in the housing, and the sound outlet channel is connected to the sound outlet hole.

[0034] Since the electronic device provided in the embodiment of the present application includes the speaker module of the above technical solution, the two can solve the same technical problem and achieve the same technical effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic diagram of the structure of an electronic device provided in some embodiments of the present application;

[0036] Figure 2 for Figure 1 The cross-sectional structure diagram of the electronic device shown is taken along line AA;

[0037] Figure 3 for Figure 2 An enlarged view of the electronic device shown in FIG. 1 is circled at B;

[0038] Figure 4 for Figure 1-Figure 3 A schematic diagram of the speaker module shown in ;

[0039] Figure 5 for Figure 4 A schematic cross-sectional structural diagram of a loudspeaker module shown in ;

[0040] Figure 6 for Figure 5 Schematic diagram of the cross-sectional structure of the core shown in;

[0041] Figure 7A schematic structural diagram of a magnetic circuit system provided in some other embodiments of the present application;

[0042] Figure 8 A schematic diagram of the structure of the kernel provided in some other embodiments of the present application;

[0043] Figure 9 for Figure 8 The cross-sectional structure diagram of the core at the CC line is shown;

[0044] Figure 10 for Figure 8-Figure 9 A schematic diagram of the structure of the connecting member shown in FIG;

[0045] Figure 11 Schematic diagram of the structure of the connector provided in some other embodiments of the present application;

[0046] Figure 12 A schematic structural diagram of a connector provided in some further embodiments of the present application;

[0047] Figure 13 Schematic diagram of a speaker module according to another embodiment of the present invention, wherein the core of the speaker module is Figure 8-Figure 9 The kernel shown in ;

[0048] Figure 14 for Figure 13 The cross-sectional structure diagram of the loudspeaker module shown is taken along line DD;

[0049] Figure 15 Schematic diagrams of the cross-sectional structure of the speaker module according to some other embodiments of the present application;

[0050] Figure 16 To adopt Figure 13-14 A schematic cross-sectional structural diagram of an electronic device of a speaker module shown in FIG;

[0051] Figure 17 for Figure 16 An enlarged view of the electronic device shown in FIG. 1 is circled at F. Description of the drawings:

[0053] 100. Electronic equipment;

[0054] 10. Screen; 11. Translucent cover; 12. Display screen;

[0055] 20. Middle plate;

[0056] 30. Back shell; 31. Frame; 311. Sound hole; 32. Back cover;

[0057] 40. Circuit board;

[0058] 50. Speaker module; 51. Housing; 511. Mounting port; 52. Core; 521. Bracket; 5211. Opening; 521a. First cavity section; 521b. Second cavity section; 5216. Positioning step; 5212. Mounting hole; 52121. Step; 5215. Positioning flange; 5216. Positioning step; 5218. Support step; 522. Diaphragm assembly; 5221. Surrounding ring; 5222. Diaphragm; 523. Dustproof dome; 52 4. Voice coil; 5241. Coil; 5242. Voice coil frame; 525. Magnetic circuit system; 5251. First magnetic conductor; 52511. Positioning tongue; 5252. Second magnetic conductor; 5253. Magnet; 525a. Magnetic gap; 526. Centering support; 527. Connector; 5271. First part; 5272. Second part; 52721. First sub-part; 52722. Second sub-part; 52723. Third sub-part; 5273. Connecting flange. DETAILED DESCRIPTION

[0059] In the embodiments of this application, the terms "first," "second," and "third" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first," "second," or "third" may explicitly or implicitly include one or more of the features.

[0060] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed" and "connected" should be understood in a broad sense. For example, "connected" can mean a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the two are connected to each other and the relative positional relationship after connection does not change. "Multiple" means two or more.

[0061] In the embodiments of the present application, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element limited by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In the absence of further restrictions, an element limited by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0062] In the embodiments of the present application, "and / or" is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent three situations: A exists alone, A and B exist at the same time, and B exists alone.

[0063] The present application provides an electronic device 100, which is a type of electronic device 100 having a speaker module 50. Specifically, the electronic device 100 includes, but is not limited to, a television, a speaker, a mobile phone, a tablet computer (tablet personal computer), a laptop computer (laptop computer), a personal digital assistant (PDA), a personal computer, a notebook computer (notebook), an in-vehicle device, and a wearable device.

[0064] See also Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of an electronic device 100 provided in some embodiments of the present application. Figure 2 for Figure 1 The electronic device 100 is a schematic cross-sectional view of the structure at line AA. In this embodiment, the electronic device 100 is a television. Specifically, the electronic device 100 includes a screen 10, a middle plate 20, a rear housing 30, a circuit board 40, and a speaker module 50.

[0065] It is understandable that Figure 1 and Figure 2 Only some components of the electronic device 100 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not affected by the present invention. Figure 1 and Figure 2 In some other examples, the electronic device 100 may not include the screen 10.

[0066] To facilitate the description of the following embodiments, an XYZ coordinate system is established for the electronic device 100. Specifically, the thickness direction of the electronic device 100 is defined as the Z-axis direction, and the directions perpendicular to the Z-axis direction are the X-axis direction and the Y-axis direction, respectively, and the X-axis direction and the Y-axis direction are perpendicular. It is understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs and is not specifically limited here.

[0067] The screen 10 is stacked with the middle plate 20. The screen 10 is used to display images, videos, etc. The screen 10 includes a translucent cover plate 11 and a display screen 12. The translucent cover plate 11 is stacked with the display screen 12. The translucent cover plate 11 is located on the side of the display screen 12 away from the middle plate 20. The translucent cover plate 11 is mainly used to protect the display screen 12 and prevent dust. The material of the translucent cover plate 11 includes but is not limited to glass, plastic or ceramic. The display screen 12 is used to display images, videos, etc. The display screen 12 can be a flexible display screen or a rigid display screen. For example, the display screen 12 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MLED) display screen, a micro organic light-emitting diode (MLED) display screen, a micro organic light-emitting diode (MLED) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD) display screen.

[0068] The midplane 20 serves as the structural "framework" of the electronic device 100, securing and supporting the remaining components of the electronic device 100. To ensure structural strength and stability, the midplane 20 is typically made of metal. Alternatively, the midplane 20 can be made of rigid plastic.

[0069] Please continue reading Figure 2 The rear shell 30 includes a frame 31 and a back cover 32 arranged along the Z-axis direction. The back cover 32 is located on the side of the middle plate 20 away from the screen 10. The back cover 32 and the middle plate 20 are stacked and spaced apart. The frame 31 is fixed to the back cover 32. Exemplarily, the frame 31 can be fixedly connected to the back cover 32 by means of gluing, snapping or screw connection. The frame 31 can also be an integrally formed structure with the back cover 32, that is, the frame 31 and the back cover 32 are an integral structure. The frame 31 is wrapped around the edges of the screen 10 and the middle plate 20. The frame 31, the back cover 32 and the middle plate 20 form the outer shell of the electronic device 100 and enclose a closed accommodating cavity.

[0070] In the above embodiment, the rear housing 30 is fixed to the middle plate 20 via the frame 31, thereby fixing the relative positions of the rear housing 30, the middle plate 20, and the screen 10. Specifically, the frame 31 can be fixed to the edges of the middle plate 20 and the screen 10 by screwing, bonding, or clamping, etc., without further limitation.

[0071] The circuit board 40 is housed within the housing cavity defined by the frame 31, the back cover 32, and the middle plate 20. The circuit board 40 can be fixed and supported on the middle plate 20. Specifically, the circuit board 40 can be fixed to the middle plate 20 by snapping, threading, or riveting.

[0072] Circuit board 40 is used to integrate a control chip. The control chip may be, for example, an application processor (AP), double data rate synchronous dynamic random access memory (DDR), and universal flash storage (UFS). In some embodiments, circuit board 40 is electrically connected to display screen 12 and is used to control display screen 12 to display images or videos.

[0073] The circuit board 40 can be a rigid circuit board, a flexible circuit board, or a combination of rigid and flexible circuit boards. The circuit board 40 can be made of FR-4 dielectric board, Rogers dielectric board, or a combination of FR-4 and Rogers dielectric board. FR-4 is a flame-retardant material grade, and Rogers dielectric board is a high-frequency board.

[0074] The speaker module 50 is used to convert audio signals such as music and speech into sound, enabling audio playback. In some embodiments, the speaker module 50 is electrically connected to the circuit board 40. At this point, the audio signals sent by the circuit board 40 are transmitted to the speaker module 50, where they are further converted into sound signals for output.

[0075] For details, please refer to Figure 2 , and combined with Figure 3 , Figure 3 for Figure 2 The electronic device 100 shown in FIG is an enlarged view circled at B. In this embodiment, the speaker module 50 has a sound outlet channel 50a. The sound signal output by the speaker module 50 is output to the outside of the speaker module 50 through the sound outlet channel 50a. Figure 2 and Figure 3The frame 31 is provided with a sound outlet 311. The sound outlet 311 is connected to the sound outlet channel 50a. The sound signal output by the sound outlet channel 50a is further output to the outside of the electronic device 100 through the sound outlet 311. In other embodiments, the sound outlet 311 can also be provided on the back cover 32.

[0076] In some embodiments, the number of speaker modules 50 can be multiple, and the multiple speaker modules 50 are spaced apart in the direction of the X-axis. Specifically, the number of speaker modules 50 can be two, and the two speaker modules 50 are arranged at both ends of the frame 31 in the X-axis direction. The two speaker modules 50 have the same structure and are symmetrically arranged. In other embodiments, the number of speaker modules 50 can also be one or more than three, which is not specifically limited here. It should be noted that the position of the speaker module 50 on the rear shell 30 can be flexibly set.

[0077] See also Figure 4 and Figure 5 , Figure 4 for Figure 1-Figure 3 The schematic diagram of the speaker module 50 shown in FIG. Figure 5 for Figure 4 FIG2 is a schematic cross-sectional view of a speaker module 50 shown in FIG3. In this embodiment, the speaker module 50 includes a shell 51 and a core 52.

[0078] The housing 51 is used to support and secure the core 52, and the housing 51 encloses the rear cavity C2 of the speaker module 50. Specifically, a mounting opening 511 is formed on the wall of the housing 51. The core 52 is installed within the housing 51 and blocks the mounting opening 511. The inner circumferential wall of the mounting opening 511 and the area defined by the core 52 define the front cavity C1 of the speaker module 50.

[0079] The material of the housing 51 includes but is not limited to metal, plastic, or a combination of metal and plastic.

[0080] See also Figure 5 , and also see Figure 6 , Figure 6 for Figure 5 is a schematic diagram of the cross-sectional structure of the core 52. In this embodiment, the core 52 includes a basket 521, a diaphragm assembly 522, a dustproof dome 523, a voice coil 524 fixedly connected to the diaphragm assembly 522, a magnetic circuit system 525 disposed on one side of the diaphragm assembly 522, and a centering support 526.

[0081] The frame 521 is used to mount and support the diaphragm assembly 522, voice coil 524, magnetic circuit system 525, and centering support 526. To ensure reliable support for the diaphragm assembly 522, voice coil 524, magnetic circuit system 525, and centering support 526, the frame 521 can be made of metal. Exemplarily, the frame 521 is made of iron or aluminum. Of course, to reduce the weight and manufacturing cost of the speaker module 50, the frame 521 can also be made of plastic.

[0082] The basin frame 521 has an open opening 5211 , and a support step 5218 is formed on a peripheral wall of the basin frame 521 adjacent to the open opening 5211 . The basin frame 521 is supported on the outer end surface of the portion of the housing 51 defining the mounting opening 511 by the support step 5218 .

[0083] The diaphragm assembly 522 is located within the frame 521, and the outer edge of the diaphragm assembly 522 is connected to the frame 521. For example, the outer edge of the diaphragm assembly 522 is stacked and fixed to the step surface of the support step 5218. The connection between the diaphragm assembly 522 and the frame 521 includes, but is not limited to, gluing.

[0084] The diaphragm assembly 522 surrounds the outer periphery of the voice coil 524 and is connected to the voice coil 524. The connection between the diaphragm assembly 522 and the voice coil 524 includes, but is not limited to, gluing.

[0085] Specifically, the diaphragm assembly 522 includes: a folding ring 5221 and a diaphragm 5222 surrounded by the folding ring 5221. The folding ring 5221 is connected to the inner peripheral wall of the basin frame 521, and the diaphragm 5222 is connected to the voice coil 524. For example, see Figure 6 The diaphragm 5222 is connected to the outer peripheral wall of the voice coil 524. Of course, the present application is not limited thereto, and the diaphragm 5222 can also be connected to the end surface of one axial end of the voice coil 524.

[0086] The material of the diaphragm group 522 includes but is not limited to metal, plastic, plant fiber and animal fiber.

[0087] The dustproof dome 523 can be located on the end surface of one axial end of the voice coil 524 to block the end surface of one axial end of the voice coil 524. The dustproof dome 523 can prevent dust and the like from entering the voice coil 524. In this embodiment, the dustproof dome 523 can be fixedly connected to the voice coil 524. The connection method between the dustproof dome 523 and the voice coil 524 includes but is not limited to gluing. Of course, the present application is not limited to this. In other examples, the dustproof dome 523 can also be connected to the diaphragm 5222. The dustproof dome 523 is fixed to the diaphragm 5222 by gluing or other methods. The material of the dustproof dome 523 can be the same as the material of the diaphragm assembly 522 described above.

[0088] For details, please refer to Figure 5 , and combined with Figure 6 The space formed by the dustproof dome 523, the voice coil 524, the side of the diaphragm group 522 facing the installation port 511 and the surrounding wall of the installation port 511 defines the front cavity C1, and the space formed by the dustproof dome 523, the voice coil 524, the side of the diaphragm group 522 facing away from the installation port 511 and the shell 51 defines the rear cavity C2.

[0089] Magnetic circuit system 525 is located within rear cavity C2 and outside of frame 521. Specifically, a mounting hole 5212 is provided on the bottom wall of frame 521, opposite opening 5211. Magnetic circuit system 525 blocks mounting hole 5212. An annular magnetic gap 525a is formed on the side of magnetic circuit system 525 facing the interior of frame 521.

[0090] Please continue reading Figure 6 The magnetic circuit system 525 includes: a first magnetic conductor 5251, a second magnetic conductor 5252 and a magnet 5253. The magnet 5253 and the second magnetic conductor 5252 cooperate with the first magnetic conductor 5251 to define the magnetic gap 525a. For example, please refer to Figure 6 The first magnetic conductor 5251 can be a U-iron, the magnet 5253 is installed in the first magnetic conductor 5251 and connected to the inner bottom wall of the first magnetic conductor 5251, the second magnetic conductor 5252 is located on the side of the magnet 5253 away from the bottom wall of the first magnetic conductor 5251, and the outer peripheral wall of the second magnetic conductor 5252, the outer peripheral wall of the magnet 5253 and the inner peripheral wall of the first magnetic conductor 5251 define the magnetic gap 525a. For another example, please refer to Figure 7 , Figure 7 Schematic diagram of the structure of the magnetic circuit system 525 provided in some other embodiments of the present application. In particular, the first magnetic conductor 5251 is a T-iron, which includes a T-iron chassis 5251a and a central magnetic pole 5251b. The central magnetic pole 5251b is disposed in the middle of the T-iron chassis 5251a. The magnet 5253 is located on the T-iron chassis 5251a and surrounds the outer periphery of the central magnetic pole 5251b. The second magnetic conductor 5252 is located at the end of the magnet 5253 away from the T-iron chassis 5251a and surrounds the outer periphery of the central magnetic pole 5251b. The inner peripheral wall of the second magnetic conductor 5252, the inner peripheral wall of the magnet 5253, and the outer peripheral wall of the central magnetic pole 5251b define the magnetic gap 525a.

[0091] Please continue reading Figure 6The other axial end of the voice coil 524 extends into the magnetic gap 525a. When energized, the voice coil 524 generates an induced magnetic field and is displaced by the magnetic force of the magnetic circuit system 525, driving the diaphragm group 522 and the dustproof ball top 523 to vibrate along the axial direction of the voice coil 524, thereby driving the air in the front cavity C1 to vibrate and form sound waves, which are output from the sound output channel 50a.

[0092] The voice coil 524 may include a voice coil bobbin 5242 and a coil 5241 wound around the voice coil bobbin 5242. The voice coil bobbin 5242 serves as a support for the coil 5241. Materials for the voice coil bobbin 5242 include, but are not limited to, paper, aluminum, or fiberglass. The coil 5241 is enameled wire, and the conductors in the coil 5241 may be made of, but are not limited to, copper, aluminum, or copper-clad aluminum wire. The insulation layer of the coil 5241 may be made of, but are not limited to, plastic or rubber.

[0093] The centering support 526 is located on the side of the diaphragm assembly 522 facing away from the opening 5211. It connects between the inner circumferential wall of the frame 521 and the outer circumferential wall of the voice coil 524. When the diaphragm assembly 522 and the dustproof dome 523 vibrate axially along the voice coil 524, they deform to some extent. This deformation generates radial tension and thrust on the frame 521 and the voice coil 524. The presence of the centering support 526 reduces these forces, maintaining the structural stability of the diaphragm assembly 522 and the voice coil 524.

[0094] The connection method of the centering support 526 to the basin frame 521 includes, but is not limited to, gluing. The connection method of the centering support 526 to the voice coil 524 includes, but is not limited to, gluing. The material of the centering support 526 includes, but is not limited to, cotton, silk, or chemical fiber.

[0095] For the core 52 in the above embodiment, the diaphragm assembly 522, the centering support 526, and the magnetic circuit system 525 are arranged in sequence along the axial direction of the voice coil 524, resulting in a thicker core 52. In addition, the displacement of the voice coil 524 causes the diaphragm assembly 522 to vibrate, which also causes the centering support 526 to vibrate. In order to prevent interference between the diaphragm assembly 522 and the centering support 526 due to vibration, a first vibration space D1 (such as φ1) needs to be reserved between the centering support 526 and the diaphragm assembly 522. Figure 5 In order to prevent interference between the centering support piece 526 and the bottom wall of the basin frame 521 and between the centering support piece 526 and the magnetic circuit system 525, a second vibration space D2 (such as Figure 5In addition, the voice coil 524 reciprocates along the axial direction of the voice coil 524 within the magnetic gap 525a of the magnetic circuit system 525. In order to ensure reliable cooperation between the voice coil 524 and the magnetic circuit system 525, the depth of the magnetic gap 525a needs to be set deeper, that is, the magnetic gap 525a needs to be provided with an avoidance gap D3 (as shown in FIG. Figure 5 The first vibration space D1, the second vibration space D2, and the avoidance gap D3 further increase the thickness of the core 52. When the speaker module 50 including the core 52 is used in the electronic device 100, it occupies a considerable space within the housing, hindering the optimization of the internal structural layout of the electronic device 100 and the optimization of the size of the electronic device 100.

[0096] To resolve this technical issue, see Figure 8 and Figure 9 , Figure 8 A schematic diagram of the structure of the kernel 52 provided in some other embodiments of the present application; Figure 9 for Figure 8 The cross-sectional structure diagram of the core 52 at the CC line is shown. In this embodiment, the magnetic circuit system 525 is no longer arranged on the outside of the basin frame 521, but is arranged inside the basin frame 521. In addition, the magnetic circuit system 525 and the diaphragm group 522 are no longer arranged along the axial direction of the voice coil 524, but the diaphragm group 522 is arranged around the outer periphery of the magnetic circuit system 525. In other words, the diaphragm group 522 is arranged in the space between the outer periphery of the magnetic circuit system 525 and the inner periphery of the basin frame 521, and a vibration space is provided for the vibration of the diaphragm group 522, which is conducive to reducing the thickness of the core 52. The core 52 has a high structural compactness, which is conducive to reducing the space occupied by the speaker module 50 in the electronic device 100, and is conducive to optimizing the internal structural layout of the electronic device 100, and is also conducive to optimizing the size of the electronic device 100.

[0097] In this embodiment, the structure and material of the diaphragm assembly 522 may be the same as those of the diaphragm assembly 522 in the above embodiment. Also, the structure of the magnetic circuit system 525 may be the same as those of the magnetic circuit system 525 in the above embodiment.

[0098] In this embodiment, since the diaphragm assembly 522 is located on the periphery of the magnetic circuit system 525, and the portion of the voice coil 524 located outside the magnetic gap 525a is located on one axial side of the magnetic circuit system 525, please refer to Section 9 to consider the connection between the diaphragm assembly 522 and the portion of the voice coil 524 located outside the magnetic gap 525a. In this embodiment, the core 52 also includes a connector 527. One end of the connector 527 is connected to the diaphragm assembly 522, and the other end is connected to the portion of the voice coil 524 located outside the magnetic gap 525a. The voice coil 524 can use this connector 527 to drive the diaphragm assembly 522 to vibrate.

[0099] According to the core 52 of the embodiment of the present application, the magnetic circuit system 525 is disposed within the frame 521, and the diaphragm assembly 522 located within the frame 521 is surrounded by the outer periphery of the magnetic circuit system 525. The diaphragm assembly 522 is connected to the portion of the voice coil 524 located outside the magnetic gap 525a by a connector 527. This not only achieves the connection between the voice coil 524 and the diaphragm assembly 522, but also utilizes the space between the outer periphery of the magnetic circuit system 525 and the inner periphery of the frame 521 to arrange the diaphragm assembly 522, providing a vibration space for the diaphragm assembly 522 to vibrate. This helps reduce the thickness of the core 52, resulting in a highly compact structure. This in turn helps reduce the space occupied by the speaker module 50 in the electronic device 100, helps optimize the internal structural layout of the electronic device 100, and also helps optimize the size of the electronic device 100.

[0100] In order to improve the connection effect of the connecting member 527, the material of the connecting member 527 includes but is not limited to metal or plastic.

[0101] See also Figure 10 , Figure 10 for Figure 8-Figure 9 Schematic diagram of the structure of the connecting member 527 shown in FIG. In this embodiment, the connecting member 527 includes: a first part 5271 and a second part 5272.

[0102] The first portion 5271 is cylindrical and surrounds the outer periphery of the magnetic circuit system 525 and is connected to the diaphragm group 522. Figure 9 , and combined with Figure 10 The outer peripheral wall of the first portion 5271 is connected to the inner peripheral edge of the diaphragm group 522. Of course, the present application is not limited thereto. In other embodiments, please refer to Figure 11 , Figure 11Schematic diagrams of the structure of a connector 527 according to another embodiment of the present application. In this embodiment, a connecting flange 5273 is provided on the outer peripheral wall of the first portion 5271. The connecting flange 5273 can be stacked and connected to the diaphragm assembly 522. This further improves the connection reliability between the connector 527 and the diaphragm assembly 522.

[0103] The connection method between the first part 5271 and the diaphragm assembly 522 includes but is not limited to gluing. The shape of the first part 5271 includes but is not limited to a circular cylinder, a square cylinder, an elliptical cylinder or other special-shaped cylinders.

[0104] Please continue reading Figure 9 and Figure 10 , the second portion 5272 and the voice coil 524 are located on the same side of the magnetic circuit system 525. That is, the second portion 5272 and the voice coil 524 are both located on the side of the magnetic circuit system 525 where the magnetic gap 525a is provided, and the second portion 5272 is connected between the first portion 5271 and the voice coil 524.

[0105] The connection method between the second part 5272 and the first part 5271 includes but is not limited to clamping, welding, and threaded connection. Of course, the present application is not limited thereto, and the second part 5272 and the first part 5271 can also be an integral part.

[0106] According to the connector 527 of the embodiment of the present application, by configuring the first portion 5271 to be cylindrical, the first portion 5271 is conveniently connected to the diaphragm assembly 522 along the entire circumferential direction of the diaphragm assembly 522. This not only improves the reliability of the connection between the first portion 5271 and the diaphragm assembly 522, but also facilitates the first portion 5271 driving the entire diaphragm assembly 522 to vibrate in the axial direction of the voice coil 524. Furthermore, by locating the second portion 5272 and the voice coil 524 on the same side of the magnetic circuit system 525, the second portion 5272 is conveniently connected to the voice coil 524 and the first portion 5271, while preventing interference between the first portion 5271 and the magnetic circuit system 525. Furthermore, the connector 5277 has a simple structure and is easy to manufacture.

[0107] For further information, please refer to Figure 9 and Figure 10The second portion 5272 includes a first sub-portion 52721. The first sub-portion 52721 is an annular, flat plate. Its outer edge is connected to the end of the first portion 5271 that is distal from the magnetic circuit system 525, while its inner edge faces the voice coil 524 in its radial direction. This arrangement allows the first sub-portion 52721 to be connected to the first portion 5271 along the entire circumference of the first portion 5271. This not only improves the reliability of the connection between the first sub-portion 52721 and the first portion 5271, but also facilitates force transmission between the first sub-portion 52721 and the first portion 5271 along the entire circumference of the first portion 5271. This facilitates the first portion 5271 driving the entire diaphragm assembly 522 to vibrate axially in the voice coil 524.

[0108] The shape of the first sub-portion 52721 includes, but is not limited to, a circular ring, a square ring, an elliptical ring, or a special-shaped ring, wherein the shape of the first sub-portion 52721 matches the shape of the first portion 5271 described above.

[0109] Please continue reading Figure 9 and Figure 10 The second portion 5272 further includes a second sub-portion 52722, which is connected to the inner peripheral edge of the first sub-portion 52721. The second sub-portion 52722 is inclined in a direction approaching the magnetic circuit system 525 along the radial direction of the voice coil 524 and toward the centerline of the voice coil 524, and is connected to the voice coil 524. This arrangement can at least to some extent prevent the second sub-portion 52722 from inhibiting the axial movement of the voice coil 524, while also facilitating the transmission of vibration generated by the displacement of the voice coil 524 to the diaphragm assembly 522.

[0110] The shape of the second sub-portion 52722 includes, but is not limited to, a circular ring, a square ring, an elliptical ring, or a special-shaped ring. The shape of the second sub-portion 52722 matches the shape of the first sub-portion 52721. The connection between the second sub-portion 52722 and the voice coil 524 includes, but is not limited to, gluing.

[0111] In order to further improve the connection reliability between the connector 527 and the voice coil 524, please refer to Figure 12 , Figure 12 Schematic diagram of the structure of a connector 527 provided in some further embodiments of the present application. In this embodiment, the second portion 5272 further includes a third sub-portion 52723. The third sub-portion 52723 is cylindrical and connected to the inner circumferential wall of the second sub-portion 52722. The inner circumferential wall of the third sub-portion 52723 is in contact with and connected to the outer circumferential wall of the voice coil 524.

[0112] On the basis of the above embodiment, in order to improve the dustproof effect of the voice coil 524, please refer to Figure 9 In this embodiment, the dustproof dome 523 can be located at the end of the voice coil 524 away from the magnetic circuit system 525. Optionally, the dustproof dome 523 can be integrally connected to the connector 527. Alternatively, the dustproof dome 523 can be directly connected to the voice coil 524 without being directly connected to the connector 527. The material of the dustproof dome 523 can be the same as that of the dustproof dome 523 in the above-mentioned embodiment.

[0113] Specifically, because the diaphragm assembly 522 surrounds the outer periphery of the magnetic circuit system 525 and is connected to the voice coil 524 via the connector 527, and the dustproof dome 523 is located at the end of the voice coil 524 away from the magnetic circuit system 525, the diaphragm assembly 522, the connector 527, the voice coil 524, and the dustproof dome 523 can divide the space within the frame 521 into a first cavity 521a and a second cavity 521b. The first cavity 521a is located on the side of the diaphragm assembly 522 adjacent to the bottom wall of the frame 521, and the second cavity 521b is located on the side of the diaphragm assembly 522 adjacent to the open opening 5211 of the frame 521. In this way, the first cavity 521a can serve as the front cavity of the speaker module 50, or the first cavity 521a can serve as the rear cavity of the speaker module 50.

[0114] Specifically, a second sound outlet channel 50b is formed on the wall of the frame 521, communicating with the first cavity 521a. Thus, the first cavity 521a forms the front cavity C1 of the speaker module 50, with the magnetic circuit system 525 located within this front cavity C1. Thus, when the speaker module 50 is operating, heat in the magnetic circuit system 525 can be carried away by airflow through the second sound outlet channel 50b on the frame 521, thereby improving the heat dissipation of the magnetic circuit system 525.

[0115] Specifically, a plurality of second sound outlet channels 50b are formed on the peripheral wall of the basin frame 521 and / or the bottom wall of the basin frame 521. That is, a plurality of second sound outlet channels 50b can be provided only on the peripheral wall of the basin frame 521; a plurality of second sound outlet channels 50b can also be provided only on the bottom wall of the basin frame 521; or a plurality of second sound outlet channels 50b can also be provided on the peripheral wall of the basin frame 521 and the bottom wall of the basin frame 521 respectively. Optionally, the plurality of second sound outlet channels 50b on the peripheral wall of the basin frame 521 are evenly spaced apart in the circumferential direction of the basin frame 521. The plurality of second sound outlet channels 50b on the bottom wall of the basin frame 521 are evenly spaced apart in the circumferential direction of the basin frame 521. Exemplarily, four second sound outlet channels 50b are provided on the bottom wall of the basin frame 521, and the four second sound outlet channels 50b are evenly spaced apart in the circumferential direction of the basin frame 521. Four second sound outlet channels 50b are also provided on the peripheral wall of the basin frame 521, and the four second sound outlet channels 50b on the peripheral wall of the basin frame 521 are evenly spaced apart in the circumferential direction of the basin frame 521.

[0116] The second sound outlet channel 50b is a strip-shaped hole extending along the circumference of the basin frame 521. Alternatively, the second sound outlet channel 50b can be an arc-shaped hole, an oblong hole, a rectangular hole, or a hole extending in an irregular curve, as long as the second sound outlet channel 50b extends along the circumference of the basin frame 521.

[0117] See also Figure 13 and Figure 14 , Figure 13 Schematic diagram of a speaker module 50 according to another embodiment of the present application, wherein the core 52 of the speaker module 50 is Figure 8-Figure 9 The kernel shown in ; Figure 14 for Figure 13 The cross-sectional structure of the speaker module 50 at line DD is shown. When the core 52 is mounted at the mounting opening 511 of the housing 51 of the speaker module 50, a rear cavity C2 is defined between the side of the diaphragm assembly 522 adjacent to the open opening 5211 of the frame 521 and the housing 51. The portion of the core 52 defining the front cavity C1 is exposed from the housing 51. This allows at least a portion of the magnetic circuit system 525 to be located outside the housing 51, further facilitating heat dissipation from the magnetic circuit system 525 during operation of the speaker module 50.

[0118] For details, please refer to Figure 14 , and combined with Figure 9 , one end of the magnetic circuit system 525 away from the voice coil 524 is installed at the mounting hole 5212. In this way, not only the installation of the magnetic circuit system 525 is achieved, but also it is more conducive to the magnetic circuit system 525 to use the mounting hole 5212 for heat dissipation.

[0119] For example, a step 52121 is provided on the inner circumferential wall of the mounting hole 5212, and a positioning tongue 52511 is provided on the outer circumferential wall of the end of the magnetic circuit system 525 facing away from the voice coil 524. The positioning tongue 52511 engages with the step 52121. This arrangement allows the positioning tongue 52511 and the step 52121 to be used for positioning during assembly of the magnetic circuit system 525 and the frame 521, thereby improving assembly efficiency.

[0120] For details, please refer to Figure 14 The magnetic circuit system 525 forms a first sound outlet channel 50c, which is opposite the dustproof dome 523 and surrounded by a magnetic gap 525a. Thus, when the speaker module 50 is operating, the voice coil 524 generates an induced magnetic field when energized. This magnetic force from the magnetic circuit system 525 causes it to displace, driving the dustproof dome 523 to vibrate axially along the voice coil 524, thereby causing the air within the front cavity C1 to vibrate and form sound waves. These sound waves can then be output from the first sound outlet channel 50c, thereby improving the mid- and high-frequency performance of the speaker module 50's frequency response.

[0121] For example, please see Figure 14 The magnetic circuit system 525 includes a first magnetic conductor 5251 having a through hole in its bottom wall, an annular magnet 5253, and an annular second magnetic conductor 5252. The magnet 5253 is installed in the first magnetic conductor 5251 and connected to the inner bottom wall of the first magnetic conductor 5251. The second magnetic conductor 5252 is located on the side of the magnet 5253 away from the bottom wall of the first magnetic conductor 5251. The outer peripheral wall of the second magnetic conductor 5252, the outer peripheral wall of the magnet 5253, and the inner peripheral wall of the first magnetic conductor 5251 define a magnetic gap 525a, while the inner peripheral wall of the through hole, the inner peripheral wall of the magnet 5253, and the inner peripheral wall of the second magnetic conductor 5253 define the first sound outlet channel 50c.

[0122] For example, see Figure 15 , Figure 15This figure shows a cross-sectional structure of a speaker module according to yet another embodiment of the present application. In this embodiment, a magnetic circuit system 525 includes a first magnetic conductor 5251, an annular second magnetic conductor 5252, and an annular magnet 5253. The first magnetic conductor 5251 is a T-iron. The T-iron includes a T-iron chassis 5251a and a central magnetic column 5251b. The central magnetic column 5251b is arranged in the middle of the T-iron chassis 5251a, the magnet 5253 is located on the T-iron chassis 5251a and surrounds the outer circumference of the central magnetic column 5251b, the second magnetic body 5252 is located at the end of the magnet 5253 away from the T-iron chassis 5251a, and surrounds the outer circumference of the central magnetic column 5251b, and a magnetic gap 525a is defined between the inner circumferential wall of the second magnetic body 5252, the inner circumferential wall of the magnet 5253 and the outer circumferential wall of the central magnetic column 5251b, and the first sound outlet channel 50c is formed on the first magnetic body 5251 and passes through the central magnetic column 525b and the T-iron chassis 5251a along the axial direction of the central magnetic column 5251b.

[0123] For further information, please refer to Figure 14 , and combined Figure 9 The centering support 526 is located on the side of the diaphragm assembly 522 that faces away from the bottom wall of the chassis 521. The outer edge of the centering support 526 is connected to the chassis 521, and the inner edge of the centering support 526 is connected to the connector 527. For example, the inner edge of the centering support 526 may be stacked with the first sub-portion 52721 described above, and supported and fixed by the first sub-portion 52721. Of course, the present application is not limited to this. The inner edge of the centering support 526 may also be directly connected to the voice coil 524 instead of being connected to the connector 527.

[0124] The centering support piece 526 and the basin frame 521 can be connected by gluing. The centering support piece 526 and the connecting piece 527 can be connected by gluing.

[0125] For example, please see Figure 14 The centering support 526 is installed at the opening 5211 of the basin frame 521. This helps to increase the distance between the centering support 526 and the diaphragm assembly 522, thereby providing vibration space for the centering support 526 itself and the diaphragm assembly 522 to vibrate, avoiding mutual interference between the two, and ensuring the reliability of the centering support 526 and the diaphragm assembly 522.

[0126] Specifically, a positioning flange 5215 is provided at the opening 5211 of the basin frame 521, and the outer peripheral edge of the centering support piece 526 is stacked with the positioning flange 5215. This is conducive to increasing the connection area between the centering support piece 526 and the positioning flange 5215, thereby improving the connection strength between the two.

[0127] Based on any of the above embodiments, in some embodiments of this application, please refer to Figure 14 , and combined with Figure 9 The peripheral wall of the basin frame 521 is formed with a positioning step 5216, and the outer peripheral edge of the diaphragm group 522 is supported on the positioning step 5216 and connected to the positioning step 5216. In this way, the positioning step 5216 can be used to position and install the diaphragm group 522, which is conducive to improving installation efficiency.

[0128] See also Figure 16 and Figure 17 , Figure 16 To adopt Figure 13-14 The cross-sectional structural diagram of the electronic device 100 including the speaker module 50 is shown in FIG. Figure 17 for Figure 16 , which is an enlarged view of the electronic device circled at F. In conjunction with the structure of the speaker module 50 in any of the above embodiments, when the speaker module 50 is installed in the electronic device 100, the portion of the core 52 that defines the front cavity C1 can be exposed from the housing 51. Thus, the portion of the core 52 that defines the front cavity C1 can face the sound outlet 311, so that the front cavity C1 can communicate with the sound outlet 311 through the first sound outlet channel 50c and the second sound outlet channel 50b. In this way, the sound waves emitted by the first sound outlet channel 50c and the second sound outlet channel 50b can be transmitted to the sound outlet 311 to produce sound. At the same time, the heat of the magnetic circuit system 525 carried by the sound waves can also be discharged from the sound outlet 311, thereby improving the heat dissipation effect of the magnetic circuit system 525.

[0129] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0130] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A core (52) of a loudspeaker module (50), characterized in that: include: A magnetic circuit system (525), wherein the magnetic circuit system (525) is formed with a magnetic gap (525a); a voice coil (524), one end of the voice coil (524) extending into the magnetic gap (525a); an annular diaphragm group (522), the diaphragm group (522) surrounding the outer periphery of the magnetic circuit system (525), and the diaphragm group (522) and the outer periphery of the magnetic circuit system (525) are arranged opposite to each other; A connecting member (527), one end of the connecting member (527) is connected to the diaphragm group (522), and the other end of the connecting member (527) is connected to a portion of the voice coil (524) located outside the magnetic gap (525a), and the connecting member (527) includes: A first part (5271), the first part (5271) is cylindrical, the first part (5271) surrounds the outer periphery of the magnetic circuit system (525) and is connected to the diaphragm group (522); The second part (5272) and the voice coil (524) are located on the same side of the magnetic circuit system (525) and are connected between the first part (5271) and the voice coil (524). The second part (5272) further includes a second sub-part (52722). Along the radial inward direction of the voice coil (524), the second sub-part (52722) is inclined toward the direction close to the magnetic circuit system (525) and is connected to the voice coil (524).

2. The core (52) of the loudspeaker module (50) according to claim 1, characterized in that: The second part (5272) includes a first sub-part (52721), which is in the shape of an annular flat plate. The outer peripheral edge of the first sub-part (52721) is connected to the end of the first part (5271) away from the magnetic circuit system (525), and the inner edge of the first sub-part (52721) is directed toward the voice coil (524) along its own radial direction.

3. The core (52) of the loudspeaker module (50) according to claim 2, characterized in that: The second sub-portion (52722) is connected to the inner peripheral edge of the first sub-portion (52721).

4. The core (52) of the loudspeaker module (50) according to any one of claims 1 to 3, characterized in that: include: A dustproof ball top (523) is provided on an end of the voice coil (524) away from the magnetic circuit system (525).

5. The core (52) of the loudspeaker module (50) according to claim 4, characterized in that: The dustproof ball top (523) and the connecting member (527) are an integral part.

6. The core (52) of the loudspeaker module (50) according to claim 5, characterized in that: Also includes: A basin frame (521), the diaphragm group (522), the connecting member (527), the voice coil (524) and the magnetic circuit system (525) are located in the basin frame (521), the outer peripheral edge of the diaphragm group (522) is connected to the inner peripheral wall of the basin frame (521), the diaphragm group (522), the connecting member (527), the voice coil (524) and the dustproof ball top (523) divide the space in the basin frame (521) into a first part cavity (521a) and a second part cavity (521b), the first part cavity (521a) is located on a side of the diaphragm group (522) adjacent to the bottom wall of the basin frame (521), the magnetic circuit system (525) is located in the first part cavity (521a), and the first part cavity (521a) forms a front cavity.

7. The core (52) of the loudspeaker module (50) according to claim 6, characterized in that: Also includes: A centering support piece (526), ​​the centering support piece (526) is located on a side of the diaphragm group (522) away from the bottom wall of the basin frame (521), the outer peripheral edge of the centering support piece (526) is connected to the basin frame (521), and the inner peripheral edge of the centering support piece (526) is connected to the connecting piece (527) or the voice coil (524).

8. The core (52) of the loudspeaker module (50) according to claim 7, characterized in that: The centering support piece (526) is installed at the open opening (5211) of the basin frame (521).

9. The core (52) of the loudspeaker module (50) according to any one of claims 6 to 8, characterized in that: The bottom wall of the basin frame (521) has a mounting hole (5212), and one end of the magnetic circuit system (525) facing away from the dustproof ball top (523) is mounted at the mounting hole (5212).

10. The core (52) of the loudspeaker module (50) according to claim 9, characterized in that: The magnetic circuit system (525) has a first sound outlet channel (50c) opposite to the dustproof ball top (523), the first sound outlet channel (50c) is connected to the mounting hole (5212), and the magnetic gap (525a) surrounds the outer periphery of the first sound outlet channel (50c).

11. The core (52) of the loudspeaker module (50) according to claim 10, characterized in that: The magnetic circuit system (525) includes: a first magnetic conductor (5251), a magnet (5253) and a second magnetic conductor (5252), wherein the magnet (5253) and the second magnetic conductor (5252) cooperate with the first magnetic conductor (5251) to define the magnetic gap (525a).

12. The core (52) of the loudspeaker module (50) according to claim 11, characterized in that: The first magnetic conductor (5251) is a U iron, the magnet (5253) is installed in the first magnetic conductor (5251) and is connected to the inner bottom wall of the first magnetic conductor (5251), the second magnetic conductor (5252) is located on the side of the magnet (5253) away from the bottom wall of the first magnetic conductor (5251), and the outer peripheral wall of the second magnetic conductor (5252), the outer peripheral wall of the magnet (5253) and the inner peripheral wall of the first magnetic conductor (5251) define the magnetic gap (525a).

13. The core (52) of the loudspeaker module (50) according to claim 12, characterized in that: The magnet (5253) and the second magnetic conductor (5252) are both formed in a ring shape, and a through hole is provided on the bottom wall of the first magnetic conductor part (5251). The inner peripheral wall of the magnet (5253), the inner peripheral wall of the second magnetic conductor (5252) and the inner peripheral wall of the through hole define the first sound outlet channel (50c).

14. The core (52) of the loudspeaker module (50) according to claim 13, characterized in that: The first magnetic conductor (5251) is a T-iron, which includes a T-iron chassis (5251a) and a central magnetic conductor (5251b). The central magnetic conductor (5251b) is arranged in the middle of the T-iron chassis (5251a). The magnet (5253) is located on the T-iron chassis (5251a) and surrounds the outer periphery of the central magnetic conductor (5251b). The second magnetic conductor (5252) is located at the end of the magnet (5253) away from the T-iron chassis (5251a) and surrounds the outer periphery of the central magnetic conductor (5251b). The magnetic gap (525a) is defined between the inner peripheral wall of the second magnetic conductor (5252), the inner peripheral wall of the magnet (5253), and the outer peripheral wall of the central magnetic conductor (5251b).

15. The core (52) of the loudspeaker module (50) according to claim 14, characterized in that: The first sound outlet channel (50c) is formed on the first magnetic conductor (5251) and penetrates the central magnetic conductor (525b) and the T-iron chassis (5251a) along the axial direction of the central magnetic conductor (5251b).

16. The core (52) of the loudspeaker module (50) according to claim 9, characterized in that: A step portion (52121) is provided on the inner peripheral wall of the mounting hole (5212), and a positioning tongue (52511) is provided on the outer peripheral wall of the end of the magnetic circuit system (525) away from the voice coil (524), and the positioning tongue (52511) cooperates with the step portion (52121).

17. The core (52) of the loudspeaker module (50) according to any one of claims 6 to 8, characterized in that: A positioning step (5216) is formed on the peripheral wall of the basin frame (521), and the outer peripheral edge of the diaphragm group (522) is connected to the positioning step (5216).

18. The core (52) of the loudspeaker module (50) according to any one of claims 6 to 8, characterized in that: A second sound outlet channel (50b) is formed on the peripheral wall of the basin frame and / or the bottom wall of the basin frame, and the second sound outlet channel (50b) is in communication with the first partial cavity (521a).

19. A loudspeaker module (50), characterized in that: include: A shell (51) and a core (52) according to any one of claims 1 to 18, wherein the shell (51) has a mounting opening (511), the core (52) is mounted at the mounting opening (511), and the diaphragm group (522) and the shell (51) define a closed rear cavity.

20. The loudspeaker module (50) according to claim 19, characterized in that At least a portion of the magnetic circuit system (525) is located outside the housing (51).

21. An electronic device (100), characterized in that include: A housing, a circuit board (40), and a speaker module (50) as claimed in claim 19 or 20, wherein the housing has a sound outlet hole (311), the speaker module (50) has a sound outlet channel (50b, 50c), the circuit board (40) and the speaker module (50) are both arranged in the housing, and the sound outlet channel (50b, 50c) is connected to the sound outlet hole (311).

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