Silicon wafer cleaning solution mixing device and silicon wafer cleaning solution circulating system using the same

Abstract

The application discloses a silicon wafer cleaning liquid mixing device and a silicon wafer cleaning liquid circulating system adopting the device. The silicon wafer cleaning liquid mixing device comprises a cleaning liquid mixing box with an open top. A first overflow assembly, an overflow blocking plate perpendicular to the bottom plate of the cleaning liquid mixing box and a partition plate are sequentially arranged on the bottom plate of the cleaning liquid mixing box from left to right. An overflow inclined plate is movably arranged on the upper end of the partition plate. The silicon wafer cleaning liquid circulating system comprises the silicon wafer cleaning liquid mixing device, a silicon wafer cleaning machine, a cleaning liquid supplement tank, an acid mixing chamber and a control device. The silicon wafer cleaning liquid mixing device is arranged in the acid mixing chamber. An air extractor is arranged on the top of the acid mixing chamber and is connected with an acid mist treatment device arranged outside the acid mixing chamber. The acid mist treatment device is arranged outside the acid mixing chamber. The silicon wafer cleaning liquid circulating system can realize the recycling of the cleaning liquid and ensure the cleaning quality by supplementing new acid liquid on line, mixing by overflow and cooling. The device has the characteristics of convenient cleaning.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer cleaning solution mixing technology, and more specifically to a silicon wafer cleaning solution mixing device and a silicon wafer cleaning solution circulation system using the device. Background Technology

[0002] With the continuous advancement of integrated circuit manufacturing processes, semiconductor devices are becoming smaller and smaller. This has led to even very small particles becoming capable of affecting the manufacturing and performance of semiconductor devices, making silicon wafer cleaning processes increasingly important.

[0003] Currently, common methods for cleaning silicon wafers include physical cleaning and chemical cleaning. Chemical cleaning aims to remove invisible atomic and ionic contaminants and employs various methods, such as solvent extraction, acid washing (hydrofluoric acid, acetic acid, nitric acid, and various mixed acids), and plasma methods. When using mixed acid cleaning, several acids often need to be mixed in a specific volume ratio. In existing technologies, the effective cleaning substances in the acid solution are often consumed before the solution is treated as hazardous waste, resulting in high costs and difficult disposal. Alternatively, the used cleaning solution can be directly filtered before adding new acid, but impurities in the cleaning solution (mixed acid) often clog the filter. Mixed acid cleaning is generally completed at 30-40℃, but the continuous rotation of the silicon wafer during cleaning causes the cleaning solution temperature to rise to 45-50℃, directly using the cleaning solution will lead to a decrease in cleaning quality. Furthermore, adding new acid after the effective cleaning substances in the solution are almost consumed often results in uneven mixing of the cleaning solution, further reducing cleaning quality. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a silicon wafer cleaning solution mixing device and a silicon wafer cleaning solution circulation system using the device. By adding new acid solution online and mixing and cooling through overflow, the cleaning solution can be recycled and the cleaning quality can be guaranteed. The device is also easy to clean.

[0005] The technical solution adopted in this invention is as follows.

[0006] A silicon wafer cleaning fluid mixing device is characterized in that it includes a cleaning fluid mixing box with an open top, and a first overflow component, an overflow baffle plate perpendicular to the bottom plate of the cleaning fluid mixing box, and a partition plate are installed sequentially from left to right on the bottom plate of the cleaning fluid mixing box, and an overflow inclined plate is movably installed at the upper end of the partition plate.

[0007] The front sides of the first overflow assembly, overflow baffle, partition, and overflow inclined plate are all in contact with the rear side of the front sidewall of the cleaning fluid mixing box, and the rear sides of the first overflow assembly, overflow baffle, partition, and overflow inclined plate are all in contact with the front side of the rear sidewall of the cleaning fluid mixing box; the left side of the first overflow assembly, the right side of the first overflow assembly, the overflow baffle, partition, and overflow inclined plate are all perpendicular to the rear sidewall of the cleaning fluid mixing box.

[0008] The front wall of the cleaning fluid mixing box is screwed to the right side wall and the left side wall of the cleaning fluid mixing box, respectively; or, the rear wall of the cleaning fluid mixing box is screwed to the right side wall and the left side wall of the cleaning fluid mixing box, respectively.

[0009] The top surface of the first overflow assembly is higher than the top surface of the overflow baffle plate; the rear side wall of the cleaning fluid mixing box, the front side wall of the cleaning fluid mixing box, the bottom plate of the cleaning fluid mixing box, the right side of the first overflow assembly, and the overflow baffle plate form a first cleaning fluid flow space.

[0010] The top surface of the overflow baffle is higher than the top surface of the overflow inclined plate; the rear side wall of the cleaning fluid mixing box, the front side wall of the cleaning fluid mixing box, the bottom plate of the cleaning fluid mixing box, the overflow baffle, the partition, and the overflow inclined plate form a second cleaning fluid flow space.

[0011] The rear side wall of the cleaning fluid mixing box, the front side wall of the cleaning fluid mixing box, the bottom plate of the cleaning fluid mixing box, the partition, the overflow inclined plate, and the right side wall of the cleaning fluid mixing box form a third cleaning fluid flow space.

[0012] A filter screen is provided on the side of the overflow inclined plate away from the overflow baffle plate; the filter screen is in contact with the right side wall of the cleaning fluid mixing box, the front side wall of the cleaning fluid mixing box, and the rear side wall of the cleaning fluid mixing box.

[0013] The distance between the top of the overflow inclined plate and the top of the overflow baffle plate is greater than the distance between the bottom of the overflow inclined plate and the bottom of the overflow baffle plate.

[0014] Several main liquid outlet holes are provided between the partition on the bottom plate of the cleaning fluid mixing box and the right side of the cleaning fluid mixing box.

[0015] The top of the front or rear side of the first overflow assembly is provided with an inlet hole, and the bottom of the right side of the first overflow assembly is provided with several first overflow holes.

[0016] The overflow baffle plate is provided with several second overflow holes, and the top of the uppermost second overflow hole is higher than the top of the overflow inclined plate.

[0017] As a preferred technical solution, the first overflow assembly includes a left side plate, a right side plate perpendicular to the bottom plate of the cleaning fluid mixing box, a top plate, a bottom plate, a partition plate parallel to the bottom plate of the cleaning fluid mixing box, a front side plate perpendicular to the bottom plate of the cleaning fluid mixing box, and a rear side plate perpendicular to the bottom plate of the cleaning fluid mixing box; the partition plate is located between the top plate and the bottom plate.

[0018] The left side plate, right side plate, top plate, bottom plate, and partition plate are all in contact with the rear side of the front side wall of the cleaning fluid mixing box and are perpendicular to the rear side wall of the cleaning fluid mixing box; the front ends of the left side plate, right side plate, top plate, bottom plate, and partition plate are respectively connected to the front side plate, and the rear ends of the left side plate, right side plate, top plate, bottom plate, and partition plate are respectively connected to the rear side plate, thereby forming a fourth cleaning fluid flow space above the partition plate inside the first overflow assembly and a fifth cleaning fluid flow space below the partition plate inside the first overflow assembly.

[0019] The first cleaning fluid flow space is formed between the rear side wall of the cleaning fluid mixing box, the front side wall of the cleaning fluid mixing box, the bottom plate of the cleaning fluid mixing box, the right side plate, and the overflow baffle plate.

[0020] The first overflow hole is located on the right side plate below the partition plate.

[0021] Several third overflow holes are vertically arranged on the partition plate.

[0022] As a preferred technical solution, the left end of the bottom panel is connected to the bottom end of the left side panel, the right end of the bottom panel is connected to the bottom end of the right side panel, and the bottom end of the left side panel is higher than the bottom end of the right side panel.

[0023] As a preferred technical solution, the second overflow hole is an elongated hole perpendicular to the bottom plate of the cleaning fluid mixing box; the vertical length of the second overflow hole is not less than one-third of the height of the overflow baffle plate; and the sum of the liquid-passing cross-sectional areas of each second overflow hole is not less than four-fifths of the side area of ​​the overflow baffle plate.

[0024] As a preferred technical solution, the overflow inclined plate and the baffle are movably connected.

[0025] As a preferred technical solution, the front side wall of the cleaning fluid mixing box is movably connected to the left side wall and the right side wall of the cleaning fluid mixing box, or the rear side wall of the cleaning fluid mixing box is movably connected to the left side wall and the right side wall of the cleaning fluid mixing box.

[0026] As a preferred technical solution, the bottom plate of the cleaning fluid mixing box is provided with a first overflow component snap-fit ​​groove in the longitudinal direction, and the first overflow component is installed on the first overflow component snap-fit ​​groove.

[0027] The bottom plate of the cleaning fluid mixing box is provided with an overflow baffle plate locking groove in the longitudinal direction, and the overflow baffle plate is installed on the overflow baffle plate locking groove.

[0028] The bottom plate of the cleaning fluid mixing box is provided with a partition locking groove in the longitudinal direction, and the partition is installed on the partition locking groove.

[0029] As a preferred technical solution, the distance between the top of the baffle and the overflow baffle is greater than the distance between the bottom of the baffle and the overflow baffle.

[0030] As a preferred technical solution, several auxiliary liquid outlet holes are provided between the partition and the overflow baffle on the bottom plate of the cleaning fluid mixing box.

[0031] The silicon wafer cleaning solution circulation system includes any one of the above-mentioned silicon wafer cleaning solution mixing devices, a silicon wafer cleaning machine, a cleaning solution replenishment tank, an acid mixing chamber, and a control device. The silicon wafer cleaning solution mixing device is installed in the acid mixing chamber, and an exhaust fan is provided on the top of the acid mixing chamber. The exhaust fan is connected to an acid mist treatment device located outside the acid mixing chamber.

[0032] The cleaning fluid replenishment tank is connected to the inlet of the first overflow component via a pipeline, and the pipeline is equipped with a first flow control valve; the first flow control valve is connected to a control device.

[0033] The main outlet is connected to the silicon wafer cleaning machine via a pipeline, which is equipped with an acid concentration measuring sensor and a second flow control valve. The second flow control valve and the acid concentration measuring sensor are respectively connected to the control device.

[0034] The silicon wafer cleaning machine is connected to the liquid inlet of the first overflow component through a pipeline, and a pump is installed on the pipeline and connected to a control device;

[0035] The silicon wafer cleaning machine is equipped with a cleaning fluid temperature sensor, which is connected to the control device.

[0036] The beneficial effects of this invention are as follows: A filter plate is provided on the right side of the overflow inclined plate, which can filter impurities online. The top surface of the first overflow component is higher than the top surface of the overflow baffle plate; a first cleaning fluid flow space is formed between the rear side wall of the cleaning fluid mixing box, the front side wall of the cleaning fluid mixing box, the bottom plate of the cleaning fluid mixing box, the right side of the first overflow component, and the overflow baffle plate. The top surface of the overflow baffle plate is higher than the top surface of the overflow inclined plate; a second cleaning fluid flow space is formed between the rear side wall of the cleaning fluid mixing box, the front side wall of the cleaning fluid mixing box, the bottom plate of the cleaning fluid mixing box, the overflow baffle plate, the partition plate, and the overflow inclined plate. A third cleaning fluid flow space is formed between the rear side wall of the cleaning fluid mixing box, the front side wall of the cleaning fluid mixing box, the bottom plate of the cleaning fluid mixing box, the partition plate, the overflow inclined plate, and the right side wall of the cleaning fluid mixing box. The arrangement of the three overflow spaces ensures that the cleaning fluid is fully mixed. The open design of the cleaning fluid mixing box, with the cleaning fluid flowing through the three overflow spaces, achieves cooling of the cleaning fluid. Overflow-type acid addition prevents foaming; a cleaning solution replenishment tank is equipped with online detection, online acid replenishment, and online overflow cooling to achieve circulating circulation of the cleaning solution. A cleaning solution temperature sensor measures the temperature; when the temperature of the cleaning solution in the silicon wafer cleaning machine exceeds the set value, the control device accelerates the circulation speed of the cleaning solution to cool it down. Online acid replenishment solves the problem of uneven mixing and decreased cleaning quality often caused by adding new acid when the effective cleaning agent in the acid solution is almost depleted. Attached Figure Description

[0037] Figure 1 This is a three-dimensional structural schematic diagram of a preferred embodiment of the silicon wafer cleaning solution mixing device of the present invention.

[0038] Figure 2 yes Figure 1 A magnified view of part A.

[0039] Figure 3 yes Figure 1 A magnified view of part B.

[0040] Figure 4 yes Figure 1 Rear view of the silicon wafer cleaning solution mixing device shown.

[0041] Figure 5 yes Figure 1 Left view of the silicon wafer cleaning solution mixing device shown.

[0042] Figure 6 This is a perspective view of the first overflow component.

[0043] Figure 7 yes Figure 6 A magnified view of part D.

[0044] Figure 8 yes Figure 6 A magnified view of part E.

[0045] Figure 9 yes Figure 1 The diagram shows the structure after the front part has been cut off along line C-C'.

[0046] Figure 10 yes Figure 9 A magnified view of part F.

[0047] Figure 11 yes Figure 9 A magnified view of part G.

[0048] Figure 12 yes Figure 8 The front view of the silicon wafer cleaning solution mixing device with the front part cut off is shown.

[0049] Figure 13 yes Figure 12 A magnified view of part H.

[0050] Figure 14 yes Figure 12 A magnified view of part I.

[0051] Figure 15 This is a schematic diagram of the working principle of the silicon wafer cleaning solution mixing device.

[0052] Figure 16 yes Figure 15 A magnified view of part J.

[0053] Figure 17 yes Figure 15 A magnified view of part K.

[0054] Figure 18 Is adopted Figure 1 The diagram shows the structure of the silicon wafer cleaning solution circulation system in the silicon wafer cleaning solution mixing device.

[0055] Figure 19 This is a schematic diagram of a preferred embodiment of the silicon wafer cleaning solution mixing device of the present invention.

[0056] Figure 20 yes Figure 19 A magnified view of part L.

[0057] Figure 21 yes Figure 19 A magnified view of part M.

[0058] Figure 22 Is adopted Figure 20 The diagram shows the structure of the silicon wafer cleaning solution circulation system in the silicon wafer cleaning solution mixing device.

[0059] Wherein: cleaning fluid mixing box-1; bottom plate of cleaning fluid mixing box-11; front side wall of cleaning fluid mixing box-12; rear side wall of cleaning fluid mixing box-13; right side wall of cleaning fluid mixing box-14; left side wall of cleaning fluid mixing box-15; first overflow assembly retaining groove-16; overflow baffle plate retaining groove-17; partition retaining groove-18; protrusion-19;

[0060] First overflow assembly-2; Liquid inlet-21; First overflow hole-22; Left side plate-23; Right side plate-24; Top plate-25; Bottom plate-26; Divider plate-27; Front side plate-28; Rear side plate-29; Third overflow hole-210;

[0061] Overflow baffle plate-3; Second overflow hole-31;

[0062] Partition-4;

[0063] Overflow inclined plate-5; Filter screen plate-51; Plastic screw-52;

[0064] First cleaning fluid flow space -61; Second cleaning fluid flow space -62; Third cleaning fluid flow space -63; Fourth cleaning fluid flow space -64; Fifth cleaning fluid flow space -65;

[0065] Main outlet -71; Auxiliary outlet -72;

[0066] Silicon wafer cleaning machine - 81; Cleaning solution replenishment tank - 82; Valve - 83; Pump - 84; Acid concentration measuring sensor - 85; First flow control valve - 86; Second flow control valve - 87; Cleaning solution temperature sensor - 88;

[0067] Mixed acid chamber-9; exhaust fan-91. Detailed Implementation

[0068] The present invention will now be further described in conjunction with the accompanying drawings and embodiments.

[0069] Example 1. As... Figure 1-17 As shown, a silicon wafer cleaning fluid mixing device is characterized in that it includes a cleaning fluid mixing box 1 with an open top, and a first overflow component 2, an overflow baffle plate 3 perpendicular to the bottom plate 11 of the cleaning fluid mixing box, and a partition plate 4 are installed sequentially from left to right on the bottom plate 11 of the cleaning fluid mixing box, and an overflow inclined plate 5 is movably installed at the upper end of the partition plate 4.

[0070] The front sides of the first overflow assembly 2, overflow baffle 3, partition 4, and overflow inclined plate 5 are all in contact with the rear side of the front sidewall 12 of the cleaning fluid mixing box, and the rear sides of the first overflow assembly 2, overflow baffle 3, partition 4, and overflow inclined plate 5 are all in contact with the front side of the rear sidewall 13 of the cleaning fluid mixing box; the left side of the first overflow assembly 2, the right side of the first overflow assembly 2, the overflow baffle 3, partition 4, and overflow inclined plate 5 are all perpendicular to the rear sidewall 13 of the cleaning fluid mixing box.

[0071] The front side wall 12 of the cleaning fluid mixing box is connected to the right side wall 14 and the left side wall 15 of the cleaning fluid mixing box by screws.

[0072] The top surface of the first overflow component 2 is higher than the top surface of the overflow baffle plate 3; the rear side wall 13 of the cleaning fluid mixing box, the front side wall 12 of the cleaning fluid mixing box, the bottom plate 11 of the cleaning fluid mixing box, the right side of the first overflow component 2, and the overflow baffle plate 3 form a first cleaning fluid flow space 61.

[0073] The top surface of the overflow baffle 3 is higher than the top surface of the overflow inclined plate 5; the rear side wall 13 of the cleaning fluid mixing box, the front side wall 12 of the cleaning fluid mixing box, the bottom plate 11 of the cleaning fluid mixing box, the overflow baffle 3, the partition 4, and the overflow inclined plate 5 form a second cleaning fluid flow space 62.

[0074] The rear sidewall 13 of the cleaning fluid mixing box, the front sidewall 12 of the cleaning fluid mixing box, the bottom plate 11 of the cleaning fluid mixing box, the partition 4, the overflow inclined plate 5, and the right sidewall 14 of the cleaning fluid mixing box form a third cleaning fluid flow space 63.

[0075] A filter plate 51 is provided on the side of the overflow inclined plate 5 away from the overflow baffle plate 3; the filter plate 51 is in contact with the right side wall 14 of the cleaning fluid mixing box, the front side wall 12 of the cleaning fluid mixing box, and the rear side wall 13 of the cleaning fluid mixing box.

[0076] The distance between the top of the overflow inclined plate 5 and the top of the overflow baffle plate 3 is greater than the distance between the bottom of the overflow inclined plate 5 and the bottom of the overflow baffle plate 3.

[0077] Several main outlet holes 71 are provided between the partition 4 on the bottom plate 11 of the cleaning fluid mixing box and the right side of the cleaning fluid mixing box 1.

[0078] The top of the front or rear side of the first overflow component 2 is provided with an inlet hole 21, and the bottom of the right side of the first overflow component 2 is provided with a plurality of first overflow holes 22.

[0079] The overflow baffle plate 3 is provided with several second overflow holes 31, and the top of the uppermost second overflow hole 31 is higher than the top of the overflow inclined plate 5.

[0080] The first overflow assembly 2 includes a left side plate 23, a right side plate 24 perpendicular to the bottom plate 11 of the cleaning fluid mixing box, a top plate 25, a bottom plate 26, a partition plate 27 parallel to the bottom plate 11 of the cleaning fluid mixing box, a front side plate 28 perpendicular to the bottom plate 11 of the cleaning fluid mixing box, and a rear side plate 29 perpendicular to the bottom plate 11 of the cleaning fluid mixing box; the partition plate 27 is located between the top plate 25 and the bottom plate 26.

[0081] The left side plate 23, right side plate 24, top plate 25, bottom plate 26, and partition plate 27 are all in contact with the rear side of the front side wall 12 of the cleaning fluid mixing box and are perpendicular to the rear side wall 13 of the cleaning fluid mixing box. The front ends of the left side plate 23, right side plate 24, top plate 25, bottom plate 26, and partition plate 27 are respectively connected to the front side plate 28, and the rear ends of the left side plate 23, right side plate 24, top plate 25, bottom plate 26, and partition plate 27 are respectively connected to the rear side plate 29, thereby forming a fourth cleaning fluid flow space 64 above the partition plate 27 inside the first overflow assembly 2 and a fifth cleaning fluid flow space 65 below the partition plate 27 inside the first overflow assembly 2.

[0082] The rear sidewall 13 of the cleaning fluid mixing box, the front sidewall 12 of the cleaning fluid mixing box, the bottom plate 11 of the cleaning fluid mixing box, the right side plate 24, and the overflow baffle plate 3 form a first cleaning fluid flow space 61.

[0083] The first overflow hole 22 is located on the right side plate 24 below the partition plate 27.

[0084] The partition plate 27 is provided with several third overflow holes 210 vertically.

[0085] The left end of the bottom panel 26 is connected to the bottom end of the left side panel 23, and the right end of the bottom panel 26 is connected to the bottom end of the right side panel 24. The bottom end of the left side panel 23 is higher than the bottom end of the right side panel 24.

[0086] The second overflow hole 31 is an elongated hole perpendicular to the bottom plate 11 of the cleaning fluid mixing box; the vertical length of the second overflow hole 31 is not less than one-third of the height of the overflow baffle plate 3; the sum of the liquid flow cross-sectional areas of each second overflow hole 31 is not less than four-fifths of the side area of ​​the overflow baffle plate 3.

[0087] The overflow inclined plate 5 is movably connected to the partition plate 4.

[0088] The front side wall 12 of the cleaning fluid mixing box is movably connected to the left side wall 15 and the right side wall 14 of the cleaning fluid mixing box, or the rear side wall 13 of the cleaning fluid mixing box is movably connected to the left side wall 15 and the right side wall 14 of the cleaning fluid mixing box.

[0089] The distance between the top of the baffle 4 and the overflow baffle 3 is greater than the distance between the bottom of the baffle 4 and the overflow baffle 3.

[0090] The cleaning fluid mixing box 1 has a longitudinal protrusion 19 on the right side wall. The side of the overflow inclined plate 5 away from the overflow baffle plate 3 is connected to the filter screen plate 51. The right end of the filter screen plate 51 overlaps the protrusion 19.

[0091] The overflow inclined plate 5 is connected to the partition plate 4 by plastic screws 52.

[0092] All components of the silicon wafer cleaning fluid mixing device are made of plastic. The arrows indicate the direction of liquid flow.

[0093] Example 2. (As shown) Figure 18 As shown, the silicon wafer cleaning solution circulation system includes the silicon wafer cleaning solution mixing device described in Example 1, the silicon wafer cleaning machine 81, the cleaning solution replenishment tank 82, the acid mixing chamber 9, and the control device. The silicon wafer cleaning solution mixing device is installed in the acid mixing chamber 9. The top of the acid mixing chamber 9 is equipped with an exhaust fan 91, which is connected to an acid mist treatment device located outside the acid mixing chamber.

[0094] The cleaning fluid replenishment tank 82 is connected to the inlet port 21 of the first overflow assembly 2 via a pipeline, and the pipeline is equipped with a first flow control valve 86; the first flow control valve 86 is connected to the control device.

[0095] The main outlet 71 is connected to the silicon wafer cleaning machine 81 through a pipeline. The pipeline is equipped with an acid concentration measuring sensor 85 and a second flow control valve 87. The second flow control valve 87 and the acid concentration measuring sensor 85 are respectively connected to the control device.

[0096] The silicon wafer cleaning machine 81 is connected to the liquid inlet 21 of the first overflow component 2 via a pipeline. A pump 84 is provided on the pipeline and is connected to a control device.

[0097] The silicon wafer cleaning machine 81 is equipped with a cleaning fluid temperature sensor 88, which is connected to the control device.

[0098] Example 3. (As shown) Figure 19-21 As shown, the difference between this embodiment and embodiment 1 is that: the bottom plate 11 of the cleaning fluid mixing box is provided with a first overflow component snap-fit ​​groove 16 in the longitudinal direction, and the first overflow component 2 is installed on the first overflow component snap-fit ​​groove 16;

[0099] An overflow baffle plate slot 17 is provided longitudinally on the bottom plate 11 of the cleaning fluid mixing box, and an overflow baffle plate 3 is installed on the overflow baffle plate slot 17.

[0100] The bottom plate 11 of the cleaning fluid mixing box has a longitudinally arranged partition locking groove 18, and the partition 4 is installed on the partition locking groove 18. The front side wall 12 of the cleaning fluid mixing box is screwed to the right side wall 14 and the left side wall 15 of the cleaning fluid mixing box, respectively; or, the rear side wall 13 of the cleaning fluid mixing box is screwed to the right side wall 14 and the left side wall 15 of the cleaning fluid mixing box, respectively. This structure facilitates disassembly and cleaning.

[0101] Example 4. (As shown) Figure 22 As shown, the difference between this embodiment and embodiment 1 is that: a number of auxiliary liquid outlet holes 72 are provided between the partition 4 and the overflow baffle 3 on the bottom plate 11 of the cleaning fluid mixing box.

[0102] The auxiliary liquid outlet 72 is connected to the silicon wafer cleaning machine 81 via a pipeline, and a valve 83 is installed on the pipeline. The valve 83 is connected to a control device, which is a PLC.

Claims

1. A silicon wafer cleaning solution mixing device, characterized in that, Includes a top-open cleaning fluid mixing box (1), and from left to right, the bottom plate (11) of the cleaning fluid mixing box is equipped with a first overflow assembly (2), an overflow baffle plate (3) perpendicular to the bottom plate (11) of the cleaning fluid mixing box, and a partition plate (4), and an overflow inclined plate (5) is movably installed at the upper end of the partition plate (4). The front sides of the first overflow assembly (2), overflow baffle (3), partition (4), and overflow inclined plate (5) are all in contact with the rear side of the front sidewall (12) of the cleaning fluid mixing box, and the rear sides of the first overflow assembly (2), overflow baffle (3), partition (4), and overflow inclined plate (5) are all in contact with the front side of the rear sidewall (13) of the cleaning fluid mixing box; the left side of the first overflow assembly (2), the right side of the first overflow assembly (2), the overflow baffle (3), partition (4), and overflow inclined plate (5) are all perpendicular to the rear sidewall (13) of the cleaning fluid mixing box. The front side wall (12) of the cleaning fluid mixing box is screwed to the right side wall (14) and the left side wall (15) of the cleaning fluid mixing box, respectively; or, the rear side wall (13) of the cleaning fluid mixing box is screwed to the right side wall (14) and the left side wall (15) of the cleaning fluid mixing box, respectively. The top surface of the first overflow assembly (2) is higher than the top surface of the overflow baffle plate (3); the rear side wall (13) of the cleaning fluid mixing box, the front side wall (12) of the cleaning fluid mixing box, the bottom plate (11) of the cleaning fluid mixing box, the right side of the first overflow assembly (2), and the overflow baffle plate (3) form a first cleaning fluid flow space (61). The top surface of the overflow baffle (3) is higher than the top surface of the overflow inclined plate (5); the rear side wall (13) of the cleaning fluid mixing box, the front side wall (12) of the cleaning fluid mixing box, the bottom plate (11) of the cleaning fluid mixing box, the overflow baffle (3), the partition (4), and the overflow inclined plate (5) form a second cleaning fluid flow space (62). The rear sidewall (13), the front sidewall (12), the bottom plate (11), the partition (4), the overflow inclined plate (5), and the right sidewall (14) of the cleaning fluid mixing box form a third cleaning fluid flow space (63). A filter plate (51) is provided on the side of the overflow inclined plate (5) away from the overflow baffle plate (3); the filter plate (51) is in contact with the right side wall (14), the front side wall (12), and the rear side wall (13) of the cleaning liquid mixing box respectively. The distance between the top of the overflow inclined plate (5) and the top of the overflow baffle plate (3) is greater than the distance between the bottom of the overflow inclined plate (5) and the bottom of the overflow baffle plate (3). Several main outlet holes (71) are provided between the partition (4) on the bottom plate (11) of the cleaning fluid mixing box and the right side of the cleaning fluid mixing box (1). The first overflow assembly (2) has an inlet hole (21) at the top of the front or rear side and a plurality of first overflow holes (22) at the bottom of the right side. The overflow baffle plate (3) is provided with several second overflow holes (31), and the top of the uppermost second overflow hole (31) is higher than the top of the overflow inclined plate (5); The overflow inclined plate (5) is movably connected to the partition plate (4); Several auxiliary outlet holes (72) are provided between the partition (4) on the bottom plate (11) of the cleaning fluid mixing box and the overflow baffle (3).

2. The silicon wafer cleaning solution mixing device as described in claim 1, characterized in that: The first overflow assembly (2) includes a left side plate (23), a right side plate (24) perpendicular to the bottom plate (11) of the cleaning fluid mixing box, a top plate (25), a bottom plate (26), a partition plate (27) parallel to the bottom plate (11) of the cleaning fluid mixing box, a front side plate (28) perpendicular to the bottom plate (11) of the cleaning fluid mixing box, and a rear side plate (29) perpendicular to the bottom plate (11) of the cleaning fluid mixing box; the partition plate (27) is located between the top plate (25) and the bottom plate (26); The left side plate (23), right side plate (24), top plate (25), bottom plate (26), and partition plate (27) are all in contact with the rear side of the front side wall (12) of the cleaning fluid mixing box and are perpendicular to the rear side wall (13) of the cleaning fluid mixing box; the front ends of the left side plate (23), right side plate (24), top plate (25), bottom plate (26), and partition plate (27) are respectively connected to the front side plate (28), and the rear ends of the left side plate (23), right side plate (24), top plate (25), bottom plate (26), and partition plate (27) are respectively connected to the rear side plate (29), thereby forming a fourth cleaning fluid flow space (64) above the partition plate (27) inside the first overflow assembly (2) and a fifth cleaning fluid flow space (65) below the partition plate (27) inside the first overflow assembly (2); A first cleaning fluid flow space (61) is formed between the rear side wall (13) of the cleaning fluid mixing box, the front side wall (12) of the cleaning fluid mixing box, the bottom plate (11) of the cleaning fluid mixing box, the right side plate (24) and the overflow baffle plate (3). The first overflow hole (22) is located on the right side plate (24) below the partition plate (27); Several third overflow holes (210) are provided vertically on the partition plate (27).

3. The silicon wafer cleaning solution mixing device as described in claim 2, characterized in that: The left end of the bottom panel (26) is connected to the bottom end of the left side panel (23), the right end of the bottom panel (26) is connected to the bottom end of the right side panel (24), and the bottom end of the left side panel (23) is higher than the bottom end of the right side panel (24).

4. The silicon wafer cleaning solution mixing device as described in claim 1, characterized in that: The second overflow hole (31) is a long strip hole perpendicular to the bottom plate (11) of the cleaning fluid mixing box; the vertical length of the second overflow hole (31) is not less than one-third of the height of the overflow baffle plate (3); the sum of the liquid flow cross-sectional areas of each second overflow hole (31) is not less than four-fifths of the side area of ​​the overflow baffle plate (3).

5. The silicon wafer cleaning solution mixing device as described in claim 1, characterized in that: The bottom plate (11) of the cleaning fluid mixing box is provided with a first overflow component snap-fit ​​groove (16) in the longitudinal direction, and the first overflow component (2) is installed on the first overflow component snap-fit ​​groove (16); An overflow baffle plate slot (17) is provided longitudinally on the bottom plate (11) of the cleaning fluid mixing box, and an overflow baffle plate (3) is installed on the overflow baffle plate slot (17); The bottom plate (11) of the cleaning fluid mixing box is provided with a partition slot (18) in the longitudinal direction, and the partition (4) is installed on the partition slot (18).

6. The silicon wafer cleaning solution mixing device as described in claim 5, characterized in that: The distance between the top of the partition (4) and the overflow baffle (3) is greater than the distance between the bottom of the partition (4) and the overflow baffle (3).

7. A silicon wafer cleaning fluid circulation system, characterized in that: Includes a silicon wafer cleaning solution mixing device, a silicon wafer cleaning machine (81), a cleaning solution replenishment tank (82), a mixed acid chamber (9), and a control device as described in any one of claims 1-6. The silicon wafer cleaning solution mixing device is installed in the mixed acid chamber (9). An exhaust fan (91) is provided on the top of the mixed acid chamber (9). The exhaust fan (91) is connected to an acid mist treatment device located outside the mixed acid chamber. The cleaning fluid replenishment tank (82) is connected to the inlet (21) of the first overflow assembly (2) via a pipeline, and the pipeline is equipped with a first flow control valve (86); the first flow control valve (86) is connected to the control device; The main outlet (71) is connected to the silicon wafer cleaning machine (81) through a pipeline. The pipeline is equipped with an acid concentration measuring sensor (85) and a second flow control valve (87). The second flow control valve (87) and the acid concentration measuring sensor (85) are respectively connected to the control device. The silicon wafer cleaning machine (81) is connected to the liquid inlet (21) of the first overflow assembly (2) through a pipeline, and a pump (84) is provided on the pipeline, which is connected to the control device; The silicon wafer cleaning machine (81) is equipped with a cleaning fluid temperature sensor (88), which is connected to the control device.

Images