An extendable bidirectional current control integrated circuit for dense dot matrix vision touch sensing

Abstract

The application discloses an extensible bidirectional current control integrated circuit for dense dot array visual and tactile perception. The integrated circuit unit comprises a host computer interactive platform and a main control circuit, the main control circuit is connected with a power stabilizing circuit, a current detection circuit and a discrete control circuit, the main control circuit is connected with an H-bridge driving circuit through an optical coupling isolation circuit, and the discrete control circuit is connected with the dense dot array through a row pin or a row wire. The application can be used for array type dense bidirectional control visual and tactile perception, driving visual dot array or tactile dot array to output visual stimulation or tactile stimulation, providing a control means of positive and reverse bidirectional current, having strong regulation and control ability, bus expansion function, high stability and high integration, and meeting the requirements of real-time, stability and easy control.

Description

Technical Field

[0001] This invention relates to an integrated control circuit for dense dot matrix, specifically an array scalable integrated circuit with bidirectional current control function for dense dot matrix visual and tactile sensing, which can drive visual or tactile dense dot matrix. Technical Background

[0002] Visual and tactile dense dot matrix sensors have been widely used in various visual and tactile sensing devices. How to drive these sensors is a common key technology for both. Currently, most visual and tactile sensing devices use unidirectional power to drive these sensors, which suffers from limited applicability and weak functionality. Summary of the Invention

[0003] To address the problems existing in the background art, the purpose of this invention is to provide an array-scalable integrated circuit with bidirectional current control function, capable of driving visual or tactile dot arrays of varying numbers, and possessing independent control functionality for each dot. This invention can be used for array-based, densely controlled bidirectional visual and tactile perception, driving visual or tactile dot arrays to output visual or tactile stimuli.

[0004] The technical solution of this invention is:

[0005] The present invention includes at least one integrated circuit unit. Each integrated circuit unit includes a host computer interaction platform, a main control circuit, an optocoupler isolation circuit, an H-bridge drive circuit, a current detection circuit, and a discrete control circuit. The host computer interaction platform and the main control circuit are connected. The main control circuit is connected to the power supply regulator circuit, the current detection circuit, and the discrete control circuit, respectively. The main control circuit is connected to the H-bridge drive circuit through the optocoupler isolation circuit. The discrete control circuit is connected to the dense dot matrix through pin headers or ribbon cables.

[0006] The dense dot matrix is ​​either a visual dot matrix or a tactile dot matrix.

[0007] Visual dot matrix can be composed of a dense array of LEDs, etc.

[0008] Specifically, a tactile dot matrix can be composed of a dense array of electromagnetic driving components, such as solenoid valves, used as control components to stimulate tactile surfaces.

[0009] The main control circuit includes a main controller U1, two of which have GPIO output ports connected to an optocoupler isolation circuit. The optocoupler isolation circuit controls the direction of the current output of the H-bridge drive circuit.

[0010] The main controller U1 is provided with a stable 3.3V voltage by a power supply regulator circuit. The OSC pin of the main controller U1 is connected to the active crystal oscillator X1 via resistor R18. The active crystal oscillator X1 is connected in parallel with capacitor C12. The lead between resistor R18 and active crystal oscillator X1 is connected to the 3.3V voltage provided by the power supply regulator module via ferrite bead L3.

[0011] The main controller U1 is also connected to 12 decoupling capacitors C16 to C27 between the two power supply terminals.

[0012] The SWDIO and SWDCLK pins of the main controller U1 are connected to socket P3, the TX and RX pins of the main controller U1 are connected to socket P1, and the I2C SCL and I2C SDA pins of the main controller U1 are connected to socket P2. Sockets P1 to P3 all provide functions for program burning, serial communication, and bus expansion. Among them, socket P1 is used for communication with the host computer interactive platform, socket P2 is used for bus expansion, and socket P3 is used for program burning of the main controller U1.

[0013] The optocoupler isolation circuit includes an optocoupler conversion chip U4 and decoupling capacitors C10 and C11. The optocoupler conversion chip U4 has two optocouplers. The two GPIO output ports of the main controller U1 are connected to the positive input terminals of the two optocouplers in the optocoupler conversion chip U4 through resistors R10 and R11, respectively. The negative input terminals of the two optocouplers are grounded. The anode of the output terminals of the two optocouplers is connected to the driving voltage. The cathode of the output terminals of the two optocouplers is connected to the H-bridge driving circuit through pull-down resistors R14 and R15, respectively.

[0014] The H-bridge drive circuit includes two gate chips U5 and U6, two fast-switching diodes D3 and D4, and two bootstrap capacitors C8 and C9. The HIN pins of the two gate chips U5 and U6 are respectively connected to the output cathodes of two optocouplers. The VCC pin of gate chip U5 is connected to its own VB pin via fast-switching diode D3, and its VB pin is connected to its own VS pin via bootstrap capacitor C8. The HO and LO pins of gate chip U5 are connected to the gates of enhancement-mode MOSFETs Q1 and Q3 via resistors R11 and R16, respectively. The VCC pin of gate chip U6 is connected to its own VB pin via fast-switching diode D4, and its VB pin is connected to its own VS pin via bootstrap capacitor C9. The VS pins are connected, and the HO and LO pins of the gate chip U6 are connected to the gates of enhancement-mode MOSFETs Q1 and Q3 via resistors R12 and R17, respectively. The series connection of enhancement-mode MOSFETs Q1 and Q3 is then connected in parallel with the series connection of enhancement-mode MOSFETs Q2 and Q4 to form an H-bridge structure. The VS pin of the gate chip U5 is connected between enhancement-mode MOSFETs Q1 and Q3 and is led out as the output terminal OUT_R of the H-bridge drive circuit. The VS pin of the gate chip U6 is connected between enhancement-mode MOSFETs Q2 and Q4 and is led out as the output terminal OUT_L of the H-bridge drive circuit.

[0015] The current detection circuit includes a sampling resistor R124 and a current amplifier chip U7. The sampling resistor R124 is connected between the output terminals OUT_R and OUT_L of the H-bridge drive circuit. The OUT output terminal of the current amplifier chip U7 is connected to the ADC pin of the main controller U1 of the main control circuit. The REFIN pin of the current amplifier chip U7 is connected to the drive voltage and ground via resistors R125 and R126, respectively.

[0016] The discrete control circuit includes several switching units. Each switching unit mainly consists of two MOSFETs Q5 and Q6 and a pull-down resistor R24. The two gates of the two MOSFETs Q5 and Q6 are connected to each other and are both connected to the signal output terminal of the main controller U1 of the main control circuit, and are grounded through the pull-down resistor R24. The two sources of the two MOSFETs Q5 and Q6 are respectively connected to the two ends of each viewpoint or contact in the dense dot matrix. The two drains of the two MOSFETs Q5 and Q6 are respectively connected to the output terminals OUT_R and OUT_L of the H-bridge drive circuit.

[0017] It includes multiple integrated circuit units, which are connected via a bus through the I2C line of the main controller U1 in their respective main control circuits, realizing the interconnection of multiple array-type dense array integrated circuits.

[0018] The power supply regulator circuit, main control circuit, optocoupler isolation circuit, H-bridge drive circuit, and current detection circuit are integrated on one circuit. The main control circuit and H-bridge drive circuit are connected to the discrete control circuit through pin headers, ribbon cables, or other preferred electrical connection methods. The discrete control circuit is also connected to the dense dot matrix through pin headers, ribbon cables, or other preferred electrical connection methods.

[0019] The integrated circuit of the present invention is used to drive dense visual dot matrix or dense tactile dot matrix, which has a wider range of applications and stronger functions, thus expanding the application fields of visual sensing equipment and tactile sensing equipment.

[0020] The integrated circuit of the present invention has the feature of array scalability, which can be applied to drive visual or tactile dot arrays with different numbers of dots, thereby improving the design flexibility of visual and tactile sensing equipment.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. The integrated circuit of the present invention has a simple structure, is easy to use, has high reliability, generates little heat, and has a fast response speed. It can provide bidirectional control means for forward and reverse current and control dense dot matrix in real time.

[0023] 2. The integrated circuit of the present invention has strong controllability and can drive various types of visual dense dot matrix or tactile dense dot matrix, and the driving time and driving voltage are adjustable.

[0024] 3. The integrated circuit of the present invention has a bus expansion function, which can adapt to arrayed, large-area visual dense dot arrays or tactile dense dot arrays with different numbers of dots, and provide more visual or tactile stimulation.

[0025] Therefore, the present invention can be used in array-type dense bidirectional control visual sensing equipment and tactile sensing equipment to drive visual or tactile dot arrays to output visual or tactile stimuli. It has high stability and integration, and meets the requirements of real-time performance, stability and ease of control for visual or tactile dot arrays. Attached Figure Description

[0026] Figure 1 This is a block diagram of the integrated circuit system structure of the present invention.

[0027] Figure 2 This is the circuit diagram of the main control circuit of the present invention.

[0028] Figure 3This is a circuit diagram showing the common connection of the optocoupler isolation circuit, H-bridge drive circuit, and current detection circuit of the present invention.

[0029] Figure 4 This is a circuit diagram of a single control unit in the discrete control circuit of the present invention.

[0030] In the figure: host computer interaction platform (1); power supply voltage regulator circuit (2); main control circuit (3); optocoupler isolation circuit (4); H-bridge drive circuit (5); current detection circuit (6); discrete control circuit (7); dense dot matrix (8). Detailed Implementation

[0031] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0032] The integrated circuit structure of the present invention is as follows: Figure 1 As shown, it includes at least one integrated circuit unit. Each integrated circuit unit includes a host computer interaction platform 1, a main control circuit 3, an optocoupler isolation circuit 4, an H-bridge drive circuit 5, a current detection circuit 6, and a discrete control circuit 7. The host computer interaction platform 1 and the main control circuit 3 are connected, and the host computer interaction platform 1 transmits the dot matrix control signal to the main control circuit 3 through a serial port. The main control circuit 3 is connected to the power supply regulator circuit 2, the current detection circuit 6, and the discrete control circuit 7, respectively. The main control circuit 3 is connected to the H-bridge drive circuit 5 after passing through the optocoupler isolation circuit 4. The discrete control circuit 7 is connected to the dense dot matrix 8 through electrical connections such as pin headers or ribbon cables.

[0033] It also includes a power supply regulator circuit 2, which is connected to the main control circuit 3, the optocoupler isolation circuit 4, and the discrete control circuit 7.

[0034] like Figure 2 As shown, the main control circuit 3 includes a main controller U1. Two of the GPIO output ports of the main controller U1 are connected to the optocoupler isolation circuit 4. The optocoupler isolation circuit 4 controls the direction of the current output of the H-bridge drive circuit 5. The other GPIO output ports are connected to the discrete control circuit 7 to realize the independent control of each single point in the array-type dense dot matrix.

[0035] The main controller U1 is provided with a stable 3.3V voltage by the power supply regulator circuit 2. The OSC pin of the main controller U1 is connected to the active crystal oscillator X1 through resistor R18. The active crystal oscillator X1 is connected in parallel with capacitor C12 for noise reduction. The lead between resistor R18 and active crystal oscillator X1 is connected to the 3.3V voltage provided by the power supply regulator module through the ferrite bead L3.

[0036] There are also 12 decoupling capacitors C16 to C27 connected between the two power supply terminals of the main controller U1.

[0037] The SWDIO and SWDCLK pins of the main controller U1 are connected to socket P3, the TX and RX pins of the main controller U1 are connected to socket P1, and the I2C SCL and I2C SDA pins of the main controller U1 are connected to socket P2. Sockets P1 to P3 provide serial communication, bus expansion, and program burning functions, respectively. Among them, socket P1 is used for communication with the host computer interactive platform 1, socket P2 is used for bus expansion, and socket P3 is used for program burning of the main controller U1.

[0038] In specific implementation, the clock pin of the main controller U1 is connected to resistor R18 and active crystal oscillator X1. 3.3V power is supplied to the active crystal oscillator X1 through ferrite bead L3. Decoupling capacitor C12 is present at the input and ground terminals of the main controller U1. The USART1_TX and USART1_RX pins of the main controller U1 are connected to socket P1 for communication with the host computer interaction platform 1. The I2C_SCL and I2C_SDA pins of the main controller U1 are connected to socket P2 for bus expansion. The JTMS-SWDIO and JTMS-SWCLK pins of the main controller U1 are connected to socket P3 for programming the main controller U1.

[0039] like Figure 3 As shown, the optocoupler isolation circuit 4 includes an optocoupler conversion chip U4 and decoupling capacitors C10 and C11. The optocoupler conversion chip U4 is provided with a stable 5V driving voltage by the power supply regulator circuit 2. The optocoupler conversion chip U4 has two optocouplers. The two GPIO output ports of the main controller U1 are connected to the positive terminals of the two optocouplers in the optocoupler conversion chip U4 through resistors R10 and R11, respectively. The negative terminals of the two optocouplers are grounded. The anodes of the two optocouplers are connected to the driving voltage. The cathodes of the two optocouplers are connected to the H-bridge drive circuit 5 through pull-down resistors R14 and R15, respectively.

[0040] Each optocoupler includes a light-emitting diode (LED) and a photodiode. The LED serves as the input terminal, and the photodiode receives the light emitted by the LED as the output terminal.

[0041] The optocoupler isolation circuit 4 receives the output signal from the main control circuit 3 and inputs it to the optocoupler conversion chip U4 through resistors R10 and R14. This isolates the output signal of the main control circuit 3 from the back-end H-bridge drive circuit 5, thereby protecting the main controller. Pull-down resistors R14 and R15 ensure that the back-end circuit will not malfunction when the output signal is floating, and decoupling capacitors C10 and C11 filter high-frequency noise.

[0042] like Figure 3As shown, the H-bridge driver circuit 5 includes two gate chips U5 and U6, two fast-switching diodes D3 and D4, and two bootstrap capacitors C8 and C9. The HIN pins of the two gate chips U5 and U6 are respectively connected to the output cathodes of two optocouplers. The VCC pin of gate chip U5 is connected to its own VB pin via fast-switching diode D3, and the VB pin of gate chip U5 is connected to its own VS pin via bootstrap capacitor C8. The HO and LO pins of gate chip U5 are connected to the gates of enhancement-mode MOSFETs Q1 and Q3 via resistors R11 and R16, respectively. The VCC pin of gate chip U6 is connected to its own VB pin via fast-switching diode D4, and the VB pin of gate chip U6 is connected to its own VS pin via bootstrap capacitor C9. The VS pins are connected, and the HO and LO pins of the gate chip U6 are connected to the gates of enhancement-mode MOSFETs Q1 and Q3 via resistors R12 and R17, respectively. The series connection of enhancement-mode MOSFETs Q1 and Q3 is then connected in parallel with the series connection of enhancement-mode MOSFETs Q2 and Q4 to form an H-bridge structure. The VS pin of the gate chip U5 is connected between enhancement-mode MOSFETs Q1 and Q3 and is led out as the output terminal OUT_R of the H-bridge drive circuit 5. The VS pin of the gate chip U6 is connected between enhancement-mode MOSFETs Q2 and Q4 and is led out as the output terminal OUT_L of the H-bridge drive circuit 5.

[0043] Specifically, the drains of enhancement-mode MOSFETs Q1 and Q2 are connected to the drive voltage, the source of enhancement-mode MOSFET Q1 is connected to the drain of enhancement-mode MOSFET Q3, the source of enhancement-mode MOSFET Q2 is connected to the drain of enhancement-mode MOSFET Q4, and the sources of enhancement-mode MOSFETs Q3 and Q4 are connected to ground.

[0044] Gate chips U5 and U6 obtain control signals from the main control circuit 3 from the optocoupler isolation circuit 4, and output voltages with opposite phases to the H-bridge structure in the H-bridge drive circuit 5 to control the current direction between the output terminals OUT-R and OUT-L of the H-bridge drive circuit 5; at the same time, the bootstrap capacitors C8 and C9 are charged through the fast switching diodes D3 and D4 to obtain the bootstrap voltage, which serves as the feedback voltage for the gate chips U5 and U6.

[0045] The output voltages of gate chips U5 and U6 are output to four enhancement-mode MOSFETs Q1, Q2, Q3, and Q4 respectively after passing through resistors. Only enhancement-mode MOSFETs Q1 and Q4 are turned on to make the current flow from OUT_R to OUT_L and output positive current, or only enhancement-mode MOSFETs Q2 and Q3 are turned on to make the current flow from OUT_L to OUT_R and output reverse current.

[0046] Specifically, the main controller U1 outputs a high level from the I / O1 port and a low level from the I / O2 port, which are respectively input to the two optocouplers of the optocoupler conversion chip U4. The two optocouplers of the optocoupler conversion chip U4 output high voltage and low voltage to the two gate chips U5 and U6 respectively. When the gate chip U5 receives the high voltage, it controls the enhancement-mode MOSFET Q1 to turn on and the enhancement-mode MOSFET Q3 to turn off, so that the output terminal OUT_R is connected to the VCC power supply voltage through the enhancement-mode MOSFET Q1 and thus outputs a high level. At the same time, when the gate chip U6 receives the high voltage, it controls the enhancement-mode MOSFET Q4 to turn on and the enhancement-mode MOSFET Q2 to turn off, so that the output terminal OUT_L is grounded through the enhancement-mode MOSFET Q4 and thus outputs a low level.

[0047] The H-bridge driver circuit 5 receives its drive voltage from the power supply regulator circuit 2. The gate driver chips U5 and U6 receive the output signal from the optocoupler isolation circuit 4 and transmit it to the enhancement-mode MOSFETs. Q1, Q2, Q3, and Q4 of the enhancement-mode MOSFETs can be turned on in pairs. When Q1 and Q4 are on, OUT_R is at a high potential and OUT_L is at a low potential. When Q2 and Q3 are on, OUT_L is at a high potential and OUT_R is at a low potential. The high-low potential changes of OUT_R and OUT_L are fed back to the gate driver chips U5 and U6 through the bootstrap voltage formed by the fast-switching diodes D3 and D4 and the bootstrap capacitors C8 and C9.

[0048] like Figure 3 As shown, the current detection circuit 6 includes a sampling resistor R124 and a current amplifier chip U7. The sampling resistor R124 is connected between the output terminals OUT_R and OUT_L of the H-bridge drive circuit 5. The OUT output terminal of the current amplifier chip U7 is connected to the ADC pin of the main controller U1 of the main control circuit 3. The REFIN pin of the current amplifier chip U7 is connected to the drive voltage and ground via resistors R125 and R126, respectively.

[0049] In the specific implementation, the voltage divider resistors R125 and R126 are connected in series to the driving voltage of the 3.3V power supply. After the voltage is divided to obtain 1.65V, it is connected to the reference power supply pin of the current amplifier chip U7 as the reference voltage.

[0050] The current amplifier chip U7 amplifies the voltage across the sampling resistor R124 and outputs it to the ADC pin of the main controller U1. The main controller U1 then monitors the current of the load on the H-bridge drive circuit 5 in real time.

[0051] If the current exceeds the preset threshold, the main control circuit 3 immediately changes the control signals of the I / O1 and I / O2 terminals to control the H-bridge drive circuit 5 to shut off the current output, thus providing overcurrent protection for the dense dot matrix.

[0052] The discrete control circuit 7 includes several switching units, such as... Figure 4 As shown, each switching unit mainly consists of two MOSFETs Q5 and Q6 and a pull-down resistor R24. The two gates of the two MOSFETs Q5 and Q6 are connected to each other and are connected to the signal output terminal of the main controller U1 of the main control circuit 3 to control the on and off of the signal. At the same time, they are grounded through the pull-down resistor R24. The two sources of the two MOSFETs Q5 and Q6 are respectively connected to the two ends of each viewpoint or contact in the dense dot matrix to provide driving voltage to each viewpoint or contact in the dense dot matrix. The two drains of the two MOSFETs Q5 and Q6 are respectively connected to the output terminals OUT_R and OUT_L of the H-bridge drive circuit 5 to receive current from the output terminals OUT_R and OUT_L of the H-bridge drive circuit 5 to provide positive or reverse current to each viewpoint or contact in the dense dot matrix, so as to realize real-time control of each viewpoint or contact in the dense dot matrix to present visual and tactile stimulation.

[0053] When the current flows from OUT_R to OUT_L, the output current is positive. At this time, MOSFET Q5 is turned on, and the turn-on of MOSFET Q6 is controlled by the output terminal I / O3 of the main controller U1, thereby realizing positive output control.

[0054] When the current flows from OUT_L to OUT_R, the output current is reversed. At this time, MOSFET Q6 is turned on and MOSFET Q5 is controlled by the output terminal I / O3 of the main controller U1, thereby realizing reverse output control.

[0055] In specific implementation, the discrete control circuit 7 consists of an array of 100 switching units, which are composed of 200 MOSFETs Q5 to Q204 and 100 pull-down resistors R24 to R123.

[0056] The control signal of the H-bridge drive circuit 5 is physically isolated by the optocoupler isolation circuit 4, which protects the main control circuit 3. The current detection circuit 6 measures the current output to the dense dot matrix through the sampling resistor, amplifies it and feeds it back to the main control circuit 3. If the current exceeds the set threshold, the main control circuit 3 immediately cuts off the current output, which provides overcurrent protection for the dense dot matrix.

[0057] In the specific implementation, multiple integrated circuit units are included. These multiple integrated circuit units are connected via a bus through the I2C line of the main controller U1 in their respective main control circuit 3, thereby realizing the interconnection of multiple array-type dense dot matrix integrated circuits.

[0058] The power supply regulator circuit 2, the main control circuit 3, the optocoupler isolation circuit 4, the H-bridge drive circuit 5, and the current detection circuit 6 are integrated on one circuit. The main control circuit 3 and the H-bridge drive circuit 5 are connected to the discrete control circuit 7 through pin headers, ribbon cables, or other preferred electrical connection methods. The discrete control circuit 7 is also connected to the dense dot matrix through pin headers, ribbon cables, or other preferred electrical connection methods, thereby realizing the miniaturization of the entire integrated circuit.

[0059] According to the requirements of the dense dot matrix, the discrete control circuit 7 adjusts the duty cycle of the output I / O port of the main controller U1 of the main control circuit 3 to control the operation of different combinations of discrete control circuits 7, thereby adjusting the turn-on time and average voltage to adapt to different types of dense dot matrices.

[0060] For tactile dense dot matrix, adjust the intensity and frequency of tactile stimulation; for visual dense dot matrix, adjust the brightness and flicker frequency of visual stimulation.

[0061] The working process of this invention is as follows:

[0062] The output signal of the main control circuit 3 is connected to the discrete control circuit 7 via pin headers or ribbon cables. The discrete control circuit 7 is connected to the dense dot matrix via pin headers or ribbon cables. The high and low potential reversal of OUT_R and OUT_L in the H-bridge drive circuit 5 is controlled by the output signal of the main control circuit 3. The discrete control circuit 7 is controlled by its switching unit to achieve real-time and independent control of each viewpoint or contact in the dense dot matrix. The current amplifier chip U7 obtains the real-time voltage through the sampling resistor R124, amplifies it, and outputs it to the ADC pin of the main controller U1 in the main control circuit 3, which can realize real-time monitoring of the output current. When the current exceeds the set threshold, the output signal of the main controller U1 will shut off the current output of the H-bridge drive circuit 5, which serves as overcurrent protection for the integrated circuit and the dense dot matrix. The I2C socket of the main controller U1 can be connected via a bus to connect multiple integrated circuits of this invention, realizing the expansion of this integrated circuit for driving more modules and more dot matrix numbers in the dense dot matrix, presenting more visual or tactile stimuli.

[0063] Specific implementation of the present invention:

[0064] The user operates on the host computer interactive platform 1, generating commands and sending them to the main control circuit 3 via serial port. After recognizing the host computer commands, the main control circuit 3 converts them into control signals for the H-bridge drive circuit 5 and the discrete control circuit 7, driving the dense dot matrix output to provide visual or tactile stimulation. The control signals of the H-bridge drive circuit 5 are physically isolated by the optocoupler isolation circuit 4, protecting the main control circuit 3.

[0065] The current detection circuit 6 measures the current output to the dense dot matrix through the sampling resistor, and after amplification, feeds it back to the main control circuit 3. If the current exceeds the set threshold, the main control circuit 3 immediately cuts off the current output to protect the dense dot matrix from overcurrent.

[0066] The discrete control circuit 7 maintains consistent forward and reverse current throughput, providing a stable load current and ensuring the operational stability of the dense dot matrix.

[0067] The integrated circuit of this invention features high real-time performance, strong stability, and ease of control, and also possesses expansion capabilities. It can be expanded via a bus through the I2C socket of the main controller U1 in the main control circuit, allowing multiple integrated circuits of this invention to be connected together to output tactile or visual stimuli with a larger area and more information. The discrete control circuit has high responsiveness and can adjust the duty cycle of the output I / O port of the main controller U1 in the main control circuit according to the needs of the dense dot matrix, thereby regulating the on-time and average voltage to adapt to different types of dense dot matrices. For dense tactile dot matrices, the intensity and frequency of the tactile stimulation can be adjusted; for dense visual dot matrices, the brightness and flicker frequency of the visual stimulation can be adjusted.

[0068] As can be seen from this implementation, the integrated circuit of the present invention consists of a host computer interaction platform, a power supply voltage regulator circuit, a main control circuit, an optocoupler isolation circuit, an H-bridge drive circuit, a current detection circuit, and a discrete control circuit. It provides a means of controlling bidirectional current, has strong adjustability, and has a bus expansion function, which can drive visual or tactile dot matrices of different numbers and types.

Claims

1. An extensible bidirectional current control integrated circuit for dense dot matrix visual touch perception, comprising at least one integrated circuit unit, each integrated circuit unit comprising an upper computer interaction platform (1), a main control circuit (3), an optocoupler isolation circuit (4), an H-bridge drive circuit (5), a current detection circuit (6) and a discrete control circuit (7); the upper computer interaction platform (1) is connected with the main control circuit (3); the main control circuit (3) is connected with a power stabilizing circuit (2), the current detection circuit (6) and the discrete control circuit (7) respectively; the main control circuit (3) is connected with the H-bridge drive circuit (5) through the optocoupler isolation circuit (4); and the discrete control circuit (7) is connected with a dense dot matrix (8) through a pin or a wire; the main control circuit (3) comprises a main controller U1, two GPIO output ports of the main controller U1 are connected with the optocoupler isolation circuit (4) to control the direction of current output of the H-bridge drive circuit (5) through the optocoupler isolation circuit (4); the optocoupler isolation circuit (4) comprises an optocoupler conversion chip U4 and decoupling capacitors C10 and C11, the optocoupler conversion chip U4 has two optocouplers, two GPIO output ports of the main controller U1 are connected with the input positive poles of the two optocouplers in the optocoupler conversion chip U4 through resistors R10 and R11 respectively, the input negative poles of the two optocouplers are grounded, the output positive poles of the two optocouplers are connected with a driving voltage, and the output negative poles of the two optocouplers are connected with the H-bridge drive circuit (5) through pull-down resistors R14 and R15 respectively. ​ The H-bridge drive circuit (5) includes two gate chips U5 and U6, two fast switching diodes D3 and D4, two bootstrap capacitors C8 and C9; the HIN pins of the two gate chips U5 and U6 are respectively connected to the output end cathode of two optocouplers; the VCC pin of the gate chip U5 is connected through the fast switching diode D3 and its own VB pin, the VB pin of the gate chip U5 is connected to its own VS pin through the bootstrap capacitor C8, the HO pin and the LO pin of the gate chip U5 are respectively connected to the gate of the enhancement mode MOSFET tube Q1 and the enhancement mode MOSFET tube Q3 through the resistor R11 and the resistor 16; the VCC pin of the gate chip U6 is connected through the fast switching diode D4 and its own VB pin, the VB pin of the gate chip U6 is connected to its own VS pin through the bootstrap capacitor C9, the HO pin and the LO pin of the gate chip U6 are respectively connected to the gate of the enhancement mode MOSFET tube Q1 and the enhancement mode MOSFET tube Q3 through the resistor R12 and the resistor R17; the enhancement mode MOSFET tube Q1 and the enhancement mode MOSFET tube Q3 are connected in series and connected in parallel with the structure of the enhancement mode MOSFET tube Q2 and the enhancement mode MOSFET tube Q4 in series, forming an H-bridge structure; the VS pin of the gate chip U5 is connected between the enhancement mode MOSFET tube Q1 and the enhancement mode MOSFET tube Q3 and is led out as the output end OUT_R of the H-bridge drive circuit (5), and the VS pin of the gate chip U6 is connected between the enhancement mode MOSFET tube Q2 and the enhancement mode MOSFET tube Q4 and is led out as the output end OUT_L of the H-bridge drive circuit (5); The current detection circuit (6) includes a sampling resistor R124 and a current amplification chip U7, the sampling resistor R124 is connected between the output ends OUT_R and OUT_L of the H-bridge drive circuit (5), the OUT output end of the current amplification chip U7 and the ADC pin of the main controller U1 of the main control circuit (3) are connected, and the REFIN pin of the current amplification chip U7 is connected to the driving voltage and the ground through the resistor R125 and the resistor R126.

2. The scalable bidirectional current-controlled integrated circuit for dense dot matrix visual touch sensing of claim 1, wherein: The main controller U1 is provided with a stable 3.3V voltage by the power stabilizing circuit (2), the OSC pin of the main controller U1 is connected through the resistor R18 and the active crystal oscillator X1, the active crystal oscillator X1 is connected in parallel with the capacitor C12, the 3.3V voltage provided by the power stabilizing module is led out through the magnetic bead L3 and connected between the resistor R18 and the active crystal oscillator X1.

3. The scalable bidirectional current-controlled integrated circuit for dense dot matrix visual touch sensing of claim 1, wherein: The power supply of the main controller U1 is also connected with 12 decoupling capacitors C16-C27.

4. The scalable bidirectional current-controlled integrated circuit for dense dot matrix visual touch sensing of claim 1, wherein: The SWDIO and SWDCLK pins of the main controller U1 are connected to the socket P3, the TX and RX pins of the main controller U1 are connected to the socket P1, and the I2C SCL and I2C SDA pins of the main controller U1 are connected to the socket P2; the sockets P1-P3 provide the functions of program burning, serial communication and bus expansion; the socket P1 is used for communicating with the host computer, the socket P2 is used for bus expansion, and the socket P3 is used for program burning of the main controller U1.

5. The scalable bidirectional current-controlled integrated circuit for dense dot matrix visual touch sensing of claim 1, wherein: The discrete control circuit (7) comprises a plurality of switch units, each switch unit mainly comprises two MOSFET tubes Q5 and Q6 and a pull-down resistor R24, the two gates of the two MOSFET tubes Q5 and Q6 are connected to each other and are connected to the signal output end of the main controller U1 of the main control circuit (3), and are grounded through the pull-down resistor R24; the two sources of the two MOSFET tubes Q5 and Q6 are connected to the two ends of each view point or contact point in the dense dot matrix; and the two drains of the two MOSFET tubes Q5 and Q6 are connected to the output ends OUT_R and OUT_L of the H-bridge driving circuit (5).

6. The scalable bidirectional current-controlled integrated circuit for dense dot matrix visual touch sensing of claim 1, wherein: The plurality of integrated circuit units are connected through the I2C lines of the main controller U1 in the main control circuit (3) for bus expansion, so as to realize the integrated circuit online of the plurality of array type dense dot matrices.

7. The scalable bidirectional current-controlled integrated circuit for dense dot matrix visual touch sensing of claim 1, wherein: The power supply voltage stabilizing circuit (2), the main control circuit (3), the opto-isolator circuit (4), the H-bridge driving circuit (5) and the current detection circuit (6) are integrated on one circuit, the main control circuit (3) and the H-bridge driving circuit (5) are connected to the discrete control circuit (7) through the electrical connection mode of the row pin or the row wire, and the discrete control circuit (7) is also connected to the dense dot matrix through the electrical connection mode of the row pin or the row wire.

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