Support device for supporting substrate, method for processing substrate, and semiconductor substrate

Abstract

The support device (10) includes a substrate receiving area. The support device (10) includes a support body (110) formed into a pattern having an array of openings (130). The support body (110) is a sparse structure, wherein the combined area of ​​the openings in the array of openings (130) is 40% or more of the area of ​​the substrate receiving area. The support body (110) includes one or more suction openings (140), and the one or more suction openings (140) are configured to be in fluid communication with a vacuum source arrangement.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a support device for supporting a substrate, such as a semiconductor wafer. More specifically, embodiments described herein relate to a support device for holding a substrate using a vacuum force. The substrate held by the support device can be subjected to processing such as a laser device. Background Art

[0002] In many applications, a substrate is placed on a substrate support so that the substrate can be processed. For example, the substrate support can be a horizontal support that provides a horizontal surface on which the substrate is placed to allow the substrate to be processed. When the substrate is supported by the substrate support, a holding force can be applied to the substrate so that the substrate is securely held in place. For example, the substrate support can be used as a vacuum chuck or an electrostatic chuck to apply a holding force on the substrate.

[0003] The substrate can be a thin sheet of material, such as a semiconductor wafer. In some technologies, the thickness of the substrate is continuously reduced. For example, thin semiconductor substrates with a thickness of 0.2 mm or less are used and processed in current applications.

[0004] The substrate held by the substrate support can be processed by forming a pattern in the substrate, for example, using a laser. The laser directs a laser beam onto the substrate. By moving the laser beam over the substrate, a pattern can be formed in the substrate. The pattern can include a plurality of openings or holes cut out of or drilled into the substrate by the laser. Different types of patterns are formed in the substrate depending on the application.

[0005] The demand for high precision required for forming patterns in substrates is increasing. Slight deviations of the position of the pattern from the intended target position may impair the performance of the final product. Therefore, even small movements of the substrate during processing, such as small translations of the substrate, should be avoided.

[0006] In view of the foregoing, there exists a need for an improved support device that ensures that movement of a substrate during processing thereof is avoided. Summary of the invention

[0007] According to one embodiment, a support device for supporting a substrate is provided. The support device includes a substrate receiving area. The support device includes a support body, the support body being shaped into a pattern having an array of openings. The support body is a sparse structure, wherein the combined area of ​​the openings in the array of openings is 40% or more of the area of ​​the substrate receiving area. The support body includes one or more suction openings, the one or more suction openings being configured to be in fluid communication with a vacuum source arrangement.

[0008] According to another embodiment, a support device for supporting a substrate is provided. The support device includes a support body having an array of openings. The support body is a grid-shaped support body. The array of openings is a two-dimensional array of openings. The support body includes a plurality of suction openings in the support body.

[0009] According to a further embodiment, there is provided an apparatus for processing a substrate. The apparatus comprises a support device as described herein. The apparatus comprises a processing device for forming a plurality of openings in a substrate supported by a support body of the support device.

[0010] According to a further embodiment, a method for processing a substrate is provided. The method comprises the steps of supporting a substrate by a support, wherein portions of the substrate having a combined area of ​​40% or more of the area of ​​the substrate are unsupported. The method comprises the steps of sucking the substrate to the support at one or more suction openings.

[0011] According to another embodiment, a semiconductor substrate is provided. The semiconductor substrate includes a two-dimensional array of openings, wherein a combined area of ​​the openings in the two-dimensional array of openings is 40% or more of an area of ​​the semiconductor substrate.

[0012] Embodiments are also directed to devices for performing the disclosed methods, and include device portions for performing each described method aspect. These method aspects may be performed by hardware components, computers programmed with appropriate software, by any combination of the two, or in any other manner. In addition, embodiments according to the present disclosure are also directed to methods for operating the devices. The methods for operating the devices include method aspects for performing each function of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to understand the above features of the present disclosure in detail, a more specific description of the present disclosure briefly summarized above can be obtained by reference to the embodiments. The accompanying drawings relate to the embodiments of the present disclosure and are described as follows:

[0014] Figure 1-5 shows an exemplary design of a support device for supporting a substrate according to embodiments described herein;

[0015] Figure 6 showing a support device and a substrate configured to be supported by the support device according to embodiments described herein, wherein the substrate has a plurality of openings formed therein, wherein the openings are formed while the substrate is supported by the support device;

[0016] Figure 7 , 8a-b and 9a-b show apparatus according to embodiments described herein, the apparatus comprising a support device and a handling device; and

[0017] Fig.10 An apparatus according to embodiments described herein is shown, the apparatus comprising a slot for receiving pieces cut from a substrate. DETAILED DESCRIPTION

[0018] Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of which are depicted in the accompanying drawings. In the following description of the accompanying drawings, the same reference numerals represent the same components. In general, differences are described only with respect to the various embodiments. Each example is provided by way of explanation of the present disclosure, and each example is not intended to be a limitation of the present disclosure. In addition, features shown or described as part of one embodiment may be used on other embodiments or in combination with other embodiments to produce yet another embodiment. This specification is intended to include such modifications and variations.

[0019] Embodiments described herein relate to a support device for supporting a substrate. The support device can be configured to support the substrate in a horizontal direction. The support device holds the substrate in place by applying an under-pressure or negative pressure to the bottom surface of the substrate. While the support device holds the substrate, the substrate can be processed.

[0020] The support device as described herein may be understood as a stationary support device configured to hold a substrate in a stationary or fixed position. A stationary support device is different from a dynamic support device (such as a conveyor belt) that transports a substrate while supporting it.

[0021] As described herein, a substrate may be understood as a substantially flat piece of material. The substrate may be a wafer. The substrate may be a semiconductor substrate or a semiconductor wafer, in particular a silicon substrate or a silicon wafer. For example, the substrate may be a c-Si wafer. The substrate may be a substantially rectangular substrate. The term "substantially rectangular" includes, for example, substrates having rounded corners but otherwise having a rectangular shape ("pseudo-square" substrates). The substrate as described herein may be a substrate for use in printed circuit board (PCB) applications. The substrate may have a length of 20 cm or less in a first direction and / or a length of 20 cm or less in a second direction.

[0022] The substrate (eg, a silicon substrate) may be a thin sheet of material. The thickness of the substrate may be 150 μm or less, such as 120 μm or less, or even 110 μm or less.

[0023] The support device according to the embodiments described herein is used to hold a substrate (such as a thin silicon substrate) in a fixed position to allow the substrate to be processed. The substrate supported by the support device can be processed by a processing device (such as a laser device) described herein. Using the processing device, a plurality of openings (i.e., through holes) can be formed (such as cutting or drilling) on ​​the substrate. The processing device can be used to cut out a rectangular piece from the substrate so that a plurality of openings can be formed in the substrate. For example, Figure 6 The substrate 600 is shown with a plurality of openings formed therein by a processing device.

[0024] Some of the openings formed in the substrate may be relatively large openings, such as Figure 6 The large opening 610 shown in FIG. 5 may have a length and / or width that is 5% or more of the length and / or width of the substrate, respectively.

[0025] Additionally or alternatively, a relatively small opening may be formed (eg, drilled) in the substrate by the processing device. Figure 6 As shown, the processing device may form small openings 620 (eg, through holes) in the substrate 600 such that each large opening 610 is surrounded by a plurality of small openings 620 .

[0026] In a different Figure 6 In some embodiments, only small openings may be formed in the substrate, ie, no large openings. In other embodiments, only large openings may be formed in the substrate.

[0027] The pattern according to which the openings (ie, small openings and / or large openings) are formed on the substrate may include a variety of possible patterns, depending on the application in which the substrate will be used. In some embodiments, the openings in the substrate may be distributed over substantially the entire surface of the substrate.

[0028] In some embodiments, the total area or combined area of ​​the material removed from the substrate to form an opening in the substrate can be large. The total area of ​​the material removed from the substrate (i.e., the total area of ​​the opening formed in the substrate while the substrate is supported by the support device) can be 40% or more, 50% or more, or 60% or more of the substrate area. The support device according to the embodiments described herein is a sparse structure that allows such a large amount of material to be removed from the substrate while ensuring that the substrate is firmly held in place throughout the cutting or drilling process. The displacement of the substrate or the vibration of the substrate during the cutting or drilling process can be reduced or even avoided. Accordingly, an opening can be formed in the substrate with high precision.

[0029] As described herein, when a large amount of material is removed from a substrate, the substrate may become fragile in view of the multiple openings formed in the substrate. For example, thin portions of the substrate between adjacent openings 610 may easily move, such as vibrate. If these portions are not firmly held in place, the vibration of these portions may cause the position of subsequent holes drilled in the substrate to be inaccurate, or may even cause these thin portions of the substrate to break. The embodiments described herein allow the substrate to be firmly held in place by applying a holding force to the substrate at multiple locations distributed over the entire area of ​​the substrate. Displacement of the substrate or vibration of the substrate during the cutting process can be reduced or even avoided.

[0030] In other embodiments, complex patterns of openings may be formed in the substrate. The specific pattern to be formed in the substrate may depend on the application for which the substrate is to be used. Another advantage of the support device according to the embodiments described herein is that the support device is a sparse structure in which the contact area between the substrate and the support device is small, so that a large portion of the substrate can be used to form openings (i.e., large openings and / or small openings) therein in a variety of possible opening patterns.

[0031] Figure 1 A top view of a support device 10 according to embodiments described herein is shown.

[0032] According to one embodiment, a support device 10 for supporting a substrate is provided. The support device 10 includes a substrate receiving area. For example, Figure 1 A substrate receiving area is shown, as defined by dashed line 120. The support device 10 includes a support body 110 shaped as a pattern having an array of openings 130. The support body 110 is a sparse structure, wherein the combined area of ​​the openings in the array of openings 130 is 40% or greater of the area of ​​the substrate receiving area. The support body 110 includes one or more suction openings 140, which are configured to be in fluid communication with a vacuum source device.

[0033] The support device 10 as used herein may be understood as a vacuum chuck device. The support device 10 may be configured to hold a substrate by sucking the substrate against the support body 110 at one or more suction openings 140. The suction force for holding the substrate may be provided by applying a negative pressure at one or more suction openings 140 using a vacuum source arrangement.

[0034] As used herein, a substrate receiving area may be understood as an area of ​​the support device 10 configured to receive a substrate. The substrate receiving area may be a substantially rectangular area.

[0035] The substrate receiving region may have a first edge. The substrate receiving region may have a second edge. The second edge may be opposite to the first edge. The first edge and the second edge may be in a first direction (eg, Figure 1The substrate receiving area may have a third edge. The substrate receiving area may have a fourth edge. The fourth edge may be opposite to the third edge. The third edge and the fourth edge may be substantially in the second direction (eg, Figure 1 The first edge of the substrate receiving area may be adjacent to, aligned with, or substantially coincident with a first edge of the support body 110 of the support device 10. The second edge of the substrate receiving area may be adjacent to, aligned with, or substantially coincident with a second edge of the support body 110 of the support device 10. The third edge of the substrate receiving area may be adjacent to, aligned with, or substantially coincident with a third edge of the support body 110 of the support device 10. The fourth edge of the substrate receiving area may be adjacent to, aligned with, or substantially coincident with a fourth edge of the support body 110 of the support device 10.

[0036] The support body 110 may have a perimeter. The perimeter of the support body 110 may define the extent of the support body 110. The substrate receiving area may be within the perimeter of the support body 110 or surrounded by the perimeter of the support body 110.

[0037] The array of openings 130 may be within the substrate receiving area, such as Figure 1 The substrate receiving area may have a perimeter surrounding the array of openings 130, such as Figure 1 The dashed line 120 is shown in FIG.

[0038] Each opening of the array of openings 130 may be a through hole. The support body 110 may have a first side and a second side. The support body 110 may be configured to support a substrate at the first side. The second side may be opposite to the first side. Each opening 130 in the array of openings 130 may extend through the support body 110 from the first side to the second side.

[0039] According to the embodiments of the present invention, the support body 110 of the support device 10 is a sparse structure. The support body 110 is a sparse structure in the following sense: the support body 110 is formed by a relatively thin sheet of material with relatively large openings 130 (such as formed in the form of windows) therebetween. The joint area occupied by all the openings in the array of openings 130 together is a relatively large part of the substrate receiving area. The joint area of ​​the openings in the array of openings 130 may be 40% or more of the area of ​​the substrate receiving area, in particular 50% or more, 60% or more, 70% or more, or even 80% or more. The joint area or total area of ​​the openings 130 may be understood as the sum of the areas of the individual openings 130. For example, if the array of openings 130 has a total of N openings, the joint area of ​​the openings 130 may be understood as the sum of the individual areas of the N openings 130.

[0040] Each opening of the array of openings 130 may correspond to an unsupported portion of the substrate. At each opening of the array of openings 130, the substrate may not be supported by the support 110. The support 110 may be formed so that the substrate supported by the support 110 has a plurality of unsupported portions, wherein each of the plurality of unsupported portions faces an opening in the array of openings 130. The plurality of unsupported portions may not be supported or contacted by the support 110.

[0041] As used herein, the bonding areas of the openings in the array of openings 130 may be understood as bonding areas of portions of the substrate that are not supported by the support device 10 .

[0042] In view of the large combined area of ​​the openings in the array of openings 130 (i.e., the combined area may be 40% or more of the area of ​​the substrate receiving area), the contact area between the support 110 and the substrate supported by the support 110 in the substrate area may be small compared to the area of ​​the substrate receiving area. The contact area between the support 110 and the substrate supported by the support 110 in the substrate area may be 60% or less, particularly 50% or less, 40% or less, or 30% or less, or even 20% or less of the area of ​​the substrate receiving area.

[0043] The unsupported portion of the substrate may be understood as a portion of the substrate that is processed by a laser that can be used to form an opening in the portion. In the unsupported portion of the substrate, an opening may be formed by a laser. The laser may pass through the substrate in the unsupported portion without impinging on the support 110. In contrast, a portion of the substrate supported by the support may not be available for laser processing. In the supported portion, the laser may impinge on the support and damage it. When the combined area of ​​the openings in the array of openings 130 is large, such as 40% or more of the area of ​​the substrate receiving area, in particular 50% or more, 60% or more, 70% or more, or even 80% or more, a large portion of the substrate may be used to form openings of various sizes, shapes and patterns therein. The support device according to the embodiments described herein provides a great degree of flexibility for forming large and / or small openings in a substrate in a variety of possible patterns.

[0044] The openings in the array of openings 130 may be relatively large openings. Each opening 130 in the array of openings 130 may have a first width in the first direction. The first width may be 5% or more of the first width of the substrate receiving area in the first direction. For example, the first direction may be Figure 1 Additionally or alternatively, each opening 130 of the array of openings 130 may have a second width in the second direction. The second width may be 5% or more of the second width of the substrate receiving area in the second direction. For example, the second direction may be Figure 1In the up-down direction in the substrate. In view of this, the substrate supported by the support body 110 may have multiple unsupported portions. Each unsupported portion may have a relatively large size, that is, the size is a relatively large part of the substrate size. Each unsupported portion may have a first width in the first direction. The first width may be 5% or more of the first width of the substrate receiving area in the first direction. Additionally or alternatively, each unsupported portion may have a second width in the second direction. The second width may be 5% or more of the second width of the substrate receiving area in the second direction.

[0045] As used herein, a suction opening may be understood as an opening in the support body 110 that is connected or connectable to a vacuum source arrangement, the vacuum source arrangement being used to suck or pull the substrate against the support body 110 at the suction opening. Each of the one or more suction openings 140 may be arranged inside the periphery of the substrate receiving area, such as in Figure 1 The inside of the dotted line 120 shown in FIG. The substrate can be supported, held or adsorbed to the support body 110 at each of the one or more suction openings 140. According to an embodiment of the present invention, the suction openings are distributed over the substrate receiving area. In view of this, the substrate can be sucked against the support body 110 at multiple positions.

[0046] The suction opening shown in the figure is schematically depicted as a circular opening. The present disclosure will not be limited thereto. The suction opening can have other shapes, such as a thin, slit-shaped opening. In some embodiments, several (such as circular) suction openings can be arranged adjacent to each other as a linear sequence of a certain length. In other embodiments, an elongated, slit-shaped suction opening of a certain length can be provided.

[0047] The support body 110 may include a plurality of channels. The end of each of the plurality of channels may be at a suction opening of the one or more suction openings 140. Each channel or at least a portion thereof may be disposed inside the support body 110. Each of the one or more suction openings 140 may be configured to be in fluid communication with a vacuum source arrangement via one or more of the plurality of channels.

[0048] Figure 1 An example of a substrate receiving area (dashed line 120) is shown that is smaller than the outer perimeter of the support body 110, i.e., is contained therein. This is an example and should not be construed as limiting. Other configurations are also possible. For example, the following discussion Fig.10 A substrate 600 is shown having an area greater than that of the support, ie the substrate extends beyond the borders of the support. In this case, the substrate receiving area may be understood to coincide with an area of ​​the support 110.

[0049] Figure 2A top view of a support device 10 according to embodiments described herein is shown.

[0050] As described herein, the opening array of the support body 110 may include a first opening (eg Figure 2 The opening 130a shown in FIG. Figure 2 The one or more suction openings of the support body 110 may include at least one suction opening in a portion of the support body 110 between the first opening and the second opening, such as Figure 2 The suction opening 140a shown. The first opening and the second opening can be adjacent openings in the opening array. The one or more suction openings can be multiple suction openings. The multiple suction openings can include two or more suction openings in a portion of the support body 110 between the first opening and the second opening.

[0051] If there is no third opening in the array of openings 130 between the two openings, the two openings in the array of openings can be understood as adjacent openings. Figure 2 The opening 130a and the opening 130b are shown as adjacent openings in the array of openings. The opening 130a and the opening 130x are not adjacent openings in the array of openings.

[0052] At least one suction opening is provided between the first opening and the second opening in the array of openings to allow the substrate 600 to be sucked against the support 110 at the at least one suction opening. When a piece of the substrate 600 disposed within the periphery of the first opening and / or within the periphery of the second opening is cut from the substrate 600, for example by a processing device 710 as herein, the substrate 600 can be securely held at the at least one suction opening between the first opening and the second opening. Displacement and / or vibration of the substrate 600 during the cutting operation can be avoided. The openings can be formed in the substrate 600 with high precision.

[0053] The array of openings 130 may include a first opening, such as Figure 2 The array of openings 130 may include a second opening, such as Figure 2 The second opening may be adjacent to the first opening. The array of openings 130 may include a third opening, such as Figure 2 The third opening may be adjacent to the second opening. The array of openings 130 may include a fourth opening, such as Figure 2 The fourth opening may be adjacent to the third opening and the first opening.

[0054] The first opening, the second opening, the third opening and the fourth opening may form a two-dimensional opening matrix, in particular a 2×2 matrix, such as Figure 2 shown.

[0055] The one or more suction openings 140 may include at least one suction opening in a portion of the support body 110 between the first opening and the second opening, such as Figure 2 Additionally or alternatively, the one or more suction openings 140 may include at least one suction opening in a portion of the support body 110 between the second opening and the third opening, such as Figure 2 Additionally or alternatively, the one or more suction openings 140 may include at least one suction opening in a portion of the support body 110 between the third opening and the fourth opening, such as Figure 2 Additionally or alternatively, the one or more suction openings 140 may include at least one suction opening in a portion of the support body 110 between the fourth opening and the first opening, such as Figure 2 Suction opening 140d is shown.

[0056] At least one of the one or more suction openings 140 or two or more suction openings may be disposed in the support body 110 between any two adjacent openings of the array of openings 130. For example, Figure 2 The support device 10 shown has corresponding suction openings between any pair of adjacent openings in the array of openings 130. When a piece of substrate 600 disposed within the periphery of openings 130 is cut from substrate 600, substrate 600 can be securely held at the corresponding suction openings between adjacent openings 130. Displacement and / or vibration of substrate 600 during the cutting operation can be avoided. Openings can be formed in substrate 600 with high precision.

[0057] One or more (particularly two or more) openings in the array of openings 130 may each be surrounded by several of the one or more suction openings. Each opening of the array of openings 130 may be surrounded by several of the one or more suction openings.

[0058] In the case where an opening 130 in the array of openings 130 is surrounded by several suction openings, four, six, eight or more suction openings 140 may surround the opening 130. The suction openings surrounding the opening 130 may be disposed between the opening 130 and other openings adjacent thereto in the array of openings 130. Figure 2 In the embodiment shown in FIG. 1 , eight suction openings surround each opening 130 .

[0059] By surrounding one opening 130 of the array of openings 130 with a plurality of suction openings, the substrate 600 can be firmly held in the area surrounding the opening 130. When the arranged piece of substrate 600 is cut from the substrate 600 within the periphery of the opening 130, the substrate can be sucked against the support 110 at the suction openings surrounding the opening 130. In the area surrounding the opening 130, displacement and / or vibration of the substrate 600 during the cutting operation can be avoided. The opening can be formed in the substrate 600 with high precision.

[0060] The support 110 may include a frame portion surrounding the array of openings 130. The frame portion may be configured to support the substrate 600 in the substrate receiving area. Figure 2 The frame portion may be understood as the portion of the support body surrounding the nine white rectangles (ie, the nine openings of the opening 130 array).

[0061] The one or more suction openings 140 may include one or more (particularly multiple) external suction openings disposed in the frame portion. The one or more external suction openings may be arrayed around the opening 130. The plurality of external suction openings may include 10, 20 or more suction openings. For example, regarding Figure 2 , the external suction openings can be understood as 24 openings surrounding the nine openings in the array of openings 130 .

[0062] The opening array of the support 110 may include a first opening (such as opening 130a) and a second opening (such as opening 130b) as described herein. The first opening may be adjacent to the second opening. The support 110 may include a support portion between the first opening and the second opening. The support portion may be configured to support (particularly contact) the substrate 600.

[0063] The array of openings 130 may include a third opening (e.g., opening 130c) and a fourth opening (e.g., opening 130d) as described herein. The second opening may be adjacent to the third opening. The third opening may be adjacent to the fourth opening. The fourth opening may be adjacent to the first opening. The support 110 may include a support portion between the second opening and the third opening. The support portion may be configured to support (particularly contact) the substrate 600. The support 110 may include a support portion between the third opening and the fourth opening. The support portion may be configured to support (particularly contact) the substrate 600. The support 110 may include a support portion between the fourth opening and the first opening. The support portion may be configured to support (particularly contact) the substrate 600.

[0064] The support body 110 may include a support portion between any two adjacent openings of the array of openings 130. Each support portion between two adjacent openings may be configured to support (particularly contact) the substrate 600.

[0065] The array of openings 130 may be arranged in a first direction (eg Figure 2 The left and right directions in the second direction (such as Figure 2 Extends in the up and down directions).

[0066] The array of openings 130 may be a two-dimensional array of openings, which may be understood as an opening matrix.

[0067] The array of openings 130 may include multiple rows of openings, each row extending in the first direction. Each row of openings may include a plurality of openings. Each row of openings may extend in the first direction from the first opening of the row to the last opening of the row. Each row may include 3 or more (particularly 5 or more, more particularly 10 or more) openings in the first direction.

[0068] The array of openings 130 may include multiple rows of openings, each row extending in the second direction. Each row of openings may include a plurality of openings. Each row of openings may extend from the first opening of the row to the last opening of the row in the second direction. Each row may include 3 or more (particularly 5 or more, more particularly 10 or more) openings in the second direction.

[0069] The support body 110 may be formed as a grid. The support body 110 may include a first plurality of elongated support portions, each elongated support portion extending from a first side of the support body 110 to a second side of the support body 110 opposite to the first side. Figure 2 In the embodiment, the first plurality of elongated support portions may be understood as four strip-like portions extending between the left edge and the right edge of the support body 110. The support body 110 may include a second plurality of elongated support portions, each of which extends from a third side of the support body to a fourth side of the support body opposite to the third side. Figure 2 In the embodiment, the second plurality of elongated support portions can be understood as four strip-shaped portions extending between the upper edge and the lower edge of the support body 110. The elongated support portions in the first plurality of elongated support portions can be elongated in the first direction (e.g. Figure 2 The elongated support portions of the second plurality of elongated support portions may extend in the second direction (e.g., the left-right direction). Figure 2 Extends in the up and down directions).

[0070] Adjacent openings of the array of openings 130 may be separated from one another by an elongated support portion of the first plurality of elongated support portions and / or by an elongated support portion of the second plurality of elongated support portions.

[0071] Each opening 130 of the array of openings 130 may be disposed between two elongated support portions of the first plurality of elongated support portions. The opening 130 may extend from one of the two elongated support portions to the other of the two elongated support portions.

[0072] Additionally or alternatively, each opening 130 of the array of openings 130 may be disposed between two elongated support portions of the second plurality of elongated support portions. The opening may extend from one of the two elongated support portions to the other of the two elongated support portions.

[0073] Figure 3 , 4 5 show a support device 10 according to an embodiment described herein.

[0074] The array of openings 130 may include 4 or more, 9 or more, 16 or more, or 25 or more openings.

[0075] The exemplary support body schematically shown in the figure has a square design with N arranged in an N×N matrix. 2 The embodiment described herein is not limited to such a symmetrical design. For example, different openings 130 in the array of openings 130 can have different sizes, the openings 130 can have shapes other than square, the support body 110 does not need to have a square shape, and so on.

[0076] Figure 6 A support device 10 according to embodiments described herein is shown. Figure 6 Further shown is configured by Figure 6 The support 110 is shown supporting a substrate 600. The substrate 600 is configured to be received in a substrate receiving area. The size of the substrate receiving area indicated by the dashed line 120 matches the size of the substrate 600.

[0077] The substrate 600 as described herein may include a plurality of large openings 610 and a plurality of small openings 620 or through holes. The large openings 610 and the small openings 620 may be formed in the substrate 600 by a processing device while the substrate 600 is supported in a substrate receiving area by a support device 10. The location of the array of openings 130 is shown on the substrate 600 with dashed lines to show that each large opening 610 and each small opening 620 formed in the substrate 600 is within the perimeter of an opening in the array of openings 130. For example, Figure 6 As shown, a plurality of large openings 610, such as four large openings, may be formed within the periphery of a single opening 130 in the array of openings 130. Each large opening 610 may be surrounded by a plurality of small openings 620, such as 20 or more, 50 or more, or 100 or more small openings. Each small opening 620 is formed within the periphery of an opening 130 in the array of openings 130.

[0078] According to another embodiment, a support device 10 for supporting a substrate 600 is provided. The support device 10 includes a support body 110 having an array of openings 130. The support body 110 is a grid-like support body. The array of openings 130 is a two-dimensional array of openings. The support body 110 includes one or more suction openings 140 in the support body 110. The support device 10 may include all of the components, features, and aspects of the support devices described herein.

[0079] Figure 7 A side view of an apparatus 700 for processing a substrate 600 is shown according to embodiments described herein.

[0080] According to another embodiment, an apparatus 700 for processing a substrate 600 is provided. The apparatus 700 includes a support device 10 as described herein. The apparatus 700 includes a processing device 710 for forming (eg, cutting or drilling) a plurality of openings in a substrate 600 supported by a support body 110 of the support device 10.

[0081] The processing device 710 as described herein may be a laser device. The processing device 710 may be configured to direct a laser beam 712 onto a substrate 600 held by the support 110 in a substrate receiving area. The processing device 710 may be configured to move the laser beam relative to the substrate 600 to cut an opening, such as a rectangular opening, in the substrate 600. Figure 6 The processing device 710 can be configured to form (particularly drill) small openings or vias in the substrate, such as Figure 6 The small opening 620 is shown in FIG.

[0082] The substrate 600 supported by the support 110 may be processed by the processing device 710. The first portion (e.g., the rectangular portion) of the substrate 600 may be disposed above an opening 130 in the array of openings 130 or may face an opening 130 in the array of openings 130. The first portion may be an unsupported portion of the substrate 600. The first portion may have an area surrounded by the periphery of the opening 130, i.e., fit inside the periphery of the opening 130. For example, but not limiting the scope, the first portion of the substrate 600 may be shaped as a first rectangle, and the opening 130 may be shaped as a second rectangle, wherein the first rectangle is completely fitted within the second rectangle. The processing device 710 may cut the substrate 600 along the periphery of the first portion to cut off the first portion from the substrate. A corresponding opening is formed in the substrate 600. During the cutting operation, the laser beam 712 emitted from the processing device 710 may pass through the substrate 600 and through the opening 130. The laser beam 712 does not impinge on the support 110. Damage to the support 110 is avoided. After the cutting operation is completed, the pieces that have been cut from the substrate 600 may fall through the opening 130 .

[0083] The apparatus 700 according to the embodiments described herein may include a control system. The control system may be configured or programmed to control the movement of the laser beam 712 emitted by the processing device 710. The control system may be configured to control the movement of the laser beam 712 so that the laser beam 712 impinges on the substrate 600 in a portion of the substrate facing an opening 130 in the array of openings 130. The control system may be configured to control the movement of the laser beam so that the laser beam 712 does not impinge on the support 110. Accordingly, damage to the support 110 may be prevented.

[0084] For example, about Figure 6 , the laser beam emitted by the processing device can be controlled to move in the area inside the white rectangle representing the array of openings 130, and can be controlled not to hit the hashed area representing the support body 110. In view of this, large openings 610 and small openings 620 can be formed inside the perimeter of the openings 130.

[0085] The apparatus 700 according to embodiments described herein may comprise a vacuum source arrangement 720 . The one or more suction openings 140 may be in fluid communication with the vacuum source arrangement, in particular for sucking the substrate against the support 110 .

[0086] Figure 8b A cross section of a device 700 according to an embodiment described herein is shown in side view. The cross section is taken along Figure 8a The line shown in is taken.

[0087] The openings in the array of openings 130 may be through holes of the support body 110. The substrate 600 is unsupported in a region facing the openings in the array of openings 130. Between adjacent openings in the array of openings 130, a portion of the support body supporting the substrate 600 is provided.

[0088] Figure 9a -b shows an apparatus 700 according to embodiments described herein.

[0089] The apparatus 700 according to the embodiments described herein may include a container 910. The container 910 may be arranged below the support 110. The container 910 may be configured to receive a piece of the substrate 600 cut from the substrate 600 by the processing device 710. The container 910 may be configured to store the piece of the substrate 600.

[0090] Figure 9a A first piece 952 of the substrate 600 is shown, after the processing device 710 cuts the first piece 952 from the substrate 600 and the first piece 952 falls into the container 910 through one of the openings 130 . Figure 9bA second piece 954 of the substrate 600 is shown, after the processing device 710 cuts the second piece 954 from the substrate 600 and the second piece 954 falls into the container 910 through another one of the openings 130 .

[0091] Fig.10 An apparatus 700 is shown according to embodiments described herein.

[0092] The support 110 according to embodiments herein may be configured to receive a substrate 600 extending beyond the support, such as Fig.10 The area of ​​the substrate 600 may be larger than the area of ​​the support body 110 .

[0093] The apparatus 700 according to the embodiments described herein may include one or more slots 1010. The one or more slots 1010 may be arranged below the support 110. Each of the one or more slots 1010 may be disposed below an edge region of the support 110. The one or more slots 1010 may be arranged to receive a piece (particularly an edge piece) cut from the substrate 600 by the processing device 710. For example, the processing device 710 may be configured to cut an edge piece, such as a strip-like portion at one of the edges of the substrate, from the substrate 600. After the edge piece is cut from the substrate 600, the edge piece may fall into one of the one or more slots 1010. The edge piece may be received by the container 910.

[0094] The support device 10 according to the embodiments described herein may be a replaceable support device. The apparatus 700 according to the embodiments described herein may include a first support device according to the embodiments described herein and a second support device according to the embodiments described herein. The pattern formed by the array of openings 130 of the second support device may be different from the pattern formed by the array of openings 130 of the first support device. For example, the array of openings 130 of the second support device may have a different number of openings than the array of openings 130 of the first support device. In view of this, a suitable support device may be selected according to the specific pattern of openings to be formed in the substrate.

[0095] According to another embodiment, a method of processing a substrate 600 is provided. The method includes the following steps: supporting the substrate 600 by a support 110, wherein a plurality of portions of the substrate 600 having a combined area of ​​40% or more of the area of ​​the substrate 600 are not supported. For example, Figure 8b Portions 810 of the unsupported substrate 600 are shown. The method comprises the steps of suctioning the substrate 600 to the support 110 at the one or more suction openings 140. The substrate 600, the support 110 and the one or more suction openings 140 may be a substrate, a support and one or more suction openings, respectively, according to any aspect described herein.

[0096] The unsupported portion of the substrate 600 (eg Figure 8b The portion 810 shown may be understood as a portion of the substrate 600 that is not supported or contacted by the support 110 or other supporting components.

[0097] The plurality of unsupported portions of substrate 600 as described herein may be a plurality of unsupported portions or regions of substrate 600 that are spaced apart from one another.

[0098] The joint area of ​​the plurality of unsupported portions of substrate 600 may be 40% or more, in particular 50% or more, 60% or more, 70% or more, or even 80% or more of the area of ​​substrate 600. The term "jointarea" or "total area" may be understood as the sum of the areas of the individual unsupported portions of substrate 600. If N portions of substrate 600 are unsupported, the joint area of ​​the unsupported portions may be understood as the sum of N individual areas, each of which is the area of ​​a corresponding unsupported portion of substrate 600.

[0099] Each of the plurality of unsupported portions of substrate 600 may have a first width in the first direction, wherein the first width is 5% or more of the first width of substrate 600 in the first direction. Each of the plurality of unsupported portions of substrate 600 may have a second width in the second direction, wherein the second width is 5% or more of the second width of the substrate in the second direction.

[0100] Multiple unsupported portions of the substrate 600 may be disposed within the perimeter of a substrate receiving area as described herein. For example, multiple unsupported portions may be disposed within the perimeter of a substrate receiving area as described herein. Figure 1 Inside the dashed line 120 shown.

[0101] The support 110 may be formed into a pattern having an array of openings 130 as described herein. Each opening of the array of openings 130 may correspond to an unsupported portion of the substrate 600 or an unsupported portion facing the substrate 600.

[0102] The plurality of unsupported portions of substrate 600 may be a two-dimensional array of unsupported portions.

[0103] One or more (particularly two or more, more particularly each) unsupported portions of substrate 600 may be a substantially rectangular portion of the substrate.

[0104] The plurality of unsupported portions of the substrate 600 may include a first unsupported portion and a second unsupported portion. The first unsupported portion may face a first opening in an array of openings 130 of the support body 110. The second unsupported portion may face a second opening in an array of openings 130 of the support body 110. The first opening and the second opening may be adjacent openings in the array of openings 130. The first unsupported portion may be spaced or separated from the second unsupported portion. As described herein, one or more suction openings 140 may include at least one suction opening between the first unsupported portion and the second unsupported portion.

[0105] The plurality of unsupported portions of the substrate 600 may include a third unsupported portion and / or a fourth unsupported portion. The third unsupported portion may face a third opening in the array of openings 130 of the support body 110. The third opening in the array of openings 130 may be adjacent to a second opening in the array of openings 130. The fourth unsupported portion may face a fourth opening in the array of openings 130 of the support body 110. The fourth opening in the array of openings 130 may be adjacent to the third opening and the first opening in the array of openings 130. One or more suction openings 140 may include at least one suction opening between the second unsupported portion and the third unsupported portion. One or more suction openings 140 may include at least one suction opening between the third unsupported portion and the fourth unsupported portion. One or more suction openings 140 may include at least one suction opening between the fourth unsupported portion and the first unsupported portion.

[0106] One or more (particularly two or more, more particularly each) unsupported portions of the substrate 600 may be surrounded by a plurality of the one or more suction openings 140 (eg, four, six, eight or more suction openings).

[0107] The one or more suction openings 140 may include a plurality of external suction openings extending along an edge region of the substrate 600. Each of the plurality of unsupported portions of the substrate 600 may be surrounded by the plurality of external suction openings.

[0108] Methods according to embodiments described herein may include the following steps: forming one or more openings in a first unsupported portion of substrate 600. The one or more openings may be through holes. The first unsupported portion may face a first opening in an array of openings 130 of support 110. The one or more openings may be formed using a processing device 710 as described herein. The step of forming one or more openings may include the following steps: directing a laser beam onto the first unsupported portion of substrate 600. The laser beam may cut through the first unsupported portion of substrate 600. The laser beam may pass through a first opening in an array of openings 130 of support 110.

[0109] The step of forming one or more openings in the first unsupported portion may include the following steps: forming a plurality of openings in the first unsupported portion. The plurality of openings may include a large opening 610 and a plurality of small openings 620 or through holes surrounding the large opening 610.

[0110] The method according to the embodiments described herein may include the following steps: forming one or more openings, in particular through holes, in the second unsupported portion of the substrate 600. The second unsupported portion may be spaced apart from the first unsupported portion. The second unsupported portion may face a second opening in the array of openings 130 of the support body 110.

[0111] One or more openings in the second unsupported portion of substrate 600 may be formed using processing apparatus 710 as described herein. The step of forming one or more openings may include the steps of directing a laser beam onto the second unsupported portion of substrate 600. The laser beam may cut through the second unsupported portion of substrate 600. The laser beam may pass through a second opening in the array of openings 130 of support 110.

[0112] Methods according to embodiments described herein may include the following steps: forming one or more corresponding openings in each of 9 or more, 16 or more, or 25 or more unsupported portions of substrate 600. The openings may be through holes. Each unsupported portion may face a corresponding opening in the array of openings 130.

[0113] Embodiments of the method for processing a substrate 600 as described herein may be performed by the support device 10 and / or the apparatus 700 according to embodiments described herein.

[0114] According to another embodiment, a semiconductor substrate is provided. The semiconductor substrate includes a two-dimensional array of openings, wherein the combined area of ​​the openings of the two-dimensional array of openings is 40% or more of the area of ​​the semiconductor substrate. The semiconductor substrate may be the substrate 600 described herein, such as Figure 6 The substrate 600 is shown.

[0115] The combined area of ​​the openings in the two-dimensional array of openings is 40% or more, in particular 50% or more, or even 60% or more of the area of ​​the semiconductor substrate. The concept of a "joint area" of the two-dimensional array of openings of the substrate is similar to the concept of a "joint area" associated with the array of openings 130 of the support 110 as explained above.

[0116] The openings in the two-dimensional opening array may be through holes in the semiconductor substrate.

[0117] The semiconductor substrate may be a silicon substrate. Additionally or alternatively, the semiconductor substrate may be a semiconductor wafer. Additionally or alternatively, the semiconductor substrate may have a thickness of 150 μm or less, such as 120 μm or less or even 110 μm or less.

[0118] The two-dimensional array of openings in the semiconductor substrate may include a plurality of large openings 610, such as 20 or more, 50 or more, or 100 or more large openings. Each large opening may be a substantially rectangular opening.

[0119] The two-dimensional opening array in the semiconductor substrate may include a plurality of small openings 620, such as 100 or more, 300 or more, or 800 or more small openings. The number of small openings may be greater than the number of large openings. The small openings may be understood as through holes.

[0120] The diameter of the small openings 620 as described herein may be 1% or less of the diameter of the large openings 610 as described herein.

[0121] Each of the plurality of large openings can be surrounded by a number of small openings. For example, each of the plurality of large openings can be surrounded by 50 or more, in particular 100 or more small openings.

[0122] A linear array of small openings can be formed between any two adjacent large openings. If there are no other large openings between the two large openings, the two large openings can be understood to be adjacent.

[0123] The two-dimensional array of openings in the semiconductor substrate may be formed in a first direction (eg Figure 6 in the left and right directions) and in the second direction (such as Figure 6 The two-dimensional opening array can be understood as an opening matrix.

[0124] The two-dimensional array of openings in the semiconductor substrate may include multiple rows of openings, each row extending in a first direction. Each row of openings may include several openings. Each row of openings may extend from the first opening of the row to the last opening of the row in the first direction. Each row may include 3 or more (particularly 9 or more, more particularly 20 or more) openings.

[0125] The two-dimensional array of openings in the semiconductor substrate may include multiple rows of openings, each row extending in the second direction. Each row of openings may include several openings. Each row of openings may extend from the first opening of the row to the last opening of the row in the second direction. Each row may include 3 or more (particularly 9 or more, more particularly 20 or more) openings.

[0126] Embodiments of the methods, support devices and / or apparatus described herein may be used to manufacture a semiconductor substrate according to embodiments described herein.

[0127] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope of the disclosure is determined by the claims that follow.

Claims

1. An apparatus for processing a semiconductor substrate, comprising: A supporting device, used to support the semiconductor substrate, the supporting device comprising: a substrate receiving area; and a support body formed into a pattern having a two-dimensional array of openings, the support body being a sparse structure, wherein a combined area of ​​the openings in the two-dimensional array of openings is 40% or more of an area of ​​the substrate receiving region, wherein the support body comprises a plurality of suction openings, the plurality of suction openings being arranged to be in fluid communication with a vacuum source, wherein the two-dimensional array of openings of the support body comprises a first opening and a second opening, wherein the first opening and the second opening are adjacent openings in the two-dimensional array of openings, wherein the plurality of suction openings comprises at least one suction opening in a portion of the support body between the first opening and the second opening; and A laser device is configured to form an opening through the semiconductor substrate by emitting a laser beam onto a portion of the openings in the two-dimensional array of openings of the semiconductor substrate facing the support body.

2. The apparatus of claim 1, wherein each opening in the two-dimensional array of openings of the support body has a first width in a first direction, wherein the first width is 5% or more of a first width of the substrate receiving area in the first direction.

3. The apparatus of claim 1, wherein each opening in the two-dimensional array of openings of the support body has a second width in a second direction, wherein the second width is 5% or more of a second width of the substrate receiving area in the second direction.

4. The apparatus of claim 1, wherein the two-dimensional array of openings of the support body comprises a third opening and a fourth opening, wherein the first opening, the second opening, the third opening and the fourth opening form a 2×2 opening matrix, wherein: the plurality of suction openings including at least one suction opening in a portion of the support body between the second opening and the third opening; the plurality of suction openings including at least one suction opening in a portion of the support body between the third opening and the fourth opening; and The plurality of suction openings includes at least one suction opening in a portion of the support body between the fourth opening and the first opening.

5. The apparatus of claim 1, wherein at least one of the plurality of suction openings is disposed in the support body between any two adjacent openings in the two-dimensional array of openings of the support body. 6 . The apparatus of claim 1 , wherein the support body comprises a support portion for supporting the semiconductor substrate between any two adjacent openings in the two-dimensional array of openings of the support body.

7. The apparatus of claim 1, wherein each opening of the two-dimensional array of openings of the support body is surrounded by a number of suction openings of the plurality of suction openings.

8. The apparatus of claim 1, wherein the support body includes a frame portion surrounding the two-dimensional array of openings of the support body.

9. The apparatus of claim 8, wherein the plurality of suction openings comprises one or more external suction openings, the one or more external suction openings being disposed in the frame portion, the one or more external suction openings surrounding the two-dimensional array of openings of the support body.

10. The apparatus of claim 1, wherein the support is shaped as a two-dimensional grid.

11. An apparatus for processing a semiconductor substrate, comprising: A supporting device, used to support the semiconductor substrate, the supporting device comprising: A grid-shaped support body having a two-dimensional array of openings; and A plurality of suction openings, wherein the one or more suction openings are in the grid-like support body, wherein the two-dimensional array of openings of the grid-shaped support body comprises a first opening and a second opening, wherein the first opening and the second opening are adjacent openings in the two-dimensional array of openings, wherein the plurality of suction openings comprises at least one suction opening in a portion of the grid-shaped support body between the first opening and the second opening; and A laser device is configured to form an opening through the semiconductor substrate by emitting a laser beam onto a portion of the semiconductor substrate facing the two-dimensional array of openings of the grid-like support.

12. The apparatus of claim 11, further comprising: A container is arranged below the grid-shaped support body, and the container is used to receive the slices of the semiconductor substrate cut from the semiconductor substrate by the laser device.

13. A method for processing a semiconductor substrate, comprising the steps of: Supporting the semiconductor substrate by a grid-shaped support body, the grid-shaped support body having a two-dimensional array of openings, wherein a plurality of portions of the semiconductor substrate are a plurality of unsupported portions that are not supported; sucking the semiconductor substrate to the grid-shaped support body at a plurality of suction openings; as well as forming openings through the semiconductor substrate by emitting a laser beam from a laser device onto unsupported portions of the semiconductor substrate facing openings in the two-dimensional array of openings of the grid-like support; as well as The multiple unsupported portions of the semiconductor substrate include a first unsupported portion and a second unsupported portion, the first unsupported portion faces a first opening in the two-dimensional opening array of the grid-shaped support body, and the second unsupported portion faces a second opening in the two-dimensional opening array of the grid-shaped support body, wherein the first opening and the second opening are adjacent openings in the two-dimensional opening array, and wherein the multiple suction openings include at least one suction opening between the first unsupported portion and the second unsupported portion.

14. The method of claim 13, further comprising the steps of: One or more openings are formed in at least one of the first unsupported portion and the second unsupported portion of the semiconductor substrate.

15. The method of claim 13, wherein the plurality of unsupported portions of the semiconductor substrate include a third unsupported portion and a fourth unsupported portion, the third unsupported portion faces a third opening in the two-dimensional array of openings of the grid-shaped support, and the fourth unsupported portion faces a fourth opening in the two-dimensional array of openings of the grid-shaped support, wherein the first opening, the second opening, the third opening, and the fourth opening form a 2×2 opening matrix, wherein: the plurality of suction openings including at least one suction opening between the second unsupported portion and the third unsupported portion; the plurality of suction openings including at least one suction opening between the third unsupported portion and the fourth unsupported portion; and The plurality of suction openings includes at least one suction opening between the fourth unsupported portion and the first unsupported portion.

16. The method of claim 13, wherein each unsupported portion of the plurality of unsupported portions is surrounded by a number of suction openings of the plurality of suction openings.

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