Laser cutting method of printed circuit metal substrate based on machine tool coordinate system

Abstract

The present invention discloses a laser cutting method for a printed circuit metal substrate based on a machine tool coordinate system, comprising: obtaining a MARK point: generating a laser cutting file including an ejector trajectory and a laser cutting trajectory; displaying the ejector trajectory information and position in the machine tool coordinate system, and placing the ejector in the machine tool coordinate system according to the position; and laser cutting the printed circuit metal substrate to be processed. The embodiment of the present invention generates the ejector trajectory and position to be placed corresponding to the printed circuit metal substrate, so as to avoid the laser cutting trajectory from intersecting with the placement position of the ejector and the line trajectory position, thereby achieving perfect avoidance of the ejector and the line during the laser cutting process. The present invention determines the placement position of the ejector through precise calculation, effectively avoids the laser cutting path, greatly improves the placement efficiency of the ejector, ensures the accuracy of laser cutting, and ensures the quality of the cut metal substrate.

Description

Technical Field

[0001] The invention belongs to the technical field of laser cutting, and specifically relates to a laser cutting method for a printed circuit metal substrate based on a machine tool coordinate system. Background Art

[0002] Laser cutting is a process of using a high-power laser beam to irradiate a metal plate, causing the metal plate to be quickly heated and vaporized, thereby cutting the metal plate into a specified shape. Laser cutting technology is widely used in the processing of metal plates due to its advantages such as good cutting effect, fast cutting speed, and high efficiency. However, after the substrate is cut, the flat part is hollowed out, which destroys the internal stress of the plane and breaks the balance of the plane stress, so the plane cannot remain flat. In order to maintain the flatness of the plane as much as possible, it is necessary to supplement the support force where the stress is lost. Therefore, when using laser cutting, the metal plate needs to be placed on the ejector pin for cutting to ensure that the flatness of the plane is maintained after the substrate is cut.

[0003] In the prior art, there are two main methods for placing ejector pins in laser cutting of metal plates: multiple rows of serrated ejector pins and free placement of ejector pins with bottom magnets. The ejector pins used in these two methods have the same function. Since the cutting data is based on the machine tool coordinate system, its position is relatively fixed, so there is no need to use visual guidance positioning (CCD positioning). When these two methods are used to cut the same data multiple times, the ejector pins do not need to be replaced. As long as the cut metal substrate is placed in roughly the same place each time, the position of the ejector pin relative to the machine tool coordinate system is fixed. You can try cutting a piece first or take a previously cut outer frame and place it on the cutting platform to fix it and mark the fixed position. Then adjust the ejector pin and place it to avoid the laser cutting track to fix it. Then place the ejector pins one by one or in a row until all the ejector pins that need to be placed are placed.

[0004] However, this method cannot be applied to metal substrates with printed circuits, because if the traditional cutting method is used, the ejector pin is located in a fixed position and the circuit cannot be cut by the laser, it is necessary to ensure that the laser cutting route avoids the position of the ejector pin and the circuit at the same time. If the position of the circuit is avoided during laser cutting, the laser light trajectory may appear at the ejector pin position. Once the ejector pin position is cut off, the entire metal substrate will have no support point at this position, resulting in the metal substrate being unable to be effectively fixed, causing deviation during the laser cutting process, resulting in the scrapping of the substrate. Moreover, if the ejector pin is placed at the cutting track, the laser high-pressure gas will hit the ejector pin during cutting. During laser cutting, the residue blown down by the high-pressure air will rebound onto the circuit board, which will also cause the substrate to be defective or directly scrapped. Summary of the invention

[0005] To this end, an embodiment of the present invention provides a laser cutting method for a printed circuit metal substrate based on a machine tool coordinate system, which aims to solve the problem of laser cutting of printed circuit metal substrates in the prior art methods, in which the substrate is scrapped or the product is defective due to deviation caused by the lack of support points.

[0006] In a first aspect, an embodiment of the present invention provides a laser cutting method for a printed circuit metal substrate based on a machine tool coordinate system, comprising:

[0007] Obtain the MARK point, and determine the position of the printed circuit metal substrate to be processed in the machine tool coordinate system according to the MARK point:

[0008] Acquire the printed circuit metal substrate file to be processed, generate a laser cutting file including an ejector track and a laser cutting track according to the printed circuit metal substrate file to be processed, and import the laser cutting file into the laser cutting system;

[0009] Displaying the ejector trajectory information and position in the machine tool coordinate system according to the laser cutting file, and placing the ejector in the machine tool coordinate system according to the position;

[0010] Placing the printed circuit metal substrate to be processed at a designated position corresponding to the machine tool coordinate system, so that the ejector trajectory on the printed circuit metal substrate to be processed corresponds to the ejector position;

[0011] The printed circuit metal substrate to be processed is laser cut according to the laser cutting track in the laser cutting file.

[0012] In a second aspect, an embodiment of the present invention provides a computer device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the method for laser cutting of a printed circuit metal substrate based on a machine tool coordinate system when executing the computer program.

[0013] In a third aspect, an embodiment of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method for laser cutting of a printed circuit metal substrate based on a machine tool coordinate system is implemented.

[0014] The embodiment of the present invention provides a laser cutting method for a printed circuit metal substrate based on a machine tool coordinate system, and generates the ejector trajectory and position to be placed by the printed circuit metal substrate, so as to avoid the laser cutting trajectory from intersecting with the placement position of the ejector and the line trajectory position, thereby achieving perfect avoidance of the ejector and the line during the laser cutting process. The present invention determines the placement position of the ejector through precise calculation, effectively avoids the laser cutting path, greatly improves the placement efficiency of the ejector, ensures the accuracy of laser cutting, and guarantees the quality of the cut metal substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0016] Figure 1 This is a flow chart of laser cutting of a metal substrate for a printed circuit according to an embodiment of the present invention. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0019] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0020] It should be further understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0021] See also Figure 1 As shown, Figure 1 This is a flowchart of laser cutting of a metal substrate for printed circuit according to an embodiment of the invention. The present invention provides a laser cutting method for a metal substrate for printed circuit based on a machine tool coordinate system, the method comprising the following steps:

[0022] S1. Obtain the MARK point, and determine the position of the metal substrate of the printed circuit to be processed in the machine tool coordinate system according to the MARK point:

[0023] MARK points are the position identification points used by PCB on automatic placement machines in circuit board design, also called reference points, which provide reference points for the placement of all components in the placement process. The corresponding MARK points are included in the original circuit board data. MARK points in circuit board design must appear in pairs, marked as solid circles, including marking points / feature points and empty areas; located at the relative position of the diagonal of the circuit board and separated as far as possible.

[0024] Prior to this, it is necessary to open the data file (CAD file in DXF format) through the NC cutting software; and edit the data by shrinking, expanding, leading or micro-connecting.

[0025] To obtain the MARK point, you can use the data on the original circuit board, select the MARK points on the data for marking, and mark them as 1, 2, and 3 respectively, so that the coordinates of these three points on the machine tool can be obtained. Based on the principle that two points determine a straight line and three points determine a plane, with 1 as the first point, the data coordinates are compared with the coordinates obtained by the CCD after movement, and there are several differences and a rotation angle, so that the MARK point can be determined to determine the position of the metal substrate of the printed circuit to be processed in the machine tool coordinate system.

[0026] S2, obtaining the printed circuit metal substrate file to be processed, and generating a laser cutting file including an ejector track and a laser cutting track according to the printed circuit metal substrate file to be processed, and importing the laser cutting file into the laser cutting system;

[0027] In this embodiment, the file of the metal substrate of the printed circuit to be processed includes the position of the printed circuit on the metal substrate and the position of the ejector pins that need to be used to support the metal substrate.

[0028] The ejector track includes a plurality of ejector position points, and the ejector track is formed by a continuous combination of the plurality of ejector position points, which correspond to the track positions on the circuit board that need to form support points for the circuit board during the cutting process.

[0029] At the same time, the laser cutting trajectory must not only ensure that it has no intersection with the ejector trajectory, but also ensure that the laser running trajectory avoids the circuit graphics on the circuit board. This can ensure that the laser cuts the metal substrate of the circuit board along the laser trajectory during cutting, and the ejector forms a support point to avoid the problem of uneven circuit boards. At the same time, it can effectively avoid the corresponding circuit graphics on the circuit board to prevent damage to the circuit graphics and cause the circuit board to be scrapped.

[0030] S3, displaying the ejector trajectory information and position in the machine tool coordinate system according to the laser cutting file, and placing the ejector in the machine tool coordinate system according to the position;

[0031] In step S1, after the data is edited by the NC cutting software such as indentation, expansion, lead or micro-connection, the condition tool positioning bar in the corresponding menu bar of the software operation interface can be selected, and then an NC file is generated. The NC file is the PTP working mode that realizes the point coordinates. Then click the start button with the mouse to make the red light of the laser cutting head run to each Flag point, and then wait for the operator to place the ejector (support point). Click the start button with the mouse again to run to the next ejector position and continue to place the ejector; the operation is repeated until all the points are completed, and all the ejectors are placed.

[0032] S4, placing the printed circuit metal substrate to be processed at a designated position corresponding to the machine tool coordinate system, so that the ejector trajectory on the printed circuit metal substrate to be processed corresponds to the ejector position;

[0033] In step S3, when all ejectors are placed, the tooling positioning function is turned off, and the NC cutting software is operated to regenerate the NC file.

[0034] S5. Laser cutting the printed circuit metal substrate to be processed according to the laser cutting trajectory in the laser cutting file.

[0035] According to the NC file generated in S4, the ejector cutting process can be realized by grabbing the mark point through CCD.

[0036] The above is an explanation of the printed circuit metal substrate laser cutting method based on the machine tool coordinate system of the present invention. Based on this method, it also includes a computer device for executing the method. The device includes a memory and a processor, which are connected through a system bus, wherein the memory may include a storage medium and an internal memory, and the storage medium may store an operating system and a computer program. When the computer program is executed, the processor may execute the printed circuit metal substrate laser cutting method, wherein the storage medium may be a volatile storage medium or a non-volatile storage medium; the processor is used to provide computing and control capabilities to support the operation of the entire computer device.

[0037] In another embodiment of the present invention, a computer-readable storage medium is provided. The computer-readable storage medium may be a volatile or non-volatile computer-readable storage medium. The computer-readable storage medium stores a computer program, wherein when the computer program is executed by a processor, the steps included in the above-mentioned printed circuit metal substrate laser cutting method based on a machine tool coordinate system are implemented.

[0038] The present invention uses CCD (image sensor) to obtain the mark point and then calculates and determines the position of the plate in the machine tool coordinate system. The position where the ejector pin needs to be placed is stored in the data as a point to avoid the path of laser cutting. The point placement is also to allow several points to be in a straight line and a horizontal line as much as possible in the ejector pin plane. The brackets supporting the vertex are also placed in a row or a column, which greatly facilitates the placement of the ejector pin and improves the efficiency of ejector pin placement.

[0039] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, the specific working process of the above-described equipment, devices and units can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. Those of ordinary skill in the art can appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented with electronic hardware, computer software or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to the function. Whether these functions are executed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present invention.

[0040] In the several embodiments provided by the present invention, it should be understood that the disclosed equipment, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. Units with the same function may also be combined into one unit. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interfaces, devices or units, or may be an electrical, mechanical or other form of connection.

[0041] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiments of the present invention.

[0042] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0043] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a computer-readable storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned computer-readable storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a magnetic disk or an optical disk.

[0044] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A laser cutting method for printed circuit metal substrate based on a machine tool coordinate system, characterized in that: include: Obtain the MARK point, and determine the position of the printed circuit metal substrate to be processed in the machine tool coordinate system according to the MARK point: Acquire the printed circuit metal substrate file to be processed, generate a laser cutting file including an ejector track and a laser cutting track according to the printed circuit metal substrate file to be processed, and import the laser cutting file into the laser cutting system; Displaying the ejector trajectory information and position in the machine tool coordinate system according to the laser cutting file, and placing the ejector in the machine tool coordinate system according to the position; Placing the printed circuit metal substrate to be processed at a designated position corresponding to the machine tool coordinate system, so that the ejector trajectory on the printed circuit metal substrate to be processed corresponds to the ejector position; The printed circuit metal substrate to be processed is laser cut according to the laser cutting track in the laser cutting file.

2. The laser cutting method according to claim 1, characterized in that: The step of obtaining the MARK point and determining the position of the metal substrate for printed circuit to be processed in the machine tool coordinate system according to the MARK point may also include: Open the data file and edit the data file.

3. The laser cutting method according to claim 2, characterized in that: The data files include CAD files in DXF format.

4. The laser cutting method according to claim 3, characterized in that: The editing of the data file includes: shrinking, expanding, leading and micro-connecting the data file.

5. The laser cutting method according to claim 1, characterized in that: The file of the metal substrate of the printed circuit to be processed includes the position of the printed circuit on the metal substrate and the position of the ejector pins that need to be used to support the metal substrate.

6. The laser cutting method according to claim 5, characterized in that: The ejector needle trajectory includes a plurality of ejector needle position points.

7. The laser cutting method according to claim 5, characterized in that: The laser cutting trajectory has no intersection with the ejector trajectory.

8. The laser cutting method according to claim 1, characterized in that: Get MARK points, including: Select three points on the file of the metal substrate of the printed circuit to be processed for marking; Obtaining the coordinates of the three points on the machine tool; Select one of the points as the first point, and compare the coordinates in the file data of the printed circuit metal substrate to be processed with the coordinates on the machine tool obtained by the CCD after movement to obtain the MARK point.

9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the printed circuit metal substrate laser cutting method based on the machine tool coordinate system as described in any one of claims 1 to 8 is implemented.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the printed circuit metal substrate laser cutting method based on a machine tool coordinate system as described in any one of claims 1 to 8 is implemented.

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