Power conversion module and magnetic assembly thereof

Abstract

The present application relates to a magnetic assembly comprising: a magnetic core assembly comprising; first to fourth magnetic legs, the first and third magnetic legs being disposed opposite each other and between the second and fourth magnetic legs, the second and fourth magnetic legs being disposed opposite each other; a first winding channel comprising a first portion formed between the first and second magnetic legs and a second portion formed between the second and third magnetic legs; a second winding channel comprising a first portion formed between the first and fourth magnetic legs and a second portion formed between the third and fourth magnetic legs; a first winding partially disposed within the first portion of the first winding channel and partially disposed within the second portion of the second winding channel; and a second winding partially disposed within the first portion of the second winding channel and partially disposed within the second portion of the first winding channel. The present application also relates to a power conversion module.

Description

Technical Field

[0001] This case relates to the field of power electronic equipment technology, and more particularly to a power conversion module and its magnetic components. Background Technology

[0002] Modern power electronic devices, as a crucial component of power conversion, are widely used in the power, electronics, motor, and energy industries. Ensuring the long-term stable operation of power electronic devices and improving their power conversion efficiency have always been important goals pursued by those skilled in the art.

[0003] With the rapid development of technologies such as mobile communication and cloud computing, high-power DC / DC power conversion modules have been widely used in communication products. Due to the increasing power and miniaturization of these products, new challenges have been posed to the conversion efficiency and size of power conversion modules. Therefore, designing a reasonable structure and layout for power conversion modules to improve their conversion efficiency and reduce their size is one of the hot topics in this technical field.

[0004] To achieve the advantages of reducing the size of the output filter and increasing the output power, traditional power conversion modules typically use a parallel circuit architecture, which includes at least two power conversion circuits connected in parallel, such as two buck power conversion circuits connected in parallel. In order to optimize the ripple characteristics of the output current of these parallel circuits, magnetic integration technology is used to make the inductors of the two power conversion circuits in the power conversion module form a magnetically integrated coupling relationship, that is, the two inductors of the two power conversion circuits constitute two-phase coupled inductors.

[0005] Traditional power conversion modules using magnetic integration technology employ magnetic components comprising two windings and a magnetic core to form a two-phase coupled inductor. However, due to the winding positions and methods of the two windings in traditional power conversion modules, the output terminal of the inductor formed by one winding is relatively close to the output terminal of the power conversion module, while the output terminal of the inductor formed by the other winding is relatively far away. This uneven distance between the output terminals of the two-phase coupled inductors and the output terminals of the power conversion module results in an asymmetrical equivalent DC series resistance and uneven current distribution between the two inductors. This leads to a large DC flux at the side posts of the magnetic core, which can easily cause flux saturation at the side posts, hindering the performance improvement of the power conversion module.

[0006] Therefore, how to develop a power conversion module and its magnetic components to solve the problems faced by the existing technology and achieve the goal of optimizing the power conversion module is a topic that urgently needs to be addressed in this field. Summary of the Invention

[0007] The purpose of this invention is to provide a power conversion module and its magnetic components to solve the problem that the distance between the output terminal of the two-phase coupled inductor and the output terminal of the power conversion module is inconsistent, which makes the equivalent DC series resistance of the two-phase coupled inductor asymmetrical and the current of the two-phase coupled inductor uneven. This, in turn, causes the magnetic flux of the side column of the E-type magnetic core to easily saturate, which is not conducive to improving the performance of the power conversion module.

[0008] To achieve the aforementioned objectives, this invention provides a magnetic component, comprising: a magnetic core assembly including: a first magnetic post; a second magnetic post; a third magnetic post disposed opposite to the first magnetic post; and a fourth magnetic post disposed opposite to the second magnetic post, wherein the first and third magnetic posts are located between the second and fourth magnetic posts; a first winding channel including a first portion formed between the first and second magnetic posts, and a second portion formed between the second and third magnetic posts; a second winding channel including a first portion formed between the first and fourth magnetic posts, and a second portion formed between the third and fourth magnetic posts; a first winding, with its input end disposed within the first portion of the first winding channel and its output end disposed within the second portion of the second winding channel; and a second winding, with its input end disposed within the first portion of the second winding channel and its output end disposed within the second portion of the first winding channel; wherein the magnetic reluctance of the second magnetic post and the fourth magnetic post are respectively greater than the magnetic reluctance of the first magnetic post and the magnetic reluctance of the third magnetic post.

[0009] To achieve the aforementioned objectives, this application further provides a power conversion module, comprising: a magnetic component, including: a magnetic core component, including: a first magnetic post; a second magnetic post; a third magnetic post, disposed opposite to the first magnetic post; and a fourth magnetic post, disposed opposite to the second magnetic post, wherein the first magnetic post and the third magnetic post are located between the second magnetic post and the fourth magnetic post; a first winding channel, including a first portion formed between the first magnetic post and the second magnetic post, and a second portion formed between the second magnetic post and the third magnetic post; and a second winding channel, including a first portion formed between the first magnetic post and the fourth magnetic post, and a second portion partially formed between the third magnetic post and the fourth magnetic post. Between four magnetic pillars; a first winding, the input end of which is located in the first part of the first winding channel, and the output end of which is located in the second part of the second winding channel; and a second winding, the input end of which is located in the first part of the second winding channel, and the output end of which is located in the second part of the first winding channel, wherein the magnetic reluctance of the second magnetic pillar and the magnetic reluctance of the fourth magnetic pillar are greater than the magnetic reluctance of the first magnetic pillar and the magnetic reluctance of the third magnetic pillar, respectively; and two power devices, one of which is electrically connected to the input end of the first winding, and the other of which is electrically connected to the input end of the second winding.

[0010] To achieve the aforementioned objective, this application further provides a magnetic component comprising: a printed circuit board, wherein the printed circuit board has at least one winding internally mounted, and the printed circuit board includes at least one through-hole surrounded by the at least one winding, and the through-hole is filled with magnetic powder material, the magnetic powder material being pressed together to form at least one first magnetic post within the at least one through-hole. Attached Figure Description

[0011] Figure 1A and Figure 1B Three-dimensional structural diagrams of the power conversion module of the first preferred embodiment of this case from different perspectives;

[0012] Figure 2A and Figure 2B for Figure 1A The power conversion module shown is an exploded view from different perspectives.

[0013] Figure 3A and Figure 3B for Figure 1A The diagram shown is an exploded view of the magnetic components of the power conversion module in this case from different perspectives.

[0014] Figure 4A and Figure 4B for Figure 1A The diagram shows the three-dimensional structure of the magnetic component of the power conversion module in this case from different perspectives.

[0015] Figure 4C , Figure 4D , Figure 4E and Figure 4F This is a schematic diagram of the conductor and the first, second, third and fourth connecting parts;

[0016] Figure 4G for Figure 3A The diagram shows a structural schematic of an integrated structure consisting of a main body layer, a conductor, a first winding, and a second winding.

[0017] Figure 5 for Figure 3A The diagram shows the current direction of the first and second windings.

[0018] Figure 6 This is the circuit topology corresponding to the power conversion module in this case;

[0019] Figure 7 This is a three-dimensional and partial perspective structural diagram of the power conversion module of the second preferred embodiment of this case;

[0020] Figure 8A and Figure 8B Three-dimensional structural diagrams of the power conversion module in the third preferred embodiment of this case from different perspectives;

[0021] Figure 9A and Figure 9B for Figure 8A The diagram shows the exploded structure of the power conversion module from different perspectives.

[0022] Figure 10 This is an exploded structural diagram of the magnetic component in the fourth preferred embodiment of this case.

[0023] The reference numerals in the attached figures are explained as follows:

[0024] 1, 1b, 1c: Power conversion modules

[0025] 2: Magnetic components

[0026] 20: Magnetic core assembly

[0027] 21, 21a: First winding

[0028] 22, 22a: Second winding

[0029] 200: First magnetic column

[0030] 201: Second magnetic column

[0031] 202: Third magnetic column

[0032] 203: Fourth Magnetic Pillar

[0033] 204: First winding channel

[0034] 205: Second winding channel

[0035] D1, D2: Direction of direct current

[0036] L 0A L 0N :inductance

[0037] 206: Connected Part

[0038] A: Extension line

[0039] 26, 26b: First magnetic cover

[0040] 27, 26b: Second magnetic cover

[0041] 30: Main body layer

[0042] 40: Conductor

[0043] 401: First connecting part

[0044] 402: Second connecting part

[0045] 403: Fourth connecting part

[0046] 404: Third Connection

[0047] 31, 520, 60, 80, 26c, 27c: First surface

[0048] 32, 521, 61, 81: Second surface

[0049] 50a, 50b: Power devices

[0050] Q 1A Q 2A Q 1N Q 2N :switch

[0051] Cin: Input capacitance

[0052] 5: Power Device Layer

[0053] 51: Component Combination

[0054] 52, 8: Printed Circuit Board

[0055] B: Line of symmetry

[0056] 531: Power device contact terminal

[0057] 532: Input positive terminal contact terminal

[0058] 534: Output negative terminal contact

[0059] 535: Signal control contact terminal

[0060] 536: Detection signal contact terminal

[0061] SW: Power device pin

[0062] Vin+: Input positive terminal

[0063] Vo-: Negative output terminal

[0064] 6: Pin layer

[0065] 62, 64a: Positive input pins

[0066] 63, 63a: Positive output pins

[0067] 64, 62a: Output negative pins

[0068] 65: Signal control pin

[0069] 66: Detection signal pin

[0070] Vo+: Positive output terminal

[0071] 610: First terminal

[0072] 611: Second terminal

[0073] 612: Third terminal

[0074] 613: Fourth terminal

[0075] Co: Output capacitor

[0076] 42: Input positive terminal pin face

[0077] 43: Output positive terminal pin face

[0078] 44: Output negative terminal pin face

[0079] 45: Signal control pin side

[0080] 46: Detection signal pin face

[0081] C: First Zone

[0082] D: Second Zone

[0083] 40k, 82, 83: Through holes

[0084] 84, 85: Core slots

[0085] 65a: Signal control and detection signal pin

[0086] 40a: First copper foil layer

[0087] 40b: First PP layer

[0088] 40c: First copper layer

[0089] 40d: Second PP layer

[0090] 40e: Second copper layer

[0091] 40f: Third PP layer

[0092] 40g: Second copper foil layer

[0093] 40h: Core slot

[0094] 40i: Inner wall

[0095] 40j: Outer side

[0096] A: Integrated structure Detailed Implementation

[0097] Some typical embodiments embodying the features and advantages of this invention will be described in detail in the following description. It should be understood that this invention can have various variations in different implementations, all of which do not depart from the scope of this invention, and the descriptions and drawings therein are for illustrative purposes only and are not intended to limit this invention.

[0098] Figure 1Aand Figure 1B These are three-dimensional structural diagrams of the power conversion module in the first preferred embodiment of this case, viewed from different angles. Figure 2A and Figure 2B for Figure 1A The diagram shown is an exploded view of the power conversion module from different perspectives. Figure 3A and Figure 3B for Figure 1A The diagram shows the exploded structure of the magnetic components of the power conversion module from different viewpoints. Figure 4A and Figure 4B for Figure 1A The diagram shows the three-dimensional structure of the magnetic components of the power conversion module from different perspectives. Figure 5 for Figure 3A The diagram shows the current direction of the first and second windings. Figure 6 This is the circuit topology corresponding to the power conversion module in this case. In this embodiment, the circuit topology formed by power conversion module 1 can be similar to... Figure 6 As shown, the power conversion module 1 can be a circuit topology consisting of two step-down power conversion circuits connected in parallel, wherein the power conversion module 1 includes a magnetic component 2 and at least one power device.

[0099] The magnetic assembly 2 includes a magnetic core assembly 20, a first winding 21, and a second winding 22. The magnetic core assembly 20 includes a first magnetic post 200, a second magnetic post 201, a third magnetic post 202, a fourth magnetic post 203, a first winding channel 204, and a second winding channel 205. The first magnetic post 200 and the third magnetic post 202 are arranged opposite to and spaced apart, and the second magnetic post 201 and the fourth magnetic post 203 are arranged opposite to and spaced apart, with the first magnetic post 200 and the third magnetic post 202 located between the second magnetic post 201 and the fourth magnetic post 203. A first portion of the first winding channel 204 is formed between the first magnetic post 200 and the second magnetic post 201, and a second portion of the first winding channel 204 is formed between the second magnetic post 201 and the third magnetic post 202. A first portion of the second winding channel 205 is formed between the first magnetic post 200 and the fourth magnetic post 203, and a second portion of the second winding channel 205 is formed between the third magnetic post 202 and the fourth magnetic post 203.

[0100] The first winding 21 includes an input terminal and an output terminal. The input terminal of the first winding 21 is located within the first portion of the first winding channel 204, and the output terminal of the first winding 21 is located within the second portion of the second winding channel 205. The second winding 22 also includes an input terminal and an output terminal. The input terminal of the second winding 22 is located within the first portion of the second winding channel 205, and the output terminal of the second winding 22 is located within the second portion of the first winding channel 204. Furthermore, as... Figure 5As shown, the direction of the DC current flowing through the first winding 21 (labeled D1) is the same as the direction of the DC current flowing through the second winding 22 (labeled D2). That is, the DC current in the first winding 21 flows from the first side of the first winding channel 204 adjacent to the first magnetic post 200 to the second side of the second winding channel 205 adjacent to the third magnetic post 202, while the DC current in the second winding 22 flows from the first side of the second winding channel 205 adjacent to the first magnetic post 200 to the second side of the first winding channel 204 adjacent to the third magnetic post 202. The two windings 21 and 22 can form two coupled inductors together with the magnetic core assembly 20, for example... Figure 6 The inductor L shown 0A L 0N However, this is not the limitation; the two windings 21 and 22 and the magnetic core assembly 20 can also be used together to form a transformer.

[0101] In some embodiments, the magnetic core assembly 20 further includes a connecting region 206, located between the first winding channel 204 and the second winding channel 205, and connected to both the first winding channel 204 and the second winding channel 205. Furthermore, the first winding 21 is partially disposed within the connecting region 206, such that the first winding 21 is bridging the first winding channel 204 and the second winding channel 205 via the connecting region 206. The second winding 22 is also partially disposed within the connecting region 206, such that the second winding 22 is bridging the first winding channel 204 and the second winding channel 205 via the connecting region 206. Therefore, the first winding 21 and the second winding 22 form an alternating top-bottom crossover state within the connecting region 206. Furthermore, the intersection of the first winding 21 and the second winding 22 in the connecting region 206 may include an insulating medium (not shown), that is, the insulating medium is located between the first winding 21 and the second winding 22 to isolate the first winding 21 and the second winding 22 through the insulating medium (not shown). Moreover, the overall structure of the magnetic core assembly 20, the first winding 21 and the second winding 22 can be mirror-symmetrical with reference to the extension line A of the first magnetic post 200 and the third magnetic post 202.

[0102] In some embodiments, the magnetic core assembly 20 further includes a first magnetic cover 26 and a second magnetic cover 27 disposed opposite to each other, and the first magnetic post 200, the second magnetic post 201, the third magnetic post 202, and the fourth magnetic post 203 are respectively located between the first magnetic cover 26 and the second magnetic cover 27. Furthermore, one end of each of the first magnetic post 200, the second magnetic post 201, the third magnetic post 202, and the fourth magnetic post 203 may be connected to the first magnetic cover 26, but this is not a limitation. One end of each of the first magnetic post 200, the second magnetic post 201, the third magnetic post 202, and the fourth magnetic post 203 may also be connected to the second magnetic cover 27, or each of the first magnetic post 200, the second magnetic post 201, the third magnetic post 202, and the fourth magnetic post 203 may be composed of two posts, with one post of each post connected to the first magnetic cover 26 and the other post of each post connected to the second magnetic cover 27.

[0103] In some embodiments, the magnetic component 2 further includes a main body layer 30 and a conductor 40. The main body layer 30 may be, for example, but not limited to, a hollow box structure or a plate structure, and the structural shape of the main body layer 30 generally corresponds to the structural shape of the magnetic core component 20. It includes a first surface 31 and a second surface 32, which are two opposing surfaces. In addition, the main body layer 30 may include a slot 33, which penetrates a portion of the first surface 31 and a portion of the second surface 32. The size of the slot 33 generally corresponds to the structural shape of the magnetic core component 20. Therefore, the magnetic core component 20 can be embedded in the main body layer 30 through the slot 33. The first magnetic cover 26 of the magnetic core component 20 is adjacent to the first surface 31 of the main body layer 30, and the second magnetic cover 27 of the magnetic core component 20 is adjacent to the second surface 32 of the main body layer 30. The conductor 40 is embedded between the first surface 31 and the second surface 32 of the main body layer 30, and is circumferentially disposed and at least partially exposed on the first surface 31 or the second surface 32 of the main body layer 30. Furthermore, a portion of the structure of the conductor 40 can constitute a first winding 21 and a second winding 22. The first winding 21 and the second winding 22 are at least partially located within the slot 33 and between the first surface 31 and the second surface 32, respectively. The conductor 40 can extend to the first surface 31 and / or to the second surface 32 of the main body layer 30, thereby allowing individual input and output terminals of the first winding 21 and the second winding 22 to extend toward the first surface 31 and / or toward the second surface 32. The upper surface of the first magnetic cover 26 may be higher than or not higher than the upper surface of the first magnetic cover 26, and / or the individual input terminals of the first winding 21 and the second winding 22 may extend downward beyond or not extend downward beyond the lower surface of the first magnetic cover 27. Similarly, the individual output terminals of the first winding 21 and the second winding 22 may extend upward above or not higher than the upper surface of the first magnetic cover 26, and / or the individual output terminals of the first winding 21 and the second winding 22 may extend downward beyond or not extend downward beyond the lower surface of the first magnetic cover 27. Furthermore, the conductor 40 may be formed by electroplating on the outer wall surface of the main body layer 30 between the first surface 31 and the second surface 32. The height of the first surface 31 of the main body layer 30 is higher than the upper surface of the first magnetic cover 26 of the magnetic core assembly 20, and the height of the second surface 32 is lower than the lower surface of the second magnetic cover 27 of the magnetic core assembly 20 (in...). Figure 2A The direction H is indicated, and it is parallel to the decomposition direction of power conversion module 1. Direction H is used to define the height relationship mentioned in this document. That is, the closer the arrow is to direction H, the higher the height of the component. Conversely, the farther away the arrow is from direction H, the lower the height of the component.

[0104] The power device layer 5 may be a plate structure and, for example, be attached to the first surface 31 of the main body layer 30. The power device layer 5 includes at least one power device, such as power devices 50a and 50b. Each power device 50a and 50b includes two switches and forms a half-bridge arm (for example, power device 50a may be configured as follows). Figure 6 The diagram shows a switch Q. 1A Q 2A The half-bridge arm, with power devices 50b, can be configured as follows: Figure 6 The diagram shows a switch Q. 1N Q 2N (half-bridge arms), each half-bridge arm can be connected to the input capacitor Cin (see [link to relevant documentation]). Figure 6 The two half-bridge arms are electrically connected, and each half-bridge arm can be electrically connected to the corresponding winding in the first winding 21 and the second winding 22. For example, the half-bridge arm composed of power device 50a can be electrically connected to the input end of the first winding 21, and the half-bridge arm composed of power device 50b can be electrically connected to the input end of the second winding 22. In addition, the drive signals received by the two half-bridge arms are 180° out of phase.

[0105] In other embodiments, the power device layer 5 may further include a component assembly 51 and a printed circuit board 52. The printed circuit board 52 includes a first surface 520 and a second surface 521 opposite to each other, with the second surface 521 adjacent to the first surface 31 of the main body layer 30. The component assembly 51 and the power devices 50a and 50b are respectively disposed on the first surface 520 of the printed circuit board 52. The component assembly 51 may be a portion of the input capacitor Cin, but is not limited thereto. In some embodiments, the two power devices 50a and 50b constituting the two half-bridge arms may be symmetrically disposed on the first surface 520 of the printed circuit board 52 with reference to a symmetry line B on the printed circuit board 52, wherein the symmetry line B is parallel to and corresponds to the extension line A. In other embodiments, the power devices 50a and 50b are the highest surfaces in the power conversion module 1 to facilitate the installation of a heat sink (not shown). The second surface 521 is provided with at least one power device contact terminal 531, at least one positive input contact terminal 532, at least one negative output contact terminal 534, at least one signal control contact terminal 535, and at least one detection signal contact terminal 536. The power device contact terminal 531 is electrically connected to the power device pin SW of power devices 50a and 50b, i.e., corresponding to… Figure 6 The symbol SW corresponds to the positive terminal contact 532. Figure 6 The positive input terminal Vin+ and the negative output terminal contact terminal 534 correspond to... Figure 6 The output negative terminal Vo- (i.e., the GND of the power conversion module 1) is used to transmit control signals, and the signal control contact terminal 535 is used to transmit sampling signals.

[0106] In some embodiments, the power conversion module 1 further includes a pin layer 6 adjacent to the second surface 32 of the main body layer 30. The pin layer 6 includes a first surface 60 and a second surface 61 opposite to each other, and at least one input positive pin 62, at least one output positive pin 63, at least one output negative pin 64, at least one signal control pin 65, and at least one detection signal pin 66 disposed on the first surface 60. The first surface 60 is adjacent to the second magnetic cover 27 relative to the second surface 61. The input positive pin 62 corresponds to... Figure 6 The positive input terminal Vin+ and the negative output terminal pin 64 correspond to... Figure 6 The output negative terminal Vo- (i.e., GND of the power conversion module 1) and the output positive terminal pin 63 correspond to Figure 6 The positive output terminal Vo+ is connected to the power converter module 1, and the aforementioned three pins are electrically connected to external pins on the second surface 32 of the main body layer 30 via wiring within the pin layer 6, thereby providing electrical connections for input and output of the power converter module 1. Signal control pin 65 is used to transmit control signals. Detection signal pin 66 is used to transmit sampling signals.

[0107] In some embodiments, such as Figure 1B As shown, a plurality of first terminals 610, a plurality of second terminals 611, a plurality of third terminals 612, and a plurality of fourth terminals 613 are disposed on the second surface 61 of the pin layer 6. The first terminals 610 can transmit control signals and / or transmit sampling signals, and the second terminals 611 can correspond to... Figure 6 The positive input terminal Vin+ corresponds to the third terminal 612. Figure 6 The output negative terminal Vo- (i.e., GND of the power conversion module 1) and the fourth terminal 613 correspond to... Figure 6 The output terminal Vo+ is shown.

[0108] Of course, the power conversion module 1 also includes an input capacitor layer or at least an input capacitor assembly to form Figure 6 The input capacitance Cin shown is (in) Figure 2B The above illustration shows an input capacitor (Cin) composed of an input capacitor assembly, wherein the input capacitor layer or input capacitor assembly is connected across the input terminal of the power conversion module 1. Structurally, the input capacitor layer or input capacitor assembly is disposed between the power device layer 5 and the magnetic core assembly 20, for example, disposed on the second surface 521 of the printed circuit board 52 and located between the power device layer 5 and the magnetic assembly 2, or disposed between the power device layer 5 and the main body layer 30, and thus located between the power device layer 5 and the magnetic core assembly 20. The input capacitor assembly is preferably disposed close to the power devices 50a and 50b. The power conversion module 1 may also include... Figure 6 The output capacitor Co shown is as follows: Figure 2AAs shown, the output capacitor Co can be disposed on the first surface 60 of the pin layer 6, located between the magnetic component 2 and the pin layer 6. Furthermore, Figure 6 The output capacitor Co shown can also be placed on the system board instead of in the power conversion module 1. The second terminal of the output capacitor Co is connected to the positive output pin 63, and the first terminal of the output capacitor Co is connected to the negative output pin 64. It should be noted that during the switching process of power devices 50a and 50b, the parasitic parameters between the input capacitor Cin and the power devices 50a and 50b, along with the equivalent parameters of the power devices, will generate high-frequency parasitic oscillations, affecting the switching process and losses of power devices 50a and 50b. Therefore, this design, which uses an input capacitor layer or input capacitor assembly close to the power devices 50a and 50b, helps to reduce the influence of parasitic parameters and further achieves the goal of reducing the size of the power conversion module 1 and increasing the overall power density of the power conversion module 1.

[0109] As can be seen from the above, since the input terminal of the first winding 21 of the magnetic component 2 of the power conversion module 1 in this case is located in the first winding channel 204 between the first magnetic post 200 and the second magnetic post 201, and the output terminal of the first winding 21 is located in the second winding channel 205 between the third magnetic post 202 and the fourth magnetic post 203, and the input terminal of the second winding 22 is located in the second winding channel 205 between the first magnetic post 200 and the fourth magnetic post 203, and the output terminal of the second winding 22 is located in the first winding channel 204 between the second magnetic post 201 and the third magnetic post 202, through the cross arrangement of the two windings, the output terminals of the two inductors coupled by the two windings are connected to the output terminals of the power conversion module 1 (i.e., Figure 1B The distance between the output terminals 613 (as indicated) can be approximately equal. This significantly reduces the asymmetry of the equivalent DC series resistance of the two coupled inductors, making them nearly equal. This results in the DC flux generated by the DC currents of the two inductors at the first magnetic pillar 200 subtracting from it, approaching zero and reducing the risk of saturation of the first magnetic pillar 200. Simultaneously, the DC flux generated by the DC currents of the two inductors at the third magnetic pillar 202 subtracts from it, also reducing the risk of saturation of the third magnetic pillar 202. Furthermore, the arrangement of the first winding 21 and the second winding 22 minimizes the distance between the output terminals of the two coupled inductors and the output terminals of the power conversion module 1, minimizing the equivalent DC series resistance of the two inductors and thus reducing conduction losses, thereby improving the conversion efficiency of the power conversion module 1.

[0110] In some embodiments, the second magnetic post 201 and the fourth magnetic post 203 include air gaps, while the first magnetic post 200 and the third magnetic post 202 may not include air gaps. However, this is not a limitation. In other embodiments, the first magnetic post 200 and the third magnetic post 202 may also include air gaps, provided that the lengths of the air gaps in the second magnetic post 201 and the fourth magnetic post 203 are greater than the lengths of the air gaps in the first magnetic post 200 and the third magnetic post 202, respectively. Furthermore, the air gap of each magnetic post may be located in the upper region of the corresponding magnetic post and adjacent to the first magnetic cover 26, but this is not a limitation. The air gap of each magnetic post may also be located in the lower region of the corresponding magnetic post and adjacent to the second magnetic cover 27, or the air gap of each magnetic post may be located in the middle region of the corresponding magnetic post.

[0111] In some embodiments, the first voltage across the input and output terminals of the first winding 21 is 180° out of phase with the second voltage across the input and output terminals of the second winding 22. When the first voltage across the input and output terminals of the first winding 21 is 180° out of phase with the second voltage across the input and output terminals of the first winding 22, the AC flux generated by the first winding 21 and the AC flux generated by the second winding 22 are subtracted in phase and approximately evenly distributed to the first magnetic post 200 and the third magnetic post 202, with the AC flux directions on the first magnetic post 200 and the third magnetic post 202 being opposite. Furthermore, the AC flux generated by the first winding 21 and the AC flux generated by the second winding 22 are superimposed in phase and also approximately evenly distributed to the second magnetic post 201 and the fourth magnetic post 203, with the AC flux directions on the second magnetic post and the fourth magnetic post being opposite. Furthermore, the DC flux generated by the DC current flowing through the first winding 21 on the first magnetic post 200 is subtracted from the DC flux generated by the DC current flowing through the second winding 22 on the first magnetic post 200. Simultaneously, the DC flux generated by the DC current flowing through the first winding 21 on the third magnetic post 202 is also subtracted from the DC flux generated by the DC current flowing through the second winding 22 on the third magnetic post 202. In some embodiments, the power conversion module 1 may include a current sharing circuit (not shown). Under the control of the current sharing circuit, the DC current flowing through the first winding 21 and the DC current flowing through the second winding 22 can be approximately equal, making the DC flux of the first magnetic post 200 and the third magnetic post 202 approximately zero. Furthermore, the DC magnetic field generated by the DC current flowing through the first winding 21 and the DC magnetic field generated by the DC current flowing through the second winding 22 are connected in series in the same direction, bridging the second magnetic post 201 and the fourth magnetic post 203. The air gap between the second magnetic post 201 and the fourth magnetic post 203 is used to resist this series DC magnetic field and prevent the second magnetic post 201 and the fourth magnetic post 203 from saturating. However, when the current sharing circuit cannot guarantee that the DC current flowing through the first winding 21 and the DC current flowing through the second winding 22 are completely equal, the DC magnetic flux of the first magnetic post 200 and the third magnetic post 202 will not be zero. In this case, the first magnetic post 200 and the third magnetic post 202 must each have an air gap to prevent the first magnetic post 200 and the third magnetic post 202 from saturating.

[0112] Furthermore, in this case, the first magnetic post 200 has a large AC flux but a small air gap and low magnetic reluctance. In contrast, the second magnetic post 201 has a large air gap and high magnetic reluctance, but a small AC flux. This results in a small AC current ripple in the first winding 21 and a large equivalent inductance. Similarly, although the third magnetic post 202 has a large AC flux, it has a small air gap and low magnetic reluctance. In contrast, the fourth magnetic post 203 has a large air gap and high magnetic reluctance, but a small AC flux. This results in a small AC current ripple in the second winding 22 and a large equivalent inductance. Therefore, the magnetic component 2 of the power conversion module 1 in this case has the advantages of small AC current ripple in the inductor current and strong resistance to current saturation of the magnetic core.

[0113] In another embodiment, regarding the configuration of the core assembly 20, the materials used to construct the first magnetic pillar 200 and the third magnetic pillar 202 are different from the materials used to construct the rest of the core assembly 20. For example, the first magnetic pillar 200 and the third magnetic pillar 202 are made of ferrite material, while the rest of the core assembly 20 is made of iron powder material with distributed air gaps. This results in low core loss and high equivalent inductance of the two windings of the core assembly 20. In some embodiments, the sum of the cross-sectional areas of the second magnetic pillar 201 and the fourth magnetic pillar 203 is greater than the sum of the cross-sectional areas of the first magnetic pillar 200 and the third magnetic pillar 202. Furthermore, the cross-sectional area of ​​the second magnetic pillar 201 is approximately equal to the cross-sectional area of ​​the fourth magnetic pillar 203, with an error within ±20%, and the cross-sectional area of ​​the first magnetic pillar 200 is approximately equal to the cross-sectional area of ​​the third magnetic pillar 202, with an error within ±20%.

[0114] In some embodiments, the output terminals of the first winding 21 and the second winding 22 can be short-circuited together on the outside of the third magnetic post 202 (i.e., on the outside of the power conversion module 1) and electrically connected to the positive output pin 63. Furthermore, the first winding 21 and the second winding 22 are not limited to being composed of a portion of the conductor 40 structure. In some embodiments, the first winding 21 and the second winding 22 can be composed of two copper strips embedded in the main body layer 30, or two copper strips directly embedded within the magnetic core assembly 20 and located between the first magnetic cover 26 and the second magnetic cover 27. Even further, the first winding 21 and the second winding 22 composed of two copper strips may contain an insulating medium at the intersection of the connecting area 206 to isolate the first winding 21 and the second winding 22 through the insulating medium (not shown).

[0115] Please refer to the following: Figure 4A and Figure 4B In some embodiments, the conductor 40 may be, for example, composed of at least one copper layer, and may be distributed on the outer and inner walls of the main body layer 30, or, as... Figure 4C , Figure 4D , Figure 4Eand Figure 4F As shown, the conductor 40 can be pre-embedded within the main body layer 30. The manufacturing process of the conductor 40 can be found in [reference needed]. Figure 4C , Figure 4D , Figure 4E and Figure 4F The description is as follows. First, it will be as follows: Figure 4C The first copper foil layer 40a, the first PP layer 40b, the first copper plate layer 40c, the second PP layer 40d, the second copper plate layer 40e, the third PP layer 40f, and the second copper foil layer 40g, totaling seven layers, are laminated together to form a printed circuit board. The second PP layer 40d insulates between the first copper plate layer 40c and the second copper plate layer 40e. Then, as shown... Figure 4D and Figure 4E As shown, the aforementioned laminated printed circuit board is milled with two magnetic core grooves 40h through surface etching and milling. After a controlled depth milling process, the first copper layer 40c and the second copper layer 40e will be milled out as shown. Figure 4F The first winding 21, the second winding 22, and two through holes 40k surrounded by the first winding 21 and the second winding 22. As described above, the first copper plate layer 40c and the second copper plate layer 40e are insulated from each other by a second PP layer 40d. In other words, the intersection areas of the winding copper strips of the first copper plate layer 40c and the winding copper strips of the second copper plate layer 40e are insulated from each other by an insulating medium (i.e., the second PP layer 40d). The inner sidewalls 40i and the outer sidewalls 40j of the copper strips constituting the first winding 21 and the second winding 22 are shorted by side electroplating to form the respective input and output terminals of the first winding 21 and the second winding 22, as shown. Figure 4F As shown, the first winding 21 and the second winding 22 are ultimately separated by a PP layer at the middle crossing position, and the first winding 21 and the second winding 22 in the middle crossing area are not connected by sidewall circuits; at the non-crossing position, the copper strips constituting the first winding 21 and the second winding 22 are shorted by side plated shorting. This achieves the highest copper fill rate of the printed circuit board and the lowest equivalent DC resistance of the windings. In addition, the two magnetic core slots 40h can respectively accommodate the second magnetic post 201 and the fourth magnetic post 203, and the two through holes 40k can respectively accommodate the first magnetic post 200 and the third magnetic post 202.

[0116] The conductor 40 includes a first connecting portion 401, a second connecting portion 402, a third connecting portion 404, and a fourth connecting portion 403. The first connecting portion 401 is at least partially exposed on the first surface 31 and forms two power device pin surfaces 41 in the power conversion module 1, for use in achieving connection with… Figure 6The power devices 50a and 50b are connected to their respective power device pins SW. The second connection portion 402 and the third connection portion 404 are at least partially exposed on the first surface 31 and the second surface 32 to form the input positive terminal pin surface 42 and the output negative terminal pin surface 44 in the power conversion module 1, respectively. The input positive terminal pin surface 42 is used to realize… Figure 6 The connection of the positive input terminal Vin+ is shown, and the negative output terminal pin 44 is used to implement... Figure 6 The output negative terminal Vo- is connected upwards to the GND network of power device layer 5 and downwards to the GND network of pin layer 6. The fourth connection portion 403 is at least partially exposed on the second surface 32, for example forming the output positive terminal pin surface 43 in the power conversion module 1. The conductor 40 may also include other connections, wherein the first end face of these connections is at least partially exposed on the first surface 31, and the second end face is at least partially exposed on the second surface 32, thereby forming the signal control pin surface 45 and the detection signal pin surface 46 (e.g., ...). Figure 4A As shown), the signal control pin surface 45 is used to realize the signal connection between the power switch layer 5 and the pin layer 6 of the power conversion module 1, or to realize the transmission of control signals between at least one power device in the power conversion module 1 and the system board. The detection signal pin surface 46 is used to realize the electrical connection of the sampling signal of the power conversion module 1.

[0117] The positive input pin 62 of the pin layer 6 is electrically connected to the positive input pin surface 42 of the conductor 40 exposed on the second surface 32. The positive output pin 63 is electrically connected to the positive output pin surface 43 of the conductor 40 exposed on the second surface 32. The negative output pin 64 is electrically connected to the negative output pin surface 44 of the conductor 40 exposed on the second surface 32. The signal control pin 65 is electrically connected to the signal control pin surface 45 of the conductor 40 exposed on the second surface 32. The detection signal pin 66 is electrically connected to the detection signal pin surface 46 of the conductor 40 exposed on the second surface 32. The positive input contact 532 of the power device layer 5 is electrically connected to the positive input pin surface 42 of the conductor 40 exposed on the first surface 31; the power device contact 531 is electrically connected to the power device pin surface 41 of the conductor 40 exposed on the first surface 31; the negative output contact 534 is electrically connected to the negative output pin surface 44 of the conductor 40 exposed on the first surface 31; the signal control contact 535 is electrically connected to the signal control pin surface 45 of the conductor 40 exposed on the first surface 31; and the detection signal contact 536 is electrically connected to the detection signal pin surface 46 of the conductor 40 exposed on the first surface 31.

[0118] Of course, the aforementioned output positive terminal pin surface 43, input positive terminal pin surface 42, output negative terminal pin surface 44, signal control pin surface 45 and detection signal pin surface 46 exposed on the second surface 32 can be used as external pins of the power conversion module 1 and directly electrically connected to the system board. Therefore, the power conversion module 1 may not include the pin layer 6, which can reduce the thickness of the power conversion module 1.

[0119] In other embodiments, the main body layer 30 and the conductor 40 of the magnetic component 2 can be integrated into a single structure through a molding process. The main body layer 30 may be made of, for example, epoxy molding compound or printed circuit board material, and this invention is not limited thereto. Furthermore, it is worth noting that, in order to effectively improve the power density of the power conversion module 1, the main body layer 30 of this invention uses a multilayer printed circuit board, and embeds, for example, a magnetic core assembly and the conductor 40 within the multilayer printed circuit board to form the magnetic component 2. The first winding 21 and the second winding 22, formed by the conductor 40, are located on different layers of the multilayer printed circuit board. The output terminals of the power devices 50a and 50b can be directly electrically connected to the magnetic component 2.

[0120] Depend on Figure 2A , Figure 2B , Figure 4C , Figure 4D , Figure 4E and Figure 4F As shown, the main body layer 30 and the conductor 40 (including the first winding 21 and the second winding 22) formed by the laminated printed circuit board are an integral structure, while the magnetic core assembly 20 is a separate independent component, which is different from the integral structure formed by the main body layer 30 and the conductor 40. The magnetic core assembly 20 and the conductor 40 are combined to form an inductor or transformer.

[0121] To reduce the horizontal and vertical assembly tolerances between the main body layer 30, the conductor 40, and the magnetic core assembly 20, and to avoid drawbacks such as low space utilization of the magnetic assembly, small effective cross-section of the magnetic core assembly 20, low inductance, and high inductor core loss, in some embodiments, a similar structure can be formed on the integral structure composed of the main body layer 30 and the conductor 40 by pressing iron powder material. Figure 4A The magnetic core assembly 20 shown is manufactured on an integral structure (hereinafter referred to as integral structure A) consisting of a main body layer 30 and a conductor 40. Figure 4A The flow chart for the magnetic core assembly 20 shown can be found in [reference]. Figure 4G The description is as follows. When completed as follows... Figure 4C , Figure 4D , Figure 4E and Figure 4F The manufacturing process shown constitutes, for example, the manufacturing process shown. Figure 4G The integrated structure A shown (i.e., equivalent to) Figure 2A , Figure 2B When the integrated structure of the main body layer 30 and conductor 40 is shown, the integrated structure A is fixed in the hollow cavity of the mold (not shown).

[0122] Next, a measured amount of magnetic powder material is filled into the cavity of the mold, filling the slots 33 and covering the two core slots 40h and the two through holes 40k. The magnetic powder material is then pressed together, causing the magnetic powder particles to bond together to form the core assembly 20. The magnetic powder material located in the two core slots 40h has a structure similar to... Figure 2A The second magnetic pillar 201 and the fourth magnetic pillar 203 shown are made of magnetic powder material located within the two through holes 40k, which is similar to... Figure 2A The first magnetic post 200 and the third magnetic post 202 shown are formed by magnetic powder material on opposite sides of the laminated printed circuit board, constituting the first magnetic cover and the second magnetic cover. Furthermore, the magnetic core assembly 20 is further bonded to the integral structure A, thereby forming an integrally molded magnetic assembly 2, as shown. Figure 4A , Figure 4B As shown, the first surface of the first magnetic cover and the first surface of the second magnetic cover constitute two opposing outer surfaces of the magnetic core assembly 20. The first surface of the first magnetic cover is approximately parallel to the first surface 31 of the main body layer 30, and the first surface of the first magnetic cover is adjacent to the first surface 31 of the main body layer 30 compared to the first surface of the second magnetic cover. The first surface of the second magnetic cover is approximately parallel to the second surface 32 of the main body layer 30, and the first surface of the second magnetic cover is adjacent to the second surface 32 of the main body layer 30 compared to the first surface of the first magnetic cover. Furthermore, the height of the first surface of the first magnetic cover may be lower than the height of the first surface 31 of the main body layer 30, so that the first surface of the first magnetic cover and the first surface 31 of the main body layer 30 jointly define a first recessed area. The first recessed area can accommodate components, such as input capacitor Cin. Of course, the height of the first surface of the first magnetic cover may be equal to the height of the first surface 31 of the main body layer 30. In addition, the height of the first surface of the second magnetic cover can be higher than the height of the second surface 32 of the main body layer 30, so that the first surface of the second magnetic cover and the second surface 32 of the main body layer 30 jointly define the second recessed area. The second recessed area can accommodate components, such as output capacitor Co, etc. In this way, the external pins on the second surface 32 of the main body layer 30 can be directly electrically connected to the system board, that is, the second surface 32 of the main body layer 30 can be used as the external soldering surface of the power conversion module; or a power component layer 5 can be provided on the first surface 31 of the main body layer 30, and a pin layer 6 can be provided on the second surface 32, and the pin layer 6 can be fixed and electrically connected to the system board.

[0123] In one embodiment, the first magnetic post 200, the second magnetic post 201, the third magnetic post 202 and the fourth magnetic post 203 are formed by filling magnetic powder material, and are subsequently assembled with the first magnetic cover 26 and the second magnetic cover 27 to form a magnetic core assembly 20.

[0124] The formation of the magnetic core assembly 20 by pressing magnetic powder material into an integral structure A containing the main body layer 30 and the conductor 40 has several advantages. It realizes the integration of circuit and magnetic circuit, and the horizontal and vertical assembly tolerances between the integral structure A and the magnetic core assembly 20 can be very small or even non-existent, which greatly improves the space utilization of the magnetic core assembly 20, increases the effective cross-section of the magnetic core assembly 20, increases the inductance of the magnetic component 2, and reduces the core loss of the magnetic component 2.

[0125] The following will further illustrate various possible implementations of the power conversion module, and since the structures of the power conversion modules in the following implementations are all similar... Figure 1A , Figure 1B , Figure 2A , Figure 2B The power conversion module 1 shown is used hereafter; therefore, it will be referred to by the same symbol to indicate that the components have similar structures and functions, and will not be described in detail again.

[0126] Figure 7 This is a three-dimensional and partial perspective structural diagram of the power conversion module of the second preferred embodiment of this case. The power conversion module 1b of this embodiment and... Figure 1A , Figure 1B The difference in power conversion module 1 shown is that power conversion module 1b will be composed of... Figure 2A The two half-bridge arms and component assembly 51 formed by the power devices 50a and 50b shown are all embedded in the printed circuit board 52, thereby reducing the process difficulty of the conversion module 1b in the printed circuit board assembly (PCBA). There are no electronic components on the first surface 520 of the printed circuit board 52, which is conducive to the installation of the heat sink (not shown).

[0127] Figure 8A and Figure 8B These are three-dimensional structural diagrams of the power conversion module in the third preferred embodiment of this case, viewed from different angles. Figure 9A and Figure 9B for Figure 8A The diagram shows the exploded structure of the power conversion module from different perspectives. The power conversion module 1c in this embodiment can also be configured as shown below. Figure 6 The circuit topology is shown. The power conversion module 1c includes at least one power device, a magnetic component 2, and a printed circuit board 8. The magnetic component 2 includes a magnetic core assembly 20, a first winding 21a, and a second winding 22a, wherein the structure of the magnetic core assembly 20 and the manner in which the first winding 21a and the second winding 22a are arranged in the magnetic core assembly 20 are the same as described above. Figure 1A The structure of the magnetic core assembly 20 of the disclosed power conversion module 1 and the manner in which the first winding 21 and the second winding 22 are arranged in the magnetic core assembly 20 will not be described in detail here.

[0128] The printed circuit board 8 is partially located between the first magnetic cover 26 and the second magnetic cover 27 of the magnetic core assembly 20, and partially exposed outside the first magnetic cover 26 and the second magnetic cover 27 of the magnetic core assembly 20. The printed circuit board 8 can be composed of a multilayer printed circuit board. The printed circuit board 8 includes a first surface 80 and a second surface 81. The first surface 80 is adjacent to the first magnetic cover 26, and the second surface 81 is adjacent to the second magnetic cover 27. The first magnetic cover 26 can be fastened to the printed circuit board 8 by the first surface 80, and the second magnetic cover 27 can be fastened to the printed circuit board 8 by the second surface 81.

[0129] In some embodiments, the printed circuit board 8 can be divided into a first region C and a second region D, which are arranged adjacent to each other on the left and right. The second region D is roughly corresponding to the position of the magnetic core assembly 20 and is assembled with the first magnetic cover 26 and the second magnetic cover 27. The second surface 81 is recessed inward at the position corresponding to the second region D, forming a recessed area 86, so the second magnetic cover 27 can be accommodated in the recessed area 86. The first region C is misaligned with the magnetic core assembly 20 and exposed outside the magnetic core assembly 20. In addition, the printed circuit board 8 also includes two through holes 82 and 83 and two magnetic core slots 84 and 85 on the second region D. The through holes 82 and 83 are respectively positioned opposite to the first magnetic post 200 and the third magnetic post 202, so that the first magnetic post 200 and the third magnetic post 202 can pass through when the first magnetic cover 26 and the second magnetic cover 27 are fastened to the second region D of the printed circuit board 8. Two magnetic core slots 84 and 85 are formed by indentation from the two opposite outer sides of the printed circuit board 8, and are respectively positioned opposite to the second magnetic post 201 and the fourth magnetic post 203, so as to accommodate the second magnetic post 201 and the fourth magnetic post 203 respectively when the first magnetic cover 26 and the second magnetic cover 27 are fastened on the second area D of the printed circuit board 8.

[0130] In some embodiments, the first winding 21a and the second winding 22a may be formed by two copper strips (not shown) embedded in a printed circuit board 8, or by two copper strips directly embedded in the magnetic core assembly 20 between the first magnetic cover 26 and the second magnetic cover 27. Furthermore, the first winding 21a and the second winding 22a formed by the two copper strips may contain an insulating medium at the intersection of the connecting area 206 to isolate the first winding 21a and the second winding 22a through the insulating medium (not shown). Of course, if the aforementioned two copper strips are directly embedded in the magnetic core assembly 20 to form the first winding 21a and the second winding 22a...

[0131] At least one power device, such as power devices 50a and 50b, is disposed correspondingly and parallel to each other on the first surface 80 of the printed circuit board 8 and located in the first region C. Each power device 50a and 50b includes two switches and forms a half-bridge arm (for example, power device 50a can be configured as follows). Figure 6 The diagram shows a switch Q. 1A Q 2A The half-bridge arm, with power devices 50b, can be configured as follows: Figure 6 The diagram shows a switch Q. 1N Q 2N (half-bridge arms), each half-bridge arm can be connected to the input capacitor Cin (see [link to relevant documentation]). Figure 6 The two half-bridge arms are electrically connected, and the drive signals received by them are 180° out of phase. In some embodiments, the top surfaces of the power devices 50a and 50b are on the same horizontal plane as the top surface of the first magnetic cover 26 of the core assembly, which facilitates the installation of the heat sink (not shown).

[0132] In other embodiments, the power conversion module 1c may further include a component assembly 51 disposed on the first surface 80 of the printed circuit board 8 and located in the first region C. The component assembly 51 may include capacitors, but is not limited thereto.

[0133] In some embodiments, the power conversion module 1c further includes a pin layer disposed on the second surface 81 of the printed circuit board 8. The pin layer includes a signal control and detection signal pin 65a, an input positive pin 64a, an output negative pin 62a, and an output positive pin 63a sequentially arranged from the first region C to the second region D of the second surface 81 of the printed circuit board 8. The input positive pin 64a is used to implement... Figure 6 The connection of the positive input terminal Vin+ is shown, and the negative output terminal pin 62a is used to achieve... Figure 6 The output negative terminal Vo- shown is connected to the signal control and detection signal pin 65a, which is used to realize the signal connection of the power conversion module 1c and to realize the transmission of control signals between at least one power device in the power conversion module 1c and the system board. The output positive terminal pin 63a is used to realize... Figure 6 The output positive terminal Vo+ is shown.

[0134] In some embodiments, the power conversion module 1c further includes an input capacitor layer or at least one input capacitor assembly to form Figure 6 The input capacitance Cin shown is (in) Figure 9A The above example illustrates an input capacitor Cin, which is composed of an input capacitor assembly. The input capacitor Cin is embedded in the printed circuit board 8 and located in the first region C, and the input capacitor Cin is preferably positioned close to the power devices 50a and 50b.

[0135] Of course, in other embodiments, the printed circuit board 8 is further provided with multiple different conductors (not shown) to form a signal control and detection signal interface, an output negative terminal interface, an input positive terminal interface, and an output positive terminal interface, wherein the input positive terminal interface is used to realize Figure 6The connection shown is for the positive input terminal Vin+, and the negative output terminal is used to achieve... Figure 6 The connection of the output negative terminal Vo- shown is used for signal connection of the power conversion module 1c and transmission of control signals between at least one power device in the power conversion module 1c and the system board. The output positive terminal is used to realize... Figure 6 The output positive terminal Vo+ is shown.

[0136] Compared to Figure 2A The magnetic component 2 and the power device of the power conversion module 1 shown are stacked vertically. Since the power device and the magnetic component of the power conversion module 1c in this embodiment are arranged in a left-right manner on the first area C and the second area D of the printed circuit board 8, the overall thickness of the power conversion module 1c can be reduced.

[0137] Depend on Figures 8A to 9B As shown, the printed circuit board 8 and the magnetic core assembly 20 are two independent components. However, in order to reduce the horizontal and vertical assembly tolerances between the printed circuit board 8, the first winding 21, the second winding 22, and the magnetic core assembly 20, and to avoid disadvantages such as low space utilization of the power conversion module, small effective cross-section of the magnetic core assembly 20, low inductance of the inductor, and high inductor core loss, in some embodiments, similar to the foregoing, iron powder material can be pressed onto the printed circuit board 8 to form a structure similar to... Figure 9A The magnetic core assembly 20 shown comprises a first magnetic post 200, a second magnetic post 201, a third magnetic post 202, and a fourth magnetic post 203. These are subsequently assembled with a first magnetic cover 26b and a second magnetic cover 27b to form the magnetic core assembly on the printed circuit board 8. A similar structure is formed on the printed circuit board 8 by pressing iron powder material. Figure 9A The manufacturing process of the first magnetic pillar 200, the second magnetic pillar 201, the third magnetic pillar 202, and the fourth magnetic pillar 203 of the magnetic core assembly 20 shown is as follows: First, provide as shown... Figure 9A , Figure 9B The printed circuit board 8 shown can be divided into a first region C and a second region D. The first winding 21a and the second winding 22a can be formed by two copper strips (not shown) embedded in the second region D of the printed circuit board 8 or by the internal wiring of the printed circuit board 8. The printed circuit board 8 also includes two through holes 82 and 83 and two magnetic core slots 84 and 85 in the second region D.

[0138] Next, the printed circuit board 8 is fixed in the hollow cavity of the mold (not shown).

[0139] Then, a measured amount of magnetic powder material is filled into the hollow cavity of the mold, filling the through holes 82 and 83 and the two magnetic core slots 84 and 85. The magnetic powder material is then pressed together, causing it to bond and form an iron powder core, thus forming a magnetic column. The second magnetic column 201a and the fourth magnetic column 203a, formed by the magnetic powder material located in the two magnetic core slots 84 and 85, are similar to... Figure 9A , Figure 9B The second magnetic pillar 201 and the fourth magnetic pillar 203 shown are similar to the first magnetic pillar 200a and the third magnetic pillar 202a, which are made of magnetic powder material located in the two through holes 82 and 83. Figure 9A , Figure 9B The first magnetic pillar 200 and the third magnetic pillar 202 are shown, and all magnetic pillars are integrally formed and further bonded to the printed circuit board 8. Each magnetic pillar has a first end and a second end disposed opposite to each other. The first end of each magnetic pillar is flush with the first surface 80 of the printed circuit board 8, and the second end of each magnetic pillar is flush with the second surface 81 of the printed circuit board 8 (e.g., ...). Figure 10 (As shown).

[0140] Then, the first magnetic cover 26b, which has a planar structure, is fastened to the second region D of the printed circuit board 8 from the first surface 80, and the second magnetic cover 27b is fastened to the second region D of the printed circuit board 8 from the second surface 81. This makes the first magnetic cover 26b, the second magnetic cover 27b, the first magnetic post 200a, the second magnetic post 201a, the third magnetic post 202a, and the fourth magnetic post 203a constitute a magnetic core assembly. The magnetic core assembly, together with the first winding 21a and the second winding 22a, constitutes a magnetic assembly (e.g., ...). Figure 8A , Figure 8B (As shown).

[0141] In some embodiments, the first surface 26c of the first magnetic cover 26b is higher than the first surface 80 of the printed circuit board 8, and the first surface 26c of the first magnetic cover 26b is substantially on the same plane as the power devices, such as power devices 50a and 50b, located on the first surface 80 of the printed circuit board 8 and in the first region C. The first surface 27c of the second magnetic cover 27b is higher than the second surface 81 of the printed circuit board 8.

[0142] In some embodiments, Figure 10 The first magnetic cover 26b and the second magnetic cover 27b shown can also be made of magnetic powder material. That is, when the printed circuit board 8 is fixed in the hollow cavity of the mold (not shown), a certain amount of magnetic powder material, in addition to filling the through holes 82, 83 and the two magnetic core slots 84, 85, is also pressed onto the opposite sides of the printed circuit board 8 to form the first magnetic cover and the second magnetic cover. This makes the first magnetic cover and the second magnetic cover integrally formed with the first magnetic post 200a, the second magnetic post 201a, the third magnetic post 202a, and the fourth magnetic post 203a, which is similar to... Figure 8A , Figure 8B As shown.

[0143] In summary, this invention provides a power conversion module and its magnetic component. The input terminal of the first winding of the magnetic component of the power conversion module is located in a first winding channel between a first magnetic post and a second magnetic post. The output terminal of the first winding is located in a second winding channel between a third magnetic post and a fourth magnetic post. The input terminal of the second winding is located in a second winding channel between a first magnetic post and a fourth magnetic post. The output terminal of the second winding is located in a second winding channel between a second magnetic post and a third magnetic post. By arranging the two windings in a cross configuration, the distance between the output terminals of the two coupled inductors formed by the two windings and the output terminals of the power conversion module can be approximately equal. This significantly reduces the asymmetry of the equivalent DC series resistance of the two coupled inductors, making the difference between the DC flux generated by the DC currents of the two inductors at the first magnetic post close to zero, thus reducing the risk of saturation of the first magnetic post. Simultaneously, the difference between the DC flux generated by the DC currents of the two inductors at the third magnetic post close to zero, further reducing the risk of saturation of the third magnetic post. Furthermore, by configuring the first and second windings, the distance between the output terminals of the two coupled inductors and the output terminals of the power conversion module can be minimized, and the equivalent DC series resistance of the two inductors can be controlled to a minimum, thus minimizing the conduction loss and improving the conversion efficiency of the power conversion module.

[0144] This case may be modified in various ways by those skilled in this technology, but all of them shall not deviate from the protection sought by the appended claims.

Claims

1. A magnetic component comprising: A magnetic core assembly, comprising: The first magnetic column; A second magnetic column; A third magnetic post is positioned opposite to the first magnetic post; A fourth magnetic post is disposed opposite to the second magnetic post, wherein the first magnetic post and the third magnetic post are located between the second magnetic post and the fourth magnetic post; A first winding channel includes a first portion formed between the first magnetic post and the second magnetic post, and a second portion formed between the second magnetic post and the third magnetic post; and A second winding channel includes a first portion formed between the first magnetic post and the fourth magnetic post, and a second portion formed between the third magnetic post and the fourth magnetic post; A first winding, wherein an input terminal of the first winding is disposed in the first portion of the first winding channel, and an output terminal of the first winding is disposed in the second portion of the second winding channel; as well as A second winding, wherein an input terminal of the second winding is disposed within the first portion of the second winding channel, and an output terminal of the second winding is disposed within the second portion of the first winding channel; The magnetic reluctance of the second magnetic post and the magnetic reluctance of the fourth magnetic post are greater than the magnetic reluctance of the first magnetic post and the magnetic reluctance of the third magnetic post, respectively. The overall structure of the magnetic core assembly, the first winding, and the second winding are mirror-symmetrical with respect to an extension line passing through the first magnetic post and the third magnetic post.

2. The magnetic component as claimed in claim 1, wherein, The length of the air gap of the second magnetic post and the length of the air gap of the fourth magnetic post are respectively greater than the length of the air gap of the first magnetic post and the length of the air gap of the third magnetic post, and the direction of the DC current flowing through the first winding is the same as the direction of the DC current flowing through the second winding.

3. The magnetic component as claimed in claim 1, wherein, The second winding channel is connected to the first winding channel via a connecting region, and the first winding is also partially disposed within the connecting region, so that the first winding is connected to the first winding channel and the second winding channel via the connecting region. The second winding is also partially disposed within the connecting region, so that the second winding is connected to the first winding channel and the second winding channel via the connecting region.

4. The magnetic component as claimed in claim 1, wherein, The output terminals of the first winding and the second winding are short-circuited together.

5. The magnetic component as claimed in claim 1, wherein, The second magnetic column and the fourth magnetic column each include an air gap, while the first magnetic column and the third magnetic column have no air gap.

6. The magnetic component as claimed in claim 1, wherein, The magnetic core assembly further includes a first magnetic cover and a second magnetic cover disposed opposite to each other, and the first magnetic post, the second magnetic post, the third magnetic post and the fourth magnetic post are respectively located between the first magnetic cover and the second magnetic cover.

7. The magnetic component as claimed in claim 6, wherein, Each of the first, second, third, and fourth magnetic pillars includes an air gap, wherein the air gap of each of the first, second, third, and fourth magnetic pillars is located in the upper region of the corresponding magnetic pillar and adjacent to the first magnetic cover, the air gap of each of the magnetic pillars is located in the lower region of the corresponding magnetic pillar and adjacent to the second magnetic cover, or the air gap of each of the magnetic pillars is located in the middle region of the corresponding magnetic pillar.

8. The magnetic component as claimed in claim 6, wherein, The magnetic component further includes: A main body layer includes a first surface and a second surface, the first surface and the second surface being two opposing surfaces, wherein the magnetic core assembly is embedded in the main body layer, and the first magnetic cover of the magnetic core assembly is adjacent to the first surface, and the second magnetic cover of the magnetic core assembly is adjacent to the second surface. as well as A conductor is embedded between the first surface and the second surface of the main body layer, and at least partially exposed on the first surface or the second surface, and includes the first winding and the second winding.

9. The magnetic component as claimed in claim 8, wherein, The height of the first surface of the main body layer is higher than an upper surface of the first magnetic cover of the magnetic core assembly, and the height of the second surface of the main body layer is lower than a lower surface of the second magnetic cover of the magnetic core assembly.

10. The magnetic component of claim 1, wherein, The first and third magnetic pillars are made of different materials than the rest of the magnetic core assembly.

11. The magnetic component of claim 10, wherein, The first and third magnetic pillars are made of ferrite material, and the remaining parts of the magnetic core assembly are made of iron powder material with distributed air gaps.

12. The magnetic component as claimed in claim 1, wherein, The DC current flowing through the first winding enters from the input terminal of the first winding and exits from the output terminal of the first winding; the DC current flowing through the second winding enters from the input terminal of the second winding and exits from the output terminal of the second winding.

13. The magnetic component as claimed in claim 1, wherein, A first voltage connected across the input and output terminals of the first winding is 180° out of phase with a second voltage connected across the input and output terminals of the second winding.

14. The magnetic component as claimed in claim 1, wherein, The sum of the cross-sectional areas of the second and fourth magnetic pillars is greater than the sum of the cross-sectional areas of the first and third magnetic pillars.

15. The magnetic component as claimed in claim 1, wherein, The cross-sectional area of ​​the second magnetic post is approximately equal to that of the fourth magnetic post, with an error within ±20%.

16. The magnetic component of claim 1, wherein, The cross-sectional area of ​​the first magnetic post is approximately equal to that of the third magnetic post, with an error within ±20%.

17. The magnetic component of claim 1, wherein, The two windings are composed of two copper strips, which are embedded within the magnetic core assembly; or the two windings are composed of copper strips embedded in a printed circuit board; or at the intersection of the first winding and the second winding, the copper strips constituting the first winding and the second winding are isolated by an insulating medium of the printed circuit board; or at the non-intersection of the first winding and the second winding, the copper strips on the insulating medium of the printed circuit board and the copper strips under the insulating medium are shorted by side electroplating to form the input terminal and the output terminal of the first winding and the second winding, respectively.

18. A power conversion module, comprising: A magnetic component as claimed in claim 1; and Two power devices, one of which is electrically connected to the input terminal of the first winding, and the other of which is electrically connected to the input terminal of the second winding.

19. The power conversion module as described in claim 18, wherein, The magnetic core assembly further includes a first magnetic cover and a second magnetic cover disposed opposite to each other, and the first magnetic post, the second magnetic post, the third magnetic post and the fourth magnetic post are respectively located between the first magnetic cover and the second magnetic cover.

20. The power conversion module as claimed in claim 19, wherein, The power conversion module further includes a printed circuit board, partially located between the first magnetic cover and the second magnetic cover, and the printed circuit board includes a first surface and a second surface, the first surface being opposite to the second surface and adjacent to the first magnetic cover, the second surface being adjacent to the second magnetic cover, and the two power devices being disposed on the first surface.

21. The power conversion module as described in claim 20, wherein, The printed circuit board includes a first region and a second region, which are arranged adjacent to each other on the left and right sides. The second region corresponds to the position of the magnetic core assembly, and the first region is offset from the magnetic core assembly and exposed to the magnetic core assembly.

22. The power conversion module as described in claim 21, wherein, The two power devices are located in the first area of ​​the printed circuit board.

23. The power conversion module as described in claim 22, wherein, The top surfaces of the two power devices are on the same horizontal plane as the top surface of the first magnetic cover.

24. The power conversion module as described in claim 21, wherein, The power conversion module further includes a pin layer disposed on the second surface of the printed circuit board, and includes a signal control and detection signal pin, an input positive terminal pin, an output negative terminal pin and an output positive terminal pin arranged sequentially from the first region to the second region.

25. The power conversion module as described in claim 21, wherein, The power conversion module also includes at least one input capacitor, which is embedded in the printed circuit board and located in the first region.

26. The power conversion module as described in claim 20, wherein, The two power devices are embedded within the printed circuit board.

27. The power conversion module as described in claim 19, wherein, The magnetic component further includes: A main body layer includes a first surface and a second surface, wherein the first surface and the second surface of the main body layer are two opposing surfaces, wherein the magnetic core assembly is embedded in the main body layer, and the first magnetic cover of the magnetic core assembly is adjacent to the first surface of the main body layer, and the second magnetic cover of the magnetic core assembly is adjacent to the second surface of the main body layer. as well as A conductor is embedded between the first surface and the second surface of the main body layer, and at least partially exposed on the first surface and the second surface of the main body layer, and includes the first winding and the second winding.

28. The power conversion module as claimed in claim 27, wherein, The power conversion module further includes a power device layer disposed on the first surface of the main body layer, wherein the power device layer includes the two power devices, and the two power devices are electrically connected to the conductor.

29. The power conversion module as described in claim 28, wherein, The power device layer includes a printed circuit board, wherein the printed circuit board includes a first surface and a second surface opposite to each other, the second surface being adjacent to the first surface of the body layer.

30. The power conversion module as described in claim 29, wherein, The two power devices are disposed on the first surface of the printed circuit board.

31. The power conversion module as described in claim 29, wherein, The two power devices are embedded within the printed circuit board.

32. The power conversion module as described in claim 18, wherein, Each of the power devices comprises two switches forming a half-bridge arm, and the drive signals received by the two power devices are 180° out of phase.

33. The power conversion module as described in claim 18, wherein, The output terminals of the first winding and the second winding are short-circuited together and electrically connected to a positive output pin of the power conversion module.

34. A magnetic component comprising; A printed circuit board has at least one first winding and one second winding built in it. The first winding intersects with the second winding via a connecting region. The printed circuit board includes two through holes and two magnetic core slots. The two through holes are surrounded by the first winding and the second winding. The two through holes and the two magnetic core slots are filled with magnetic powder material. The magnetic powder material is pressed to form a first magnetic post and a third magnetic post in the two through holes, and a second magnetic post and a fourth magnetic post in the two magnetic core slots, respectively. The magnetic reluctance of the second magnetic post and the magnetic reluctance of the fourth magnetic post are greater than the magnetic reluctance of the first magnetic post and the magnetic reluctance of the third magnetic post, respectively. The second magnetic post, the fourth magnetic post, the first winding, and the second winding are mirror-symmetrical about an extension line passing through the first magnetic post and the third magnetic post.

35. The magnetic component of claim 34, wherein the magnetic component further comprises a first magnetic cover and a second magnetic cover, and the first magnetic cover and the second magnetic cover are respectively fastened to the printed circuit board from opposite sides of the printed circuit board, and together with the at least one first magnetic post and the at least one winding, constitute the magnetic component. in, The first magnetic post has a first end and a second end disposed opposite to each other. The first end of the first magnetic post is flush with the first surface of the printed circuit board, and the second end of the first magnetic post is flush with the second surface of the printed circuit board.

36. The magnetic component of claim 34, wherein the magnetic component further comprises a first magnetic cover and a second magnetic cover, the first magnetic cover and the second magnetic cover being formed on opposite sides of the printed circuit board by pressing the magnetic powder material together, and being integrally formed with the first magnetic post.

37. The magnetic component of claim 34, wherein the second magnetic post is integrally formed with the first magnetic post.

38. The magnetic component of claim 35 or 36, wherein the printed circuit board has a first surface and a second surface opposite to each other, and the first magnetic cover and the second magnetic cover each have a first surface, the first surface of the first magnetic cover being adjacent to the first surface of the printed circuit board compared to the first surface of the second magnetic cover, and the first surface of the second magnetic cover being adjacent to the second surface of the printed circuit board compared to the first surface of the first magnetic cover.

39. The magnetic component of claim 38, wherein the height of the first surface of the first magnetic cover is lower than the height of the first surface of the printed circuit board, and the height of the first surface of the second magnetic cover is higher than the height of the second surface of the printed circuit board.

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