Semiconductor device and method of operating the same

Abstract

This invention discloses a semiconductor device and its operating method. The operating method includes: recording normal image information, wherein the normal image information includes a robotic arm, liquid ejected from the nozzle of the robotic arm, a wafer below the robotic arm, and liquid on the wafer; detecting a first image in a vertical direction using a first detector, wherein the first image includes the robotic arm, liquid ejected from the nozzle, a wafer below the robotic arm, and liquid on the wafer; detecting a second image in a horizontal direction using a second detector, wherein the second image includes the robotic arm, liquid ejected from the nozzle, a wafer below the robotic arm, and liquid on the wafer; and comparing the first image and the second image based on the normal image information to determine whether the state of the robotic arm, the state of the nozzle, the state of the liquid, and the state of the wafer are normal. When the semiconductor device determines that at least one of the first image and the second image is abnormal, it knows that an abnormality has occurred in the wafer during the cleaning process.

Description

TECHNICAL FIELD

[0001] The present application relates to a semiconductor device and a method for operating a semiconductor device. BACKGROUND

[0002] Generally, a semiconductor wafer cleaning process is a continuous step, such as moving a robot, placing the wafer on a rotating base, spraying liquid from a nozzle of the robot to a top surface of the wafer, and moving the rotating base to make the liquid evenly on the top surface of the wafer. If any step of the cleaning process has a problem, the wafer will have a defect. The wafer with the defect can only be found in the subsequent detection or yield. Since the cleaning process cannot be stopped in time to deal with the problem when any step of the cleaning process has a problem, the wafer loss is increased. SUMMARY

[0003] An object of the present application is to provide a semiconductor device, which can inform an operator that the wafer has an abnormality in the cleaning process when the semiconductor device determines that at least one of a first image and a second image has an abnormality.

[0004] According to an embodiment of the present application, a semiconductor device includes a rotating base, a robot, a first detector, and a second detector. The rotating base is configured to place a wafer. The robot is located above the wafer and the rotating base. The robot has a nozzle, and the nozzle is configured to spray liquid onto the wafer. The first detector is located above the robot and the rotating base. The first detector is configured to detect a first image in a vertical direction. The first image includes the robot, the liquid sprayed from the nozzle, the wafer, and the liquid on the wafer. The second detector is directed toward a side of the wafer and the rotating base. The second detector is configured to detect a second image in a horizontal direction. The second image includes the robot, the liquid sprayed from the nozzle, the wafer, and the liquid on the wafer.

[0005] In an embodiment of the present application, the first detector is located higher than the second detector.

[0006] In an embodiment of the present application, the semiconductor device further includes a processor. The processor is electrically connected to the first detector and the second detector. The processor is configured to determine whether the first image and the second image are normal.

[0007] In an embodiment of the present application, the semiconductor device further includes a memory. The memory is electrically connected to the processor. The memory is configured to store normal image information for the processor to determine whether the first image and the second image are normal.

[0008] In an embodiment of the present application, the semiconductor device further includes an alarm. The alarm is electrically connected to the processor, and the alarm is configured to issue an alarm.

[0009] A method for operating a semiconductor device is provided.

[0010] According to an embodiment of the present application, a method for operating a semiconductor device includes recording normal image information, wherein the normal image information includes a robot arm, a liquid being sprayed from a nozzle of the robot arm, a wafer under the robot arm, and the liquid on the wafer; detecting a first image in a vertical direction by a first detector, wherein the first image includes the robot arm, the liquid being sprayed from the nozzle, the wafer under the robot arm, and the liquid on the wafer; detecting a second image in a horizontal direction by a second detector, wherein the second image includes the robot arm, the liquid being sprayed from the nozzle, the wafer under the robot arm, and the liquid on the wafer; and comparing the first image and the second image according to the normal image information to determine whether a state of the robot arm, a state of the nozzle, a state of the liquid, and a state of the wafer are normal.

[0011] In an embodiment of the present application, the method further includes storing the normal image information using a memory.

[0012] In an embodiment of the present application, the comparing the first image and the second image according to the normal image information includes determining whether the state of the robot arm, the state of the nozzle, the state of the liquid, and the state of the wafer are normal using a processor electrically connected to the memory, the first detector, and the second detector.

[0013] In an embodiment of the present application, the method further includes issuing an alarm by an alarm electrically connected to the processor when the processor determines that the state of the robot arm, the state of the nozzle, the state of the liquid, and the state of the wafer are abnormal.

[0014] In an embodiment of the present application, the method further includes stopping the robot arm from moving, stopping the nozzle from spraying the liquid, and stopping a rotating base on which the wafer is placed from moving when the processor determines that the state of the robot arm, the state of the nozzle, the state of the liquid, and the state of the wafer are abnormal.

[0015] In the above-mentioned embodiment of the present application, since the semiconductor device has the first detector and the second detector, the semiconductor device can compare the first image and the second image according to the normal image information to determine whether the state of the robot arm, the state of the liquid being sprayed from the nozzle, the state of the wafer, and the state of the liquid on the top surface of the wafer are normal. In this way, when the semiconductor device determines that at least one of the first image and the second image is abnormal, the operator can know in advance that the wafer has an abnormality during the cleaning process, without waiting until the subsequent detection to find the abnormality of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0016] An embodiment of the present application will be best understood by the detailed description below when taken in conjunction with the accompanying drawings. It is emphasized that various features are not to scale in the drawings and are given by way of example in order to provide a thorough understanding of the present application. In fact, the dimensions of the various features can be arbitrarily increased or decreased for the sake of discussion.

[0017] Figure 1 A side view of a semiconductor apparatus in normal operation according to an embodiment of the present application is illustrated.

[0018] Figure 2 A block diagram of a semiconductor apparatus is illustrated. Figure 1

[0019] Figure 3 A flowchart of a method of operating a semiconductor apparatus according to an embodiment of the present application is illustrated.

[0020] Figure 4 A side view of a semiconductor apparatus in abnormal operation is illustrated. Figure 1

[0021] Principal reference numerals:

[0022] 100 - semiconductor apparatus, 110 - rotating base, 114 - side, 120 - wafer, 122 - top surface, 124 - side, 130 - mechanical arm, 132 - nozzle, 140 - first detector, 150 - second detector, 160 - processor, 170 - memory, 180 - alarm, D1 - vertical direction, D2 - horizontal direction, F - liquid, S1 - step, S2 - step, S3 - step, S4 - step. DETAILED DESCRIPTION

[0023] The contents of the embodiments disclosed below provide many different embodiments, or examples, for implementing various features of the provided subject matter. Specific examples of elements and arrangements are described to facilitate the discussion. These are, of course, merely examples and are not intended to limit the scope of the present application. Additionally, the present application can repeat elements and / or letters in various examples. This repetition is for the purpose of simplicity and clarity and does not itself dictate a relationship between the various embodiments and / or configurations discussed.

[0024] Spatially relative terms such as "beneath", "below", "lower", "above", "upper" and the like can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. ​​

[0025] Figure 1 A side view of a semiconductor device 100 according to an embodiment of the present invention during normal operation is illustrated. The semiconductor device 100 includes a rotating base 110, a robotic arm 130, a first detector 140, and a second detector 150. The rotating base 110 is configured to hold a wafer 120. The wafer 120 may be made of silicon. The robotic arm 130 is located above the wafer 120 and the rotating base 110. The robotic arm 130 has a nozzle 132, and the nozzle 132 is configured to spray liquid F onto the top surface 122 of the wafer 120. The robotic arm 130 is movable above the rotating base 110 by means of a moving device. The first detector 140 is located above the robotic arm 130 and the rotating base 110. The first detector 140 is configured to detect a first image in a vertical direction D1. The first image includes the robotic arm 130, the liquid F sprayed from the nozzle 132, the wafer 120, and the liquid F on the top surface 122 of the wafer 120. For example, when nozzle 132 ejects liquid F, the rotating base 110 can rotate to form a thin layer of liquid F on the top surface 122 of wafer 120. Liquid F can be deionized water (DIW) or a chemical solvent, and the chemical solvent can be isopropyl alcohol (IPA). A second detector 150 faces the side surface 124 of wafer 120 and the side surface 114 of rotating base 110. The second detector 150 is configured to detect a second image in the horizontal direction D2. The second image includes the robotic arm 130, the liquid F ejected from nozzle 132, wafer 120, and the liquid F on the top surface 122 of wafer 120. In some embodiments, the first detector 140 is positioned higher than the second detector 150. The first detector 140 and the second detector 150 may include a camera.

[0026] Figure 2 Draw Figure 1 Block diagram of semiconductor equipment 100. Also refer to... Figure 1 and Figure 2The semiconductor device 100 further includes a processor 160, a memory 170, and an alarm 180. The processor 160 is electrically connected to the first detector 140, the second detector 150, the memory 170, and the alarm 180. The processor 160 is configured to determine whether the first image and the second image are normal, and the memory 170 is configured to store normal image information for the processor 160 to determine whether the first image and the second image are normal. In some embodiments, the normal image information can include the robot arm 130, the liquid F being sprayed from the nozzle 132 of the robot arm 130, the wafer 120 below the robot arm 130, and the liquid F on the top surface 122 of the wafer 120. The processor 160 electrically connected to the first detector 140, the second detector 150, and the memory 170 can compare the first image and the second image by the normal image information to determine whether the state of the robot arm 130, the state of the nozzle 132, the state of the liquid F, and the state of the wafer 120 are normal. The state of the liquid F can include the state of being sprayed from the nozzle 132 and the state of being on the wafer 120.

[0027] For example, if the image of the normal image information overlaps the first image in the vertical direction D1, the semiconductor device 100 can determine that the robot arm 130, the nozzle 132, the liquid F, and the wafer 120 in the first image are in a normal state. Similarly, if the image of the normal image information overlaps the second image in the horizontal direction D2, the semiconductor device 100 can determine that the robot arm 130, the nozzle 132, the liquid F, and the wafer 120 in the second image are in a normal state. That is, the image of the normal image information overlapping the first image and the second image can indicate that the robot arm 130 moves along a correct path, and the wafer 120 is correctly placed on the predetermined position on the rotary base 110. Also, it can indicate that the time for the nozzle 132 to spray the liquid F is a correct time, and the state of the liquid F on the top surface 122 of the wafer 120 is a normal state. The liquid F being in a normal state can indicate that the rotary base 110 does not generate abnormal vibration when rotating, further representing that the rotary base 110 is operating normally.

[0028] In some embodiments, the alarm 180 is configured to issue an alarm. In detail, when the processor 160 determines that any one of the state of the robot arm 130, the state of the nozzle 132, the state of the liquid F, and the state of the wafer 120 is abnormal, the alarm 180 electrically connected to the processor 160 can issue an alarm. In addition, when the processor 160 determines that any one of the state of the robot arm 130, the state of the nozzle 132, the state of the liquid F, and the state of the wafer 120 is abnormal, the robot arm 130 can be stopped from moving, the nozzle 132 can be stopped from spraying the liquid F, and the rotating base 110 on which the wafer 120 is placed can be stopped from moving. For example, if an abnormality occurs in the cleaning process of the wafer 120, the semiconductor device 100 having the first detector 140, the second detector 150, and the processor 160 can issue an alarm through the alarm 180 and stop the cleaning process in time so that personnel can eliminate the abnormality and reduce the loss of the wafer 120.

[0029] In some embodiments, the processor 160 can include a central processing unit (CPU), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), or a combination thereof. In some embodiments, the processor 160 can be an artificial intelligence (AI) chip. The memory 170 can be any type of fixed or removable random access memory (RAM), read-only memory (ROM), flash memory, hard disk drive (HDD), solid state drive (SSD), or a combination thereof.

[0030] Figure 3A flowchart of a method of operating a semiconductor apparatus according to an embodiment of the present application is shown. The method of operating a semiconductor apparatus includes the following steps. First, in step S1, normal image information is recorded, wherein the normal image information includes a robot arm, a liquid being ejected from a nozzle of the robot arm, a wafer under the robot arm, and the liquid on the wafer. Next, in step S2, a first image is detected in a vertical direction by a first detector, wherein the first image includes the robot arm, the liquid being ejected from the nozzle, the wafer under the robot arm, and the liquid on the wafer. Then, in step S3, a second image is detected in a horizontal direction by a second detector, wherein the second image includes the robot arm, the liquid being ejected from the nozzle, the wafer under the robot arm, and the liquid on the wafer. Thereafter, in step S4, the first image and the second image are compared according to the normal image information to determine whether the state of the robot arm, the state of the nozzle, the state of the liquid, and the state of the wafer are normal. In the following description, each of the above steps will be described in detail.

[0031] Referring to Figures 1 to 3 First, in step S1, the semiconductor apparatus 100 records normal image information, wherein the normal image information includes a robot arm 130, a liquid F being ejected from a nozzle 132 of the robot arm 130, a wafer 120 under the robot arm 130, and the liquid F on a top surface 122 of the wafer 120. In some embodiments, the normal image information can be stored using a memory 170. Next, in step S2, a first image is detected in a vertical direction D1 by a first detector 140 of the semiconductor apparatus 100, wherein the first image includes the robot arm 130, the liquid F being ejected from the nozzle 132 of the robot arm 130, the wafer 120 under the robot arm 130, and the liquid F on the top surface 122 of the wafer 120. Then, in step S3, a second image is detected in a horizontal direction D2 by a second detector 150 of the semiconductor apparatus 100, wherein the second image includes the robot arm 130, the liquid F being ejected from the nozzle 132 of the robot arm 130, the wafer 120 under the robot arm 130, and the liquid F on the top surface 122 of the wafer 120. Thereafter, in step S4, the semiconductor apparatus 100 compares the first image and the second image according to the normal image information to determine whether the state of the robot arm 130, the state of the nozzle 132, the state of the liquid F, and the state of the wafer 120 are normal.

[0032] In step S4, a processor 160, electrically connected to the memory 170, the first detector 140, and the second detector 150, can determine whether the states of the robotic arm 130, the nozzle 132, the liquid F, and the wafer 120 are normal. That is, the processor 160 can determine whether the first and second images are normal based on the normal image information in the memory 170. When the processor 160 determines that the states of the robotic arm 130, the nozzle 132, the liquid F, and the wafer 120 are abnormal, an alarm can be issued via an alarm 180 electrically connected to the processor 160. Furthermore, when the processor 160 determines that the states of the robotic arm 130, the nozzle 132, the liquid F, and the wafer 120 are abnormal, it can stop the movement of the robotic arm 130, stop the nozzle 132 from spraying liquid F, and stop the movement of the rotating base 110 on which the wafer 120 is placed.

[0033] For example, if the image of normal image information overlaps with the first image in the vertical direction D1, the semiconductor device 100 can determine that the robotic arm 130, nozzle 132, liquid F, and wafer 120 in the first image are in a normal state. Similarly, if the image of normal image information overlaps with the second image in the horizontal direction D2, the semiconductor device 100 can determine that the robotic arm 130, nozzle 132, liquid F, and wafer 120 in the second image are in a normal state. In other words, the overlap of the image of normal image information with the first and second images indicates that the robotic arm 130 is moving along the correct path, and the wafer 120 is correctly placed on the rotating base 110. Furthermore, it also indicates that the time when the nozzle 132 sprays liquid F is the correct time, and the state of liquid F on the top surface 122 of the wafer 120 is normal. The normal state of liquid F indicates that the rotating base 110 does not generate abnormal vibrations during rotation.

[0034] Figure 4 Draw Figure 1 The figure shows a side view of a semiconductor device 100 during abnormal operation, for example, a schematic diagram of the abnormal state of the liquid F on the wafer 120. As shown, when the rotating base 110 vibrates abnormally during rotation, a special water layer will form on the top surface 122 of the wafer 120, for example, with an arc-shaped outer edge and droplets jumping on the surface. Figure 1 The uniform liquid F thin layer has different states. Therefore, when the semiconductor device 100 compares the first image and the second image based on normal image information, it can determine the state of the liquid through the normal image information. Figure 4 If the liquid F on wafer 120 is in an abnormal state, alarm 180 will sound and semiconductor equipment 100 will stop operating. Upon inspection by operators, it can be determined that the rotating base 110 is vibrating during rotation. Therefore, operators can promptly address the abnormality of the rotating base 110 to reduce the wear and tear on wafer 120.

[0035] In summary, since the semiconductor device has the first detector and the second detector, the semiconductor device can compare the first image and the second image through normal image information to determine the state of the robot arm, the state of the liquid when being sprayed from the nozzle, the state of the wafer, and the state of the liquid on the top surface of the wafer. In this way, when the semiconductor device determines that the first image and the second image are abnormal, the operator can know in advance that the wafer has an abnormality in the cleaning process, without waiting until the subsequent detection to find the abnormality of the wafer, so as to effectively improve the product yield.

[0036] The foregoing summary has outlined features of several embodiments so that those skilled in the art can better understand the various aspects of the application. Those skilled in the art should appreciate that they can readily apply the conception of the application as a basis for the design and construction of other processes and structures for carrying out the same purposes and / or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the application, and that they can make various changes, substitutions and alterations herein without departing from the spirit and scope of the application.

Claims

1. A semiconductor device, characterized in that, Include: A rotating base is configured to hold a wafer; A robotic arm, located above the wafer and the rotating base, has a nozzle configured to spray liquid onto the wafer. A first detector is located above the robotic arm and the rotating base, and the first detector is configured to detect a first image in a vertical direction, the first image including the robotic arm, the liquid ejected from the nozzle, the wafer, and the liquid on the wafer; as well as A second detector is positioned facing the side of the wafer and the rotating base, wherein the second detector is configured to detect a second image in a horizontal direction, the second image including the robotic arm, the liquid ejected from the nozzle, the wafer, and the liquid on the wafer.

2. The semiconductor device as claimed in claim 1, characterized in that, The position of the first detector is higher than the position of the second detector.

3. The semiconductor device as claimed in claim 1, characterized in that, Also includes: A processor is electrically connected to the first detector and the second detector, and the processor is configured to determine whether the first image and the second image are normal.

4. The semiconductor device as claimed in claim 3, characterized in that, Also includes: A memory electrically connected to the processor, and the memory is configured to store normal image information for the processor to determine whether the first image and the second image are normal.

5. The semiconductor device as claimed in claim 3, characterized in that, Also includes: An alarm is electrically connected to the processor and is configured to sound an alarm.

6. A method of operating a semiconductor device, characterized in that, Include: Record normal video information, wherein the normal video information includes a robotic arm, liquid ejected from the nozzle of the robotic arm, a wafer below the robotic arm, and the liquid on the wafer; A first image is detected in a vertical direction by a first detector, wherein the first image includes the robotic arm, the liquid ejected from the nozzle, the wafer below the robotic arm, and the liquid on the wafer; A second image is detected in the horizontal direction by a second detector, wherein the second image includes the robotic arm, the liquid ejected from the nozzle, the wafer below the robotic arm, and the liquid on the wafer; as well as The first image and the second image are compared based on the normal image information to determine whether the state of the robotic arm, the state of the nozzle, the state of the liquid, and the state of the wafer are normal.

7. The operating method as described in claim 6, characterized in that, Also includes: The normal image information is stored in a memory.

8. The operating method as described in claim 7, characterized in that, The comparison between the first image and the second image based on the normal image information includes: A processor electrically connected to the memory, the first detector, and the second detector determines whether the state of the robotic arm, the state of the nozzle, the state of the liquid, and the state of the wafer are normal.

9. The operating method as described in claim 8, characterized in that, Also includes: When the processor determines that the state of the robotic arm, the state of the nozzle, the state of the liquid, and the state of the wafer are abnormal, it issues an alarm through an alarm electrically connected to the processor.

10. The operating method as described in claim 8, characterized in that, Also includes: When the processor determines that the state of the robotic arm, the state of the nozzle, the state of the liquid, and the state of the wafer are abnormal, it stops the movement of the robotic arm, stops the nozzle from spraying the liquid, and stops the movement of the rotating base on which the wafer is placed.

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