Display Panel

Abstract

The present invention provides a display panel, which includes a display area and a non-display area. A step filling layer is arranged on the surface of the non-display area, and a touch metal lead is arranged on the step filling layer; wherein the step filling layer is used to expand the effective wiring area of ​​the touch metal lead. Compared with the prior art, the present invention increases the effective wiring width of the touch metal lead by adding a step filling layer on the surface of a packaging layer located in the non-display area, thereby reducing the height difference of the film layer at the edge of the non-display area, and having a smaller impedance. The wiring space at the frame position is increased, and the problem of excessive impedance caused by narrow wiring width and routing due to the narrowing of the frame can be effectively improved; the problem of process residue after wiring caused by excessive step difference can also be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel. Background Art

[0002] Organic light-emitting diodes have many excellent properties such as self-luminescence, low energy consumption, wide viewing angle, and fast response. The panels made of OLED devices have the characteristics of simple structure and bendability, which has aroused great interest in the scientific research and industrial circles and is considered to be a highly promising next-generation display technology.

[0003] The organic layer and cathode of OLED devices are very sensitive to water and oxygen, so when preparing OLED display panels, various means are needed to encapsulate OLED devices. Currently, thin film encapsulation technology has been successfully applied to OLED display panels. In the display area of ​​OLED display panels, TFE can ensure good properties and the entire surface can be made very flat, but there are large unevenness at the edge of the non-display area.

[0004] Due to the large height difference near the edge of the non-display area, an uneven terrain is formed. The touch lead is set on the uneven terrain, which is prone to process residue problems. The narrow frame leads to insufficient space for touch lead wiring, and the wiring width and routing are too narrow, resulting in excessive touch lead impedance. Further improvement is needed. Summary of the invention

[0005] Based on the problems of the prior art, the present application provides a display panel that can solve the problem of large height difference near the edge of the non-display area in the prior art, resulting in an uneven terrain. The touch leads are arranged on the uneven terrain. Due to the narrowing of the frame, there is insufficient space for the touch lead wiring, and the wiring width and routing are too narrow, resulting in the problem of excessive touch lead impedance.

[0006] To solve the above problems, the technical solution provided by the present invention is as follows:

[0007] An embodiment of the present invention provides a display panel, which includes a display area and a non-display area located on one side of the display area. In the non-display area, the display panel includes a substrate, a power module and a GOA circuit located on the substrate, a signal routing group located on the power module and the GOA circuit, a pixel definition layer located on the signal routing group, and an encapsulation layer located on the pixel definition layer.

[0008] The packaging layer near the edge of the non-display area is in a concave structure due to the step difference, a step difference filling layer is arranged on the concave structure, and a touch metal lead is arranged on the step difference filling layer, wherein the step difference filling layer is used to expand the effective wiring area of ​​the touch metal lead.

[0009] According to an optional embodiment of the present invention, the material of the step filling layer is an organic polymer material, and the organic polymer material is one or a combination of more than one of acrylic, hexamethyldisiloxane, polyacrylate, polycarbonate, and polystyrene.

[0010] According to an optional embodiment of the present invention, the material of the step filling layer is optically transparent glue.

[0011] According to an optional embodiment of the present invention, the material of the step filling layer is UV curable epoxy resin or moisture absorbing sealant.

[0012] According to an optional embodiment of the present invention, in the display area, the display panel includes a substrate, a TFT layer located on the substrate, a planarization layer located on the TFT layer, a pixel definition layer located on the planarization layer, a light-emitting device located in a pixel opening of the pixel definition layer, an encapsulation layer located on the light-emitting device, and a touch layer located on the encapsulation layer.

[0013] According to an optional embodiment of the present invention, the light emitting device includes an anode, a light emitting material layer located above the anode, and a cathode layer located above the light emitting material layer.

[0014] Wherein, the cathode layer is electrically connected to the power module through the signal wiring group, and the GOA circuit is electrically connected to the TFT layer.

[0015] According to an optional embodiment of the present invention, the touch metal lead array is arranged on the surface of the step filling layer, and the side of the step filling layer away from the substrate is a smooth inclined surface, curved surface or flat surface.

[0016] According to an optional embodiment of the present invention, one end of the touch metal lead is electrically connected to the touch chip, and the other end is electrically connected to the touch layer of the display area.

[0017] According to an optional embodiment of the present invention, the edge of the non-display area further includes a first crack stop block and a second crack stop block located outside the first crack stop block, and the first crack stop block is arranged close to the display area and in contact with the side surface of the step filling layer.

[0018] According to an optional embodiment of the present invention, both the first crack-stopping block and the second crack-stopping block include an organic layer and a water-blocking layer stacking module.

[0019] The beneficial effects of the present invention are as follows: an embodiment of the present invention provides a display panel, the display panel includes a display area and a non-display area, wherein a step filling layer is arranged on the surface of the non-display area, and a touch metal lead is arranged on the step filling layer; wherein the step filling layer is used to expand the effective wiring area of ​​the touch metal lead; the present invention increases the effective wiring width of the touch metal lead by adding a step filling layer on the surface of the packaging layer located in the non-display area, thereby reducing the height difference of the film layer at the edge of the non-display area, thereby increasing the wiring space at the frame position, improving the problem of excessive load caused by the narrowing of the frame, resulting in the wiring width and the routing being too narrow; and improving the problem of process residue after wiring caused by excessive step difference. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 The figure is a schematic diagram of a display panel structure in the prior art.

[0022] Figure 2 A schematic diagram of a film layer structure of a display panel is provided for an embodiment of the present invention. DETAILED DESCRIPTION

[0023] The following descriptions of the embodiments are made with reference to the attached diagrams to illustrate specific embodiments in which the present invention may be implemented. The directional terms mentioned in the present invention, such as [up], [down], [front], [back], [left], [right], [inside], [outside], [side], etc., are only with reference to the directions of the attached diagrams. Therefore, the directional terms used are used to illustrate and understand the present invention, rather than to limit the present invention. In the figures, units with similar structures are represented by the same reference numerals, and the dotted lines in the figures represent those that do not exist in the structure and only illustrate the shape and position of the structure.

[0024] like Figure 1As shown, the prior art provides a structural schematic diagram of a spliced ​​display panel 10. The display panel 10 is divided into a display area 12 and a non-display area 11. In the display area 12, the display panel 10 includes a substrate 13, a TFT layer 181 located on the substrate 13, a planarization layer 182 located on the TFT layer 181, a pixel definition layer 19 located on the planarization layer 182, a light-emitting material layer 21 located on the pixel definition layer 19, and an encapsulation layer located on the light-emitting material layer 21, wherein the encapsulation layer includes a first inorganic material layer 221, an organic material layer 222 located on the first inorganic material layer 221, and a second inorganic material layer 223 located on the organic material layer 222. In the non-display area 11, a power module 15, a GOA circuit 14 and a reference voltage module 16 are arranged on the substrate 13, and a signal wiring group 17 is also arranged on the power module 15 and the GOA circuit 14. The signal wiring group 17 is used to electrically connect the power module 15 with the cathode layer in the light-emitting material layer 21, and the GOA circuit 14 is electrically connected with the TFT layer 181. A crack stop block 24 is also arranged on the edge of the non-display area 11.

[0025] Due to the tortuous topography, the first inorganic material layer 221 and the second inorganic material layer 223 on the signal routing group 17 cause the first inorganic material layer 221 and the second inorganic material layer 223 in the area to present multiple bends, and the touch metal lead 23 is arranged on the partially flat structure of the first inorganic material layer 221 and the second inorganic material layer 223 in the area, resulting in a very narrow wiring area 111 of the touch metal lead 23, insufficient touch lead wiring space, and too narrow wiring width and routing, resulting in the problem of excessive impedance of the touch metal lead 23.

[0026] In response to the above technical problems, an embodiment of the present invention provides a display panel, which includes a display area and a non-display area located on one side of the display area. In the non-display area, the display panel includes a substrate, a power module and a GOA circuit located on the substrate, a signal routing group located on the power module and the GOA circuit, a pixel definition layer located on the signal routing group, and a packaging layer located on the pixel definition layer; the packaging layer near the edge of the non-display area is in a concave structure due to the presence of a step difference, a step filling layer is arranged on the concave structure, and a touch metal lead is arranged on the step filling layer, wherein the step filling layer is used to expand the effective wiring area of ​​the touch metal lead; the present invention adds a step filling layer on the surface of the packaging layer located in the non-display area, reduces the height difference of the film layer at the edge of the non-display area, thereby increasing the effective wiring width of the touch metal lead, and increases the wiring space at the frame position, which can effectively improve the problem of excessive impedance caused by the narrowing of the frame, resulting in wiring width and narrow routing; it can also improve the problem of process residue after wiring caused by excessive step difference.

[0027] Specifically, Figure 2As shown, an embodiment of the present invention provides a schematic diagram of a film layer structure of a display panel. The display panel 30 includes a display area 32 and a non-display area 31 located on one side of the display area 32. In the non-display area 31, the display panel includes a substrate 33, a power module 35 and a GOA circuit 34 located on the substrate 33, a signal routing group 36 located on the power module 35 and the GOA circuit 34, a pixel definition layer 391 located on the signal routing group 36, and an encapsulation layer 41 located on the pixel definition layer 391; a reference voltage module 36 is also provided on the side of the GOA circuit 34 close to the display area. The encapsulation layer 41 includes a first inorganic material layer 411, an organic material layer 412 located on the first inorganic material layer 411, and a second inorganic material layer 413 located on the organic material layer 412. The organic material layer 412 is located on the side of the non-display area 31 close to the display area 32; the first inorganic material layer 411 and the second inorganic material layer 413 on the side of the non-display area 31 are bonded together; and the encapsulation layer 41 close to the edge of the non-display area 31 is a concave structure due to the presence of a step difference, and the combined structure of the first inorganic material layer 411 and the second inorganic material layer 413 presents a multi-segment bending structure. A step difference filling layer 42 is arranged on the concave structure, and a touch metal lead 43 is arranged on the step difference filling layer 42, wherein the step difference filling layer 42 is used to expand the effective wiring area of ​​the touch metal lead, and can accommodate a touch metal lead 43 with a larger wiring width and routing width. Compared with the prior art, the touch metal lead 43 of this embodiment has a smaller impedance.

[0028] In the display area 32, the display panel 30 includes a substrate 33, a TFT layer 381 located on the substrate 33, a planarization layer 382 located on the TFT layer 381, a light-emitting functional layer 39 located on the planarization layer 382, ​​and an encapsulation layer 41 located on the light-emitting functional layer 39. The signal routing group 36 is used to electrically connect the power module 35 and the cathode of the light-emitting functional layer 39, and the GOA circuit 34 is electrically connected to the TFT layer 381. Specifically, the GOA circuit 34 outputs a scan signal and a data signal, the scan signal is applied to the first gate and the second gate of the TFT layer 381, and the data signal is applied to the source of the TFT layer 381.

[0029] The edge of the non-display area 31 also includes a first crack stop block 44 and a second crack stop block 45 located outside the first crack stop block 44. The first crack stop block 44 is arranged to be attached to the side of the step filling layer 42 near the display area 32. Each crack stop block includes an organic layer and a water blocking layer superposition module, the cross-sectional shape of the organic layer is rectangular, and the cross-sectional shape of the water blocking layer is trapezoidal. The organic layer in the crack stop block in this embodiment is a partial planarization layer, and the water blocking layer in the crack stop block is a partial pixel definition layer. The first crack stop block 44 includes an organic layer 441 and a water blocking layer 442 located on the organic layer 441. The organic layer 441 is a partial planarization layer, that is, the organic layer 441 and the planarization layer 382 are made of the same material and prepared by the same process. The water blocking layer 442 is a partial pixel definition layer, that is, the water blocking layer 442 and the pixel definition layer 391 are made of the same material and prepared by the same process. The second crack stop block 45 includes an organic layer 451 and a water blocking layer 452 located on the organic layer 451.

[0030] The encapsulation layer 41 extends from the display area 32 to the non-display area 31. The encapsulation layer 41 in the non-display area 31 is a concave structure, and the step filling layer 42 fills the concave structure. The material of the step filling layer 42 is an organic polymer material, and the organic polymer material is one or more of acrylic, hexamethyldisiloxane, polyacrylate, polycarbonate, and polystyrene. The present embodiment can use inkjet printing to print the step filling layer 42, with a clear step difference of 6um to 12um between the first crack stop block 44 and the display area. The printing range of the non-display area 31 is controlled by the inkjet printing speed to prevent the organic polymer material from overflowing into the display area and the cutting path.

[0031] In another embodiment, the material of the step filling layer 42 is an optically transparent adhesive layer. In this embodiment, the range of the optically transparent adhesive layer can be controlled by a conventional exposure method to prevent the optical OC adhesive material from overflowing into the display area and the cutting path.

[0032] In another embodiment, the material of the step filling layer 42 is UV curable epoxy resin or moisture absorbing sealant to enhance the packaging effect of the non-display area 31 .

[0033] The substrate 33 in this embodiment includes a first flexible layer, a first water-blocking layer, a second flexible layer, and a second water-blocking layer, which are stacked. The materials of the first flexible layer and the second flexible layer are preferably transparent polyimide or yellow polyimide. The first water-blocking layer and the second water-blocking layer are preferably silicon dioxide.

[0034] The TFT layer 381 is located on the substrate 33, and includes a light shielding layer disposed on the substrate 33, a buffer layer disposed on the substrate 33 and covering the light shielding layer, an active layer disposed on the buffer layer, a first gate insulating layer disposed on the active layer, a first gate disposed on the first gate insulating layer, a second gate insulating layer disposed on the first gate insulating layer and covering the first gate, a second gate disposed on the second gate insulating layer, a first interlayer insulating layer disposed on the second gate insulating layer and covering the second gate, a source electrode and a drain electrode disposed on the first interlayer insulating layer, a second interlayer insulating layer disposed on the first interlayer insulating layer and covering the source electrode and the drain electrode, and a planarization layer disposed on the second interlayer insulating layer. The active layer includes a channel region corresponding to the lower portion of the first gate insulating layer, and a source contact region and a drain contact region disposed on both sides of the channel region, respectively. A source contact hole and a drain contact hole corresponding to the source contact area and the drain contact area are provided on the first interlayer insulating layer, the second gate insulating layer, and the first gate insulating layer, respectively. The source and the drain are electrically connected to the source contact area and the drain contact area of ​​the active layer through the source contact hole and the drain contact hole, respectively. The orthographic projection of the light-shielding layer on the substrate 33 covers the orthographic projection of the active layer on the flexible substrate, so that the light-shielding layer can completely cover the active layer, prevent the active layer from being exposed to light, and avoid negative drift of the threshold voltage of the driving circuit layer.

[0035] The light-emitting functional layer 39 is located on the TFT layer 381, and includes an anode layer, a pixel definition layer 391 located above the anode, the pixel definition layer 391 is arranged at intervals to form a pixel opening, and a light-emitting device 392 is formed in the pixel opening. In the pixel opening, the light-emitting device 392 includes an anode, a light-emitting material layer located above the anode, and a cathode layer located above the light-emitting material layer. The cathode layer is electrically connected to the power module 35, and the anode is electrically connected to the drain of the TFT layer 381.

[0036] The encapsulation layer 41 is located on the light-emitting functional layer 39 and covers the light-emitting functional layer 39. The encapsulation layer 41 includes a first inorganic material layer 411, an organic material layer 412, and a second inorganic material layer 413. The first inorganic material layer 411 and the second inorganic material layer 413 are prepared by physical vapor deposition. The organic layer is generally printed by inkjet printing, which not only has a high light transmittance, but also can effectively relieve the stress of the inorganic layer. The touch layer is located above the encapsulation layer 41. The touch layer includes an array of touch sensor units, and the touch sensor units are electrically connected to the touch metal leads 43. The touch metal lead 43 array in this embodiment is arranged on the surface of the step filling layer 42. The step filling layer 42 is away from the substrate 33. The side is a smooth inclined surface, curved surface or plane. One end of the touch metal lead 43 is electrically connected to the touch chip, and the other end is electrically connected to the touch layer of the display area, so as to realize the normal transmission of the driving signal and the receiving signal of the touch layer.

[0037] As described above, the present invention reduces the height difference of the film layer at the edge of the non-display area by adding a step filling layer on the surface of the packaging layer located in the non-display area, thereby increasing the effective wiring width of the touch metal lead, increasing the wiring space at the frame position, and improving the problem of excessive load caused by the narrowing of the frame, resulting in wiring width and narrow routing; and improving the problem of process residue after wiring caused by excessive step difference.

[0038] In summary, although the present invention has been disclosed as above in terms of preferred embodiments, the above preferred embodiments are not intended to limit the present invention. A person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined in the claims.

Claims

1. A display panel, comprising a display area and a non-display area located on one side of the display area, characterized in that: In the non-display area, the display panel includes a substrate, a power module and a GOA circuit located on the substrate, a signal wiring group located on the power module and the GOA circuit, a pixel definition layer located on the signal wiring group, and an encapsulation layer located on the pixel definition layer; The encapsulation layer near the edge of the non-display area is in a concave structure due to the presence of a step, a step filling layer is arranged on the concave structure, and a touch metal lead is arranged on the step filling layer, wherein the step filling layer is used to expand the effective wiring area of ​​the touch metal lead; The edge of the non-display area further includes a first crack-stopping block and a second crack-stopping block located outside the first crack-stopping block, the first crack-stopping block and the second crack-stopping block are arranged at intervals, and the first crack-stopping block is arranged close to the display area and in contact with the side surface of the step-difference filling layer; The edge of the effective wiring area stops at the first crack stopper.

2. The display panel according to claim 1, characterized in that: The material of the step filling layer is an organic polymer material, and the organic polymer material is one of acrylic, hexamethyldisiloxane, polyacrylate, polycarbonate, and polystyrene, or a combination of more than one of the materials.

3. The display panel according to claim 1, characterized in that: The material of the step filling layer is optically transparent glue.

4. The display panel according to claim 1, characterized in that: The material of the step filling layer is UV curable epoxy resin or moisture absorbing frame glue.

5. The display panel according to claim 1, characterized in that: In the display area, the display panel includes a substrate, a TFT layer located on the substrate, a planarization layer located on the TFT layer, a pixel definition layer located on the planarization layer, a light-emitting device located in a pixel opening of the pixel definition layer, an encapsulation layer located on the light-emitting device, and a touch layer located on the encapsulation layer.

6. The display panel according to claim 5, characterized in that: The light emitting device comprises an anode, a light emitting material layer located on the anode, and a cathode layer located on the light emitting material layer; Wherein, the cathode layer is electrically connected to the power module through the signal wiring group, and the GOA circuit is electrically connected to the TFT layer.

7. The display panel according to claim 5, characterized in that: The touch metal lead array is arranged on the surface of the step filling layer, and the side of the step filling layer away from the substrate is a smooth inclined surface, curved surface or flat surface.

8. The display panel according to claim 7, characterized in that: One end of the touch metal lead is electrically connected to the touch chip, and the other end is electrically connected to the touch layer of the display area.

9. The display panel according to claim 1, characterized in that: The first crack-stopping block and the second crack-stopping block both include an organic layer and a water-blocking layer stacking module.

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