Anti-gravity cooling system and electronic components

Abstract

A counter-gravity heat dissipation system and an electronic component, the counter-gravity heat dissipation system is suitable for a heating element with a vertical heat dissipation surface, the counter-gravity heat dissipation system includes a plurality of panels arranged in a stacked manner, the plurality of panels are perpendicular to the vertical heat dissipation surface; a temperature equalizing plate and a heat dissipation assembly are arranged between the plurality of panels; the temperature equalizing plate includes a condensate pool, a steam chamber and an infusion channel; the extension plane of the condensate pool is perpendicular to the vertical heat dissipation surface, and at least part of the condensate pool is located on the side of the counter-gravity heat dissipation system close to the vertical heat dissipation surface; the steam chamber and the infusion channel are arranged at intervals, the steam chamber extends from close to the vertical heat dissipation surface to away from the vertical heat dissipation surface, and the extension direction of the infusion channel is perpendicular to the extension plane of the condensate pool; the top of the infusion channel is connected to the steam chamber, and the bottom ends of the steam chamber and the infusion channel are both connected to the condensate pool; the heat dissipation assembly is arranged adjacent to the steam chamber. The present application can be applied to heat dissipation of a high-power heating element with a small vertical heat dissipation surface.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation equipment, and in particular to a counter-gravity heat dissipation system and electronic components. Background Art

[0002] A heat pipe is a component that uses the liquid phase change process to carry the latent heat of vaporization to improve the heat transfer capacity of the cooling system. Cooling systems with heat pipes have been widely used in the electronic engineering industry.

[0003] In the related art, a heat dissipation system with heat pipes includes a heat absorbing base plate, heat pipes and heat dissipation fins. The heat absorbing base plate is connected to the heat dissipation surface of the heat generating element. A plurality of heat pipes are arranged on the side of the heat absorbing base plate away from the heat dissipation surface. The heat absorbing ends of the plurality of heat pipes are all connected to the heat absorbing base plate. The heat dissipation ends of the plurality of heat pipes are all away from the heat generating element, and the heat dissipation fins are connected to the heat dissipation ends of the heat pipes.

[0004] However, the above technical solution is not suitable for dissipating heat from a high-power heating element with a small vertical heat dissipation surface. Summary of the invention

[0005] In view of the above problems, the present application provides a counter-gravity heat dissipation system and an electronic component, which can be used to dissipate heat from high-power heating elements with small vertical heat dissipation surfaces.

[0006] In order to achieve the above objectives, this application provides the following technical solutions:

[0007] A first aspect of an embodiment of the present application provides a counter-gravity heat dissipation system, which is applicable to a heat-generating element having a vertical heat dissipation surface. The counter-gravity heat dissipation system comprises a plurality of panels arranged in a stacked manner, wherein the plurality of panels are perpendicular to the vertical heat dissipation surface;

[0008] A temperature equalizing plate and a heat dissipation component are arranged between the plurality of panels;

[0009] The temperature homogenizing plate comprises a condensate pool, a steam chamber and a liquid infusion channel, wherein the condensate pool is located at the bottom of the counter-gravity heat dissipation system in the vertical direction, and the liquid infusion channel and the steam chamber are both located at the top of the counter-gravity heat dissipation system in the vertical direction;

[0010] The extension plane of the condensate pool is perpendicular to the vertical heat dissipation surface, and at least part of the condensate pool is located on a side of the counter-gravity heat dissipation system close to the vertical heat dissipation surface; the steam chamber and the infusion channel are arranged at intervals, the steam chamber extends from close to the vertical heat dissipation surface to away from the vertical heat dissipation surface, and the extension direction of the infusion channel is perpendicular to the extension plane of the condensate pool;

[0011] The top of the liquid infusion channel in the vertical direction is connected to an end of the steam chamber close to the vertical heat dissipation surface, and the bottoms of the steam chamber and the liquid infusion channel in the vertical direction are both connected to the condensate pool;

[0012] The heat dissipation component is disposed adjacent to the steam chamber.

[0013] In an achievable implementation, a plurality of the infusion channels are provided, the top ends of the plurality of the infusion channels in the vertical direction are interconnected, and at least one of the infusion channels is interconnected with the steam chamber;

[0014] The distance between the top of at least one of the infusion channels in the vertical direction and the condensate pool is greater than or equal to the distance between the top of the steam chamber in the vertical direction and the condensate pool.

[0015] In a feasible embodiment, the temperature equalizing plate further includes a plurality of steam chamber micro-channels, which are arranged in a mesh pattern on the chamber wall of the steam chamber and are interconnected, and at least one of the steam chamber micro-channels is connected to the infusion channel, so that the steam chamber is connected to the infusion channel.

[0016] In an achievable implementation, a plurality of the liquid infusion channels and a plurality of the steam chamber micro-channels are provided on the same panel, and one of the liquid infusion channels among the plurality of the liquid infusion channels is interconnected with at least two of the plurality of the steam chamber micro-channels;

[0017] The infusion channel is provided with at least two infusion holes spaced apart in the vertical direction, the number of the at least two infusion holes is equal to the number of the at least two steam chamber microchannels, and the at least two steam chamber microchannels are connected to the at least two infusion holes in a one-to-one correspondence.

[0018] In one possible implementation, the steam chamber includes a plurality of sub-steam chambers;

[0019] Along a direction parallel to the vertical heat dissipation surface, a plurality of the sub-steam chambers are arranged at intervals;

[0020] Ends of the plurality of sub-steam chambers close to the vertical heat dissipation surface are all connected to each other, and ends of the plurality of sub-steam chambers away from the vertical heat dissipation surface are all connected to each other.

[0021] In an achievable embodiment, at least part of the sub-steam chambers are located between part of the panels, part of the panels include a plurality of first sequence panels and a plurality of second sequence panels, and the plurality of first sequence panels and the plurality of second sequence panels are alternately distributed in sequence;

[0022] The first sequence panel is provided with a plurality of first transverse through holes spaced apart in the vertical direction, the ends of the first transverse through holes away from the vertical heat dissipation surface are interconnected, and the solid parts between adjacent first transverse through holes form a first transverse support;

[0023] The second sequence panel is provided with a plurality of second transverse through holes spaced apart in the vertical direction, the ends of the second transverse through holes away from the vertical heat dissipation surface are interconnected, and the solid parts between adjacent second transverse through holes form a second transverse support;

[0024] Along the thickness direction of the panel, the first transverse through hole and the second transverse through hole are interconnected; the first transverse support located on the side of the first transverse through hole away from the vertical heat dissipation surface is interconnected with the second transverse support located on the side of the second transverse through hole away from the vertical heat dissipation surface; the first transverse support located on the side of the first transverse through hole close to the vertical heat dissipation surface and the second transverse support located on the side of the second transverse through hole close to the vertical heat dissipation surface are at least partially staggered.

[0025] In a feasible embodiment, one end of the steam chamber close to the vertical heat dissipation surface is inclined toward a side close to the condensate pool, and one end of the steam chamber away from the vertical heat dissipation surface is inclined toward a side away from the condensate pool, so that the cavity wall of the steam chamber has a slope that guides the steam to flow in a direction close to the condensate pool.

[0026] In an achievable embodiment, along the extension direction of the steam cavity, the extension height of the steam cavity at the first side of the panel is greater than the extension height of the steam cavity at the second side of the panel, and the first side and the second side are opposite sides of the extension direction of the panel;

[0027] The heat dissipation component is located on the second side of the panel.

[0028] In an achievable implementation, the heat dissipation component includes a refrigerant inlet, a refrigerant outlet, and a microchannel;

[0029] The refrigerant inlet and the refrigerant outlet are located at the top edge and the bottom edge of the heat dissipation component in the vertical direction;

[0030] The microchannel is located between the refrigerant inlet and the refrigerant outlet, and the microchannel is communicated with the refrigerant inlet and the refrigerant outlet.

[0031] In a feasible implementation, two temperature averaging plates are included, and the two temperature averaging plates are located on opposite sides of the extension direction of the heat dissipation component, and the two temperature averaging plates are mirror images of each other.

[0032] A second aspect of an embodiment of the present application provides an electronic component, comprising a heat generating element and the above-mentioned counter-gravity heat dissipation system, wherein the heat generating element has a vertical heat dissipation surface, and the counter-gravity heat dissipation system is arranged on a side of the heat generating element close to the vertical heat dissipation surface.

[0033] The embodiments of the present application provide a counter-gravity heat dissipation system and an electronic component. The counter-gravity heat dissipation system is suitable for dissipating heat from a high-power heat-generating component with a small vertical heat dissipation surface. The anti-gravity heat dissipation system forms a layered structure by arranging multiple panels perpendicular to the vertical heat dissipation surface. The heat of the heating element flows along the layers on both sides of each panel, and the flow resistance is smaller. The heat can be quickly diffused from one end close to the vertical heat dissipation surface to the other end away from the vertical heat dissipation surface. It is suitable for heat transfer on a small area of ​​the vertical heat dissipation surface, and has higher heat dissipation efficiency and better heat dissipation effect. By arranging a temperature equalizing plate, a condensate pool is formed at the bottom of the temperature equalizing plate along the vertical direction to accommodate the condensate, which can provide sufficient condensate for the heat dissipation of the heating element to meet the heat dissipation requirements of high power. By arranging an infusion channel and a steam chamber, the condensate can climb to the top along the infusion channel under the action of capillary force, and the condensate in the condensate pool is lifted upward against gravity and transported to the steam chamber. The temperature of the steam chamber is higher than that of the infusion channel, so that the condensate undergoes a phase change and is converted into steam after entering the steam chamber. The steam flows along the steam chamber in a direction away from the vertical heat dissipation surface, and undergoes heat transfer with the heat dissipation component to undergo a phase change and be converted into condensate. The condensate after the phase change flows back to the condensate pool again. In this way, the condensate circulates between the infusion channel, the steam chamber and the condensate pool to dissipate heat from the vertical heat dissipation surface of the heating element; by arranging the heat dissipation component on the panel and adjacent to the temperature plate, the steam chamber and the heat dissipation component are separated by only one wall, avoiding the contact thermal resistance and structural redundancy caused by the physical structure connection, so that the heat can be quickly diffused along the panel, improving the heat dissipation effect. The electronic component includes the above heat dissipation system and has the same beneficial effect.

[0034] The construction of the present application as well as its other objects and beneficial effects will be more clearly understood through the description of the preferred embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0036] Figure 1 A brief schematic diagram of a counter-gravity heat dissipation system provided in an embodiment of the present application;

[0037] Figure 2 for Figure 1 Schematic diagram of the internal structure at A in the middle;

[0038] Figure 3 for Figure 1 Schematic diagram of the internal structure at B in the middle;

[0039] Figure 4 A schematic structural diagram of a first panel of a counter-gravity heat dissipation system provided in an embodiment of the present application;

[0040] Figure 5 for Figure 4 A partial enlarged view of point C;

[0041] Figure 6 A schematic diagram of the structure of a second panel of the counter-gravity heat dissipation system provided in an embodiment of the present application;

[0042] Figure 7 A schematic diagram of the structure of a third panel of the counter-gravity heat dissipation system provided in an embodiment of the present application;

[0043] Figure 8 for Figure 7 A partial enlarged view of point D;

[0044] Fig. 9 A schematic diagram of the structure of a fourth panel of the counter-gravity heat dissipation system provided in an embodiment of the present application;

[0045] Fig.10 A schematic diagram of the structure of the fifth panel of the counter-gravity heat dissipation system provided in an embodiment of the present application;

[0046] Fig.11 A schematic diagram of the structure of the sixth panel of the counter-gravity heat dissipation system provided in an embodiment of the present application;

[0047] Fig.12 A schematic diagram of the structure of the seventh panel of the counter-gravity heat dissipation system provided in an embodiment of the present application;

[0048] Fig.13 A schematic diagram of the structure of the eighth panel of the counter-gravity heat dissipation system provided in an embodiment of the present application.

[0049] Description of reference numerals:

[0050] 100- Anti-gravity cooling system;

[0051] 101-first panel; 102-second panel; 103-third panel; 104-fourth panel; 105-fifth panel; 106-sixth panel; 107-seventh panel; 108-eighth panel;

[0052] 200-Equalizing plate;

[0053] 210 - condensate pool; 211 - through hole;

[0054] 220 - steam chamber; 221 - sub-steam chamber; 222 - steam chamber micro-channel; 223 - first transverse through hole; 224 - connecting rib; 225 - second transverse through hole;

[0055] 230 - infusion channel; 231 - micro-groove; 232 - communication hole;

[0056] 300-heat dissipation component;

[0057] 310-Refrigerant inlet;

[0058] 320-refrigerant outlet;

[0059] 330-microchannel; 331-micropore;

[0060] Q-heat; L-refrigerant; Y-condensate; Z-steam. DETAILED DESCRIPTION

[0061] In the related art, a heat dissipation system with a heat pipe includes a heat absorbing base plate, a heat pipe and a heat dissipation fin. The heat absorbing base plate is connected to the heat dissipation surface of the heating element through an interface material that reduces the contact thermal resistance. A plurality of heat pipes are arranged on the side of the heat absorbing base plate away from the heat dissipation surface. Each heat pipe is U-shaped, and the two ends of the U-shaped heat pipe are a heat absorbing end and a heat dissipation end, respectively. The heat absorbing end of each U-shaped heat pipe is clamped on the heat absorbing base plate, and the heat dissipation end of each U-shaped heat pipe is located on the side away from the heating element and is spaced apart from the heat absorbing base plate. A plurality of heat dissipation fins are arranged, and the plurality of heat dissipation fins are spaced apart in parallel and are riveted to the heat dissipation end of the U-shaped heat pipe.

[0062] However, the above technical solution is only applicable to heat dissipation of low-power heating elements with large horizontal heat dissipation surfaces, but not to heat dissipation of high-power heating elements with small vertical heat dissipation surfaces. On the one hand, it is impossible to arrange a sufficient number of heat pipes on the small vertical heat dissipation surface, and it is impossible to transfer the heat of the high-power heating element in time. On the other hand, due to the effect of gravity, the condensate in the heat pipe is located at the heat absorbing end of the heat pipe close to the bottom in the vertical direction, and it is impossible to evenly dissipate the heat on the vertical heat dissipation surface.

[0063] In order to solve the above technical problems, the embodiments of the present application provide a counter-gravity heat dissipation system and an electronic component. The counter-gravity heat dissipation system is suitable for dissipating heat from high-power heating elements with a small vertical heat dissipation surface. The anti-gravity heat dissipation system forms a layered structure by arranging multiple panels perpendicular to the vertical heat dissipation surface. The heat of the heating element flows along the layers on both sides of each panel, and the flow resistance is smaller. The heat can be quickly diffused from one end close to the vertical heat dissipation surface to the other end away from the vertical heat dissipation surface. It is suitable for heat transfer on a small area of ​​the vertical heat dissipation surface, and has higher heat dissipation efficiency and better heat dissipation effect. By arranging a temperature equalizing plate, a condensate pool is formed at the bottom of the temperature equalizing plate along the vertical direction to accommodate the condensate, which can provide sufficient condensate for the heat dissipation of the heating element to meet the heat dissipation requirements of high power. By arranging an infusion channel and a steam chamber, the condensate can climb to the top along the infusion channel under the action of capillary force, and the condensate in the condensate pool is lifted upward against gravity and transported to the steam chamber. The temperature of the steam chamber is higher than that of the infusion channel, so that the condensate undergoes a phase change and is converted into steam after entering the steam chamber. The steam flows along the steam chamber in a direction away from the vertical heat dissipation surface, and undergoes heat transfer with the heat dissipation component to undergo a phase change and be converted into condensate. The condensate after the phase change flows back to the condensate pool again. In this way, the condensate circulates between the infusion channel, the steam chamber and the condensate pool to dissipate heat from the vertical heat dissipation surface of the heating element; by arranging the heat dissipation component on the panel and adjacent to the temperature plate, the steam chamber and the heat dissipation component are separated by only one wall, avoiding the contact thermal resistance and structural redundancy caused by the physical structure connection, so that the heat can be quickly diffused along the panel, improving the heat dissipation effect. The electronic component includes the above heat dissipation system and has the same beneficial effect.

[0064] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below in conjunction with the drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals throughout represent the same or similar parts or parts with the same or similar functions. The described embodiments are part of the embodiments of the present application, not all of the embodiments. The embodiments described below with reference to the drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0065] The electronic components provided in the embodiments of the present application are described below.

[0066] An embodiment of the present application provides an electronic component, including a heating element and a heat dissipation system, wherein the heating element has a vertical heat dissipation surface, and the heat dissipation system is arranged on a side of the heating element close to the vertical heat dissipation surface.

[0067] Among them, the electronic components may include circuit boards, and the heating elements may include chips on the circuit boards. The heating elements may include not only low-power, low-heat flux heating elements in large spaces, but also high-power, high-heat flux heating elements in small spaces. For example, the circuit board may be a circuit board in large-scale integrated circuits, IGBT power electronic systems, aerospace, airborne, and shipborne equipment, and the heat flux density of its chips may be as high as 1000W / cm 2 above.

[0068] It is understandable that as the position and posture of the electronic component changes during use, the position and posture of the vertical heat dissipation surface also change accordingly, that is, the vertical heat dissipation surface can be in an inclined or horizontal state. The embodiment of the present application does not strictly limit the vertical heat dissipation surface to always remain vertical, but means that the vertical heat dissipation surface can be in a vertical state under normal circumstances.

[0069] The following will refer to Figure 1-Figure 13 The counter-gravity heat dissipation system 100 provided in an embodiment of the present application is described.

[0070] The embodiment of the present application provides a counter-gravity heat dissipation system 100, which is suitable for a heat-generating component with a vertical heat dissipation surface. The counter-gravity heat dissipation system 100 includes a plurality of panels arranged in a stacked manner, and the plurality of panels are all perpendicular to the vertical heat dissipation surface. A temperature evaporating plate 200 and a heat dissipation assembly 300 are arranged between the plurality of panels.

[0071] The temperature homogenizing plate 200 includes a condensate pool 210 , a steam chamber 220 and an infusion channel 230 . The condensate pool 210 is located at the bottom of the counter-gravity cooling system 100 in the vertical direction, and the infusion channel 230 and the steam chamber 220 are both located at the top of the counter-gravity cooling system 100 in the vertical direction.

[0072] The extension plane of the condensate pool 210 is perpendicular to the vertical heat dissipation surface, and at least part of the condensate pool 210 is located on a side of the counter-gravity heat dissipation system 100 close to the vertical heat dissipation surface. The steam chamber 220 and the infusion channel 230 are arranged at intervals, and the steam chamber 220 extends from close to the vertical heat dissipation surface to away from the vertical heat dissipation surface. The extension direction of the infusion channel 230 is perpendicular to the extension plane of the condensate pool 210.

[0073] The top of the infusion channel 230 in the vertical direction is connected to one end of the steam chamber 220 close to the vertical heat dissipation surface, and the bottom ends of the steam chamber 220 and the infusion channel 230 in the vertical direction are both connected to the condensate pool 210 .

[0074] The heat dissipation assembly 300 is disposed adjacent to the steam chamber 220 .

[0075] The panel may include a metal part or a composite material part. For example, the panel may be a copper alloy sheet or a stainless steel sheet. The multiple panels may have the same shape and size, so that the orthographic projections of the multiple panels on each other overlap with each other, and the multiple panels may be welded and fixed.

[0076] Multiple panels are perpendicular to the vertical heat dissipation surface, so that multiple panels form a layered structure. The heat Q of the heating element flows along the layers on both sides of each panel, and the flow resistance is smaller. The heat Q can quickly diffuse from the end close to the vertical heat dissipation surface to the end far away from the vertical heat dissipation surface, which is suitable for heat transfer on a small area of ​​vertical heat dissipation surface, with higher heat dissipation efficiency and better heat dissipation effect.

[0077] The heat dissipation assembly 300 is formed in a plurality of panels. On the one hand, the heat dissipation assembly 300 has a better heat transfer and heat dissipation effect by virtue of the arrangement of the panels perpendicular to the vertical heat dissipation surface. On the other hand, the heat dissipation assembly 300 is arranged adjacent to the temperature homogenizing plate 200, and the steam chamber 220 and the heat dissipation assembly 300 are separated by only one wall, which avoids the contact thermal resistance and structural redundancy caused by the physical structure connection, so that the heat Q can be rapidly diffused along the panel.

[0078] The temperature plate 200 is a heat pipe structure formed in a plurality of panels. With the panel being arranged perpendicular to the vertical heat dissipation surface, the temperature plate 200 has a better heat transfer and heat dissipation effect. A condensate pool 210 is formed at the bottom of the temperature plate 200 in the vertical direction to accommodate the condensate Y, which can provide sufficient condensate Y for the heat dissipation of the heating element to meet the heat dissipation requirements of high power.

[0079] The infusion channel 230 and the steam chamber 220 are both connected to the condensate pool 210, so that the condensate Y can climb to the top along the infusion channel 230 under the action of capillary force, and the condensate Y is lifted upward against gravity and transported to the steam chamber 220. Since the infusion channel 230 is full of condensate Y, the condensate Y in the steam chamber 220 is replenished by the infusion channel 230. The difference in the cross-sectional area and the flow rate of the condensate Y between the two makes the temperature in the steam chamber 220 higher than the temperature in the infusion channel 230. In addition, since the temperature of the end of the steam chamber 220 away from the vertical heat dissipation surface is lower than the temperature of the end close to the vertical heat dissipation surface. When the condensate Y enters the end of the steam cavity 220 close to the vertical heat dissipation surface from the infusion channel 230, the condensate Y in the steam cavity 220 will undergo a phase change and transform into steam Z under the action of high temperature; the steam Z flows along the steam cavity 220 in the direction away from the vertical heat dissipation surface, and contacts the low-temperature cavity wall at a position close to the heat dissipation component 300, undergoing a phase change and transforming into condensate Y; the condensate Y after the phase change flows back to the condensate pool 210 again. In this way, the condensate Y circulates between the infusion channel 230, the steam cavity 220 and the condensate pool 210 to dissipate heat from the vertical heat dissipation surface of the heating element.

[0080] It can be understood that the infusion channel 230 is used to transport the condensate Y. The smaller the cross-sectional area of ​​the infusion channel 230, the smaller its effective diameter, the greater the capillary force of the infusion channel 230 on the condensate Y, and the higher the lifting height of the condensate Y in the infusion channel 230. In the embodiment of the present application, the infusion channel 230 has a cross-sectional area of ​​micrometer size. The capillary force of the infusion channel 230 on the condensate Y should be sufficient to lift the condensate Y to the top of the steam chamber 220, thereby inputting the condensate Y into the steam chamber 220.

[0081] In one possible implementation, such as Figure 2 Combination Figure 4-Figure 13 As shown, a plurality of infusion channels 230 are provided, and the top ends of the plurality of infusion channels 230 along the vertical direction are interconnected, and at least one infusion channel 230 is interconnected with the steam chamber 220 .

[0082] It can be understood that in order to lift the condensate Y against gravity, the cross-sectional area of ​​the infusion channel 230 is small, and the flow rate of condensate Y that can be transported by a single infusion channel 230 is limited. By setting more infusion channels 230, a sufficient flow rate of condensate Y can be added to the steam chamber 220 to take away more heat Q and improve the heat dissipation efficiency.

[0083] When the steam chamber 220 is connected to multiple infusion channels 230, the multiple infusion channels 230 can be directly connected to the steam chamber 220 respectively, or the multiple infusion channels 230 can be connected to each other at the top and one of the infusion channels 230 is connected to the steam chamber 220, so that the steam chamber 220 is indirectly connected to the multiple infusion channels 230.

[0084] In one possible implementation, such as Figure 1-Figure 3 As shown, the counter-gravity heat dissipation system 100 may include a first end panel, a second end panel, and a plurality of intermediate panels forming a shell, wherein the first end panel is located on a side of the plurality of panels closest to the vertical heat dissipation surface, the second end panel is located on a side of the plurality of panels farthest from the vertical heat dissipation surface, and the plurality of intermediate panels are stacked between the first end panel and the second end panel. At least part of the infusion channel 230 is disposed on the first end panel and / or the second end panel.

[0085] It can be understood that the cross-sectional area of ​​the steam cavity 220 is larger than the cross-sectional area of ​​the infusion channel 230, the steam cavity 220 can be located on multiple middle panels, and the infusion channel 230 can be located between two adjacent panels. The steam cavity 220 occupies most of the area on the middle panel, which greatly reduces the area where the infusion channel 230 can be set, while the panels located on the side can provide more area for setting the infusion channel 230. Therefore, by setting most of the infusion channels 230 on the panels located on the side, the number of infusion channels 230 formed can be increased to transport more condensate Y.

[0086] In the embodiments of the present application, Figure 4 The first panel 101 shown (which can be considered to be equivalent to the first end panel described above) and Fig.10 The fifth panel 105 shown (which can be considered to be equivalent to the second end panel mentioned above) has two infusion channel groups on both panels. Taking the first panel 101 as an example, the two infusion channel groups are respectively the first infusion channel group close to the left side and the second infusion channel group close to the right side. Each infusion channel group has multiple infusion channels 230. The cross-sectional area of ​​the infusion channel 230 in the first infusion channel group is greater than the cross-sectional area of ​​the infusion channel 230 in the second infusion channel group, and the height of the infusion channel 230 in the first infusion channel group is higher than the height of the infusion channel 230 in the second infusion channel group. The tops of the infusion channels 230 in the same infusion channel group are interconnected. The two infusion channel groups on the fifth panel 105 are designed similarly to the first panel 101.

[0087] like Figure 7 The third panel 103 shown and Fig. 9 The fourth panel 104 shown has two infusion channel groups on each panel. Taking the third panel 103 as an example, the two infusion channel groups are the third infusion channel group close to the left side and the fourth infusion channel group located on the solid part of the steam chamber 220 and the connecting rib 224. There are also multiple infusion channels 230 in each infusion channel group. The cross-sectional area of ​​the infusion channel 230 in the third infusion channel group is greater than the cross-sectional area of ​​the infusion channel 230 in the fourth infusion channel group. The height of the infusion channel 230 in the third infusion channel group is higher than the height of the infusion channel 230 in the fourth infusion channel group. The tops of the infusion channels 230 in the same infusion channel group are interconnected. The infusion channels 230 between the two infusion channel groups are also interconnected.

[0088] Among them, an infusion channel 230 in the third infusion channel group close to the fourth infusion channel group is a selected infusion channel, and the cross-sectional area of ​​the selected infusion channel is larger than the cross-sectional area of ​​other infusion channels 230 in the third infusion channel group, and because the cross-sectional area of ​​the infusion channel 230 in the fourth infusion channel group is smaller than the cross-sectional area of ​​the infusion channel 230 in the third infusion channel group, the condensate Y in the other infusion channels 230 in the third infusion channel group and the infusion channel 230 in the fourth infusion channel group all flows to the selected infusion channel, and the condensate Y is replenished to the steam chamber 220 through the selected infusion channel. The two infusion channel groups on the fourth panel 104 are designed similarly to the third panel 103.

[0089] The second panel 102, the third panel 103, the fourth panel 104 and the fifth panel 105 are provided with corresponding communication holes 232, so that the first panel 101 and the infusion channels 230 on the above panels are all connected to each other. In this way, the multiple infusion channels 230 formed on each panel are all connected to each other, and the multiple infusion channels 230 can replenish the condensate Y to the selected infusion channels on the third panel 103 and the fourth panel 104, and can provide enough condensate Y for heat exchange circulation.

[0090] In one possible implementation, such as Figure 7 and Fig. 9 As shown, the distance between the top of at least one infusion channel 230 in the vertical direction and the condensate pool 210 is greater than or equal to the distance between the top of the steam chamber 220 in the vertical direction and the condensate pool 210 .

[0091] In this way, the infusion channel 230 can enter the steam chamber 220 in a backflow manner at the top, and can form condensate Y to supplement the entire height of the steam chamber 220 to evenly dissipate heat at various positions of the heating element.

[0092] In one possible implementation, combining Figure 4 and Figure 6 As shown, one of the two adjacent panels is provided with a micro-channel 231 , and the other of the two adjacent panels is butted against the panel provided with the micro-channel 231 and blocks the notch of the micro-channel 231 to form an infusion channel 230 .

[0093] Alternatively, micro-grooves 231 are provided on the surfaces of two adjacent panels that are close to each other, and the two adjacent panels are butted against each other, and the micro-grooves 231 on the two adjacent panels are matched to form the infusion channel 230 .

[0094] In this way, an infusion channel 230 can be formed between any adjacent panels, which facilitates the arrangement of more infusion channels 230 to transport condensed liquid Y to the steam chamber 220 and continuously take away the heat Q of the heating element.

[0095] In one possible implementation, combining Figure 4-Figure 13 As shown, at least part of the condensate pool 210 is located between the multiple middle panels, each middle panel is provided with a through hole 211 at the bottom along the vertical direction, and the through holes 211 of adjacent middle panels are interconnected to form the condensate pool 210 located between the multiple middle panels.

[0096] In this way, the condensate pool 210 can have a larger liquid storage capacity, providing sufficient condensate Y for the counter-gravity heat dissipation system 100, thereby improving the heat dissipation effect.

[0097] In some embodiments, a portion of the condensate pool 210 may also be located on at least one of the first end panel and the second end panel.

[0098] Taking the case where part of the condensate pool 210 is located at the first end panel as an example, a groove can be formed at the position of the first end panel corresponding to the condensate pool 210, and the groove is interconnected with the through holes 211 of the plurality of middle panels to form the condensate pool 210 located between the first end panel and the plurality of middle panels. The top of the groove can also be connected with the infusion channel 230 on the first end panel to achieve mutual communication between the condensate pool 210 and the infusion channel 230.

[0099] Similarly, the second end panel can be similarly configured to form a partial condensate pool 210 and communicate with the infusion channel 230 .

[0100] In this way, the condensate pool 210 can provide condensate Y for the infusion channels 230 on the first end panel and the second end panel, and the condensate pool 210 can have a larger liquid storage capacity to improve the heat dissipation effect.

[0101] In one possible implementation, such as Figure 7-Figure 9 As shown, the steam chamber 220 includes a plurality of sub-steam chambers 221. The plurality of sub-steam chambers 221 are arranged at intervals in a direction parallel to the vertical heat dissipation surface. The ends of the plurality of sub-steam chambers 221 close to the vertical heat dissipation surface are interconnected, and the ends of the plurality of sub-steam chambers 221 away from the vertical heat dissipation surface are interconnected.

[0102] In this way, the steam chamber 220 is set as a structure in which multiple sub-steam chambers 221 are interconnected, which not only ensures that the steam Z formed by the condensate pool 210 diffuses rapidly along the sub-steam chamber 221, but also forms support in the solid part between adjacent sub-steam chambers 221. The supports on adjacent panels are interconnected, which can ensure the structural strength of the temperature equalizing plate 200.

[0103] In a feasible implementation, at least part of the sub-steam chamber 221 is located between part of the panels, and part of the panels includes a plurality of first sequence panels and a plurality of second sequence panels, and the plurality of first sequence panels and the plurality of second sequence panels are alternately distributed in sequence.

[0104] The first sequence panel is provided with a plurality of first transverse through holes 223 spaced apart in the vertical direction, the ends of the first transverse through holes 223 away from the vertical heat dissipation surface are interconnected, and the solid parts between adjacent first transverse through holes 223 form a first transverse support.

[0105] The second sequence panel is provided with a plurality of second transverse through holes 225 spaced apart in the vertical direction, and the ends of the second transverse through holes 225 away from the vertical heat dissipation surface are interconnected, and the solid parts between adjacent second transverse through holes 225 form a second transverse support.

[0106] Along the thickness direction of the panel, the first transverse through hole 223 and the second transverse through hole 225 are interconnected. The first transverse support located on the side of the first transverse through hole 223 away from the vertical heat dissipation surface is interconnected with the second transverse support located on the side of the second transverse through hole 225 away from the vertical heat dissipation surface. The first transverse support located on the side of the first transverse through hole 223 close to the vertical heat dissipation surface and the second transverse support located on the side of the second transverse through hole 225 close to the vertical heat dissipation surface are at least partially staggered.

[0107] In the embodiment of the present application, the steam chamber 220 may be composed of a plurality of Figure 7 The third panel 103 (i.e., the first sequence panel) and the plurality of panels shown in FIG. Fig. 9 The fourth panel 104 (ie, the second sequence of panels) is formed by alternately stacking and welding.

[0108] The third panel 103 is provided with a plurality of first transverse through holes 223. Each of the first transverse through holes 223 extends from a direction close to the vertical heat dissipation surface to a direction away from the vertical heat dissipation surface. From the top to the bottom along the vertical direction, the plurality of first transverse through holes 223 are spaced apart. The ends of the first transverse through holes 223 away from the vertical heat dissipation surface are interconnected, so that the first transverse through holes 223 form a cantilever beam structure. The solid part between the first transverse through holes 223 forms a first transverse support.

[0109] On the third panel 103, one end of the first transverse through hole 223 located in an even-numbered row close to the vertical heat dissipation surface is connected to the same end of the first transverse through hole 223 in the bottom row, so that the upper side support of the first transverse through hole 223 located in an even-numbered row close to the vertical heat dissipation surface is physically connected to the side wall of the micro-groove 231 forming the third infusion channel group, so as to have a reliable connection point. A connecting rib 224 (which can be used as a part of the first transverse support) is arranged between the two supports of the first transverse through hole 223, and a connecting rib 224 is also arranged between the support of the first transverse through hole 223 located at the bottom and the condensate pool 210, so that the physical parts between the multiple first transverse through holes 223 are all connected as a whole, and have a common connection point.

[0110] The fourth panel 104 is provided with a plurality of second transverse through holes 225. Each second transverse through hole 225 extends from a direction close to the vertical heat dissipation surface to a direction away from the vertical heat dissipation surface. From the top to the bottom along the vertical direction, the plurality of second transverse through holes 225 are spaced apart. The ends of each second transverse through hole 225 away from the vertical heat dissipation surface are interconnected, so that the second transverse through holes 225 form a cantilever beam structure. The solid part between each second transverse through hole 225 forms a second transverse support.

[0111] On the fourth panel 104, the end of the second transverse through hole 225 located in the even-numbered row close to the vertical heat dissipation surface is connected to the same end of the second transverse through hole 225 in the top row, so that the upper side support of the second transverse through hole 225 located in the odd-numbered row close to the vertical heat dissipation surface is connected to the side wall of the micro-groove 231 forming the third infusion channel group, and has a reliable connection point. A connecting rib 224 (which can be used as a part of the second transverse support) is set between the two supports of the second transverse through hole 225, and a connecting rib 224 is also set between the support of the second transverse through hole 225 located at the bottom and the condensate pool 210, so that the entity parts between multiple second transverse through holes 225 are connected as a whole and have a common connection point.

[0112] Between the third panel 103 and the fourth panel 104, each first transverse through hole 223 and each second transverse through hole 225 are arranged correspondingly and interconnected, and each connecting rib 224 can be arranged in a staggered manner, so that each first transverse through hole 223 and each second transverse through hole 225 at a corresponding position are interconnected to form a sub-steam chamber 221, and adjacent sub-steam chambers 221 are interconnected to form a steam chamber 220. Among them, the fourth infusion channel group on the third panel 103 and the fourth panel 104 can be arranged on the connecting rib 224 and the entity part between each first transverse through hole 223. The fourth infusion channel group on the fourth panel 104 can be arranged on the entity part between the connecting rib 224 and each second transverse through hole 225.

[0113] In some embodiments, in order to provide improved support strength of the heat dissipation assembly 300, multiple stacked third panels 103 may be provided, and then stacked and welded with multiple stacked fourth panels 104. Exemplarily, four stacked third panels 103 may be provided, and then four stacked fourth panels 104 may be provided, and finally the two may be stacked and welded.

[0114] In one possible implementation, such as Figure 7-Figure 9 As shown, one end of the steam chamber 220 close to the vertical heat dissipation surface is inclined toward the side close to the condensate pool 210, and the other end of the steam chamber 220 away from the vertical heat dissipation surface is inclined toward the side away from the condensate pool 210, so that the cavity wall of the steam chamber 220 has an inclined surface that guides the steam Z to flow in the direction close to the condensate pool 210.

[0115] In this way, the condensate Y in the steam chamber 220 that undergoes phase change at the end away from the vertical heat dissipation surface can quickly flow back to the condensate pool 210 under the guidance of the inclined surface, thereby promoting the circulation speed of the condensate Y and improving the heat dissipation efficiency.

[0116] In one possible implementation, such as Figure 7-Figure 9 As shown, the temperature homogenizing plate 200 further includes a plurality of steam cavity micro-channels 222 , which are arranged in a mesh on the cavity wall of the steam cavity 220 and are interconnected, and at least one steam cavity micro-channel 222 is connected to the infusion channel 230 .

[0117] For example, steam cavity micro-channels 222 can be formed on the supports of each first transverse through hole 223 and each second transverse through hole 225, and the steam cavity micro-channels 222 on adjacent panels can be connected through the through holes, so that the steam cavity micro-channels 222 on the supports of each transverse through hole are arranged in a mesh shape and connected to each other.

[0118] It can be understood that the steam chamber micro-channel 222 is located on the cavity wall of the steam chamber 220. It can refer to the structure of the micro-channel 231 of the infusion channel 230. The micro-channel 231 is opened at the supporting edge of the first transverse through hole 223 and the second transverse through hole 225, and the side wall of the adjacent transverse through hole of the micro-channel 231 is connected to the transverse through hole.

[0119] In one possible implementation, such as Figure 7-Figure 9 As shown, a plurality of liquid infusion channels 230 and a plurality of steam cavity micro-channels 222 are disposed on the same panel, and one of the liquid infusion channels 230 is interconnected with at least two of the plurality of steam cavity micro-channels 222 .

[0120] The infusion channel 230 is provided with at least two infusion holes spaced apart in the vertical direction, the number of the at least two infusion holes is equal to the number of the at least two steam chamber microchannels 222, and the at least two steam chamber microchannels 222 are connected to the at least two infusion holes in a one-to-one correspondence.

[0121] Exemplarily, steam chamber micro-channels 222 are provided on the supports between the adjacent first transverse through holes 223 on the third panel 103, so that a plurality of steam chamber micro-channels 222 are formed on the third panel. A third infusion channel group and a fourth infusion channel group are also provided on the third panel 103. The selected infusion channel is interconnected with two of the steam chamber micro-channels 222.

[0122] Specifically, the steam chamber microchannel 222 on the support connected to the side wall of the selected infusion channel is connected to the selected infusion channel. The steam chamber microchannel 222 extends to the connection point between the support and the side wall of the selected infusion channel, and an infusion hole is provided at the connection point, and the steam chamber microchannel 222 is connected to the selected infusion channel through the infusion hole.

[0123] In this way, the condensate Y is transported to the steam chamber micro-channel 222 by the selected infusion channel, and the multiple steam chamber micro-channels 222 are also interconnected, so that the condensate Y can cover the steam chamber micro-channel 222. Since the cross-sectional area of ​​the steam chamber micro-channel 222 is very small, the condensate Y flows therein and contacts the heat Q in the steam chamber 220, and can be quickly vaporized, thereby accelerating the circulation and heat dissipation effect of the condensate.

[0124] In one possible implementation, the counter-gravity heat dissipation system 100 further includes a liquid injection port (not shown) with a sealing cover, and the liquid injection port is connected to the top end of the steam chamber 220 in the vertical direction.

[0125] In this way, supplementary condensate Y can be injected into the condensate pool 210 through the liquid injection port.

[0126] In one possible implementation, combining Figure 7-Figure 13 As shown, along the extension direction of the steam chamber 220, the extension height of the steam chamber 220 on the first side of the setting panel is greater than the extension height of the steam chamber 220 on the second side of the setting panel, and the first side and the second side are opposite sides of the extension direction of the setting panel. The heat dissipation assembly 300 is located on the second side of the setting panel.

[0127] In this way, the heat dissipation component 300 can be arranged close to the vertical heat dissipation surface, thereby improving the heat exchange efficiency between the heat dissipation component 300 and the steam chamber 220 and enhancing the heat dissipation effect.

[0128] In one possible implementation, such as Figure 1As shown, the counter-gravity heat dissipation system 100 includes two temperature evaporating plates 200 . The two temperature evaporating plates 200 are located on opposite sides of the extension direction of the heat dissipation component 300 , and the two temperature evaporating plates 200 are mirror images of each other.

[0129] In this way, the heat dissipation component 300 can exchange heat Q between the two steam chambers 220 , take away the heat Q transferred by the steam chambers 220 , and improve the heat dissipation effect of the counter-gravity heat dissipation system 100 .

[0130] For example, in the embodiment of the present application, two steam chambers 220 are provided on both sides of the heat dissipation assembly 300, which are mirror images of each other. The left half of the counter-gravity heat dissipation system 100 is composed of Figure 4-Figure 7 The right half of the counter-gravity cooling system 100 is composed of the following: Figure 4-Figure 7 The multiple panels shown are mirrored with the vertical direction as the axis and then stacked and welded in reverse order.

[0131] In one possible implementation, such as Figure 1 Combined with Fig.12 and Fig.13 As shown, the heat dissipation component 300 includes a refrigerant inlet 310 , a refrigerant outlet 320 and a microchannel 330 .

[0132] The refrigerant inlet 310 and the refrigerant outlet 320 are located at the top edge and the bottom edge of the heat dissipation assembly 300 in the vertical direction.

[0133] The microchannel 330 is located between the refrigerant inlet 310 and the refrigerant outlet 320 , and the microchannel 330 is connected to the refrigerant inlet 310 and the refrigerant outlet 320 .

[0134] In this way, the heat Q in the steam chamber 220 can be better removed by utilizing the coldness of the refrigerant L to exchange the heat Q with the steam Z in the steam chamber 220 .

[0135] In a feasible implementation, the plurality of microchannels 330 are arranged in parallel, and each microchannel 330 is connected between the refrigerant inlet 310 and the refrigerant outlet 320 .

[0136] For example, a plurality of micropores 331 may be formed on each of the middle panels, the micropores 331 are spaced apart in a direction perpendicular to the vertical heat dissipation surface, and the micropores 331 on adjacent panels are interconnected to form microchannels 330. Moreover, the solid parts between adjacent micropores 331 on each panel are interconnected with the solid parts between adjacent micropores 331 on adjacent panels, which can ensure that the heat dissipation assembly 300 has sufficient structural strength.

[0137] In this way, a plurality of microchannels 330 are formed between the refrigerant inlet 310 and the refrigerant outlet 320, which have a higher heat transfer coefficient and can also improve the heat dissipation effect. Moreover, this microchannel 330 structure is not only suitable for liquid refrigerant, but also for gas refrigerant.

[0138] It is worth noting that, since the two ends of each micropore 331 are connected to the refrigerant inlet 310 and the refrigerant outlet 320 respectively, the solid part between adjacent micropores 331 on the same panel needs to rely on the adjacent panels to form positioning and support. Therefore, it is possible to first perform processing to form other structures on each panel, then stack the first end panel and multiple middle panels (it is also possible to consider stacking the second end panel), and finally form the micropores 331 by removing materials.

[0139] It should be noted that in the embodiments of the present application, the "micro" in "microgrooves" and "micropores" means that the structural dimensions of the grooves are in the micrometer level, while for structures not explicitly shown, such as "through holes", their structural dimensions can be in the millimeter level or in the micrometer level, and there is no limitation on this.

[0140] It should be noted that, in the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0141] In the description of the embodiments of the present application, the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the term "plurality" means two or more, unless otherwise precisely and specifically specified.

[0142] In the description of the embodiment of the present application, the terms "first", "second", "third", "fourth", etc. (if present) are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0143] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A counter-gravity heat dissipation system, characterized in that: Suitable for a heat-generating element with a small vertical heat-dissipating surface, the counter-gravity heat-dissipating system comprises a plurality of panels arranged in a stacked manner, and the plurality of panels are perpendicular to the vertical heat-dissipating surface; A temperature equalizing plate and a heat dissipation component are arranged between the plurality of panels; The temperature homogenizing plate comprises a condensate pool, a steam chamber and a liquid infusion channel, wherein the condensate pool is located at the bottom of the counter-gravity heat dissipation system in the vertical direction, and the liquid infusion channel and the steam chamber are both located at the top of the counter-gravity heat dissipation system in the vertical direction; The extension plane of the condensate pool is perpendicular to the vertical heat dissipation surface, and at least part of the condensate pool is located on a side of the counter-gravity heat dissipation system close to the vertical heat dissipation surface; the steam chamber and the infusion channel are arranged at intervals, the steam chamber extends from close to the vertical heat dissipation surface to away from the vertical heat dissipation surface, and the extension direction of the infusion channel is perpendicular to the extension plane of the condensate pool; The top of the liquid infusion channel in the vertical direction is connected to an end of the steam chamber close to the vertical heat dissipation surface, and the bottoms of the steam chamber and the liquid infusion channel in the vertical direction are both connected to the condensate pool; The heat dissipation component is disposed adjacent to the steam chamber.

2. The counter-gravity heat dissipation system according to claim 1, characterized in that: There are a plurality of infusion channels, the top ends of the plurality of infusion channels in the vertical direction are interconnected, and at least one of the infusion channels is interconnected with the steam chamber; The distance between the top of at least one of the infusion channels in the vertical direction and the condensate pool is greater than or equal to the distance between the top of the steam chamber in the vertical direction and the condensate pool.

3. The counter-gravity heat dissipation system according to claim 2, characterized in that: The temperature homogenizing plate further includes a plurality of steam cavity micro-channels, which are arranged in a mesh on the cavity wall of the steam cavity and are interconnected, and at least one of the steam cavity micro-channels is connected to the infusion channel, so that the steam cavity is connected to the infusion channel.

4. The counter-gravity heat dissipation system according to claim 3, characterized in that: A plurality of the liquid infusion channels and a plurality of the steam chamber micro-channels are arranged on the same panel, and one of the liquid infusion channels is interconnected with at least two of the steam chamber micro-channels; The infusion channel is provided with at least two infusion holes spaced apart in the vertical direction, the number of the at least two infusion holes is equal to the number of the at least two steam chamber microchannels, and the at least two steam chamber microchannels are connected to the at least two infusion holes in a one-to-one correspondence.

5. The counter-gravity heat dissipation system according to any one of claims 1 to 4, characterized in that: The steam chamber includes a plurality of sub-steam chambers; Along a direction parallel to the vertical heat dissipation surface, a plurality of the sub-steam chambers are arranged at intervals; Ends of the plurality of sub-steam chambers close to the vertical heat dissipation surface are all connected to each other, and ends of the plurality of sub-steam chambers away from the vertical heat dissipation surface are all connected to each other.

6. The heat dissipation system according to claim 5, characterized in that: At least part of the sub-steam chambers are located between part of the panels, part of the panels include a plurality of first sequence panels and a plurality of second sequence panels, and the plurality of first sequence panels and the plurality of second sequence panels are alternately distributed in sequence; The first sequence panel is provided with a plurality of first transverse through holes spaced apart in the vertical direction, the ends of the first transverse through holes away from the vertical heat dissipation surface are interconnected, and the solid parts between adjacent first transverse through holes form a first transverse support; The second sequence panel is provided with a plurality of second transverse through holes spaced apart in the vertical direction, the ends of the second transverse through holes away from the vertical heat dissipation surface are interconnected, and the solid parts between adjacent second transverse through holes form a second transverse support; Along the thickness direction of the panel, the first transverse through hole and the second transverse through hole are interconnected; the first transverse support located on the side of the first transverse through hole away from the vertical heat dissipation surface is interconnected with the second transverse support located on the side of the second transverse through hole away from the vertical heat dissipation surface; the first transverse support located on the side of the first transverse through hole close to the vertical heat dissipation surface and the second transverse support located on the side of the second transverse through hole close to the vertical heat dissipation surface are at least partially staggered.

7. The counter-gravity heat dissipation system according to any one of claims 1 to 4, characterized in that: One end of the steam chamber close to the vertical heat dissipation surface is inclined toward a side close to the condensate pool, and one end of the steam chamber away from the vertical heat dissipation surface is inclined toward a side away from the condensate pool, so that the chamber wall of the steam chamber has an inclined surface that guides the steam to flow toward the condensate pool.

8. The counter-gravity heat dissipation system according to any one of claims 1 to 4, characterized in that: Along the extension direction of the steam cavity, the extension height of the steam cavity at the first side of the panel is greater than the extension height of the steam cavity at the second side of the panel, and the first side and the second side are two opposite sides of the extension direction of the panel; The heat dissipation component is located on the second side of the panel.

9. The counter-gravity heat dissipation system according to claim 8, characterized in that: The heat dissipation component includes a refrigerant inlet, a refrigerant outlet and a microchannel; The refrigerant inlet and the refrigerant outlet are located at the top edge and the bottom edge of the heat dissipation component in the vertical direction; The microchannel is located between the refrigerant inlet and the refrigerant outlet, and the microchannel is communicated with the refrigerant inlet and the refrigerant outlet.

10. The counter-gravity heat dissipation system according to claim 8, characterized in that: It comprises two temperature averaging plates, which are located on opposite sides of the extension direction of the heat dissipation component and are mirror images of each other.

11. An electronic component, characterized in that: It comprises a heating element and a counter-gravity heat dissipation system as described in any one of claims 1 to 10, wherein the heating element has a vertical heat dissipation surface, and the counter-gravity heat dissipation system is arranged on a side of the heating element close to the vertical heat dissipation surface.

Images