PCB structure and electronic device including the same

Abstract

An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes: a circuit board including an opening area and a conductive pattern, the opening area being formed through a first surface of the circuit board and a second surface of the circuit board, the second surface being opposite to the first surface, the conductive pattern being formed in a peripheral area around the opening area; a board disposed on the second surface of the circuit board and covering the opening area; an electronic component disposed on the board and electrically connected to the circuit board; a resin portion disposed between the board and the circuit board and extending from the conductive pattern, the resin portion including a conductive material; and a solder portion formed between the resin portion and the board.

Description

Technical Field

[0001] The present disclosure relates to a PCB structure and an electronic device including the same. Background Art

[0002] The electronic device may include a circuit board. A plurality of electrical (eg, electronic) components may be disposed on the circuit board, and the circuit board may include a conductive pattern connecting the plurality of electrical components. The plurality of electrical components may be electrically connected to the conductive pattern in various ways.

[0003] The electrical components may be mounted on the circuit board using surface mounting technology (SMT). The surface mounting technology may include soldering the electrical components to a partial area (eg, a pad) of a conductive pattern included in the circuit board. Summary of the invention

[0004] Technical issues

[0005] The circuit board may include a pad formed by exposing a conductive pattern. Electronic components may be mounted on the circuit board by soldering to the pad. In order to mount relatively large mechanical parts, wide pads may be required, which makes it difficult to use the circuit board efficiently.

[0006] The image sensor may be disposed on a circuit board included in the camera module. Regarding the flatness of the image sensor, it is preferred that no pressure is applied to the circuit board during mounting of the image sensor.

[0007] The above information is presented as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with respect to the present disclosure.

[0008] Technical Solution

[0009] Embodiments of the present disclosure solve at least the above problems and / or disadvantages and provide at least the advantages described below.Accordingly, embodiments of the present disclosure provide a printed circuit board (PCB) structure for mounting wide mechanical components on relatively small pads.

[0010] Embodiments of the present disclosure provide a board having a flatness suitable for an image sensor and a PCB structure for mounting the board on a circuit board.

[0011] According to an exemplary embodiment of the present disclosure, an electronic device includes: a housing and a PCB structure disposed in the housing. The PCB structure includes: a circuit board including an opening area and a conductive pattern, the opening area is formed through a first surface and a second surface, the conductive pattern is formed in a peripheral area around the opening area, the first surface is opposite to the second surface; a board disposed on the second surface of the circuit board and covering the opening area; an electronic component disposed on the board and electrically connected to the circuit board; a resin portion disposed between the board and the circuit board, extending from the conductive pattern and including a conductive material; and a solder portion formed between the resin portion and the board.

[0012] According to another exemplary embodiment of the present disclosure, an electronic device includes: a housing; a display forming a first surface of the housing; a circuit board disposed in the housing and including a conductive pattern and an insulating layer, the insulating layer covering a portion of the conductive pattern and forming a surface of the circuit board, the circuit board having an opening through which a first portion of the conductive pattern is exposed on the surface of the circuit board; a metal plate disposed on the circuit board and electrically connected to the first portion of the conductive pattern; an electronic component disposed on the metal plate; a conductive resin electrically connecting the electronic component and the conductive pattern; and a solder portion electrically connecting the metal plate and the conductive resin. At least a portion of the conductive resin is accommodated in the opening, and another portion of the conductive resin extends along the surface of the insulating layer.

[0013] Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various exemplary embodiments of the disclosure.

[0014] Beneficial Effects

[0015] According to various exemplary embodiments of the present disclosure, the flatness of an image sensor can be improved. In addition, the utilization rate of a circuit board can be improved. In addition, the present disclosure can provide various effects that can be directly or indirectly realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0017] Figure 1 is a block diagram illustrating an example electronic device in a network environment 100 according to various embodiments;

[0018] Figure 2A is a front perspective view of an electronic device according to various embodiments;

[0019] Figure 2B is a rear perspective view of an electronic device according to various embodiments;

[0020] Figure 2Cis an exploded perspective view of an electronic device according to various embodiments;

[0021] Figure 3A is a perspective view showing a camera module of an electronic device according to various embodiments;

[0022] Figure 3B is an exploded perspective view of a camera module of an electronic device according to various embodiments;

[0023] Figure 4 is a diagram showing an example PCB structure of a camera module of an electronic device according to various embodiments;

[0024] Figure 5 is a cross-sectional view showing a PCB structure of a camera module of an electronic device according to various embodiments; and

[0025] Figure 6 is a cross-sectional view illustrating a PCB structure of an electronic device according to various embodiments.

[0026] In the following description with respect to the accompanying drawings, like components will be given like reference numerals. DETAILED DESCRIPTION

[0027] Hereinafter, various example embodiments of the present disclosure may be described with reference to the accompanying drawings. Therefore, those of ordinary skill in the art will recognize that various modifications, equivalents and / or substitutions may be made to the various example embodiments described herein without departing from the scope and spirit of the present disclosure. With respect to the description of the accompanying drawings, similar components may be marked with similar reference numerals.

[0028] Figure 1 is a block diagram illustrating an example electronic device 101 in a network environment 100 according to various embodiments.

[0029] Reference Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In various embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In various embodiments, some of the components may be implemented as a single integrated circuit.For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented to be embedded in the display device 160 (eg, a display).

[0030] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may load a command or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be specifically used for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 , or as part of the main processor 121 .

[0031] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123, rather than the main processor 121, may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123.

[0032] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0033] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0034] The input device 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input device 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0035] The sound output device 155 can output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as a part of the speaker.

[0036] The display device 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the strength of a force caused by a touch.

[0037] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input device 150, or output sound via the sound output device 155 or an external electronic device (e.g., electronic device 102) (e.g., a speaker of a headset) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0038] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0039] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0040] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0042] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0043] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0044] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0045] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with the external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a Wide Area Network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0046] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element including a conductive material or a conductive pattern formed in or on a substrate (e.g., a PCB). According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190. A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0047] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0048] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0049] Figure 2A is a front perspective view of an electronic device according to various embodiments. Figure 2B is a rear perspective view of an electronic device according to various embodiments.

[0050] Reference Figure 2A and Figure 2B According to an embodiment, the electronic device 200 may include a housing 210 including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B.

[0051] In an embodiment (not shown), the housing 210 may be formed Figure 2A and Figure 2B The structure of some of the first surface 210A, the second surface 210B, and the side surfaces 210C.

[0052] According to an embodiment, the first surface 210A may be formed by a front plate 202, at least a portion of which is substantially transparent (e.g., a glass plate including various coatings, or a polymer plate). The second surface 210B may be formed by a substantially opaque rear plate 211. The rear plate 211 may be formed by, for example, coated or tinted glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of at least two of the foregoing materials. The side surface 210C may be formed by a side frame structure (or "frame structure") 218 ​​coupled to the front plate 202 and the rear plate 211 and comprising metal and / or polymer.

[0053] In various embodiments, the rear panel 211 and the side frame structure 218 may be integrally formed with each other and may include the same material (eg, a metal material such as aluminum).

[0054] In the illustrated embodiment, the front plate 202 may include two first regions 210D at opposite long edges thereof that are bent and seamlessly extend from the first surface 210A toward the rear plate 211 .

[0055] In the illustrated embodiment, the rear plate 211 may include two second regions 210E at opposite long edges thereof that are bent and seamlessly extend from the second surface 210B toward the front plate 202 .

[0056] In various embodiments, the front plate 202 (or the rear plate 211) may include only one of the first region 210D (or the second region 210E). In an embodiment, the front plate 202 (or the rear plate 211) may not include a portion of the first region 210D (or the second region 210E).

[0057] In an embodiment, when viewed from a side of the electronic device 200, the side frame structure 218 may have a first thickness (or width) at an edge (e.g., a short edge) that does not include the first region 210D or the second region 210E, and may have a second thickness at an edge (e.g., a long edge) that includes the first region 210D or the second region 210E, the second thickness being less than the first thickness.

[0058] According to an embodiment, the electronic device 200 may include a display 201, audio modules 203 and 207 (eg, Figure 1 audio module 170), a sensor module (not shown) (e.g., Figure 1 sensor module 176), camera modules 290a, 290b and 213 (e.g., Figure 1 camera module 180), key input device 217 (eg, Figure 1 input device 150) or connector hole 208 (e.g., Figure 1 In various embodiments, the electronic device 200 may not include at least one of the aforementioned components (e.g., the key input device 217), or may further include other (multiple) components (e.g., a light emitting element (not shown)).

[0059] For example, the display 201 may be exposed through a majority of the front plate 202. In various embodiments, at least a portion of the display 201 may be exposed through the front plate 202 including the first surface 210A and the first region 210D of the side surface 210C.

[0060] In various embodiments, the periphery of the display 201 may be formed to be substantially the same shape as the adjacent outer edge of the front plate 202. In an embodiment (not shown), in order to expand the exposed area of ​​the display 201, the gap between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed to be substantially constant.

[0061] In an embodiment, the surface of the housing 210 (or the front plate 202) may include a screen display area formed when the display 201 is visually exposed (e.g., visible or visible). For example, the screen display area may include the first surface 210A and the first area 210D of the side surface 210C.

[0062] In various embodiments, the screen display areas 210A and 210D may include a sensing area (not shown) configured to obtain biometric information of the user. For example, the sensing area may refer to an area that can display visual information of the display 201 like other areas of the screen display areas 210A and 210D and additionally obtain biometric information (e.g., fingerprint) of the user.

[0063] In an embodiment, the screen display areas 210A and 210D of the display 201 may include an area through which the first camera module 290a (e.g., a punch hole camera) is visually exposed (e.g., visible). For example, the area through which the first camera module 290a is exposed may be surrounded by the screen display areas 210A and 210D. In various embodiments, the first camera module 290a may include multiple camera modules (e.g., Figure 1 camera module 180).

[0064] In an embodiment (not shown), the display 201 may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor for measuring touch strength (pressure), and / or a digitizer for detecting a magnetic type stylus.

[0065] In various embodiments, at least a portion of the key input device 217 may be disposed on the side surface 210C (eg, the first region 210D and / or the second region 210E).

[0066] The audio modules 203 and 207 may include a microphone hole 203 and a speaker hole 207. A microphone for obtaining sound from the outside may be provided in the microphone hole 203, and in various embodiments, a plurality of microphones may be provided in the microphone hole 203 to detect the direction of the sound. The speaker hole 207 may include an external speaker hole 207 and a receiver hole (not shown) for a phone call. In various embodiments, the speaker hole 207 and the microphone hole 203 may be implemented with a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without the speaker hole 207.

[0067] A sensor module (not shown) (eg, Figure 1 The sensor module 176 of the electronic device 200 may generate an electrical signal or a data value corresponding to an operating state inside the electronic device 200 or an environmental state outside the electronic device 200. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0068] The camera modules 290 a , 290 b , and 213 may include a first camera module 290 a (eg, a punch-hole camera) visible on a first surface 210A of the electronic device 200 , and a second camera module 290 b and / or a flash 213 exposed on a second surface 210B of the electronic device 200 .

[0069] In an embodiment, the first camera module 290a may be visible through portions of the screen display areas 210A and 210D of the display 201. For example, the first camera module 290a may be visible through an opening (e.g., a perforation) formed in a portion of the display 201 in portions of the screen display areas 201A and 210D.

[0070] In an embodiment, the second camera module 290b may include a plurality of camera modules (eg, dual cameras, triple cameras, or quad cameras). However, the second camera module 290b is not necessarily limited to include a plurality of camera modules and may include one camera module.

[0071] The first camera module 290a and the second camera module 290b may include one or more lenses, image sensors and / or image signal processors, but are not limited thereto. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In various embodiments, two or more lenses (IR camera lens, wide-angle lens, and telephoto lens) and an image sensor may be disposed on one surface of the electronic device 200.

[0072] The key input device 217 may be provided on the side surface 210C of the housing 210. In an embodiment, the electronic device 200 may not include all or some of the aforementioned key input devices 217, and the key input device 217 not included may be implemented in a different form (such as a soft key) on the display 201. In various embodiments, the key input device 217 may include a sensor module (not shown) that forms a sensing area (not shown) included in the screen display areas 210A and 210D.

[0073] The connector hole 208 may include a first connector hole 208 and / or a second connector hole (not shown) (e.g., a headphone jack), a connector for sending and receiving power and / or data with an external electronic device (e.g., a USB connector) is accommodated in the first connector hole 208, and a connector for sending and receiving audio signals with an external electronic device is accommodated in the second connector hole.

[0074] In various embodiments, the electronic device 200 may include a light emitting element (not shown). The light emitting element may be disposed, for example, on the first surface 210A of the housing 210. The light emitting element may provide, for example, state information of the electronic device 200 in the form of light. In an embodiment, the light emitting element may provide, for example, a light source that operates in conjunction with the first camera module 290a. The light emitting element may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0075] Figure 2C is an exploded perspective view of an electronic device according to various embodiments.

[0076] Reference Figure 2C, the electronic device 200 may include a front panel 220 (eg, Figure 2A 210A and the first area 210D), the display 230 (eg, Figure 2A display 201), side member 240 (eg, Figure 2A 210C, for example, including a frame or frame structure), a first support member 242 (for example, a plate structure), a circuit board 250, a battery 259, a second support member 260, and a rear plate 280 (for example, Figure 2B the rear surface 210B and the second area 210E).

[0077] In various embodiments, the electronic device 200 may not include at least one of the aforementioned components (eg, the first support member 242 or the second support member 260), or may additionally include other (multiple) components. Figure 2A and Figure 2B At least one component of the electronic device 200 is the same or similar, and the repeated description will not be repeated.

[0078] The first support member 242 may be provided in the electronic device 200 and may be connected to the side member 240, or may be integrally formed with the side member 240. The first support member 242 may be formed of, for example, a metal material and / or a non-metallic (e.g., polymer) material. The display 230 may be coupled to one surface of the first support member 242, and the circuit board 250 may be coupled to the opposite surface of the first support member 242. The circuit board 250 may have, for example, but not limited to, a processor, a memory, and / or an interface (e.g., an electronic component or device) mounted thereon. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, a communication processor, etc., but is not limited thereto.

[0079] The memory may include, for example, volatile memory or non-volatile memory.

[0080] The interface may include various interface circuits, such as a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface may electrically or physically connect the electronic device 200 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0081] The battery 259, which may refer to, for example, a device for supplying power to at least one component of the electronic device 200, may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. For example, at least a portion of the battery 259 may be disposed on substantially the same plane as the circuit board 250. The battery 259 may be integrally disposed inside the electronic device 200, or may be disposed to be detachable from the electronic device 200.

[0082] In various embodiments, the first camera module 290a may be disposed on the first support member 242 of the side member 240 so that the lens is visible through the front panel 220 (eg, Figure 2A For example, the first camera module 290a may be arranged so that the optical axis of the lens is at least partially aligned with the hole or recess 237 formed in the display 230. For example, the area through which the lens is exposed may be formed in the front plate 220. For example, the first camera module 290a may include a perforated camera arranged in the hole or recess 237 formed in the rear surface of the display 230.

[0083] In various embodiments, the second camera module 290b may be disposed on the circuit board 250 so that the lens is visible through the rear plate 280 (eg, Figure 2B A camera area 284 of the rear surface 210B) is visible.

[0084] In the illustrated embodiment, the camera area 284 may be formed on a surface of the rear plate 280 (eg, Figure 2B In various embodiments, the camera region 284 may be formed to be at least partially transparent so that external light is incident on the lens of the second camera module 290b. In various embodiments, at least a portion of the camera region 284 may protrude from the surface of the rear plate 280 to a predetermined height. However, the camera region 284 is not limited thereto, and in various embodiments, the camera region 284 may form a substantially same plane as the surface of the rear plate 280.

[0085] In various embodiments, the front panel 220, the rear panel 280, and at least a portion of the side members 240 may form a housing (eg, Figure 2A and Figure 2B housing 210).

[0086] Figure 3A is a perspective view illustrating an example camera module of an electronic device according to various embodiments. Figure 3B is an exploded perspective view of a camera module of an electronic device according to various embodiments.

[0087] Figure 3A and Figure 3B The camera module 290 shown may include Figure 2C The first camera module 290a or the second camera module 290b is shown.

[0088] Reference Figure 3A and Figure 3B , the camera module 290 may include a camera housing 294 , a body 291 and a PCB structure 300 .

[0089] In an embodiment, the camera housing 294 may include a base 296 and a cover 295. The circuit board 310 may be disposed on the base 296. The base 296 and the cover 295 may form an internal space in which the body 291 is accommodated. In an embodiment, the body 291 may include a lens 292 and a lens barrel 293 surrounding at least a portion of the lens 292. At least a portion of the body 291 may be accommodated in the camera housing 294. For example, a portion of the lens barrel 293 may extend outside the camera housing 294.

[0090] In an embodiment, at least a portion of the PCB structure 300 may be disposed in the camera housing 294. The PCB structure 300 may include a circuit board 310, an image sensor 299, and an extension region 319.

[0091] In an embodiment, the circuit board 310 may be disposed in the camera housing 294. The extension region 319 may extend from the circuit board 310 to the outside of the camera housing 294. In various embodiments, electronic components including the image sensor 299 may be disposed on the circuit board 310. In various embodiments, at least a portion of the circuit board 310 may be formed of a rigid circuit board, and another portion of the circuit board 310 may be formed of a flexible circuit board. For example, the area where the image sensor 299 is disposed may be formed of a rigid circuit board. In various embodiments, the extension region 319 may extend to a circuit board (e.g., Figure 2C The extended region 319 may include other electronic components electrically connected to the electronic device 200 (e.g., Figure 1 The extension region 319 may include a flexible circuit board.

[0092] In an embodiment, the image sensor 299 may be disposed to be aligned with the optical axis L of the lens 292. For example, the image sensor 299 may include a planar area having a normal vector parallel to the optical axis L of the lens 292.

[0093] In an embodiment, a partial area of ​​the circuit board 310 on which the image sensor 299 is disposed may be formed of a flat surface whose normal vector is parallel to the optical axis L of the lens 292 .

[0094] Figure 4is a diagram illustrating an example PCB structure of a camera module of an electronic device according to various embodiments.

[0095] Figure 4 The PCB structure 300 shown may include Figure 3A and Figure 3B The circuit board 310 of the camera module 290 is shown as well as Figure 2C The circuit board 250 of the electronic device 200 is shown.

[0096] In an embodiment, the PCB structure 300 may include a structure for mounting the electronic component 302 on the circuit board 310. For example, the PCB structure 300 may include the circuit board 310, the board 350, and the electronic component 302.

[0097] In an embodiment, the circuit board 310 may include an open area 317. The open area 317 may be formed through a first surface and a second surface opposite to each other of the circuit board 310. In an embodiment, the board 350 may be disposed on the circuit board 310. For example, the board 350 may make surface-to-surface contact with the circuit board 310.

[0098] In an embodiment, the circuit board 310 may be formed such that the board 350 is exposed through the opening area 317. In an embodiment, the circuit board 310 may be formed to surround the electronic components 302 disposed on the board 350.

[0099] In an embodiment, the circuit board 310 may further include an extension area 319 extending to one side. In various embodiments, the extension area 319 may extend from the inside to the outside of the camera housing 294. In various embodiments, the extension area 319 may include a flexible circuit board.

[0100] In an embodiment, at least a portion of the plate 350 may be attached to a surface of the circuit board 310. In an embodiment, the plate 350 may be coupled to the circuit board 310 to cover at least a portion of the open area 317 of the circuit board 310. In various embodiments, the plate 350 may include a metal material. In various embodiments, the plate 350 may be formed to be more rigid than the circuit board 310.

[0101] In an embodiment, the board 350 may include a first region 351 on which the electronic component 302 is disposed and a second region 352 on which the circuit board 310 is disposed and surrounding at least a portion of the first region 351. For example, the first region 351 may form the bottom of the opening region 317 of the circuit board 310.

[0102] In an embodiment, the board 350 may be electrically connected to the electronic component 302. In various embodiments, the electronic component 302 may include an image sensor (e.g., Figure 3B image sensor 299).

[0103] In an embodiment, the board 350 may be electrically connected to the circuit board 310. For example, the board 350 may be electrically connected to a conductive pattern (eg, Figure 5 The second region 352 of the board 350 may be electrically connected to a portion of the conductive pattern. In an embodiment, the board 350 may be attached to the circuit board 310 by a conductive adhesive material. For example, one or more conductive materials may be located between the second region 352 of the board 350 and the circuit board 310. In an embodiment, the board 350 may be surface mounted on the circuit board 310. In various embodiments, the second region 352 of the board 350 may be attached to the surface of the circuit board 310 by soldering.

[0104] Figure 5 is a cross-sectional view illustrating a PCB structure of a camera module of an electronic device according to various embodiments. Figure 5 It is along Figure 4 A cross-sectional view taken along line AA'.

[0105] In an embodiment, the electronic device 200 may include a PCB structure 300 for mounting an electronic component 302. The PCB structure 300 may include a circuit board 310, a resin portion 360, a board 350, a solder portion 370, and the electronic component 302.

[0106] Figure 5 The illustrated circuit board 310 may include a camera module (e.g., Figure 3A and Figure 3B The camera module 290 has an image sensor (eg, Figure 3B The image sensor 299) of the circuit board (eg, Figure 3B For example, the camera module 290 may include a circuit board 310 formed by passing through the rear surface of the electronic device 200 (eg, Figure 2B A rear camera module 290b is visible on the rear surface 210B).

[0107] In an embodiment, the circuit board 310 may include a plurality of layers 320 and an open area 317 formed through the plurality of layers 320. The open area 317 may be formed through a first surface 311 and a second surface 312 of the circuit board 310 that are opposite to each other.

[0108] In an embodiment, the plurality of layers 320 may include a first insulating layer 321 , a second insulating layer 322 , a conductive pattern 380 , and a layer group 329 .

[0109] In an embodiment, the first insulating layer 321 may form at least a portion of the first surface 311 of the circuit board 310. The first insulating layer 321 may include a first opening 326 through which a portion (e.g., the second portion 382) of the conductive pattern 380 is exposed. The solder material 371 may be accommodated in the first opening 326.

[0110] In an embodiment, the second insulating layer 322 may form at least a portion of the second surface 312 of the circuit board 310. The second insulating layer 322 may include a second opening 325 through which a portion (e.g., the first portion 381) of the conductive pattern 380 is exposed. The resin portion 360 may be formed in the second opening 325.

[0111] In an embodiment, the conductive pattern 380 may include a first portion 381 in contact with the resin portion 360. In the illustrated embodiment, the first portion 381 may be exposed on the second surface 312 of the circuit board 310 through the second opening 325 of the second insulating layer 322. In various embodiments, the first portion 381 may be referred to as a conductive pad of the circuit board 310 on which the electronic component 302 is disposed or electrically connected.

[0112] In an embodiment, the conductive pattern 380 may include a second portion 382 electrically insulated from the first portion 381. In an embodiment, a ground signal may be applied to the first portion 381. In an embodiment, an electrical signal different from the ground signal may be applied to the second portion 382. In various embodiments, the second portion 382 of the conductive pattern 380 may be exposed on the first surface 311 of the circuit board 310 through the first opening 326 of the first insulating layer 321. In various embodiments, a solder material 371 electrically connected to the second portion 382 of the conductive pattern 380 may be accommodated in the first opening 326. The solder material 371 may electrically connect the second portion 382 and the electronic component 302. In various embodiments, the second portion 382 may be referred to as a conductive pad of the circuit board 310, on which the electronic component 302 is disposed or electrically connected to the conductive pad.

[0113] In various embodiments, the first portion 381 and the second portion 382 may be conductive patterns formed in different layers among the plurality of layers 320 of the circuit board 310 .

[0114] In an embodiment, at least a portion of the resin portion 360 may be received in the second opening 325 , and another portion of the resin portion 360 may extend along a surface of the second insulating layer 322 .

[0115] In an embodiment, the resin portion 360 may include a conductive material. For example, the resin portion 360 may be formed by curing a liquid conductive material applied to the conductive pattern 380. In various embodiments, the conductive material may include a thermosetting resin and a UV curable resin.

[0116] In various embodiments, the resin portion 360 may contain solder paste. In various embodiments, the resin portion 360 may additionally contain metal and / or tin. For example, the resin portion 360 may be plated with metal and / or tin.

[0117] In an embodiment, the solder portion 370 may be formed between the resin portion 360 and the board 350. The solder portion 370 may bond the board 350 to the resin portion 360. The solder portion 370 may be formed by solidifying a solder material between the board 350 and the resin portion 360.

[0118] In an embodiment, the board 350 may be formed to be substantially flat. In an embodiment, the board 350 may support the electronic component 302 so that the electronic component 302 remains flat. In an embodiment, the board 350 may prevent and / or reduce warping of the circuit board 310.

[0119] In an embodiment, the electronic component 302 may be disposed on the board 350. The electronic component 302 may be electrically connected to the circuit board 310. For example, the electronic component 302 may be electrically connected to the first portion 381 and the second portion 382 of the conductive pattern 380 included in the circuit board 310. For example, the electronic component 302 may be electrically connected to the first portion 381 of the conductive pattern 380 through the board 350 and the resin portion 360. For example, the electronic component 302 may be electrically connected to the second portion 382 of the conductive pattern 380 through the lead 303.

[0120] In an embodiment, a portion of the lead 303 may be soldered to the second portion 382 of the conductive pattern 380 by the solder material 371. In various embodiments, a ground signal may be applied to the first portion 381 of the conductive pattern 380 and the resin portion 360. An electrical signal different from the ground signal may be applied to the lead 303 and the second portion 382 of the conductive pattern 380.

[0121] In various embodiments (not shown), layer group 329 may include a plurality of conductive layers and a plurality of insulating layers.

[0122] Figure 6 is a cross-sectional view illustrating an example PCB structure of an electronic device according to various embodiments.

[0123] Figure 6 The circuit board 410 shown may include a circuit board of the electronic device 200 (eg, Figure 2C circuit board 250) or a camera module (e.g., Figure 3A and Figure 3B The camera module 290) has a circuit board (eg, Figure 3B circuit board 310).

[0124] Figure 6 The electronic components 402 shown may include an image sensor (e.g., Figure 3B image sensor 299).

[0125] In an embodiment, the PCB structure 400 may include a circuit board 410, a resin portion 460 (eg, Figure 5 The resin portion 360), the plate 450 (eg, Figure 5 board 350), solder portion 470 (eg, Figure 5 solder portion 370) and electronic component 402 (eg, Figure 5 electronic components 302).

[0126] In an embodiment, the circuit board 410 may include a plurality of layers 420. The plurality of layers 420 may include a first insulating layer 421, a second insulating layer 422, a first conductive pattern 480, a second conductive pattern 484, and a layer group 429.

[0127] In an embodiment, the first insulating layer 421 may form the first surface 411 of the circuit board 410. The first insulating layer 421 may include a first opening 425 and a second opening 426 through which a portion of the first conductive pattern 480 is exposed. For example, the resin portion 460 may be formed in the first opening 425. For example, the solder material 471 may be located in the second opening 426. In various embodiments, the first insulating layer 421 may be formed by applying an insulating material such that the insulating material covers at least a portion of the first conductive pattern 480.

[0128] In an embodiment, the first conductive pattern 480 may include a first portion 481 in contact with the resin portion 460, a second portion 482 in contact with the solder material 471, and a third portion 483 covered by the first insulating layer 421. For example, at least two of the first portion 481, the second portion 482, and the third portion 483 may be electrically insulated from each other. In various embodiments, the first portion 481 and the second portion 482 may be referred to as conductive pads of the circuit board 410.

[0129] In an embodiment, the board 450 may be disposed on the first surface 411 of the circuit board 410. In an embodiment, the electronic component 402 may be located on the board 450. In various embodiments, the board 450 may support the electronic component 402 so that the electronic component 402 remains flat. In various embodiments, at least a portion of the resin portion 460 may be disposed between the board 450 and the circuit board 410.

[0130] In an embodiment, the electronic component 402 may be connected to the second portion 482 of the first conductive pattern 480 by wire bonding. For example, one side of the wire 403 may be connected to the electronic component 402, and the opposite side of the wire 403 may be electrically connected to the second portion 482 of the first conductive pattern 480 by soldering.

[0131] In an embodiment, at least a portion of the resin portion 460 may be accommodated in the first opening 425 formed in the first insulating layer 421, and another portion of the resin portion 460 may extend along the surface of the first insulating layer 421. In an embodiment, the resin portion 460 may include a conductive material. In various embodiments, the resin portion 460 may be formed by curing a liquid conductive material that fills the first opening 425 and is applied to the surface of the first insulating layer 421. In various embodiments, the conductive material may include a thermosetting material resin and a UV curable resin.

[0132] In various embodiments, the board 450 may be surface mounted on the resin portion 460. For example, a solder portion 470 containing a solder material may be located on one surface of the resin portion 460 facing the board 450. In various embodiments, the resin portion 460 may additionally contain solder paste. For example, the solder paste may contain metal and / or tin. For example, the resin portion 460 may be plated with metal or tin.

[0133] In an embodiment, the first portion 481 of the first conductive pattern 480 may be electrically connected to the electronic component 402 through the board 450 and the resin portion 460. In various embodiments, the first portion 481 of the first conductive pattern 480 may include a ground region.

[0134] An electrical signal different from the ground signal may be applied to the second portion 482 of the first conductive pattern 480 .

[0135] In an embodiment, the second insulating layer 422 may form the second surface 412 of the circuit board 410. The second insulating layer 422 may include a third opening 427 through which a portion of the second conductive pattern 484 is exposed. The second insulating layer 422 may be formed by applying an insulating material such that the insulating material covers a portion of the second conductive pattern 484. In various embodiments, the third opening 427 may be referred to as a conductive pad of the circuit board 410.

[0136] In various embodiments (not shown), the layer group 429 may include a plurality of conductive layers and a plurality of insulating layers.

[0137] In various embodiments, Figure 5 The PCB structure 300 shown may be included in a front camera module (eg, Figure 2CIn various embodiments, Figure 6 The illustrated PCB structure 400 may be included in a rear camera module (eg, Figure 2C In the second camera module 290b).

[0138] Reference Figure 5 and Figure 6 In the PCB structures 300 and 400 shown, when the circuit boards 310 and 410 are viewed from above, the boards 350 and 450 can be positioned to overlap at least a portion of the conductive patterns 380 and 480. For example, when a mechanical component (e.g., board 350 and 450) is mounted on the circuit boards 310 and 410 according to the related art, a wide pad corresponding to the size of the mechanical component may be required, so the area of ​​the pattern region (e.g., the region where the conductive patterns 380 and 480 are formed) may be relatively reduced. However, the PCB structures 300 and 400 according to the embodiments of the present disclosure are configured so that the mechanical component (e.g., board 350 and 450) and the pattern region (e.g., conductive patterns 380 and 480) overlap each other. Therefore, the area of ​​the circuit boards 310 and 410 can be efficiently used.

[0139] An electronic device according to various exemplary embodiments of the present disclosure may include a housing and a PCB structure disposed in the housing. The PCB structure may include: a circuit board including an opening area formed through a first surface and a second surface of the circuit board, and a conductive pattern formed in a peripheral area around the opening area, the first surface and the second surface being opposite to each other; a board disposed on the second surface of the circuit board and covering the opening area; an electronic component disposed on the board and electrically connected to the circuit board; a resin portion disposed between the board and the circuit board, extending from the conductive pattern and including a conductive material; and a solder portion formed between the resin portion and the board.

[0140] In various example embodiments, the circuit board may further include an insulating layer covering at least a portion of the conductive pattern and forming at least a portion of the second surface of the circuit board. The insulating layer may include a first opening through which a first portion of the conductive pattern is exposed on the second surface of the circuit board. The resin portion may contact the first portion of the conductive pattern.

[0141] In various example embodiments, at least a portion of the resin portion may be received in the first opening, and another portion of the resin portion may be formed on the second surface of the circuit board.

[0142] In various example embodiments, the conductive material may be configured to be applied to the inside of the first opening and the surface of the insulating layer in a liquid phase, and may be cured to form the resin portion.

[0143] In various example embodiments, the resin portion may include a thermosetting resin or a UV curable resin.

[0144] In various example embodiments, the resin portion may be plated with metal and / or tin.

[0145] In various example embodiments, the ground region of the circuit board may include a first portion of the conductive pattern, and the electronic component may be electrically connected to the first portion through the board.

[0146] In various example embodiments, the conductive pattern may include a second portion exposed on the first surface of the circuit board, and the second portion may be electrically connected to the electronic component.

[0147] In various example embodiments, the electronic device may further include a wire electrically connecting the electronic element with the second portion of the conductive pattern.

[0148] In various example embodiments, an electrical signal different from a ground signal may be applied to the second portion of the conductive pattern.

[0149] In various example embodiments, the board may include a first region contacting the solder portion and a second region at least partially surrounded by the first region, and the electronic component may be disposed on the second region.

[0150] In various example embodiments, the first region and the second region may form the same plane.

[0151] In various example embodiments, a region of the second surface of the circuit board where the resin portion is formed may have a first height from the board, and at least a portion of the electronic component may have a second height from the board that is substantially the same as the first height.

[0152] In various example embodiments, the electronic device may further include a camera module including a lens, and the electronic element may include an image sensor aligned with an optical axis of the lens.

[0153] In various example embodiments, the plate may be formed of a flat surface having a normal vector parallel to the optical axis of the lens.

[0154] An electronic device according to various exemplary embodiments of the present disclosure may include: a housing; a display; a circuit board disposed in the housing and including a conductive pattern and an insulating layer, the insulating layer covering a portion of the conductive pattern and forming a surface of the circuit board, the circuit board having an opening, a first portion of the conductive pattern being exposed on the surface of the circuit board through the opening; a metal plate disposed on the circuit board and electrically connected to the first portion of the conductive pattern; an electronic component disposed on the metal plate; a conductive resin electrically connecting the electronic component and the conductive pattern; and a solder portion electrically connecting the metal plate and the conductive resin. At least a portion of the conductive resin may be accommodated in the opening, and another portion of the conductive resin may extend along the surface of the insulating layer.

[0155] In various example embodiments, the metal plate may be surface mounted on a circuit board via a conductive resin and a solder portion.

[0156] In various example embodiments, the conductive resin may include a thermosetting resin and / or a UV curable resin.

[0157] In various example embodiments, the conductive pattern may include a second portion electrically insulated from the first portion, and the second portion may be electrically connected to the electronic component through wire bonding.

[0158] In various example embodiments, the electronic device may further include a camera module including a lens visible on the first surface of the housing, the circuit board may be included in the camera module, and the electronic component may include an image sensor aligned with an optical axis of the lens.

[0159] According to various exemplary embodiments of the present disclosure, the flatness of an image sensor can be improved. In addition, the utilization rate of a circuit board can be improved. In addition, the present disclosure can provide various effects that can be directly or indirectly realized.

[0160] The various embodiments of the present disclosure and the terms used herein are not intended to limit the technology described in the present disclosure to specific embodiments, and it should be understood that the embodiments and terms include various modifications, equivalents or alternative forms for the corresponding embodiments described herein. For the description of the accompanying drawings, similar parts may be marked by similar reference numerals. Terms in the singular form may include plural forms unless otherwise specified. In the disclosure disclosed herein, the expressions "A or B", "at least one of A and / or B", "A, B or C" or "at least one of A, B and / or C" etc. used herein may include any and all combinations of one or more of the relevant listed items. Expressions such as "first" or "second" etc. may describe their components regardless of their priority or importance, and may be used to distinguish one component from another component, but are not limited to these components. When a (e.g., first) component is referred to as being "(operably or communicatively) coupled with / to another (e.g., second) component" or "connected to another (e.g., second) component", it may be directly coupled with / to the other component, or an intervening component (e.g., a third component) may be present.

[0161] As used herein, the expression "adapted to or configured to" may be used interchangeably with, for example, the expressions "suitable for," "having the ability to," "changed to," "made to," "capable of," or "designed to," in terms of hardware or software, as the case may be. The expression "a device configured to" may refer to a device that is "capable of" operating with another device or other parts. For example, "a processor configured to (or set to) perform A, B, and C" may refer to, for example, a dedicated processor (e.g., an embedded processor) for performing the corresponding operations or a general-purpose processor (e.g., a central processing unit (CPU) or an application processor (AP)) that performs the corresponding operations by running one or more software programs stored in a storage device (e.g., memory 130).

[0162] The term "module" used herein may include a unit implemented in hardware, software or firmware or any combination thereof, and may be used interchangeably with the terms "logic", "logic block", "part", "circuit", etc. A "module" may be the smallest unit of an integrated part or a part thereof, or may be the smallest unit for performing one or more functions or a part thereof. A "module" may be implemented mechanically or electrically, and may include, for example, a dedicated IC (ASIC) chip, a field programmable gate array (FPGA), and a programmable logic device known or to be developed for performing some operations.

[0163] At least a portion of the apparatus (e.g., its modules or functions) or methods (e.g., operations) according to various embodiments may be implemented, for example, by instructions stored in a computer-readable storage medium (e.g., memory 130) in the form of a program module. When the instruction is executed by a processor (e.g., processor 120), the processor may perform a function corresponding to the instruction. The computer-readable recording medium may include a hard disk, a floppy disk, a magnetic medium (e.g., a magnetic tape), an optical medium (e.g., a compact disk read-only memory (CD-ROM) and a digital versatile disk (DVD), a magneto-optical medium (e.g., an optical magneto-floppy disk)), an embedded memory, etc. One or more instructions may include a code generated by a compiler or a code executable by an interpreter.

[0164] Each component (e.g., module or program module) according to various embodiments may include a single entity or multiple entities, may omit a part of the above-mentioned subcomponents, or may further include other subcomponents. Alternatively or additionally, after being integrated into an entity, some components (e.g., module or program module) may identically or similarly perform the functions performed by each corresponding component before integration. According to various embodiments, the operations performed by a module, program module or other components may be performed by a sequential method, a parallel method, a repetitive method or a heuristic method, or may be performed at least a portion of the operations or omitted at least a portion of the operations in different orders. Alternatively, other operations may be added.

[0165] Although the present disclosure has been shown and described with reference to various exemplary embodiments of the present disclosure, it will be understood that the various exemplary embodiments are intended to be illustrative rather than restrictive. It will also be understood by those skilled in the art that various changes in form and details may be made without departing from the true spirit and full scope of the present disclosure including the appended claims and their equivalents.

Claims

1. An electronic device, comprising: case; as well as a printed circuit board (PCB) structure disposed in the housing, The printed circuit board structure comprises: A circuit board, comprising an opening area, a conductive pattern, and an insulating layer, wherein the opening area is formed through a first surface of the circuit board and a second surface of the circuit board, the second surface of the circuit board is opposite to the first surface of the circuit board, the conductive pattern is formed in a peripheral area around the opening area, the insulating layer covers at least a portion of the conductive pattern and forms at least a portion of the second surface of the circuit board, wherein the insulating layer comprises a first opening, and a first portion of the conductive pattern is exposed on the second surface of the circuit board through the first opening; a plate, disposed on the second surface of the circuit board and covering the opening area; An electronic component is disposed on the board and electrically connected to the circuit board; a resin portion provided between the board and the circuit board, the resin portion extending from the conductive pattern and including a conductive material; and a solder portion formed between the resin portion and the board, wherein at least a portion of the resin portion is accommodated in the first opening and between an inner wall of the first opening and a side surface of the first portion of the conductive pattern facing the inner wall of the first opening, and another portion of the resin portion extends along a surface of the insulating layer to be formed on the second surface of the circuit board. 2 . The electronic device according to claim 1 , wherein the resin portion is formed to contact the first portion of the conductive pattern. 3 . The electronic device according to claim 1 , wherein the conductive material is configured to be applied to the inside of the first opening and the surface of the insulating layer in a liquid phase and to be curable to form the resin portion. 4 . The electronic device according to claim 1 , wherein the resin portion comprises a thermosetting resin or a UV curable resin. The electronic device according to claim 1 , wherein the resin portion is plated with metal and / or tin.

6. The electronic device according to claim 1, wherein a ground area of ​​the circuit board includes the first portion of the conductive pattern, and wherein the electronic component is electrically connected to the first portion through the board.

7. The electronic device according to claim 1, wherein the conductive pattern includes a second portion exposed on the first surface of the circuit board, and The second part is electrically connected to the electronic component.

8. The electronic device according to claim 7, further comprising: A lead electrically connects the electronic component and the second portion of the conductive pattern. 9 . The electronic device of claim 7 , wherein the second portion of the conductive pattern is configured to have an electrical signal different from a ground signal applied thereto.

10. The electronic device according to claim 1, wherein the board includes a first area contacting the solder portion and a second area at least partially surrounded by the first area, and The electronic component is arranged on the second area. The electronic device according to claim 10 , wherein the first area and the second area form a same plane.

12. The electronic device according to claim 1, wherein a region of the second surface of the circuit board where the resin portion is formed has a first height from the board, and At least a portion of the electronic component has a second height from the board, the second height being substantially the same as the first height.

13. The electronic device according to claim 1, wherein the electronic device further comprises a camera module, the camera module comprising a lens, and The electronic component includes an image sensor aligned with an optical axis of the lens. 14 . The electronic device of claim 13 , wherein the plate has a flat surface having a normal vector parallel to the optical axis of the lens.

Images