Method for fabricating driving substrate

Abstract

This application discloses a method for fabricating a driving substrate. In the splicing exposure process, a first exposure layer and a second exposure layer, both disposed on the same layer, overlap to form a first splicing area. A first reference scale, a second reference scale, and a third reference scale are all disposed outside the first splicing area. These reference scales are formed by a single exposure, effectively avoiding the influence of errors inherent in the reference scales themselves due to multiple exposures. Subsequently, the third and fourth exposure layers, both disposed on the same layer, are aligned using the second reference scale. By using the same set of reference scales when exposing the same layers, the positional deviation caused by using different reference scales is effectively avoided. This improves the alignment performance of the overlapping exposure area in the second layer during the exposure process, thus enhancing the splicing accuracy of the overlapping exposure area.

Description

Technical Field

[0001] This application relates to the field of splicing exposure alignment methods, specifically to a method for fabricating a driving substrate. Background Technology

[0002] With the continuous development of semiconductor display manufacturing technology, people's requirements for display size are also increasing, and larger-sized televisions are gradually entering ordinary households. In order to enhance their competitiveness, panel manufacturers must develop technologies to produce large-size panels on lower-generation production lines. Limited by the size of the mask resolution guarantee area of ​​the exposure machines on lower-generation production lines, the only way to produce large-size panels without changing the exposure equipment is to use a splicing exposure method, that is, a panel needs to be exposed multiple times.

[0003] In the process of researching and practicing existing technologies, the inventors of this application discovered that in existing exposure processes, the first layer of circuit patterns is exposed on a blank substrate, and the positional accuracy of the circuit patterns is determined by the accuracy of the exposure equipment itself. Simultaneously, the first layer exposure also forms an alignment ruler pattern, which serves as the reference for the alignment of subsequent layers. The absolute positional accuracy of the alignment ruler is the primary factor affecting the positional accuracy of the circuit patterns in subsequent layers. For splicing exposure processes, the positional accuracy requirements for splicing exposure are even higher, therefore, the alignment of the splicing area is more important. Currently, there are two main alignment schemes for splicing exposure processes. The first is that the alignment of subsequent layers uses the ruler of the non-splicing area AA, such as... Figure 1 As shown. The second method is to use the scale of the first layer's stitching area for alignment of subsequent layer stitching areas, such as... Figure 2 As shown. The first alignment scheme has a technical flaw: for the second layer circuit splicing exposure area aa, because its alignment ruler is created through two separate exposures, the position and size of the alignment ruler itself deviate. This deviation cannot be eliminated, directly affecting the splicing exposure accuracy of the second layer circuit. The second alignment scheme has a technical flaw because the shared reference ruler A1 is formed by overlapping exposure of the first circuit layer, and its position and size accuracy are affected by the overlapping exposure, thus impacting the splicing accuracy of the second layer overlapping exposure area aa. Therefore, in existing manufacturing methods, the position and size differences of the reference ruler affect the splicing accuracy of the second and subsequent overlapping exposure areas of the spliced ​​product. Summary of the Invention

[0004] This application provides a method for preparing a driving substrate, which can improve the alignment performance of the second layer of overlapping exposure area and improve the splicing accuracy of the overlapping exposure area in the exposure process of spliced ​​exposure products.

[0005] This application provides a method for fabricating a driving substrate, including:

[0006] S1: A glass substrate is provided, and a first mask is aligned with the glass substrate to define a first exposure area on the glass substrate. A first exposure layer is formed in the first exposure area of ​​the glass substrate, and the first exposure layer includes a first reference scale.

[0007] S2: Align the second mask with the glass substrate to define a second exposure area on the glass substrate. The second exposure area partially overlaps with the first exposure area to form a first splicing area. A second exposure layer is formed in the second exposure area of ​​the glass substrate, which is co-layered with the first exposure layer. The second exposure layer includes a second reference scale and a third reference scale. The first reference scale, the second reference scale, and the third reference scale are all located outside the first splicing area, and the second reference scale is located between the first reference scale and the third reference scale.

[0008] S3: After aligning the third mask with both the first and second reference scales, a third exposure area is defined on the glass substrate.

[0009] S4: After aligning the fourth mask with both the second and third reference scales, a fourth exposure area is defined on the glass substrate. The fourth exposure area and the third exposure area partially overlap to form a second splicing area.

[0010] S5: The third exposure area of ​​the glass substrate is exposed through the third mask to form a third exposure layer, the third exposure layer being located above the first exposure layer. The fourth exposure area of ​​the glass substrate is exposed through the fourth mask to form a fourth exposure layer disposed in the same layer as the third exposure layer.

[0011] Optionally, in some embodiments of this application, the second reference scale is located within the second splicing area.

[0012] Optionally, in some embodiments of this application, the second reference scale is located at the center of the glass substrate.

[0013] Optionally, in some embodiments of this application, a plurality of second reference scales are provided, and the plurality of second reference scales are arranged at intervals along the length extension direction of the second splicing area.

[0014] Optionally, in some embodiments of this application, a second reference scale is provided at both ends of the length extension direction of the second splicing area.

[0015] Optionally, in some embodiments of this application, both the first reference scale and the third reference scale are provided in multiples, with the multiple first reference scales arranged at intervals along the length extension direction of the second splicing area, and the multiple third reference scales arranged at intervals along the length extension direction of the second splicing area.

[0016] Optionally, in some embodiments of this application, a first reference scale is respectively flush with a second reference scale and a third reference scale along the width extension direction of the second splicing area.

[0017] Optionally, in some embodiments of this application, the first reference scale is located on the side of the third exposure area away from the fourth exposure area.

[0018] Optionally, in some embodiments of this application, the third reference scale is located on the side of the fourth exposure area away from the third exposure area.

[0019] Optionally, in some embodiments of this application, the method for fabricating the driving substrate further includes, after step S5:

[0020] S6: After aligning the fifth mask with both the first and second reference scales, a fifth exposure area is defined on the glass substrate.

[0021] S7: After aligning the sixth mask with both the second and third reference scales, a sixth exposure area is defined on the glass substrate. The sixth exposure area partially overlaps with the fifth exposure area to form a third splicing area. The third splicing area coincides with the second splicing area.

[0022] S8: The fifth exposure area of ​​the glass substrate is exposed through the fifth photomask to form a fifth exposure layer, which is located above the third exposure layer. The sixth exposure area of ​​the glass substrate is exposed through the sixth photomask to form a sixth exposure layer disposed in the same layer as the fifth exposure layer.

[0023] In this embodiment, during the splicing exposure process, the first and second exposure layers, which are disposed on the same layer, overlap to form a first splicing area. A first, second, and third reference scale are all positioned outside the first splicing area, and each of these scales is formed by a single exposure, effectively avoiding the influence of errors inherent in the reference scales themselves due to multiple exposures. Subsequently, the third and fourth exposure layers, which are also disposed on the same layer, use the second reference scale for alignment during exposure. By using the same set of reference scales when exposing the same layers, the positional deviation caused by using different reference scales is effectively avoided. The method for fabricating the driving substrate in this application effectively solves the problem of differences in the position and size of the reference scales, thereby improving the alignment performance of the second layer overlapping exposure area and enhancing the splicing accuracy of the overlapping exposure area during the exposure process. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of an existing exposure alignment method for glass substrates;

[0026] Figure 2 This is a schematic diagram of another existing exposure alignment method for glass substrates;

[0027] Figure 3 This is a schematic flowchart of the method for fabricating the driving substrate provided in the embodiments of this application;

[0028] Figure 4 This is a schematic diagram of step S1 of the method for fabricating a driving substrate provided in this application embodiment;

[0029] Figure 5 This is a schematic diagram of step S2 of the method for fabricating a driving substrate provided in this application embodiment;

[0030] Figure 6 This is a schematic diagram of the structure after exposure of the third exposure layer in the method for fabricating the driving substrate provided in the embodiments of this application;

[0031] Figure 7 This is a schematic diagram of the structure after exposure of the fourth exposure layer in the method for fabricating the driving substrate provided in the embodiments of this application;

[0032] Figure 8This is a flowchart illustrating steps S6, S7, and S8 of the method for fabricating a driving substrate provided in the embodiments of this application. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0034] Currently, there are two main alignment schemes for splicing exposure processes. The first is to use the non-splicing area AA scale as a reference for subsequent layer alignment. Figure 1 The specific process is as follows: The exposure of the first layer circuit pattern is performed twice, left and right, with the narrow strip area filled with diagonal lines in the middle serving as the splicing exposure area aa. The reference ruler required for subsequent circuit layer exposure alignment is located in the non-splicing area AA, formed by the two exposures. The exposure of the second layer circuit pattern is also performed twice, left and right, with the splicing area of ​​the two exposures coinciding with the splicing area of ​​the first layer circuit. The reference ruler A1 used for left-side exposure alignment of the second layer circuit is created from the left-side exposure of the first layer circuit, and the reference ruler A2 used for right-side exposure alignment of the second layer circuit is created from the right-side exposure of the first layer circuit. The technical drawback of this scheme is that, for the splicing exposure area of ​​the second layer circuit, since the alignment rulers are created by two separate exposures, there is a deviation in the position and size of the rulers themselves. This deviation cannot be eliminated, directly affecting the splicing exposure accuracy of the second layer circuit.

[0035] Reference Figure 2The second existing alignment scheme is as follows: the exposure of the first layer circuit pattern is performed twice, left and right, with the narrow strip area filled with diagonal lines in the middle serving as the splicing exposure area aa. The reference scales required for subsequent circuit layer exposure alignment are formed by single exposures on the left and right sides, respectively. The reference scale A1 in the middle is located within the splicing exposure area and is formed by overlapping exposures on the left and right sides. The exposure of the second layer circuit pattern is also performed twice, left and right, with the overlapping area of ​​the two exposures coinciding with the overlapping area of ​​the first layer circuit exposure; the overlapping area of ​​the second layer circuit's left and right exposures shares the reference scale A1. The technical drawback of this scheme is that although it avoids the problem of different reference scale positions, since the shared reference scale is formed by overlapping exposures of the first layer circuit, its position and dimensional accuracy are affected by the overlapping exposures, which has a certain impact on the splicing accuracy of the overlapping exposure area of ​​the second layer circuit.

[0036] Therefore, a preparation method is needed to effectively improve the stitching accuracy of the overlapping exposure areas.

[0037] This application provides a method for fabricating a driving substrate. The following provides a detailed description of each method. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0038] See Figure 3 This application provides a method for fabricating a driving substrate, comprising:

[0039] S1: A glass substrate is provided, and a first exposure area is defined on the glass substrate by means of a first mask, and a first exposure layer is formed in the first exposure area of ​​the glass substrate. The first exposure layer includes a first reference scale.

[0040] S2: The second photomask is aligned with the glass substrate to define a second exposure area on the glass substrate. The second exposure area partially overlaps with the first exposure area to form a first splicing area. A second exposure layer is formed in the second exposure area of ​​the glass substrate, which is disposed in the same layer as the first exposure layer. The second exposure layer includes a second reference scale and a third reference scale. The first reference scale, the second reference scale, and the third reference scale are all located outside the first splicing area, and the second reference scale is located between the first reference scale and the third reference scale.

[0041] S3: After aligning the third mask with the first and second reference scales simultaneously, a third exposure area is defined on the glass substrate.

[0042] S4: After aligning the fourth mask with both the second and third reference scales, a fourth exposure area is defined on the glass substrate. The fourth exposure area and the third exposure area partially overlap to form a second splicing area.

[0043] S5: The third exposure area of ​​the glass substrate is exposed through the third photomask to form a third exposure layer, which is located above the first exposure layer. The fourth exposure area of ​​the glass substrate is exposed through the fourth photomask to form a fourth exposure layer that is disposed in the same layer as the third exposure layer.

[0044] It is understood that in the splicing exposure process of this application embodiment, the overlap of the first exposure layer and the second exposure layer, which are arranged in the same layer, forms the first splicing area. The first reference ruler, the second reference ruler, and the third reference ruler are all located outside the first splicing area, and all three reference rulers are formed by a single exposure to effectively avoid the influence of errors in the reference rulers themselves caused by multiple exposures. Subsequently, the third and fourth exposure layers, which are arranged in the same layer, will use the second reference ruler for alignment during exposure. By using the same set of reference rulers when exposing the same layer, the influence of positional deviations caused by using different reference rulers is effectively avoided. Therefore, the method for preparing the driving substrate of this application can effectively solve the influence caused by differences in the position and size of the reference rulers, thereby improving the alignment performance of the second and subsequent overlapping exposure areas and improving the splicing accuracy of the overlapping exposure areas in the splicing exposure product exposure process.

[0045] The fabrication method of the driving substrate 100 will be described in detail below:

[0046] Please see Figure 4 and Figure 5 In step S1, a glass substrate 10 is provided, and a first mask is aligned with the glass substrate 10 to define a first exposure area 11 on the glass substrate 10. A first exposure layer 20 is formed in the first exposure area 11 of the glass substrate 10. The first exposure layer 20 includes a first reference scale 21.

[0047] It is understood that the first exposure layer 20, along with the subsequent second exposure layer 30, third exposure layer 40, and fourth exposure layer 50, can be either metal layers of the driving substrate 100 or pixel layers of the driving substrate 100. The first reference scale 21, second reference scale 31, and third reference scale 32 are all made of metal to facilitate subsequent identification and alignment with each photomask. Furthermore, the first reference scale 21, second reference scale 31, and third reference scale 32 share the same pattern to facilitate the fabrication of patterns on the first and second photomasks.

[0048] In step S2, the second photomask is aligned with the glass substrate 10 to define a second exposure region 12 on the glass substrate 10. The second exposure region 12 partially overlaps with the first exposure region 11 to form a first splicing region 15. A second exposure layer 30 is formed in the second exposure region 12 of the glass substrate 10, which is co-layered with the first exposure layer 20. The second exposure layer 30 includes a second reference scale 31 and a third reference scale 32. The first reference scale 21, the second reference scale 31, and the third reference scale 32 are all located outside the first splicing region 15, and the second reference scale 31 is located between the first reference scale 21 and the third reference scale 32.

[0049] It is understandable that the first and second photomasks can be two independent plates for independent use. Alternatively, the first and second photomasks can be a single plate. During exposure, their positions can be adjusted so that they correspond to the exposure machine during the fabrication of the first exposure layer 20 and the second exposure layer 30. The area of ​​the second exposure region 12 is larger than the area of ​​the first exposure region 11. This ensures that during fabrication, the entire first splicing region 15 is offset from the center of the first and second exposure layers 20 and 30, moving closer to the edge, thus facilitating its offset from the subsequent second reference scale 31 located in the middle.

[0050] Please see Figure 6 In step S3, after aligning the third mask with the first reference scale 21 and the second reference scale 31 simultaneously, a third exposure area 13 is defined on the glass substrate 10.

[0051] It is understood that the third mask is provided with markings corresponding to the first reference scale 21 and the second reference scale 31, so that the position of the third mask is defined by the corresponding markings to define the third exposure area 13 on the glass substrate 10.

[0052] Please see Figure 7 In step S4, after the fourth mask is aligned with the second reference scale 31 and the third reference scale 32 at the same time, the fourth exposure area 14 is defined on the glass substrate 10. The fourth exposure area 14 and the third exposure area 13 are partially overlapped to form the second splicing area 16.

[0053] It is understood that the fourth mask has markings corresponding to the second reference scale 31 and the third reference scale 32. These markings define the position of the fourth mask to delineate the fourth exposure area 14 on the glass substrate 10. The third and fourth masks can be two independent plates for independent use. Alternatively, they can be a single plate, and during exposure, their positions can be adjusted so that they correspond to the exposure machine when preparing the third exposure layer 40 and the fourth exposure layer 50, respectively.

[0054] Reference Figure 6 and Figure 7 In some embodiments, the second reference scale 31 is located within the second stitching area 16. It should be noted that exposure is a process of scanning a light spot; the lateral light spot scans vertically. Alignment essentially involves identifying the position of the reference layer. One item in the alignment data reflects the lateral light spot's need for expansion or reduction in the lateral direction (absolute value of lateral expansion or reduction / lateral span). The larger the lateral span of the alignment scale, the smaller the error in the alignment data (alignment accuracy or random error, etc.). Since the second stitching area 16 is located on the outermost lateral side of the third exposure area 13 and the fourth exposure area 14, placing the second reference scale 31 within the second stitching area 16 results in higher alignment accuracy.

[0055] In some embodiments, the second reference scale 31 is located at the center of the glass substrate 10. This facilitates the alignment and placement of the third and fourth mask templates.

[0056] Reference Figure 6 and Figure 7 In some embodiments, multiple second reference scales 31 are provided, and the multiple second reference scales 31 are arranged at intervals along the length extension direction of the second splicing area 16. In this way, by setting multiple second reference scales 31, the alignment position is further increased, thereby improving the alignment accuracy of the third mask template and the fourth mask template.

[0057] Furthermore, a second reference scale 31 is provided at both ends of the length extension direction of the second splicing area 16. This alignment of the two ends in the vertical direction can further improve the accuracy of the subsequent mask template alignment.

[0058] Furthermore, multiple first reference scales 21 and multiple third reference scales 32 are provided. The multiple first reference scales 21 are arranged at intervals along the length extension direction of the second splicing area 16, and the multiple third reference scales 32 are arranged at intervals along the length extension direction of the second splicing area 16. By setting multiple first reference scales 21 and multiple third reference scales 32, the alignment position is further increased, thereby improving the alignment accuracy of the third mask template and the fourth mask template.

[0059] Furthermore, a first reference scale 21 is aligned with a second reference scale 31 and a third reference scale 32 along the width extension direction of the second splicing area 16. This ensures that the third exposure area 13 and the fourth exposure area 14 are laterally aligned, thereby further improving alignment accuracy.

[0060] Reference Figure 6 and Figure 7 In step S5, the third exposure area 13 of the glass substrate 10 is exposed through the third mask to form the third exposure layer 40, which is located above the first exposure layer 20. The fourth exposure area 14 of the glass substrate 10 is exposed through the fourth mask to form the fourth exposure layer 50, which is disposed in the same layer as the third exposure layer 40.

[0061] In the process of creating the third exposure layer 40 and the fourth exposure layer 50, alignment is first performed using the third and fourth photomasks. This can be achieved by keeping the third and fourth photomasks stationary and then moving the glass substrate 10 for alignment, or by fixing the glass substrate 10 and sequentially placing the third and fourth photomasks for alignment. The method for moving the glass substrate 10 is as follows: First, align the third photomask with the first reference scale 21 and the second reference scale 31 on the glass substrate 10, record the alignment data, and adjust for errors. Then, move the second reference scale 31 and the third reference scale 32 of the glass substrate 10 to align with the fourth photomask, record the alignment data, and adjust for errors. Next, move the glass substrate 10 back to the position recorded with the third photomask to begin exposure. After the third exposure layer 40 is formed, move the glass substrate 10 again to align it with the position recorded with the fourth photomask for further exposure. In this way, in the third exposure layer 40 and the fourth exposure layer 50 set in the same layer, the alignment error is adjusted first and then the layers are exposed one by one to improve the splicing accuracy of the exposure layers in the same layer.

[0062] Reference Figure 6 and Figure 7In some embodiments, the first reference scale 21 is located on the side of the third exposure area 13 away from the fourth exposure area 14. It should be noted that exposure is a process of scanning a light spot. The lateral light spot scans vertically, and alignment essentially involves identifying the position of the reference layer. One item in the alignment data reflects the lateral light spot's need to be enlarged or reduced in the lateral direction. The larger the lateral span of the alignment scale, the smaller the error in the alignment data. Thus, by positioning the first reference scale 21 on the side of the third exposure area 13 away from the fourth exposure area 14, i.e., the first reference scale 21 is located on the outermost side of the exposure area in the lateral direction, alignment accuracy is improved.

[0063] In some embodiments, the third reference scale 32 is located on the side of the fourth exposure area 14 away from the third exposure area 13. Similarly, by positioning the third reference scale 32 on the side of the third exposure area 13 away from the fourth exposure area 14, i.e., by positioning the third reference scale 32 on the outermost side of the exposure area laterally, higher alignment accuracy is achieved.

[0064] Reference Figure 8 In some embodiments of this application, the method for fabricating the driving substrate 100 further includes the following steps:

[0065] S6: After aligning the fifth mask with the first reference scale 21 and the second reference scale 31 simultaneously, a fifth exposure area is defined on the glass substrate 10.

[0066] S7: After aligning the sixth mask with the second reference scale 31 and the third reference scale 32 simultaneously, a sixth exposure area is defined on the glass substrate 10. The sixth exposure area and the fifth exposure area partially overlap to form a third splicing area. The third splicing area and the second splicing area 16 are overlapped.

[0067] S8: The fifth exposure area of ​​the glass substrate 10 is exposed through the fifth photomask to form the fifth exposure layer, which is located above the third exposure layer 40. The sixth exposure area of ​​the glass substrate 10 is exposed through the sixth photomask to form the sixth exposure layer disposed in the same layer as the fifth exposure layer.

[0068] When other exposure layers are prepared on the third exposure layer 40 and the fourth exposure layer 50, the fifth and sixth mask templates are aligned with the first reference scale 21, the second reference scale 31 and the third reference scale 32 to ensure the alignment performance of the subsequent overlapping exposure areas and improve the splicing accuracy of the overlapping exposure areas.

[0069] The above provides a detailed description of a method for preparing a driving substrate according to the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for fabricating a driving substrate, characterized in that, include: S1: A glass substrate is provided, and a first mask is aligned with the glass substrate to define a first exposure area on the glass substrate. A first exposure layer is formed in the first exposure area of ​​the glass substrate, and the first exposure layer includes a first reference scale. S2: Align the second mask with the glass substrate to define a second exposure area on the glass substrate. The second exposure area partially overlaps with the first exposure area to form a first splicing area. A second exposure layer is formed in the second exposure area of ​​the glass substrate, which is co-layered with the first exposure layer. The second exposure layer includes a second reference scale and a third reference scale. The first reference scale, the second reference scale, and the third reference scale are all located outside the first splicing area, and the second reference scale is located between the first reference scale and the third reference scale. The area of ​​the second exposure area is larger than the area of ​​the first exposure area, and the second reference scale is located between the first splicing area and the third reference scale. S3: After aligning the third mask with both the first and second reference scales, a third exposure area is defined on the glass substrate. S4: After aligning the fourth mask with both the second and third reference scales, a fourth exposure area is defined on the glass substrate. The fourth exposure area and the third exposure area partially overlap to form a second splicing area. S5: The third exposure area of ​​the glass substrate is exposed through the third mask to form a third exposure layer, the third exposure layer being located above the first exposure layer. The fourth exposure area of ​​the glass substrate is exposed through the fourth mask to form a fourth exposure layer disposed in the same layer as the third exposure layer.

2. The method for preparing the driving substrate as described in claim 1, characterized in that, The second reference scale is located within the second splicing area.

3. The method for preparing the driving substrate as described in claim 1, characterized in that, The second reference scale is located in the middle of the glass substrate.

4. The method for preparing the driving substrate as described in claim 2, characterized in that, The second reference scale is provided in multiple ways, and the multiple second reference scales are arranged at intervals along the length extension direction of the second splicing area.

5. The method for preparing the driving substrate as described in claim 4, characterized in that, A second reference scale is provided at both ends of the length extension direction of the second splicing area.

6. The method for preparing the driving substrate as described in claim 4, characterized in that, Both the first reference scale and the third reference scale are provided in multiples. The multiple first reference scales are arranged at intervals along the length extension direction of the second splicing area, and the multiple third reference scales are arranged at intervals along the length extension direction of the second splicing area.

7. The method for preparing the driving substrate as described in claim 6, characterized in that, The first reference scale is set flush with the second reference scale and the third reference scale along the width extension direction of the second splicing area.

8. The method for preparing the driving substrate as described in claim 1, characterized in that, The first reference scale is located on the side of the third exposure area that is away from the fourth exposure area.

9. The method for preparing the driving substrate as described in claim 1, characterized in that, The third reference scale is located on the side of the fourth exposure area that is away from the third exposure area.

10. The method for preparing the driving substrate as described in claim 1, characterized in that, The method for fabricating the driving substrate further includes, after step S5: S6: After aligning the fifth mask with both the first and second reference scales, a fifth exposure area is defined on the glass substrate. S7: After aligning the sixth mask with both the second and third reference scales, a sixth exposure area is defined on the glass substrate. The sixth exposure area partially overlaps with the fifth exposure area to form a third splicing area. The third splicing area coincides with the second splicing area. S8: The fifth exposure area of ​​the glass substrate is exposed through the fifth photomask to form a fifth exposure layer, which is located above the third exposure layer. The sixth exposure area of ​​the glass substrate is exposed through the sixth photomask to form a sixth exposure layer disposed in the same layer as the fifth exposure layer.

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