Fit structure

Abstract

The present invention discloses a bonding structure, comprising a transparent substrate, an identification module and an adhesive component. The identification module has a thickness less than or equal to 0.3 mm. The adhesive component is attached between the transparent substrate and the identification module. At least one of the 180-degree peel strength between the adhesive component and the transparent substrate and the 180-degree peel strength between the adhesive component and the identification module is less than 2 Newtons / inch.

Description

Technical Field

[0001] The present invention relates to a structure, and more particularly to a bonding structure. Background Art

[0002] Generally speaking, the recognition module is often fixed on one side of the transparent substrate relative to the user, so that the recognition module receives and interprets the user's operation through the transparent substrate. In addition, the current technology of fixing the transparent substrate and the recognition module by full bonding can enable the recognition module to obtain a better imaging effect, thereby improving the recognition module's recognition accuracy.

[0003] However, the materials used in the full lamination method are often difficult to rework due to their high peel strength. If problems occur during the lamination process or the identification module is found to be abnormal after lamination, the transparent substrate often needs to be scrapped, thereby increasing production costs. Therefore, how to solve the difficulties in reworking the full lamination method and reduce production costs, and then improve the competitiveness of the full lamination method in terms of technology, is the focus of current research. Summary of the invention

[0004] The present invention provides a fitting structure, which can increase reworkability and reduce production costs.

[0005] The bonding structure of the present invention comprises a transparent substrate, an identification module and an adhesive component. The identification module has a thickness less than or equal to 0.3 mm. The adhesive component is attached between the transparent substrate and the identification module. At least one of the 180-degree peel strength between the adhesive component and the transparent substrate and the 180-degree peel strength between the adhesive component and the identification module is less than 2 Newtons / inch.

[0006] In one embodiment of the present invention, the light-transmitting substrate is a display panel.

[0007] In one embodiment of the present invention, the adhesive assembly comprises a substrate layer and a pair of adhesive layers. The substrate layer is disposed between the pair of adhesive layers. The pair of adhesive layers are disposed between the light-transmitting substrate and the identification module.

[0008] In one embodiment of the present invention, the projection area of ​​the identification module on the transparent substrate is larger than the projection area of ​​the adhesive component on the transparent substrate. The projection area of ​​the adhesive component on the transparent substrate is within the projection area of ​​the identification module on the transparent substrate.

[0009] In one embodiment of the present invention, the projection area of ​​the identification module on the transparent substrate is smaller than the projection area of ​​the adhesive component on the transparent substrate. The projection area of ​​the identification module on the transparent substrate is located within the projection area of ​​the adhesive component on the transparent substrate.

[0010] In one embodiment of the present invention, at least one side of the adhesive component is retracted into a corresponding side of the identification module.

[0011] In one embodiment of the present invention, there is a distance between at least one side of the adhesive component and the corresponding side of the identification module, and the distance is between 0.3 mm and 5 mm.

[0012] In one embodiment of the present invention, at least one side of the adhesive component protrudes from a corresponding side of the identification module.

[0013] In one embodiment of the present invention, there is a distance between at least one side of the adhesive component and the corresponding side of the identification module, and the distance is between 1 mm and 10 mm.

[0014] In one embodiment of the present invention, the adhesive component has a handle area protruding from the identification module.

[0015] In one embodiment of the present invention, the identification module has a cross section. Two opposite ends of the cross section are two supporting points. The midpoint of the cross section is located between the two supporting points. When a vertical external force is applied to the midpoint of the cross section of the identification module, the maximum value of the vertical distance between the midpoint and the two supporting points is greater than 1 mm.

[0016] Based on the above, the bonding structure of the present invention utilizes that the thickness of the identification module is less than or equal to 0.3 mm, and at least one of the 180-degree peel strength between the adhesive component and the transparent substrate and the 180-degree peel strength between the adhesive component and the identification module is less than 2 Newtons / inch, so that the transparent substrate and the identification module will not be damaged when the transparent substrate and the identification module are separated by reverse tearing due to the excessively high peel strength of the adhesive component, and the residual adhesive of the adhesive component is avoided. The situation of remaining on the transparent substrate or the identification module. In this way, the reworkability of the identification module can be effectively increased and the production cost of the identification module can be reduced, thereby improving the competitiveness of the identification module in the full-mount method.

[0017] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a cross-sectional view of a bonding structure according to an embodiment of the present invention.

[0019] Figure 2 yes Figure 1 A three-dimensional cross-sectional view of the deformation of the identification module of the fitting structure.

[0020] Figure 3 yes Figure 1 A cross-sectional view of separating the identification module and the adhesive component in a reverse tearing manner in a bonding structure.

[0021] Figure 4 is a cross-sectional view of a bonding structure according to another embodiment of the present invention.

[0022] Figure 5 yes Figure 4 A cross-sectional view of separating the identification module and the adhesive component in a reverse tearing manner in a bonding structure.

[0023] Figure 6 is a cross-sectional view of a bonding structure according to another embodiment of the present invention.

[0024] Figure 7 yes Figure 6 A bottom view of the identification module and the adhesive component of the bonding structure.

[0025] Figure 8 It is a bottom view of an identification module and an adhesive component of a bonding structure according to another embodiment of the present invention.

[0026] Wherein, the reference numerals are:

[0027] 100, 100A, 100B: Identification module

[0028] 110: Translucent substrate

[0029] 120, 120A: Identification module

[0030] 121: Cross section

[0031] 122: Fulcrum

[0032] 123: Midpoint

[0033] 124: Connection

[0034] 130, 130A, 130B, 130C: Adhesive components

[0035] 131: base material layer

[0036] 132: Adhesive layer

[0037] 133: Glue remover

[0038] 134, 134C: handle area

[0039] A1, A2: Projection area

[0040] D1: Thickness

[0041] D2: Distance

[0042] G1, G2: Spacing

[0043] S1, S2: Side

[0044] F: External force

[0045] XYZ: Cartesian coordinates DETAILED DESCRIPTION

[0046] Figure 1 1 is a cross-sectional view of a bonding structure according to an embodiment of the present invention. It should be noted that rectangular coordinates XYZ are provided here to facilitate the subsequent description and reference of the components. In addition, the proportional relationship of the size, thickness, etc. of the transparent substrate 110, the identification module 120 and the adhesive component 130 of the identification module 100 in the figure is only for illustration.

[0047] Please refer to Figure 1 The identification module 100 of this embodiment includes a transparent substrate 110, a recognition module 120, and an adhesive component 130. The adhesive component 130 is directly attached between the transparent substrate 110 and the recognition module 120 in a removable manner along the Z axis.

[0048] Here, it should be noted that, in one embodiment, the light-transmitting substrate 110 is, for example, a display panel, but is not limited thereto. In one embodiment, the identification module 120 is, for example, a fingerprint identification module, wherein when the user's fingerprint (not shown) touches the light-transmitting substrate 110, the reflected light of the fingerprint can pass through the light-transmitting substrate 110 to allow the identification module 120 to receive and interpret it, but is not limited thereto. In one embodiment, the material of the adhesive component 130 is, for example, a transparent low-adhesion adhesive such as silicone or acrylic adhesive, but is not limited thereto. In one embodiment, the adhesive component 130 is fully attached between the light-transmitting substrate 110 and the identification module 120, but is not limited thereto.

[0049] Specifically, in the present embodiment, the identification module 120 has a thickness D1 less than or equal to 0.3 mm, and at least one of the 180-degree peel strength between the adhesive component 130 and the light-transmitting substrate 110 and the 180-degree peel strength between the adhesive component 130 and the identification module 120 is less than 2 Newtons / inch, so as to increase the reworkability of the light-transmitting substrate 110 and the identification module 120 in terms of bonding.

[0050] Here, it should be noted that, in one embodiment, the identification module 120 is, for example, an optical identification module composed of a circuit board and a sensor with a total thickness D1 of 0.3 mm, but the present invention is not limited thereto. In other embodiments, the identification module 120 is, for example, an ultrasonic identification module or a capacitive identification module with a thickness D1 of 0.3 mm, and the present invention does not limit the type of the identification module 120. In one embodiment, the value of the 180-degree peel strength of the adhesive component 130 is obtained by testing according to ASTM D3330, PSTC101, GB T2792 or JIS Z0237, but the present invention is not limited thereto.

[0051] As described above, the identification module 120 has a thickness D1 less than or equal to 0.3 mm, and at least one of the 180-degree peel strength between the adhesive component 130 and the transparent substrate 110 and the 180-degree peel strength between the adhesive component 130 and the identification module 120 is less than 2 Newtons / inch, so that the transparent substrate 110 and the identification module 120 will not be damaged when the transparent substrate 110 and the identification module 120 are separated by reverse tearing due to the excessively high peel strength of the adhesive component 130, and the residual adhesive of the adhesive component 130 will not remain on the transparent substrate 110 or the identification module 120.

[0052] Thereby, the reworkability of the identification module 100 can be effectively increased and the production cost of the identification module 100 can be reduced, thereby improving the competitiveness of the identification module 100 in the full-mount method.

[0053] Figure 2 yes Figure 1 A three-dimensional cross-sectional view of the deformation of the identification module of the fitting structure. It should be noted that, Figure 2 The dotted line indicates the deformation state of the recognition module 120. For more details, please refer to Figure 2 In this embodiment, the identification module 120 has a cross section 121. In the Y-axis direction, two opposite ends of the cross section 121 are two supporting points 122, and the midpoint 123 of the cross section 121 is located between the two supporting points 122. When a vertical external force F parallel to the Z-axis is applied to the midpoint 123 of the cross section 121 of the identification module 120, the maximum value of the vertical distance D2 between the midpoint 123 and the two supporting points 122 in the Z-axis direction is greater than 1 mm.

[0054] That is to say, in this embodiment, when the thickness D1 of the identification module 120 is less than or equal to 0.3 mm, since the maximum value of the deformation of the identification module 120 when subjected to the vertical external force F is greater than 1 mm, when the identification module 120 is subjected to the external force F as described above to separate from the adhesive component 130, the identification module 120 can utilize the characteristics of bending deformation to gradually separate from the adhesive component 130 at a small angle and without being damaged.

[0055] Figure 3 yes Figure 1 A cross-sectional view of separating the identification module and the adhesive component by reverse tearing in the bonding structure. For further information, please refer to Figure 1 In the present embodiment, the projection area A1 of the identification module 120 on the transparent substrate 110 is larger than the projection area A2 of the adhesive component 130 on the transparent substrate 110 , and the projection area A2 of the adhesive component 130 on the transparent substrate 110 is located within the projection area A1 of the identification module 120 on the transparent substrate 110 .

[0056] That is to say, Figure 1 and Figure 3 As shown, in this embodiment, the side S2 of the adhesive component 130 is retracted from the corresponding side S1 of the identification module 120. Here, it should be noted that, in this embodiment, there is a gap G1 between the side S2 of the adhesive component 130 and the corresponding side S1 of the identification module 120, and the gap G1 is between 0.3 mm and 5 mm, but not limited thereto.

[0057] Therefore, if Figure 3 As shown, taking the separation of the identification module 120 from the adhesive component 130 as an example, when an external force F is applied to the identification module 120 (near the side S1), since the side S2 of the adhesive component 130 is retracted into the corresponding side S1 of the identification module 120, the distance G1 between the side S2 of the adhesive component 130 and the corresponding side S1 of the identification module 120 is equivalent to the force arm for initially applying the external force F to the identification module 120, and the connection point 124 where the adhesive component 130 connects the identification module 120 can be regarded as the force fulcrum for initially applying the external force F to the identification module 120.

[0058] In this way, by virtue of the bending deformation characteristics of the identification module 120, as the identification module 120 is gradually separated from the adhesive component 130 at a small angle and without being damaged, the spacing G1 between the connection 124 of the adhesive component 130 connecting the identification module 120 and the corresponding side S1 of the identification module 120 will gradually increase, thereby gradually reducing the force required to be applied by the identification module 120, thereby allowing the identification module 120 to be smoothly separated from the adhesive component 130.

[0059] It must be noted that the following embodiments use the same component numbers and some contents as the previous embodiments, wherein the same number is used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can refer to the previous embodiments, and the following embodiments will not be repeated.

[0060] Figure 4 is a cross-sectional view of a bonding structure according to another embodiment of the present invention. Figure 5 yes Figure 4 A cross-sectional view of separating the identification module and the adhesive component by tearing off the adhesive component in the reverse direction in the bonding structure. Please also refer to Figure 1 and Figure 4 The bonding structure 100A of this embodiment and Figure 1 The difference between the two lies in the relative relationship between the identification module 120A and the adhesive component 130A.

[0061] Please refer to Figure 4In the present embodiment, the projection area A1 of the identification module 120A on the transparent substrate 110 is smaller than the projection area A2 of the adhesive component 130A on the transparent substrate 110 , and the projection area A1 of the identification module 120A on the transparent substrate 110 is located within the projection area A2 of the adhesive component 130A on the transparent substrate 110 .

[0062] That is to say, Figure 4 and Figure 5 As shown, in this embodiment, the side S2 of the adhesive component 130A protrudes from the corresponding side S1 of the identification module 120A. Here, it should be noted that, in this embodiment, there is a gap G1 between the side S2 of the adhesive component 130A and the corresponding side S1 of the identification module 120A, and the gap G1 is between 1 mm and 10 mm, but not limited thereto.

[0063] Therefore, if Figure 5 As shown, taking the separation of the identification module 120A from the adhesive component 130A as an example, since the side S2 of the adhesive component 130A protrudes from the corresponding side S1 of the identification module 120A, it is necessary to dissolve the adhesive component 130A (near the side S1) by, for example, a debonding agent 133 so that there is a gap G2 between the connection 124 where the adhesive component 130A connects to the identification module 120A and the side S1 of the identification module 120A.

[0064] Thus, when an external force F is applied to the identification module 120A (near the side S1), the distance G2 between the connection 124 where the adhesive component 130A connects the identification module 120A and the side S1 of the identification module 120A is equivalent to the force arm for initially applying the external force F to the identification module 120A, and the connection 124 where the adhesive component 130A connects the identification module 120A can be regarded as the force fulcrum for initially applying the external force F to the identification module 120A.

[0065] In this way, through the bending deformation characteristics of the above-mentioned identification module 120A, as the identification module 120A is gradually separated from the adhesive component 130A at a small angle and without being damaged, the distance G2 between the connection 124 of the adhesive component 130A connecting the identification module 120A and the corresponding side S1 of the identification module 120A will gradually increase, so that the force required to be applied by the identification module 120A is gradually reduced, thereby allowing the identification module 120A to be smoothly separated from the adhesive component 130A.

[0066] Figure 6 is a cross-sectional view of a bonding structure according to another embodiment of the present invention. Figure 7 yes Figure 6 The bottom view of the identification module and adhesive components of the bonding structure. Please also refer to Figure 4 and Figure 6The bonding structure 100B of this embodiment and Figure 4 The bonding structure 100A is similar to the bonding structure 100A, and the difference between the two is: the adhesive component 130B.

[0067] Please refer to Figure 6 In this embodiment, the adhesive assembly 130B includes a substrate layer 131 and a pair of adhesive layers 132. The substrate layer 131 is disposed between the pair of adhesive layers 132 along the Z axis, and the pair of adhesive layers 132 is disposed between the transparent substrate 110 and the identification module 120A along the Z axis.

[0068] Here, it should be noted that, in one embodiment, the substrate layer 131 is, for example, an optically transparent sheet, but not limited thereto. In one embodiment, the material of the pair of adhesive layers 132 is, for example, a transparent low-adhesion adhesive such as silicone or acrylic adhesive, but not limited thereto. In one embodiment, the pair of adhesive layers 132 are fully attached between the light-transmitting substrate 110 and the identification module 120A, but not limited thereto.

[0069] Specifically, in this embodiment, the pair of adhesive layers 132 are repeatedly removably and directly attached between the transparent substrate 110 and the identification module 120A. At least one of the 180-degree peel strength between one of the pair of adhesive layers 132 and the transparent substrate 110 and the 180-degree peel strength between the other of the pair of adhesive layers 132 and the identification module 120A is less than 2 Newtons / inch, so as to increase the reworkability of the transparent substrate 110 and the identification module 120A in the attachment.

[0070] It should be noted that, in one embodiment, the value of the 180-degree peel strength of each adhesive layer 132 is obtained by testing according to standards such as ASTM D3330, PSTC 101, GB T2792 or JIS Z0237, but is not limited thereto.

[0071] For further information, please refer to Figure 7 In this embodiment, the adhesive component 130B has a handle area 134 protruding from the identification module 120A. Figure 8 As shown, in other embodiments, the handle region 134C of the adhesive component 130C may be partially protruded from the identification module 120A to facilitate separation of the adhesive component 130C from the transparent substrate 110 and the identification module 120A.

[0072] Thus, through the arrangement of the base material layer 131 and the handle area 134 of the adhesive component 130B, the base material layer 131 can provide the adhesive component 130B with hardness and support force, so that the adhesive component 130B can be directly separated from the transparent substrate 110 and the identification module 120A through the handle area 134 without the need for additional separation tools (such as pull tape).

[0073] Furthermore, as described above, by utilizing the 180-degree peel strength between the pair of adhesive layers 132 and the transparent substrate 110 and the 180-degree peel strength between the pair of adhesive layers 132 and the identification module 120A to be less than 2 Newtons / inch, the transparent substrate 110 and the identification module 120A will not be damaged in their structures when they are separated by reverse tearing due to the excessively high peel strength of the adhesive component 130B, and the residual adhesive of the pair of adhesive layers 132 of the adhesive component 130B will not remain on the transparent substrate 110 or the identification module 120A.

[0074] In summary, the bonding structure of the present invention utilizes that the thickness of the identification module is less than or equal to 0.3 mm, and at least one of the 180-degree peel strength between the adhesive component and the transparent substrate and the 180-degree peel strength between the adhesive component and the identification module is less than 2 Newtons / inch, so that the transparent substrate and the identification module will not be damaged when the transparent substrate and the identification module are separated by reverse tearing due to the excessively high peel strength of the adhesive component, and the residual adhesive of the adhesive component is avoided. The situation of remaining on the transparent substrate or the identification module. In this way, the reworkability of the identification module can be effectively increased and the production cost of the identification module can be reduced, thereby improving the competitiveness of the identification module in the full-mount method.

[0075] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, technicians familiar with the field may make various corresponding changes and deformations based on the present invention, but these corresponding changes and deformations should all fall within the scope of protection of the claims of the present invention.

Claims

1. A fitting structure, characterized in that: include: a light-transmissive substrate; An identification module having a thickness less than or equal to 0.3 mm; and An adhesive component is attached between the transparent substrate and the identification module, wherein at least one of the 180-degree peel strength between the adhesive component and the transparent substrate and the 180-degree peel strength between the adhesive component and the identification module is less than 2 Newtons / inch. 2 . The bonding structure as claimed in claim 1 , wherein the light-transmitting substrate is a display panel. 3 . The bonding structure as claimed in claim 1 , wherein the adhesive assembly comprises a base material layer and a pair of adhesive layers, the base material layer is disposed between the pair of adhesive layers, and the pair of adhesive layers are disposed between the light-transmissive substrate and the identification module.

4. The bonding structure as described in claim 1, wherein a projection area of ​​the identification module on the light-transmitting substrate is larger than a projection area of ​​the adhesive component on the light-transmitting substrate, and the projection area of ​​the adhesive component on the light-transmitting substrate is located within the projection area of ​​the identification module on the light-transmitting substrate.

5. The bonding structure as described in claim 1, wherein a projection area of ​​the identification module on the light-transmitting substrate is smaller than a projection area of ​​the adhesive component on the light-transmitting substrate, and the projection area of ​​the identification module on the light-transmitting substrate is located within the projection area of ​​the adhesive component on the light-transmitting substrate. 6 . The bonding structure as claimed in claim 1 , wherein at least one side edge of the adhesive component is retracted into a corresponding side edge of the identification module. 7 . The bonding structure as claimed in claim 6 , wherein there is a distance between the at least one side edge of the adhesive component and the corresponding side edge of the identification module, and the distance is between 0.3 mm and 5 mm. 8 . The bonding structure as claimed in claim 1 , wherein at least one side of the adhesive component protrudes from a corresponding side of the identification module. 9 . The bonding structure as claimed in claim 8 , wherein there is a distance between the at least one side edge of the adhesive component and the corresponding side edge of the identification module, and the distance is between 1 mm and 10 mm. 10 . The bonding structure as claimed in claim 1 , wherein the adhesive component has a handle area protruding from the identification module.

11. The bonding structure as described in claim 1, wherein the identification module has a cross-section, two opposite ends of the cross-section are respectively two supporting points, and a midpoint of the cross-section is located between the two supporting points, and when a vertical external force is applied to the midpoint of the cross-section of the identification module, a maximum value of a vertical distance between the midpoint and the two supporting points is greater than 1 mm.

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