Substrate processing device and substrate processing method

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus of the present invention comprises a flow path unit, a discharge unit, and a detection unit. A fluid flows within the flow path unit. The fluid may be, for example, a liquid or a gas. The discharge unit is configured to discharge the fluid flowing within the flow path unit into a processing space for processing a substrate. The detection unit detects discharges occurring within the flow path unit.

Description

Technical Field

[0001] The present invention relates to a substrate processing device and a substrate processing method for processing a substrate. Background Art

[0002] Substrate processing equipment is used to perform various processes on various substrates, including FPD (Flat Panel Display) substrates, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, and solar cell substrates. The substrate processing equipment is equipped with piping for supplying fluids such as liquids and gases.

[0003] For example, Japanese Patent Publication No. 2014-93506 describes a substrate processing apparatus used in conjunction with a processing liquid supply apparatus. The processing liquid supply apparatus includes multiple processing liquid supply systems. In each processing liquid supply system, processing liquid stored in a tank is pumped through piping and supplied to the substrate processing apparatus. Summary of the Invention

[0004] In substrate processing apparatuses, pipes for supplying fluid may be damaged or foreign matter may enter the fluid, making it impossible to properly supply the fluid.

[0005] An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of preventing abnormal fluid supply.

[0006] To identify the causes of pipe damage and the incorporation of foreign matter into the fluid, the inventors conducted extensive experiments and research, resulting in the following insights. Within pipes, friction between the inner wall and the fluid generates static electricity, causing the inner wall or fluid to become charged. When the inner wall or fluid becomes excessively charged, a discharge occurs. This frequent discharge can damage the inner wall of the pipe, and particles generated by this damage can be introduced into the fluid. Based on these insights, the inventors developed the following invention.

[0007] (1) A substrate processing apparatus according to one aspect of the present invention includes: a flow path portion through which a fluid flows; a discharge portion configured to discharge the fluid flowing in the flow path portion into a processing space for processing a substrate; and a detection portion for detecting discharge occurring within the flow path portion.

[0008] In this substrate processing apparatus, a discharge unit discharges fluid flowing within the flow path into the processing space where substrates are processed. Even if static electricity is generated by friction between the inner wall of the flow path and the fluid, causing discharge within the flow path, the discharge is detected by the detection unit. This prevents abnormal fluid supply.

[0009] (2) The flow path includes a pipe and an inserting member inserted into the pipe; the detection unit can be installed in either the pipe or the inserting member. In this case, the detection unit can be easily arranged. This makes it easy to detect discharges occurring within the flow path.

[0010] (3) The substrate processing apparatus may further include: a valve inserted in the piping; and a processing control unit that controls the operation of the valve so that the fluid is not ejected from the ejection unit into the processing space when the detection unit detects discharge. In this case, the abnormal fluid is prevented from being supplied into the processing space.

[0011] (4) The substrate processing apparatus may further include: a valve inserted in the piping; and a processing control unit that, when the detection unit detects discharge, controls the operation of the valve so that the discharge unit discharges fluid into the processing space when no substrate to be processed is present in the processing space. In this case, abnormal fluid is prevented from being supplied to the substrate to be processed.

[0012] (5) The substrate processing apparatus may further include a notification unit that notifies when the detection unit detects discharge. This can prompt the user to take measures to ensure normal supply of the fluid.

[0013] (6) Another aspect of the substrate processing method of the present invention includes the following steps: ejecting a fluid flowing in a flow path portion into a processing space for processing a substrate through a ejection portion; and detecting a discharge occurring inside the flow path portion through a detection portion.

[0014] According to this substrate processing method, even if static electricity is generated by friction between the inner wall of the flow path and the fluid, causing discharge inside the flow path, the discharge is detected by the detection unit, thereby preventing abnormal fluid supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 FIG. 1 is a diagram showing the structure of a substrate processing apparatus according to an embodiment of the present invention.

[0016] Figure 2 Yes Figure 1 A side view of the internal structure of the processing chamber,

[0017] Figure 3is a diagram showing the configuration of the flow path system.

[0018] Figure 4 is a block diagram showing the configuration of a control device.

[0019] Figure 5 FIG. 1 is a diagram showing an example of a display screen of a display device.

[0020] Figure 6 Yes Figure 4 A flowchart of an example of a control process performed by a control device,

[0021] Figure 7 This is a block diagram showing the configuration of a control device in another embodiment. DETAILED DESCRIPTION

[0022] The following describes a substrate processing apparatus according to one embodiment of the present invention using the accompanying drawings. In the following description, a substrate refers to a semiconductor substrate, a substrate for a flat panel display (FPD) such as a liquid crystal display or an organic EL (electroluminescence) display, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a mask substrate, a ceramic substrate, or a solar cell substrate.

[0023] (1) Configuration of substrate processing apparatus

[0024] Figure 1 1 is a diagram showing the structure of a substrate processing apparatus according to one embodiment of the present invention. Figure 1 and the following Figure 2 In order to clearly indicate the positional relationship, arrows indicating the mutually orthogonal X, Y, and Z directions are marked. The X and Y directions are mutually orthogonal in the horizontal plane, and the Z direction is equivalent to the vertical direction. Figure 1 As shown, the substrate processing apparatus 500 includes a substrate processing unit 100 , a flow system 200 , a control device 300 , and a display device 400 . Figure 1 1 mainly shows a schematic top view of the substrate processing unit 100.

[0025] In this embodiment, the substrate processing apparatus 500 is a substrate cleaning apparatus for cleaning a substrate W to be processed, and the substrate processing apparatus is, for example, installed in a factory. In the factory where the substrate processing apparatus 500 is installed, a processing liquid supply source 510, a gas supply source 520, and a waste liquid unit 530 are provided as factory equipment (factory facilities). The processing liquid supply source 510 supplies a cleaning liquid such as IPA (isopropyl alcohol) or a diluent as the processing liquid. The gas supply source 520 supplies a gas such as N2 (nitrogen) or CDA (clean dry air). The used processing liquid is discarded in the waste liquid unit 530.

[0026] The flow path system 200 introduces the processing liquid supplied from the processing liquid supply source 510 into the substrate processing unit 100 through the flow path. The control device 300 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), and a storage device to control the operation of the substrate processing unit 100 and the flow path system 200. The RAM serves as the CPU's operating area. The ROM stores system programs. The storage device stores control programs. The display device 400, for example, includes an LCD (Liquid Crystal Display) panel or an organic EL (Electroluminescence) panel, and displays the processing results of the control device 300.

[0027] The substrate processing unit 100 includes an index block 110, a first processing block 120, a transfer block 130, a second processing block 140, and a third processing block 150. The index block 110, the first processing block 120, the transfer block 130, the second processing block 140, and the third processing block 150 are arranged in order in the X direction.

[0028] The index block 110 includes a plurality of carrier placement units 111 and a transfer chamber 112. Each carrier placement unit 111 holds a carrier 113, which stores a plurality of substrates W in multiple stages. The transfer chamber 112 includes a transfer mechanism (transfer robot arm) 114, which transfers the substrates W while holding them.

[0029] The first processing block 120 includes processing chambers 121 and 122 and an interface 123. The processing chambers 121 and 122 are arranged opposite each other in the Y direction with the interface 123 interposed therebetween. Each processing chamber 121 and 122 is provided with a plurality of processing units 10 and a plurality of standby tanks 20 for processing substrates W. The interface 123 temporarily holds substrates W to be transferred between the transfer mechanism 114 and a transfer mechanism 132 (described later). Multiple substrates W can be placed in the interface 123. The transfer block 130 includes a transfer chamber 131. The transfer chamber 131 is provided with a transfer mechanism 132 that transfers the substrates W while holding them.

[0030] The second processing block 140 includes processing chambers 141 and 142 and an interface 143. The processing chambers 141 and 142 are arranged opposite each other in the Y direction with the interface 143 interposed therebetween. Multiple processing units 10 and multiple standby tanks 20 are installed in each processing chamber 141 and 142. The interface 143 temporarily holds substrates W that are transferred between the transfer mechanism 132 and the transfer mechanism 154 (described later). Multiple substrates W can be placed in the interface 143. In this example, the interface 143 is capable of transporting (shuttling) a predetermined distance in the X direction while holding the substrates W.

[0031] The third processing block 150 includes processing chambers 151 and 152 and a transfer chamber 153. The processing chambers 151 and 152 are arranged opposite each other in the Y direction with the transfer chamber 153 interposed therebetween. A plurality of processing units 10 and a plurality of standby tanks 20 are installed in each of the processing chambers 151 and 152. A transfer mechanism 154 is installed in the transfer chamber 153 to transfer a substrate W while holding it.

[0032] Figure 2 Yes Figure 1 A side view of the internal structure of the processing chambers 121, 141, and 151. Figure 2 As shown, in each processing chamber 121, 141, 151, a plurality of (four in this example) processing units 10 are stacked in the Z direction, and a plurality of standby tanks 20 are respectively arranged corresponding to the plurality of processing units 10. Figure 1 The same is true for each of the processing chambers 122 , 142 , and 152 , where a plurality of (four in this example) processing units 10 are stacked in the Z direction, and a plurality of standby tanks 20 are respectively arranged corresponding to the plurality of processing units 10 .

[0033] Each processing unit 10 includes a spin chuck 11, a spray nozzle 12, and a cup 13. The processing unit 10 may also include a brush. A processing chamber V for cleaning substrates W is located near the top of the spin chuck 11. The spray nozzle 12 is movable between the processing chamber V and a standby tank 20. Except when cleaning substrates W, the spray nozzle 12 is located in the standby tank 20.

[0034] When the substrate W is cleaned, the rotary chuck 11 is rotated by a driving device (e.g., an electric motor) (not shown) to keep the substrate W in the processing space V. In addition, the discharge nozzle 12 moves to the processing space V and discharges the liquid through the nozzle into the processing space V. Figure 1 The processing liquid is introduced through the flow system 200. In this case, the processing liquid is supplied to the substrate W being rotated by the spin chuck 11. This cleans the substrate W. The cup 13 is provided so as to surround the spin chuck 11 and catches the processing liquid splashing from the substrate W during the cleaning process.

[0035] Reference Figure 1 and Figure 2 The operation of the substrate processing unit 100 will now be described. A carrier 113 is placed on the carrier placement unit 111 of the index block 110. The carrier 113 contains an unprocessed substrate W. The transport mechanism 114 transports the unprocessed substrate W from the carrier 113 to the interface 123 of the first processing block 120. Furthermore, the transport mechanism 114 transports the cleaned substrate W placed in the interface 123 to the carrier 113.

[0036] The transport mechanism 132 of the transport block 130 transports an unprocessed substrate W placed in the delivery interface 123 to any of the processing units 10 in the processing chambers 121 and 122 of the first processing block 120 or to the delivery interface 143 of the second processing block 140. The substrate W transported to any of the processing units 10 in the processing chambers 121 and 122 is cleaned. Furthermore, the transport mechanism 132 transports a substrate W placed in any of the processing units 10 in the processing chambers 121 and 122 or in the delivery interface 143 after it has been cleaned to the delivery interface 123.

[0037] The transfer mechanism 154 of the third processing block 150 transfers an unprocessed substrate W placed in the interface 143 to any processing unit 10 in the processing chambers 141, 142, 151, and 152 of the second or third processing block 140 or 150. The substrate W transferred to any processing unit 10 in the processing chambers 141, 142, 151, and 152 is cleaned. Furthermore, the transfer mechanism 154 transfers a substrate W placed in any processing unit 10 in the processing chambers 141, 142, 151, and 152 after it has been cleaned to the interface 143.

[0038] (2) Composition of the flow system

[0039] Figure 1 A plurality of flow path systems 200 are provided so as to correspond to the plurality of processing units 10 of the substrate processing section 100 , respectively. Figure 3 2 is a diagram showing the structure of the flow path system 200. Figure 3 As shown, the flow path system 200 includes a pipe 210, one or more inserting components 220, and a detection unit 230. The inserting components 220 are components inserted into the pipe 210. The pipe 210 and the one or more inserting components 220 form a flow path 201. The flow path 201 is located outside the processing space V.

[0040] The piping 210 is formed of resin and includes a main pipe 211 and a branch pipe 212. The piping 210 can also be constructed by connecting multiple pipes with joints. In this case, the joint used to connect the multiple pipes is an interposer 220. In the following description, the flow direction of the processing liquid in the main pipe 211 is defined as the downstream direction, and the direction opposite to the flow direction is defined as the upstream direction. The downstream end of the main pipe 211 is connected to the spray nozzle 12 of the corresponding processing unit 10.

[0041] In this example, a plurality of interposing members 220 are provided. Each interposing member 220 includes, for example, a treatment liquid tank 221, a flow switching valve 222, a filter 223, a regulator 224, a pressure sensor 225, a pump 226, a flow sensor 227, or a discharge valve 228. Figure 3 In the example, the plurality of interposing components 220 are sequentially inserted into the main pipe 211 from upstream to downstream. The interposing components 220 are not limited to the components described above and may also be on-off valves that open and close the flow path of the pipe 210. Furthermore, multiple interposing components 220 of the same type may be provided.

[0042] The treatment liquid tank 221 is inserted at the upstream end of the main pipe 211 and stores the treatment liquid supplied from the treatment liquid supply source 510. By supplying gas from the gas supply source 520 to the treatment liquid tank 221, the treatment liquid stored in the treatment liquid tank 221 is pressure-fed downstream through the main pipe 211.

[0043] The flow path switching valve 222 can be switched between a first flow path state and a second flow path state. In the first flow path state, the flow path between the treatment liquid tank 221 and the filter 223 is open, and the flow path between the treatment liquid tank 221 and the waste liquid section 530 is disconnected. In the second flow path state, the flow path between the treatment liquid tank 221 and the waste liquid section 530 is open, and the flow path between the treatment liquid tank 221 and the filter 223 is disconnected.

[0044] The filter 223 is, for example, a UPE (Ultra-high molecular weight polyethylene) filter, which removes foreign matter from the treatment liquid passing through the filter itself. In addition, the filter 223 is constructed in a manner that can discharge the removed foreign matter together with the treatment liquid into the waste liquid section 530. The portion between the filter 223 and the adjustment section 224 in the main pipe 211 and the treatment liquid tank 221 is connected via a branch pipe 212. In this way, the treatment liquid passing through the filter 223 can be circulated into the treatment liquid tank 221. An intervening component 220 such as a switch valve or a joint can also be inserted into the branch pipe 212.

[0045] The adjustment unit 224 is, for example, an electric pressure regulator, which adjusts the flow rate of the treatment liquid flowing in the main pipe 211 based on the control of the control device 300. The pressure sensor 225 measures the pressure of the treatment liquid flowing in the main pipe 211. The measurement results of the pressure sensor 225 are provided to the control device 300. The pump 226 pressurizes the treatment liquid flowing in the main pipe 211 downstream. The flow sensor 227 measures the flow rate of the treatment liquid flowing in the main pipe 211. The measurement results of the flow sensor 227 are provided to the control device 300.

[0046] The discharge valve 228 is, for example, an on-off valve. When the substrate W is held and rotated by the spin chuck 11 and the discharge outlet of the discharge nozzle 12 is located within the processing space V, the discharge valve 228 is opened. In this state, the processing liquid is discharged from the discharge nozzle 12 into the processing space V and supplied onto the substrate W. In this manner, the substrate W is cleaned.

[0047] Static electricity may sometimes be generated within the flow path 201 due to friction between the inner wall of the flow path 201 and the treatment liquid. Therefore, a detection unit 230 is installed within the flow path 201. The detection unit 230 can also be attached to the outer surface of the flow path 201 using adhesive tape or other adhesive material. In this case, the detection unit 230 can be easily positioned.

[0048] Detection unit 230, for example, is an antenna formed from a wound wire. It converts the magnetic field component of electromagnetic waves within flow path 201 into an electromotive force. This allows discharge within flow path 201 caused by static electricity to be detected as an electromotive force. The detection results from detection unit 230 are provided to control device 300.

[0049] Figure 3In the example shown, the detection unit 230 is installed in one of the interposing members 220, but the embodiment is not limited to this. The detection unit 230 may also be installed in the pipe 210. In this case, the detection unit 230 may be attached to the outer surface of the pipe 210 using an adhesive member, or the detection unit 230 may be rolled up to surround the pipe 210. In these cases, the detection unit 230 can be easily configured.

[0050] The flow system 200 may also include two or more detection units 230. Specifically, the two or more detection units 230 may be installed in two or more portions of the piping 210 or in two or more interposing components 220. Alternatively, the two or more detection units 230 may be installed in part or all of the piping 210 and one or more interposing components 220.

[0051] (3) Control device

[0052] Figure 4 It is a block diagram showing the configuration of the control device 300 . Figure 5 4 is a diagram showing an example of a display screen of the display device 400. Figure 4 As shown, control device 300 includes a measurement unit 310, a log storage unit 320, a display control unit 330, a determination unit 340, and a processing control unit 350 as functional units. The functional units of control device 300 are implemented by the CPU executing a control program stored in a storage device on RAM. Alternatively, some or all of the functional units of control device 300 may be implemented using hardware such as electronic circuits.

[0053] The measuring unit 310 measures the electromotive force converted by the detecting unit 230. Here, the user can set the electromotive force measured by the measuring unit 310 when no discharge occurs within the flow path 201 as the ground level (0 mV) in the measuring unit 310. This allows the user to easily distinguish between electromotive forces caused by discharge and those not caused by discharge, even if the ground level near the mounting portion of the detecting unit 230 is unstable.

[0054] The log storage unit 320 operates as a data logger and stores the electromotive force measured by the measuring unit 310 in association with the measurement time. The display control unit 330 creates a trend graph of the temporal change of the electromotive force based on the information stored in the log storage unit 320 and displays it on the display device 400. Figure 5 As shown in the figure, there are more than one peak value of electromotive force in the trend graph. In order to easily recognize the shape of the peak, Figure 5 The white box in the diagram shows the maximum EMF peak in the trend graph.

[0055] Determination unit 340 determines whether the electromotive force measured by measurement unit 310 exceeds a predetermined threshold value. The user can set any threshold value for determination unit 340. In this example, the threshold value refers to the magnitude of the electromotive force, but the embodiment is not limited to this. The threshold value may also be the width of the peak value of the electromotive force (e.g., the half-width).

[0056] The log storage unit 320 may also store only the electromotive force exceeding the threshold, corresponding to the measurement time. In this case, the display control unit 330 displays only the electromotive force exceeding the threshold on the display device 400. Alternatively, the log storage unit 320 may store the number of times the electromotive force exceeded the threshold. In this case, the display control unit 330 displays the number of times the electromotive force exceeded the threshold on the display device 400.

[0057] The process control unit 350 controls the operations of the substrate processing unit 100 and the flow system 200 to execute substrate processing. Furthermore, if the determination unit 340 determines that the electromotive force exceeds a threshold, the process control unit 350 controls the operations of the substrate processing unit 100 and the flow system 200 to stop substrate processing.

[0058] In this example, if the determination unit 340 determines that the electromotive force exceeds the threshold, the process control unit 350 closes the discharge valve 228 for only a specified time. This reduces the amount of charge within the flow path unit 201. This prevents continuous discharge within the flow path unit 201. The user can set a desired closing time for the discharge valve 228 with the process control unit 350. After the specified time has elapsed, the process control unit 350 controls the operations of the substrate processing unit 100 and the flow path system 200 to resume substrate processing.

[0059] (4) Control processing

[0060] Figure 6 Yes Figure 4 Flowchart of an example of control processing performed by the control device 300. Figure 6 The control process is performed by the CPU of the control device 300 executing a control program stored in the storage device. First, the process control unit 350 controls the operation of the substrate processing unit 100 and the flow system 200 to start substrate processing (in this example, cleaning) (step S1). The measurement unit 310 measures the electromotive force converted by the detection unit 230 (step S2). Step S2 can be executed almost simultaneously with step S1.

[0061] Next, the log storage unit 320 stores the electromotive force measured in step S2 in association with the measurement time (step S3). The display control unit 330 displays the temporal changes in the electromotive force stored in step S3 on the display device 400 (step S4). Step S4 can be executed almost simultaneously with step S3.

[0062] Next, the determination unit 340 determines whether the electromotive force measured in step S2 exceeds a threshold value (step S5). If the electromotive force does not exceed the threshold value, the process control unit 350 returns to step S2. The substrate process is continued by repeating steps S2 to S5.

[0063] If the electromotive force exceeds the threshold, the process control unit 350 stops substrate processing by closing the discharge valve 228 (step S6). Step S6 can be executed after the substrate W being processed has completed its processing. Thereafter, steps S7 through S9, which are identical to steps S2 through S4, are executed. This allows the electromotive force to be measured, stored, and displayed even while substrate processing is stopped.

[0064] Next, the process control unit 350 determines whether the specified time has elapsed (step S10). If the specified time has not elapsed, the process control unit 350 returns to step S7. Steps S7 to S10 are repeated until the specified time has elapsed. If the specified time has elapsed, the process control unit 350 changes the substrate transfer schedule (step S11) and returns to step S1. This resumes substrate processing. Control processing ends when the specified number of substrate processes have been completed or when the user issues an end instruction.

[0065] (5) Effect

[0066] In the substrate processing apparatus 500 of this embodiment, the fluid flowing within the flow path portion 201 is discharged into the processing space V for processing the substrate W via the discharge nozzle 12. Even if static electricity is generated by friction between the inner wall of the flow path portion 201 and the fluid, causing discharge within the flow path portion 201, the discharge is detected by the detection unit 230.

[0067] If the detector 230 detects a discharge, the supply of the treatment liquid is stopped for a predetermined period of time. This reduces the amount of charge within the flow path 201, preventing continuous discharge within the flow path 201. Consequently, abnormalities in the supply of the treatment liquid can be prevented.

[0068] (6) Variations

[0069] In this embodiment, when a discharge is detected, substrate processing is stopped by closing the discharge valve 228 for only a predetermined time. However, the embodiment is not limited to this. In a first variation, when a discharge is detected, substrate processing is stopped by placing the discharge nozzle 12 on standby in the standby tank 20, and the discharge valve 228 is opened for only a predetermined time.

[0070] In the second variation, when discharge is detected, the flow path switching valve 222 is switched to the second flow path state for only a predetermined period of time, thereby stopping substrate processing. In the third variation, when discharge is detected, an on / off valve (not shown) located between the filter 223 and the waste liquid section 530 is opened for only a predetermined period of time, while on / off valves located downstream of the filter 223 (including the discharge valve 228) are closed. In either the second or third variation, the discharge nozzle 12 may be located within the processing space V or within the standby tank 20.

[0071] According to the first to third variations, the charged processing liquid is discarded by the waste liquid section 530. Therefore, it is possible to more efficiently prevent continuous discharge from occurring within the flow path section 201. Furthermore, it is believed that static electricity is more likely to occur when gas is mixed in the liquid. Therefore, when discharge is detected, it is possible that the processing liquid contains tiny bubbles that cannot be detected by the bubble sensor. In this case, according to the first to third variations, the processing liquid is also discarded by the waste liquid section 530, thereby preventing the use of processing liquid mixed with tiny bubbles for substrate processing. This allows for more appropriate substrate processing.

[0072] In the second variation, the detection unit 230 may also be installed at a position further upstream than the flow path switching valve 222. In this case, since the flow path switching valve 222 is provided at a position further upstream than the filter 223, the charged treatment liquid does not pass through the filter 223. In this way, the filter 223 can be prevented from being contaminated. However, the embodiment is not limited thereto. For example, the detection unit 230 may also be installed at the flow path switching valve 222, or may also be installed at a position further downstream than the flow path switching valve 222. In addition, the flow path switching valve 222 may also be installed at a position further downstream than the filter 223.

[0073] In the fourth variation, when discharge is detected, the discharge valve 228 is opened so that the processing liquid is discharged from the discharge nozzle 12 into the processing space V when no substrate W to be processed is present in the processing space V. Specifically, the discharge valve 228 is opened so that the processing liquid is discharged from the discharge nozzle 12 into the processing space V when a dummy substrate different from the substrate W to be processed is present in the processing space V. In this case, the supply of abnormal fluid to the substrate W to be processed is prevented. Furthermore, because the waste liquid unit 530 can discard charged processing liquid, continuous discharge within the flow path unit 201 can be more efficiently prevented.

[0074] (7) Other Implementation Methods

[0075] (a) In the above-described embodiment, when discharge is detected, control is performed so that the processing liquid is not ejected into the processing space V, or the processing liquid is ejected into the processing space V when no substrate W to be processed exists in the processing space V. However, the embodiment is not limited thereto. Figure 7 FIG. 1 is a block diagram showing the structure of the control device 300 in another embodiment. Figure 7 As shown, the control device 300 further includes a notification unit 360 as a functional unit.

[0076] When a discharge is detected, the notification unit 360 notifies the user by displaying a message indicating the presence of the discharge on the display device 400. This prompts the user to implement measures to ensure the normal supply of the fluid. Furthermore, when a notification is issued, control can be performed such that the processing liquid is not discharged into the processing space V, or the processing liquid is discharged into the processing space V when no substrate W to be processed is present.

[0077] In this embodiment, notification is performed using the display device 400, but the embodiment is not limited to this. Notification may also be performed without using the display device 400. For example, if the substrate processing apparatus 500 includes an audio output device, notification may be performed by outputting an audio signal indicating the occurrence of a discharge, or by outputting a warning sound such as a buzzer. Alternatively, if the substrate processing apparatus 500 includes an indicator light such as a lamp, notification may be performed by turning the indicator light on, off, or alternating between on and off.

[0078] (b) In the above embodiment, the substrate processing apparatus 500 is a substrate cleaning apparatus, but the embodiment is not limited thereto. The substrate processing apparatus 500 may also be a coating apparatus that performs a coating process on the substrate W to be processed. In this case, the substrate processing unit 100 may include, for example, a coating process unit (spin coater), and the process liquid may include a coating liquid. Alternatively, the substrate processing apparatus 500 may be a developing apparatus that performs a developing process on the substrate W to be processed. In this case, the substrate processing unit 100 may include, for example, a developing process unit (spin developer), and the process liquid may include a developer.

[0079] (c) In the above embodiment, the fluid is a liquid such as a cleaning solution, a coating solution, or a developer, but the embodiment is not limited thereto. The fluid may also be a gas. For example, the fluid may be a process gas such as oxygen or an inert gas such as nitrogen.

[0080] (d) In the above embodiment, the detection unit 230, the control device 300, and the display device 400 are provided separately, but the embodiment is not limited to this. Part or all of the detection unit 230, the control device 300, and the display device 400 may be provided integrally. For example, at least a portion of the functional components of the control device 300 may be provided in the detection unit 230. Alternatively, a display unit such as a monitor may be provided in the detection unit 230.

[0081] (8) Correspondence between the constituent elements of the claims and the components of the embodiments

[0082] Hereinafter, examples of correspondence between the components of the claims and the components of the embodiments will be described, but the present invention is not limited to the following examples. Various other components having the configurations or functions described in the claims may be used as the components of the claims.

[0083] In the embodiment described above, the flow path unit 201 is an example of a flow path unit, the processing space V is an example of a processing space, the substrate W is an example of a substrate, the discharge nozzle 12 is an example of a discharge unit, the detection unit 230 is an example of a detection unit, and the substrate processing unit 100 is an example of a substrate processing apparatus. The piping 210 is an example of a piping unit, the interposer 220 is an example of an interposer, the flow path switching valve 222 or the discharge valve 228 is an example of a valve, the processing control unit 350 is an example of a processing control unit, and the notification unit 360 is an example of a notification unit.

Claims

1. A substrate processing apparatus comprising: a flow path portion for flowing a fluid; a discharge portion configured to discharge the fluid flowing in the flow path portion into a processing space for processing a substrate; and The detection unit converts a magnetic field component of the electromagnetic wave inside the flow path portion into an electromotive force, thereby detecting the discharge generated inside the flow path portion without contacting the fluid.

2. The substrate processing apparatus according to claim 1, wherein the flow path portion includes a pipe and an inserting member inserted in the pipe; and The detection unit is mounted on either the pipe or the interposing member.

3. The substrate processing apparatus according to claim 2, further comprising: a valve inserted in the pipe; and The process control unit controls the operation of the valve so that the fluid is not ejected from the ejection unit into the process space when the detection unit detects the discharge.

4. A substrate processing apparatus comprising: a flow path portion for flowing a fluid; a discharge portion configured to discharge the fluid flowing in the flow path portion into a processing space for processing a substrate; a detection unit for detecting discharge occurring inside the flow path unit; valves; and Process control unit; and The flow path portion includes a pipe and an inserting member inserted in the pipe; The detection unit is installed in any one of the pipe and the inserting member; The valve is inserted into the pipe; When the detection unit detects the discharge, the process control unit controls the operation of the valve so that the fluid is ejected from the ejection unit into the process space when no substrate to be processed exists in the process space. 5 . The substrate processing apparatus according to claim 1 , further comprising a notification unit configured to perform notification when the detection unit detects the discharge.

6. A substrate processing method, comprising the steps of: ejecting a fluid flowing in a flow path portion into a processing space for processing a substrate through an ejection portion; and The detection unit converts the magnetic field component of the electromagnetic wave inside the flow path portion into an electromotive force, thereby detecting the discharge generated inside the flow path portion without the detection unit coming into contact with the fluid.

7. A substrate processing method, comprising the steps of: ejecting a fluid flowing in a flow path portion into a processing space for processing a substrate through an ejection portion, the flow path portion comprising a pipe having a valve inserted therein and an inserting member inserted in the pipe; and When the detection unit detects discharge, the valve is controlled so that the fluid is ejected from the ejection unit into the processing space when no substrate to be processed exists in the processing space.

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