Circuit of discharge resistor and design method, device, equipment and medium thereof

Abstract

The application discloses a discharge resistor circuit and a design method, device and equipment thereof and a medium. The method comprises the following steps: acquiring a distance boundary parameter, a discharge resistor working condition parameter and a temperature difference threshold of a discharge resistor circuit board; establishing a discharge resistor circuit pre-topology structure according to the distance boundary parameter and a power tolerance threshold; wherein the structure comprises multiple groups of series resistor units; each resistor unit comprises multiple parallel resistor sub-units; determining a total resistance threshold and total resistance value of the discharge resistor, the resistance value and power of each resistor sub-unit according to the working condition parameter and the pre-topology structure; performing thermal simulation processing on the discharge resistor circuit pre-topology structure to determine a discharge resistor temperature topology structure; determining the difference between the maximum temperature and the minimum temperature of each resistor sub-unit according to the structure; judging whether the difference is less than the temperature difference threshold; if yes, determining that the pre-topology structure is the discharge resistor circuit topology structure; and if no, adjusting the resistance value of each resistor sub-unit to determine the discharge resistor circuit topology structure.

Description

Technical Field

[0001] The embodiments of the present invention relate to discharge technology, and more particularly to a discharge resistor circuit and a design method, device, equipment, and medium thereof. Background Art

[0002] Passive discharge resistors generally come in two forms: discrete devices or PCB chip resistors. Discrete discharge resistors are often constructed of metal, offering superior heat dissipation. Discrete resistors are typically connected to capacitors via wiring harnesses. Since capacitors are high-voltage devices, the wiring harnesses require high insulation levels. However, the surfaces of resistors and capacitors are relatively hard, while the wiring harnesses are relatively flexible. This connection requires high-quality workmanship. Otherwise, cracks often develop due to factors like fatigue corrosion over time, compromising insulation levels and creating safety risks.

[0003] Discharge resistors using PCB surface-mounted devices typically employ multiple resistors connected in series and parallel. These can be standalone discharge circuit boards or integrated into other circuit boards. Compared to discrete components, soldering the PCB to the capacitor terminals is more reliable than wiring harnesses and significantly reduces costs. However, PCBs lack the heat dissipation capabilities of metal-cased discrete components, so they typically use large copper cladding or surface-mounted heat sinks. Even so, these methods often lack sufficient heat dissipation.

[0004] The reason for this is that conventional PCB designs typically use resistors of equal value connected in series and parallel. If the resistors are arranged evenly, the center of the board will inevitably be hotter than the edges. Furthermore, if the PCB is placed vertically, gravity forces hot air upward, causing the top half of the board to be hotter than the bottom. This uneven temperature distribution across the PCB's discharge resistors under conventional designs can shorten component lifespan, leading to new requirements for achieving relatively uniform temperature across the board by optimizing the values ​​of resistors at different locations. Summary of the Invention

[0005] The present invention provides a discharge resistor circuit, a design method, a device, an apparatus, and a medium thereof, so as to optimize the resistance values ​​of resistors at different positions to achieve a relatively uniform temperature across the entire board.

[0006] In a first aspect, an embodiment of the present invention provides a circuit design method for a discharge resistor, the method comprising:

[0007] Obtaining the distance boundary parameters, discharge resistor operating condition parameters, and temperature difference threshold of the discharge resistor circuit board; wherein the discharge resistor operating condition parameters include discharge time, capacitance value, and bus voltage;

[0008] establishing a discharge resistance circuit pre-topology structure according to the distance boundary parameter and the power tolerance threshold; wherein the discharge resistance circuit pre-topology structure comprises a plurality of groups of series resistance units; each of the resistance units comprises a plurality of parallel resistance sub-units;

[0009] determining a total discharge resistance value threshold in the discharge resistance circuit pre-topology structure according to the discharge resistance working condition parameter, and selecting a total discharge resistance value according to the total discharge resistance value threshold;

[0010] setting a resistance value of each of the resistance sub-units and a power of each of the resistance sub-units according to the total discharge resistance value and the discharge resistance circuit pre-topology structure; wherein the power of each of the resistance sub-units is less than the power tolerance threshold;

[0011] performing thermal simulation processing on the discharge resistance circuit pre-topology structure to determine a discharge resistance temperature topology structure;

[0012] determining a difference between a maximum temperature of each of the resistance sub-units and a minimum temperature of each of the resistance sub-units according to the discharge resistance temperature topology structure;

[0013] judging whether the difference is less than a temperature difference threshold; if yes, determining that the discharge resistance circuit topology structure is the discharge resistance circuit pre-topology structure;

[0014] if no, adjusting the resistance value of each of the resistance sub-units in the discharge resistance circuit pre-topology structure, and returning to perform thermal simulation processing on the discharge resistance circuit topology structure to determine a discharge resistance circuit topology structure.

[0015] Optionally, the method further comprises:

[0016] judging whether the power of any of the resistance sub-units in the discharge resistance circuit topology structure is greater than the power tolerance threshold;

[0017] if yes, changing the power tolerance threshold of each of the resistance sub-units to determine a new discharge resistance circuit topology structure;

[0018] if no, the discharge resistance circuit topology structure is an optimal discharge resistance circuit topology structure.

[0019] Optionally, adjusting the resistance value of each of the resistance sub-units in the discharge resistance circuit pre-topology structure comprises:

[0020] determining a temperature matrix according to the discharge resistance temperature topology structure, determining an average temperature parameter according to the temperature matrix, and determining a temperature deviation matrix according to the temperature matrix and the average temperature parameter;

[0021] determining a power matrix according to the power of each of the resistance sub-units;

[0022] Setting a temperature-power coefficient based on a difference between a maximum temperature of each of the resistor subunits and a minimum temperature of each of the resistor subunits;

[0023] Determine a resistance power matrix according to the power matrix, the temperature-power coefficient and the temperature deviation matrix;

[0024] A resistance matrix is ​​determined according to the resistance power matrix, and the resistance value of each resistance sub-unit in the pre-topology structure of the discharge resistance circuit is adjusted according to the resistance matrix.

[0025] Optionally, determining a resistance matrix according to the resistance power matrix includes:

[0026] Get bus voltage;

[0027] Determining the power of each of the series resistor units according to the resistor power matrix;

[0028] Determining the resistance value of each of the series resistance units according to the power of each of the series resistance units, the total resistance value of the discharge resistors, and the bus voltage parameter;

[0029] determining a conductance matrix according to the resistance value of each of the series resistor units, the power of each of the series resistor units, and the resistance-power matrix;

[0030] A resistance matrix is ​​determined based on the conductance matrix.

[0031] Optionally, after determining the resistance matrix according to the conductance matrix, the method further includes:

[0032] Determining a nominal resistance matrix according to the resistance matrix and the nominal resistance table;

[0033] determining a nominal discharge resistor total resistance based on the nominal resistance matrix;

[0034] Determining whether the nominal total resistance of the discharge resistors is less than the total resistance threshold of the discharge resistors;

[0035] If so, determining that the nominal resistance matrix is ​​an optimal resistance matrix;

[0036] If not, the nominal resistance matrix is ​​re-determined according to the resistance matrix and the nominal resistance table.

[0037] Optionally, the total resistance threshold of the discharge resistor is determined according to the discharge resistor operating condition parameter, specifically:

[0038]

[0039] Among them, r all is the total resistance of the discharge resistor, τ is the discharge time, C is the capacitance, U is the bus voltage, Uf The human body safety voltage is 60V.

[0040] In a second aspect, an embodiment of the present invention further provides a discharge circuit for a discharge resistor, the discharge circuit comprising a discharge resistor circuit topology structure obtained by the discharge resistor circuit design method described in the first aspect and a PCB circuit board; the discharge resistor circuit topology structure is evenly distributed on the front and back surfaces of the PCB circuit board;

[0041] The discharge resistor circuit topology is connected in parallel across the bus voltage and in parallel with the bus capacitance.

[0042] In a third aspect, an embodiment of the present invention further provides a circuit design device for a discharge resistor, the design device comprising:

[0043] An acquisition unit is used to acquire a distance boundary parameter of the discharge resistor circuit board, a discharge resistor operating condition parameter, and a temperature difference threshold; wherein the discharge resistor operating condition parameter includes a discharge time, a capacitance value, and a bus voltage;

[0044] a pre-topology structure establishing unit, configured to establish a pre-topology structure of a discharge resistance circuit according to the distance boundary parameter and the power tolerance threshold; wherein the pre-topology structure of the discharge resistance circuit includes a plurality of series-connected resistance units; each of the resistance units includes a plurality of parallel-connected resistance sub-units; and the power of each resistance sub-unit is less than the power tolerance threshold;

[0045] a first parameter determination unit, configured to determine a total resistance threshold of the discharge resistor in the pre-topology structure of the discharge resistor circuit according to the discharge resistor operating condition parameter, and select a total resistance of the discharge resistor according to the total resistance threshold of the discharge resistor;

[0046] a second parameter determination unit, configured to set the resistance value of each resistor sub-unit and the power of each resistor sub-unit according to the total resistance value of the discharge resistor and the pre-topological structure of the discharge resistor circuit;

[0047] a temperature topology determination unit, configured to perform a thermal simulation on the discharge resistor pre-circuit topology to determine the discharge resistor temperature topology;

[0048] a difference determination unit, configured to determine a difference between a maximum temperature of each of the resistor subunits and a minimum temperature of each of the resistor subunits according to the discharge resistor temperature topology;

[0049] a judging unit, configured to judge whether the difference is less than a temperature difference threshold;

[0050] a circuit topology structure determining unit, configured to determine that the discharge resistor circuit topology structure is a discharge resistor circuit pre-topology structure when the difference is less than a temperature difference threshold;

[0051] The resistance adjustment unit is used to return to adjust the resistance of each resistor sub-unit in the discharge resistor circuit pre-topology structure when the difference is greater than the temperature difference threshold, and return to perform thermal simulation processing on the discharge resistor circuit pre-topology structure to determine the discharge resistor circuit topology structure.

[0052] In a fourth aspect, an embodiment of the present invention provides a computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the circuit design method for the discharge resistor as described in the first aspect above when executing the program.

[0053] In a fifth aspect, an embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the circuit design method for the discharge resistor as described in the first aspect above.

[0054] In an embodiment of the present invention, a distance boundary parameter, a discharge resistor operating condition parameter, and a temperature difference threshold of a discharge resistor circuit board are obtained; a discharge resistor circuit pre-topology structure is established based on the distance boundary parameter and the power tolerance threshold; wherein the discharge resistor circuit pre-topology structure includes multiple groups of series resistor units; each resistor unit includes multiple parallel resistor sub-units; the power of each resistor sub-unit is less than the power tolerance threshold; a total resistance threshold and a total resistance of the discharge resistor, as well as the resistance and power of each resistor sub-unit are determined based on the operating condition parameter and the pre-topology structure; a discharge resistor temperature topology structure is determined by thermal simulation processing of the discharge resistor circuit pre-topology structure; a difference between a maximum temperature of each resistor sub-unit and a minimum temperature of each resistor sub-unit is determined based on the discharge resistor temperature topology structure; and whether the difference is less than the temperature difference threshold is determined; if so, determining that the discharge resistor circuit topology structure is the discharge resistor circuit pre-topology structure; if not, adjusting the resistance of each resistor sub-unit in the discharge resistor circuit pre-topology structure, and returning to perform thermal simulation processing of the discharge resistor circuit pre-topology structure to determine the discharge resistor circuit topology structure, thereby optimizing the resistance of the resistor sub-units to achieve a relatively uniform temperature across the entire discharge resistor circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 This is a flow chart of a circuit design method for a discharge resistor provided by an embodiment of the present invention;

[0056] Figure 2 is a schematic diagram of a process for adjusting the resistance value of each resistor subunit provided by an embodiment of the present invention;

[0057] Figure 3 is a flow chart of another circuit design method for a discharge resistor provided by an embodiment of the present invention;

[0058] Figure 41 is a schematic diagram of a discharge module structure of a discharge resistor provided by an embodiment of the present invention;

[0059] Figure 5 is an electrical connection diagram of a discharge resistor circuit topology structure provided by an embodiment of the present invention;

[0060] Figure 6 This is a schematic structural diagram of a circuit design device for a discharge resistor provided by an embodiment of the present invention;

[0061] Figure 7 A schematic structural diagram of a computer device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0062] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0063] Figure 1 1 is a flow chart of a method for designing a circuit for a discharge resistor provided by an embodiment of the present invention. This embodiment is applicable to the circuit design of a discharge resistor. The method can be executed by a circuit design device for a discharge resistor and specifically includes the following steps:

[0064] S110 , obtaining a distance boundary parameter of a discharge resistor circuit board, a discharge resistor operating condition parameter, and a temperature difference threshold.

[0065] Among them, in the electric drive system of electric vehicles, in order to ensure the stability of the battery voltage power supply, energy storage capacitors are connected in parallel at both ends of the bus voltage. When the power battery voltage is cut off from the capacitor, energy is still stored inside the capacitor, and two measures, active discharge and passive discharge, are required to consume the energy of the capacitor. For passive discharge, a discharge resistor needs to be connected in parallel at both ends of the capacitor. In the absence of the discharge switch control, the electrical energy of the capacitor is consumed in the form of heat energy of the discharge resistor. There is always current flowing through the discharge resistor, which generates heat. Therefore, certain heat dissipation measures need to be adopted to ensure that the electric drive system operates within the allowable temperature range. This solution achieves the effect of relatively uniform temperature of the entire discharge resistor circuit board by designing the circuit of the discharge resistor on the discharge resistor circuit board. First, the distance boundary parameters, discharge resistor operating parameters and temperature difference threshold of the discharge resistor circuit board are obtained. The distance boundary parameters of the discharge resistor circuit board are the length parameters and width parameters of the circuit board; the discharge resistor operating parameters include discharge time, capacitance value and bus voltage; the temperature difference threshold is the maximum range difference of the heat energy consumption of each discharge resistor on the discharge resistor circuit board;

[0066] S120 : Establishing a pre-topology structure of a discharge resistor circuit according to the distance boundary parameter and the power tolerance threshold.

[0067] Among them, the pre-topology structure of the discharge resistor circuit needs to consider two factors in the process of establishing it. On the one hand, considering the distribution mode, according to the distance boundary parameter, the pre-topology structure of the discharge resistor circuit includes multiple groups of series resistor units r1, r2...r n Each resistance unit consists of multiple parallel resistance sub-units (r 11 ,r21...r m1 )...(r 1m ,r 2m ...r nm ) composition; at the same time, in order to meet the heat dissipation problem, multiple parallel resistor sub-units (r 11 ,r 21 ...r m1 )...(r 1m ,r 2m ...r nm ) are evenly distributed on the circuit board as much as possible. On the other hand, considering the power requirement, since the power tolerance thresholds of the resistor subunits of different packaging structures are different, this solution selects multiple parallel resistor subunits (r 11 ,r21...r m1 )...(r 1m ,r 2m ...r nm ) packaging form, preferably, each resistor sub-unit selects a package larger than 0805; in this way, a pre-topological structure of the discharge resistor circuit can be established according to the distance boundary parameter and the power tolerance threshold.

[0068] S130 , determining a total resistance threshold of the discharge resistor in the pre-topology structure of the discharge resistor circuit according to the discharge resistor operating condition parameter, and selecting a total resistance of the discharge resistor according to the total resistance threshold of the discharge resistor.

[0069] The total resistance threshold of the discharge resistor is determined according to the discharge resistor operating condition parameters, specifically:

[0070]

[0071] In formula (1), ratl' is the total resistance threshold of the discharge resistor, τ is the discharge time, C is the capacitance, U is the bus voltage, and U f The human body safety voltage is 60V.

[0072]

[0073] In formula (2), r all is the total resistance of the discharge resistor. According to formula (2), the total resistance of the discharge resistor r is selected. all .

[0074] S140, determine the resistance value of each resistance subunit and the power of each resistance subunit according to the total resistance value of the discharge resistance and the discharge resistance circuit pre-topology.

[0075] wherein the discharge resistance circuit pre-topology is an m*n topology, the resistance value r ij is r all *m / n; the power P ij of each resistance subunit is (U / n) 2 all / (r all *m / n), which is less than the power tolerance threshold.

[0076] S150, perform thermal simulation processing on the discharge resistance circuit pre-topology to determine the discharge resistance temperature topology.

[0077] wherein the thermal simulation processing on the discharge resistance circuit pre-topology obtains a topology with different temperature distributions corresponding to different resistance subunits, i.e., the discharge resistance temperature topology.

[0078] S160, determine the difference between the maximum temperature of each resistance subunit and the minimum temperature of each resistance subunit according to the discharge resistance temperature pre-topology.

[0079] S170, determine whether the difference is less than the temperature difference threshold; if yes, perform S180; if no, perform S190.

[0080] S180, determine that the discharge resistance circuit topology is the discharge resistance circuit pre-topology.

[0081] wherein when the difference is less than the temperature difference threshold, the discharge resistance circuit pre-topology is the discharge resistance circuit topology, and the temperature on the circuit board is uniformly distributed.

[0082] S190, adjust the resistance value of each resistance subunit in the discharge resistance circuit pre-topology, and return to perform thermal simulation processing on the discharge resistance circuit pre-topology to determine the discharge resistance circuit topology.

[0083] wherein when the difference is greater than the temperature difference threshold, the temperature of the discharge resistance pre-topology on the circuit board is non-uniformly distributed, at which time the resistance value of each resistance subunit can be adjusted, the discharge resistance topology is re-confirmed, and the thermal simulation processing on the discharge resistance topology is performed in a loop until the discharge resistance temperature pre-topology determines that the difference between the maximum temperature of each resistance subunit and the minimum temperature of each resistance subunit is less than the temperature difference threshold, at which time the discharge resistance circuit topology is re-determined, so that the temperature of the entire circuit board is relatively uniform, and the problem of reduced device life caused by non-uniform temperature distribution due to the use of resistors with the same resistance value in series and parallel connection on the PCB under conventional design is avoided.

[0084] Specifically, Figure 2 FIG. 1 is a flow chart of adjusting the resistance value of each resistor subunit according to an embodiment of the present invention; FIG. Figure 2 As shown, adjusting the resistance value of each resistor subunit in the pre-topology structure of the discharge resistor circuit to determine the topology structure of the discharge resistor circuit includes the following steps:

[0085] S01. Determine the temperature matrix T according to the temperature topology of the discharge resistor, and determine the average temperature parameter t according to the temperature matrix T ave , and according to the temperature matrix T and the average temperature parameter t ave Determine the temperature deviation matrix ΔT; ΔT = Tt ave .

[0086] S02, according to the power P of each resistor sub-unit ij Determine the power matrix P.

[0087] S03, setting a temperature-power coefficient Δp based on a difference between a maximum temperature of each resistor subunit and a minimum temperature of each resistor subunit;

[0088] The temperature-power coefficient Δp can be adjusted according to the difference between the maximum temperature of each resistor sub-unit and the minimum temperature of each resistor sub-unit.

[0089] S04. Determine the resistance power matrix P1 according to the power matrix P, the temperature-power coefficient Δp, and the temperature deviation matrix ΔT; that is, P1 = P-ΔpΔT.

[0090] S05 , determining a resistance matrix R according to the resistance power matrix P1 , and adjusting the resistance value of each resistance sub-unit in the pre-topology structure of the discharge resistance circuit according to the resistance matrix R.

[0091] Specifically, the resistance matrix R is determined according to the resistance power matrix P1, including:

[0092] S001. Obtain bus voltage U;

[0093] S002, according to the resistance power matrix P1, determine the power p1, p2, ... p of each series resistance unit n ;

[0094] in, i=1,2,…n

[0095] S003, according to the power p of each series resistance unit i ,, total resistance of discharge resistor r all and bus voltage U determine the resistance values ​​r1, r2, ... r of each series resistor unit n ;

[0096] Among them, ri =r all pi / p all , i=1,2,…n

[0097] In the formula, p all is the total power of all resistance subunits; it can be obtained from the bus voltage parameter U and the total resistance value of the discharge resistor r all Get, that is, U 2 / r all .

[0098] S004, according to the resistance values ​​r1, r2, ... r n , the power of each series resistance unit p1, p2, ... p n And the resistance power matrix P1 determines the conductance matrix G, that is (g 11 ,g 21 ,…g m1 ),…(g 1m ,g 2m ,…g nm );

[0099] Among them, g ji =pji / pir i ,j=1,2,…m,i=1,2,…n

[0100] S006. Determine the resistance matrix R based on the conductance matrix G.

[0101] Where R = 1 / G.

[0102] Furthermore, after determining the resistance matrix R according to the conductance matrix G, the method further includes:

[0103] S007. Determine the nominal resistance matrix R' according to the resistance matrix R and the nominal resistance table;

[0104] The nominal resistance table represents resistor models of a certain specification currently available on the market. Each resistor model has a specific resistance value. The resistance matrix R can be further adjusted based on the nominal resistance table. For example, if an element in the calculated resistance matrix R is 4.52Ω and the actual value in the nominal resistance table is 4.5Ω, 4.52Ω can be adjusted to 4.5Ω, thereby re-determining the nominal resistance matrix R'.

[0105] S008. Determine the total resistance r1 of the nominal discharge resistors based on the nominal resistance matrix R' all ;

[0106] S009, determine the total resistance of the nominal discharge resistor r1 all Is it less than the total resistance threshold value r of the discharge resistor? all ';

[0107] S100, if yes, determining the nominal resistance matrix R' as the optimal resistance matrix;

[0108] S101 : If not, re-determine the nominal resistance matrix R′ according to the resistance matrix R and the nominal resistance table.

[0109] After determining the resistance matrix R based on the conductance matrix G, the optimal resistance matrix is ​​reconfirmed to adapt to a certain specification of resistors on the market and meet the adjustment requirements of actual resistor specifications. By selecting different temperature-power coefficients Δp, different resistance power matrices P1 are determined to determine different resistance matrices R. Different nominal resistance matrices are then determined based on a nominal resistance table. This adjusts the resistance values ​​of each resistor subunit and reconstructs the discharge resistor circuit topology, ensuring relatively uniform temperature across the discharge resistor circuit board.

[0110] Furthermore, based on the above embodiment, the topology of the discharge resistor circuit is further optimized. Figure 3 FIG. 1 is a flow chart of another circuit design method for a discharge resistor provided by an embodiment of the present invention. Figure 3 As shown, the specific steps include:

[0111] S210: Obtain distance boundary parameters, discharge resistor operating condition parameters, and temperature difference threshold of the discharge resistor circuit board.

[0112] S220 : Establishing a pre-topology structure of a discharge resistor circuit according to the distance boundary parameter and the power tolerance threshold.

[0113] S230 , determining a total resistance threshold of the discharge resistor in the pre-topology structure of the discharge resistor circuit according to the discharge resistor operating condition parameter, and selecting a total resistance of the discharge resistor according to the total resistance threshold of the discharge resistor.

[0114] S240 , setting the resistance value of each resistor sub-unit and the power of each resistor sub-unit according to the total resistance value of the discharge resistor and the pre-topological structure of the discharge resistor circuit.

[0115] S250 , performing thermal simulation on the pre-topology structure of the discharge resistor circuit to determine the temperature topology structure of the discharge resistor.

[0116] S260 : Determine the difference between the maximum temperature of each resistor sub-unit and the minimum temperature of each resistor sub-unit according to the discharge resistor temperature pre-topology structure.

[0117] S270: Determine whether the difference is less than the temperature difference threshold; if so, execute S280; if not, execute S290.

[0118] S280: Determine that the topology of the discharge resistor circuit is a pre-topology of the discharge resistor circuit.

[0119] S290 , adjusting the resistance value of each resistor subunit in the pre-topology structure of the discharge resistor circuit, and returning to perform thermal simulation processing on the topology structure of the discharge resistor circuit to determine the topology structure of the discharge resistor circuit.

[0120] S300, determining whether the power of any resistor sub-unit in the discharge resistor circuit topology structure is greater than a power tolerance threshold; if so, executing S310; if not, executing S320;

[0121] S310, changing the power tolerance threshold of each resistor sub-unit to determine a new topology of the discharge resistor circuit;

[0122] S320. The discharge resistor circuit topology is an optimal discharge resistor circuit topology.

[0123] Among them, based on the above scheme, this scheme further judges the power of each resistor sub-unit in the determined discharge resistor circuit topology structure. When the power of each resistor sub-unit is greater than the power tolerance threshold, the power tolerance threshold of each resistor sub-unit is changed to determine the new discharge resistor circuit topology structure; it can be understood that if the power tolerance threshold of each resistor sub-unit in the new discharge resistor circuit topology structure is higher, the package of each resistor sub-unit becomes larger, and the resistance value of each resistor sub-unit does not change; and when the power of each resistor sub-unit is less than the power tolerance threshold, the discharge resistor circuit topology structure is the optimal discharge resistor circuit topology structure, so that the temperature of the entire circuit board is relatively uniform.

[0124] Based on the same inventive concept, an embodiment of the present invention further provides a discharge module of a discharge resistor. Figure 4 FIG. 1 is a schematic diagram of a discharge module structure of a discharge resistor provided by an embodiment of the present invention, such as Figure 4 As shown, the discharge module includes a discharge resistor circuit topology structure 01 obtained by the circuit design method of the discharge resistor in the above embodiment (only some resistor subunits are shown in the figure) and a PCB circuit board 02; the discharge resistor circuit topology structure is evenly distributed on the front and back sides of the PCB circuit board 02; Figure 5 This is an electrical connection diagram of the discharge resistor circuit topology structure provided by an embodiment of the present invention, such as Figure 5 As shown, the discharge resistor circuit topology is connected in parallel across the bus voltage Vdc and in parallel with the bus capacitor C. This embodiment can achieve a relatively uniform temperature across the entire PCB circuit board.

[0125] An embodiment of the present invention further provides a circuit design device for a discharge resistor. The circuit design device provided by the embodiment of the present invention can execute the circuit design method for a discharge resistor provided by any embodiment of the present invention, and has functional modules and beneficial effects corresponding to the execution method. Figure 6 FIG. 1 is a schematic structural diagram of a circuit design device for a discharge resistor provided by an embodiment of the present invention.Figure 6 As shown, the device includes:

[0126] An acquisition unit 10 is configured to acquire a distance boundary parameter of a discharge resistor circuit board, a discharge resistor operating condition parameter, and a temperature difference threshold; wherein the discharge resistor operating condition parameter includes a discharge time, a capacitance value, and a bus voltage;

[0127] The pre-topology structure establishing unit 20 is configured to establish a pre-topology structure of a discharge resistor circuit according to the distance boundary parameter and the power tolerance threshold; wherein the pre-topology structure of the discharge resistor circuit includes a plurality of series-connected resistor units; each resistor unit includes a plurality of parallel-connected resistor sub-units; and the power of each resistor sub-unit is less than the power tolerance threshold.

[0128] A first parameter determination unit 30 is configured to determine a total resistance threshold of the discharge resistor in the pre-topology structure of the discharge resistor circuit according to the discharge resistor operating condition parameter, and select a total resistance of the discharge resistor according to the total resistance threshold of the discharge resistor;

[0129] The second parameter determination unit 40 is used to set the resistance value of each resistor sub-unit and the power of each resistor sub-unit according to the total resistance value of the discharge resistor and the pre-topological structure of the discharge resistor circuit;

[0130] The temperature topology structure determining unit 50 is used to perform thermal simulation processing on the topology structure of the discharge resistor circuit to determine the temperature topology structure of the discharge resistor;

[0131] a difference determination unit 60, configured to determine a difference between a maximum temperature of each resistor subunit and a minimum temperature of each resistor subunit according to a temperature topology of the discharge resistor;

[0132] A judging unit 70 is configured to judge whether the difference is less than a temperature difference threshold;

[0133] a circuit topology determining unit 80 for determining that the discharge resistor circuit topology is a discharge resistor circuit pre-topology when the difference is less than a temperature difference threshold;

[0134] The resistance adjustment unit 90 is used to return to adjust the resistance of each resistor sub-unit in the discharge resistor circuit pre-topology structure when the difference is greater than the temperature difference threshold, and return to perform thermal simulation processing on the discharge resistor circuit pre-topology structure to determine the discharge resistor circuit topology structure.

[0135] Figure 7 A schematic diagram of the structure of a computer device provided in an embodiment of the present invention is shown in FIG. Figure 7 As shown, the device includes a processor 70, a memory 71, an input device 72 and an output device 73; the number of processors 70 in the device can be one or more. Figure 7In the embodiment, a processor 70 is used as an example; the processor 70, the memory 71, the input device 72 and the output device 73 in the device can be connected by a bus or other means. Figure 7 The bus connection is taken as an example.

[0136] Memory 71, as a computer-readable storage medium, can be used to store software programs, computer-executable programs, and modules, such as the program instructions / modules corresponding to the discharge resistor circuit design method in the embodiments of the present invention. Processor 70 executes the software programs, instructions, and modules stored in memory 71 to execute various functional applications and data processing of the device, thereby implementing the aforementioned discharge resistor circuit design method.

[0137] The memory 71 may primarily include a program storage area and a data storage area. The program storage area may store an operating system and at least one application required for a function; the data storage area may store data created based on the use of the terminal, etc. Furthermore, the memory 71 may include high-speed random access memory and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other non-volatile solid-state memory device. In some instances, the memory 71 may further include memory remotely located relative to the processor 70, and these remote memories may be connected to the device via a network. Examples of the aforementioned networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0138] The input device 72 may be used to receive input digital or character information and generate key signal input related to user settings and function control of the device. The output device 73 may include a display device such as a display screen.

[0139] An embodiment of the present invention further provides a storage medium containing computer-executable instructions. When the computer-executable instructions are executed by a computer processor, the computer-executable instructions are used to perform a circuit design method for a discharge resistor. The method includes:

[0140] Obtaining the distance boundary parameters, discharge resistor operating condition parameters, and temperature difference threshold of the discharge resistor circuit board; wherein the discharge resistor operating condition parameters include discharge time, capacitance value, and bus voltage;

[0141] A discharge resistance circuit pre-topology structure is established according to the distance boundary parameter and the power tolerance threshold; wherein the discharge resistance circuit pre-topology structure includes a plurality of series-connected resistance units; each of the resistance units includes a plurality of parallel-connected resistance sub-units;

[0142] Determining a total resistance threshold of the discharge resistor in the pre-topology structure of the discharge resistor circuit according to the discharge resistor operating condition parameter, and selecting a total resistance of the discharge resistor according to the total resistance threshold of the discharge resistor;

[0143] The resistance value of each resistor subunit and the power of each resistor subunit are set according to the total resistance value of the discharge resistor and the pre-topological structure of the discharge resistor circuit; wherein the power of each resistor subunit is less than the power tolerance threshold;

[0144] Performing thermal simulation on the discharge resistor circuit topology to determine the discharge resistor temperature topology;

[0145] Determining a difference between a maximum temperature of each of the resistor subunits and a minimum temperature of each of the resistor subunits according to the discharge resistor temperature topology;

[0146] Determining whether the difference is less than a temperature difference threshold; if so, determining that the discharge resistor circuit topology is a discharge resistor circuit pre-topology;

[0147] If not, the resistance value of each resistor subunit in the discharge resistor circuit pre-topology structure is adjusted, and the process returns to perform a thermal simulation process on the discharge resistor circuit topology structure to determine the discharge resistor circuit topology structure.

[0148] Of course, the computer-executable instructions of the storage medium provided in the embodiment of the present invention are not limited to the operations of the method described above, but can also execute the relevant operations in the circuit design method of the discharge resistor provided in any embodiment of the present invention.

[0149] Through the above description of the implementation methods, those skilled in the art can clearly understand that the present invention can be implemented with the help of software and necessary general-purpose hardware, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as a computer floppy disk, read-only memory (ROM), random access memory (RAM), flash memory (FLASH), hard disk or optical disk, etc., including a number of instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to execute the methods described in each embodiment of the present invention.

[0150] It is worth noting that in the embodiment of the above-mentioned search device, the various units and modules included are only divided according to functional logic, but are not limited to the above-mentioned division, as long as the corresponding functions can be achieved; in addition, the specific names of the functional units are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of the present invention.

[0151] Note that the above merely describes preferred embodiments of the present application and the principles of the technology applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and that various obvious changes, modifications and substitutions can be made to the present application without departing from the scope of the present application. Therefore, although the present application has been described in detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the claims.

Claims

1. A method for designing a circuit of a discharge resistor, characterized in that: include: Obtaining the distance boundary parameters, discharge resistor operating condition parameters, and temperature difference threshold of the discharge resistor circuit board; wherein the discharge resistor operating condition parameters include discharge time, capacitance value, and bus voltage; A discharge resistance circuit pre-topology structure is established according to the distance boundary parameter and the power tolerance threshold; wherein the discharge resistance circuit pre-topology structure includes a plurality of series-connected resistance units; each of the resistance units includes a plurality of parallel-connected resistance sub-units; Determining a total resistance threshold of the discharge resistor in the pre-topology structure of the discharge resistor circuit according to the discharge resistor operating condition parameter, and selecting a total resistance of the discharge resistor according to the total resistance threshold of the discharge resistor; The resistance value of each resistor subunit and the power of each resistor subunit are set according to the total resistance value of the discharge resistor and the pre-topological structure of the discharge resistor circuit; wherein the power of each resistor subunit is less than the power tolerance threshold; Performing thermal simulation on the pre-topology structure of the discharge resistor circuit to determine the temperature topology structure of the discharge resistor; Determining a difference between a maximum temperature of each of the resistor subunits and a minimum temperature of each of the resistor subunits according to the discharge resistor temperature topology; Determining whether the difference is less than the temperature difference threshold; if so, determining that the discharge resistor circuit topology is the discharge resistor circuit pre-topology; If not, the resistance value of each resistor subunit in the discharge resistor circuit pre-topology structure is adjusted, and the thermal simulation process of the discharge resistor circuit pre-topology structure is returned to determine the discharge resistor circuit topology structure.

2. The circuit design method of the discharge resistor according to claim 1, characterized in that: Also includes: Determining whether the power of any of the resistor subunits in the discharge resistor circuit topology structure is greater than the power tolerance threshold; If so, changing the power tolerance threshold of each resistor sub-unit to determine a new topology of the discharge resistor circuit; If not, the discharge resistor circuit topology is the optimal discharge resistor circuit topology.

3. The circuit design method of the discharge resistor according to claim 1, characterized in that: Adjusting the resistance value of each resistor subunit in the pre-topological structure of the discharge resistor circuit includes: Determining a temperature matrix according to the discharge resistor temperature topology, determining an average temperature parameter according to the temperature matrix, and determining a temperature deviation matrix according to the temperature matrix and the average temperature parameter; Determining a power matrix according to the power of each of the resistance subunits; setting a temperature-power coefficient based on a difference between a maximum temperature of each of the resistor subunits and a minimum temperature of each of the resistor subunits; Determine a resistance power matrix according to the power matrix, the temperature-power coefficient and the temperature deviation matrix; A resistance matrix is ​​determined according to the resistance power matrix, and the resistance value of each resistance sub-unit in the pre-topology structure of the discharge resistance circuit is adjusted according to the resistance matrix.

4. The circuit design method of the discharge resistor according to claim 3, characterized in that: Determining a resistance matrix according to the resistance power matrix includes: Obtaining the bus voltage; Determining the power of each of the series resistor units according to the resistor power matrix; Determining the resistance value of each of the series resistance units according to the power of each of the series resistance units, the total resistance value of the discharge resistors, and the bus voltage; determining a conductance matrix according to the resistance value of each of the series resistor units, the power of each of the series resistor units, and the resistance-power matrix; A resistance matrix is ​​determined based on the conductance matrix.

5. The circuit design method of the discharge resistor according to claim 4, characterized in that: After determining the resistance matrix according to the conductance matrix, the method further includes: Determining a nominal resistance matrix according to the resistance matrix and the nominal resistance table; determining a nominal discharge resistor total resistance based on the nominal resistance matrix; Determining whether the nominal total resistance of the discharge resistors is less than the total resistance threshold of the discharge resistors; If so, determining that the nominal resistance matrix is ​​the optimal resistance matrix; If not, the nominal resistance matrix is ​​re-determined according to the resistance matrix and the nominal resistance table.

6. The circuit design method of the discharge resistor according to claim 4, characterized in that: The total resistance threshold of the discharge resistor is determined according to the discharge resistor operating condition parameters, specifically: Among them, r all is the total resistance of the discharge resistor, τ is the discharge time, C is the capacitance, U is the bus voltage, U f The human body safety voltage is 60V.

7. A discharge circuit of a discharge resistor, characterized in that: A discharge resistor circuit topology structure and a PCB circuit board obtained by the circuit design method of the discharge resistor according to any one of claims 1 to 6; the discharge resistor circuit topology structure is evenly distributed on the front and back sides of the PCB circuit board; The discharge resistor circuit topology is connected in parallel across the bus voltage and in parallel with the bus capacitance.

8. A circuit design device for a discharge resistor, characterized in that: include: An acquisition unit is used to acquire a distance boundary parameter of the discharge resistor circuit board, a discharge resistor operating condition parameter, and a temperature difference threshold; wherein the discharge resistor operating condition parameter includes a discharge time, a capacitance value, and a bus voltage; A pre-topology structure establishing unit, configured to establish a pre-topology structure of a discharge resistance circuit according to the distance boundary parameter and the power tolerance threshold; wherein the pre-topology structure of the discharge resistance circuit includes a plurality of groups of series-connected resistance units; each of the resistance units includes a plurality of parallel-connected resistance sub-units; a first parameter determination unit, configured to determine a total resistance threshold of the discharge resistor in the pre-topology structure of the discharge resistor circuit according to the discharge resistor operating condition parameter, and select a total resistance of the discharge resistor according to the total resistance threshold of the discharge resistor; a second parameter determination unit, configured to set the resistance value of each of the resistor subunits and the power of each of the resistor subunits according to the total resistance value of the discharge resistor and the pre-topological structure of the discharge resistor circuit; wherein the power of each of the resistor subunits is less than the power tolerance threshold; a temperature topology structure determining unit, configured to perform a thermal simulation process on the pre-topology structure of the discharge resistor circuit to determine the temperature topology structure of the discharge resistor; a difference determination unit, configured to determine a difference between a maximum temperature of each of the resistor subunits and a minimum temperature of each of the resistor subunits according to the discharge resistor temperature topology; a judging unit, configured to judge whether the difference is less than a temperature difference threshold; a circuit topology determining unit, configured to determine, when the difference is less than a temperature difference threshold, that the topology of the discharge resistor circuit is the pre-topology of the discharge resistor circuit; The resistance adjustment unit is used to return to adjust the resistance of each resistor sub-unit in the discharge resistor circuit pre-topology structure when the difference is greater than the temperature difference threshold, and return to perform thermal simulation processing on the discharge resistor circuit pre-topology structure to determine the discharge resistor circuit topology structure.

9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the program, the circuit design method for the discharge resistor as described in any one of claims 1 to 6 is implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the circuit design method for the discharge resistor as claimed in any one of claims 1 to 6 is implemented.

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