Method for fixing printed circuit board of groove processing device and groove processing device

Abstract

A method for fixing a printed substrate of a grooving processing device, wherein a plurality of substrate fixing pins are erected on the top of a relay template, and a plurality of inner pin discharge holes are provided, and a plurality of template fixing pins are erected below the relay template, so that the substrate fixing pins of the relay template are inserted into a plurality of substrate fixing pin holes pre-pierced in the lower plate, the mother substrate and the upper plate, and are overlapped and fixed to form a substrate template unit, and the entire substrate template unit is moved into, fixed, and moved out of the unitary grooving processing device, so that the recovery operation of the plurality of sub-substrates and the removal operation of the residues on the lower plate, the mother substrate and the upper plate can be carried out outside the unitary grooving processing device, so that the grooving processing operation can be carried out continuously to improve the operation efficiency and also improve the work efficiency of the operator.

Description

Technical Field

[0001] The present invention relates to a fixing method for a processing device and a processing device for implementing the fixing method, and in particular to a fixing method for a printed substrate of a grooving processing device for performing cutting processing (hereinafter referred to as grooving processing) on ​​the periphery of a printed substrate or a slot or inner window in a printed substrate, and a grooving processing device for implementing the fixing method for a printed substrate of the grooving processing device. Background Art

[0002] In recent years, printed circuit boards are being required to function not only as electronic components themselves but also as mechanical components and machine parts. Furthermore, the printed circuit boards themselves are being required to be smaller and more precise.

[0003] When multiple printed circuit boards are cut out from a single substrate as multiple products (hereinafter referred to as the original substrate is referred to as the "mother substrate", and the multiple printed circuit boards cut out from the mother substrate as products are referred to as "sub-substrates"), the sub-substrates themselves are assembled as independent single parts. Therefore, the grooving process performed on the sub-substrates also requires high processing accuracy.

[0004] Therefore, for the aforementioned sub-substrate which is required to have the function of a mechanism part or a mechanical part and also needs to be miniaturized and highly precise, a previous technology has been proposed: in order to achieve high-precision grooving processing, the mother substrate and the lower plate are overlapped on a template fixed on a processing table of a grooving processing device and fixed with substrate positioning pins, and at the same time, an inner pinhole is set in the sub-substrate by the same device, so that the inner pin is respectively embedded in the inner pinhole of the mother substrate and the lower plate (see patent document 1: Japanese Patent Gazette No. 2015-199224).

[0005] In this way, since the inner pinholes of the above-mentioned mother substrate and the lower plate are set by the same device, there is no need to set a significant diameter difference between the inner pinhole and the inner needle, so the dimensional tolerance of the two can be set to about ±0μm, and the inner needle can be embedded in the inner pinhole to fix the sub-substrate.

[0006] Therefore, when the groove forming device is used to perform the groove forming process, the sub-substrate will not shake, so the processing accuracy of the sub-substrate during the groove forming process can reach less than ±50 μm.

[0007] However, when the substrate positioning pin holes are provided on the template fixed to the processing table of the grooving processing device, and the substrate positioning pins are inserted into the substrate positioning pin holes while overlapping the lower plate and the mother substrate, if there is a slight deviation in the positions of the overlapping lower plate and the mother substrate, a part of the lower plate and the mother substrate will float up, resulting in that even if the processing accuracy can reach below ±50μm, it is difficult to further improve the accuracy.

[0008] Moreover, when the substrate positioning pin is installed or removed from the substrate positioning pin hole of the template, the substrate positioning pin will cause wear or deformation of the substrate positioning pin hole, and there is a possibility of poor positioning or reduced processing accuracy, so it is necessary to manage the number of times the substrate positioning pin is installed and removed from the substrate positioning pin hole.

[0009] As such, the current situation is still that when the substrate positioning pins are fixed to the template, the lower plate and the mother substrate must be fixed to the template manually in sequence.

[0010] Moreover, the preparation work of embedding the substrate positioning pins into the substrate positioning pin holes provided on the lower plate and the mother substrate and the substrate positioning pin holes provided on the template to make a unit, the recovery operation of the sub-substrates cut out from the mother substrate after the groove processing, and the removal operation of the inner needles that fell into the inner needle holes of the template and the residues on the lower plate and the mother substrate are all carried out in the groove processing device.

[0011] Therefore, the grooving process in the grooving processing device cannot be performed continuously, which not only causes a significant reduction in the efficiency of the grooving process, but also the various operations performed in the grooving processing device are all performed manually by the operator, which also causes the operator's work efficiency to be low.

[0012] Technical problems that the invention aims to solve:

[0013] The problem that the present invention aims to solve is that, when fixing the lower plate and the mother substrate by embedding the substrate positioning pins in the substrate positioning pin holes of the template fixed on the processing table, the installation and removal of the substrate positioning pins will cause the substrate positioning pin holes of the template to wear or deform, resulting in poor positioning, and the shaking during the grooving process will make it difficult to improve the processing accuracy, making it difficult to obtain higher processing accuracy.

[0014] Moreover, another technical problem is that the preparatory work of embedding the substrate positioning pins of the template into the substrate positioning pin holes provided on the lower plate and the mother substrate to overlap the lower plate and the mother substrate, the recovery operation of the sub-substrate cut out from the mother substrate by grooving processing, and the removal operation of the lower plate and the mother substrate residue in the grooving processing device are all manually performed by the operator in the grooving processing device, which not only causes the grooving processing operation to be discontinuous and the efficiency to be reduced, but also causes the problem of low working efficiency of the operator. Summary of the Invention

[0015] The object of the present invention is to provide a method for fixing a printed circuit board of a grooving processing device, which can continuously perform grooving processing operations to improve operation efficiency and also improve the working efficiency of operators.

[0016] A first feature of the method for fixing a printed circuit board of a groove processing device of the present invention is that, in the groove processing device having at least a groove processing mechanism and a processing table for performing groove processing:

[0017] First, a lower plate and a printed circuit board, or the lower plate, the printed circuit board and an upper plate are overlapped and fixed on a plate-shaped relay template to form a substrate template unit, and then the substrate template unit is fixed on the processing table.

[0018] Therefore, on the relay template, the lower plate and the printed substrate, or the lower plate, the printed substrate and the upper plate are overlapped and fixed together to form the substrate template unit, and the substrate template unit is moved into the processing table of the grooving processing device as a whole before processing, and is fixed to the processing table when moved in, and is moved out of the grooving processing device after processing.

[0019] In this way, the assembly operation of the substrate template unit, the recovery operation of the printed substrate as a product, and the removal operation of the lower plate and the printed substrate constituting the substrate template unit, or the residue of the lower plate, the printed substrate and the upper plate, can all be carried out outside the grooving processing device. Therefore, the grooving processing operation in the grooving processing device can be carried out continuously, thereby improving the operation efficiency.

[0020] Moreover, the operator can perform the above-mentioned various operations in a centralized manner outside the grooving processing device, so that the operator's moving distance or working range during the above-mentioned various operations are not restricted by the grooving processing device, and the degree of freedom is expanded, thereby also improving the operator's working efficiency.

[0021] Based on the first feature, the second feature of the method for fixing a printed circuit board of the groove processing device of the present invention is:

[0022] A plurality of substrate fixing pins are vertically erected at predetermined positions on the upper side of the relay template constituting the substrate template unit, and a plurality of template fixing pins are vertically erected at predetermined positions on the lower side of the relay template.

[0023] The lower plate and the printed circuit board, or the lower plate, the printed circuit board and the upper plate constituting the substrate template unit, are pre-pierced with a plurality of holes for substrate fixing pins at positions corresponding to the substrate fixing pins erected on the upper surface of the relay template.

[0024] In the processing table of the grooving processing device, a plurality of template clamps are provided at positions corresponding to the template fixing pins erected below the relay template constituting the substrate template unit.

[0025] The substrate fixing pins erected on the relay template are inserted into the substrate fixing pin holes on the lower plate and the printed substrate, or the lower plate, the printed substrate and the upper plate, so that the lower plate and the printed substrate, or the lower plate, the printed substrate and the upper plate, and the relay template are overlapped and fixed together to form the substrate template unit.

[0026] The template fixing pins provided on the bottom of the relay template constituting the substrate template unit are gripped by the template clamp provided in the processing table to fix the template to the processing table.

[0027] Therefore, in the relay template constituting the substrate template unit, the substrate fixing pins for holding the overlapping lower plate and the printed substrate, or the lower plate, the printed substrate and the upper plate, are continuously fixed on the relay template during multiple processing operations, and the substrate fixing pins are not installed or removed. Therefore, the multiple substrate fixing pin use holes provided on the relay template for continuously setting up the substrate fixing pins are unlikely to be worn or deformed, so there is no need to separately manage the number of times the substrate fixing pins are installed and removed.

[0028] Moreover, the template clamp provided in the processing table is used to correctly and firmly hold the template fixing pin, so that the relay template can be correctly and firmly fixed on the processing table. Furthermore, the substrate fixing pins provided on the relay template are embedded in and overlapped with and fixed to the lower plate and the printed substrate on the relay template, or the lower plate, the printed substrate and the substrate fixing pin holes on the upper plate. Therefore, the printed substrate of the substrate template unit will be firmly fixed in the correct position in the grooving processing device.

[0029] Thus, the printed circuit board does not shake during the groove forming process, so that the groove forming process can be performed with high precision.

[0030] In addition, when the substrate template unit is moved into the processing table of the grooving processing device, the substrate fixing pins erected on the relay template are suitable for being erected at the two central locations in the front and rear directions of the relay template described later, or at three of the four corners.

[0031] In addition, in conjunction with the substrate fixing needle, regarding the shape of the hole for the substrate fixing needle that is pre-pierced on the lower plate, or the lower plate and the upper plate, and the printed substrate, if the substrate fixing needle is arranged at two central locations in the front and rear directions of the relay template, the shape should be a round hole. If the substrate fixing needle is arranged at three of the four corners of the relay template, all three can be round holes, or only one can be set as a round hole, and the other two diagonal locations can be set as long holes, so that its position can be adjusted.

[0032] Based on the first or second feature, a third feature of the method for fixing a printed circuit board of a grooving processing device of the present invention is:

[0033] The grooving processing device also has an inner needle hole punching mechanism and an inner needle driving mechanism.

[0034] A printed circuit board constituting the substrate template unit can be divided into multiple printed circuit boards as products. The original printed circuit board is defined as a mother substrate, and multiple printed circuit boards cut from the mother substrate as products are defined as multiple daughter substrates.

[0035] On the upper surface of the relay template constituting the substrate template unit, a plurality of inner needle discharge holes are pre-punched at positions corresponding to the plurality of inner needle holes through which the sub-substrates are to be pierced.

[0036] In the lower plate and the printed substrate, or the lower plate, the printed substrate and the upper plate, which constitute the substrate template unit and are overlapped and fixed on the relay template, the inner pinhole punching mechanism is used to punch out the inner pinhole at a predetermined position of the sub-substrate constituting the lower plate and the printed substrate, or the lower plate, the printed substrate and the upper plate, and the inner pinhole punching mechanism is used to punch out a plurality of inner pins from above into the punched inner pinholes, so that the lower plate and the mother substrate, or the lower plate, the mother substrate and the upper plate become one.

[0037] Therefore, in the grooving processing device, on the relay template constituting the substrate template unit, at a predetermined position of the sub-substrate constituting the lower plate and the mother substrate, or the lower plate, the mother substrate and the upper plate, the inner pinhole is punched out by the same inner pinhole punching mechanism, and the inner pin is driven in by the inner pin driving mechanism, so there is no need to set a significant diameter difference between the inner pinhole and the inner pin, and the dimensional tolerance between the two can be set to about ±0.

[0038] In this way, the lower plate and the mother substrate, or the lower plate, the mother substrate, and the upper plate, which overlap and are held by the relay template constituting the substrate template unit, can be securely fixed in the correct position. Furthermore, the lower plate and the mother substrate, or the lower plate, the mother substrate, and the upper plate are integrated with the relay template via the substrate fixing pins, and when the template clamp of the processing table securely holds the template fixing pins, the substrate template unit is securely fixed in the correct position relative to the processing table. Therefore, the mother substrate will not shake during the grooving process, and the sub-substrate can be grooved with higher precision.

[0039] In addition, after the grooving processing of the mother substrate installed on the substrate template unit is completed, the inner needle that is driven into the predetermined position of the lower plate and the mother substrate, or the sub-substrate of the lower plate, the mother substrate and the upper plate that together constitute the substrate template unit together with the relay template is driven into the inner needle discharge hole of the relay template by the inner needle driving mechanism, and then the entire substrate template unit is moved out of the grooving processing device for recovery.

[0040] On the other hand, the substrate template unit composed of the lower plate and the mother substrate, or the lower plate, the mother substrate and the upper plate that overlap and hold the relay template is manufactured and prepared outside the grooving processing device, so the substrate template unit to be grooved next can be manufactured in advance. Therefore, after grooving is performed on one substrate template unit, the grooving operation can be continuously performed on the grooving processing device by pre-manufacturing the substrate template unit to be grooved next. Therefore, not only the operating efficiency of the grooving processing device can be improved, but also the operating efficiency of the operator can be improved.

[0041] Furthermore, the inner needle discharge holes provided in the relay template are pre-punched corresponding to the type of the sub-substrates constituting the mother substrate, and therefore, there is no need to replace the relay template in accordance with the mother substrate being processed.

[0042] Based on any one of the first to third features, the groove forming apparatus of the present invention is characterized (fourth feature) in that:

[0043] The grooving processing device includes a grooving processing mechanism and a processing table.

[0044] The grooving processing mechanism is used for performing grooving processing.

[0045] The processing table is used to fix the substrate template unit during the grooving process.

[0046] The grooving apparatus implements the method for fixing a printed circuit board of the grooving apparatus described in any one of the first to third features.

[0047] Therefore, in the grooving processing device, the printed substrate or the mother substrate is fixed on the processing table as the substrate template unit for grooving processing. Therefore, the manufacture of the substrate template unit and the recovery of the processed printed substrate or the sub-substrate after grooving processing can be performed by the operator outside the grooving processing device.

[0048] In this way, the grooving device can continuously perform grooving, and the operator can centrally perform the above-mentioned operations outside the grooving device, thereby improving the operating efficiency of the grooving device and the operating efficiency of the operator.

[0049] In addition, the printed substrate (or the mother substrate) and the lower plate, or the lower plate and the upper plate, are correctly and firmly fixed into one by the inner needles driven in, and when the printed substrate is firmly fixed in the correct position on the processing table via the relay template of the substrate template unit, the printed substrate can be grooved with high precision.

[0050] Furthermore, in the grooving processing device, the printed substrate or the mother substrate is fixed to the processing table by the substrate template unit which is jointly constituted by the lower plate, or the lower plate, the upper plate, and the relay template. There is no need to add a new device, nor is there any need to change or expand the setting space or production line of the grooving processing device. As long as the design of the previous carrying-in and carrying-out mechanism is changed to match the thickness or weight of the substrate template unit, it can correspond to the present invention. Therefore, it can prevent the operating efficiency of the grooving processing device from being reduced due to long-term stoppage, for example.

[0051] The beneficial effects of the present invention are:

[0052] In the present invention, on the relay template, the printed circuit board (or the mother substrate) and the lower plate, or the lower plate and the upper plate are overlapped and fixed to serve as the substrate template unit, and various operations such as preparation and product recovery required for the grooving processing are centrally performed outside the grooving processing device. Therefore, it has the excellent effect of improving the operating efficiency of the grooving processing device and improving the working efficiency of the operator.

[0053] Furthermore, the substrate fixing pins that hold the lower plate and the printed substrate (or the mother substrate), or the lower plate and the printed substrate (or the mother substrate) and the upper plate overlapping each other on the relay template, are continuously fixed on the relay template. Therefore, the installation and removal of the substrate fixing pins will not cause the holes for the substrate fixing pins provided on the relay template to be worn or deformed. Therefore, there is no need to manage the number of installation and removal of the substrate fixing pins, which also has a good effect on improving the processing accuracy.

[0054] Furthermore, the present invention can be implemented in an existing grooving processing device without adding a new device or changing or expanding the installation space or production line of the grooving processing device. The present invention can be implemented by simply changing the design of the previous loading and unloading mechanism to match the thickness or weight of the substrate template unit. Therefore, there is no need to suspend the use of the grooving processing device, which has the excellent effect of preventing a decrease in operational efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 It is a schematic diagram of an embodiment of the grooving processing device of the present invention;

[0056] Figure 2 It is along Figure 1 A schematic cross-sectional view of line II-II in FIG.

[0057] Figure 3 is a front view of a base plate sample unit of the embodiment;

[0058] Figure 4 is a schematic cross-sectional view of the substrate sample unit of the embodiment;

[0059] Figure 5 (a) to (c) are schematic diagrams showing the operating status of two sets of template clamps of the embodiment. The template clamps are set in a processing table and respectively clamp and fix two template fixing pins of a relay template. DETAILED DESCRIPTION

[0060] Embodiments of the invention:

[0061] A lower plate and a printed substrate (or a mother substrate), or the lower plate, the printed substrate (or the mother substrate) and an upper plate are overlapped and fixed on a relay template to serve as a substrate template unit, and the entire substrate template unit is moved into and fixed on a processing table in a grooving processing device. After processing, the entire substrate template unit is moved out of the grooving processing device from the processing table, and the processed printed substrate or multiple sub-substrates are recovered outside the grooving processing device, and the residues of the lower plate and the printed substrate (or the mother substrate), or the lower plate, the printed substrate (or the mother substrate) and the upper plate are removed. On the other hand, by moving another substrate template unit to be processed next, which is prepared in advance outside the grooving processing device, into and fixing it on the processing table in the grooving processing device, the grooving processing operation can be carried out continuously, so that the operator can concentrate on the work.

[0062] Example:

[0063] See Figure 1 、 Figure 2 and Figure 3 , Figure 1An embodiment of the present invention is shown, which is a unit-type grooving processing device A. Specifically, the unit-type grooving processing device A is a currently mainstream grooving processing device with six processing axes, and comprises: a grooving processing device 1; a work table 5 corresponding to the six processing axes; a loading and unloading mechanism 6 connecting the grooving processing device 1 and the work table 5 to enable free movement of a substrate template unit 7, which will be described later; and a control device (not shown) that comprehensively controls the grooving processing device 1, the work table 5, and the loading and unloading mechanism 6.

[0064] On the back side of the unit type grooving processing device A ( Figure 1 The workbench 5 is arranged on the upper part of the back side (hereinafter referred to as the "rear").

[0065] The following is a description of the portion of the unitary grooving processing device A corresponding to one of the processing axes (see Figure 2 ).

[0066] Furthermore, the printed circuit board being grooved in the unit-type groove forming apparatus A serves as the substrate template unit 7. The following description assumes that a single printed circuit board is processed and cut into multiple printed circuit boards as products. The original printed circuit board is referred to as a "motherboard 12," and the multiple printed circuit boards cut from the motherboard 12 as products are referred to as "sub-substrates 12'."

[0067] Here, first of all, Figure 4 As shown, the substrate template unit 7 is formed by overlapping the mother substrate 12, a lower plate 13, and an upper plate 14 on a relay template 8, and fixed as a whole. Figure 4 In the figure, although only one mother substrate 12 is shown, it can also be composed of multiple overlapping mother substrates.

[0068] See Figure 1 、 Figure 3 and Figure 4 That is, the relay template 8 constituting the substrate template unit 7 is a rectangular plate with a thickness of 8 mm made of very hard glass epoxy resin. Three of the four corners on its upper side are respectively provided with three substrate fixing needles 9, and two template fixing needles 10 facing each other are respectively vertically provided at the center in the front-to-back direction on its lower side.

[0069] Furthermore, an inner pinhole punching mechanism (not shown, and a slotting tool of the slotting apparatus 1 can also serve as the inner pinhole punching mechanism) provided on the unitary slotting processing device A punches inner pinholes 13', 12'a, and 14' in the stacked and held lower plate 13, the sub-base plate 12' of the mother substrate 12, and the upper plate 14. A plurality of inner pinhole discharge holes 11 are provided on the upper surface of the relay template 8 at positions corresponding to the inner pinholes 13', 12'a, and 14'. The diameter of the inner pinhole discharge holes 11 is wider than the diameter of the inner pinholes 13', 12'a, and 14'. In this way, a plurality of inner needles 15 that are driven into the inner needle holes 13', 12'a, 14' in order to integrally hold the lower plate 13, the sub-base plate 12' and the upper plate 14 can be driven by an inner needle driving mechanism (not shown in the figure, and the groover of the groove processing device 1 itself can also serve as the inner needle driving mechanism, or the inner needle hole punching mechanism can also serve as the inner needle driving mechanism) can be further driven into the inner needle discharge hole 11 by the inner needle driving mechanism after the groove processing, and the inner needle 15 can be easily recovered.

[0070] In addition, the inner pinhole 12'a provided in the sub-substrate 12' in the mother substrate 12 is provided at three of the four corners of each sub-substrate 12', and the inner pinholes 13', 14' provided on the lower plate 13 and the upper plate 14 and the inner needle discharge hole 11 provided on the relay template 8 are provided at positions corresponding to the inner pinhole 12'a provided in the sub-substrate 12'.

[0071] In addition, the lower plate 13, the mother substrate 12 and the upper plate 14, which together with the above-mentioned relay template 8 constitute the substrate template unit 7, each have a plurality of substrate fixing needle holes 13", 12", 14" pre-drilled at the position of the substrate fixing needle 9 erected on one side of the relay template 8 for the substrate fixing needle 9 to be embedded.

[0072] Therefore, when making the substrate template unit 7, the substrate fixing needle 9 erected on one side of the relay template 8 is embedded in the substrate fixing needle holes 13", 12", and 14" pre-drilled on the lower plate 13, the mother substrate 12, and the upper plate 14. Therefore, the lower plate 13, the mother substrate 12, and the upper plate 14 can overlap and be fixed as a whole relative to the above-mentioned relay template 8.

[0073] Moreover, in the unitary grooving processing device A, the inner pinhole punching mechanism of the grooving processing device 1 is used to punch the inner pinholes 13', 12'a, 14' on the lower plate 13, the mother substrate 12 and the upper plate 14, and the inner pinhole 15 is driven into the inner pinholes 13', 12'a, 14' by the inner pin driving mechanism of the same grooving processing device 1. Therefore, the overlapping lower plate 13, the mother substrate 12 and the sub-substrate 12' and the upper plate 14 are firmly integrated together.

[0074] Next, the grooving processing device 1 of the unit-type grooving processing device A for performing grooving processing on the above-mentioned substrate template unit 7 comprises: a grooving processing mechanism (not shown) for performing grooving processing, an inner needle punching and driving mechanism (not shown) for punching the inner pinholes 13', 12'a, 14' on the lower plate 13, the mother substrate 12 and the upper plate 14 constituting the above-mentioned substrate template unit 7, and driving the inner needle 15 into the inner pinholes 13', 12'a, 14', and a processing table 2 for fixing the substrate template unit 7 during grooving processing.

[0075] Although not shown in the drawings, the groove forming mechanism and the inner needle punching and driving mechanism included in the groove forming device 1 may be replaced with those included in the existing groove forming device.

[0076] See Figure 1 and Figure 5 Here, during the above-mentioned grooving process, the substrate template unit 7 is fixed on the processing table 2 as shown in FIG. Figure 5 As shown. Among them, Figure 5 (a) is a schematic diagram of a temporary installation in the carrying-in and carrying-out mechanism 6. Figure 5 (b) is a diagram showing the front side position being fixed by the front pressure block 3″ described below. Figure 5 (c) is a diagram showing how the angle is corrected and fixed by the pressure block 4" described below.

[0077] That is, in order to fix the substrate template unit 7 at a predetermined position when the substrate template unit 7 is moved into the processing table 2, the processing table 2 has two sets of front and rear template clamps 3 and 4 that never protrude from the surface of the processing table 2 at the positions of the two template fixing needles 10 erected below the relay template 8 that constitutes the substrate template unit 7, and the two sets of front and rear template clamps 3 and 4 respectively have a set of two blocks 3', 3" and 4', 4" for holding the corresponding template fixing needles 10.

[0078] The front and rear template clamps 3 and 4 (hereinafter referred to as "front template clamp 3" and "rear template clamp 4") are arranged on the front side of the unit type grooving processing device A ( Figure 1 The front template clamp 3 (shown on the lower side of the drawing, annotations omitted below) is composed of two blocks 3', 3" (hereinafter referred to as "front fixing block 3'" and "front pressure block 3") arranged in the front-to-back direction. The front fixing block 3' has a locking portion 3'a with a V-shaped cross section and is fixed to the processing table 2. The front pressure block 3" slides toward the front fixing block 3' to form a block with a rectangular cross section that can pressurize and hold the template fixing needle 10. On the other hand, the rear template clamp 4 on the back side of the unitary grooving processing device A is composed of a rear fixing block 4' and a rear pressure block 4" that are arranged facing each other in a right angle direction perpendicular to the front-to-back direction of the unitary grooving processing device A. The rear fixing block 4' has a rectangular cross section and is fixed to the processing table 2. The rear pressure block 4" has a rectangular cross section and slides toward the rear fixing block 4' to pressurize and hold the template fixing needle 10.

[0079] Therefore, when the front and rear two sample fixing needles 10 of the relay sample 8 constituting the substrate sample unit 7 are located between the blocks 3', 3", 4', 4" constituting the front and rear sample clamps 3, 4, the front pressure block 3" slides toward the front fixing block 3' and the rear pressure block 4" slides toward the rear fixing block 4', so that the front and rear two sample fixing needles 10 are respectively pressurized and gripped.

[0080] In particular, the template fixing needle 10 located between the front fixing block 3' and the front pressure block 3" is guided toward the V-shaped tip by the V-shaped locking portion 3'a provided on the front fixing block 3' located in its sliding direction, so that it can be firmly held by the front fixing block 3' and the front pressure block 3", while the template fixing needle 10 located between the rear fixing block 4' and the rear pressure block 4" is corrected in position toward the rear fixing block 4' by the sliding of the rear pressure block 4" and is firmly held, so that the substrate template unit 7 can be firmly fixed at the correct position on the processing table 2.

[0081] Here, the front and rear template clamps 3 and 4 of the processing table 2 are provided with positions of multiple template fixing needles 10 erected below the relay template 8 that constitutes the substrate template unit 7.

[0082] Therefore, since there are basically only two sizes of the printed circuit board or the mother board 12 that are currently being processed, the size of the relay template 8 that together with the printed circuit board or the mother board 12 constitutes the substrate template unit 7 can also be unified into two sizes.

[0083] Therefore, in the front and rear template clamps 3 and 4 installed in the processing table 2, the front template clamp 3 is universal regardless of the size of the relay template 8, and by making the cross-sections of the long sides of the rear fixing block 4' and the rear pressure block 4" of the rear template clamp 4 rectangular, the relay template 8 of any size can be applied.

[0084] See Figure 1 and Figure 2 Next, the workbench 5 constituting the above-mentioned unit-type grooving processing device A has an upper workbench 5' and a lower workbench 5" in two sections, so as to perform various operations such as manufacturing and disassembly of the substrate template unit 7, wherein there is a certain interval between the upper workbench 5' and the lower workbench 5", and the substrate template unit 7 can be moved in and out of at least the processing table 2 of the grooving processing device 1, and the upper workbench 5' and the lower workbench 5" can be freely raised and lowered to a height approximately the same as that of the processing table 2 in the grooving processing device 1.

[0085] In this way, the upper work table 5' and the lower work table 5" can be used interactively. That is, for example, when the substrate template unit 7 is manufactured on the upper work table 5', the substrate template unit 7 is moved into the grooving processing device 1, and when the grooving processing is performed, the upper work table 5' is made to bounce upward while the lower work table 5" is raised. After the lower work table 5" manufactures the next substrate template unit 7, the lower work table 5" is lowered to its original position, and the substrate template unit 7 after the grooving processing is moved out to the upper work table 5' outside the grooving processing device 1. Thereafter, the work table 5 is raised, and the next substrate template unit 7 is moved from the lower work table 5" into the grooving processing device 1. In this way, when the grooving processing is performed, the sub-substrate 12' can be recovered from the moved-out substrate template unit 7 on the upper work table 5 (see Figure 3 ) as a product, and can simultaneously exclude the lower plate 13, the mother substrate 12 and the upper plate 14 (see Figure 4 ) residue, and repeating this programming can make the unit grooving processing device A operate continuously.

[0086] In addition, the loading and unloading mechanism 6 connecting the upper work table 5' and the lower work table 5" of the above-mentioned work table 5 and the processing table 2 is constructed as follows. For example, it can be composed of an upper work table conveyor belt hidden in the upper work table 5', a lower work table conveyor belt hidden in the lower work table 5", a relay conveyor belt provided on the back side of the grooving processing device 1, and a lifting mechanism with a telescopic cylinder installed in the grooving processing device 1 so that the substrate template unit 7 can be lifted and moved to a predetermined position (its specific structure is not shown in the figure).

[0087] Therefore, before the grooving process, the substrate template unit 7 manufactured on either the upper work table 5' or the lower work table 5" can be moved and placed on the relay conveyor that operates synchronously with the upper or lower work table conveyor by activating either the upper work table conveyor built into the upper work table 5' or the lower work table conveyor built into the lower work table 5". Then, the substrate template unit 7 placed on the relay conveyor is moved to the vicinity of the rear end portion (the end edge on the back side) of the processing table 2. Moreover, by the lifting mechanism provided in the grooving processing device 1, the substrate template unit 7 on the relay conveyor is lifted to a length higher than the protruding length of the template fixing pin 10 provided below the relay template 8, and is moved to a position roughly above the template clamps 3 and 4 provided on the processing table 2 of the grooving processing device 1 where the template fixing pin 10 is located. Then, the substrate template unit 7 is lowered onto the processing table 2 so that the template fixing needle 10 is located at each block 3', 3" and 4', 4" (see Figure 5 ) between the two locations.

[0088] In addition, after the grooving process, the substrate template unit 7 on the processing table 2 is lifted to a length higher than the protruding length of the template fixing needle 10 erected under the relay template 8 by the lifting mechanism installed in the grooving processing device 1, and is moved and placed on the relay conveyor belt near the rear end of the processing table 2. Then, the substrate template unit 7 placed on the relay conveyor belt is moved to the opposite end of the relay conveyor belt, that is, near the front end of either the upper work table 5' or the lower work table 5". Thereafter, the substrate template unit 7 is moved out and placed on the upper work table 5' or the lower work table 5" by either the upper work table conveyor belt or the lower work table conveyor belt that operates synchronously.

[0089] Matching reference Figures 1 to 5As shown in Table 1 below, the substrate template unit 7 in the modular groove forming apparatus A of the present invention performs groove forming in the stages shown in Table 1, depending on the operator's work content, the conditions of the groove forming apparatus 1, the loading and unloading mechanism 6, and the work table 5. Specifically, the first stage is the assembly step of the substrate template unit 7.

[0090] After the operator places the relay template 8 on the upper workbench 5' of the workbench 5 provided on the back side of the unit-type grooving processing device A in an embodiment of the present invention, the operator inserts the substrate fixing needles 9 erected on the relay template 8 into the pre-punched holes 13", 12", and 14" for the substrate fixing needles in the order of the lower plate 13, the mother substrate 12, and the upper plate 14, and assembles the substrate template unit 7 that is fixed as a whole.

[0091] The second stage is a step of carrying in the substrate template unit 7 and a preparation step for the groove forming process.

[0092] After the operator has adjusted the height of the upper work table 5' to approximately the same as the height of the processing table 2, he or she instructs the loading and unloading mechanism 6 to load the assembled substrate template unit 7 onto the processing table 2 within the groove forming apparatus 1. In response, the loading and unloading mechanism 6 loads the substrate template unit 7 on the upper work table 5' onto the processing table 2 within the groove forming apparatus 1.

[0093] In the unit-type grooving processing device A, a control circuit that integrates and controls the unit-type grooving processing device A, the loading and unloading mechanism 6, and the workbench 5 confirms that the substrate template unit 7 has been loaded and placed on the processing table 2. Then, the template clamps 3 and 4 provided in the processing table 2 hold the template fixing pin 10 provided below the relay template 8 constituting the substrate template unit 7 to fix it to the processing table 2.

[0094] The third stage is a processing step of the substrate template unit 7 and a next assembling step of the substrate template unit 7 .

[0095] After confirming that the substrate template unit 7 has been loaded and secured to the processing table 2 within the grooving apparatus 1, the operator instructs the operator to begin grooving. The grooving apparatus 1 then uses the inner pin drilling and driving mechanism of the grooving apparatus 1 to drill inner pin holes 13', 12'a, and 14' at predetermined locations on the lower plate 13, the sub-substrate 12' constituting the mother substrate 12, and the upper plate 14, and then drives the inner pins 15. Subsequently, the mother substrate 12 undergoes the predetermined grooving process.

[0096] In addition, the operator moves to the back side of the unit-type grooving processing device A, raises the lower work table 5", and then makes the upper work table 5' bounce upward to make the lower work table 5" open upward, and places the relay template 8 on the lower work table 5". Thereafter, the substrate fixing needles 9 erected thereon are embedded in the pre-punched holes 13", 12", and 14" for the substrate fixing needles in the order of the lower plate 13, the mother substrate 12, and the upper plate 14, to assemble the substrate template unit 7 that is fixed as a whole.

[0097] The fourth stage is the step of carrying out the substrate template unit 7 .

[0098] The operator moves to the front side of the unit-type grooving processing device A again, confirms that the grooving processing of the mother substrate 12 has been completed normally, and then instructs the control device of the grooving processing device 1 to use the inner needle punching and driving mechanism to drive the inner needle 15 into the inner needle discharge hole 11 of the relay template 8 in the processed substrate template unit 7. After confirming the punching of the inner needle 15, the template clamps 3 and 4, which are placed in the processing table 2 and hold the template fixing pins 10 installed below the relay template 8 constituting the substrate template unit 7, are released, and the clamps 3 and 4 are released from the processing table 2.

[0099] Afterwards, the operator moves to the back side of the modular groove processing device A and instructs the loading / unloading mechanism 6 to unload the substrate template unit 7. At this time, the upper work table 5' is released from its upward spring and lowered to approximately the same height as the processing table 2. The loaded / unloaded mechanism 6 then unloads the processed substrate template unit 7 from the processing table 2 and places it on the upper work table 5'. The operator then confirms that the substrate template unit 7 has been unloaded.

[0100] The fifth stage involves loading the substrate template unit 7 and preparing for the grooving process. This stage is essentially the same as the second stage, with the only difference being that the loading and unloading mechanism 6 loads the substrate template unit 7 assembled on the lower workbench 5" onto the processing table 2 within the grooving apparatus 1. Therefore, to allow the loading of the substrate template unit 7, the workbench 5 is raised to a height approximately equal to that of the lower workbench 5" and the processing table 2.

[0101] The sixth stage is the processing step of the substrate sample unit 7, the product recovery step and the assembly step of the next substrate sample unit 7.

[0102] The substrate processing steps are the same as the first half of the aforementioned third stage.

[0103] On the other hand, the operator retrieves the processed substrate template unit 7 placed on the upper workbench 5' in the fourth stage as a finished product, and removes the residue from the lower plate 13, the upper plate 14, and the mother substrate 12. Furthermore, the assembly steps for the next substrate template unit 7 are also performed on the upper workbench 5', in the same manner as in the first stage.

[0104] The seventh stage is the step of carrying out the substrate sample unit 7 .

[0105] The operator moves to the front side of the unitary grooving processing device A, performs the same operations as those described in the first half of the fourth stage, and issues instructions to the control device of the grooving processing device 1. Afterwards, the operator moves to the back side of the unitary grooving processing device A, raises the height position of the lower work table 5" to the height position after the raising in the aforementioned fifth stage, and then, similarly to the description in the second half of the aforementioned fourth stage, issues instructions for carrying out the substrate template unit 7, and uses the loading and unloading mechanism 6 to carry out the processed substrate template unit 7 on the processing table 2, and confirms that it is placed on the lower work table 5".

[0106] The eighth stage is a step of carrying in the next substrate template unit 7 and a step of preparing for the grooving process.

[0107] After the operator lowers the height position of the upper work table 5' set in the aforementioned seventh stage until the height position of the upper work table 5' is approximately the same as the height position of the processing table 2, he performs the loading operation according to the loading instruction recorded in the aforementioned second stage.

[0108] Furthermore, regarding the substrate template unit 7 carried into the groove forming apparatus 1 , the control circuit of the groove forming apparatus 1 performs the fixing operation described in the second half of the second stage.

[0109] The ninth stage is a step of processing the substrate sample unit 7 and a step of recovering the product.

[0110] The processing steps are the same as those described in the aforementioned Stage 3. Regarding the product recovery step, to facilitate the workflow, the upper work platform 5' is made to spring upward, and the lower work platform 5" is raised. Except for the height increase of the lower work platform 5", the process is the same as the product recovery step in the aforementioned Stage 6.

[0111] Thereafter, by repeating these steps, the unit type groove forming device A can continuously perform groove forming processing on the sub-substrate 12 ′ constituting the mother substrate 12 .

[0112] In summary, in the grooving operation, the steps corresponding to the operator's work content at the workbench, the operating status of the grooving device, and the operating status of the loading and unloading mechanism can be shown in Table 1 below:

[0113] Table 1

[0114]

[0115]

[0116]

[0117] Industrial Application Possibilities:

[0118] At least, a printed substrate to be processed is overlapped on a relay template to form a substrate template unit that is fixed as a whole, and this substrate template unit is moved into or out of a unitary grooving processing device for processing. In this way, various operations other than grooving processing can be performed outside the grooving processing device, so grooving processing can be performed continuously, and it is also suitable for various processing devices other than the grooving processing device.

[0119] The above descriptions are merely embodiments of the present invention and should not be used to limit the scope of the present invention. In other words, any simple equivalent changes and modifications made according to the claims and description of the present invention still fall within the scope of the present invention.

Claims

1. A method for fixing a printed circuit board in a grooving processing device, wherein the grooving processing device comprises at least a grooving processing mechanism and a processing table for performing grooving processing, characterized in that: The fixing method comprises: First, a lower plate and a printed circuit board, or the lower plate, the printed circuit board and the upper plate are overlapped and fixed on a plate-shaped relay template to form a substrate template unit, and then the substrate template unit is fixed to the processing table; A plurality of substrate fixing pins are vertically erected at predetermined positions on the upper side of the relay template constituting the substrate template unit, and a plurality of template fixing pins are vertically erected at predetermined positions on the lower side of the relay template; The lower plate and the printed circuit board, or the lower plate, the printed circuit board and the upper plate constituting the substrate template unit, are pre-pierced with a plurality of substrate fixing pin holes at positions corresponding to the substrate fixing pins erected on the upper surface of the relay template; In the processing table of the grooving processing device, a plurality of template clamps are provided at positions corresponding to the template fixing pins erected below the relay template constituting the substrate template unit; Inserting the substrate fixing pins provided on the relay template into the substrate fixing pin holes formed on the lower plate and the printed substrate, or the lower plate, the printed substrate, and the upper plate, so that the lower plate, the printed substrate, or the lower plate, the printed substrate, the upper plate, and the relay template are overlapped and fixed together to form the substrate template unit; The template clamp provided in the processing table grips the template fixing pin provided on the bottom of the relay template constituting the substrate template unit to fix it to the processing table; The groove processing device also has an inner needle hole punching mechanism and an inner needle driving mechanism; A printed circuit board constituting the substrate template unit can be divided into a plurality of printed circuit boards as products, wherein the original printed circuit board is defined as a mother substrate, and the plurality of printed circuit boards cut from the mother substrate as products are defined as a plurality of daughter substrates; On the top of the relay template constituting the substrate template unit, a plurality of inner needle discharge holes are pre-punched at positions corresponding to the plurality of inner needle holes to be pierced through by the sub-substrate; In the lower plate and the printed substrate, or the lower plate, the printed substrate, and the upper plate, which constitute the substrate template unit and are overlapped and fixed on the relay template, the inner pinhole punching mechanism punches inner pinholes at predetermined positions of the sub-substrates constituting the lower plate and the printed substrate, or the lower plate, the printed substrate, and the upper plate, and the inner pin driving mechanism drives a plurality of inner pins into the punched inner pinholes from above, thereby integrating the lower plate and the mother substrate, or the lower plate, the mother substrate, and the upper plate; and First, the substrate fixing pin is inserted into the pre-punched hole for the substrate fixing pin to assemble the integrated substrate template unit. Then, the template fixing pin is held by the template clamp of the processing table to fix the substrate template unit to the processing table. Then, the inner pin hole punching mechanism and the inner pin driving mechanism are used to punch the inner pin hole at the predetermined position of the lower plate, the sub-substrate constituting the mother substrate, and the upper plate, and the inner pin is driven in. After the grooving of the mother substrate is completed, the inner pin hole punching mechanism and the inner pin driving mechanism are used to drive the inner pin into the inner pin discharge hole, and the template clamp holding the template fixing pin is released to release the fixation to the processing table.

2. A grooving processing device, comprising a grooving processing mechanism and a processing table, characterized in that: The grooving processing mechanism is used for performing grooving processing; The processing table is used to fix the substrate template unit during the grooving process; The groove forming apparatus implements the method for fixing a printed circuit board of the groove forming apparatus according to claim 1 .

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