Wafer surface defect detector

Abstract

The present invention relates to a wafer surface defect detector, comprising: a conveyor line group, including a first conveyor line and a second conveyor line. A plurality of carriers. A loading and grabbing device, used to grab and position the carrier with wafers stacked thereon, and then move the wafers on the carrier to the first conveyor line in sequence. A posture adjustment device, placed on the first conveyor line, used to adjust the posture of the wafer. A code scanning device, used to read the laser-engraved code on the wafer. A material sorting and detection device, placed between the first conveyor line and the second conveyor line, provided with at least two detection stations, the material sorting and detection device sorts the wafers transported by the first conveyor line to each detection station for detection, and transports the wafers that have been detected to the second conveyor line. A classification and discharging device, placed on the second conveyor line, used to classify and stack the wafers. A controller. The present invention can realize automatic loading, detection and classified stacking of wafers, with a high degree of automation and high efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection equipment, and in particular to a wafer surface defect detector. Background Art

[0002] During the production process of wafers, affected by process conditions, early transportation and other factors, a small amount of wafers prepared will have defects such as stains, bubbles, holes, uneven thickness, and missing edges. Therefore, surface defect detection is required before the wafers leave the factory to remove defective products. Existing wafer surface defect detection devices mostly use manual loading and unloading, and take photos and detect them through industrial cameras. After the wafers are produced, they are generally stacked on the carrier first. During the inspection, the wafers need to be taken out from the carrier one by one for inspection, which is a major factor limiting the wafer loading speed. When large-scale wafer inspection is required, this single-station inspection method cannot meet the needs, and adding multiple stations for inspection. If it is still a single-person operation, as the operation time goes by, the error rate increases, which may cause defective products to be mixed with qualified products, or qualified products to be treated as defective products. If the number of operators is increased, there will be serious waste of labor, and in the long run, the labor cost will be high. Summary of the invention

[0003] The object of the present invention is to provide a wafer surface defect detector, which can realize streamlined detection of wafer surface defects and can classify and stack the detected wafers according to needs, with high degree of automation and high efficiency.

[0004] To achieve the above object, the present invention discloses a wafer surface defect detector, which comprises:

[0005] The conveyor line group is used for conveying wafers, and comprises a first conveyor line and a second conveyor line which are arranged in sequence.

[0006] A plurality of carriers are used to stack wafers.

[0007] The loading and grabbing device is located at the feed end of the first conveyor line, and is used to grab and position the carrier on which the undetected wafers are stacked. The loading and grabbing device cooperates with the first conveyor line to move the wafers on the carrier to the first conveyor line in sequence, or the loading and grabbing device directly grabs the wafers on the carrier in sequence and moves them to the first conveyor line.

[0008] The posture adjustment device is placed on the first conveying line and is used to adjust the posture of the wafer so that the wafer continues to be conveyed in a uniform posture.

[0009] The code scanning device is placed on the first conveyor line and is used to read the laser engraved code on the wafer.

[0010] The material separation and detection device is placed between the first conveyor line and the second conveyor line. The material separation and detection device is provided with at least two detection stations. The material separation and detection device separates the wafers conveyed by the first conveyor line to each detection station for detection, and conveys the wafers after detection to the second conveyor line.

[0011] The sorting and discharging device is placed on the second conveying line and is used to sort and stack the wafers on the second conveying line.

[0012] The controller is connected to the first conveying line, the second conveying line, the loading and grabbing device, the posture adjustment device, the code scanning device, the material separation detection device and the classification and discharging device.

[0013] Preferably, the feeding and grabbing device comprises:

[0014] A stacking rack is provided with a plurality of stacking stations arranged in an array, and each of the stacking stations can limit the placement of at least one carrier.

[0015] The first transport mechanism includes a first three-axis mobile platform, a first rotating table and at least two sets of first clamping components. The first three-axis mobile platform drives the first rotating table to move, and the first rotating table drives the first clamping component to rotate. The first clamping component can clamp at least one set of carriers.

[0016] The second transport mechanism includes a second rotating table, at least two first fixed seats and at least two first lifting assemblies. The second rotating table drives the first lifting assembly to rotate. The first lifting assembly corresponds to the first fixed seat one by one, and the first lifting assembly drives the first fixed seat to move up and down. At least one bearing member can be placed on the first fixed seat in a limited position. The first transport mechanism and the second transport mechanism cooperate to shift the bearing member on the stacking station to the first fixed seat.

[0017] The first conveying line cooperates with the first lifting assembly to grab the wafer on the carrier of the first fixing seat and move it to the first conveying line.

[0018] Preferably, the stacking station is provided with a detection sensor for detecting whether wafers are stacked on the carrier.

[0019] Preferably, the posture adjustment device comprises:

[0020] The first visual camera is placed above the first conveyor line and is used to compare the current posture of the wafer with the set posture and give adjustment commands.

[0021] The adjustment mechanism includes a second three-axis mobile platform, a turntable and at least one first vacuum suction cup. The second three-axis mobile platform drives the turntable to move, and the turntable drives the first vacuum suction cup to rotate. The first vacuum suction cup is connected to an external vacuum device. Under normal conditions, the first vacuum suction cup does not exceed the conveying surface of the first conveying line. The adjustment mechanism acts according to the adjustment command to adjust the position of the wafer to the set posture.

[0022] Preferably, the code scanning device includes a second visual camera and a first light source.

[0023] Preferably, the material distribution detection device comprises:

[0024] The first material sorting mechanism is adjacent to the discharging end of the first conveying line and is used for sorting and positioning the wafers conveyed by the first conveying line.

[0025] At least one second material dividing mechanism is placed between the first material dividing mechanism and the second conveyor line; the second material dividing mechanism includes at least one first linear motion module and at least one transfer mechanism for grabbing wafers, and the first linear motion module drives the transfer mechanism to move back and forth between the first material dividing mechanism and the second conveyor line.

[0026] At least two conveying mechanisms, and each of the second material distribution mechanisms corresponds to at least two conveying mechanisms; the conveying mechanisms are arranged beside the second material distribution mechanisms and are arranged at intervals along the conveying direction of the first conveying line.

[0027] At least two first detection mechanisms are placed at the detection station and correspond one-to-one to the conveying mechanism. The first detection mechanisms are used to detect wafer surface defects including bubbles, stains, and holes.

[0028] The first material dividing mechanism, the second material dividing mechanism and the conveying mechanism cooperate to move the wafer located on the first material dividing mechanism to the inspection station for inspection, and the second material dividing mechanism and the conveying mechanism cooperate to move the wafer located at the inspection station to the second conveying line.

[0029] Preferably, it also includes a third material dividing mechanism, which is placed between the second material dividing mechanism and the second conveyor line, and the second material dividing mechanism and the third material dividing mechanism cooperate to move the wafers on the second material dividing mechanism to the second conveyor line.

[0030] Preferably, the first material dividing mechanism and the third material dividing mechanism both include a second linear moving module and at least one first conveying component, the second linear moving module drives the first conveying component to move along a conveying direction perpendicular to the first conveyor line, and the first conveying component corresponds one-to-one to the second material dividing mechanism.

[0031] Preferably, the transfer mechanism includes a rotating drive member, a transfer cylinder and at least one grabbing member, the rotating drive member drives the transfer cylinder to rotate, and the transfer cylinder drives the grabbing member to move up and down; the grabbing member includes a mounting plate and at least one suction cup, and the suction cup is arranged on the upper surface of the mounting plate.

[0032] The conveying mechanism comprises a third linear moving module, a fourth linear moving module and a placement table; the third linear moving module drives the fourth linear moving module to move along a conveying direction perpendicular to the first conveying line, and the fourth linear moving module drives the placement table to move along a conveying direction parallel to the first conveying line; the placement table is used to position and place the wafer;

[0033] Preferably, the first detection mechanism includes a mounting platform and at least one first detection camera, and the mounting platform is provided with adjustment components corresponding to the first detection cameras one by one, and the adjustment components are used to adjust the horizontal position and height of the first detection camera.

[0034] Preferably, the classification discharging device comprises:

[0035] A plurality of unloading mechanisms are arranged on one side or both sides of the second conveying line and are arranged in sequence along the conveying direction of the second conveying line.

[0036] A plurality of lifting mechanisms are arranged on the second conveying line and arranged in sequence along the conveying direction of the second conveying line; each of the lifting mechanisms corresponds to at least one set of unloading mechanisms, and the lifting mechanisms move the wafers on the second conveying line to the unloading mechanisms.

[0037] A plurality of lifting mechanisms correspond to the unloading mechanisms one by one. The lifting mechanisms are used to position and place the carrier and drive the carrier to move up and down. The lifting mechanisms cooperate with the unloading mechanisms to stack the wafers on the unloading mechanisms into the carriers.

[0038] At least one third transport mechanism is used to transport the empty carrier to the lifting mechanism, and to transport the fully loaded carrier on the lifting mechanism to a designated position.

[0039] Preferably, the unloading mechanism includes a unloading cylinder and a second conveying assembly, the unloading cylinder drives the second conveying assembly to move up and down, and the conveying direction of the second transmission assembly is perpendicular to the conveying direction of the second conveyor line.

[0040] The lifting mechanism includes a lifting cylinder, a third conveying assembly, a material blocking cylinder and a material blocking plate. The lifting cylinder drives the third conveying assembly to move up and down, and the third conveying assembly can be adjacent to the second conveying assembly; the material blocking cylinder drives the material blocking plate to move up and down; under normal circumstances, the third conveying assembly and the material blocking plate do not exceed the conveying surface of the second conveyor line.

[0041] The lifting mechanism comprises a second lifting assembly and a second fixed seat, wherein the second lifting assembly drives the second fixed seat to move up and down, and the second fixed seat is used for limiting the position of the bearing member.

[0042] The third transport mechanism includes a third three-axis mobile platform, a third rotating table and at least one set of second clamping components. The third three-axis mobile platform drives the third rotating table to move, and the third rotating table drives the second clamping components to rotate. The second clamping components are used to clamp the carrier.

[0043] Preferably, it also includes at least one third conveying line for conveying empty carriers, and a plurality of fourth conveying lines for conveying sorted carriers.

[0044] Preferably, it also includes a second detection mechanism connected to the controller, and the second detection mechanism is arranged at the discharge end of the first conveyor line or the feed end of the second conveyor line; the second detection mechanism includes a second detection camera and a second light source, and the second detection camera is used to detect the bottom surface appearance of the wafer.

[0045] Preferably, it further comprises a third detection mechanism connected to the controller, wherein the third detection mechanism is arranged between the first conveying line and the material distribution detection device or between the material distribution detection device and the second conveying line.

[0046] The third detection mechanism includes a fifth conveyor line, a first vertical cylinder, a second vertical cylinder, a block, a fourth rotating table, at least one second vacuum suction cup, at least one third detection camera and at least one third light source; the first vertical cylinder drives the fourth rotating table to move up and down, and the fourth rotating table drives the second vacuum suction cup to rotate; the second vertical cylinder drives the block to move up and down, and under normal circumstances, the second vacuum suction cup and the block are placed below the conveying surface of the fifth conveyor line; the third detection camera and the third light source correspond one to one, and the third detection camera is used to detect whether the wafer is missing edges.

[0047] Preferably, it further comprises a fourth detection mechanism connected to the controller, and the fourth detection mechanism is arranged between the first conveying line and the material division detection device or between the material division detection device and the second conveying line.

[0048] The fourth detection mechanism includes a frame, a sixth conveyor line, a fifth linear motion module, a shock absorbing platform, a detection probe group and at least one third vertical cylinder; the detection probe group is fixed on the frame, the detection probe group includes a plurality of detection probes, and the detection probes are staggered, and the detection probe group is used to detect the thickness of the wafer; the fifth linear motion module is arranged on the frame, and the fifth linear motion module drives the shock absorbing platform to move along the transmission direction of the sixth conveyor line and pass through the detection probe group; the third vertical cylinder is fixed on the frame and drives the sixth conveyor line to move up and down, the third vertical cylinder, the sixth conveyor line and the shock absorbing platform cooperate to move the wafers on the sixth conveyor line to the shock absorbing platform, and after all the wafers pass through the detection probe group, the wafers on the shock absorbing platform are moved to the sixth conveyor line.

[0049] The present invention has the following beneficial effects:

[0050] The present invention uses a loading and grabbing device to grab and position a carrier on which undetected wafers are stacked, and then moves the wafers on the carrier one by one to the first conveyor line for transportation. The wafers are adjusted to a uniform posture by a posture adjustment device for continued transportation, so as to facilitate subsequent code scanning and detection. The laser engraved code on the wafer is read by a code scanning device, and the detection result of each wafer can be associated with the laser engraved code, which is convenient for management and classification. The material separation detection device can detect multiple wafers at the same time without interfering with each other, which is conducive to improving the detection speed. The wafers that have been detected are classified and stacked by the classification discharging device according to the required classification method, which is convenient for later management. The present invention can realize automatic loading, detection and classified stacking of wafers, and the assembly line detection method has a high degree of automation and high efficiency, which can save a lot of labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 It is a schematic diagram of the present invention.

[0052] Figure 2 A schematic diagram of a carrier.

[0053] Figure 3 Schematic diagram of the feeding and grabbing device.

[0054] Figure 4 for Figure 3 Enlarged schematic diagram of part A in the middle.

[0055] Figure 5 It is a schematic diagram of the first transport mechanism.

[0056] Figure 6 for Figure 5 Enlarged schematic diagram of part B in the middle.

[0057] Figure 7 It is a schematic diagram of the second transport mechanism.

[0058] Figure 8 It is a schematic diagram of the first conveyor line, the posture adjustment device, the code scanning device and the second detection mechanism.

[0059] Fig. 9 It is a schematic diagram of the material distribution detection device.

[0060] Fig.10 This is a schematic diagram of the material distribution detection device from another perspective.

[0061] Fig.11 It is a schematic diagram of the first material distribution mechanism.

[0062] Fig.12 It is a schematic diagram of the third material distribution mechanism.

[0063] Fig.13 This is a schematic diagram of the transfer mechanism.

[0064] Fig.14 Schematic diagram of the transmission mechanism.

[0065] Fig.15 It is a schematic diagram of the first detection mechanism.

[0066] Fig.16 It is a schematic diagram of the third detection mechanism.

[0067] Fig.17 It is a schematic diagram of the fourth detection mechanism.

[0068] Fig.18 for Fig.17 Enlarged schematic diagram of part C in the middle.

[0069] Fig.19 This is a schematic diagram of the classification discharging device.

[0070] Fig. 20 for Fig.19 Enlarged schematic diagram of part D in the middle.

[0071] Fig.21 Schematic diagram of the second conveyor line.

[0072] Fig. 22 Schematic diagram of the feeding mechanism.

[0073] Fig.23 Schematic diagram of the lifting mechanism.

[0074] Fig.24 Schematic diagram of the lifting mechanism.

[0075] Fig.25 It is a schematic diagram of the third transport mechanism.

[0076] Main component symbols:

[0077] Carrier 11, wafer 12, first conveyor line 13, second conveyor line 14;

[0078] Loading and grabbing device 20, stacking rack 21, photoelectric switch 211, induction sheet 212, first transport mechanism 22, first three-axis mobile platform 221, first X-axis mobile module 2211, first Y-axis mobile module 2212, first Z-axis mobile module 2213, first rotating table 222, clamping assembly 223, two-way cylinder 2231, clamping block 2232, anti-slip baffle 2233, second transport mechanism 23, second rotating table 231, pedestal 2311, swivel seat 2312, second motor 2313, first lifting assembly 232, first fixed seat 233;

[0079] Position adjustment device 30, first visual camera 31, second three-axis mobile platform 321, second X-axis mobile module 3211, second Y-axis mobile module 3212, position cylinder 3213, turntable 322, first vacuum suction cup 323;

[0080] A code scanning device 40, a second visual camera 41, and a first light source 42;

[0081] A second detection mechanism 50, a second detection camera 51, and a second light source 52;

[0082] The material distribution detection device 60, the first material distribution mechanism 61, the second linear motion module 611, the first transmission component 612, the positioning baffle 613, the second material distribution mechanism 62, the first linear motion module 621, the transfer mechanism 622, the rotary drive member 6221, the transfer cylinder 6222, the grabber 6223, the mounting plate 62231, the suction cup 62232, the third material distribution mechanism 63, the baffle 631, the transmission mechanism 64, the third linear motion module 641, the fourth linear motion module 642, the placement table 643, the pad 6431, the support column 6432, the placement groove 64321, the first detection mechanism 65, the mounting table 651, the first detection camera 652, the stud 6531, the crank 6532, the sliding block 6533, the sliding column 6534, the angle adjustment table 6535, and the extension plate 6536;

[0083] A third detection mechanism 70, a fifth conveying line 71, a first vertical cylinder 72, a second vertical cylinder 73, a stopper 74, a fourth rotating table 75, a third detection camera 76, and a third light source 77;

[0084] Fourth detection mechanism 80, frame 81, sixth conveyor line 82, fifth linear motion module 83, shock absorbing platform 84, detection probe group 85, third vertical cylinder 86;

[0085] Classification and discharging device 90, unloading mechanism 91, unloading cylinder 911, second conveying assembly 912, lifting mechanism 92, third conveying assembly 922, material blocking cylinder 923, material blocking plate 924, arc surface 9241, lifting mechanism 93, second lifting assembly 931, first motor 9311, mounting frame 9312, guide rail 9313, screw 9314, slider 9315, second fixed seat 932, third conveying mechanism 94, third three-axis mobile platform 941, third X-axis mobile module 9411, third Y-axis mobile module 9412, third Z-axis mobile module 9413, third rotating table 942, material blocking column 9421, second clamping assembly 943, third conveying line 95, fourth conveying line 96. DETAILED DESCRIPTION

[0086] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0087] like Figures 1 to 25 As shown, the present invention discloses a wafer surface defect detector, which includes: a controller, a conveyor line group, a plurality of carriers 11, a loading and grabbing device 20, a posture adjustment device 30, a code scanning device 40, a material separation detection device 60, a classification and discharging device 90, a second detection mechanism 50, a third detection mechanism 70 and a fourth detection mechanism 80. The conveyor line group includes a first conveyor line 13 and a second conveyor line 14, which are used to convey wafers 12. The first conveyor line 13 and the second conveyor line 14 use double belts to convey the wafers 12, and the double belts are driven to rotate by a conveying motor. This is a mature technology at present and will not be described in detail. The first conveyor line 13 and the second conveyor line 14 are connected to the controller. The controller uses PLC. The carrier 11 is used to stack the wafers 12.

[0088] The loading and grabbing device 20 is located on the feeding end side of the first conveyor line 13, and is used to grab and position the carrier 11 on which the undetected wafers 12 are stacked. At the same time, the loading and grabbing device 20 also cooperates with the first conveyor line 13 to move the wafers 12 on the carrier 11 to the first conveyor line 13 for transportation in sequence.

[0089] The loading and grabbing device 20 includes a stacking rack 21, a first transport mechanism 22 and a second transport mechanism 23. The stacking rack 21 is provided with a plurality of stacking stations arranged in an array on a vertical plane, and each stacking station can limit the placement of a carrier 11, so that the placement position of the carrier 11 on the stacking rack 21 can be accurately located, which is convenient for the first transport mechanism 22 to grab. In addition, each stacking station is provided with a detection sensor for detecting whether a wafer 12 is stacked on the carrier 11. The detection sensor can be a photoelectric switch 211 and its matching induction sheet 212. After the carrier 11 is placed at the stacking station, its position is exactly between the photoelectric switch 211 and the induction sheet 212. If the light emitted by the photoelectric switch 211 is blocked by the wafer 12 and cannot reach the induction sheet 212, the connection between the photoelectric switch 211 and the induction sheet 212 is disconnected, which means that the carrier 11 is loaded with a wafer 12 and can be grabbed. The detection sensor is connected to the controller.

[0090] The first transport mechanism 22 includes a first three-axis mobile platform 221, a first rotating platform 222 and at least two sets of first clamping assemblies 223. The first three-axis mobile platform 221 drives the first rotating platform 222 to move, and the first rotating platform 222 drives the first clamping assembly 223 to rotate. The first clamping assembly 223 clamps one set of carriers 11 at a time.

[0091] The first three-axis mobile platform 221 includes a first X-axis mobile module 2211, a first Y-axis mobile module 2212 and a first Z-axis mobile module 2213. The first X-axis mobile module 2211, the first Y-axis mobile module 2212 and the first Z-axis mobile module 2213 all include a first motor, a mounting frame, a guide rail, a screw and a slider. The first motor and the guide rail are fixed on the mounting frame, the screw is rotatably connected to the mounting frame, and the screw and the guide rail are parallel to each other. The first motor is connected to the screw in a transmission manner. The slider is slidably connected to the guide rail, and the slider is threadedly connected to the screw. For a specific connection diagram, see Fig.24 The first motor is connected to the controller. The mounting frame of the first X-axis moving module 2211 is fixed on the slider of the first Z-axis moving module 2213, the mounting frame of the first Y-axis moving module 2212 is fixed on the slider of the first X-axis moving module 2211, and the first rotating platform 222 is fixed on the slider of the first Y-axis moving module 2212.

[0092] The first rotating platform 222 includes a base 2311, a rotating base 2312 and a second motor 2313. The rotating base 2312 is rotatably connected to the base 2311. The second motor 2313 is fixed to the base 2311, and the output shaft of the second motor 2313 is transmission-connected to the rotating base 2312. The second motor 2313 is connected to a controller. The first clamping assembly 223 is fixed to the rotating base 2312.

[0093] The number of the first clamping assemblies 223 is an even number, and the first clamping assemblies 223 are evenly distributed around the rotation axis of the first rotating table 222, or the first clamping assemblies 223 are equally divided into two groups and symmetrically arranged at both ends of the first rotating table 222. The first clamping assembly 223 includes a bidirectional cylinder 2231 and two clamping blocks 2232, and the two clamping blocks 2232 are respectively connected to the push rods on both sides of the bidirectional cylinder 2231, and the bidirectional cylinder 2231 drives the two clamping blocks 2232 to move relative to each other. The clamping blocks 2232 are adapted to the shape of the carrier 11 to facilitate clamping. The bidirectional cylinder 2231 is connected to the controller. In addition, an anti-drop baffle 2233 is provided on the clamping block 2232 to prevent the wafer 12 from falling, so as to avoid the wafer 12 from falling during transportation.

[0094] The second transport mechanism 23 includes a second rotating table 231, at least two first fixed seats 233 and at least two first lifting assemblies 232. The second rotating table 231 drives the first lifting assemblies 232 to rotate. The first lifting assemblies 232 correspond to the first fixed seats 233 one by one, and the first lifting assemblies 232 drive the first fixed seats 233 to move up and down. A carrier 11 can be placed on the first fixed seats 233. The structure of the second rotating table 231 is the same as that of the first rotating table 222, and will not be repeated. The number of first lifting assemblies 232 is equal to the number of first clamping assemblies 223, and the arrangement of the first lifting assemblies 232 relative to the second rotating table 231 is consistent with the arrangement of the first clamping assemblies 223 relative to the first rotating table 222. The structure of the first lifting assembly 232 is the same as that of the first X-axis moving module 2211, and will not be repeated. The first fixed seat 233 is fixed on the slider corresponding to the first lifting assembly 232.

[0095] The first transport mechanism 22 and the second transport mechanism 23 cooperate to shift the carrier 11 on the stacking station to the first fixed seat 233. Afterwards, the first conveyor line 13 cooperates with the first lifting assembly 232 to grab and shift the wafers 12 on the carrier 11 located on the first fixed seat 233 from bottom to top one by one to the first conveyor line 13. In order to enable the first conveyor line 13 to more stably move the wafer 12 from the carrier 11, a single belt group connected to a small section is also transmitted at the feeding end of the first conveyor line 13. The transmission surface of the single belt group is relatively wider to ensure that it has a larger contact area with the wafer 12. The friction between the wafer 12 and the single belt makes the wafer 12 move out of the carrier 11. A notch is provided on the carrier 11 to expose the wafer 12, so that the single belt group can effectively contact the wafer 12. Similarly, an avoidance groove for avoiding the single belt group is provided on the first fixed seat 233. Of course, the single belt group can be set up separately, and the single belt group can be regarded as a part of the feeding grabbing device 20, so that the feeding grabbing device 20 is completely independent.

[0096] When the wafer 12 is moved from the carrier 11 to the first conveyor line 13, the first transport mechanism 22 and the second transport mechanism 23 cooperate to replace the empty carrier 11 on the other fixed seat and put it back to the stacking rack 21, and then the first transport mechanism 22 grabs a carrier 11 stacked with wafers 12 for standby use, and so on. The empty carrier 11 on the stacking rack 21 is replaced manually or by a stacking robot. The empty carrier 11 can be returned to the warehouse or transported to the back end of the present invention for stacking the wafers 12 that have been inspected and classified.

[0097] The posture adjustment device 30 and the code scanning device 40 are sequentially arranged on the first conveying line 13 along the conveying direction of the first conveying line 13 .

[0098] The posture adjustment device 30 is used to adjust the posture of the wafer 12 so that the wafer 12 continues to be transferred in a uniform posture. The posture adjustment device 30 includes a first visual camera 31 and an adjustment mechanism, and the first visual camera 31 is connected to the controller. The adjustment mechanism includes a second three-axis mobile platform 321, a turntable 322 and a first vacuum suction cup 323. The second three-axis mobile platform 321 drives the turntable 322 to move, and the second three-axis mobile platform 321 includes a second X-axis mobile module 3211, a second Y-axis mobile module 3212 and a posture cylinder 3213. The structure of the second X-axis mobile module 3211 and the second Y-axis mobile module 3212 is the same as the first X-axis mobile module 2211, and will not be repeated. The mounting frame of the second Y-axis mobile module 3212 is fixed on the slider of the second X-axis mobile module 3211, the posture cylinder 3213 is fixed on the slider of the second Y-axis mobile module 3212, and the turntable 322 is fixed on the push rod of the posture cylinder 3213. The turntable 322 is directly an electric rotating table, which has a simple structure and can be directly purchased from the market. The turntable 322 is connected to a controller. The first vacuum suction cup 323 is fixed on a rotating seat 2312 corresponding to the turntable 322, and the turntable 322 drives the first vacuum suction cup 323 to rotate.

[0099] The first vacuum suction cup 323 is connected to an external vacuum device. By vacuuming to form a negative pressure, the first vacuum suction cup 323 can absorb and grasp the wafer 12 to prevent the wafer 12 from being thrown away during rotation. The first vacuum suction cup 323 is controlled by a solenoid valve, which is connected to a controller. Under normal conditions, the first vacuum suction cup 323 does not exceed the conveying surface setting of the first conveyor line 13. The first conveyor line 13 is designed as an independent segment in a section where the posture adjustment device 30 is set for easy control. The first conveyor line 13 pauses after conveying the wafer 12 to the top of the adjustment mechanism, and takes a photo of the wafer 12 through the first visual camera 31 set above the first conveyor line 13. At the same time, the first visual camera 31 compares the current posture of the wafer 12 with the set posture and gives an adjustment command. The adjustment command is fed back to the controller, and the controller forwards it to the adjustment mechanism. The adjustment structure acts according to the adjustment command to adjust the posture of the wafer 12 to the set posture. The first visual camera 31 is a CCD camera, and its photo comparison function is a mature technology at present, which will not be repeated.

[0100] After the posture of the wafer 12 is adjusted by the posture adjustment device 30 , it can be ensured that the wafer 12 is reliably transported on the first conveyor line 13 , and by preparing for subsequent code scanning, the laser engraved code on the wafer 12 is prevented from being blocked by the first conveyor line 13 .

[0101] The code scanning device 40 is used to read the laser engraved code on the wafer 12, and includes a second visual camera 41 and a first light source 42, both of which are connected to the controller. The first light source 42 illuminates the wafer 12 so that the second visual camera 41 can take a picture to read the laser engraved code. The second visual camera 41 is a CCD camera.

[0102] The second detection mechanism 50 is arranged at the gap between the discharge end of the first conveyor line 13 and the feed end of the material distribution detection device 60. The wafer 12 can pass through the gap completely as it is conveyed by the first conveyor line 13. The second detection mechanism 50 is used to detect the bottom appearance of the wafer 12. Of course, the second detection mechanism 50 can also be arranged at the gap between the feed end of the second conveyor line 14 and the discharge end of the material distribution detection device 60. Specifically, the second detection mechanism 50 includes a second detection camera 51 and a second light source 52, and the second detection camera 51 and the second light source 52 are both connected to the controller. The second detection camera 51 uses a CCD camera. The second light source 52 is used to illuminate the bottom surface of the wafer 12, and the second detection camera 51 detects the bottom appearance of the wafer 12. Generally speaking, the bottom appearance inspection item of the wafer 12 is to see whether there is a crack. Under the irradiation of the second light source 52, the crack will be very obvious, and rapid detection can be achieved, so the wafer 12 can be inspected without stopping.

[0103] The material distribution detection device 60, the third detection mechanism 70, and the fourth detection mechanism 80 are sequentially placed between the first conveyor line 13 and the second conveyor line 14 along the conveying direction of the wafer 12. The third detection mechanism 70 and the fourth detection mechanism 80 may be interchanged. The material distribution detection device 60 is provided with at least two detection stations. The material distribution detection device 60 distributes the wafer 12 conveyed by the first conveyor line 13 to each detection station for detection, and conveys the wafer 12 after detection to the second conveyor line 14. The following is an example of eight detection stations.

[0104] The material sorting and detection device 60 includes a first material sorting mechanism 61, two sets of second material sorting mechanisms 62, a third material sorting mechanism 63, eight sets of conveying mechanisms 64 and eight sets of first detection mechanisms 65. The first material sorting mechanism 61 is adjacent to the discharge end of the first conveyor line 13, and is used to sort and position the wafers 12 transported by the first conveyor line 13. The third material sorting mechanism 63 is adjacent to the feed end of the third detection mechanism 70. Two sets of second material sorting mechanisms 62 are arranged side by side and placed between the first material sorting mechanism 61 and the second material sorting mechanism 62, and both sets of second material sorting mechanisms 62 can cooperate with the first material sorting mechanism 61 and the third material sorting mechanism 63 to complete the transfer operation of the wafer 12. The third material sorting mechanism 63 is used to aggregate the wafers 12 on the second material sorting mechanism 62 and orderly transition them to the third detection mechanism 70.

[0105] The first material distribution mechanism 61 and the third material distribution mechanism 63 both include a second linear moving module 611 and two sets of first conveying components 612. The second linear moving module 611 drives the first conveying component 612 to move along a conveying direction perpendicular to the first conveyor line 13. The first conveying component 612 corresponds to the second material distribution mechanism 62 one by one. When one of the first conveying components 612 is adjacent to the first conveyor line 13, the other first conveying component 612 is adjacent to the second material distribution mechanism 62 near it. The second linear moving module 611 is the same as the first X-axis moving module 2211. The structure of the first conveying component 612 is similar to the first conveyor line 13, which will not be repeated. Among them, the first conveying component 612 of the first material distribution mechanism 61 is also provided with a positioning baffle 613, which is adapted to the periphery of the wafer 12, can block the transmission of the wafer 12, and position the wafer 12 so that it can be grabbed by the second material distribution mechanism 62. In addition, a baffle 631 is provided on the first conveying component 612 of the third material dividing mechanism 63. The baffle 631 can be movably arranged to facilitate adapting to wafers 12 of different specifications. The baffle 631 can prevent the wafer 12 from falling when it transitions from the second material dividing mechanism 62 to the third material dividing mechanism 63.

[0106] The second material distribution mechanism 62 includes a first linear motion module 621 and a transfer mechanism 622 for grabbing the wafer 12. The first linear motion module 621 is the same as the first X-axis motion module 2211 and will not be described in detail. The first linear motion module 621 drives the transfer mechanism 622 to move back and forth between the first material distribution mechanism 61 and the third material distribution mechanism 63.

[0107] The transfer mechanism 622 includes a rotary drive member 6221, a transfer cylinder 6222 and two groups of gripping members 6223. The rotary drive member 6221 can be a rotary cylinder or a motor. The rotary drive member 6221 drives the transfer cylinder 6222 to rotate, and the transfer cylinder 6222 drives the gripping member 6223 to move up and down. The rotary drive member 6221 and the transfer cylinder 6222 are connected to the controller. The gripping member 6223 includes a mounting plate 62231 and at least one suction cup 62232, and the suction cup 62232 is arranged on the upper surface of the mounting plate 62231. The suction cup 62232 of the gripping member 6223 can be a rubber suction cup 62232, which fits the bottom surface of the wafer 12, and the friction between the two is sufficient to ensure that the wafer 12 will not fall during the movement. Of course, the suction cup 62232 can also be a vacuum suction cup.

[0108] The eight sets of conveying mechanisms 64 are equally divided into two groups and correspond to one set of second material distribution mechanisms 62 respectively. The conveying mechanisms 64 are arranged beside the second material distribution mechanisms 62 and arranged at intervals along the conveying direction of the first conveying line 13. The conveying mechanism 64 includes a third linear motion module 641, a fourth linear motion module 642 and a placement table 643. The third linear motion module 641 drives the fourth linear motion module 642 to move along the conveying direction perpendicular to the first conveying line 13, and the fourth linear motion module 642 drives the placement table 643 to move along the conveying direction parallel to the first conveying line 13. The third linear motion module 641 and the fourth linear motion module 642 are the same as the first X-axis motion module 2211, and will not be repeated. The placement table 643 is used to position and place the wafer 12. The placement table 643 includes a pad 6431 and four support columns 6432. The support columns 6432 are plugged into the pad 6431. The tops of the support columns 6432 are provided with positioning grooves. The positioning grooves on the four support columns 6432 cooperate to form a positioning space adapted to the wafer 12. Multiple groups of sockets that cooperate with the support columns 6432 can be provided on the pad 6431, and different specifications of wafers 12 can be adapted by replacing different groups of sockets.

[0109] Eight sets of first detection mechanisms 65 are correspondingly arranged at eight detection stations, and the first detection mechanisms 65 correspond one-to-one to the conveying mechanisms 64. The first detection mechanisms 65 are used to detect surface defects of the wafer 12 including bubbles, stains, and pits. Specifically, the first detection mechanism 65 includes a mounting table 651 and three first detection cameras 652. The first detection cameras 652 are connected to the controller, and the first detection cameras 652 are CCD cameras. The three first detection cameras 652 are respectively used to detect bubbles, stains, and pits, and separate detection is used to improve detection efficiency. An adjustment component corresponding one-to-one to the first detection camera 652 is provided on the mounting table 651, and the adjustment component is used to adjust the horizontal position and height of the first detection camera 652. The adjustment assembly includes a stud 6531, a crank 6532, a sliding block 6533, two sliding columns 6534 and a plurality of angle adjustment platforms 6535. The sliding column 6534 is fixed on the mounting platform 651. The stud 6531 is rotatably connected to the mounting platform 651. The sliding block 6533 is slidably connected to the sliding column 6534, and the sliding block 6533 is threadedly connected to the stud 6531. The crank 6532 is fixedly connected to one end of the stud 6531. A scale line is also provided on the mounting platform 651, and an indicator line matching the scale line is provided on the sliding block 6533. The angle adjustment platforms 6535 are stacked and connected in sequence. The lowest angle adjustment platform 6535 is fixedly connected to the sliding block 6533, and the highest angle adjustment platform 6535 is connected to the first detection camera 652 through an extension plate 6536.

[0110] The first material sorting mechanism 61 , the second material sorting mechanism 62 and the conveying mechanism 64 cooperate to move the wafer 12 located on the first material sorting mechanism 61 to the inspection station for inspection, and the second material sorting mechanism 62 and the conveying mechanism 64 cooperate to move the wafer 12 located at the inspection station to the third inspection mechanism 70 .

[0111] The third detection mechanism 70 is used to detect whether the wafer 12 is missing an edge. Because not all wafers 12 need to be detected for missing an edge, the third detection mechanism 70 is set separately to facilitate its removal from this detector. At the same time, the third detection mechanism 70 is also required to have the ability to convey the wafer 12. Specifically, the third detection mechanism 70 includes a fifth conveying line 71, a first vertical cylinder 72, a second vertical cylinder 73, a stopper 74, a fourth rotating table 75, a second vacuum suction cup, three third detection cameras 76 and three sets of third light sources 77. The fifth conveying line 71, the first vertical cylinder 72, the second vertical cylinder 73, the fourth rotating table 75, the second vacuum suction cup, the third detection camera 76 and the third light source 77 are connected to the controller. The third detection camera 76 is a CCD camera.

[0112] The first vertical cylinder 72 drives the fourth rotating table 75 to move up and down, and the fourth rotating table 75 drives the second vacuum suction cup to rotate. The third rotating table 942 directly adopts an electric rotating table. The second vertical cylinder 73 drives the stopper 74 to move up and down. Under normal conditions, the second vacuum suction cup and the stopper 74 are placed below the conveying surface of the fifth conveying line 71. When the wafer 12 is transported to the top of the second vacuum suction cup, the stopper 74 rises to block the wafer 12, and at the same time, it can also play a role in positioning the wafer 12. Then the second vacuum suction cup extends and absorbs and grasps the wafer 12, and then the third rotating table 942 moves and makes the wafer 12 rotate one circle. When the wafer 12 starts to rotate, the third detection camera 76 and the third light source 77 work to detect the edge of the wafer 12. The third detection camera 76 and the third light source 77 correspond one to one, and the three third detection cameras 76 detect the upper edge, side edge and lower edge of the wafer 12 respectively.

[0113] The fourth detection mechanism 80 is used to detect the thickness of the wafer 12. Similarly, because not all wafers 12 need to detect the wall thickness, the fourth detection mechanism 80 is set separately. Specifically, the fourth detection mechanism 80 includes a frame 81, a sixth conveyor line 82, a fifth linear motion module 83, a shock absorbing platform 84, a detection probe group 85 and two third vertical cylinders 86. The sixth conveyor line 82, the fifth linear motion module 83, the detection probe group 85 and the third vertical cylinder 86 are connected to the controller.

[0114] The detection probe group 85 is fixed on the frame 81. The detection probe group 85 includes a plurality of detection probes, and the detection probes are staggered. The detection probe group 85 is used to detect the thickness of the wafer 12. The fifth linear motion module 83 is set on the frame 81. The fifth linear motion module 83 is the same as the first X-axis motion module 2211, and will not be repeated. The fifth linear motion module 83 drives the shock absorbing platform 84 to move along the conveying direction of the sixth conveyor line 82 and pass through the detection probe group 85. The third vertical cylinder 86 is fixed on the frame 81 and drives the sixth conveyor line 82 to move up and down. The third vertical cylinder 86 extends out, so that the wafer 12 from the third detection mechanism 70 can be transported to the sixth conveyor line 82. At this time, the conveying surface of the sixth conveyor line 82 is higher than the shock-absorbing platform 84. When the wafer 12 continues to be transported and reaches above the shock-absorbing platform 84, the third vertical cylinder 86 contracts, and the wafer 12 falls into the shock-absorbing platform 84. At this time, the conveying surface of the sixth conveyor line 82 is lower than the shock-absorbing platform 84. The shock-absorbing platform 84 is provided with an avoidance groove for avoiding the sixth conveyor line 82. Afterwards, the fifth linear motion module 83 drives the shock-absorbing platform 84 to move, so that the wafer 12 placed thereon slowly passes through the detection probe group 85. After all the wafers 12 pass through the detection probe group 85, the third vertical cylinder 86 extends again, and the sixth conveyor line 82 lifts the wafer 12 from the shock-absorbing platform 84 and continues to transport it to the second conveyor line 14.

[0115] The classification unloading device 90 is arranged on the second conveyor line 14, and is used to classify and stack the wafers 12 on the second conveyor line 14. The classification unloading device 90 includes a plurality of unloading mechanisms 91, a plurality of lifting mechanisms 92, a plurality of lifting mechanisms 93, two sets of third handling mechanisms 94, two third conveyor lines 95 and a plurality of fourth conveyor lines 96. The unloading mechanism 91 is arranged on one side or both sides of the second conveyor line 14, and is arranged in sequence along the conveying direction of the second conveyor line 14. The lifting mechanism 92 is arranged on the second conveyor line 14, and is arranged in sequence along the conveying direction of the second conveyor line 14. Each lifting mechanism 92 corresponds to one or two sets of unloading mechanisms 91, and the lifting mechanism 92 moves the wafers 12 of the corresponding classification from the second conveyor line 14 to the unloading mechanism 91 according to the classification requirements. Generally, one set of unloading mechanisms 91 corresponds to one type of wafer 12, and multiple sets of unloading mechanisms 91 may correspond to one type.

[0116] The unloading mechanism 91 includes an unloading cylinder 911 and a second conveying assembly 912. The unloading cylinder 911 drives the second conveying assembly 912 to move up and down, and the conveying direction of the second transmission assembly is perpendicular to the conveying direction of the second conveyor line 14. The unloading cylinder 911 and the second conveying assembly 912 are connected to the controller, and the second conveying assembly 912 is the same as the first conveyor line 13, which will not be described in detail. The purpose of setting the unloading cylinder 911 is to prevent the second transmission assembly from blocking the conveying of the wafer 12 on the second conveyor line 14.

[0117] The lifting mechanism 92 includes a lifting cylinder, a third conveying assembly 922, a material blocking cylinder 923 and a material blocking plate 924, and the lifting cylinder, the third conveying assembly 922 and the material blocking cylinder 923 are connected to the controller. The third conveying assembly 922 is the same as the first conveying line 13, and will not be repeated. The lifting cylinder drives the third conveying assembly 922 to move up and down. When the lifting cylinder is extended, the third conveying assembly 922 can be adjacent to the second conveying assembly 912. The third material blocking cylinder 923 drives the material blocking plate 924 to move up and down. Under normal circumstances, the third conveying assembly 922 and the material blocking plate 924 do not exceed the conveying surface of the second conveying line 14. When the lifting mechanism 92 needs to move, the material blocking plate 924 is extended first, and after blocking the wafer 12, the third conveying assembly 922 rises and transports the wafer 12 to the designated unloading mechanism 91. The baffle plate 924 is provided with an arc surface 9241 that matches the outer edge of the wafer 12 , and cooperates with the second conveyor line 14 to adjust the position of the wafer 12 .

[0118] The lifting mechanism 93 corresponds to the unloading mechanism 91 one by one. The lifting mechanism 93 is used to position and place the carrier 11 and drive the carrier 11 to move up and down. The lifting mechanism 93 cooperates with the unloading mechanism 91 to put the wafer 12 on the unloading mechanism 91 into the carrier 11. The lifting mechanism 93 includes a second lifting component 931 and a second fixed seat 932. The second lifting component 931 drives the second fixed seat 932 to move up and down. The second fixed seat 932 is used to limit the placement of the carrier 11. The second lifting component 931 is connected to the controller, and the second lifting component 931 is the same as the first X-axis moving module 2211, including a first motor 9311, a mounting frame 9312, a guide rail 9313, a screw 9314 and a slider 9315. The first motor 9311 and the guide rail 9313 are fixed on the mounting frame 9312, the screw 9314 is rotatably connected to the mounting frame 9312, and the screw 9314 and the guide rail 9313 are parallel to each other. The first motor 9311 is connected to the screw rod 9314 in a transmission manner. The slider 9315 is connected to the guide rail 9313 in a sliding manner, and the slider 9315 is connected to the screw rod 9314 in a threaded manner. Fig.24 The cooperation principle between the second lifting assembly 931 and the third conveying assembly 922 is similar to the cooperation principle between the first lifting assembly 232 and the first conveying line 13 .

[0119] The third conveyor line 95 is used to convey empty carriers 11. Empty carriers 11 on the stacking rack 21 can be placed on the third conveyor line 95. The fourth conveyor line 96 is used to convey sorted carriers 11. The third conveyor line 95 and the fourth conveyor line 96 are connected to the controller.

[0120] The third transport mechanism 94 is used to transport the carrier 11 on the third conveyor line 95 to the lifting mechanism 93, and transport the fully loaded carrier 11 on the lifting mechanism 93 to the designated fourth conveyor line 96. The third transport mechanism 94 includes a third three-axis mobile platform 941, a third rotating platform 942 and two sets of second clamping components 943. The third three-axis mobile platform 941 includes a third X-axis mobile module 9411, a third Y-axis mobile module 9412 and a third Z-axis mobile module 9413. The structures of the third X-axis mobile module 9411, the third Y-axis mobile module 9412 and the third Z-axis mobile module 9413 are uniform and the same as the first X-axis mobile module 2211, and are all connected to the controller. The third X-axis moving module 9411 drives the third Y-axis moving module 9412 to move, the third Y-axis moving module 9412 drives the third Z-axis moving module 9413 to move, the third Z-axis moving module 9413 drives the third rotating table 942 to move, the third rotating table 942 directly uses a rotating cylinder, and the third rotating table 942 is connected to the controller. The second clamping assembly 943 is similar to the first clamping assembly 223 and will not be repeated. In addition, in order to prevent the wafer 12 from being thrown out and falling during transportation, at least one material blocking column 9421 cooperating with the second clamping assembly 943 is also provided on the third rotating table 942.

[0121] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by any technician familiar with the technical field within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention.

Claims

1. A wafer surface defect detector, characterized in that: include: A conveyor line group, used for conveying wafers, comprising a first conveyor line and a second conveyor line arranged in sequence; A number of carriers for stacking wafers; A loading and grabbing device is located at the feeding end of the first conveyor line, and is used to grab and position the carrier on which the undetected wafers are stacked; the loading and grabbing device cooperates with the first conveyor line to sequentially move the wafers on the carrier to the first conveyor line, or the loading and grabbing device directly grabs and moves the wafers on the carrier to the first conveyor line in sequence; A posture adjustment device is placed on the first conveying line and is used to adjust the posture of the wafer so that the wafer continues to be conveyed in a uniform posture; A code scanning device, placed on the first conveyor line, for reading the laser-engraved code on the wafer; A material distribution detection device is placed between the first conveyor line and the second conveyor line. The material distribution detection device is provided with at least two detection stations. The material distribution detection device distributes the wafers conveyed by the first conveyor line to each detection station for detection, and conveys the wafers after detection to the second conveyor line; The material distribution and detection device includes: a first material distribution mechanism, which is adjacent to the discharge end of the first conveyor line and is used to sort and position the wafers conveyed by the first conveyor line; at least one second material distribution mechanism, which is placed between the first material distribution mechanism and the second conveyor line; the second material distribution mechanism includes at least one first linear moving module and at least one transfer mechanism for grabbing wafers, and the first linear moving module drives the transfer mechanism to move back and forth between the first material distribution mechanism and the second conveyor line; at least two conveying mechanisms, and each of the second material distribution mechanisms corresponds to at least two conveying mechanisms; the conveying mechanisms are arranged beside the second material distribution mechanism and arranged at intervals along the conveying direction of the first conveyor line; at least two first detection mechanisms, which are placed at the detection station and correspond to the transmission mechanisms one by one, and the first detection mechanism is used to detect wafer surface defects including bubbles, stains, and pits; the first material distribution mechanism, the second material distribution mechanism and the conveying mechanism cooperate to move the wafer located on the first material distribution mechanism to the detection station for detection, and the second material distribution mechanism and the conveying mechanism cooperate to move the wafer located at the detection station to the second conveyor line; A sorting and discharging device is placed on the second conveying line and is used to sort and stack the wafers on the second conveying line; The controller is connected to the first conveying line, the second conveying line, the loading and grabbing device, the posture adjustment device, the code scanning device, the material separation detection device and the classification and discharging device.

2. The wafer surface defect detector according to claim 1, characterized in that: The feeding and grabbing device comprises: A stacking rack, wherein a plurality of stacking stations are arranged in an array on the stacking rack, and each of the stacking stations can limit the placement of at least one carrier; The first transport mechanism comprises a first three-axis mobile platform, a first rotating platform and at least two sets of first clamping assemblies, wherein the first three-axis mobile platform drives the first rotating platform to move, the first rotating platform drives the first clamping assembly to rotate, and the first clamping assembly can clamp at least one set of carriers; The second transport mechanism comprises a second rotating platform, at least two first fixed seats and at least two first lifting assemblies, wherein the second rotating platform drives the first lifting assemblies to rotate; the first lifting assemblies correspond to the first fixed seats one by one, and the first lifting assemblies drive the first fixed seats to move up and down, and at least one bearing member can be placed on the first fixed seats in a limited position; the first transport mechanism and the second transport mechanism cooperate to shift the bearing member on the stacking station to the first fixed seats; The first conveying line cooperates with the first lifting assembly to grab the wafer on the carrier of the first fixing seat and move it to the first conveying line.

3. The wafer surface defect detector according to claim 2, characterized in that: The stacking station is provided with a detection sensor for detecting whether wafers are stacked on the carrier.

4. The wafer surface defect detector according to claim 1, characterized in that: The posture adjustment device comprises: A first visual camera is placed above the first conveyor line and is used to compare the current posture of the wafer with the set posture and give an adjustment command; The adjustment mechanism includes a second three-axis mobile platform, a turntable and at least one first vacuum suction cup, wherein the second three-axis mobile platform drives the turntable to move, the turntable drives the first vacuum suction cup to rotate, and the first vacuum suction cup is connected to an external vacuum device; under normal conditions, the first vacuum suction cup does not exceed the conveying surface setting of the first conveyor line; the adjustment mechanism acts according to the adjustment command to adjust the position and posture of the wafer to the set posture.

5. The wafer surface defect detector according to claim 1, characterized in that: The code scanning device includes a second visual camera and a first light source.

6. The wafer surface defect detector according to claim 1, characterized in that: It also includes a third material dividing mechanism, which is placed between the second material dividing mechanism and the second conveying line. The second material dividing mechanism and the third material dividing mechanism cooperate to move the wafer on the second material dividing mechanism to the second conveying line.

7. The wafer surface defect detector according to claim 6, characterized in that: The first material dividing mechanism and the third material dividing mechanism both include a second linear moving module and at least one first conveying component. The second linear moving module drives the first conveying component to move along a conveying direction perpendicular to the first conveying line. The first conveying component corresponds one-to-one to the second material dividing mechanism.

8. The wafer surface defect detector according to claim 1, characterized in that: The transfer mechanism includes a rotary drive member, a transfer cylinder and at least one grabbing member, wherein the rotary drive member drives the transfer cylinder to rotate, and the transfer cylinder drives the grabbing member to move up and down; the grabbing member includes a mounting plate and at least one suction cup, and the suction cup is arranged on the upper surface of the mounting plate; The conveying mechanism includes a third linear moving module, a fourth linear moving module and a placement table; the third linear moving module drives the fourth linear moving module to move along a conveying direction perpendicular to the first conveying line, and the fourth linear moving module drives the placement table to move along a conveying direction parallel to the first conveying line; the placement table is used to position and place the wafer.

9. The wafer surface defect detector according to claim 1, characterized in that: The first detection mechanism includes a mounting platform and at least one first detection camera. The mounting platform is provided with adjustment components corresponding to the first detection cameras one by one, and the adjustment components are used to adjust the horizontal position and height of the first detection camera.

10. The wafer surface defect detector according to claim 1, characterized in that: The classification discharging device comprises: A plurality of unloading mechanisms are arranged on one side or both sides of the second conveying line and arranged in sequence along the conveying direction of the second conveying line; A plurality of lifting mechanisms are arranged on the second conveying line and arranged in sequence along the conveying direction of the second conveying line; each of the lifting mechanisms corresponds to at least one set of unloading mechanisms, and the lifting mechanisms move the wafers on the second conveying line to the unloading mechanisms; A plurality of lifting mechanisms, corresponding to the unloading mechanisms one by one, the lifting mechanisms are used to position and place the carrier and drive the carrier to move up and down, and the lifting mechanisms cooperate with the unloading mechanisms to stack the wafers on the unloading mechanisms into the carrier; At least one third transport mechanism is used to transport the empty carrier to the lifting mechanism, and to transport the fully loaded carrier on the lifting mechanism to a designated position.

11. The wafer surface defect detector according to claim 10, characterized in that: The unloading mechanism comprises an unloading cylinder and a second conveying assembly, wherein the unloading cylinder drives the second conveying assembly to move up and down, and the conveying direction of the second conveying assembly is perpendicular to the conveying direction of the second conveying line; The lifting mechanism includes a lifting cylinder, a third conveying assembly, a material blocking cylinder and a material blocking plate. The lifting cylinder drives the third conveying assembly to move up and down, and the third conveying assembly can be adjacent to the second conveying assembly; the material blocking cylinder drives the material blocking plate to move up and down; under normal conditions, the third conveying assembly and the material blocking plate do not exceed the conveying surface of the second conveying line; The lifting mechanism comprises a second lifting assembly and a second fixed seat, the second lifting assembly drives the second fixed seat to move up and down, and the second fixed seat is used to limit the position of the bearing member; The third transport mechanism includes a third three-axis mobile platform, a third rotating table and at least one set of second clamping components. The third three-axis mobile platform drives the third rotating table to move, and the third rotating table drives the second clamping components to rotate. The second clamping components are used to clamp the carrier.

12. The wafer surface defect detector according to claim 10, characterized in that: It also includes at least one third conveying line for conveying empty carriers, and a plurality of fourth conveying lines for conveying sorted carriers.

13. The wafer surface defect detector according to claim 1, characterized in that: It also includes a second detection mechanism connected to the controller, the second detection mechanism is arranged at the discharge end of the first conveyor line or the feed end of the second conveyor line; the second detection mechanism includes a second detection camera and a second light source, and the second detection camera is used to detect the bottom surface appearance of the wafer.

14. The wafer surface defect detector according to claim 1, characterized in that: It also includes a third detection mechanism connected to the controller, and the third detection mechanism is arranged between the first conveying line and the material distribution detection device or between the material distribution detection device and the second conveying line; The third detection mechanism includes a fifth conveyor line, a first vertical cylinder, a second vertical cylinder, a block, a fourth rotating table, at least one second vacuum suction cup, at least one third detection camera and at least one third light source; the first vertical cylinder drives the fourth rotating table to move up and down, and the fourth rotating table drives the second vacuum suction cup to rotate; the second vertical cylinder drives the block to move up and down, and under normal circumstances, the second vacuum suction cup and the block are placed below the conveying surface of the fifth conveyor line; the third detection camera and the third light source correspond one to one, and the third detection camera is used to detect whether the wafer is missing edges.

15. The wafer surface defect detector according to claim 1, characterized in that: It also includes a fourth detection mechanism connected to the controller, and the fourth detection mechanism is arranged between the first conveying line and the material distribution detection device or between the material distribution detection device and the second conveying line; The fourth detection mechanism includes a frame, a sixth conveyor line, a fifth linear motion module, a shock absorbing platform, a detection probe group and at least one third vertical cylinder; the detection probe group is fixed on the frame, the detection probe group includes a plurality of detection probes, and the detection probes are staggered, and the detection probe group is used to detect the thickness of the wafer; the fifth linear motion module is arranged on the frame, and the fifth linear motion module drives the shock absorbing platform to move along the transmission direction of the sixth conveyor line and pass through the detection probe group; the third vertical cylinder is fixed on the frame and drives the sixth conveyor line to move up and down, the third vertical cylinder, the sixth conveyor line and the shock absorbing platform cooperate to move the wafers on the sixth conveyor line to the shock absorbing platform, and after all the wafers pass through the detection probe group, the wafers on the shock absorbing platform are moved to the sixth conveyor line.

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