Laser conductive microvia manufacturing method of PCB board and PCB board

Abstract

The present invention provides a method for fabricating laser-conductive microvias on a PCB board and the PCB board. The method comprises: performing a copper coating operation on the PCB board to obtain a processed board, wherein the processed board includes a first processed surface and a second processed surface; positioning the PCB board on the first processed surface to obtain a first positioning hole; drilling a hole on the first processed surface to two-thirds of the thickness of the processed board according to the first positioning hole to obtain a first laser hole; positioning the PCB board on the second processed surface according to the first laser hole to determine a second positioning hole, wherein the second positioning hole and the first positioning hole are arranged symmetrically about the horizontal axis of the processed board; drilling a hole on the second processed surface to two-thirds of the thickness of the processed board according to the second positioning hole to obtain a second laser hole; and machining the target microvia based on the first laser hole and the second laser hole. In an embodiment of the present invention, the problem that mechanical drilling cannot produce microvias that meet the requirements can be solved, thereby saving costs while producing microvias.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and in particular to a method for manufacturing laser-connected microvias of a PCB board and the PCB board. Background Art

[0002] As electronic products continue to develop towards miniaturization and high speed, higher requirements are placed on the production of PCB circuit boards. As electronic products continue to shrink in size and improve in performance, in order to meet the high density, high precision, micro-pore size, fine pitch and high reliability of electronic products, more and more manufacturers are setting micro-through holes on PCB circuit boards (Printed Circuit Boards) to meet the performance requirements of these electronic products. Currently, the existing technology for through-hole production in the PCB circuit board industry uses mechanical drilling to meet the product through-hole requirements. However, mechanical drilling can only meet the requirements for through-holes with a diameter greater than 0.15mm. When making through-holes with a diameter less than 0.15mm, the drill needle diameter is too small during mechanical production, resulting in serious problems such as needle breakage during production. Therefore, existing mechanical drilling cannot meet the development demand for through-holes less than 0.15mm in PCB circuit boards. When using precision instruments for drilling, it will increase costs. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art and provides a method for producing laser-conducted microvias in a PCB board and a PCB board, which can solve the problem that microvias cannot be produced by mechanical drilling, and save costs while producing microvias.

[0004] In a first aspect, the present invention provides a method for fabricating laser-conducted microvias on a PCB, comprising: performing a copper cladding operation on the PCB to obtain a processed plate, wherein the processed plate includes a first processed surface and a second processed surface, the first processed surface and the second processed surface being symmetrically arranged with respect to the horizontal axis of the processed plate;

[0005] Positioning from the first processing surface to obtain a first positioning hole;

[0006] Punching a hole on the first processing surface to two-thirds of the thickness of the processing plate according to the first positioning hole to obtain a first laser hole;

[0007] Positioning the first laser hole on the second processing surface to determine a second positioning hole, wherein the second positioning hole and the first positioning hole are arranged on the processing plate in a symmetrical manner along the horizontal axis;

[0008] Punching a hole on the second processing surface to two-thirds of the thickness of the processing plate according to the second positioning hole to obtain a second laser hole;

[0009] The target microhole is obtained by processing the first laser hole and the second laser hole.

[0010] The above-mentioned laser conductive micro-hole production method of the PCB board has at least the following beneficial effects: first, the PCB board is copper-clad to obtain a processing board including a first processing surface and a second processing surface, and positioning is performed from the first processing surface to obtain a first positioning hole, and then a hole is punched on the first processing surface according to the position of the first positioning hole, wherein the punching depth is two-thirds of the thickness of the processing board, thereby obtaining a first laser hole, avoiding the problem of not being able to form a through hole due to the drilling depth being too shallow, and then positioning is performed on the second processing surface according to the first laser hole to determine the second positioning hole, so that the first positioning hole and the second positioning hole can be symmetrically arranged on the upper and lower sides of the processing board, which is convenient for forming microholes, and the second positioning hole is punched on the second processing surface to two-thirds of the thickness of the processing board to obtain a second laser hole, and finally the target microhole is obtained by processing according to the first laser hole and the second laser hole, thereby realizing the production of microholes and reducing production costs.

[0011] According to some embodiments of the present invention, performing a copper cladding operation on a PCB to obtain a processed board includes:

[0012] Copper-cladding operations are performed on both sides of the PCB to obtain a first copper-clad surface and a second copper-clad surface;

[0013] performing a browning operation on the first copper-clad surface to obtain the first processed surface;

[0014] The second copper-clad surface is subjected to a browning operation to obtain the second processed surface, thereby enhancing the bonding strength between the processed board and the first processed surface and the second processed surface, and avoiding problems such as delamination and cracking of the board.

[0015] According to some embodiments of the present invention, the thickness of the PCB board is less than or equal to 0.2 mm, and the thickness of the first processing surface and the second processing surface is 7-8 microns, which facilitates subsequent conduction of the first laser hole and the second laser hole.

[0016] According to some embodiments of the present invention, after obtaining the target microhole by processing the first laser hole and the second laser hole, the method further includes:

[0017] The target micropores are electroplated and filled with copper to obtain target conductive micropores, thereby improving the conductivity of the target conductive micropores and preventing local carburization.

[0018] According to some embodiments of the present invention, the target microvia is electroplated and filled with copper to obtain a target conductive microvia, including:

[0019] Performing a copper deposition operation on the target microvia to obtain a copper deposition hole;

[0020] Performing electroplating bridge operation on the copper-plated hole, and copper plating on the copper-plated hole after the electroplating bridge operation to obtain a first blind hole and a second blind hole;

[0021] The first blind hole and the second blind hole are processed to obtain the target conductive microvia, thereby enhancing the conductivity of the target conductive microvia.

[0022] According to some embodiments of the present invention, processing the first blind hole and the second blind hole to obtain the target conductive microvia includes:

[0023] Performing a copper filling operation on the first blind hole;

[0024] Performing a copper filling operation on the second blind hole;

[0025] The target conductive microvia is generated according to the first blind via and the second blind via after copper filling.

[0026] According to some embodiments of the present invention, the target microhole and the target conductive microhole both have apertures smaller than or equal to 0.15 mm, thereby improving the precision of microhole fabrication.

[0027] According to some embodiments of the present invention, the wall thickness of the first blind hole and the second blind hole is 3-4 microns, which improves the accuracy of microhole production and facilitates the production of microholes with smaller apertures.

[0028] According to some embodiments of the present invention, the wall thickness of the copper-plated hole is 1-2 microns, which improves the accuracy of micro-hole production and facilitates the production of micro-holes with smaller apertures.

[0029] In a second aspect, an embodiment of the present invention provides a PCB board, comprising conductive microvias obtained by the laser conductive microvia fabrication method for the PCB board as described above.

[0030] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained through the structures particularly pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the technical solution of the present invention and do not constitute a limitation to the technical solution of the present invention.

[0032] Figure 1 This is a flow chart of a method for fabricating laser-connected microvias on a PCB board according to one embodiment of the present invention;

[0033] Figure 2 yes Figure 1 A specific method flow chart of step S100;

[0034] Figure 3 This is a flow chart of a method for fabricating laser-connected microvias on a PCB board according to another embodiment of the present invention;

[0035] Figure 4 yes Figure 3 A specific method flow chart of step S900;

[0036] Figure 5 This is a schematic diagram of fabricating a conductive microvia provided by a specific example of the present invention;

[0037] Figure 6 It is a schematic diagram of a conductive microhole provided by a specific example of the present invention. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0039] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0040] In the description of the present invention, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0041] In the description of the present invention, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0042] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0043] The embodiments of the present invention are further described below with reference to the accompanying drawings.

[0044] refer to Figure 1 , Figure 1 This is a flow chart of a method for fabricating laser-connected microvias on a PCB board provided by one embodiment of the present invention. The method can be applied to a circuit board and includes but is not limited to step S100 and step S600.

[0045] Step S100: performing copper cladding operation on the PCB board to obtain a processed board;

[0046] It should be noted that the processing board includes a first processing surface and a second processing surface, and the first processing surface and the second processing surface are symmetrically arranged with the processing board as the horizontal axis, wherein the copper cladding operation is to perform a double-sided copper pressing operation on the PCB board to obtain the processing board.

[0047] Step S200: Positioning from the first processing surface to obtain a first positioning hole;

[0048] Step S300: drilling a first positioning hole on the first processing surface to two-thirds of the thickness of the processing plate to obtain a first laser hole;

[0049] Step S400: Positioning the second positioning hole on the second processing surface according to the first laser hole to determine the second positioning hole;

[0050] It should be noted that the second positioning hole and the first positioning hole are arranged on the processing plate in a symmetrical manner along the horizontal axis;

[0051] Step S500: drilling a second positioning hole on the second processing surface to two-thirds of the thickness of the processing plate to obtain a second laser hole;

[0052] Step S600: obtaining target micro-holes by processing the first laser hole and the second laser hole.

[0053] In one embodiment of the present invention, a copper cladding operation is first performed on a PCB board to obtain a processing board including a first processing surface and a second processing surface, and positioning is performed from the first processing surface to obtain a first positioning hole, and then a hole is punched on the first processing surface according to the position of the first positioning hole, wherein the punching depth is two-thirds of the thickness of the processing board, thereby obtaining a first laser hole, thereby avoiding the problem of not being able to form a through hole due to the punching depth being too shallow, and then positioning is performed on the second processing surface according to the first laser hole to determine the second positioning hole, so that the first positioning hole and the second positioning hole can be symmetrically arranged on the upper and lower sides of the processing board to facilitate the formation of microholes, and the second positioning hole is punched on the second processing surface to two-thirds of the thickness of the processing board to obtain a second laser hole, and finally the target microhole is obtained by processing according to the first laser hole and the second laser hole, thereby realizing the production of the microhole and reducing the production cost.

[0054] It should be noted that the first laser hole and the second laser hole are V-shaped holes, and the directions of the first laser hole and the second laser hole are opposite. The opening direction of the first laser hole is toward the first processing surface, and the opening direction of the second laser hole is toward the second processing surface, which facilitates the conduction of the microhole. Therefore, the target microhole finally obtained is an X-shaped microhole.

[0055] It can be understood that the positioning on the first processing surface and the second processing surface can be performed by machine positioning or manual positioning, etc., and this embodiment does not impose any specific limitation.

[0056] refer to Figure 2 , Figure 2 yes Figure 1 A specific method flow chart of step S100 is a further explanation of step S100, and step S100 includes but is not limited to steps S110 to S130.

[0057] Step S110: performing copper cladding operations on both sides of the PCB board to obtain a first copper clad surface and a second copper clad surface;

[0058] Step S120: performing a browning operation on the first copper-clad surface to obtain a first processed surface;

[0059] Step S130: performing a browning operation on the second copper-clad surface to obtain a second processed surface.

[0060] In one embodiment of the present invention, copper cladding operations are performed on both sides of the PCB board to obtain a first copper clad surface and a second copper clad surface, and browning operations are performed on the first copper clad surface and the second copper clad surface to obtain a first processing surface and a second processing surface, thereby enhancing the bonding strength between the processing board and the first processing surface and the second processing surface, and avoiding problems such as delamination and explosion of the board.

[0061] In one embodiment of the present invention, the thickness of the PCB board is less than or equal to 0.2 mm, and the thickness of the first processing surface and the second processing surface is 7-8 μm, which facilitates the subsequent connection between the first laser hole and the second laser hole and avoids microvia connection failure due to the excessive thickness of the PCB board.

[0062] In one embodiment of the present invention, after the target microholes are obtained by processing the first laser hole and the second laser hole, the process further includes: electroplating and filling the target microholes with copper to obtain target conductive microholes, thereby improving the conductivity of the target conductive microholes and preventing local carburization.

[0063] It should be noted that before the target micro-holes are electroplated and filled with copper, the processing board needs to be cleaned to remove the brown film on the surface of the first laser hole and the second laser hole.

[0064] refer to Figure 3 , Figure 3This is a flow chart of a method for fabricating laser-connected microvias on a PCB board provided by another embodiment of the present invention. The method for fabricating laser-connected microvias includes but is not limited to step S700 and step S900.

[0065] Step S700: performing copper deposition operation on the target microvia to obtain a copper deposition hole;

[0066] Step S800: performing electroplating bridge operation on the copper vias, and copper plating the copper vias after electroplating bridge operation to obtain a first blind via and a second blind via;

[0067] Step S900: Processing the first blind hole and the second blind hole to obtain target conductive microvias.

[0068] In one embodiment of the present invention, chemical copper plating is performed on the target microvia to obtain a copper-plated hole, and the copper-plated hole is subjected to an electroplating bridge operation to obtain a first blind hole and a second blind hole. Thereafter, the first blind hole and the second blind hole are processed to obtain a target conductive microvia, thereby enhancing the conductivity of the target conductive microvia.

[0069] It is understandable that the electroplating bridging operation is completed by the electroplating cylinder, which first performs intermediate electroplating bridging on the target microhole and then performs copper plating to obtain the first blind hole and the second blind hole, wherein the first blind hole and the second blind hole are both U-shaped holes.

[0070] refer to Figure 4 , Figure 4 yes Figure 3 A specific method flow chart of step S900 is a further explanation of step S900, and step S900 includes but is not limited to steps S910 to S930.

[0071] Step S910: performing a copper filling operation on the first blind via;

[0072] Step S920: performing copper filling operation on the second blind via;

[0073] Step S930: generating target conductive microvias according to the first blind via and the second blind via after copper filling.

[0074] In one embodiment of the present invention, copper filling operations are performed on the first blind via and the second blind via respectively, thereby forming target conductive microvias and enhancing the conductivity of the target conductive microvias.

[0075] It should be noted that the copper filling operation is performed on the first blind hole and the second blind hole until the copper filling surfaces of the first blind hole and the second blind hole are flush with the first processing surface and the second processing surface, thereby completing the copper filling operation, wherein the copper filling operation is completed by an electroplating copper filling cylinder.

[0076] In one embodiment of the present invention, the diameters of the target microholes and the target conductive microholes are both less than or equal to 0.15 mm, thereby improving the precision of microhole fabrication.

[0077] It is understandable that existing mechanical drilling cannot meet the development demand of through holes less than 0.15 mm in PCB circuit boards. The present invention can produce conductive microholes with a hole diameter less than or equal to 0.15 mm through mechanical drilling, thereby improving the fineness of microhole production.

[0078] In one embodiment of the present invention, the wall thickness of the first blind hole and the second blind hole is 3-4 microns, which improves the accuracy of micropore production, thereby facilitating the production of micropores with smaller apertures and avoiding the micropores having an excessively large aperture due to excessive wall thickness.

[0079] In one embodiment of the present invention, the wall thickness of the copper-plated hole is 1-2 microns to avoid the micro-hole diameter being too large due to the excessive thickness of the hole wall.

[0080] Furthermore, based on the above embodiments, another embodiment of the present invention provides a PCB board, wherein the PCB board includes conductive microvias obtained by the laser conductive microvia manufacturing method of the PCB board in any of the above embodiments.

[0081] Therefore, the PCB board has the beneficial effects brought about by the laser conductive micro-via manufacturing method of the PCB board in any of the above embodiments.

[0082] In one embodiment, in order to more clearly illustrate the manufacturing process of the laser conductive micro-via manufacturing method of the PCB board, a specific example is given below for illustration.

[0083] Example 1:

[0084] Reference Figure 5-6 , Figure 5 This is a schematic diagram of fabricating a conductive microvia provided by a specific example of the present invention;

[0085] Figure 6 is a schematic diagram of a conductive microvia provided by a specific example of the present invention;

[0086] Reference Figure 5First, the PCB board is copper-clad to obtain a processing board 100 including a first processing surface 200 and a second processing surface 300. Before processing the first processing surface 200 and the second processing surface 300, the processing board 100 is subjected to copper reduction processing. Then, the first processing surface 200 is positioned in the X-axis direction and the Y-axis direction to obtain a first positioning hole. Then, according to the position of the first positioning hole, a hole is punched on the first processing surface 200. The depth of the punching is two-thirds of the thickness of the processing board 100, thereby obtaining a first laser hole 400 to avoid The problem of not being able to form a through hole due to the drilling depth being too shallow occurs. Then, the first laser hole 400 is positioned on the second processing surface 300 to determine the second positioning hole, so that the first positioning hole and the second positioning hole can be symmetrically arranged on the upper and lower sides of the processing plate 100, which is convenient for forming microholes. The second positioning hole is punched on the second processing surface 300 to two-thirds of the thickness of the processing plate 100 to obtain a second laser hole 500. Finally, the target microhole is obtained by processing the first laser hole and the second laser hole, thereby realizing the production of microholes and reducing production costs.

[0087] refer to Figure 6 After obtaining the target conductive microvia, the processing plate 100 is cleaned to remove the brown film on the surface of the first laser hole 400 and the second laser hole 500, and then the target microvia is electroplated and filled with copper to obtain the target conductive microvia, thereby completing the process of laser conductive microvia production.

[0088] By using the laser conductive micro-hole production method of the PCB board according to the embodiment of the present invention, conductive micro-holes with an aperture of less than 0.15 mm can be obtained, so that they can be applied to more electronic devices, reducing the size of the electronic devices and making the electronic devices develop in the direction of being lighter, more integrated and more precise.

[0089] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0090] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

[0091] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the spirit of the present invention.

Claims

1. A method for producing laser-conducted microvias on a PCB, characterized in that: include: Performing a copper cladding operation on the PCB board to obtain a processed board, wherein the processed board includes a first processed surface and a second processed surface, and the first processed surface and the second processed surface are symmetrically arranged with the processed board as a horizontal axis; Positioning from the first processing surface to obtain a first positioning hole; According to the first positioning hole, a first laser hole is punched on the first processing surface to two-thirds of the thickness of the processing plate, so as to obtain the first laser hole; the position of the first positioning hole is the same as that of the first laser hole; Positioning the first laser hole on the second processing surface to determine a second positioning hole, wherein the second positioning hole and the first positioning hole are arranged on the processing plate in a symmetrical manner along the horizontal axis; Punching a second laser hole on the second processing surface to two-thirds of the thickness of the processing plate according to the second positioning hole; the position of the second positioning hole is the same as that of the second laser hole; Obtaining a target microhole by machining the first laser hole and the second laser hole; After obtaining the target micro-holes by processing the first laser hole and the second laser hole, the method further includes: Cleaning the processing plate; Performing copper electroplating on the target microvias on the cleaned processing board to obtain target conductive microvias; Wherein, the apertures of the target micropores and the target conductive micropores are both smaller than or equal to 0.15 mm.

2. The method for fabricating laser-connected microvias on a PCB according to claim 1, wherein: The copper-cladding operation is performed on the PCB board to obtain a processed board, comprising: Copper-cladding operations are performed on both sides of the PCB board to obtain a first copper-clad surface and a second copper-clad surface; performing a browning operation on the first copper-clad surface to obtain the first processed surface; A browning operation is performed on the second copper-clad surface to obtain the second processed surface.

3. The method for fabricating laser-guided microvias on a PCB according to claim 2, wherein: The thickness of the PCB board is less than or equal to 0.2 mm, and the thickness of the first processing surface and the second processing surface is 7-8 microns.

4. The method for fabricating laser-connected microvias on a PCB according to claim 1, wherein: The target microvia is electroplated and filled with copper to obtain a target conductive microvia, comprising: Performing a copper deposition operation on the target microvia to obtain a copper deposition hole; Performing electroplating bridge operation on the copper-plated hole, and copper plating on the copper-plated hole after the electroplating bridge operation to obtain a first blind hole and a second blind hole; The first blind hole and the second blind hole are processed to obtain the target conductive microvia.

5. The method for fabricating laser-guided microvias on a PCB according to claim 4, wherein: The processing of the first blind hole and the second blind hole to obtain the target conductive microvia includes: Performing a copper filling operation on the first blind hole; Performing a copper filling operation on the second blind hole; The target conductive microvia is generated according to the first blind via and the second blind via after copper filling.

6. The method for fabricating laser-connected microvias on a PCB according to claim 4, wherein: The wall thickness of the first blind hole and the second blind hole is 3-4 microns.

7. The method for fabricating laser-guided microvias on a PCB according to claim 4, wherein: The wall thickness of the copper-plated hole is 1-2 microns.

8. A PCB board, characterized in that: The invention comprises a conductive microvia obtained by the laser conductive microvia manufacturing method of a PCB board as claimed in any one of claims 1 to 7.

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