Full encapsulation method for components on FPC, FPC and display module

Abstract

The embodiment of the present invention discloses a method for full encapsulation of components on FPC, including: heating component protection glue to a first preset temperature threshold; dripping the component protection glue that reaches the first preset temperature threshold onto the component; dripping the component protection glue that reaches the first preset temperature threshold onto the component includes the component protection glue covering the top of the component; heating the component protection glue on the periphery of the component to a preset second temperature threshold; heating the component protection glue on the periphery of the component to the preset second temperature threshold includes the component protection glue on the periphery of the component melting and covering the component. The embodiment of the present invention also discloses an FPC and a display module, which achieves the purpose of fixing the component protection glue on the top of the component by controlling the temperature of the component protection glue dripped onto the top of the component.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to a full encapsulation method for components on an FPC, the FPC and a display module. Background Art

[0002] In the production of display screens, some customers require the design of FPC component protection glue to fully encapsulate the components (full encapsulation, that is, the component protection glue completely covers the components). The conventional operation is to drip the component protection glue onto the components through equipment when the component protection glue is at a high temperature. However, at high temperatures, the fluidity of the component protection glue is very strong, especially under the action of gravity, the component protection glue flows downward, and often the top of the component is not covered by the component protection glue.

[0003] How to fix component protection glue on the top of components and how to fully encapsulate components have become technical problems that need to be solved urgently in the industry. Summary of the invention

[0004] In order to at least solve the above-mentioned technical problems, the purpose of an embodiment of the present invention is to provide a full encapsulation method for components on an FPC, by controlling the temperature of the component protection glue dripped onto the components, so as to achieve the purpose of fixing the component protection glue on the top of the components.

[0005] To achieve the above-mentioned purpose, an embodiment of the present invention provides a method for fully encapsulating components on an FPC, comprising:

[0006] heating the component protection glue to a first preset temperature threshold;

[0007] dripping component protection glue that reaches a first preset temperature threshold onto the component;

[0008] The component protection glue that reaches the first preset temperature threshold is dripped onto the component, including the component protection glue covering the top of the component;

[0009] Heating the component protection glue on the periphery of the component to a preset second temperature threshold;

[0010] Heating the component protection glue on the periphery of the component to a preset second temperature threshold includes melting the component protection glue on the periphery of the component and covering the component.

[0011] In an exemplary embodiment, the step of heating the component protection glue to a first preset temperature threshold includes heating the component protection glue until it melts and can flow.

[0012] In an exemplary embodiment, before the step of heating the component protection glue on the periphery of the component to a preset second temperature threshold, the step further includes cooling the component protection glue dripped onto the component.

[0013] In an exemplary embodiment, the step of heating the component protection glue on the periphery of the component to a preset second temperature threshold includes melting only the periphery of the component protection glue dripped onto the component.

[0014] In an exemplary embodiment, the periphery of the component includes a middle portion of a side surface of the component and / or a lower portion of a side surface of the component.

[0015] In an exemplary embodiment, the step of heating the component protection glue on the periphery of the component to a preset second temperature threshold further includes heating the component protection glue dripped onto the component as a whole.

[0016] In an exemplary embodiment, the shape of the component protection glue dropped onto the component includes an oval.

[0017] In an exemplary embodiment, the shape of the component protection glue dropped onto the component includes a water drop shape.

[0018] To achieve the above purpose, an embodiment of the present invention further provides an FPC, including a component area, the component area includes components; the components are wrapped with component protection glue; the component protection glue adopts the above-mentioned full encapsulation method applied to components on the FPC.

[0019] To achieve the above object, an embodiment of the present invention further provides a display module, including the above FPC.

[0020] The full encapsulation method for components on FPC according to the embodiment of the present invention comprises: heating component protection glue to a first preset temperature threshold; dripping the component protection glue that reaches the first preset temperature threshold onto the component; dripping the component protection glue that reaches the first preset temperature threshold onto the component includes that the component protection glue covers the top of the component; heating the component protection glue on the periphery of the component to a preset second temperature threshold; heating the component protection glue on the periphery of the component to the preset second temperature threshold includes that the component protection glue on the periphery of the component melts and covers the component. The full encapsulation method for components on FPC according to the embodiment of the present invention achieves the purpose of fixing the component protection glue on the top of the component by controlling the temperature of the component protection glue dripped onto the component; secondary heating of the component protection glue dripped onto the component achieves the design of full encapsulation of the component; improves the moisture-proof, dust-proof, insulation, heat-insulating, confidentiality, corrosion-resistant, high-temperature-resistant and shock-proof functions of the component, and improves the use performance and stability parameters. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate one or more embodiments of this specification or the technical solutions in the prior art, the drawings required for use in the description of one or more embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 It is a schematic flow chart of a full encapsulation method for components on an FPC according to an embodiment of the present invention;

[0023] Figure 2 It is a schematic diagram of an embodiment of the present invention when the component protection glue is dripped onto the top of the component by using the full glue encapsulation method applied to the components on the FPC.

[0024] Description of reference numerals:

[0025] 201-components; 202-component protection glue. DETAILED DESCRIPTION

[0026] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0027] An embodiment of the present invention provides a method for fully encapsulating components on an FPC, comprising:

[0028] heating the component protection glue to a first preset temperature threshold;

[0029] dripping component protection glue that reaches a first preset temperature threshold onto the component;

[0030] The component protection glue that reaches the first preset temperature threshold is dripped onto the component, including covering the top of the component with the component protection glue;

[0031] Heating the component protection glue on the periphery of the component to a preset second temperature threshold;

[0032] Heating the component protection glue on the periphery of the component to a preset second temperature threshold includes melting the component protection glue on the periphery of the component and covering the component.

[0033] Example 1

[0034] Figure 1 1 is a schematic flow chart of a method for fully encapsulating components on an FPC according to an embodiment of the present invention. Figure 2This is a schematic diagram of the embodiment of the present invention using the full encapsulation method applied to the components on the FPC when the component protection glue is dripped onto the top of the component. Figure 1-2 , the full encapsulation method of components on FPC according to an embodiment of the present invention is described in detail.

[0035] The full encapsulation method of the embodiment of the present invention is used for full encapsulation of a component 201 , and the component 201 is applied to an FPC.

[0036] The component 201 of the embodiment of the present invention adopts a full rubber encapsulation design, which can play a good role in moisture-proof, dust-proof, insulation, heat insulation, confidentiality, corrosion resistance, high temperature resistance and shock resistance, and improve the performance and stability parameters.

[0037] First, in step 101, the component protection glue is heated to a first preset temperature threshold.

[0038] In some exemplary implementations, the component protection glue 202 is heated to a first preset temperature threshold, and the first temperature threshold has different corresponding temperature values ​​according to different component protection glues 202 .

[0039] In some exemplary embodiments, the first preset temperature threshold includes heating the component protection glue 202 until it melts and enables the component protection glue 202 to flow (ie, heating it just enough to flow without continuing to heat it to a very high temperature).

[0040] In some exemplary embodiments, taking a certain component protection glue 202 as an example, the temperature when it just melts and enters a flowing state is 200°C-210°C, and the temperature when it melts to a bubble state is 250°C, then the first preset temperature threshold is selected between 200°C-210°C.

[0041] In some exemplary embodiments, there is another reason why the first preset temperature threshold is not a very high temperature. If the temperature is very high, it will cause bubbles to form in the component protection glue 202. If bubbles are generated, it will inevitably affect the coverage effect of the component 201. Therefore, the first preset temperature threshold cannot be too high.

[0042] In step 102, component protection glue that reaches a first preset temperature threshold is dripped onto the component; dripping the component protection glue that reaches the first preset temperature threshold onto the component includes that the component protection glue covers the top of the component.

[0043] In some exemplary implementations, the component protection glue 202 that has reached a first preset temperature threshold is dripped onto the component 201 .

[0044] In some exemplary embodiments, the component protection glue 202 at least covers the top of the component 201 .

[0045] In some exemplary embodiments, the top of the component 201 in the present application is placed horizontally. The following explanation is given by taking the shape of the component 201 as a rectangular parallelepiped. The component protection glue 202 is dripped onto the top of the component 201 (i.e., the top of the component 201), and the bottom of the component 201 is reserved for contact with the FPC; the front, back, left and right sides of the component 201 are not covered by the component protection glue 202, or at least one side is not covered (at this time, the shape of the component protection glue 202 above the component 201 includes a circle, an ellipse, a semi-ellipse, etc.; of course, if the top of the component 201 is not placed horizontally, the shape of the component protection glue 202 dripped onto the top of the component 201 also includes a teardrop shape).

[0046] In some exemplary embodiments, after the component protection glue 202 is dripped onto the top of the component 201 , the component protection glue 202 can at least cover the top of the component 201 .

[0047] In some exemplary embodiments, due to the natural cooling of the component protection glue 202 (there is a time difference between the component protection glue 202 flowing out of the dispensing equipment and then dripping onto the top of the component 201), or additional cooling time is given to the component protection glue 202 dripped onto the top of the component 201, or the cooling is accelerated with the assistance of a cooling device; at least the component protection glue 202 on the top of the component 201 is solidified or semi-solidified.

[0048] In some exemplary embodiments, before the component protection glue 202 is dripped onto the component 201 , the surface of the component 201 is cleaned and dried.

[0049] In step 103, the component protection glue on the periphery of the component is heated to a preset second temperature threshold; heating the component protection glue on the periphery of the component to the preset second temperature threshold includes melting the component protection glue on the periphery of the component and covering the component.

[0050] In some exemplary embodiments, the component protection glue 202 on the periphery of the component 201 is heated to a preset second temperature threshold.

[0051] In some exemplary embodiments, the second temperature threshold causes the component protection glue 202 on the periphery of the component 201 to melt and cover the component 201 (ie, covers the front side, the back side, the left side, and the right side of the component 201 ).

[0052] In some exemplary embodiments, the second temperature threshold may be the same as the first temperature threshold, or slightly higher than the first temperature threshold, for example, about 5° C. higher.

[0053] In some exemplary embodiments, the component protection glue 202 on the periphery of the component 201 is heated a second time to melt only the periphery of the component protection glue 202 dripped onto the component 201 (ie, the component protection glue 202 on the top of the component 201 is not melted).

[0054] In some exemplary embodiments, when the component protection glue 202 is only on the top of the component 201 , the periphery of the component 201 includes an outer ring of the top.

[0055] In some exemplary embodiments, when the component protection glue 202 covers the top of the component 201 and the component protection glue 202 partially covers the side of the component 201, the periphery of the component 201 includes the middle of the side of the component 201 and / or the lower part of the side of the component 201.

[0056] In some exemplary embodiments, of course, the component protection glue 202 dripped onto the component 201 can be heated as a whole as needed, but it is better that the inside of the component protection glue 202 on the top of the component 201 does not melt, and the unmelted part still remains on the top of the component 201 to protect the top of the component 201; the heating is stopped after the component 201 is completely covered by the component protection glue 202.

[0057] In some exemplary embodiments, the component protection glue 202 on the periphery of the heating component 201 may be heated by hot air baking (for example, a hot air gun is used to bake the component protection glue 202 ).

[0058] Example 2

[0059] Embodiment 2 is an FPC, which includes a component area.

[0060] In some exemplary embodiments, the component area includes components, and the components include component protection glue; the component protection glue adopts the full glue encapsulation method applied to components on the FPC in the above-mentioned embodiment to perform a full glue encapsulation design on the components.

[0061] In some exemplary embodiments, after the components are arranged in the component area of ​​the FPC, the components are fully encapsulated with component protection glue.

[0062] In some exemplary implementations, the component protection glue may be dripped in batches for each component arranged or for multiple components as needed.

[0063] In some exemplary embodiments, components fully encapsulated with component protection glue using the method of the above embodiment have excellent properties such as excellent moisture-proof, dust-proof, and insulation.

[0064] Example 3

[0065] Embodiment 3 is a display module, which includes the FPC of the above embodiment.

[0066] In some exemplary implementations, the display module using the FPC of the above-mentioned embodiment enables the components to have excellent protection performance, thereby ensuring the stability of the performance of the display module.

[0067] Example 4

[0068] Embodiment 4 is an embodiment of an electronic device of the present invention. At the hardware level, the electronic device includes a processor, and optionally also includes a bus, a network interface, and a memory. The memory may include a memory, such as a high-speed random access memory (RAM), and may also include a non-volatile memory (non-volatile memory), such as at least one disk storage, etc. Of course, the electronic device may also include hardware required for other services.

[0069] The processor, network interface and memory can be interconnected through an internal bus, which can be an ISA (Industry Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc.

[0070] The memory is used to store programs. Specifically, the programs may include program codes, and the program codes include computer operation instructions.

[0071] The processor reads the corresponding computer program from the non-volatile memory into the memory and then runs it, forming a shared resource access control device at the logical level.

[0072] In some exemplary embodiments, the electronic device of this embodiment includes the FPC of the above embodiment.

[0073] Although the embodiments disclosed in the present invention are as above, the contents are only embodiments adopted to facilitate understanding of the present invention and are not intended to limit the present invention. Any technician in the field to which the present invention belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in the present invention, but the patent protection scope of the present invention shall still be subject to the scope defined in the attached claims.

Claims

1. A method for full encapsulation of components on FPC, characterized in that: include: heating the component protection glue to a first preset temperature threshold; dripping component protection glue that reaches the first preset temperature threshold onto the component; The step of dripping the component protection glue that reaches the first preset temperature threshold onto the component includes: the component protection glue covers the top of the component; Heating the component protection glue on the periphery of the component to a preset second temperature threshold; The heating of the component protection glue on the periphery of the component to a preset second temperature threshold comprises: the component protection glue on the periphery of the component melts and covers the component; The step of heating the component protection glue on the periphery of the component to a preset second temperature threshold comprises melting only the periphery of the component protection glue dripped onto the component; The step of heating the component protection glue to a first preset temperature threshold comprises heating the component protection glue until it melts and can flow; The periphery of the component includes the middle part of the side surface of the component and / or the lower part of the side surface of the component.

2. The method for fully encapsulating components on FPC according to claim 1, characterized in that: Before the step of heating the component protection glue on the periphery of the component to a preset second temperature threshold, the step further includes cooling the component protection glue dripped onto the component.

3. The method for full encapsulation of components on FPC according to claim 1, characterized in that: The step of heating the component protection glue on the periphery of the component to a preset second temperature threshold also includes heating the component protection glue dripped onto the component as a whole.

4. The method for full encapsulation of components on FPC according to claim 1, characterized in that: The shape of the component protection glue dripped onto the component includes an oval shape.

5. The method for full encapsulation of components on FPC according to claim 1, characterized in that: The shape of the component protection glue dripped onto the component includes a water drop shape.

6. An FPC, characterized in that: comprising a component area, wherein the component area includes components; The components are wrapped with component protection glue; The component protection glue adopts the full glue encapsulation method for components on FPC as described in any one of claims 1 to 5.

7. A display module, characterized in that: The invention comprises the FPC as claimed in claim 6.

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