A method for manufacturing a standard part for verifying the depression accuracy of resin plug holes

Abstract

The present invention discloses a method for manufacturing a standard part for verifying the depression accuracy of resin plug holes, the method comprising: S1, designing a module; S2, selecting a drill bit to drill holes normally; S3, producing to the resin plug hole process; S4, completing the resin plug hole, scanning on an AOI scanner to confirm that there is no resin depression; S5, the qualified resin plug hole board undergoes secondary copper deposition and secondary electroplating according to the normal process, and the copper plating thickness is ≥25um; S6, the whole board is covered with a dry film, and a window is made on the hole of the original resin plug hole by CCD alignment; S7, etching away the copper plating on the hole; S8, taking a slice at the position of the resin plug hole, first confirming the depression depth of the plug hole under a 3D microscope, then sealing and grinding the plug hole position slice, and measuring the depression depth of the resin plug hole under a metallographic microscope; S9, other boards use a 3D microscope to measure the depression depth of the resin plug hole; S10, AOI scanning of the resin plug hole. The present invention uses a 3D microscope to screen out holes that meet the depression depth, which can be used as a standard board to verify the equipment.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing and manufacturing, and in particular to a method for manufacturing a standard part for verifying the depression accuracy of a resin plug hole. Background Art

[0002] In order to ensure that the vias of automotive boards / automotive safety parts / medical elevator boards can withstand harsh environments or meet patch requirements, resin plugging is often used, and strict requirements are placed on the depth of the resin plugging. Eagle Eye AOI can check the depth of the resin plugging, but the actual depth of the depression measured under the selected template parameters is consistent with the parameter settings, and there is no corresponding standard board to verify whether the detection capability of the equipment can meet the requirements. Summary of the invention

[0003] The problem to be solved by the present invention is to provide a method for manufacturing a standard part for verifying the depression accuracy of resin plug holes, and use a 3D microscope to screen out holes that meet the depression depth, which can be used as a standard plate to verify the equipment.

[0004] The technical solution provided by the present invention to solve the above problems is: a method for manufacturing a standard part for verifying the depression accuracy of a resin plug hole, the method comprising:

[0005] S1. Design module: Take the copper substrate and set the drilling module in the middle;

[0006] S2. Use a drill bit to drill normally;

[0007] S3, according to normal parameters, the normal PCB production process is produced to the resin plugging process;

[0008] S4. Use vacuum plugging process to complete resin plugging, use ceramic brush grinding plate to grind off excess resin, and scan on AOI scanner to confirm that there is no resin depression;

[0009] S5. The qualified boards with resin plug holes shall be subjected to secondary copper deposition and secondary electroplating according to the normal process, and the surface copper shall be plated to a thickness of ≥25um;

[0010] S6. Cover the whole board with dry film, and make windows on the holes of the original resin plugs by CCD alignment to avoid deviation caused by alignment accuracy;

[0011] S7, etching away the plated copper on the hole according to the copper thickness etching parameter of 25um, exposing the resin underneath, and obtaining a preset resin plug hole depression defect;

[0012] S8. Take a slice at the position of the resin plug hole, first confirm the plug hole depression depth under a 3D microscope, then seal the plug hole position and slice it, measure the resin plug hole depression depth under a metallographic microscope, and compare and check the accuracy of the 3D microscope and the slice data to ensure that the difference is within 1um, meeting the measurement requirements;

[0013] S9. Use 3D microscope to measure the depression depth of resin plug holes on other boards, and select the ones with depression depth of 25-26um as standard boards to verify the accuracy of the equipment;

[0014] S10, AOI scanning of resin plug holes to verify that the recessed defects of the reserved modules can be scanned out and the standard board can meet the requirements.

[0015] Preferably, in step S1, the copper substrate has a length of 700 mm, a width of 620 mm, and a thickness of 1.5 mm.

[0016] Preferably, the number of cuts in step S1 is 24PNL.

[0017] Preferably, the diameter of the drill bit in step S2 is 0.4 mm.

[0018] Preferably, in step S5, DVCP is used for the secondary electroplating, and 28ASF is used as the current for the whole plate electroplating.

[0019] Preferably, the aperture of the window in step S6 is

[0020] Preferably, in step S10, AOI uses 25.tpl parameter scanning.

[0021] Compared with the prior art, the advantages of the present invention are: the present invention uses the method of plugging the holes first and then thickening them with electroplating, which makes it easier to control the thickness of the thickened copper surface, and then uses the etching window opening process to remove the thickened copper at the plugging position, so that the required recessed points can be artificially made. By comparing the 3D microscope and slice data, the measurement error is reduced, and the holes that meet the recessed depth are screened out using a 3D microscope, which can be used as a standard plate to verify the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings described herein are used to provide further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0023] Figure 1 This is a schematic diagram of the resin plug hole depression under a 100x microscope;

[0024] Figure 2 The depth of the resin plug hole depression under the 3D microscope and the metallographic microscope of the present invention is shown in the figure. DETAILED DESCRIPTION

[0025] The following will describe the implementation methods of the present invention in detail with reference to the accompanying drawings and embodiments, so that the implementation process of how the present invention applies technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0026] In the description of the present invention, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of narrating the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of the present invention.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. Therefore, the definition of "first" and "second" features can explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.

[0028] In the present invention, unless otherwise specified and limited, the terms "assemble", "connect", and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can also be a mechanical connection; it can be directly connected, or it can be connected through an intermediate medium, or the two elements can be internally connected. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0030] It should also be understood that the terms used in this description of the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present invention. As used in the description of the embodiments of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms of "a", "an" and "the" are intended to include plural forms.

[0031] The present invention discloses a method for manufacturing a standard part for verifying the depression accuracy of a resin plug hole, comprising the following steps:

[0032] Design module: Take a 620*700mm, 1.5mm thick copper substrate, set a drilling module in the middle, and the number of openings is 24PNL

[0033] Use φ0.4mm drill bit for normal drilling

[0034] According to normal parameters, the normal PCB production process is followed to the resin plugging process.

[0035] Use vacuum plugging process to complete resin plugging, use ceramic brush grinding plate to grind off excess resin, and scan on AOI scanner to confirm that there is no resin depression;

[0036] The qualified boards with resin plug holes shall be subjected to secondary copper deposition according to the normal process. The secondary electroplating adopts DVCP, and the current adopts 28ASF for the whole board electroplating, and the copper thickness of the plated surface is ≥25um;

[0037] The whole board is covered with dry film, and a window is made on the hole of the original resin plug by CCD alignment. The window aperture is φ0.3mm to avoid deviation caused by alignment accuracy;

[0038] According to the etching parameters of copper thickness of 25um, the plated copper on the hole is etched away to expose the resin underneath, and the preset resin plug hole depression defect is obtained;

[0039] Take a slice at the resin plug hole position, first confirm the plug hole depression depth under a 3D microscope, then seal the plug hole position and slice it, measure the resin plug hole depression depth under a metallographic microscope, and compare and check the accuracy of the 3D microscope and the slice data to ensure that the difference is within 1um, which meets the measurement requirements;

[0040] Other boards use 3D microscope to measure the depression depth of resin plug holes, and select the depression depth of 25-26um as the standard board to verify the accuracy of the equipment;

[0041] The resin plug hole AOI uses 25.tpl parameter scanning to verify that the recessed defects of the reserved module can be scanned out and the standard board can meet the requirements.

[0042] Specifically, it is difficult to find a defective board with a depth of exactly 25um by the method of selecting the depth of the concave plate, and it is difficult to meet the requirements of the standard board due to the influence of other holes;

[0043] The error of deep drilling by machining is ±50um, which cannot meet the requirements.

[0044] The present invention adopts the method of plugging the hole first and then thickening it by electroplating, which makes it easier to control the thickness of the thickened copper surface. Then, the etching window opening process is used to remove the thickened copper at the plugging position, so that the required recessed points can be artificially made. By comparing the 3D microscope and slice data, the measurement error is reduced, and the holes that meet the recessed depth are screened out using a 3D microscope, which can be used as a standard plate to verify the equipment.

[0045] The above description is only for the best embodiment of the present invention, but it should not be understood as limiting the claims. The present invention is not limited to the above embodiments, and its specific structure is allowed to be changed. All changes made within the scope of protection of the independent claims of the present invention are within the scope of protection of the present invention.

Claims

1. A method for manufacturing a standard part for verifying the depression accuracy of a resin plug hole, characterized in that: The method comprises, S1. Design module: Take the copper substrate and set the drilling module in the middle; S2. Use a drill bit to drill normally; S3, according to normal parameters, the normal PCB production process is produced to the resin plugging process; S4. Use vacuum plugging process to complete resin plugging, use ceramic brush grinding plate to grind off excess resin, and scan on AOI scanner to confirm that there is no resin depression; S5. The qualified boards with resin plug holes shall be subjected to secondary copper deposition and secondary electroplating according to the normal process, and the surface copper shall be plated to a thickness of ≥25um; S6. Cover the whole board with dry film, and make windows on the holes of the original resin plugs by CCD alignment to avoid deviation caused by alignment accuracy; S7, etching away the plated copper on the hole according to the copper thickness etching parameter of 25um, exposing the resin underneath, and obtaining a preset resin plug hole depression defect; S8. Take a slice at the position of the resin plug hole, first confirm the plug hole depression depth under a 3D microscope, then seal the plug hole position and slice it, measure the resin plug hole depression depth under a metallographic microscope, and compare and check the accuracy of the 3D microscope and the slice data to ensure that the difference is within 1um, meeting the measurement requirements; S9. Use 3D microscope to measure the depression depth of resin plug holes on other boards, and select the ones with depression depth of 25-26um as standard boards to verify the accuracy of the equipment; S10, AOI scanning of resin plug holes to verify that the recessed defects of the reserved modules can be scanned out and the standard board can meet the requirements.

2. The method for manufacturing a standard part for verifying the depression accuracy of a resin plug hole according to claim 1, characterized in that: In the step S1, the copper substrate has a length of 700 mm, a width of 620 mm, and a thickness of 1.5 mm.

3. The method for manufacturing a standard part for verifying the depression accuracy of a resin plug hole according to claim 1, characterized in that: The number of cuts in step S1 is 24PNL.

4. The method for manufacturing a standard part for verifying the depression accuracy of a resin plug hole according to claim 1, characterized in that: The diameter of the drill bit in step S2 is 0.4 mm.

5. The method for manufacturing a standard part for verifying the depression accuracy of a resin plug hole according to claim 1, characterized in that: In step S5, DVCP is used for secondary electroplating, and 28ASF is used as the current for whole-board electroplating.

6. The method for manufacturing a standard part for verifying the depression accuracy of a resin plug hole according to claim 1, characterized in that: The aperture of the window in step S6 is 7. The method for manufacturing a standard part for verifying the depression accuracy of a resin plug hole according to claim 1, characterized in that: In step S10, AOI uses 25.tpl parameter scanning.

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