Light emitting device mass transfer apparatus and light emitting device transfer processing system

Abstract

The application provides a light-emitting device mass transfer device and a light-emitting device transfer processing system, comprising a feeding mechanism, a receiving mechanism and a transfer mechanism, the feeding mechanism is used for carrying an external light-emitting device chip, the feeding mechanism comprises a feeding station, the receiving mechanism is located on one side of the feeding mechanism, the receiving mechanism comprises a receiving station, the transfer mechanism is used for transferring the external light-emitting device chip on the feeding mechanism to the receiving mechanism, the transfer mechanism comprises a receiving roller, a feeding roller, a conveying belt and a pickup, the receiving roller is arranged on the feeding station, the feeding roller is arranged on the receiving station, the conveying belt surrounds the receiving roller and the feeding roller, and the pickup is arranged on the conveying belt and used for picking up the external light-emitting device chip; the transfer precision is improved and the product yield is improved by arranging the conveying belt and the pickup device.

Description

Technical Field

[0001] This application relates to the field of mass transfer of light-emitting devices, specifically to a mass transfer device and a light-emitting device transfer processing system. Background Technology

[0002] Sub-millimeter and micron-sized light-emitting diodes have become the focus of development in the field of display technology due to their excellent performance. However, as resolution requirements increase, the number of chips that need to be transferred is increasing, making the development of mass transfer technology increasingly important.

[0003] In the process of researching and practicing existing technologies, the inventors of this application found that the transfer efficiency of the currently mature precision grasping technology is relatively low; the crystal-piercing technology has high requirements for the adhesive film material; and the maturity of stamp transfer technology, laser transfer technology, roller transfer technology, etc. is relatively low, and the key technologies are controlled by a few manufacturers. Summary of the Invention

[0004] This application provides a mass transfer device for light-emitting devices, which can improve the transfer efficiency of light-emitting devices, improve transfer accuracy by using a conveyor belt and a pickup component, and improve product yield.

[0005] This application provides a mass transfer device for light-emitting devices, comprising:

[0006] A feeding mechanism is used to carry an external light-emitting device chip; the feeding mechanism includes a feeding station.

[0007] A receiving mechanism is located on one side of the feeding mechanism; the receiving mechanism includes a receiving station;

[0008] A transfer mechanism is provided for transferring an external light-emitting device chip from the feeding mechanism to the receiving mechanism. The transfer mechanism includes a receiving roller, a discharging roller, a conveyor belt, and a pickup component. The receiving roller is disposed at the feeding station, the discharging roller is disposed at the receiving station, and the conveyor belt surrounds the receiving roller and the discharging roller. The pickup component is disposed on the conveyor belt and is used to pick up the external light-emitting device chip.

[0009] Optionally, in some embodiments of this application, the transfer structure further includes a first roller and a second roller, the first roller and the second roller being disposed between the receiving roller and the discharging roller, the height of the first roller being greater than the height of the second roller, and the height of the second roller being greater than the height of both the discharging roller and the receiving roller, the first roller being connected to the side of the conveyor belt away from the picking-up item, and the second roller being connected to the side of the conveyor belt where the picking-up item is disposed.

[0010] Optionally, in some embodiments of this application, the height of the receiving roller is greater than the height of the discharging roller.

[0011] Optionally, in some embodiments of this application, the diameter of the first roller is larger than the diameter of the receiving roller and the discharging roller.

[0012] Optionally, in some embodiments of this application, the pickup element is provided with a pickup slot, the width of which gradually decreases from the head to the tail.

[0013] Optionally, in some embodiments of this application, the pickup element is provided with a pickup slot, the width of which gradually increases from the middle to both sides.

[0014] Optionally, in some embodiments of this application, the material of the pickup includes an elastic material.

[0015] Optionally, in some embodiments of this application, the pickup element is further provided with an adsorption hole, which is connected to the pickup slot.

[0016] Optionally, in some embodiments of this application, the feeding mechanism includes a feeding platform and a feeding drive device for driving the feeding platform to move; the receiving mechanism includes a receiving platform and a receiving drive device for driving the receiving platform to move.

[0017] Accordingly, embodiments of this application also provide a light-emitting device transfer processing system, including:

[0018] The mass transfer device for the light-emitting device;

[0019] A sorting device is used to remove defective external light-emitting device chips; a track is provided between the sorting device and the feeding mechanism;

[0020] A cutting device is used to cut an external light-emitting device chip motherboard to form an external light-emitting device chip; the track is provided between the cutting device and the sorting device.

[0021] A repair device is provided on one side of the receiving mechanism, and the repair device is used to fill the position occupied by the defective external light-emitting device chip with a qualified external light-emitting device chip.

[0022] The embodiments of this application employ conveyor belts and pickup components to improve transfer accuracy. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the mass transfer device for light-emitting devices provided in Embodiment 1 of this application;

[0025] Figure 2 This is a schematic diagram of the pickup structure provided in Embodiment 1 of this application;

[0026] Figure 3 This is a schematic diagram of the engagement structure between the pickup component and the external light-emitting device chip provided in Embodiment 1 of this application;

[0027] Figure 4 This is a schematic diagram of another pickup structure provided in Embodiment 1 of this application;

[0028] Figure 5 This is a schematic diagram of another pickup component and external light-emitting device chip engagement structure provided in Embodiment 1 of this application;

[0029] Figure 6 This is a schematic diagram of the light-emitting device transfer processing system provided in Embodiment 2 of this application.

[0030] Explanation of reference numerals in the attached figures:

[0031] Light-emitting device mass transfer device 100, light-emitting device transfer processing system 200, external light-emitting device chip 101, feeding mechanism 10, feeding station 11, receiving mechanism 20, receiving station 21, transfer mechanism 30, receiving roller 31, discharging roller 32, conveyor belt 33, picking component 34, first roller 35, second roller 36, picking groove 34a, adsorption hole 34b, feeding platform 12, feeding drive device 13, receiving platform 22, receiving drive device 23, sorting device 201, cutting device 202, repair device 203, track 204. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0033] This application provides a display panel, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0034] Example 1

[0035] Please see Figure 1 This application provides a mass transfer device 100 for light-emitting devices, including: a feeding mechanism 10, a receiving mechanism 20, and a transfer mechanism 30. The feeding mechanism 10 is used to carry external light-emitting device chips 101. The feeding mechanism 10 includes a feeding station 11. The receiving mechanism 20 is located on one side of the feeding mechanism 10. The receiving mechanism 20 includes a receiving station 21. The transfer mechanism 30 is used to transfer the external light-emitting device chips 101 on the feeding mechanism 10 to the receiving mechanism 20. The transfer mechanism 30 includes a receiving roller 31, a discharging roller 32, a conveyor belt 33, and a pickup component 34. The receiving roller 31 is disposed on the feeding station 11, the discharging roller 32 is disposed on the receiving station 21, and the conveyor belt 33 surrounds the receiving roller 31 and the discharging roller 32. The pickup component 34 is disposed on the conveyor belt and is used to pick up the external light-emitting device chips 101.

[0036] It should be noted that, in this embodiment, the arrangement spacing of the external light-emitting device chips 101 on the receiving mechanism 20 can be controlled by controlling the operating speed parameters of the feeding mechanism 10, the receiving mechanism 20, and the transfer mechanism 30. For example, the more external light-emitting device chips 101 the transfer mechanism 30 places to the receiving station 21 per unit time, the smaller the arrangement spacing of the external light-emitting device chips 101 on the receiving mechanism 20. Conversely, the fewer external light-emitting device chips 101 the transfer mechanism 30 places to the receiving station 21 per unit time, the larger the arrangement spacing of the external light-emitting device chips 101 on the receiving mechanism 20.

[0037] It is understood that this embodiment improves transfer accuracy and product yield by setting up a conveyor belt 33 and a pickup device 34.

[0038] In this embodiment, the transfer structure further includes a first roller 35 and a second roller 36. The first roller 35 and the second roller 36 are disposed between the receiving roller 31 and the discharging roller 32. The height of the first roller 35 is greater than the height of the second roller 36. The height of the second roller 36 is greater than the height of both the discharging roller 32 and the receiving roller 31. The first roller 35 is connected to the side of the conveyor belt 33 away from the picking member 34, and the second roller 36 is connected to the side of the conveyor belt 33 where the picking member 34 is disposed.

[0039] It is understood that, in this embodiment, by setting the first roller 35 and the second roller 36, the tension of the conveyor belt 33 can be adjusted to ensure the normal operation of the device. Furthermore, the working angle between the conveyor belt 33 and the feeding mechanism 10 and the receiving mechanism 20 can be adjusted to accommodate different work objects, such as chips and substrates of different sizes. In this embodiment, by setting the height of the first roller 35 to be greater than the height of the second roller 36, the first roller 35 and the second roller 36 can support the conveyor belt 33 at different points, preventing excessive deformation of the conveyor belt 33 due to its own weight during operation, thus avoiding affecting the working state of the conveying mechanism. It is understood that setting the height of the second roller 36 to be greater than the height of the feeding roller 32 and the receiving roller 31 facilitates the adjustment of the working angle between the conveyor belt 33 and the feeding mechanism 10 and the receiving mechanism 20. Understandably, the first roller 35 is connected to the side of the conveyor belt 33 away from the pickup 34, which can prevent the external light-emitting device chip 101 from being damaged by the first roller 35 during the conveying process; the second roller 36 is connected to the side of the conveyor belt 33 where the pickup 34 is located, which can reset the working state of the pickup 34.

[0040] In this embodiment, the height of the receiving roller 31 is greater than the height of the discharging roller 32.

[0041] Understandably, by setting the height of the receiving roller 31 to be greater than the height of the discharging roller 32, the feeding mechanism 10 can have a larger working space. In some cases, the external light-emitting device chip 101 often requires a series of processes before entering the light-emitting device mass transfer device 100, and these processes often require a large amount of space. Setting the height of the receiving roller 31 to be greater than the height of the discharging roller 32 can effectively accommodate the entire process and facilitate production line layout.

[0042] In some embodiments, the height of the receiving roller 31 is equal to the height of the discharging roller 32. It is understood that when the height of the receiving roller 31 is equal to the height of the discharging roller 32, the angle between the conveyor belt 33 and the receiving roller 31 and the discharging roller 32 can be easily adjusted.

[0043] In this embodiment, the diameter of the first roller 35 is larger than the diameter of the receiving roller 31 and the discharging roller 32.

[0044] It is understandable that when the diameter of the first roller 35 is larger than the diameter of the receiving roller 31 and the discharging roller 32, the slope of the conveyor belt 33 at the first roller 35 will be smaller, thereby reducing the force on the external light-emitting device chip 101 as it passes through the first roller 35, making it easier for the external light-emitting device chip 101 to pass smoothly.

[0045] Optionally, in some embodiments of this application, the diameter of the second roller 36 can be set smaller than the diameter of the receiving roller 31 and the discharging roller 32 to increase the force exerted on the pickup 34 when it passes through the second roller 36, facilitating the reset of the pickup 34's working state. For example, when the external light-emitting device chip 101 is not properly placed in the receiving station 21, the pickup 34 undergoes elastic deformation under the action of the second roller 36, and the abnormal external light-emitting device chip 101 will fall out of the pickup 34. Another example: when excessive charge is generated inside the pickup 34 and is not released, direct contact between the second roller 36 and the pickup 34 can also eliminate static electricity.

[0046] Please combine Figure 2 and Figure 3 In this embodiment, the pickup member 34 is provided with a pickup groove 34a, the width of which gradually decreases from the head to the tail.

[0047] Understandably, the width of the pickup slot 34a gradually decreases from the head to the tail. On the one hand, this reduces the difficulty of picking up the external light-emitting device chip 101, and on the other hand, it can calibrate the position of the external light-emitting device chip 101 to improve the transfer accuracy.

[0048] Optionally, in some embodiments of this application, the width of the tail of the pickup slot 34a is smaller than the width of the external light-emitting device chip 101. In this case, friction is formed between the pickup slot 34a and the external light-emitting device chip 101, which can maximize the effect of the pickup 34 in calibrating the position of the external light-emitting device chip 101.

[0049] Please combine Figure 4 and Figure 5 Optionally, in some embodiments of this application, the pickup member 34 is provided with a pickup groove 34a, the width of which gradually increases from the middle to both sides.

[0050] Understandably, the width of the pickup slot 34a gradually increases from the middle to both sides. On the one hand, this reduces the difficulty of picking up the external light-emitting device chip 101, and on the other hand, it can calibrate the position of the external light-emitting device chip 101 to improve the transfer accuracy.

[0051] Optionally, in some embodiments of this application, the width of the middle portion of the pickup slot 34a is smaller than the width of the external light-emitting device chip 101. In this case, friction is formed between the pickup slot 34a and the external light-emitting device chip 101, which can maximize the effect of the pickup 34 in calibrating the position of the external light-emitting device chip 101.

[0052] In this embodiment, the material of the pickup 34 includes an elastic material.

[0053] It is understandable that when the pickup component 34 picks up the external light-emitting device chip 101, there will be a positional deviation of the external light-emitting device chip 101. Therefore, the pickup component 34 will inevitably come into contact with the external light-emitting device chip 101 during this process. Selecting the material of the pickup component 34 as an elastic material can protect the external light-emitting device chip 101 and reduce the risk of damage to the external light-emitting device chip 101.

[0054] In this embodiment, the pickup member 34 is also provided with an adsorption hole 34b, which is connected to the pickup groove 34a.

[0055] Understandably, in order to facilitate the control of the pickup component 34 in picking up and releasing the external light-emitting device, the pickup component 34 can also use vacuum adsorption, electrostatic adsorption, or magnetic adsorption to adsorb the external light-emitting device chip 101. The pickup component 34 is also provided with an adsorption hole 34b, which is connected to the pickup groove 34a to improve the effect of vacuum adsorption, electrostatic adsorption, or magnetic adsorption.

[0056] In this embodiment, the feeding mechanism 10 includes a feeding platform 12 and a feeding drive device 13 for driving the feeding platform 12 to move; the receiving mechanism 20 includes a receiving platform 22 and a receiving drive device 23 for driving the receiving platform 22 to move.

[0057] It should be noted that, in this embodiment, by controlling the feeding speed of the feeding platform 12 and the moving speed of the receiving platform 22, the arrangement spacing of the external light-emitting device chips 101 can be controlled.

[0058] The operation of the mass transfer device 100 for light-emitting devices will be explained below:

[0059] The feeding mechanism 10 transfers the external light-emitting device chip 101 to the feeding station 11. At this time, the transfer mechanism 30 picks up the external light-emitting device chip 101 through the pick-up component 34 and transfers it to the conveyor belt 33. During this process, the pick-up component 34 also calibrates the position of the external light-emitting device chip 101. When the conveyor belt 33 transfers the external light-emitting device chip 101 to the receiving station 21, the pick-up component 34 releases the external light-emitting device chip 101 to the receiving station 21, thus completing the transfer of the external light-emitting device chip 101.

[0060] Example 2

[0061] Please see Figure 6 This application also provides a light-emitting device transfer processing system 200, including: a mass transfer device 100 for light-emitting devices as described in Embodiment 1; a sorting device 201; a cutting device 202; and a repair device 203. The sorting device 201 is used to remove defective external light-emitting device chips 101. A track 204 is provided between the sorting device 201 and the feeding mechanism 10. The cutting device 202 is used to cut the external light-emitting device chip motherboard to form external light-emitting device chips 101. A track 204 is provided between the cutting device 202 and the sorting device 201. The repair device 203 is disposed on one side of the receiving mechanism 20, and the repair device 203 is used to fill the positions occupied by defective external light-emitting device chips 101 with qualified external light-emitting device chips 101.

[0062] It is understood that this embodiment employs a cutting device 202, a sorting device 201, a mass transfer device 100 for light-emitting devices as described in Embodiment 1, and a repair device 203, which can form a streamlined production process of cutting-sorting-transfer-repair, thus improving production efficiency. The linkage between the sorting device 201 and the repair device 203 improves the product qualification rate.

[0063] The above provides a detailed description of a display panel provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A mass transfer device for light-emitting devices, characterized in that, include: A feeding mechanism is used to carry an external light-emitting device chip; the feeding mechanism includes a feeding station. A receiving mechanism is located on one side of the feeding mechanism; the receiving mechanism includes a receiving station; A transfer mechanism is provided for transferring the external light-emitting device chip from the feeding mechanism to the receiving mechanism. The transfer mechanism includes a receiving roller, a discharging roller, a conveyor belt, and a pickup component. The receiving roller is disposed at the feeding station, the discharging roller is disposed at the receiving station, and the conveyor belt surrounds the receiving roller and the discharging roller. The pickup component is disposed on the conveyor belt and is used to pick up the external light-emitting device chip. The transfer mechanism further includes a first roller and a second roller, which are disposed between the receiving roller and the discharging roller. The height of the first roller is greater than the height of the second roller, and the height of the second roller is greater than the height of both the discharging roller and the receiving roller. The first roller is connected to the side of the conveyor belt away from the picking-up item, and the second roller is connected to the side of the conveyor belt where the picking-up item is disposed.

2. The mass transfer device for light-emitting devices according to claim 1, characterized in that, The height of the receiving roller is greater than the height of the discharging roller.

3. The mass transfer device for light-emitting devices according to claim 1, characterized in that, The diameter of the first roller is larger than the diameter of the receiving roller and the discharging roller.

4. The mass transfer device for light-emitting devices according to claim 1, characterized in that, The pickup component is provided with a pickup slot, the width of which gradually decreases from the head to the tail.

5. The mass transfer device for light-emitting devices according to claim 1, characterized in that, The pickup component is provided with a pickup slot, the width of which gradually increases from the middle to both sides.

6. The mass transfer device for light-emitting devices according to claim 4 or 5, characterized in that, The material of the pickup component includes an elastic material.

7. The mass transfer device for light-emitting devices according to claim 4 or 5, characterized in that, The pickup element is also provided with an adsorption hole, which is connected to the pickup slot.

8. The mass transfer device for light-emitting devices according to claim 1, characterized in that, The feeding mechanism includes a feeding platform and a feeding drive device for driving the feeding platform to move; the receiving mechanism includes a receiving platform and a receiving drive device for driving the receiving platform to move.

9. A light-emitting device transfer processing system, characterized in that, include: Mass transfer device for light-emitting devices as described in any one of claims 1-8; A sorting device is used to remove defective external light-emitting device chips; a track is provided between the sorting device and the feeding mechanism; A cutting device is used to cut an external light-emitting device chip motherboard to form an external light-emitting device chip; the track is provided between the cutting device and the sorting device. A repair device is provided on one side of the receiving mechanism, and the repair device is used to fill the position occupied by the defective external light-emitting device chip with a qualified external light-emitting device chip.

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