Camera modules and electronic devices

Abstract

The present application provides a camera module, including a circuit board, a mounting base and a plurality of electronic components. The mounting base is arranged on the circuit board, and the mounting base includes a base and a first flange arranged between the base and the circuit board. The base is provided with a through hole penetrating the mounting base. The base has a bottom surface facing the circuit board, and the bottom surface has a first area, a second area, a third area and a fourth area away from the through hole and connected in sequence. The first flange includes a first flange portion and a second flange portion connected to the first flange portion. The first flange portion is arranged in the first area, and the second flange portion is arranged in the second area; a plurality of electronic components are arranged on the circuit board and are located between the circuit board and the third area or the fourth area. The present application omits the arrangement of corresponding flanges of the mounting base in the third area and the fourth area, reduces the lateral size of the mounting base, and realizes the miniaturization of the camera module. The present application also provides an electronic device having the camera module.

Description

Technical Field

[0001] The present application relates to the technical field of cameras, and in particular to a camera module and an electronic device. Background Art

[0002] Camera modules are primarily used in electronic devices (such as mobile phones, computers, and tablets) to enable their camera functions. With the advancement of intelligent communication technologies, people are increasingly pursuing larger screen sizes for electronic devices, such as full-screen mobile phones. Given the fixed size of electronic devices, this requires further optimization of the dimensions of their internal components. Existing camera module structures are relatively large, limiting the development of these devices. Summary of the Invention

[0003] In view of this, the present application provides a miniaturized camera module.

[0004] In addition, it is also necessary to provide an electronic device having the camera module.

[0005] The present application provides a camera module, comprising a circuit board, a mounting base, and a plurality of electronic components. The mounting base is disposed on the circuit board, comprising a base and a first flange disposed between the base and the circuit board, the base being provided with a through hole extending therethrough, the base having a bottom surface facing the circuit board, the bottom surface having a first region, a second region, a third region, and a fourth region connected in sequence away from the through hole, the first flange comprising a first flange portion and a second flange portion connected to the first flange portion, the first flange portion being disposed in the first region, and the second flange portion being disposed in the second region;

[0006] The plurality of electronic components are disposed on the circuit board and located between the circuit board and the third area or the fourth area.

[0007] In some embodiments, the mounting base further includes a reinforcement block provided on the third area.

[0008] In some embodiments, the reinforcement block includes a first block and a second block, the first block is connected to the second flange portion, the second block is arranged at the connection between the third area and the fourth area, and a first accommodating groove for accommodating the electronic component is formed between the first block and the second block.

[0009] In some embodiments, the second block has an outer side surface away from the first region, and the outer side surface is concave toward the center of the through hole to form a second receiving groove for receiving the electronic component.

[0010] In some embodiments, the mounting seat is provided with a third block at the connection between the first area and the fourth area, and a third receiving groove for receiving the electronic component is formed between the third block and the second block.

[0011] In some embodiments, a first rubber block is provided in the first receiving groove, a second rubber block is provided in the second receiving groove, and a third rubber block is provided in the third receiving groove. The first rubber block, the second rubber block and the third rubber block are all coated on the electronic component.

[0012] In some embodiments, the camera module further includes a photosensitive chip and a first adhesive layer, wherein the photosensitive chip is disposed on the circuit board and corresponds to the through hole;

[0013] The base extends toward the circuit board at the edge of the through hole to form a second flange, the photosensitive chip is arranged on the second flange and the circuit board, and the second flange and the photosensitive chip are connected through the first adhesive layer.

[0014] In some embodiments, the second flange has a notch.

[0015] In some embodiments, the first flange portion and the second flange portion extend out of the bottom surface to the same height, and the second flange portion extends out of the bottom surface to a lesser height than the first flange portion extends out of the bottom surface.

[0016] The present application also provides an electronic device using a camera module.

[0017] In the present application, the first and second areas of the mounting seat are respectively provided with a first flange portion and a second flange portion, and no corresponding flanges are provided in the third and fourth areas. Therefore, it is possible to avoid the problem in the prior art that when flanges are provided on all four sides of the base of the mounting seat, the flanges on all four sides need to avoid the position of the electronic components or need to maintain a certain distance from the electronic components, which leads to an increase in the lateral size of the mounting seat. That is, the present application reduces the distance from the first area to the third area and from the second area to the fourth area of the mounting seat, reduces the overall lateral size of the mounting seat, and realizes the miniaturization of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a structural diagram of a camera module provided by a preferred embodiment of the present application.

[0019] Figure 2 yes Figure 1 An exploded view of a camera module in one embodiment is shown.

[0020] Figure 3 yes Figure 1 A schematic structural diagram of a mounting base and a circuit board of a camera module in one embodiment is shown.

[0021] Figure 4 yes Figure 1 A schematic structural diagram of a mounting base in one embodiment is shown.

[0022] Figure 5 yes Figure 1 The cross-sectional diagram of the camera module along IV-IV in one embodiment is shown.

[0023] Figure 6 yes Figure 1 The cross-sectional diagram of the camera module along VV in one embodiment is shown.

[0024] Figure 7 Provided is an electronic device using the camera module.

[0025] Description of main component symbols

[0026] Camera module 100

[0027] Circuit board 10

[0028] First plate portion 101

[0029] Second plate portion 102

[0030] The third plate portion 103

[0031] Base surface 104

[0032] Electronic components 20

[0033] Photosensitive chip 30

[0034] First edge 301

[0035] Second edge 302

[0036] Mounting Block 40

[0037] Base 41

[0038] Through hole 42

[0039] Bottom 43

[0040] District 1 431

[0041] District 2 432

[0042] District 3 433

[0043] District 434

[0044] First flange 44

[0045] First flange portion 441

[0046] Second flange portion 442

[0047] Second flange 45

[0048] Gap 451

[0049] Reinforcement block 46

[0050] The first piece 461

[0051] The second piece is 462

[0052] Outer side 4621

[0053] The third block 463

[0054] First receiving groove 471

[0055] Second accommodating groove 472

[0056] The third receiving groove 473

[0057] Fourth accommodating groove 474

[0058] Fifth receiving groove 475

[0059] Top 48

[0060] First rubber block 50

[0061] Second rubber block 51

[0062] The third rubber block 52

[0063] Filter 60

[0064] First adhesive layer 70

[0065] Second adhesive layer 71

[0066] The third adhesive layer 72

[0067] Fourth adhesive layer 73

[0068] Lens assembly 80

[0069] Mirror mount 81

[0070] Lens tube 82

[0071] Electrical connection portion 90

[0072] Electronic device 200

[0073] The following specific implementation methods will be combined with the above-mentioned Figure 1-7 Further explain this application. DETAILED DESCRIPTION

[0074] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0075] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. When an element is referred to as being "disposed on" another element, it may be directly disposed on the other element or there may be an intermediate element.

[0076] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0077] In order to further illustrate the technical means and effects adopted by this application to achieve the intended purpose, the following detailed description of this application is made in conjunction with the accompanying drawings and preferred implementation methods.

[0078] See also Figure 1 and Figure 2 A preferred embodiment of the present application provides a camera module 100, which includes a circuit board 10, an electronic component 20, a photosensitive chip 30, a mounting seat 40, a filter 60, and a lens assembly 80. The electronic component 20 is arranged on the circuit board 10 and is located around the photosensitive chip 30. The mounting seat 40 is arranged on the circuit board 10, and the photosensitive chip 30 is located between the circuit board 10 and the mounting seat 40. The lens assembly 80 is placed on the surface of the mounting seat 40 away from the circuit board 10. The filter 60 is located in the mounting seat 40 and is arranged between the photosensitive chip 30 and the lens assembly 80.

[0079] See Figure 2 The circuit board 10 includes a first board portion 101, a second board portion 102 and a third board portion 103. The electronic components 20 and the photosensitive chip 30 are both mounted on the first board portion 101. The second board portion 102 is connected between the first board portion 101 and the third board portion 103. The side of the circuit board 10 facing the lens assembly 80 is the base surface 104. The circuit board 10 can be a soft board, a hard board or a hard-soft board. In this embodiment, the circuit board 10 adopts a hard-soft board. The first board portion 101 and the third board portion 103 both adopt hard boards, and the second board portion 102 adopts a soft board. The third board portion 103 is provided with an electrical connection portion 90, which is located on the base surface 104. The electrical connection portion 90 can adopt a connector or a gold finger to realize signal transmission between the camera module 100 and other electronic components 20 in the electronic device 200.

[0080] See Figure 2 and Figure 3 , the photosensitive chip 30 is fixed on the base surface 104 and is located on the first board portion 101. A plurality of electronic components 20 are arranged at the edge of the photosensitive chip 30. The electronic components 20 can be passive components such as resistors, capacitors, diodes, transistors, relays, and electrically erasable programmable read-only memories (EEPROMs). The photosensitive chip 30 has a first edge 301 and a second edge 302 connected to the first edge 301, and the first edge 301 is close to the connection between the first board portion 101 and the second board portion 102. In the present application, a plurality of electronic components 20 are concentrated near the first edge 301 and the second edge 302 of the photosensitive chip 30, but this is not a limitation.

[0081] See Figure 3 and Figure 4 The mounting base 40 includes a base 41 and a first flange 44 disposed between the base 41 and the circuit board 10. The base 41 has a through hole 42 extending through the mounting base 40 and a bottom surface 43 facing the circuit board 10. The photosensitive chip 30 corresponds to the through hole 42 of the mounting base 40. The bottom surface 43 includes a first area 431, a second area 432, a third area 433, and a fourth area 434 that are connected in sequence and away from the through hole 42. The second area 432 is away from the intersection of the first plate portion 101 and the second plate portion 102, and the fourth area 434 is close to the connection between the first plate portion 101 and the second plate portion 102. The first flange 44 includes a first flange portion 441 and a second flange portion 442 connected to the first flange portion 441. The first flange portion 441 is disposed in the first area 431, and the second flange portion 442 is disposed in the second area 432. The first flange portion 441 and the second flange portion 442 extend to the same height from the bottom surface 43. The fourth area 434 of the mounting base 40 corresponds to the first edge 301 of the photosensitive chip 30 .

[0082] The mounting base 40 is respectively provided with a first flange portion 441 and a second flange portion 442 in the first area 431 and the second area 432, and no corresponding flanges are provided in the third area 433 and the fourth area 434. Therefore, it is possible to avoid the problem in the prior art that when the mounting base 40 is provided with flanges on all sides of the base 41, the lateral size of the mounting base 40 increases due to the need for the flanges on all sides to avoid the position of the electronic components 20. That is, the present application reduces the distance between the first area 431 and the third area 433 and the distance between the second area 432 and the fourth area 434, so that the overall lateral size of the mounting base 40 is reduced, thereby realizing the miniaturization of the camera module 100.

[0083] See Figure 3 and Figure 4In order to improve the mechanical strength of the mounting base 40, the mounting base 40 also includes a reinforcing block 46 provided in the third area 433. The reinforcing block 46 includes a first block 461 and a second block 462. The first block 461 is connected to the second flange portion 442, and the second block 462 is provided at the connection between the third area 433 and the fourth area 434. A first receiving groove 471 is formed between the first block 461 and the second block 462. The second block 462 has an outer side surface 4621 away from the first area 431. The outer side surface 4621 is concave toward the center of the through hole 42 to form a second receiving groove 472. The multiple electronic components 20 located at the second edge 302 of the photosensitive chip 30 are accommodated in the first receiving groove 471 and the second receiving groove 472.

[0084] See Figure 3 and Figure 4 The mounting base 40 is provided with a third block 463 at the intersection of the first area 431 and the fourth area 434. A third receiving groove 473 is formed between the third block 463 and the second block 462. The plurality of electronic components 20 at the second edge 302 of the photosensitive chip 30 are accommodated in the third receiving groove 473.

[0085] See Figure 4 、 Figure 5 and Figure 6 To prevent light leakage from the edges of the photosensitive chip 30, a first rubber block 50 is provided in the first receiving groove 471, a second rubber block 51 is provided in the second receiving groove 472, and a third rubber block 52 is provided in the third receiving groove 473. The first rubber block 50, the second rubber block 51, and the third rubber block 52 are all coated on the electronic component 20 and completely fill the corresponding first receiving groove 471, the second receiving groove 472, and the third receiving groove 473. The first rubber block 50, the second rubber block 51, and the third rubber block 52 can be made of an opaque material. This arrangement not only prevents light leakage from the edges of the photosensitive chip 30, but also acts as a buffer when the camera module 100 falls.

[0086] See Figure 3 and Figure 4 The base 41 and the first flange 44 form a fourth receiving groove 474 for accommodating the photosensitive chip 30. The mounting base 40 extends toward the circuit board 10 from the edge of the through hole 42 to form a second flange 45. The height of the second flange 45 extending from the bottom surface 43 is less than the height of the first flange portion 441 extending from the bottom surface 43. The photosensitive chip 30 is mounted between the second flange 45 and the circuit board 10.

[0087] See Figure 3 and Figure 4A first adhesive layer 70 is provided on the surface of the second flange 45 facing the circuit board 10. The first adhesive layer 70 is used to fix the photosensitive chip 30 on the second flange 45, so that the second flange 45 and the photosensitive chip 30 are sealed, preventing external light sources from entering the photosensitive chip 30 through the connection between the second flange 45 and the photosensitive chip 30. In actual production, in order to improve the yield rate, a notch 451 is provided on the second flange 45. This arrangement allows the gas inside the mounting base 40 to flow toward the notch 451 of the second flange 45 when the first adhesive layer 70 is baked, thereby avoiding bulges or bubbles in the first adhesive layer 70 and improving the sealing between the second flange 45 and the photosensitive chip 30. In the present application, the first adhesive layer 70 is correspondingly coated on the second flange 45 according to the matching conditions between the second flange 45 and the photosensitive chip 30 to achieve the requirement of complete sealing between the second flange 45 and the photosensitive chip 30.

[0088] See Figure 3 and Figure 4 The base 41 also includes a top surface 48 away from the bottom surface 43. The top surface 48 is recessed toward the bottom surface 43 to form a fifth accommodating groove 475. The through hole 42 is located at the bottom of the fifth accommodating groove 475. The filter 60 is accommodated in the fifth accommodating groove 475.

[0089] See Figure 2 The camera module 100 further includes a second adhesive layer 71, a third adhesive layer 72, and a fourth adhesive layer 73. The second adhesive layer 71 is disposed between the circuit board 10 and the mounting base 40. The third adhesive layer 72 is disposed on the surface of the optical filter 60 facing the mounting base 40, and is used to bond the optical filter 60 to the mounting base 40. The fourth adhesive layer 73 is disposed between the mounting base 40 and the lens assembly 80, thereby bonding the mounting base 40 and the lens assembly 80.

[0090] See Figure 2 and Figure 5 The lens assembly 80 includes a lens base 81 and a lens barrel 82. The lens barrel 82 is disposed on the surface of the lens base 81 away from the circuit board 10. The lens base 81 is bonded to the mounting base 40 via the fourth adhesive layer 73. In the present application, the lens base 81 is generally square in shape, and the shape and size of the lens base 81 and the mounting base 40 are adapted.

[0091] See Figure 7 The camera module 100 can be applied to various electronic devices 200 having a camera module, such as mobile phones, wearable devices, vehicles, cameras or monitoring devices, etc. In this embodiment, the camera module 100 is applied to a mobile phone.

[0092] In the present application, in the camera module 100, the first flange portion 441 and the second flange portion 442 are respectively provided in the first area 431 and the second area 432 of the mounting base 40, and no corresponding flanges are provided in the third area 433 and the fourth area 434. Therefore, it is possible to avoid the problem in the prior art that when the mounting base 40 is provided with flanges on all sides of the base 41, the lateral size of the mounting base 40 increases because the flanges around the base 41 need to avoid the position of the electronic components 20. That is, the distance between the first area 431 and the third area 433 and the distance between the second area 432 and the fourth area 434 are reduced, so that the overall lateral size of the mounting base 40 is reduced, thereby realizing the miniaturization of the camera module 100.

[0093] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A camera module, characterized in that: include: circuit boards; a mounting base, arranged on the circuit board, the mounting base comprising a base and a first flange arranged between the base and the circuit board, the base being provided with a through hole penetrating the mounting base, the base having a bottom surface facing the circuit board, the bottom surface comprising a first area, a second area, a third area and a fourth area away from the through hole and connected in sequence, the first flange comprising a first flange portion and a second flange portion connected to the first flange portion, the first flange portion being provided in the first area, the second flange portion being provided in the second area, and the fourth area being not provided with a corresponding flange, the mounting base further comprising a reinforcing block provided on the third area, the reinforcing block comprising a second block, the second block being provided at the connection between the third area and the fourth area, and the mounting base being provided with a third block at the intersection of the first area and the fourth area; a plurality of electronic components disposed on the circuit board and located between the circuit board and the third area or the fourth area; The photosensitive chip and the first adhesive layer, the base extends toward the circuit board at the edge of the through hole to form a second flange, the second flange has a notch, the photosensitive chip is arranged between the second flange and the circuit board, the second flange is connected to the photosensitive chip through the first adhesive layer, a third receiving groove for accommodating the electronic component is formed between the third block and the second block, the base and the first flange form a fourth receiving groove for accommodating the photosensitive chip, and the third receiving groove and the fourth receiving groove are communicated.

2. The camera module according to claim 1, wherein: The reinforcement block further includes a first block connected to the second flange portion, and a first accommodating groove for accommodating the electronic component is formed between the first block and the second block.

3. The camera module according to claim 2, wherein: The second block has an outer side surface away from the first area, and the outer side surface is concave toward the center of the through hole to form a second receiving groove for receiving the electronic component.

4. The camera module according to claim 3, wherein: A first rubber block is provided in the first accommodating groove, a second rubber block is provided in the second accommodating groove, and a third rubber block is provided in the third accommodating groove. The first rubber block, the second rubber block and the third rubber block are all coated on the electronic component.

5. The camera module according to claim 1, wherein: The photosensitive chip is arranged on the circuit board and corresponds to the through hole.

6. The camera module according to claim 1, wherein: The first flange portion and the second flange portion extend out of the bottom surface to the same height, and the second flange portion extends out of the bottom surface to a lesser height than the first flange portion extends out of the bottom surface.

7. An electronic device, characterized in that: Comprising a camera module as described in any one of claims 1 to 6.

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