Electronic device

Abstract

The present invention relates to an electronic device. A semi-finished product of an electronic device includes a substrate, a sensing module, and a housing. The substrate has a first surface and a second surface opposite to each other, and the substrate has a first through hole and a second through hole. The sensing module is disposed on the first surface. The housing is disposed on the first surface and forms a first cavity together with the substrate. The sensing module is located in the first cavity. The sensing module has a second cavity. The first through hole corresponds to and communicates with the first cavity, and the second through hole corresponds to and communicates with the second cavity. The above-mentioned semi-finished product of the electronic device effectively corrects its sensitivity while reducing the difficulty of testing the electronic device, thereby improving the performance of the finished electronic device.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic device testing, and particularly to a semi-finished product of an electronic device and an electronic device. Background Art

[0002] Generally speaking, during the production process of an electronic device, the finished product of the electronic device is usually tested. However, as the structure of the electronic device becomes more complex, the difficulty of testing the finished product stage of the electronic device also increases accordingly. Therefore, how to further reduce the difficulty of testing the electronic device while improving the performance of the electronic device in design has become a challenge in the industry. Summary of the Invention

[0003] Based on this, it is necessary to provide a semi-finished product of an electronic device and an electronic device to reduce the difficulty of testing the electronic device, effectively correct the sensitivity of the electronic device, and thus improve the performance of the finished product of the electronic device.

[0004] A semi-finished product of an electronic device includes:

[0005] A substrate having opposite first and second surfaces, the substrate having a first through hole and a second through hole;

[0006] A sensing module disposed on the first surface; and

[0007] A housing disposed on the first surface and jointly forming a first cavity with the substrate, the sensing module being located in the first cavity, the sensing module having a second cavity, the first through hole corresponding to communicate with the first cavity, and the second through hole corresponding to communicate with the second cavity.

[0008] In one embodiment, the semi-finished product of the electronic device performs a calibration sensitivity test by means of air pressure.

[0009] In one embodiment, the housing has an opening that communicates the first cavity with the outside air.

[0010] In one embodiment, the housing is in direct contact with the substrate.

[0011] In one embodiment, the sensing module includes:

[0012] A partition structure disposed on the first surface;

[0013] A sensor disposed on the first surface and covering the second through hole; and

[0014] A pressurizing component disposed on the partition structure and the sensor, the pressurizing component including a mass block and a diaphragm.

[0015] In one embodiment, the mass block is disposed inside the second cavity or the mass block is disposed outside the second cavity.

[0016] An electronic device, comprising:

[0017] A first substrate having opposite first and second surfaces, the first substrate having a first through hole and a second through hole;

[0018] A sensing module disposed on the first surface;

[0019] A second substrate disposed on the second surface, the first substrate and the second substrate being electrically connected; and

[0020] A housing disposed on the first surface and jointly forming a first cavity with the first substrate, the sensing module being disposed inside the first cavity, the sensing module having a second cavity, the first through hole corresponding to and communicating with the first cavity, and the second through hole corresponding to and communicating with the second cavity.

[0021] In one embodiment, a back cavity is further included between the sensing module and the second substrate, and the gas in the back cavity communicates with the gas in the first cavity.

[0022] In one embodiment, the second substrate includes conductive bumps that are connected to the second surface of the first substrate and define an extension chamber of the back cavity.

[0023] In one embodiment, the extension chamber communicates with the back cavity through the second through hole.

[0024] In one embodiment, the extension chamber communicates with the first cavity through the first through hole.

[0025] In one embodiment, the housing and the second substrate are separated by the first substrate.

[0026] In one embodiment, the housing does not directly contact the second substrate.

[0027] In one embodiment, the second substrate includes a sealing ring, and the edge of the sealing ring is flush with the edge of the second substrate.

[0028] In one embodiment, the housing has an opening that communicates the first cavity with the outside air.

[0029] In one embodiment, the housing directly contacts the first substrate.

[0030] In one embodiment, the sensing module includes:

[0031] A partition structure disposed on the first surface;

[0032] A sensor disposed on the first surface and covering the second through hole; and

[0033] A pressurizing assembly disposed on the partition structure and the sensor, wherein the pressurizing assembly includes a mass block and a diaphragm.

[0034] In one embodiment, the mass block is disposed inside the second cavity or the mass block is disposed outside the second cavity.

[0035] A semi-finished product of the above electronic device, in which a housing is disposed on the surface of a substrate to form a cavity. Thus, through the design of the test cavity, the electronic device can be tested in real time at the semi-finished product stage. Therefore, while reducing the test difficulty of the electronic device, its sensitivity can be effectively corrected, thereby improving the performance of the finished electronic device. Description of the Drawings

[0036] Figure 1A is a schematic cross-sectional view of a semi-finished product of an electronic device according to an embodiment of the present invention.

[0037] Figure 1B is Figure 1A a top view of

[0038] Figure 1C is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention.

[0039] Figure 1D is Figure 1C a top view of

[0040] Figure 2A is a schematic cross-sectional view of a semi-finished product of an electronic device according to another embodiment of the present invention.

[0041] Figure 2B is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention.

[0042] It should be noted that Figure 1B and Figure 1D For the top views of, for the sake of clear illustration, some components are omitted. Among them, 100A, 200A: semi-finished products of the electronic device

[0043] 100, 200: electronic devices

[0044] 110, 160: substrates

[0045] 110a: first through hole

[0046] 110b: second through hole

[0047] 111: First surface

[0048] 112: Second surface

[0049] 120: Sensing module

[0050] 121: Partition wall structure

[0051] 122: Sensor

[0052] 122a: Processing chip

[0053] 122b: Sensing chip

[0054] 123, 223: Pressurizing component

[0055] 123a, 223a: Mass block

[0056] 123b: Diaphragm

[0057] 130: Housing

[0058] 140: Bonding wire

[0059] 150: Insulating layer

[0060] 160a: Conductive bump

[0061] 160b: Sealing ring

[0062] C1: First cavity

[0063] C2: Second cavity

[0064] C3: Back cavity

[0065] C4: Extension chamber Detailed implementation manners

[0066] In order to make the above objects, features, and advantages of the present invention more obvious and understandable, the following will describe the detailed implementation manners of the present invention in conjunction with the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0067] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present invention.

[0068] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0069] In the present invention, unless otherwise clearly specified and defined, the terms "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0070] In the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0071] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation.

[0072] Figure 1A is a schematic cross-sectional view of a semi-finished product of an electronic device according to an embodiment of the present invention. Figure 1B is Figure 1A a top view schematic diagram of

[0073] Please refer to Figure 1A and Figure 1B In this embodiment, the semi-finished product 100A of the electronic device includes a substrate 110 (which can be the first substrate), a sensing module 120, and a housing 130. The substrate 110 has opposite first and second surfaces 111 and 112. Further, the sensing module 120 is disposed on the first surface 111, and the housing 130 is disposed on the first surface 111 and together with the substrate 110 forms a first cavity C1. Accordingly, in this embodiment, the housing 130 is disposed on the first surface 111 of the substrate 110 to form the first cavity C1 to make the semi-finished product 100A of the electronic device. In this way, through the design of the test cavity (the first cavity C1), the electronic device can be tested in real time at the semi-finished product stage. Therefore, the test difficulty of the electronic device can be reduced while effectively correcting its sensitivity. Further, in this embodiment, through the design of the test cavity (the first cavity C1) of the semi-finished product 100A of the electronic device, the electronic device can perform a sensitivity calibration test by air pressure at the semi-finished product stage. That is to say, control the air pressure change test and correct the sensitivity of the sensing module, replacing the actual vibration test and calibration steps. Therefore, the test difficulty of the electronic device can be reduced while effectively correcting its sensitivity.

[0074] In some embodiments, the housing 130 is in direct contact with the substrate 110, so the semi-finished product 100A of the electronic device can be tested without setting another substrate, but the present invention is not limited thereto.

[0075] In some embodiments, the sensing module 120 is disposed in the first cavity C1, and the sensing module 120 has a second cavity C2, wherein the substrate 110 has a first through hole 110a corresponding to the first cavity C1 and a second through hole 110b corresponding to the second cavity C2. In addition, the sensing module 120 may include a partition wall structure 121, a sensor 122, and a pressurizing component 123, wherein the partition wall structure 121 is disposed on the first surface 111, the sensor 122 is disposed on the first surface 111 and covers the second through hole 110b, and the pressurizing component 123 is disposed on the partition wall structure 121 and the sensor 122. Further, the sensor 122 may include a processing chip 122a and a sensing chip 122b, and the pressurizing component 123 includes a mass 123a and a diaphragm 123b.

[0076] In some embodiments, the processing chip 122a can be an application specific integrated circuit (ASIC) to receive and process the signal measured by the microphone component, and the sensing chip 122b can be a microphone component to sense the air pressure changes caused by the vibration of the pressurizing component 123 (the pressurizing component 123 can generate associated vibrations with external vibrations to compress the air in the second cavity C2), but the present invention is not limited to this.

[0077] In some embodiments, the substrate 110 is a circuit substrate, for example, the substrate 110 is a printed circuit board (PCB). In addition, the material of the partition wall structure 121 includes stainless steel, copper or a printed circuit board, the material of the mass block 123a is metal (for example, stainless steel or brass), and the material of the diaphragm 123b is plastic (for example, polytetrafluoroethylene (PTFE), polyethylene (PE), polyimide (PI) or polyether ether ketone (PEEK)), but the present invention is not limited thereto, and each of the above components can be replaced by any other suitable material.

[0078] In some embodiments, the sensing chip 122b covers the second through hole 110b, and the size of the sensing chip 122b is larger than the second through hole 110b. In other words, the orthographic projection of the sensing chip 122b on the substrate 110 completely covers the second through hole 110b, but the invention is not limited thereto.

[0079] In some embodiments, the first through hole 110a and the second through hole 110b have different shapes. For example, Figure 1BAs shown, the first through-hole 110a can be a strip-shaped hole, and the second through-hole 110b can be a circular hole. However, the present invention is not limited thereto, and the first through-hole 110a and the second through-hole 110b can be adjusted and matched according to the actual design requirements.

[0080] In some embodiments, the semi-finished product 100A of the electronic device further includes a plurality of bonding wires 140 and an insulating layer 150 disposed on the sensor 120. The material of the bonding wires 140 is, for example, gold or other suitable conductive materials, and the material of the insulating layer 150 is, for example, black glue or other suitable insulating materials. The present invention is not limited thereto.

[0081] In some embodiments, one of the plurality of bonding wires 140 can connect the processing chip 122a and the sensing chip 122b to form an electrical connection between the processing chip 122a and the sensing chip 122b, and another one of the plurality of bonding wires 140 can connect the processing chip 122a and the substrate 110 to form an electrical connection between the processing chip 122a and the substrate 110. In addition, the insulating layer 150 can protect the bonding wires 140 and improve the reliability of the subsequent electronic device. However, the present invention is not limited thereto.

[0082] In some embodiments, the mass block 123a is disposed in the second cavity C2. However, the present invention is not limited thereto. In other embodiments, the mass block 123a can have other different arrangements.

[0083] In some embodiments, the first cavity C1 and the second cavity C2 are two independent chambers. In other words, the first cavity C1 and the second cavity C2 are separated. However, the present invention is not limited thereto.

[0084] In some embodiments, the housing 130 has an opening 132 that communicates the first cavity C1 with the outside air. Therefore, the pressure in the first cavity C1 can be released in a timely manner. However, the present invention is not limited thereto. It should be noted that the size, number, shape, etc. of the opening 132 can be determined according to the actual design requirements, as long as the pressure in the first cavity C1 can be released, which falls within the protection scope of the present invention. Here, the pressure in the first cavity C1 can be generated by the high-temperature process during the manufacturing process.

[0085] It must be noted here that the following embodiments follow the component numbers and some contents of the above embodiments, where the same or similar numbers are used to represent the same or similar components, and the description of the same technical content is omitted. For the description of the omitted part, reference can be made to the foregoing embodiments, and the following embodiments will not be repeated.

[0086] Figure 1C is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention. Figure 1D is Figure 1C a top view schematic diagram of

[0087] Please refer to Figure 1C and Figure 1D in combination with Figure 1A and Figure 1B An electronic device 100 can be made from a semi-finished product 100A of the electronic device. The electronic device 100 includes a substrate 110, a sensing module 120, and a housing 130 of the semi-finished product 100A of the electronic device. In addition, the electronic device 100 further includes another substrate 160 (which can be a second substrate) disposed on the second surface 112 of the substrate 110, and the substrate 110 is electrically connected to the substrate 160. Accordingly, since the electronic device 100 of the present embodiment performs a sensitivity correction test in real time at the stage of the semi-finished product 100A of the electronic device, the test difficulty of the electronic device 100 can be reduced while effectively correcting its sensitivity, thereby improving the performance of the finished product of the electronic device 100.

[0088] In some embodiments, a back cavity C3 is further included between the sensing module 120 and the substrate 160, and the gas in the back cavity C3 communicates with the gas in the first cavity C1. In addition, the substrate 160 includes a conductive bump 160a and a sealing ring 160b. The conductive bump 160a abuts against the second surface 112 of the first substrate 110 and defines an extension chamber C4 of the back cavity C3. Further, the extension chamber C4 communicates with the back cavity C3 through a second through hole 110b and communicates with the first cavity C1 through a first through hole 110a. Therefore, the gas in the back cavity C3 can communicate with the gas in the first cavity C1 through the extension chamber C4, so as to achieve the effect of enlarging the chamber space of the back cavity C3 and improving the sensitivity of the sensing module 120, as Figure 1D shown, but the present invention is not limited thereto.

[0089] In some embodiments, the substrate 160 is similar to the substrate 110. For example, the substrate 160 can be a circuit board, such as a printed circuit board (PCB). The material of the conductive bump 160a is solder or conductive silver paste, and the material of the sealing ring 160b is solder or heat-resistant adhesive material. However, the present invention is not limited thereto, and any other suitable materials can be used to replace the above components.

[0090] In some embodiments, the edge of the sealing ring 160b is flush with the edge of the substrate 160. Therefore, the sealing ring 160b can be located in the peripheral area of the substrate 160, but the present invention is not limited thereto.

[0091] In some embodiments, the housing 130 and the substrate 160 are separated by the substrate 110. In other words, the substrate 110 is sandwiched between the housing 130 and the substrate 160, but the present invention is not limited thereto.

[0092] In some embodiments, the housing 130 does not directly contact the second substrate 160, but the present invention is not limited thereto.

[0093] Figure 2A It is a schematic cross-sectional view of a semi-finished product of an electronic device according to another embodiment of the present invention. Figure 2B It is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention. Please refer to Figure 2A , compared with the semi-finished product 100A of the electronic device, the mass block 223a of the pressurizing component 223 of the semi-finished product 200A of the electronic device in this embodiment is disposed outside the second cavity C2. In addition, please refer to Figure 2B , an electronic device 200 is manufactured from this semi-finished product 200A of the electronic device. Further, in this embodiment, the mass block 223a of the pressurizing component 223 may be located within the first cavity C1. Therefore, the mass block 223a may be located between the housing 130 and the diaphragm 123b, and the diaphragm 123b may be located between the mass block 223a and the sensor 122, but the present invention is not limited thereto.

[0094] In summary, through the design of the test cavity of the semi-finished product of the electronic device, the present invention can perform a sensitivity calibration test on the electronic device by air pressure at the semi-finished product stage. That is to say, the sensitivity of the sensing module is calibrated in real time using air pressure changes, thus replacing the steps of actually performing vibration tests and calibrations. Therefore, the test difficulty of the electronic device can be reduced while effectively calibrating its sensitivity.

[0095] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0096] The above-described embodiments merely represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent should be subject to the appended claims.

Claims

1. An electronic device, characterized in that, Comprising: A first substrate having opposite first and second surfaces, the first substrate having a first through-hole and a second through-hole; A sensing module disposed on the first surface, the sensing module including a partition wall structure, a sensor, and a pressurizing component. The partition wall structure is disposed on the first surface, the sensor is disposed on the first surface and covers the second through-hole, and the pressurizing component is disposed on the partition wall structure and the sensor, wherein the pressurizing component includes a mass block and a diaphragm; A second substrate disposed on the second surface, the first substrate and the second substrate being electrically connected, and a back cavity is further included between the sensing module and the second substrate; the second substrate includes a conductive bump, and the conductive bump is connected to the second surface of the first substrate and defines an extension chamber of the back cavity; And A housing disposed on the first surface and jointly forming a first cavity with the first substrate, the sensing module being disposed in the first cavity, the sensing module having a second cavity, the first through-hole corresponding to communicate with the first cavity, and the second through-hole corresponding to communicate with the second cavity; the extension chamber communicates with the back cavity through the second through-hole, and the extension chamber communicates with the first cavity through the first through-hole, so that the gas in the back cavity and the gas in the first cavity communicate.

2. The electronic device according to claim 1, characterized in that, The housing and the second substrate are separated by the first substrate.

3. The electronic device according to claim 1, wherein The housing does not directly contact the second substrate.

4. The electronic device according to claim 1, wherein The second substrate includes a sealing ring, and the edge of the sealing ring is flush with the edge of the second substrate.

5. The electronic device according to claim 1, wherein The housing has an opening, and the opening communicates the first cavity with the outside air.

6. The electronic device according to claim 1, wherein The housing directly contacts the first substrate.

7. The electronic device according to claim 1, characterized in that, The mass block is disposed inside or outside the second cavity.

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