Hybrid circuit board and battery pack having the same

Abstract

Embodiments of the present disclosure relate to a hybrid circuit board and a battery pack having the same. The battery pack includes a plurality of battery cells arranged in one direction, each battery cell including a positive electrode terminal and a negative electrode terminal, a plurality of bus bars electrically connected to the positive electrode terminal or the negative electrode terminal of each battery cell, and a hybrid circuit board including a rigid substrate and a flexible substrate, the flexible substrate being coupled to the rigid substrate and electrically connected to the bus bars. The rigid substrate is disposed between the bus bars and the flexible substrate.

Description

Technical Field

[0001] The embodiments of this disclosure relate to a hybrid circuit board and a battery pack having the hybrid circuit board. Background Technology

[0002] Typically, a battery pack includes multiple battery cells, busbars that electrically connect the battery cells to the outside (e.g., an external load), and a rigid circuit board that is electrically connected to the busbars and on which various circuits and components are mounted.

[0003] The busbars are mounted on a rigid circuit board using bolts and insert nuts, which may increase the height of the battery pack. Furthermore, to absorb bulging of the battery cells, individual terminals with bulge-absorbing structures should be bolted between the rigid circuit board and the battery cells. Additionally, the busbars should be connected using a TOX riveting process, thus complicating the structure of the battery pack and modules, increasing costs, and potentially making it difficult to reduce module height.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background of the described technology, and therefore may contain information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] This disclosure provides a hybrid circuit board with rigid reinforcement and bulging absorption structure and a battery pack having the same.

[0006] This disclosure also provides a hybrid circuit board and a battery pack having therein, the hybrid circuit board having a simple busbar connection structure that avoids increasing module height.

[0007] A hybrid circuit board according to one embodiment of the present disclosure includes: a flexible substrate comprising a flexible material (or made of a flexible material) configured to be electrically connected to a plurality of busbars electrically connected to a plurality of battery cells; and a rigid substrate comprising a rigid material (or made of a rigid material) coupled to the flexible substrate to support the flexible substrate.

[0008] The flexible substrate may include multiple tab connection portions along its edges, and the substrate tabs may be electrically connected to the tab connection portions and the busbar.

[0009] The flexible substrate may have first shaped portions on both sides of the tab connection portion, and the first shaped portions may be recessed inward from the corresponding edges of the flexible substrate.

[0010] The flexible substrate may have a second shaped portion that extends from the corresponding edge of the flexible substrate in an "S" shape and is integrally formed with the tab connection portion.

[0011] One end of the substrate contact can be soldered to the contact connection part, and the other end can be laser soldered to the busbar.

[0012] The flexible circuit board may further include: a sensor connection portion extending in an "S" shape from one of the edges of the flexible substrate; a temperature sensor configured to measure the temperature of at least one of the battery cells; a foam pad housing the temperature sensor; and a metal tab coupled to the foam pad and connected to the temperature sensor and the at least one battery cell.

[0013] A battery pack according to one embodiment of the present disclosure includes: a plurality of battery cells arranged in one direction, each battery cell including a positive electrode terminal and a negative electrode terminal; a plurality of busbars electrically connected to the positive electrode terminal or the negative electrode terminal of each battery cell; and a hybrid circuit board including a rigid substrate and a flexible substrate, the flexible substrate being coupled to the rigid substrate and electrically connected to the busbars. The rigid substrate is disposed between the busbars and the flexible substrate.

[0014] The flexible substrate may include multiple tab connection portions along its edges, and the substrate tabs may be electrically connected to the tab connection portions and the busbar.

[0015] The flexible substrate may have first shaped portions formed on both sides of at least one of the tab connection portions, and the first shaped portions may be recessed inward from the corresponding edges of the flexible substrate.

[0016] The flexible substrate may have a second shaped portion that extends in an "S" shape from one of the edges of the flexible substrate and is integrally formed with one of the tab connection portions.

[0017] One end of the substrate contact can be soldered to the contact connection part, and the other end can be laser soldered to the busbar.

[0018] The flexible substrate may further include: a sensor connection portion extending in an "S" shape from one of the edges of the flexible substrate; a temperature sensor configured to measure the temperature of at least one of the battery cells; a foam pad housing the temperature sensor; and a metal tab coupled to the foam pad and connected to the temperature sensor and the battery cell. Attached Figure Description

[0019] Figure 1 This is a partially exploded perspective view of a battery pack according to one embodiment of the present disclosure.

[0020] Figure 2 yes Figure 1 An exploded perspective view of the hybrid circuit board shown.

[0021] Figure 3 yes Figure 2 The diagram shows a plan view of the hybrid circuit board.

[0022] Figure 4 yes Figure 3 A magnified plan view of part "A".

[0023] Figure 5 yes Figure 3 A magnified plan view of part "B".

[0024] Figure 6A It is a schematic cross-sectional view showing the connection between a conventional busbar retainer and a rigid circuit board.

[0025] Figure 6B This is a schematic cross-sectional view showing the connection state between the busbar holder and the hybrid circuit board of a battery pack according to an embodiment of the present disclosure.

[0026] Figure 7 This is a plan view of a hybrid circuit board according to another embodiment of the present disclosure.

[0027] Figure 8 yes Figure 7 A magnified perspective view of part of the "C".

[0028] Figure 9 yes Figure 8 The enlarged bottom perspective view of the portion "C" shown. Detailed Implementation

[0029] Embodiments of this disclosure are provided to illustrate this disclosure more completely, and the following embodiments may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will convey aspects and features of this disclosure to those skilled in the art.

[0030] Furthermore, in the accompanying drawings, for the sake of brevity and clarity, the dimensions or thicknesses of various components may be exaggerated. The same numbers always refer to the same element. When used herein, the term "and / or" includes any and all combinations of one or more related listed items. Additionally, it will be understood that when element A is referred to as being "connected to" element B, element A may be directly connected to element B, or an intermediate element C may exist between them, such that element A and element B are indirectly connected to each other.

[0031] The terminology used herein is for the purpose of describing particular embodiments and is not intended to limit this disclosure. When used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. It will be further understood that, when used in this specification, the terms “having,” “comprising,” or “including,” and variations thereof (such as “having…,” “comprising…,” or “including…”) indicate the presence of the stated features, quantities, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, quantities, steps, operations, elements, components, and / or groups thereof.

[0032] It will be understood that although the terms first, second, etc., may be used herein to describe various components, elements, regions, layers, and / or parts, these components, elements, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one component, element, region, layer, and / or part from another. Thus, for example, the first component, first element, first region, first layer, and / or first part discussed below may be referred to as a second component, second element, second region, second layer, and / or second part without departing from the teachings of this disclosure.

[0033] For ease of description, spatial relational terms, such as “below,” “under,” “lower,” “above,” “upper,” etc., may be used herein to describe the relationship of one element or feature as shown in the figures to another element(s) or feature(s). It will be understood that, in addition to the orientations depicted in the figures, spatial relational terms are also intended to cover different orientations of the device in use or operation. For example, if an element or feature in the figures is flipped, an element described as “below” or “under” another element or feature will be oriented “above” or “on” said other element or feature. Thus, the exemplary term “below” can cover both upper and lower orientations, etc. Furthermore, the use of “may” in describing embodiments of this disclosure refers to “one or more embodiments of this disclosure.” Expressions such as “at least one of” modify the entire column of elements without modifying individual elements within the column when following a column of elements. When used herein, the terms “use,” “using,” and “being used” may be considered synonymous with the terms “utilizing,” “using,” and “being utilized,” respectively. When used herein, the terms “substantially,” “about,” and similar terms are used as terms of approximation rather than terms of degree, and are intended to describe inherent deviations in measurements or calculations that would be apparent to a person skilled in the art.

[0034] In the following, a hybrid circuit board and a battery pack having the hybrid circuit board according to embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0035] Figure 1This is a partially exploded perspective view of a battery pack according to one embodiment of the present disclosure. Figure 2 yes Figure 1 The exploded perspective view of the hybrid circuit board shown. Figure 3 yes Figure 2 The diagram shows a plan view of the hybrid circuit board. Figure 4 yes Figure 3 An enlarged plan view of part "A", and Figure 5 yes Figure 3 A magnified plan view of part "B".

[0036] like Figure 1 As shown, a battery pack 1 according to one embodiment of the present disclosure includes a plurality of battery cells 10, a cell frame 20 for aligning and supporting the battery cells 10, a plurality of busbars 40 electrically connected to the battery cells 10, and busbar holders 30 supporting the busbars 40. The battery pack 1 may also include a hybrid circuit board 50 on which various circuits and components are mounted. The busbars 40 may be electrically connected to the hybrid circuit board 50, and the hybrid circuit board 50 may be electrically connected to the outside of the battery pack 1 via a separate connector. The battery pack 1 may be referred to as a battery module.

[0037] The battery cell 10 may have a cuboid shape, and multiple battery cells 10 may be arranged in a row along a direction (e.g., a predetermined direction). Here, each battery cell 10 may be arranged such that their relatively wide plate surfaces face each other. A cell frame 20 is provided to align the battery cells 10. Each battery cell 10 may include a cuboid-shaped housing, an electrode assembly housed within the housing along with an electrolyte, and a cell cover 12 for sealing the housing.

[0038] The electrode assembly can be formed by sequentially winding or stacking a negative electrode plate, a separator, and a positive electrode plate. A negative electrode active material, such as graphite or carbon, can be applied or coated onto the negative electrode plate. The negative electrode plate can be formed from a metal foil such as copper, copper alloy, nickel, or nickel alloy. An active material, such as a transition metal oxide, can be applied or coated onto the positive electrode plate. The positive electrode plate can be formed from a metal foil such as aluminum or aluminum alloy. Uncoated areas (i.e., areas where no active material is applied) can be formed on the negative and positive electrode plates, respectively. A negative electrode tab can be connected to the uncoated negative electrode area, and a positive electrode tab can be connected to the uncoated positive electrode area. The negative and positive electrode tabs connected in this way can be electrically connected to the negative and positive electrode terminals formed in the unit cover 12, respectively. The negative and positive electrode terminals on the unit cover 12 are electrically connected to the busbar 40.

[0039] The unit frame 20 includes: a pair of end plates 22 that contact the battery cells 10 at both ends along the arrangement direction of the battery cells 10; a pair of side plates 24 positively cross-connected to the end plates 22; and a top plate 26 connected to the upper part of the hybrid circuit board 50. Based on Figure 1 The base plate of the unit frame 20 is provided on the lower part of the battery unit 10 to support the battery unit 10 from below. Based on Figure 1 Specifically, end plate 22 supports battery unit 10 in the front-to-back direction, side plate 24 supports battery unit 10 in the left-to-right direction, and top plate 26 supports battery unit 10 in the upward direction. End plate 22, side plate 24, top plate 26 and bottom plate (not shown) are interconnected to form a generally cuboid frame, in which battery unit 10, busbar holder 30 and busbar 40 and hybrid circuit board 50 are housed.

[0040] based on Figure 1 The busbar holder 30 can be seated on the unit cover 12. The busbar holder 30 is a generally rectangular plate, and a plurality of openings (e.g., through holes) can be formed therein through which the positive and negative electrode terminals of the unit cover 12 are exposed. The busbar holder 30 can be made of an insulating material. When the positive and negative electrode terminals are exposed through the openings formed in the busbar holder 30, the busbar 40 is electrically connected to the exposed positive and negative electrode terminals.

[0041] Busbar 40 can electrically connect positive and negative electrode terminals (e.g., the positive electrode terminal of one battery cell 10 to the negative electrode terminal of another battery cell 10). Busbar 40 can connect multiple battery cells 10 in series and / or in parallel. For this purpose, multiple busbars 40 can be provided. In one example, busbar 40 can electrically connect non-adjacent battery cells 10 arranged in a row. In other embodiments, busbar 40 can electrically connect the positive electrode terminal of one battery cell 10 to the positive or negative electrode terminal of another battery cell 10. Furthermore, busbar 40 can electrically connect the negative electrode terminal of one battery cell 10 to the positive or negative electrode terminal of another battery cell 10. Busbar 40 can be connected to the positive and negative electrode terminals by soldering or the like. Areas other than busbar 40 and the positive and negative electrode terminals can be insulated by busbar retainer 30. Hybrid circuit board 50 is disposed between busbar(s) 40 and top plate 26.

[0042] like Figure 2 As shown, the hybrid circuit board 50 may include a rigid substrate 50a and a flexible substrate 50b.

[0043] A rigid substrate 50a is coupled to a flexible substrate 50b to support the flexible substrate 50b and enhance (or improve) its rigidity. The rigid substrate 50a can be simply formed of a reinforcing material for reinforcement without requiring circuit mounting. In other embodiments, the rigid substrate 50a can be a printed circuit board (PCB) on which circuitry is mounted. Because the rigid substrate 50a supports the flexible substrate 50b, it can have a shape similar to that of the flexible substrate 50b. The rigid substrate 50a can have the same dimensions as or slightly smaller than those of the flexible substrate 50b. The rigid substrate 50a can have a generally rectangular shape and can be configured such that the direction of its long side aligns with the arrangement direction of the battery cells 10. Figure 1 The flexible substrate 50b is connected to the upper part of the rigid substrate 50a.

[0044] The flexible substrate 50b is a substrate made of a flexible material with lower strength than the rigid substrate 50a. The flexible substrate 50b can be (or may be referred to as) a flexible printed circuit assembly (FPCA) or a flexible printed circuit board (FPCB). Various parts (or components or circuits) for measuring the state information of the battery cell 10 (such as the voltage and / or temperature of the battery cell 10) and various parts (or components or circuits) for controlling and / or managing the battery cell 10 can be mounted on the flexible substrate 50b.

[0045] like Figure 2 and Figure 3 As shown, the flexible substrate 50b can have a generally rectangular shape, and the first tab connection portion 510 and the second tab connection portion 520 can be formed at the edge along their long side (or length) direction. Substrate tabs 530 are respectively connected to the first tab connection portion 510 and the second tab connection portion 520. The flexible substrate 50b can be configured such that its long side direction aligns with the arrangement direction of the battery cells 10. Because the flexible substrate 50b is to be connected to the busbar 40, the flexible substrate 50b should cover a portion (or dimension) or more of the area of ​​the busbar holder 30. The flexible substrate 50b can have different dimensions than the busbar holder 30, but can have dimensions sufficient to be adjacent to at least the mounting area of ​​the busbar 40 for a smooth connection with the busbar 40. For example, the flexible substrate 50b can have dimensions similar to... Figure 1 The short side (or width) length corresponding to the interval between the left busbar 40 and the right busbar 40 shown. Furthermore, the flexible substrate 50b may have a long side length equal to the width of the left busbar 40 or the right busbar 40 in the arrangement direction of the battery cells 10.

[0046] Reference Figure 2 and Figure 3Multiple first tab connection portions 510 and second tab connection portions 520 may be formed on the edge of the flexible substrate 50b in the longitudinal (or long side or length) direction. However, the first tab connection portions 510 and second tab connection portions 520 may also be formed on the edge of the flexible substrate 50b in the short side (or width) direction.

[0047] like Figures 2 to 4 As shown, the first tab connection portion 510 is part of the flexible substrate 50b, to which the substrate tab 530, which is electrically connected to the busbar 40, is connected. The first tab connection portion 510 may be formed to have the same or slightly larger dimensions as the portion to which the substrate tab 530 is welded (hereinafter referred to as the first welded portion). A first shaped portion 512, cut into a generally teardrop shape, may be formed on both sides of the first tab connection portion 510 in the flexible substrate 50b.

[0048] The first shaped portion 512 is recessed inward from the edge along the long side of the flexible substrate 50b and is provided on both sides of the first tab connection portion 510. Based on Figure 1 Because the first contact connection portion 510 is a free end due to the first shaped portion 512 and is made of a flexible material, the first contact connection portion 510 can move with a certain degree of freedom in the vertical and horizontal directions. The first contact connection portion 510 is connected to the busbar 40 via the substrate contact 530, and the busbar 40 is connected to the cell cover 12. Therefore, even if vibration is transmitted to the first contact connection portion 510 when bulging occurs in the battery cell 10, the bulging can be absorbed by the first shaped portion 512. Thus, damage to the first contact connection portion 510 or damage to the connection portion between the substrate contact 530 and the busbar 40 can be mitigated or prevented. The first shaped portion 512 for absorbing bulging can be implemented in different shapes depending on the distance from the busbar 40 or the interference with the busbar retainer 30.

[0049] like Figure 2 , Figure 3 and Figure 5As shown, the second tab connection portion 520 to which the substrate tab 530 is connected can be formed on the flexible substrate 50b, and can be provided with a second shape portion 522 having a generally "S" shape. For example, the second shape portion 522 includes: an extension portion 522a extending linearly from one end of the edge of the flexible substrate 50b; a bent portion 522b integrally formed with the extension portion 522a and having a generally "S" shaped bend; and a connecting portion 522c integrally formed with the bent portion 522b and formed as a straight line to connect to the second tab connection portion 520. The second tab connection portion 520 to which the substrate tab 530 is connected is formed at one end of the connecting portion 522c of the second shape portion 522. Furthermore, the second shape portion 522 has a width smaller than the size of the second tab connection portion 520 and is spaced apart from the end of the flexible substrate 50b. Therefore, based on Figure 1 Because the second connector portion 520 becomes a free end due to the second shaped portion 522 and is made of a flexible material, the second connector portion 520 can move with one degree of freedom in the vertical and horizontal directions (e.g., left and right directions). Therefore, the bulging of the battery cell 10 can also be absorbed by the second shaped portion 522.

[0050] Thus, the first tab connection portion 510 should be able to move smoothly with one degree of freedom (e.g., a predetermined degree of freedom). Therefore, when the rigid substrate 50a is coupled to the flexible substrate 50b, the extension length of the portion of the rigid substrate 50a supporting the first tab connection portion 510 (hereinafter referred to as the support portion 50a') can be less than the extension length of the first tab connection portion 510. When used here, the extension length is the distance by which the first tab connection portion 510 protrudes from the end of the flexible substrate 50b. In other embodiments, the support portion 50a' of the rigid substrate 50a may not be fixed to the first tab connection portion 510. For example, the extension length of the support portion 50a' may be the same as the extension length of the first tab connection portion 510.

[0051] Furthermore, similar to the first tab connection portion 510, the second tab connection portion 520 should be able to move smoothly with one degree of freedom (e.g., a predetermined degree of freedom). For this purpose, the rigid substrate 50a can be shaped to not support the portion of the flexible substrate 50b where the second tab connection portion 520 is formed. For example, the rigid substrate 50a can be shaped such that the portion where the second tab connection portion 520 is formed is empty. Figure 2 One embodiment is shown in which a portion of the second tab connection portion 520 of the rigid substrate 50a corresponding to the flexible substrate 50b is empty.

[0052] like Figure 4 and Figure 5As shown, the substrate tab 530 is a metal tab used to connect the first tab connection portion 510 and the second tab connection portion 520 to the busbar 40, respectively. For example, the substrate tab 530 may be made of nickel. The substrate tab 530 may include multiple substrate tabs, and they may have a generally rectangular shape. One end of the substrate tab 530 is connected to the first tab connection portion 510 or the second tab connection portion 520, and its other end extends outside the first tab connection portion 510 or the second tab connection portion 520. Part or all of the area of ​​the substrate tab 530, except for one end, may be connected to the busbar 40. The end of the substrate tab 530 connected to the first tab connection portion 510 or the second tab connection portion 520 may be defined as the first solder portion 532, and the remaining portion may be defined as the second solder portion 534. For example, the first weld portion 532 can be welded to the first contact connection portion 510 or the second contact connection portion 520, and the second weld portion 534 can be laser welded to the busbar 40. However, both the first weld portion 532 and the second weld portion 534 can be welded by ultrasonic welding or laser welding. For example, the connection method is not limited when the first weld portion 532 and the second weld portion 534 are physically connected (e.g., integrally formed) and electrically connected to the first contact connection portion 510, the second contact connection portion 520, or the busbar 40. Furthermore, the first weld portion 532 and the second weld portion 534 can have shapes different from those shown in the figures, which are provided as examples. In other words, the shapes of the first weld portion 532 and the second weld portion 534 are not limited to these.

[0053] As described above, since the flexible substrate 50b and the busbar 40 are electrically connected via the substrate tab 530, the bolt connection process and bolt connection parts used to connect the substrate and the busbar holder 30 can be omitted. Furthermore, the TOX riveting (a riveting process used to join dissimilar metals) used to connect the substrate and the busbar 40 can be omitted. Therefore, assembly quality is improved, quality is stabilized, and costs are reduced by eliminating parts.

[0054] Figure 6A It is a schematic cross-sectional view showing the connection between a conventional busbar retainer and a rigid circuit board. Figure 6B This is a schematic cross-sectional view showing the connection state between the busbar holder and the hybrid circuit board of a battery pack according to an embodiment of the present disclosure.

[0055] like Figure 6AAs shown, conventionally, the busbar holder (b) is mounted on the unit cover (a), the rigid circuit board (e) is placed on the busbar holder (b), and then the rigid circuit board (e) is secured to the busbar holder (b) using insert nuts (c) and bolts (d). Afterward, the top plate (f) is fastened to the rigid circuit board (e). For example, the height from the top plate (f) to the head of the bolt (d) can be approximately 2.4 mm, and the height from the head of the bolt (d) to the bottom of the busbar holder (b) can be approximately 13 mm (hereinafter, the sum of these two heights is defined as the module height). That is, in a conventional structure, the module height is approximately 15.4 mm.

[0056] In contrast, when the hybrid circuit board 50 according to an embodiment of the present disclosure is applied, according to one embodiment, the connection structure is as follows: Figure 6B As shown. Figure 6B As shown, a busbar holder 30 is placed on the unit cover 12, and a hybrid circuit board 50 on which components are mounted is placed on the busbar holder 30. A top plate 26 is then disposed on the hybrid circuit board 50. For example, the height from the top plate 26 to the top of the component mounted on the hybrid circuit board 50 can be approximately 2.4 mm, and the height from the top of the component mounted on the hybrid circuit board 50 to the bottom of the busbar holder 30 can be approximately 8 mm. Therefore, the module height according to one embodiment of this disclosure is approximately 10.4 mm, thus, compared with... Figure 6A Compared to the conventional structure shown, the module height can be significantly reduced.

[0057] In the following, the structure of a hybrid circuit board according to another embodiment of the present disclosure will be described, and detailed descriptions of structures identical to those in the previous embodiments will be omitted.

[0058] Figure 7 This is a plan view of a hybrid circuit board according to another embodiment of the present disclosure. Figure 8 yes Figure 7 A magnified perspective view of part of the "C", and Figure 9 yes Figure 8 The enlarged bottom perspective view of the portion "C" shown.

[0059] like Figure 7 As shown, in a hybrid circuit board 50' according to another embodiment of the present disclosure, a plurality of first tab connection portions 510 and sensor connection portions 540 can be formed on a flexible substrate 50b'. Here, the first tab connection portions 510 can have a... Figure 4 The same shape and structure as shown. However, as Figure 7 As shown, the substrate patch 530 can be formed in a rectangular shape without a separate soldering portion. A similar configuration of the substrate patch 530 can also be applied to... Figure 4 The implementation method shown.

[0060] The sensor connection portion 540 can extend from one edge of the flexible substrate 50b' in a generally "S" shape. A foam pad 542 on which the temperature sensor 544 is mounted can be coupled to the extended end (or distal end) of the sensor connection portion 540. The foam pad 542 has a hexahedral shape having a thickness (e.g., a predetermined thickness), and a receiving space for mounting the temperature sensor 544 can be formed on (or within) the foam pad 542. For example, the foam pad 542 can be formed to surround the temperature sensor 544 (e.g., surrounding the temperature sensor 544 in a plan view or extending around the perimeter of the temperature sensor 544). A metal tab 546 electrically connected to the temperature sensor 544 and connected to the battery cell 10 or cell cover 12 (see example...) Figure 9 The sensor connection portion 540 can be attached to the lower part of the foam pad 542 in the direction facing the busbar 40. For example, the metal contact 546 can be made of aluminum. The temperature of the battery cell 10 can be measured by attaching the metal contact 546 to the surface of the battery cell 10 using double-sided tape or the like. Therefore, the shape and length of the sensor connection portion 540 can vary depending on the location where the metal contact 546 is attached. By including the sensor connection portion 540, the processes and parts for connecting the temperature sensor to the board with separate connectors and wires, as well as soldering the temperature sensor to the battery cell and mounting it, can be omitted. Therefore, costs can be reduced and the process can be simplified due to the omission of parts. The aforementioned sensor connection portion 540 can also be applied to Figure 3 The hybrid circuit board 50 shown.

[0061] In the hybrid circuit board having the above-described structure according to an embodiment of the present disclosure, the component is not mounted on the edge of the flexible plate on which the bulging absorption structure is formed. Instead, the component is mounted on a portion less affected by bulging and supported by a rigid substrate. For example, the component may be located at a central portion spaced apart from the edge along the width direction of the flexible substrate.

[0062] According to embodiments of this disclosure, the rigidity of the substrate can be enhanced by combining the characteristics of both rigid and flexible circuit boards.

[0063] Furthermore, the hybrid circuit board according to embodiments of this disclosure has a bulging absorption structure and can be connected to the busbar without a bolt connection process, thus eliminating the need for a separate bulging absorption structure and simplifying the busbar connection structure. Therefore, the cause of increased battery pack height is eliminated, resulting in a reduced or minimally sized battery pack.

[0064] While the above embodiments are merely some embodiments for implementing this disclosure (this disclosure is not limited to these embodiments), those skilled in the art will understand that various changes in form and detail may be made herein without departing from the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

[0065] This application claims priority and benefit to Korean Patent Application No. 10-2021-0035284, filed on March 18, 2021, with the Korean Intellectual Property Office, the contents of which are incorporated herein by reference in their entirety.

Claims

1. A hybrid circuit board, comprising: A flexible substrate comprising a flexible material, the flexible substrate being electrically connected to a plurality of busbars, the busbars being electrically connected to a plurality of battery cells; as well as A rigid substrate comprising a rigid material is coupled to the flexible substrate to support the flexible substrate. The flexible substrate includes multiple tab connection portions along its edges. The substrate connector is electrically connected to the connector connection portion and the busbar. The plurality of connector portions include a plurality of second connector portions. Each of the second tab connection portions is connected to the edge of the flexible substrate via a second shaped portion, the second shaped portion extending from the edge of the flexible substrate in an "S" shape and integrally formed with the second tab connection portion. The second shape portion includes an extension portion extending in a straight line from one end of the edge of the flexible substrate, a curved portion integrally formed with the extension portion and having an "S"-shaped bend, and a connecting portion integrally formed with the curved portion and formed in a straight line to connect to the second tab connecting portion. The straight line of the extended portion and the straight line of the connecting portion are perpendicular to the edge of the flexible substrate.

2. The hybrid circuit board according to claim 1, wherein the plurality of tab connection portions further includes a plurality of first tab connection portions, wherein the flexible substrate has a first shape portion formed on both sides of the first tab connection portion, the first shape portion being concavely cut inward from the edge of the flexible substrate.

3. The hybrid circuit board according to claim 1, wherein one end of the substrate tab is soldered to the tab connection portion, and the other end is laser soldered to the busbar.

4. The hybrid circuit board according to claim 1, further comprising: A sensor connection portion extending in an "S" shape from the edge of the flexible substrate; A temperature sensor configured to measure the temperature of at least one of the battery cells; A foam pad that houses the temperature sensor; as well as A metal tab is attached to the foam pad and connected to at least one of the battery cells and the temperature sensor.

5. A battery pack, comprising: Multiple battery cells arranged in one direction, each battery cell including a positive electrode terminal and a negative electrode terminal; Multiple busbars are electrically connected to the positive electrode terminal or the negative electrode terminal of each of the battery cells; as well as A hybrid circuit board includes a rigid substrate and a flexible substrate, the flexible substrate being coupled to the rigid substrate and electrically connected to the busbar, the rigid substrate being located between the busbar and the flexible substrate. The flexible substrate includes multiple tab connection portions along its edges. The substrate connector is electrically connected to the connector connection portion and the busbar. The plurality of connector portions include a plurality of second connector portions. Each of the second tab connection portions is connected to the edge of the flexible substrate via a second shaped portion, the second shaped portion extending from the edge of the flexible substrate in an "S" shape and integrally formed with the second tab connection portion. The second shape portion includes an extension portion extending in a straight line from one end of the edge of the flexible substrate, a curved portion integrally formed with the extension portion and having an "S"-shaped bend, and a connecting portion integrally formed with the curved portion and formed in a straight line to connect to the second tab connecting portion. The straight line of the extended portion and the straight line of the connecting portion are perpendicular to the edge of the flexible substrate.

6. The battery pack of claim 5, wherein the plurality of tab connection portions further comprises a plurality of first tab connection portions, wherein the flexible substrate has a first shape portion on both sides of at least one of the first tab connection portions, the first shape portion being concavely cut inward from a corresponding edge of the edge of the flexible substrate.

7. The battery pack according to claim 5, wherein one end of the substrate tab is welded to the tab connection portion, and the other end is laser welded to the busbar.

8. The battery pack according to claim 7, further comprising: A sensor connection portion extending in an "S" shape from one of the edges of the flexible substrate; A temperature sensor configured to measure the temperature of at least one of the battery cells; A foam pad that houses the temperature sensor; as well as A metal tab is attached to the foam pad and connected to at least one of the battery cells and the temperature sensor.

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