Electronic device with a liquid cooling system

Abstract

An electronic device with a liquid cooling system, comprising: a housing having an installation slot; a heat exchanger disposed within the housing; a pumping device disposed within the installation slot and including a housing and a first water pump disposed within the housing; a delivery pipe connected to the heat exchanger and the first water pump; and a sliding mechanism disposed within the housing and connected to the delivery pipe. When the pumping device is moved to an installation position, the delivery pipe drives the sliding mechanism to a storage position. When the pumping device is moved to a removal position, the delivery pipe drives the sliding mechanism to an extended position, wherein the extended position is closer to the installation slot than the storage position.

Description

Technical Field

[0001] The present invention relates to an electronic device, and more particularly to an electronic device with a liquid cooling system. Background Art

[0002] A server can be used to process a large amount of data operations and has been widely applied in industries such as communication, data processing, and artificial intelligence. In order to process a large amount of data operations, a large amount of heat is generated when the server operates, so there are extremely high requirements for the heat dissipation efficiency.

[0003] Currently, the well-known servers mainly use multiple fans installed in the chassis to dissipate heat by using air flow. However, when the server is updated to improve its performance, the original air-cooled heat dissipation no longer meets the requirements. Therefore, how to use a liquid cooling system to improve the heat dissipation efficiency of the server is an urgent technical problem to be solved today. Summary of the Invention

[0004] In view of this, in the present invention, a liquid cooling system is installed in an electronic device such as a server to improve the heat dissipation efficiency of the server. In addition, the liquid cooling system utilizes the existing fan heat dissipation structure of the server, thereby reducing the design cost of the server and the construction cost of updating the server from an air-cooled system to a water-cooled system.

[0005] An embodiment of the present invention discloses an electronic device with a liquid cooling system, including: a chassis having an installation slot; a heat exchanger disposed in the chassis; a pumping device disposed in the installation slot and including a housing and a first water pump disposed in the housing; a delivery pipe connecting the heat exchanger and the first water pump; and a sliding mechanism disposed in the chassis and connected to the delivery pipe. When the pumping device moves to an installation position, the delivery pipe drives the sliding mechanism to a storage position. When the pumping device moves to a disassembly position, the delivery pipe drives the sliding mechanism to an extended position, where the extended position is closer to the installation slot than the storage position.

[0006] According to an embodiment of the present invention, the sliding mechanism is close to the installation slot. The sliding mechanism includes a slide rail disposed on a side wall of the chassis; a slider movably disposed on the slide rail; and a strap fixed to the slider and tied to the delivery pipe.

[0007] According to an embodiment of the present invention, the sliding mechanism further includes a spring connecting the slider and the side wall.

[0008] According to an embodiment of the present invention, the electronic device further includes a coiled pipe covering a bent section of the delivery pipe.

[0009] According to an embodiment of the present invention, the above-mentioned extraction device is movable along a moving direction within the above-mentioned installation slot. The above-mentioned coiled tube includes a plurality of connecting elements. Each of the above-mentioned connecting elements is pivotally connected to another of the above-mentioned connecting elements. Each of the above-mentioned connecting elements rotates along the same plane, and the above-mentioned plane extends along the above-mentioned moving direction.

[0010] According to an embodiment of the present invention, the above-mentioned housing further includes a baffle adjacent to the above-mentioned coiled tube. The above-mentioned coiled tube is located between the above-mentioned baffle and the above-mentioned extraction device. The above-mentioned storage position is closer to the above-mentioned baffle than the above-mentioned extended position, and the above-mentioned installation position is closer to the above-mentioned baffle than the above-mentioned disassembly position.

[0011] According to an embodiment of the present invention, the above-mentioned extraction device further includes a water storage tank disposed on the above-mentioned first water pump and connected to the above-mentioned delivery pipe. The above-mentioned water storage tank is used for storing coolant. When the above-mentioned first water pump operates, the above-mentioned coolant in the above-mentioned water storage tank flows into the above-mentioned first water pump.

[0012] According to an embodiment of the present invention, the above-mentioned extraction device further includes a sensor disposed on the above-mentioned water storage tank. The above-mentioned sensor is used for detecting the liquid level height of the above-mentioned coolant in the above-mentioned water storage tank.

[0013] According to an embodiment of the present invention, the above-mentioned extraction device further includes a water injection joint disposed on the outer side wall of the above-mentioned housing and connected to the above-mentioned water storage tank.

[0014] According to an embodiment of the present invention, the above-mentioned extraction device further includes a second water pump connected to the above-mentioned first water pump and the above-mentioned delivery pipe. The above-mentioned first water pump is connected to the above-mentioned delivery pipe via the above-mentioned second water pump.

[0015] According to an embodiment of the present invention, the electronic device further includes a plurality of fan devices. The above-mentioned housing further includes a plurality of fan slots, and the above-mentioned fan devices are detachably disposed within the above-mentioned fan slots. The above-mentioned installation slots and the above-mentioned fan slots are arranged along an arrangement direction, and the above-mentioned heat exchanger is adjacent to the above-mentioned fan devices.

[0016] According to an embodiment of the present invention, the electronic device further includes a heat source disposed within the above-mentioned housing; and a heat dissipation element disposed on the above-mentioned heat source and connected to the above-mentioned delivery pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a perspective view of an electronic device with a liquid cooling system according to an embodiment of the present invention.

[0018] Figure 2 is Figure 1 a partial enlarged view of

[0019] Figure 3Partial perspective view of an electronic device with a liquid cooling system according to an embodiment of the present invention.

[0020] Figure 4 Schematic diagram of a detachable device according to an embodiment of the present invention.

[0021] Description of main component symbols

[0022] Electronic device 1

[0023] Housing 10

[0024] Heat dissipation wall 11

[0025] Bottom plate 12

[0026] Side wall 13

[0027] Fan slot 14

[0028] Mounting slot 15

[0029] Baffle 16

[0030] Fan device 20

[0031] Detachable device 30

[0032] Housing 31

[0033] Outer side wall 311

[0034] Bottom 312

[0035] First water pump 32

[0036] First connector 321

[0037] Top surface 322

[0038] Second water pump 33

[0039] Second connector 331

[0040] Water storage tank 34

[0041] Bottom surface 341

[0042] Through hole 342

[0043] Side wall 343

[0044] Water injection connector 35

[0045] Sensor 36

[0046] Warning light 37

[0047] Power supply 40

[0048] Main board 50

[0049] Heat source 60

[0050] Coiled pipe 70

[0051] Connecting element 71

[0052] Sliding mechanism 80

[0053] Slide rail 81

[0054] Slider 82

[0055] Band 83

[0056] Spring 84

[0057] Arrangement direction D1

[0058] Moving direction D2

[0059] Liquid cooling system S1

[0060] Heat dissipation element S11

[0061] Heat exchanger S12

[0062] Delivery pipe S13

[0063] Bending section S131

[0064] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. Specific embodiments

[0065] In order to facilitate the understanding and implementation of the present invention by those of ordinary skill in the art, the present invention will be further described in detail below in conjunction with the drawings and embodiments. It should be understood that the present invention provides many applicable creative concepts, which can be implemented in various specific forms. The specific embodiments discussed in the text are only specific ways of manufacturing and using the present invention, and are not intended to limit the scope of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts fall within the scope of protection of the present invention.

[0066] In addition, repeated reference numerals or signs may be used in different embodiments. These repetitions are only for the purpose of simply and clearly describing the present invention, and do not represent any correlation between the different embodiments and / or structures discussed. It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intermediate element present at the same time. When an element is considered to be "disposed on" another element, it may be directly disposed on the other element or there may be an intermediate element present at the same time.

[0067] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this invention belongs. The terms used in the description of the present invention herein are for the purpose of describing particular embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0068] Figure 1 A perspective view of an electronic device 1 having a liquid cooling system S1 according to an embodiment of the present invention. Figure 2 is Figure 1 a partially enlarged view of. Figure 3 A partial perspective view of an electronic device 1 having a liquid cooling system S1 according to an embodiment of the present invention. The electronic device 1 can be a server, a network switch, or a personal computer. The electronic device 1 has a liquid cooling system S1 and dissipates heat by using the liquid cooling system S1.

[0069] The electronic device 1 includes a chassis 10, a plurality of fan devices 20, a removable device 30, a power supply 40, a motherboard 50, and a plurality of heat sources 60. In Figures 1 to 3 , for the purpose of clarity, the upper cover of the chassis 10 is omitted. The chassis 10 has a heat dissipation wall 11, a bottom plate 12, two side walls 13, a plurality of fan slots 14, and an installation slot 15. The heat dissipation wall 11 extends perpendicular to the bottom plate 12 and can extend along an arrangement direction D1. The two side walls 13 can extend perpendicular to the bottom plate 12 and can be parallel to each other. In addition, the two side walls 13 can be connected to both ends of the heat dissipation wall 11 and can extend perpendicular to the heat dissipation wall 11 and / or along a movement direction D2. The aforementioned heat dissipation wall 11 and side walls 13 can be connected to the edge of the bottom plate 12. The aforementioned movement direction D2 can be perpendicular to the arrangement direction D1.

[0070] The fan slots 14 and the installation slot 15 pass through the heat dissipation wall 11. The fan slots 14 and the installation slot 15 can be arranged along the arrangement direction D1. In this embodiment, the chassis 10 has three fan slots 14, but the number of fan slots 14 is not limited thereto. In this embodiment, the installation slot 15 can be connected to one side wall 13. In another embodiment, the installation slot 15 can be located between two fan slots 14.

[0071] The fan device 20 is detachably disposed in the fan slot 14. In this embodiment, the structure and size of the installation slot 15 are adapted to the fan slot 14, so the fan device 20 can also be detachably disposed in the installation slot 15. When the liquid cooling system S1 is removed, another fan device 20 can be installed in the installation slot 15, so that the electronic device 1 has a more flexible heat dissipation system.

[0072] The extraction device 30 is detachably disposed in the installation slot 15. In this embodiment, the extraction device 30 can be installed or removed along the moving direction D2 within the installation slot 15. Since the structure and size of the installation slot 15 in this embodiment are adapted to the fan slot 14, the extraction device 30 can be applied to the fan slot of the existing electronic device 1, thereby reducing the manufacturing cost of the electronic device 1.

[0073] The power supply 40 is disposed within the chassis 10 and can pass through the heat dissipation wall 11. The power supply 40, the fan device 20, and the extraction device 30 can be arranged along the arrangement direction D1. In this embodiment, the fan device 20 can be disposed between the power supply 40 and the extraction device 30. However, the arrangement order of the power supply 40, the fan device 20, and the extraction device 30 in the arrangement direction D1 can be changed according to requirements.

[0074] The main board 50 is disposed within the chassis 10 and can be fixed to the bottom plate 12. The main board 50 can be located between the two side walls 13 and adjacent to the two side walls 13. The heat source 60 is located within the chassis 10 and is disposed on the main board 50. In this embodiment, the heat source 60 can be a chip such as a central processing unit, a memory, or a controller, etc., but is not limited thereto.

[0075] The liquid cooling system S1 includes a plurality of heat dissipation elements S11, a heat exchanger S12, and a delivery pipe S13. The heat dissipation elements S11 are disposed on the heat source 60, and the heat dissipation elements S11 can be filled with a coolant. For example, the coolant can include water, propylene glycol, and / or ethanol, etc., but is not limited thereto. The heat exchanger S12 is disposed within the chassis 10 and can be fixed to the bottom plate 12. The heat exchanger S12 can be filled with a coolant. In this embodiment, the heat exchanger S12 can be a long strip plate-like structure and can extend along the arrangement direction D1. The heat exchanger S12 is adjacent to the plurality of fan devices 20.

[0076] The delivery pipe S13 is connected to the heat dissipation elements S11 and the heat exchanger S12, and the delivery pipe S13 is filled with a coolant. The heat generated by the heat source 60 is transmitted to the heat dissipation elements S11 and conducted to the coolant within the heat dissipation elements S11. The coolant heated by the heat dissipation elements S11 is transmitted through the delivery pipe S13 into the heat exchanger S12. The heated coolant can conduct the heat to the heat exchanger S12. When the fan device 20 is started to generate an air flow, the above air flow can pass through the fins (not shown in the figure) within the heat exchanger S12 and take away the heat of the heat exchanger S12, thereby reducing the temperature of the coolant.

[0077] Figure 4Schematic diagram of an extraction device 30 according to an embodiment of the present invention. The extraction device 30 includes a housing 31, a first water pump 32, a second water pump 33, and a water storage tank 34. A delivery pipe S13 is connected to the water storage tank 34 and the second water pump 33, and the first water pump 32 can be connected to the delivery pipe S13 via the second water pump 33. In some embodiments, the extraction device 30 may not include the second water pump 33, and the first water pump 32 is directly connected to the delivery pipe S13.

[0078] The above-mentioned first water pump 32, second water pump 33, and water storage tank 34 may be Figure 1 a part of the liquid cooling system S1. The coolant cooled by the heat exchanger S12 is transported to the water storage tank 34 via the delivery pipe S13. When the first water pump 32 and / or the second water pump 33 operates, the coolant flows from the water storage tank 34 into the first water pump 32 and the second water pump 33. Finally, the cooled coolant flows into the heat dissipation element S11 via the pressurization of the first water pump 32 and / or the second water pump 33 through the delivery pipe S13, and thus heat can be dissipated from the heat source 60. The heated coolant is cooled in the heat exchanger S12, and thus a cooling cycle is completed.

[0079] As Figures 2 to 4 shown, the housing 31 can move in the moving direction D2 within the installation slot 15. When the extraction device 30 is in an installation position as Figure 2 shown, the extraction device 30 is located within the installation slot 15, and the housing 31 is engaged within the installation slot 15, and the outer sidewall 311 of the housing 31 can be located at or adjacent to the opening of the installation slot 15 on the heat dissipation wall 11. When the extraction device 30 is in a disassembly position as Figure 3 shown, the outer sidewall 311 of the housing 31 is located outside the casing 10 and is far from the installation slot 15.

[0080] As Figure 4 shown, the first water pump 32 is disposed within the housing 31 and is detachably fixed to the bottom 312 of the housing 31. In this embodiment, the bottom 312 can extend in the moving direction D2, and the outer sidewall 311 can be perpendicular to the bottom 312. The second water pump 33 is connected to the first water pump 32 and the delivery pipe S13 and is detachably fixed to the bottom 312 of the housing 31. In this embodiment, the first water pump 32 may have a first connector 321, and the second water pump 33 may have a second connector 331. The first connector 321 is detachably connected to the second connector 331. In other words, the first water pump 32 is directly connected to the second water pump 33 via the first connector 321 and the second connector 331.

[0081] With the first water pump 32 and the second water pump 33, the liquid cooling system S1 can provide greater pressure to the coolant, thereby increasing the flow rate of the coolant in the delivery pipe S13. In addition, when one of the first water pump 32 or the second water pump 33 is damaged, the other first water pump 32 or the second water pump 33 can also provide pressure to the coolant to maintain the operation of the liquid cooling system S1.

[0082] The water storage tank 34 is disposed on the first water pump 32. The water storage tank 34 is used to store the coolant. When the first water pump 32 operates, the coolant in the water storage tank 34 flows into the first water pump 32. In this embodiment, the water storage tank 34 can be directly connected to the first water pump 32, and the bottom surface 341 of the water storage tank 34 can be attached to the top surface 322 of the first water pump 32. The water storage tank 34 has a plurality of through holes 342 formed in the bottom surface 341. The coolant in the water storage tank 34 can directly flow into the first water pump 32 by gravity through the through holes 342, thereby increasing the efficiency of the liquid cooling system S1.

[0083] In this embodiment, the extraction device 30 may further include a water injection joint 35 and a sensor 36. The water injection joint 35 is disposed on the outer sidewall 311 of the housing 31 and is connected to the sidewall 343 of the water storage tank 34. The coolant can be injected into the water storage tank 34 through the water injection joint 35. Since the water injection joint 35 is disposed on the outer sidewall 311 of the extraction device 30, the user does not need to disassemble the extraction device 30 or the electronic device 1 to replenish the coolant in the water storage tank 34, which increases the convenience of replenishing the coolant.

[0084] The sensor 36 is disposed on the water storage tank 34. The sensor 36 is used to detect the liquid level height of the coolant in the water storage tank 34. In this embodiment, the sensor 36 may be an ultrasonic sensor. The sensor 36 is used to emit ultrasonic waves to the liquid level of the coolant and receive the ultrasonic waves reflected by the liquid level of the coolant, thereby detecting the liquid level height of the coolant. When the sensor 36 detects that the liquid level height of the coolant is lower than the height of the water injection joint 35, a reminder signal can be transmitted to the electronic device 1 to remind the user to replenish the coolant.

[0085] In this embodiment, the extraction device 30 further includes a warning lamp 37 disposed on the outer sidewall 311 of the housing 31. The warning lamp 37 is electrically connected to the sensor 36 and the electronic device 1. The warning lamp 37 emits warning light according to the reminder signal.

[0086] As Figure 2 and Figure 3As shown, the housing 31 further includes a baffle 16 and a sliding mechanism 80. The baffle 16 can extend perpendicular to the moving direction D2. A cable management area is formed between the baffle 16 and the mounting slot 15. Two bending sections S131 of the delivery pipe S13 are located within the cable management area. The electronic device 1 further includes a coiled tube 70, which is wrapped around the two bending sections S131 of the delivery pipe S13. The baffle 16 is adjacent to the coiled tube 70, and the coiled tube 70 is located between the baffle 16 and the extraction device 30. The coiled tube 70 includes a plurality of connecting elements 71. Each connecting element 71 is pivotally connected to another connecting element 71. The coiled tube 70 can be bent along a plane, and each connecting element 71 rotates along the same plane. In other words, the coiled tube 70 restricts the movement of the bending section S131 along the aforementioned plane. The aforementioned plane can extend along the moving direction D2 and / or the arrangement direction D1.

[0087] The sliding mechanism 80 is disposed within the housing 10 and is connected to the delivery pipe S13. In this embodiment, the sliding mechanism 80 can be located within the cable management area and is close to the mounting slot 15 and the baffle 16. In addition, the sliding mechanism 80 can move along the moving direction D2. The sliding mechanism 80 can include a slide rail 81, a slider 82, a cable tie 83, and a spring 84. The slide rail 81 is disposed on a side wall 13 of the housing 10 and can extend along the moving direction D2. In this embodiment, the slide rail 81 and the housing 10 can be an integrally formed structure.

[0088] The slider 82 is movably disposed on the slide rail 81. The slider 82 can move relative to the slide rail 81 along the moving direction D2. In other words, the slider 82 can move along the moving direction D2 within the cable management area. The cable tie 83 is fixed to the slider 82 and is tied to the delivery pipe S13. One end of the spring 84 is connected to the slider 82, and the other end of the spring 84 is connected to the side wall 13 of the housing 31. The spring 84 can provide a pulling force to the slider 82.

[0089] As Figure 2 、 3 shown, when the extraction device 30 moves from the Figure 3 dismounting position to the Figure 2 mounting position, the delivery pipe S13 drives the slider 82 of the sliding mechanism 80 to move to a storage position. In addition, the spring 84 also provides a pulling force to move the slider 82 to the storage position. As Figure 2 shown, at the storage position, the coiled tube 70 is bent along a plane, and restricts the two bending sections S131 of the delivery pipe S13 from bending along the same plane. The baffle 16 can restrict the coiled tube 70 and the bending sections S131 of the delivery pipe S13 within the cable management area.

[0090] As Figure 2 、 3 shown, when the extraction device 30 moves from the Figure 2 mounting position to the Figure 3When in the disassembly position, the conveying pipe S13 drives the slider 82 of the sliding mechanism 80 to move to an extended position. In addition, the storage position is closer to the baffle 16 than the extended position. As Figure 3 shown, when in the extended position, the bending degree of the coiled pipe 70 is smaller than that when the slider 82 is in the Figure 2 storage position.

[0091] Therefore, in this embodiment, the wiring of the bent section S131 of the conveying pipe S13 can be arranged by means of the sliding mechanism 80 and the coiled pipe 70, preventing damage to the conveying pipe S13 caused by the entanglement or improper bending of the bent section S131 of the conveying pipe S13.

[0092] In summary, by installing components such as the water pump and the water storage tank of the liquid cooling system into the detachable device, the present invention can improve the convenience of maintaining the liquid cooling system. In addition, the present invention can replace one fan device in the existing chassis with a detachable device, so the installation cost of the liquid cooling system can be reduced, and components such as the water pump and the water storage tank do not occupy the utilization space of the main board in the chassis. Furthermore, the present invention uses a sliding mechanism and a coiled pipe, so that when the detachable device is installed or removed, damage to the conveying pipe caused by the entanglement or improper bending of the conveying pipe can be prevented.

[0093] For those of ordinary skill in the art, other corresponding changes or adjustments can be made according to the actual needs generated by combining the creative solutions and creative concepts of the present invention, and these changes and adjustments should fall within the protection scope of the claims of the present invention.

Claims

1. An electronic device with a liquid cooling system, characterized in that, Comprising: A casing having an installation slot; A heat exchanger disposed within the above-mentioned casing; A detachable device disposed within the above-mentioned installation slot and including a housing and a first water pump disposed within the above-mentioned housing; A delivery pipe connected to the above-mentioned heat exchanger and the above-mentioned first water pump; A sliding mechanism disposed within the above-mentioned casing and connected to the above-mentioned delivery pipe, and including: A slide rail disposed on a side wall within the above-mentioned casing; A slider movably disposed on the above-mentioned slide rail; and A strap fixed to the above-mentioned slider and attached to the above-mentioned delivery pipe, wherein when the above-mentioned detachable device moves to an installation position, the above-mentioned delivery pipe drives the above-mentioned sliding mechanism to a storage position, when the above-mentioned detachable device moves to a disassembly position, the above-mentioned delivery pipe drives the above-mentioned sliding mechanism to an extended position, wherein the above-mentioned extended position is closer to the above-mentioned installation slot than the above-mentioned storage position.

2. The electronic device with a liquid cooling system according to claim 1, characterized in that, The above-mentioned sliding mechanism is close to the above-mentioned installation slot, the above-mentioned casing further has a heat dissipation wall, the above-mentioned heat dissipation wall extends perpendicular to a moving direction, the above-mentioned installation slot passes through the above-mentioned heat dissipation wall and is located within the above-mentioned casing, the above-mentioned detachable device is installed or removed within the above-mentioned installation slot along the above-mentioned moving direction, and the above-mentioned slide rail extends along the above-mentioned moving direction.

3. The electronic device with a liquid cooling system according to claim 1, wherein, The above-mentioned sliding mechanism further includes a spring connected to the above-mentioned slider and the above-mentioned side wall.

4. The electronic device with a liquid cooling system as claimed in claim 1, wherein, Further comprising a coiled pipe covering a bent section of the above-mentioned delivery pipe.

5. The electronic device with a liquid cooling system according to claim 4, wherein, The above-mentioned detachable device is movable within the above-mentioned installation slot along a moving direction, the above-mentioned coiled pipe includes a plurality of connecting elements, each of the above-mentioned connecting elements is pivotally connected to another of the above-mentioned connecting elements, and each of the above-mentioned connecting elements rotates in the same plane, and the above-mentioned plane extends along the above-mentioned moving direction.

6. The electronic device with a liquid cooling system according to claim 4, wherein, The above-mentioned casing further includes a baffle adjacent to the above-mentioned coiled pipe, and the above-mentioned coiled pipe is located between the above-mentioned baffle and the above-mentioned detachable device, wherein the above-mentioned storage position is closer to the above-mentioned baffle than the above-mentioned extended position, and the above-mentioned installation position is closer to the above-mentioned baffle than the above-mentioned disassembly position.

7. The electronic device with a liquid cooling system according to claim 1, wherein, The above-mentioned detachable device further includes a water storage tank disposed on the above-mentioned first water pump and connected to the above-mentioned delivery pipe, and the above-mentioned water storage tank is used for storing coolant, wherein when the above-mentioned first water pump operates, the above-mentioned coolant within the above-mentioned water storage tank flows into the above-mentioned first water pump.

8. The electronic device with a liquid cooling system according to claim 7, wherein, The above-mentioned detachable device further includes a sensor disposed on the above-mentioned water storage tank, wherein the above-mentioned sensor is used for detecting the liquid level height of the above-mentioned coolant within the above-mentioned water storage tank.

9. The electronic device with a liquid cooling system according to claim 1, characterized in that, The above-mentioned detachable device further includes a second water pump connected to the above-mentioned first water pump and the above-mentioned delivery pipe, and the above-mentioned first water pump is connected to the above-mentioned delivery pipe via the above-mentioned second water pump.

10. The electronic device with a liquid cooling system as claimed in claim 1, wherein, Further comprising a plurality of fan devices, the above-mentioned casing further includes a plurality of fan slots, and the above-mentioned fan devices are detachably disposed within the above-mentioned fan slots, wherein the above-mentioned installation slot and the above-mentioned fan slots are arranged along an arrangement direction, and the above-mentioned heat exchanger is adjacent to the above-mentioned fan devices.

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