Laser processing method and laser processing equipment

Abstract

The present application proposes a laser processing method and laser processing equipment, the laser processing method includes: controlling the laser processing equipment to process the workpiece in a first mode, the workpiece is transparent to the laser, and the upper surface of the workpiece has a coating layer; wherein, processing the workpiece in the first mode includes: processing from bottom to top with a preset processing width, the lower surface of the workpiece is in contact with the working fluid, and the working fluid is kept in a flowing state; when the workpiece is processed to a preset degree, the laser processing equipment is controlled to switch from the first mode to the second mode, and the workpiece is processed in the second mode. The laser processing method and laser processing equipment of the present application can take away heat, avoid sparks during processing, avoid the generation of a recast layer, and at the same time play a role in cooling, remove dust generated by processing, eliminate slag, and avoid the generation of microcracks, further effectively reduce the damage to the coating layer, avoid the occurrence of white fog and sputtering, and effectively improve the product yield.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing method and laser processing equipment. Background Art

[0002] During the laser processing (drilling, cutting, grooving, ablation, etc.) of workpieces, some dust will be generated. As the sample size increases (such as the processing thickness increases or the processing stroke increases), the dust will gather and adhere to the processed and to-be-processed areas of the workpiece to become slag. There is a risk of slag falling off during the subsequent process. The slag and dust particles that fall off become pollution, and the slag falling off is prone to cause edge collapse, resulting in reduced product performance and yield, or even failure to meet mass production requirements. In addition, sparks will be generated during the laser processing process. When the sparks splash onto the wall of the workpiece, a thicker recast layer will be produced, as well as a large number of microcracks, which will seriously affect the processing quality.

[0003] The applicant found in the research that for workpieces with thin films on the surface, the thin films are very sensitive to lasers. If high-energy laser processing is used, the film will be discolored and modified due to excessive heat, forming a white fog area. In more serious cases, the film may even be directly eliminated, forming a sputtering area. White fog and sputtering will seriously affect the performance of the prepared product.

[0004] In order to solve the above-mentioned problems such as slag, recast layer, white mist, sputtering, etc., the following treatment methods are usually used in the prior art:

[0005] 1. Use dry processing, that is, adsorbing the air to take away the dust. However, this method is difficult to remove the dust from the workpiece immediately while laser processing, and the heat dissipation capacity is poor. It cannot effectively improve the slag, recast layer and white mist. When the slag requirements are gradually increased, the recast layer, white mist and sputtering will be aggravated.

[0006] 2. Use full immersion wet processing, that is, add working fluid, immerse the workpiece in the working fluid, and let the working fluid move to take away the slag generated by laser processing. However, for some devices that require precision processing, if immersed in a moving working fluid, after the laser enters the moving working fluid, its focal position will be different due to the different depths of the working fluid, resulting in different optical path differences, which is not conducive to focusing the laser on the specified working surface for precise dynamic processing. Furthermore, the applicant found in the study that due to the presence of the coating layer, there is a risk of damaging the coating layer and forming sputtering after the laser deviates from the processing surface.

[0007] Application Contents

[0008] The purpose of this application is to solve one of the above-mentioned technical problems at least to a certain extent.

[0009] To this end, the first purpose of this application is to propose a laser processing method that can take away heat, avoid sparks during processing, avoid the formation of a recast layer, and at the same time play a role in cooling down, remove dust generated by processing, eliminate slag, and avoid the formation of microcracks, further effectively reduce the damage to the coating layer, avoid the occurrence of white mist and sputtering, and effectively improve product yield.

[0010] The second objective of this application is to provide a laser processing device.

[0011] In order to achieve the above-mentioned purpose, the first embodiment of the present application proposes a laser processing method, comprising:

[0012] Controlling the laser processing equipment to process a workpiece in a first mode, wherein the workpiece is transparent to the laser and has a coating layer on an upper surface of the workpiece;

[0013] Wherein, processing the workpiece in the first mode includes: processing from bottom to top with a preset processing width, the lower surface of the workpiece is in contact with the working fluid, and the working fluid is kept in a flowing state;

[0014] When the workpiece is processed to a preset degree, the laser processing equipment is controlled to switch from the first mode to the second mode, and the workpiece is processed in the second mode.

[0015] Optionally, controlling the laser processing equipment to switch from the first mode to the second mode, and processing the workpiece in the second mode includes:

[0016] Controlling the working fluid to switch from the flowing state to a static state; or

[0017] The working fluid is controlled to separate from the lower surface of the workpiece.

[0018] Optionally, controlling the laser processing equipment to switch from the first mode to the second mode, and processing the workpiece in the second mode includes:

[0019] The laser is controlled to process the workpiece in a form of reducing the processing width.

[0020] Optionally, controlling the working fluid to separate from the lower surface of the workpiece includes:

[0021] Controlling the workpiece to move upward; or

[0022] Controlling the container containing the working fluid to move downward; or

[0023] Drain some or all of the working fluid from the container.

[0024] Optionally, the state of the working fluid is controlled by a pump drive, and when the pump is working, the working fluid is driven to be in a flowing state; controlling the working fluid to switch from the flowing state to a static state includes:

[0025] The pump is controlled to change from working to stopping, so that the working fluid is switched from the flowing state to the static state.

[0026] Optionally, a valve is provided on the container, and the state of the working fluid is controlled by a pump, and extracting part or all of the working fluid from the container includes:

[0027] The pump is controlled to work in reverse or the valve is opened to extract part or all of the working fluid from the container.

[0028] Optionally, the method further includes:

[0029] Before or during controlling the laser processing equipment to process the workpiece in the first mode, the laser is controlled to remove the coating layer corresponding to the processing position of the workpiece.

[0030] Optionally, the method further includes:

[0031] When the laser processing equipment is controlled to process the workpiece in the first mode, the processing point of the laser is controlled to always be located on the contact surface between the to-be-processed area of ​​the workpiece and the working fluid.

[0032] Optionally, the coating layer includes any one or more of an anti-reflection film, a high-reflection film, a filter film, a polarizing film, a protective film and a conductive film.

[0033] The laser processing method of the present application controls the laser processing equipment to process the workpiece in a first mode. When the workpiece is processed to a preset degree, the laser processing equipment is controlled to switch from the first mode to the second mode, and the workpiece is processed in the second mode. This can take away heat, avoid sparks during processing, avoid the generation of a recast layer, and at the same time play a role in cooling, remove dust generated by processing, eliminate slag, and avoid the generation of microcracks. It can further effectively reduce the damage to the coating layer, avoid the occurrence of white mist and sputtering, and effectively improve the product yield.

[0034] In order to achieve the above-mentioned purpose, the second aspect of the present application provides a laser processing device, including a laser, a controller, a driving device and a container filled with a working fluid, wherein the laser processing device includes a first mode and a second mode, the workpiece is transparent to the laser, and the upper surface of the workpiece has a coating layer,

[0035] The controller is electrically connected to the laser and the driving device respectively;

[0036] The controller controls the laser to process the workpiece in the first mode, wherein the processing of the workpiece in the first mode includes: processing from bottom to top with a preset processing width, the lower surface of the workpiece is in contact with the working fluid, and the driving device drives the working fluid to keep it in a flowing state;

[0037] When the workpiece is processed to a preset degree, the controller controls the laser processing equipment to switch from the first mode to the second mode, and processes the workpiece in the second mode.

[0038] Optionally, the controller is specifically used for:

[0039] Controlling the driving device to switch the working fluid from a flowing state to a stationary state; or

[0040] The driving device is controlled so that the working fluid is separated from the lower surface of the workpiece.

[0041] Optionally, the controller is further used for:

[0042] The laser is controlled to process the workpiece in a form of reducing a processing width.

[0043] Optionally, the laser processing equipment further includes a moving device,

[0044] The controller controls the moving device to drive the workpiece to move upward, so that the working fluid is separated from the lower surface of the workpiece; or

[0045] The controller controls the moving device to drive the container to move downward, so that the working fluid is separated from the lower surface of the workpiece.

[0046] Optionally, the driving device is a pump, and the controller is further specifically used for:

[0047] Control the pump to stop working so that the working fluid switches from a flowing state to a static state; or

[0048] The pump is controlled to work in reverse to extract part or all of the working fluid from the container.

[0049] Optionally, the container is provided with a valve, the valve is electrically connected to the controller, and the controller is further used for:

[0050] The valve is opened to allow part or all of the working fluid to be drawn out of the container.

[0051] Optionally, the controller is further used for:

[0052] Before or during controlling the laser processing equipment to process the workpiece in the first mode, the laser is controlled to remove the coating layer corresponding to the processing position of the workpiece.

[0053] Optionally, the controller is further used for:

[0054] When the laser processing equipment is controlled to process the workpiece in the first mode, the processing point of the laser is controlled to always be located on the contact surface between the to-be-processed area of ​​the workpiece and the working fluid.

[0055] Optionally, the coating layer includes any one or more of an anti-reflection film, a high-reflection film, a filter film, a polarizing film, a protective film and a conductive film.

[0056] The laser processing equipment of the present application controls the laser processing equipment to process the workpiece in a first mode. When the workpiece is processed to a preset degree, the laser processing equipment is controlled to switch from the first mode to the second mode, and the workpiece is processed in the second mode. This can take away heat, avoid sparks during processing, avoid the generation of a recast layer, and at the same time play a role in cooling down, remove dust generated by processing, eliminate slag, and avoid the generation of microcracks. It can further effectively reduce the damage to the coating layer, avoid the occurrence of white mist and sputtering, and effectively improve the product yield.

[0057] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0059] Figure 1 is a flow chart of a laser processing method according to an embodiment of the present application;

[0060] Figure 2 It is a schematic diagram of the processing width when the laser processing trajectory is a concentric circle;

[0061] Figure 3 It is a schematic diagram of the processing width when the laser processing trajectory is a spiral line;

[0062] Figure 4 This is a schematic diagram of the effect of changing from the preset processing width to a single circle;

[0063] Figure 5 This is a schematic diagram of the effect of the preset processing width becoming smoothly smaller;

[0064] Figure 6This is a schematic diagram of the effect of the preset processing width being reduced in steps;

[0065] Figure 7 is a flow chart of a laser processing method according to another embodiment of the present application;

[0066] Figure 8 is a flow chart of a laser processing method according to another embodiment of the present application;

[0067] Fig. 9 It is a schematic diagram of the effect of the laser processing trajectory of the cutting seam processing of the laser cutting of the present application;

[0068] Fig.10 This is a schematic diagram of the first effect of the cutting seam processing by laser cutting in this application;

[0069] Fig.11 This is a schematic diagram of the second effect of the cutting seam processing by laser cutting in the present application;

[0070] Fig.12 This is a schematic diagram of the third effect of the cutting seam processing by laser cutting in the present application;

[0071] Fig.13 This is a schematic diagram of the structure of a laser processing device according to an embodiment of the present application;

[0072] Fig.14 This is a schematic structural diagram of a laser processing device according to another embodiment of the present application;

[0073] Fig.15 This is a schematic structural diagram of a laser processing device according to another embodiment of the present application;

[0074] Fig.16 This is a schematic structural diagram of a laser processing device according to another embodiment of the present application. DETAILED DESCRIPTION

[0075] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0076] The present application is further described in detail below in conjunction with specific embodiments. These embodiments should not be construed as limiting the scope of protection claimed in the present application.

[0077] The laser processing method and laser processing equipment of the embodiments of the present application are described below with reference to the accompanying drawings.

[0078] Figure 1 is a flow chart of a laser processing method according to an embodiment of the present application. Figure 1 As shown, the method comprises the following steps:

[0079] S1, controlling the laser processing equipment to process the workpiece in a first mode.

[0080] Specifically, the laser can be controlled to process the workpiece from bottom to top with a preset processing width. The workpiece is transparent to the laser, that is, the laser can penetrate the workpiece and process from bottom to top. For example, the workpiece is a transparent workpiece. Taking drilling as an example, if the laser processing trajectory of a single layer (same horizontal height) is a concentric circle or a spiral line, the preset processing width is as follows: Figure 2 and Figure 3 The w shown in . The number of concentric circles and the circle spacing can be adjusted according to the actual effect. When the number of circles is 1, it is a single circle. Similarly, the number of spiral circles and the spiral spacing can also be adjusted according to the actual effect. During laser processing, it can be processed from the inner circle to the outer circle, or from the outer circle to the inner circle.

[0081] During the laser processing, the laser can be set on the workpiece, emitting laser downward, and the laser passes through the workpiece from bottom to top for processing, that is, after a single layer of concentric circles or spirals is processed, the laser processing point moves up to the adjacent upper single layer for further processing, and the laser processing point is always located on the contact surface between the workpiece and the working fluid. In other words, when the laser processing point moves from bottom to top, the surface of the working fluid will also follow the processing point upward due to the pressure, so that the processing point is always located on the contact surface between the workpiece and the working fluid.

[0082] For example, the preset processing width is usually 50-300μm, and the single-layer processing pattern is a concentric circle or a spiral line. The outermost circle of the spiral line is a closed loop, and the effect of the spiral line is better than that of the concentric circle. The laser processing equipment can dynamically perform laser processing through a 3D galvanometer or a 2D galvanometer matching the Z-axis movement to achieve precise control of the processing width and processing depth. Specifically, the laser in the laser processing equipment can obtain a focused spot of any ultra-wide size through a variable magnification beam expander matching the focusing system, thereby meeting various processing requirements. The laser adjusts the optical axis through a reflector, which is coaxial with the focusing system. The focusing system can be a front-focusing 3D galvanometer, a rear-focusing 3D galvanometer with a field lens or a focusing lens, or a 2D galvanometer with a field lens and a focusing lens. By matching the upper Z axis, the lower Z axis, the X and Y axis linear motors, etc., processing of any position, size and thickness can be achieved.

[0083] The upper surface of the workpiece has a coating layer, which includes any one or more of an anti-reflection film, a high-reflection film, a filter film, a polarizing film, a protective film and a conductive film.

[0084] During the laser processing, in order to avoid the generation of a recast layer and eliminate slag during processing, the lower surface of the workpiece can be brought into contact with the working fluid, and the working fluid can be controlled to remain in a flowing state so that the working fluid can carry away the slag generated during the processing.

[0085] The flow rate of the working fluid can be maintained within a certain flow rate range. If the working fluid flows too fast, vortices may be generated. Vortices indicate that the flow of the working fluid has a strong directionality, which will allow the working fluid to carry away the dust generated by the processing in a directional manner, but may form defective areas such as excessive slag in the local area of ​​the workpiece. If the working fluid flows too slowly, bubbles may be generated and dust or slag cannot be carried away. Bubbles may affect the processing direction of the laser, such as non-directional reflection and refraction, which will damage the coating layer. Therefore, the flow rate of the working fluid is maintained within a certain flow rate range to ensure that no vortices are generated (that is, the highest flow rate is the speed that does not generate vortices), while being able to carry away dust or slag without generating bubbles (that is, the lowest flow rate is the speed that does not generate bubbles and ensures that dust or slag is carried away). The flow rate of the working fluid can be determined by manual observation or machine observation (such as image recognition technology).

[0086] S2, when the workpiece is processed to a preset degree, controlling the laser processing equipment to switch from the first mode to the second mode, and processing the workpiece in the second mode.

[0087] The preset degree can be expressed by thickness. For example, if the processed thickness exceeds half of the workpiece thickness, the second mode can be switched (the smaller the remaining unprocessed thickness, the better the deslagging effect). Of course, it can also be expressed by time. N seconds before the workpiece is penetrated, the second mode is switched. For example, N=2.

[0088] During the laser processing process, if the required processing shape requires cutting through the workpiece, then after the workpiece is penetrated, the laser will act on the working fluid. If the working fluid is still flowing at a high speed, it will produce non-directional reflection and refraction of the laser, which can easily cause damage to the coating layer around the through hole after penetration.

[0089] To this end, this application adopts the following solutions to solve the above problems:

[0090] The first option:

[0091] Control the working fluid to switch from a flowing state to a static state.

[0092] Specifically, the pump can be controlled to stop working so that the working fluid switches from a flowing state to a static state. In this way, after the working fluid is static, the workpiece is penetrated, and the static working fluid can avoid non-directional reflection and refraction of the laser, thereby preventing damage to the coating layer.

[0093] Second option:

[0094] The working fluid is controlled to separate from the lower surface of the workpiece, and the laser is controlled to continue processing the workpiece with a preset processing width. By separating the working fluid from the lower surface of the workpiece, the working fluid can be prevented from generating non-directional reflection and refraction of the laser, thereby preventing damage to the coating layer.

[0095] Separation control methods can be divided into the following categories:

[0096] 1. Control the workpiece to move upward, and keep the working fluid in its original position, so that the working fluid is separated from the lower surface of the workpiece;

[0097] 2. Control the container containing the working fluid to move downward, the surface of the working fluid drops, and the workpiece remains in its original position, so that the working fluid is separated from the lower surface of the workpiece;

[0098] 3. Extract part or all of the working fluid from the container, the surface of the working fluid drops, and the workpiece remains in its original position, so that the working fluid is separated from the lower surface of the workpiece.

[0099] Specifically, the pump can be controlled to work in reverse or the valve on the container can be opened to extract part or all of the working fluid from the container.

[0100] The third option:

[0101] Since the workpiece has a certain thickness, if the residue after laser ablation is not removed in time, it is easy to be processed twice or multiple times to eventually form a recast layer, which makes it impossible to cut. Therefore, a certain processing width (i.e., a preset processing width) is often used to process the workpiece to achieve high-quality cutting. Therefore, this solution processes the workpiece by controlling the laser to reduce the processing width.

[0102] Among them, reducing the processing width further includes the following methods:

[0103] ①Control the processing trajectory of the laser on a single layer to process the workpiece in a single circle.

[0104] pass Figure 2 It can be seen that the processing trajectory of the laser is concentric circles on a single layer (same horizontal height). In the first mode, the preset processing width is w (drawing multiple concentric circles superimposed), then the processing trajectory in the second mode is switched to a single circle, such as Figure 4 As shown, by reducing the processing width, the area where the working fluid reflects and refracts the laser is minimized as much as possible, thereby reducing damage to the coating film.

[0105] ②Control the laser to process the workpiece in a manner that gradually reduces the processing width.

[0106] The method of gradually reducing the processing width can be as follows Figure 5The smooth reduction shown can also be Figure 6 The step-by-step reduction shown can achieve good cutting results and avoid damage to the coating layer.

[0107] Take laser drilling as an example. Figure 4-6 As shown, although the processing width is gradually reduced, the width of the hole in the workpiece remains unchanged, and what changes is that the processing width is gradually reduced. The purpose of this is to prevent the non-directional reflection and refraction of the laser and reduce the damage to the coating film, while also achieving the same size of the hole in the workpiece. Of course, the above technical solution is also applicable to holes with varying processing sizes.

[0108] It should be understood that the above three solutions can also be combined.

[0109] For example,

[0110] The combination of the first solution and the third solution, i.e. controlling the working fluid to switch from a flowing state to a static state and controlling the laser to process the workpiece in the form of a reduced processing width, can achieve the same technical effect, or even a better technical effect, and can further prevent damage to the coating layer.

[0111] The laser processing method of the embodiment of the present application controls the lower surface of the workpiece to contact with the working fluid, controls the working fluid to remain in a flowing state, and controls the laser processing equipment to process the workpiece in a first mode. When the workpiece is processed to a preset degree, the laser processing equipment is controlled to switch to a second mode, and processes the workpiece in the second mode. This can take away heat, avoid sparks during processing, avoid the generation of a recast layer, and simultaneously play a role in cooling, remove dust generated during processing, eliminate slag, and avoid the generation of microcracks, further effectively reducing damage to the coating layer, avoiding the occurrence of white mist and sputtering, and effectively improving product yield.

[0112] After the second mode is used for processing, taking punching as an example, the portion within the processing width falls off, and the punching is completed.

[0113] In another embodiment, Figure 7 As shown, the following steps are also included:

[0114] S3, before or during controlling the laser processing equipment to process the workpiece in the first mode, controlling the laser to remove the coating layer corresponding to the processing position of the workpiece.

[0115] The laser can be controlled to first remove the coating layer on the upper surface of the workpiece corresponding to the processing position. Taking laser drilling as an example, the coating layer can be removed by irradiating the area to be opened (annular area) on the upper surface of the workpiece with a laser, thereby achieving more precise processing. In the actual processing process, the coating layer is very sensitive to the laser energy (relative to the workpiece). When the laser starts processing, the coating layer corresponding to the processing position of the laser is naturally corroded, and the laser will penetrate the workpiece from the bottom to the top.

[0116] It should be understood that the laser processing method of the embodiment of the present application is applicable to all scenarios where the workpiece is processed through, and the processing through may include laser drilling, laser cutting, etc. Laser drilling is a type of closed processing pattern, while laser cutting is a type of non-closed processing pattern.

[0117] The following is an explanation using laser cutting as an example.

[0118] like Figure 8 As shown, the laser cutting method includes the following steps:

[0119] S81, laser cutting is performed from bottom to top on the workpiece with a preset processing width.

[0120] like Fig. 9 As shown, this application scenario is to cut the workpiece with a preset width, and the laser processing track on a single layer is a linear cutting seam with a width of W. After the single layer is processed, it moves up to the adjacent previous single layer to continue processing with the preset width.

[0121] S82, when the workpiece reaches a preset thickness, switching to the second mode to continue cutting the workpiece.

[0122] For example, the preset thickness is 90% of the thickness of the workpiece.

[0123] The processing scheme involved in the second mode of this embodiment is consistent with the description of the previous embodiment and will not be repeated here.

[0124] Through the laser processing method of this embodiment, the cutting of the workpiece is finally achieved. When switching to the second processing mode, the laser can be used in the form of gradually reducing the processing width. Figure 10-12 shown.

[0125] In order to implement the above embodiments, the present application also proposes a laser processing device.

[0126] Fig.13 It is a schematic structural diagram of a laser processing device according to an embodiment of the present application.

[0127] like Fig.13 As shown, the device includes a laser 100, a controller 200, a driving device 300, and a container 400 filled with a working fluid.

[0128] The laser processing equipment includes a first mode and a second mode. The processing piece 600 is transparent to the laser, and the upper surface of the processing piece 600 has a coating layer, which includes any one or more of an anti-reflection film, a high-reflection film, a filter film, a polarizing film, a protective film and a conductive film.

[0129] The controller 200 is electrically connected to the laser 100 and the driving device 300 respectively.

[0130] The controller 200 controls the laser 100 to process the workpiece 600 in the first mode. The lower surface of the workpiece 600 is in contact with the working fluid. Specifically, the controller 200 controls the laser 100 to process the workpiece 600 from bottom to top with a preset processing width. The controller 200 controls the driving device 300 to drive the working fluid to remain in a flowing state.

[0131] When the workpiece 600 is processed to a preset degree, the controller 200 controls the laser processing device to switch from the first mode to the second mode, and processes the workpiece 600 in the second mode.

[0132] As another embodiment, the controller 200 is specifically configured to:

[0133] In the second mode, the driving device 300 is controlled so that the working fluid switches from a flowing state to a static state; or

[0134] The driving device 300 is controlled so that the working fluid is separated from the lower surface of the workpiece 600. As another embodiment, the driving device 300 is a pump, and the controller 200 is further specifically used for:

[0135] Control the pump to stop working so that the working fluid switches from a flowing state to a static state; or

[0136] The pump is controlled to work in reverse, so that part or all of the working fluid is pumped out from the container 400 .

[0137] As another embodiment, the controller 200 is further configured to:

[0138] The laser 100 is controlled to process the workpiece 600 in a manner of reducing the processing width.

[0139] As another example, Fig.14 As shown, a valve 401 is provided on the container 400, and the valve 401 is electrically connected to the controller 200, and the controller 200 is specifically used for:

[0140] The valve 401 is opened to allow part or all of the working fluid to be drawn out of the container 400 .

[0141] As another embodiment, the controller 200 is further configured to:

[0142] Before or during the process of controlling the laser processing device to process the workpiece in the first mode, the laser is controlled to remove the coating layer corresponding to the processing position of the workpiece 600 .

[0143] As another embodiment, the controller 200 is further specifically configured to:

[0144] When the laser processing equipment is controlled to process the workpiece in the first mode, the processing point of the laser is controlled to always be located on the contact surface between the to-be-processed area of ​​the workpiece 600 and the working fluid.

[0145] In another embodiment of the present application, the laser processing equipment further includes a moving device 500 .

[0146] like Fig.15 As shown, the controller 200 controls the moving device 500 to drive the workpiece 600 to move upward, so that the working fluid is separated from the lower surface of the workpiece 600; or

[0147] like Fig.16 As shown, the controller 200 controls the moving device 500 to drive the container 400 to move downward, so that the working fluid is separated from the lower surface of the workpiece 600.

[0148] It should be noted that the controller of the laser processing equipment of the present invention can also simultaneously control the working fluid to switch from a flowing state to a static state, and control the laser to process the workpiece in a form of reducing the processing width.

[0149] It should be understood that the laser processing equipment of this embodiment is consistent with the implementation principle of the laser processing method of the first aspect embodiment, and will not be repeated here.

[0150] The laser processing equipment of the embodiment of the present application controls the lower surface of the workpiece to contact with the working fluid, controls the working fluid to remain in a flowing state, and controls the laser processing equipment to process the workpiece in a first mode. When the workpiece is processed to a preset degree, the laser processing equipment is controlled to switch to a second mode, and processes the workpiece in the second mode. This can take away heat, avoid sparks during processing, avoid the generation of a recast layer, and simultaneously play a role in cooling, remove dust generated during processing, eliminate slag, and avoid the generation of microcracks, further effectively reducing damage to the coating layer, avoiding the occurrence of white mist and sputtering, and effectively improving product yield.

[0151] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0152] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as an ordered list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by an instruction execution system, device or apparatus (such as a computer-based system, a system including a processor, or other system that can fetch instructions from an instruction execution system, device or apparatus and execute the instructions), or in combination with these instruction execution systems, devices or apparatuses. For the purpose of this specification, "computer-readable medium" can be any device that can contain, store, communicate, propagate or transmit a program for use by an instruction execution system, device or apparatus, or in combination with these instruction execution systems, devices or apparatuses. More specific examples of computer-readable media (a non-exhaustive list) include the following: an electrical connection with one or more wires (electronic device), a portable computer disk box (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable and programmable read-only memory (EPROM or flash memory), a fiber optic device, and a portable compact disk read-only memory (CDROM). In addition, the computer-readable medium may even be paper or other suitable medium on which the program is printed, since the program may be obtained electronically, for example, by optically scanning the paper or other medium and then editing, interpreting or otherwise processing in a suitable manner if necessary, and then stored in a computer memory.

[0153] It should be understood that the various parts of the present application can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0154] It should be noted that, in the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

Claims

1. A laser processing method, characterized in that: The following steps are involved: Controlling the laser processing equipment to process a workpiece in a first mode, wherein the workpiece is transparent to the laser and has a coating layer on an upper surface of the workpiece; The processing of the workpiece in the first mode includes: processing from bottom to top with a preset processing width, the lower surface of the workpiece is in contact with the working fluid, and the working fluid is kept in a flowing state, and the processing point of the laser is controlled to always be located on the contact surface between the to-be-processed area of ​​the workpiece and the working fluid; When the workpiece is processed to a preset degree, the laser processing device is controlled to switch from the first mode to the second mode, and the workpiece is processed in the second mode, including: Controlling the working fluid to switch from the flowing state to a static state; or Controlling the working fluid to separate from the lower surface of the workpiece; or The laser is controlled to process the workpiece in a form of reducing the processing width.

2. The method according to claim 1, characterized in that Controlling the working fluid to separate from the lower surface of the workpiece includes: Controlling the workpiece to move upward; or Controlling the container containing the working fluid to move downward; or Drain some or all of the working fluid from the container.

3. The method according to claim 1, characterized in that The state of the working fluid is controlled by a pump drive, and when the pump is working, the working fluid is driven to be in a flowing state; and the working fluid is controlled to switch from the flowing state to a static state, including: The pump is controlled to change from working to stopping, so that the working fluid is switched from the flowing state to the static state.

4. The method according to claim 2, characterized in that The container is provided with a valve, the state of the working fluid is controlled by a pump, and the extraction of part or all of the working fluid from the container includes: The pump is controlled to work in reverse or the valve is opened to allow part or all of the working fluid to be drawn out of the container.

5. The method according to claim 1, characterized in that Also includes: Before or during controlling the laser processing equipment to process the workpiece in the first mode, the laser is controlled to remove the coating layer corresponding to the processing position of the workpiece.

6. The method according to claim 1, characterized in that The coating layer includes any one or more of an anti-reflection film, a high-reflection film, a filter film, a polarizing film, a protective film and a conductive film.

7. A laser processing device, characterized in that: The laser processing device comprises a laser, a controller, a driving device and a container containing a working fluid. The laser processing device comprises a first mode and a second mode. The workpiece is transparent to the laser and has a coating layer on the upper surface of the workpiece. The controller is electrically connected to the laser and the driving device respectively; The controller controls the laser to process the workpiece in the first mode, wherein the processing of the workpiece in the first mode includes: processing from bottom to top with a preset processing width, the lower surface of the workpiece is in contact with the working fluid, and the driving device drives the working fluid to keep it in a flowing state, and controls the processing point of the laser to always be located on the contact surface between the to-be-processed area of ​​the workpiece and the working fluid; When the workpiece is processed to a preset degree, the controller controls the laser processing equipment to switch from the first mode to the second mode, and processes the workpiece in the second mode, wherein the controller is specifically used to: Controlling the driving device to switch the working fluid from a flowing state to a stationary state; or controlling the driving device so that the working fluid is separated from the lower surface of the workpiece; or The laser is controlled to process the workpiece in a form of reducing a processing width.

8. The device according to claim 7, characterized in that The laser processing equipment also includes a moving device, The controller controls the moving device to drive the workpiece to move upward, so that the working fluid is separated from the lower surface of the workpiece; or The controller controls the moving device to drive the container to move downward, so that the working fluid is separated from the lower surface of the workpiece.

9. The device according to claim 7, characterized in that The driving device is a pump, and the controller is further specifically used for: Control the pump to stop working so that the working fluid switches from a flowing state to a static state; or The pump is controlled to work in reverse to extract part or all of the working fluid from the container.

10. The device according to claim 7, characterized in that The container is provided with a valve, the valve is electrically connected to the controller, and the controller is also used for: The valve is opened to allow part or all of the working fluid to be drawn out of the container.

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